CN110788686A - Wheel mounting seat - Google Patents
Wheel mounting seat Download PDFInfo
- Publication number
- CN110788686A CN110788686A CN201910648587.XA CN201910648587A CN110788686A CN 110788686 A CN110788686 A CN 110788686A CN 201910648587 A CN201910648587 A CN 201910648587A CN 110788686 A CN110788686 A CN 110788686A
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- Prior art keywords
- grinding
- wheel
- center
- grinding water
- supply port
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B45/00—Means for securing grinding wheels on rotary arbors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B45/00—Means for securing grinding wheels on rotary arbors
- B24B45/003—Accessories therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
- B24B55/03—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant designed as a complete equipment for feeding or clarifying coolant
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Abstract
Provided is a wheel mounting seat capable of supplying grinding water to a surface to be ground and a grinding surface of a grinding wheel even if the grinding water is influenced by a centrifugal force, thereby reducing consumption of the grinding wheel. In the wheel mounting seat (34), the energy and the falling position of the ejected grinding water are changed by switching the provided stuffing plugs (61, 63). Therefore, the energy and the falling position of the grinding water can be brought close to the appropriate range by changing the injection position according to the rotation speed of the wheel mounting seat (34). Thus, a large amount of grinding water can be supplied between the surface to be ground (1a) and the grinding wheel (40), and thus the grinding wheel (40) can be cooled and grinding chips can be removed satisfactorily. As a result, the consumption of the grinding wheel (40) can be reduced.
Description
Technical Field
The invention relates to a wheel mount.
Background
In a grinding apparatus for grinding a plate-shaped workpiece, for example, as disclosed in patent documents 1 and 2, a grinding wheel having a grinding wheel annularly arranged is attached to a wheel attachment seat at the tip of a spindle. A grinding wheel rotating together with a main shaft is brought into contact with a plate-shaped workpiece held by a holding table to grind the plate-shaped workpiece. Grinding water is supplied to the inner peripheral surface of the grinding wheel for the purpose of removing grinding chips and removing grinding heat.
Patent document 1: japanese laid-open patent publication No. 7-223152
Patent document 2: japanese laid-open patent publication No. 2015-196226
In order to supply the grinding water to the inner peripheral surface of the grinding wheel as described above, a nozzle for spraying the grinding water may be disposed on the inner peripheral surface of the grinding wheel. However, when the area of the plate-shaped workpiece is large, the grinding wheel may slightly protrude from the plate-shaped workpiece. In this case, it is difficult to arrange a nozzle for spraying grinding water on the inner peripheral surface of the grinding wheel as described above. Accordingly, grinding water is supplied to the vicinity of the grinding stone via the center of the spindle.
However, in this configuration, since the grinding water is supplied from the supply port provided in the grinding wheel base, the grinding water is scattered around by the centrifugal force due to the rotation of the spindle, and therefore, the grinding water is not easily spread over the entire grinding surface. Therefore, it is difficult to sufficiently remove the grinding chips and the processing heat. Therefore, the consumption of the grinding tool increases.
Disclosure of Invention
The invention aims to provide a wheel mounting seat, which can supply grinding water to a ground surface and a grinding surface of a grinding tool even if the grinding water is influenced by centrifugal force, thereby reducing the consumption of the grinding tool.
The wheel mount (present wheel mount) of the present invention includes: a main shaft mounting surface mounted to a front end of the main shaft; and a wheel mounting surface which is an opposite surface to the spindle mounting surface and on which a grinding wheel having a grinding wheel arranged in a ring shape is mounted, wherein the wheel mounting seat includes: a connection port formed at the center of the spindle mounting surface and connected to a supply passage which penetrates the center of the spindle and through which grinding water passes; a 1 st supply port disposed on a circumference of a circle having a 1 st radius and centered on a center of the wheel mounting surface; a 2 nd supply port disposed on a circumference of a circle having a 2 nd radius larger than the 1 st radius and centered on the center of the wheel mounting surface; a 1 st connection path formed inside the wheel mounting base so as to connect the connection port and the 1 st supply port; a 2 nd connection path formed inside the wheel mount so as to connect the connection port and the 2 nd supply port; a 1 st filling plug for blocking the 1 st connecting passage; and a 2 nd packing plug for blocking the 2 nd connecting passage, wherein the 1 st packing plug or the 2 nd packing plug is used for switching the connecting passage through which the grinding water passes between the 1 st connecting passage and the 2 nd connecting passage.
