CN110787974A - Substrate baking treatment device - Google Patents
Substrate baking treatment device Download PDFInfo
- Publication number
- CN110787974A CN110787974A CN201910975877.5A CN201910975877A CN110787974A CN 110787974 A CN110787974 A CN 110787974A CN 201910975877 A CN201910975877 A CN 201910975877A CN 110787974 A CN110787974 A CN 110787974A
- Authority
- CN
- China
- Prior art keywords
- substrate
- baking
- platform
- inlet
- normally closed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
Abstract
The invention discloses a substrate baking processing device, which comprises a baking component and a movable thimble supporting platform, wherein the baking component is sequentially provided with a platform preparation area, an inlet, a baking area and an outlet on a substrate baking route, and the movable thimble supporting platform carrying a substrate is driven to reciprocate on the substrate baking route. The substrate baking processing device directly supports and moves the substrate by the movable thimble supporting platform so as to reduce the environmental change and pollution risk in the baking component.
Description
Technical Field
The present invention relates to a substrate baking apparatus, and more particularly, to a substrate baking apparatus for baking an alignment film on a substrate.
Background
In a Poly Imide (PI) alignment film coating process in a Thin film transistor liquid crystal display (TFT-LCD), a PI film is formed on a glass substrate by baking PI liquid to be cured in a pre-curing device, such as an alignment film pre-bake oven.
The current mode of pre-curing substrate receiving and placing is to adopt a robot to directly enter and exit a baking oven to place and receive the glass substrate. In the process that the robot extends into or out of the baking oven, the opening of the baking oven needs to be completely opened. However, the opening of the baking oven and the process of the robot entering and exiting the baking oven may damage the temperature balance of the environment in the oven, and the alternation of cold and hot air flows and the non-uniform temperature may cause the problems of non-uniform film formation of the PI film, Mura generation, etc. In addition, opening and closing of the opening of the oven and operation of the robot also cause particles to enter the oven, and foreign matter defects are likely to be formed on the PI film.
Therefore, there is a need to provide a substrate baking processing apparatus to solve the problems of the prior art.
Disclosure of Invention
The invention aims to provide a substrate baking processing device, which changes the pre-cured mode of receiving and placing a substrate, so as to avoid the process that the environment in a furnace is changed and needs to be reset, and achieve the purpose of improving the defects in the Mura aspect of a PI film.
To achieve the above object, an embodiment of the present invention provides a substrate baking processing apparatus, comprising a baking member having a platform preparation area, an inlet, a baking area and an outlet sequentially formed on a substrate baking path; and the movable thimble supporting platform is driven to reciprocate on the substrate baking route, and comprises a platform and a plurality of thimbles, wherein the thimbles are arranged on the upper surface of the platform, the upper parts of the thimbles are used for bearing a substrate to be baked, the movable thimble supporting platform bearing the substrate is driven to pass through the inlet from the platform preparation area along the substrate baking route and move to the baking area to bake the substrate, and finally the substrate is moved out of the baking component through the outlet to bake the substrate.
In an embodiment of the invention, the baking component further includes a buffer area, the buffer area is located between the inlet and the baking area, and the buffer area is provided with a temperature-controllable heating element to perform a first baking on the substrate.
In an embodiment of the present invention, the thimble supporting device further includes a normally closed closing member, and the inlet includes a normally closed opening and a platform inlet and outlet which are communicated with each other from top to bottom, the normally closed opening is located above the platform inlet and outlet and is adapted to the normally closed closing member, the normally closed opening is closed normally by the normally closed closing member, and the platform inlet and outlet is used for the movable thimble supporting platform to pass through.
In an embodiment of the invention, the height of the platform entrance/exit is less than 30 mm.
Furthermore, another embodiment of the present invention provides a method for baking a substrate, wherein the method for baking a substrate includes a substrate baking processing apparatus providing step of providing a substrate baking processing apparatus, the substrate baking processing apparatus including: the baking component is sequentially provided with a platform preparation area, an inlet, a baking area and an outlet on a substrate baking route, the movable thimble supporting platform is driven to reciprocate on the substrate baking route and comprises a platform and a plurality of thimbles, the thimbles are arranged on the upper surface of the platform, and the upper parts of the thimbles are used for bearing a substrate to be baked; a substrate placing step of placing a substrate to be baked on the upper portions of the plurality of pins of the movable pin support platform by a moving member, wherein the movable pin support platform is located on the platform preparation area; a baking step of moving the movable thimble supporting platform carrying the substrate from the platform preparation area to the baking area through the inlet along the substrate baking route to bake the substrate; and a moving-out step of moving the movable thimble supporting platform carrying the substrate out of the baking component from the baking area through the outlet along the substrate baking route.
In an embodiment of the present invention, a pre-bake step is further included, which is performed before the bake step, by moving the movable pin-supporting platform carrying the substrate along the substrate bake path through the entrance to a buffer area between the entrance and the bake area, so as to bake the substrate first.