The wheel mount may further include: a 1 st annular groove, which is configured with the 1 st supply port by taking the center of the wheel installation surface as the center; and a 2 nd annular groove which is provided with the 2 nd supply port by taking the center of the wheel mounting surface as the center.
In the wheel mounting base, a grinding wheel is mounted on the wheel mounting surface. The grinding wheel grinds a surface to be ground of a workpiece such as a plate-like workpiece by a grinding wheel located on an outer peripheral side of a wheel mounting surface.
The wheel mounting seat has a 1 st supply port at a position relatively close to the center of the wheel mounting surface, and has a 2 nd supply port at a position relatively far from the center of the wheel mounting surface (a position near the outer periphery). In the wheel mount, the plug can block any of the 1 st connection path connecting the connection port and the 1 st supply port and the 2 nd connection path connecting the connection port and the 2 nd supply port. That is, the grinding water can be ejected from either the 1 st supply port close to the center or the 2 nd supply port far from the center.
Thus, for example, the 1 st and 2 nd plug plugs can be arranged as follows: under the condition that the rotation speed of the wheel mounting seat is high, grinding water is jetted from a 1 st supply port close to the center; on the other hand, when the rotation speed of the wheel mounting base is slow, the grinding water is ejected from the 2 nd supply port away from the center.
That is, the energy of the grinding water at the time of ejection varies depending on the rotational speed of the wheel mounting base and the ejection position of the grinding water on the wheel mounting surface. For example, when the rotation speed of the wheel mounting base is high, the grinding water in the wheel mounting base receives a strong force from the wall surface of the 1 st or 2 nd connecting passage before being discharged (the centrifugal force received by the grinding water increases). Further, the force increases as the ejection position of the grinding water is farther from the center (rotation center) of the wheel mounting surface.
Therefore, the energy of the grinding water increases as the rotation speed increases and the injection position of the grinding water becomes farther from the center, and the grinding water is scattered to a position relatively far from the injection position. Therefore, when the rotation speed is high, if the ejection position of the grinding water is away from the center, the drop position of the ejected grinding water may deviate from the appropriate range. For example, it is considered that the grinding water is scattered to the side of the grinding wheel without falling on the surface to be ground. In this case, a part of the grinding water may leak from the gap between the grinding wheel to the outside, and may not be supplied between the grinding wheel and the surface to be ground. Alternatively, the grinding water is atomized due to a large energy, and does not have a cooling and cleaning effect, and may be scattered beyond the grinding wheel to the surroundings.
Therefore, when the rotation speed is high, the 2 nd connecting passage is blocked and the grinding water is ejected from the 1 st supply port near the center, so that the energy and the falling position of the grinding water are brought close to the appropriate range. Therefore, a large amount of grinding water can be supplied to the portion of the surface to be ground that contacts the grinding stone.
On the other hand, when the rotation speed of the wheel mounting base is slow, the force applied to the grinding water in the wheel mounting base is weakened. Further, the closer the ejection position of the grinding water is to the center of the wheel mounting surface, the weaker the force becomes. Therefore, the lower the rotation speed and the closer the injection site of the grinding water to the center, the lower the energy of the grinding water, and the grinding water falls at a position relatively close to the injection site. Therefore, when the rotation speed is low, if the ejection portion of the grinding water is close to the center, the grinding water may not easily reach the grinding wheel.
Therefore, when the rotation speed is slow, the 1 st connecting passage is blocked and the grinding water is ejected from the 2 nd supply port away from the center, so that the energy and the falling position of the grinding water are brought close to an appropriate range. Therefore, a large amount of grinding water can be supplied to the portion of the surface to be ground that contacts the grinding stone.
In this way, in the wheel mounting base, the energy and the drop position of the injected grinding water can be changed by switching the installation position of the filler plug. Therefore, by changing the injection position in accordance with a variable that affects the energy and the drop position of the grinding water, such as the rotation speed of the wheel mounting base, the energy and the drop position of the grinding water can be brought close to an appropriate range. Thus, a large amount of grinding water can be supplied to the portion where the grinding wheel contacts the surface to be ground, and thus the grinding wheel can be cooled and the grinding chips can be removed satisfactorily. As a result, the consumption of the grinding wheel can be reduced.
In addition, the present wheel mount may have: a 1 st annular groove, which is arranged by taking the center of the wheel mounting surface as the center and is provided with a 1 st supply port; and a 2 nd annular groove which is provided with a 2 nd supply port by taking the center of the wheel mounting surface as the center.
In this structure, the grinding water discharged from the 1 st and 2 nd supply ports is guided by the 1 st and 2 nd annular grooves so as to be transferred on the inner surfaces thereof and fall on the surface to be ground. Then, the grinding water is supplied to a portion where the surface to be ground contacts the grinding wheel by sliding on the surface to be ground. Therefore, in this structure, the falling position of the grinding water can be controlled. Therefore, the grinding water can be prevented from flowing to the outer peripheral side and reaching the side portion of the grinding stone.
Drawings
Fig. 1 is a perspective view showing a structural example of a grinding apparatus having a wheel mounting base according to the present embodiment.
Fig. 2 is an explanatory diagram showing a grinding water supply system in the grinding apparatus shown in fig. 1.
Fig. 3 is a perspective view showing a wheel mounting surface of the wheel mount.
Fig. 4 is a cross-sectional view showing a mount flow path that is a flow path of grinding water in the wheel mount.
Fig. 5 (a) is an explanatory view showing the wheel mount in which the 2 nd connection path is buried by the 2 nd caulking pin, and fig. 5 (b) is an explanatory view showing the wheel mount in which the 1 st connection path is buried by the 1 st caulking pin.
Description of the reference symbols
1: a wafer; 1 a: grinding the ground surface; 2: a grinding device; 4: a base station; 6: a support column; 8: a chuck table section; 12: a chuck table; 13: a holding surface; 16: a Z-axis moving mechanism; 18: a Z-axis guide rail; 20: a Z-axis moving table; 22: a Z-axis ball screw; 24: a Z-axis pulse motor; 26: a grinding unit; 28: a support structure; 30: a spindle housing; 32: a main shaft; 33: a main shaft flow path; 34: a wheel mount; 34 a: a main shaft mounting surface; 34 b: a wheel mounting surface; 35: a mount flow path; 36: grinding the grinding wheel; 38: a wheel base station; 40: grinding the grinding tool; 51: a connecting port; 53: 1, providing a port; 55: a 2 nd supply port; 57: a 1 st connection path; 59: a 2 nd connection path; 61: 1, filling a plug; 63: the 2 nd filling plug; 65: the 1 st annular groove; 67: a 2 nd annular groove; 71: grinding the mounting threaded hole of the grinding wheel; 73: wheel mount pad mounting hole.
Detailed Description
As shown in fig. 1, a grinding apparatus 2 of the present embodiment includes: a rectangular parallelepiped base 4; a support column 6 extending upward; and a grinding water supply source 46 that supplies grinding water.
On the front side of the upper surface of the base 4 are disposed: a chuck table section 8 including a chuck table 12; an X-axis moving mechanism (not shown) for moving the chuck table portion 8 in the X-axis direction; and a waterproof cover 10 covering the X-axis moving mechanism.
The X-axis moving mechanism is provided in a rectangular opening 5 extending in the X-axis direction (front-rear direction). The X-axis moving mechanism comprises: a pair of X-axis guide rails parallel to the X-axis direction; an X-axis ball screw parallel to the X-axis guide rail; and a nut portion connected to the X-axis ball screw and an X-axis pulse motor (both not shown).
An X-axis moving table 11 of the chuck table portion 8 is slidably provided on the X-axis guide rail. The nut portion is fixed to the lower surface side of the X-axis moving table 11. An X-axis ball screw is screwed to the nut portion. The X-axis pulse motor is coupled to one end of the X-axis ball screw.
In the X-axis moving mechanism, the X-axis pulse motor rotates the X-axis ball screw, and the X-axis moving table 11 moves in the X-axis direction along the X-axis guide rail.
The chuck table portion 8 includes: a chuck table 12 for holding a wafer 1 (see fig. 2); and the X-axis moving table 11 for holding the chuck table 12. The X-axis moving table 11 has a chuck table 12 disposed on an upper surface thereof, and is moved along the X-axis together with the chuck table 12 by an X-axis moving mechanism. In the present embodiment, the X-axis moving table 11 and the chuck table 12 move between a forward carrying-in/out position where the wafer 1 is carried in and out and a backward grinding position where the wafer 1 is ground.
The chuck table 12 is connected to a rotation driving source (not shown) such as a motor, and rotates about a rotation axis extending in the Z-axis direction (vertical direction). The chuck table 12 has a holding surface 13 for sucking and holding the wafer 1 at the center of the upper surface thereof. The holding surface 13 is formed as a conical surface. The conical surface has an extremely gentle slope with the rotation center of the chuck table 12 as a vertex. The holding surface 13 communicates with a suction source, not shown, and sucks and holds the wafer 1 so that the surface 1a to be ground of the wafer 1 is exposed, as shown in fig. 2.