In an embodiment of the present invention, the substrate baking processing apparatus further includes a normally closed closing member, and the inlet includes a normally closed opening and a platform inlet and outlet which are vertically communicated with each other, the normally closed opening is located above the platform inlet and outlet and is adapted to the normally closed closing member, the normally closed opening is normally closed by the normally closed closing member, and the platform inlet and outlet is used for the movable thimble supporting platform to pass through.
In an embodiment of the invention, the height of the platform entrance/exit is less than 30 mm.
Compared with the prior art, the movable thimble supporting platform can not only bear the substrate, but also move into the baking component from the outside of the baking component through the inlet and continuously move out of the baking component towards the outlet, and the baking of the substrate is completed in the moving process. Therefore, the original pre-curing mode of the film collection and placement through the robot entering and exiting the baking device is changed, the process that the environment in the furnace is changed too much and needs to be reset can be avoided, and the effect of improving the Mura type of PI films is achieved. In addition, the openings of the baking member are greatly reduced, and the risk of particle contamination can be greatly reduced.
Drawings
Fig. 1 is a schematic view of a substrate baking processing apparatus according to an embodiment of the present invention.
Fig. 2 is a schematic view of a substrate baking processing apparatus according to an embodiment of the present invention.
Fig. 3 is a schematic perspective view of a substrate baking processing apparatus according to an embodiment of the present invention.
FIG. 4 is a schematic view of a movable thimble supporting platform for supporting a substrate in a substrate baking apparatus according to an embodiment of the present invention.
Detailed Description
The following description of the embodiments refers to the accompanying drawings for illustrating the specific embodiments in which the invention may be practiced. Furthermore, directional phrases used herein, such as, for example, upper, lower, top, bottom, front, rear, left, right, inner, outer, lateral, peripheral, central, horizontal, lateral, vertical, longitudinal, axial, radial, uppermost or lowermost, etc., refer only to the orientation of the attached drawings. Accordingly, the directional terms used are used for explanation and understanding of the present invention, and are not used for limiting the present invention.
It should be understood that the detailed description and specific examples, while indicating the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
Referring to fig. 1 to 4, a substrate baking apparatus 100 according to an embodiment of the present invention includes a baking member 1 and a movable needle support platform 2.
The baking member 1 is formed with a stage preparation area 11, an inlet 12, a baking area 13 and an outlet 14 in order on a substrate baking route L.
The movable thimble supporting platform 2 is driven to reciprocate on the substrate baking path L. The movable thimble supporting platform 2 includes a platform 21 and a plurality of thimbles 22, the plurality of thimbles 22 are disposed on the upper surface of the platform 21, and the upper portions of the plurality of thimbles 22 are used for bearing a substrate S to be baked. The movable thimble supporting platform 2 carrying the substrate S to be baked is driven to pass through the inlet 12 from the platform preparation area 11 along the substrate baking path L and move to the baking area 13 to bake the substrate S, and finally moves out of the baking component 1 through the outlet 14 to bake the substrate S to be baked.
In detail, the substrate S to be baked is a glass substrate, and baking the substrate S to be baked is to bake and cure a Polyimide (PI) film on the substrate S to be baked, so that the PI film is cured on the substrate S. In this embodiment, the substrate S on the movable thimble supporting platform 2 is taken and placed by a robot R (refer to fig. 2). That is, the robot R places the substrate S on the plurality of ejector pins 22 located in the platform preparation area 11 to bake, and after baking is completed, takes away the substrate S from the plurality of ejector pins 22 located in the outside O.
Preferably, the baking component 1 further comprises a buffer area 15, the buffer area 15 is located between the inlet 12 and the baking area 13, and the buffer area 15 is provided with a temperature-controllable heating element (not shown) to bake the substrate S first, so as to avoid an excessive difference between the temperatures of the substrate S before and after entering the baking area 13.
Preferably, the substrate baking processing apparatus 100 further comprises a normally closed closing member 3. The inlet 12 includes a normally closed opening 121 and a platform inlet and outlet 122 which are communicated with each other vertically, the normally closed opening 121 is located above the platform inlet and outlet 122 and is adapted to the normally closed closing element 3, the normally closed opening 121 is closed by the normally closed closing element 3 to be normally closed, and the platform inlet and outlet 122 is used for the movable thimble supporting platform 2 to pass through. In detail, the height of the platform inlet/outlet 122 is less than 30 mm, so that the probability of external particles entering the substrate baking processing apparatus 100 can be reduced, and the condition that foreign matters exist on the PI film is avoided.
According to an embodiment of the present invention, a method for baking a substrate sequentially comprises the following steps.
A substrate baking processing apparatus providing step of providing a substrate baking processing apparatus, the substrate baking processing apparatus comprising: the baking component is sequentially provided with a platform preparation area, an inlet, a baking area and an outlet on a substrate baking route, the movable thimble supporting platform is driven to reciprocate on the substrate baking route, the movable thimble supporting platform comprises a platform and a plurality of thimbles, the plurality of thimbles are arranged on the upper surface of the platform, and the upper parts of the plurality of thimbles are used for bearing a substrate to be baked.
A substrate placing step of placing a substrate to be baked on the upper portions of the plurality of pins of the movable pin support platform by a moving member, wherein the movable pin support platform is located on the platform preparation area.