As shown in fig. 1, the support column 6 is erected at the rear of the base 4. Provided on the front surface of the support column 6 are: a grinding unit 26 that grinds the wafer 1; and a Z-axis moving mechanism 16 that moves the grinding unit 26 in the Z-axis direction.
The Z-axis moving mechanism 16 includes: a pair of Z-axis guide rails 18 parallel to the Z-axis direction; a Z-axis moving table 20 that slides on the Z-axis guide rail 18; a Z-axis ball screw 22 parallel to the Z-axis guide rail 18; and a nut portion (not shown) connected to the Z-axis ball screw 22 and a Z-axis pulse motor 24.
The Z-axis moving table 20 is slidably provided on the Z-axis guide rail 18. The nut portion is fixed to the rear surface side (rear surface side) of the Z-axis moving table 20. The nut portion is screwed with a Z-axis ball screw 22. The Z-axis pulse motor 24 is connected to one end of the Z-axis ball screw 22.
In the Z-axis moving mechanism 16, the Z-axis pulse motor 24 rotates the Z-axis ball screw 22, and the Z-axis moving table 20 moves in the Z-axis direction along the Z-axis guide rail 18.
The grinding unit 26 is mounted on the front surface (front surface) of the Z-axis moving table 20. The grinding unit 26 has: a support structure 28 fixed to the Z-axis movement table 20 of the Z-axis movement mechanism 16; a spindle housing 30 fixed to the support structure 28; a spindle 32 held by the spindle housing 30; a wheel mounting seat 34 mounted to a lower end of the main shaft 32; and a grinding wheel 36 retained in the wheel mount 34.
The support structure 28 is attached to the Z-axis movement table 20 of the Z-axis movement mechanism 16 in a state of supporting other components of the grinding unit 26. The spindle housing 30 is held by the support structure 28 so as to extend in the Z-axis direction. The spindle 32 is rotatably supported by the spindle housing 30 so as to extend in the Z-axis direction. A rotation drive source (not shown) such as a motor is connected to the upper end side of the main shaft 32. The spindle 32 is rotated by the rotation drive source about a rotation axis extending in the Z-axis direction.
The wheel mount 34 is formed in a disk shape and fixed to a lower end (front end) of the main shaft 32. As shown in fig. 2, the wheel mount 34 has a spindle mount surface 34 a. The wheel mount 34 is attached to the front end of the main shaft 32 via a main shaft attachment surface 34 a. The wheel mount 34 has a wheel mount surface 34b that is the opposite surface of the spindle mount surface 34 a. A grinding wheel 36 is mounted on the wheel mounting surface 34 b.
The grinding wheel 36 is formed to have substantially the same diameter as the wheel mount 34. As shown in fig. 2, the grinding wheel 36 includes an annular wheel base (annular base) 38 made of a metal material such as stainless steel. A plurality of grinding stones 40 arranged in a ring shape are fixed to the lower surface of the wheel base 38 along the entire circumference.
The grinding apparatus 2 has a grinding water supply system for supplying grinding water to the surface 1a to be ground of the wafer 1 and the grinding wheel 40. As shown in fig. 2, the grinding water supply system has: a grinding water supply source 46 as a water source of the grinding device 2; a grinding water supply tube 42 extending from a grinding water supply source 46; a spindle flow path 33 formed in the spindle 32; and a mount flow path 35 formed in the wheel mount 34.
The grinding water supply pipe 42 supplies grinding water from the grinding water supply source 46 to the spindle flow path 33 of the spindle 32. The spindle flow path 33 is provided to penetrate the center of the spindle 32. The spindle flow path 33 delivers the grinding water supplied through the grinding water supply pipe 42 to the mount flow path 35 of the wheel mount 34. The grinding water is supplied to the surface to be ground 1a of the wafer 1 and the grinding whetstone 40 via the mount flow path 35. The supply and stop of the grinding water are controlled by a controller, not shown, for example.
The structure of the wheel mount 34 including the mount flow path 35 will be described below.
Fig. 4 shows a cross section at line a-B and line a-C of the wheel mount 34 shown in fig. 3. As shown in fig. 3 and 4, the mount flow path 35 includes: a connection port 51 provided on the spindle attachment surface 34 a; a 1 st supply port 53 and a 2 nd supply port 55 provided in the wheel mounting surface 34 b; the 1 st annular groove 65 and the 2 nd annular groove 67; and a 1 st connection path 57 and a 2 nd connection path 59 provided inside the wheel mounting seat 34.
The connection port 51 is formed at the center of the spindle attachment surface 34a and connected to the spindle flow path 33 of the spindle 32.
The 1 st annular groove 65 and the 2 nd annular groove 67 are provided on the wheel attachment surface 34b with the center of the wheel attachment surface 34b as the center. The radius of the 2 nd annular groove 67 is longer than the radius of the 1 st annular groove 65.
The 1 st supply port 53 is disposed in the 1 st annular groove 65. The 1 st supply port 53 is disposed on the circumference of a circle having the 1 st radius centered on the center of the wheel mounting surface 34 b. On the other hand, the 2 nd supply port 55 is disposed in the 2 nd annular groove 67. The 2 nd supply port 55 is disposed on the circumference of a circle having a 2 nd radius larger than the 1 st radius and centered on the center of the wheel mounting surface 34 b.
The 1 st connecting passage 57 is formed inside the wheel mounting base 34 so as to connect the connecting port 51 and the 1 st supply port 53. The 2 nd connection path 59 is formed inside the wheel attachment seat 34 so as to connect the connection port 51 and the 2 nd supply port 55.
In addition, as shown in fig. 5 (a) and 5 (b), the wheel mount 34 has a 1 st packing plug 61 and a 2 nd packing plug 63 that block the flow of grinding water. The 1 st filling plug 61 blocks the 1 st connecting passage 57. The 2 nd filling plug 63 blocks the 2 nd connecting passage 59.
In the present embodiment, an operator who performs a grinding process using the grinding device 2 sets one of the 1 st and 2 nd plug plugs 61 and 63 to the 1 st or 2 nd connecting passage 57 and 59.
As shown in fig. 3, the wheel attachment surface 34b of the wheel attachment seat 34 is provided with: a grinding wheel mounting screw hole 71 provided at the outermost periphery; and a wheel mounting seat mounting hole 73 provided on the inner peripheral side of the grinding wheel mounting threaded hole 71.
The grinding wheel mounting threaded hole 71 is used to screw-fasten the wheel base 38 of the grinding wheel 36 to the wheel mounting seat 34. The wheel mount mounting holes 73 are used to threadedly secure the wheel mount 34 to the main shaft 32.
Here, the grinding process in the grinding apparatus 2 having the above-described configuration will be described. First, at the carrying in/out position, the wafer 1 is placed on the holding surface 13 of the chuck table 12 shown in fig. 1. Then, a suction force generated by a suction source, not shown, is transmitted to the holding surface 13, and the holding surface 13 suctions and holds the wafer 1 so that the ground surface 1a of the wafer 1 is exposed.
Then, the X-axis moving table 11 holding the chuck table 12 is moved to a position below the grinding unit 26 in the X-axis direction by the X-axis moving mechanism. Then, the grinding wheel 36 of the grinding unit 26 is aligned in the X-axis direction with the wafer 1 held by the chuck table 12. This alignment is performed, for example, such that the rotation center of the grinding wheel 36 is offset from the rotation center of the wafer 1 by a predetermined distance, and the rotation trajectory of the grinding wheel 40 passes through the rotation center of the wafer 1. Further, the inclination of the chuck table 12 is adjusted in advance so that the holding surface 13 is parallel to the grinding surface which is the lower surface of the grinding stone 40. Thus, the surface to be ground 1a of the wafer 1 is parallel to the grinding surface of the grinding stone 40.
After the grinding wheel 36 is aligned with the wafer 1, the spindle 32 is rotationally driven by a not-shown rotation drive source. Accordingly, the grinding wheel 36 rotates counterclockwise as viewed from above, for example. The chuck table 12 holding the wafer 1 is also rotated counterclockwise as viewed from above by a rotation drive source not shown.
Then, the grinding unit 26 is fed downward by the Z-axis moving mechanism 16, and the grinding wheel 36 is lowered accordingly. The grinding whetstone 40 is brought into contact with the surface to be ground 1a of the wafer 1 to perform grinding. In the grinding apparatus 2, since both the grinding whetstone 40 and the wafer 1 are rotated, the grinding whetstone 40 can grind the entire surface of the wafer 1.
In the grinding apparatus 2, during grinding, the grinding water is supplied to the surface to be ground 1a of the wafer 1 and the grinding whetstone 40 by the grinding water supply system. The grinding water is supplied in an amount of, for example, 4 liters/minute. The operation of supplying the grinding water in the grinding apparatus 2 will be described below.
Grinding water is accumulated in the grinding water supply source 46 shown in fig. 2. When the grinding process is started, a controller, not shown, starts the inflow of the grinding water supply source 46 into the grinding water supply pipe 42. The grinding water is supplied to the spindle flow path 33 of the spindle 32 via the grinding water supply pipe 42. The grinding water supplied to the spindle flow path 33 is delivered to the connection port 51 of the mount flow path 35 of the wheel mount 34 shown in fig. 4.
In the wheel mounting base 34, the water fed to the connection port 51 is ejected from any of the 1 st supply port 53 and the 2 nd supply port 55 toward the ground surface 1a of the wafer 1 via any of the 1 st connection path 57 and the 2 nd connection path 59.
Here, as shown in fig. 5 (a) and 5 (b), the operator sets the 1 st plug 61 or the 2 nd plug 63 in the mount passage 35. For example, when the rotational speed of the wheel mounting base 34 is set to a high speed, the operator sets the 2 nd plug 63 in the 2 nd connecting passage 59 as shown in fig. 5 (a). This blocks the 2 nd connecting passage 59, and hence the grinding water is less likely to pass through the 2 nd connecting passage 59. Therefore, the grinding water supplied from the main shaft 32 is discharged from the 1 st supply port 53 through the 1 st connection path 57.
The grinding water emitted from the 1 st supply port 53 is guided by the 1 st annular groove 65 so as to be transferred on the inner surface thereof and fall on the surface 1a to be ground of the wafer 1 as indicated by an arrow S in fig. 5 (a). Then, the grinding water is supplied between the surface 1a to be ground and the grinding stone 40 by sliding on the surface 1a to be ground.
On the other hand, when the rotational speed of the wheel mounting base 34 is set to be low, the operator sets the 1 st packing plug 61 in the 1 st connecting passage 57 as shown in fig. 5 (b). This blocks the 1 st connecting passage 57, and hence the grinding water is less likely to pass through the 1 st connecting passage 57. Therefore, the grinding water supplied from the main shaft 32 is ejected from the 2 nd supply port 55 through the 2 nd connection path 59.
The grinding water emitted from the 2 nd supply port 55 is guided by the 2 nd annular groove 67 so as to be transferred on the inner surface thereof and fall on the ground surface 1a of the wafer 1 as indicated by an arrow L in fig. 5 (b). Then, the grinding water is supplied between the surface 1a to be ground and the grinding stone 40 by sliding on the surface 1a to be ground.
As described above, in the present embodiment, the grinding wheel 36 mounted on the wheel mounting surface 34b of the wheel mounting base 34 grinds the surface to be ground 1a of the wafer 1 with the grinding stone 40 positioned on the outer peripheral side of the wheel mounting surface 34 b.
Further, the wheel attachment seat 34 has the 1 st supply port 53 at a position relatively close to the center of the wheel attachment surface 34b, and has the 2 nd supply port 55 at a position relatively far from the center of the wheel attachment surface 34b (a position relatively close to the outer periphery), and in the wheel attachment seat 34, any of the 1 st connection passage 57 connecting the connection port 51 and the 1 st supply port 53 and the 2 nd connection passage 59 connecting the connection port 51 and the 2 nd supply port 55 can be blocked by the 1 st caulking pin 61 or the 2 nd caulking pin 63, so that the grinding water can be ejected from either the 1 st supply port 53 near the center or the 2 nd supply port 55 far from the center.
Thus, for example, the 1 st and 2 nd plug plugs can be arranged as follows: in the case where the rotation speed of the wheel mount 34 is fast, the grinding water is ejected from the 1 st supply port 53 near the center; on the other hand, in the case where the rotation speed of the wheel mount 34 is slow, the grinding water is ejected from the 2 nd supply port 55 away from the center.
That is, the energy of the grinding water at the time of ejection varies depending on the rotation speed of the wheel mounting seat 34 and the ejection position of the grinding water on the wheel mounting surface 34 b. For example, when the rotation speed of the wheel mounting seat 34 is high, the grinding water in the wheel mounting seat 34 receives a strong force from the wall surface of the 1 st connecting passage 57 or the 2 nd connecting passage 59 before being discharged (the centrifugal force received by the grinding water increases). Further, the force increases as the ejection position of the grinding water is farther from the center (rotation center) of the wheel mounting surface 34 b.
Therefore, the higher the rotation speed of the wheel mounting seat 34 and the farther the portion of the grinding water that is emitted from the center, the more the energy of the grinding water increases, and the grinding water is dispersed to a position that is relatively distant from the portion of the emission. Therefore, when the rotation speed is high, if the ejection position of the grinding water is away from the center, the drop position of the ejected grinding water may deviate from the appropriate range. For example, it is also conceivable that the grinding water does not fall on the surface 1a to be ground and scatters to the side portion of the grinding stone 40. In this case, a part of the grinding water may leak outside from the gap between the grinding whetstone 40, and may not be supplied between the grinding whetstone 40 and the surface 1a to be ground. Alternatively, the grinding water becomes misty due to a large energy, does not have a cooling and cleaning effect, and may scatter to the surroundings beyond the grinding stone 40.
Therefore, when the rotation speed is high, the energy and the drop position of the grinding water are brought close to the appropriate range by cutting off the 2 nd connecting passage 59 and injecting the grinding water from the 1 st supply port 53 near the center. Therefore, a large amount of grinding water can be supplied between the surface to be ground 1a and the grinding stone 40.
On the other hand, in the case where the rotation speed of the wheel mount 34 is slow, the force applied to the grinding water inside the wheel mount 34 is weakened. Further, the force is weakened as the ejection position of the grinding water is closer to the center of the wheel mounting surface 34 b. Therefore, the lower the rotation speed and the closer the portion from which the grinding water is discharged to the center, the lower the energy of the grinding water, and the grinding water falls at a position closer to the portion from which the grinding water is discharged. Therefore, when the rotation speed is low, if the ejection position of the grinding water is close to the center, the grinding water may not easily reach the grinding stone 40.
Therefore, when the rotation speed is slow, the energy and the drop position of the grinding water are brought close to the appropriate range by cutting off the 1 st connecting passage 57 and injecting the grinding water from the 2 nd supply port 55 away from the center. Therefore, a large amount of grinding water can be supplied between the surface to be ground 1a and the grinding stone 40.
In this way, the energy and the drop position of the grinding water to be discharged can be changed by switching the plug pins 61 and 63 provided in the wheel mounting seat 34. Therefore, by changing the injection position in accordance with a variable that affects the energy and the drop position of the grinding water, such as the rotation speed of the wheel mounting seat 34, the energy and the drop position of the grinding water can be brought close to the appropriate range. This makes it possible to supply a large amount of grinding water between the grinding target surface 1a and the grinding whetstone 40, and thus to cool the grinding whetstone 40 and remove grinding chips satisfactorily. As a result, the consumption of the grinding stone 40 can be reduced.
Further, the wheel mount 34 includes: a 1 st annular groove 65 provided with the 1 st supply port 53 centered on the center of the wheel attachment surface 34 b; and a 2 nd annular groove 67 which is disposed around the center of the wheel mounting surface 34b and in which the 2 nd supply port 55 is disposed. Thus, the grinding water emitted from the 1 st supply port 53 and the 2 nd supply port 55 is guided by the 1 st annular groove 65 and the 2 nd annular groove 67 to be transferred on their inner surfaces and fall on the ground surface 1a, respectively. Then, the grinding water is supplied between the surface 1a to be ground and the grinding stone 40 by sliding on the surface 1a to be ground. Therefore, in this structure, the falling position of the grinding water can be controlled. Therefore, the grinding water can be prevented from flowing to the outer peripheral side and reaching the side portion of the grinding stone 40.
Claims (2)
1. A wheel mount, comprising:
a main shaft mounting surface mounted to a front end of the main shaft; and
a wheel mounting surface, which is an opposite surface to the spindle mounting surface, for mounting a grinding wheel having a grinding wheel arranged in a ring shape,
wherein the content of the first and second substances,
the wheel mount has:
a connection port formed at the center of the spindle mounting surface and connected to a supply passage which penetrates the center of the spindle and through which grinding water passes;
a 1 st supply port disposed on a circumference of a circle having a 1 st radius and centered on a center of the wheel mounting surface;
a 2 nd supply port disposed on a circumference of a circle having a 2 nd radius larger than the 1 st radius and centered on the center of the wheel mounting surface;
a 1 st connection path formed inside the wheel mounting base so as to connect the connection port and the 1 st supply port;
a 2 nd connection path formed inside the wheel mount so as to connect the connection port and the 2 nd supply port;
a 1 st filling plug for blocking the 1 st connecting passage; and
a 2 nd filling plug for blocking the 2 nd connecting passage,
the 1 st or 2 nd packing plug is used to switch the connection path for the grinding water to pass through between the 1 st and 2 nd connection paths.
2. The wheel mount of claim 1,
the wheel mount also has:
a 1 st annular groove, which is configured with the 1 st supply port by taking the center of the wheel installation surface as the center; and
and a 2 nd annular groove provided with the 2 nd supply port, centered on the center of the wheel mounting surface.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018-145817 | 2018-08-02 | ||
| JP2018145817A JP7100524B2 (en) | 2018-08-02 | 2018-08-02 | Wheel mount |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110788686A true CN110788686A (en) | 2020-02-14 |
| CN110788686B CN110788686B (en) | 2023-04-07 |
Family
ID=69427397
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910648587.XA Active CN110788686B (en) | 2018-08-02 | 2019-07-18 | Wheel mounting seat |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7100524B2 (en) |
| KR (1) | KR20200015378A (en) |
| CN (1) | CN110788686B (en) |
| TW (1) | TWI811412B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7401696B2 (en) * | 2004-02-06 | 2008-07-22 | Mayekawa Mfg. Co., Ltd. | Flexible transfer installation and foodstuff transfer system provided with the flexible transfer installation |
| EP3900876A1 (en) * | 2020-04-23 | 2021-10-27 | Siltronic AG | Method of grinding a semiconductor wafer |
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| JPS6434651A (en) * | 1987-07-29 | 1989-02-06 | Disco Abrasive Systems Ltd | Grinding stone device and grinding machine with said device |
| JP2002217143A (en) * | 2001-01-18 | 2002-08-02 | Fujitsu Ltd | Polishing method and polishing apparatus |
| JP2004025344A (en) * | 2002-06-25 | 2004-01-29 | Mito Kogyo Kk | Rotary cutter |
| JP2009279709A (en) * | 2008-05-23 | 2009-12-03 | Asahi-Seiki Mfg Co Ltd | Grinder for grinding both ends of coiled spring |
| CN101659033A (en) * | 2008-08-27 | 2010-03-03 | 株式会社迪思科 | Grinding wheel |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0326462U (en) * | 1989-07-20 | 1991-03-18 | ||
| JPH0516138U (en) * | 1991-08-14 | 1993-03-02 | 三菱重工業株式会社 | Assembled CBN whetstone |
| JPH07223152A (en) | 1994-02-10 | 1995-08-22 | Disco Abrasive Syst Ltd | Surface grinder |
| JP3289183B2 (en) * | 1997-05-30 | 2002-06-04 | 株式会社亀井 | Diamond full back |
| JP2000094342A (en) * | 1998-09-25 | 2000-04-04 | Okamoto Machine Tool Works Ltd | Cup wheel-type grinding wheel and surface grinding device having it |
| JP5284209B2 (en) * | 2009-07-17 | 2013-09-11 | 本田技研工業株式会社 | Tool holder |
| JP6117030B2 (en) * | 2013-07-08 | 2017-04-19 | Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 | Scatter plate, grinding wheel, and grinding device |
| JP6335592B2 (en) | 2014-04-02 | 2018-05-30 | 株式会社ディスコ | Grinding method |
-
2018
- 2018-08-02 JP JP2018145817A patent/JP7100524B2/en active Active
-
2019
- 2019-07-18 CN CN201910648587.XA patent/CN110788686B/en active Active
- 2019-07-18 KR KR1020190087082A patent/KR20200015378A/en not_active Application Discontinuation
- 2019-07-31 TW TW108127137A patent/TWI811412B/en active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6434651A (en) * | 1987-07-29 | 1989-02-06 | Disco Abrasive Systems Ltd | Grinding stone device and grinding machine with said device |
| JP2002217143A (en) * | 2001-01-18 | 2002-08-02 | Fujitsu Ltd | Polishing method and polishing apparatus |
| JP2004025344A (en) * | 2002-06-25 | 2004-01-29 | Mito Kogyo Kk | Rotary cutter |
| JP2009279709A (en) * | 2008-05-23 | 2009-12-03 | Asahi-Seiki Mfg Co Ltd | Grinder for grinding both ends of coiled spring |
| CN101659033A (en) * | 2008-08-27 | 2010-03-03 | 株式会社迪思科 | Grinding wheel |
| JP2011143495A (en) * | 2010-01-13 | 2011-07-28 | Disco Abrasive Syst Ltd | Grinding device |
| CN106505012A (en) * | 2015-09-04 | 2017-03-15 | 株式会社迪思科 | Grinding emery wheel and the method for grinding of machined object |
| EP3260236A2 (en) * | 2016-06-22 | 2017-12-27 | Biesse S.p.A. | Method and system for feeding a cooling fluid during machining of a workpiece by means of a cup grinding wheel, and cup grinding wheel used therein |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2020019111A (en) | 2020-02-06 |
| CN110788686B (en) | 2023-04-07 |
| TW202007473A (en) | 2020-02-16 |
| JP7100524B2 (en) | 2022-07-13 |
| KR20200015378A (en) | 2020-02-12 |
| TWI811412B (en) | 2023-08-11 |
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