And a baking step of moving the movable thimble supporting platform carrying the substrate from the platform preparation area to the baking area through the inlet along the substrate baking route to bake the substrate.
And a moving-out step, namely moving the movable thimble supporting platform carrying the substrate out of the baking component from the baking area through the outlet along the substrate baking route.
Preferably, the method further comprises a pre-bake step performed before the bake step by moving the movable pin support platform carrying the substrate along the substrate bake path through the entrance to a buffer zone between the entrance and the bake zone to pre-bake the substrate.
The present invention has been described in relation to the above embodiments, which are only exemplary of the implementation of the present invention. It must be noted that the disclosed embodiments do not limit the scope of the invention. Rather, modifications and equivalent arrangements included within the spirit and scope of the claims are included within the scope of the invention.
Claims (8)
1. A substrate baking treatment device is characterized by comprising
A baking member having a stage preparation area, an inlet, a baking area and an outlet formed in sequence on a substrate baking path; and
a movable thimble supporting platform driven to reciprocate on the substrate baking route, the movable thimble supporting platform comprises a platform and a plurality of thimbles, the plurality of thimbles are arranged on the upper surface of the platform, the upper parts of the plurality of thimbles are used for bearing a substrate to be baked,
the movable thimble supporting platform carrying the substrate is driven to pass through the inlet from the platform preparation area along the substrate baking route and move to the baking area to bake the substrate, and finally the substrate is moved out of the baking component through the outlet to finish baking the substrate.
2. The substrate baking processing apparatus according to claim 1, wherein: the baking component further comprises a buffer area, the buffer area is positioned between the inlet and the baking area, and the buffer area is provided with a temperature-controllable heating element so as to bake the substrate in advance.
3. The substrate baking processing apparatus according to claim 1, wherein: the movable thimble supporting platform further comprises a normally closed closing member, the inlet comprises a normally closed opening and a platform inlet and outlet which are communicated with each other from top to bottom, the normally closed opening is located above the platform inlet and outlet and is matched with the normally closed closing member, the normally closed opening is closed normally through the normally closed closing member, and the platform inlet and outlet is used for the movable thimble supporting platform to pass through.
4. The substrate baking processing apparatus according to claim 3, wherein: the height of the platform access opening is less than 30 mm.
5. A method for baking a substrate, comprising the steps of
A substrate baking processing apparatus providing step of providing a substrate baking processing apparatus, the substrate baking processing apparatus comprising: the baking component is sequentially provided with a platform preparation area, an inlet, a baking area and an outlet on a substrate baking route, the movable thimble supporting platform is driven to reciprocate on the substrate baking route and comprises a platform and a plurality of thimbles, the thimbles are arranged on the upper surface of the platform, and the upper parts of the thimbles are used for bearing a substrate to be baked;
a substrate placing step of placing a substrate to be baked on the upper portions of the plurality of pins of the movable pin support platform by a moving member, wherein the movable pin support platform is located on the platform preparation area;
a baking step of moving the movable thimble supporting platform carrying the substrate from the platform preparation area to the baking area through the inlet along the substrate baking route to bake the substrate; and
and a moving-out step, namely moving the movable thimble supporting platform carrying the substrate out of the baking component from the baking area through the outlet along the substrate baking route.
6. The method of baking a substrate according to claim 5, wherein: further comprising a pre-bake step, performed prior to the bake step, of moving the substrate through the movable pin-supporting platform carrying the substrate along the substrate bake path through the entrance to a buffer region located between the entrance and the bake region to pre-bake the substrate.
7. The method of baking a substrate according to claim 5, wherein: the substrate baking processing device further comprises a normally closed closing member, the inlet comprises a normally closed opening and a platform inlet and outlet which are communicated with each other from top to bottom, the normally closed opening is located above the platform inlet and outlet and is matched with the normally closed closing member, the normally closed opening is closed normally through the normally closed closing member, and the platform inlet and outlet are used for the movable thimble supporting platform to pass through.
8. The method of baking a substrate as claimed in claim 7, wherein: the height of the platform access opening is less than 30 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910975877.5A CN110787974A (en) | 2019-10-15 | 2019-10-15 | Substrate baking treatment device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910975877.5A CN110787974A (en) | 2019-10-15 | 2019-10-15 | Substrate baking treatment device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110787974A true CN110787974A (en) | 2020-02-14 |
Family
ID=69439107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910975877.5A Pending CN110787974A (en) | 2019-10-15 | 2019-10-15 | Substrate baking treatment device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110787974A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070048979A1 (en) * | 2005-08-31 | 2007-03-01 | Tokyo Electron Limited | Heating apparatus, and coating and developing apparatus |
| JP2008053454A (en) * | 2006-08-24 | 2008-03-06 | Dainippon Printing Co Ltd | Baking apparatus and baking method |
| KR20110036416A (en) * | 2009-10-01 | 2011-04-07 | 삼성전자주식회사 | Bake apparatus and bake method |
| CN102508381A (en) * | 2011-11-29 | 2012-06-20 | 深圳市华星光电技术有限公司 | Baking device for liquid crystal display panel |
| CN106873200A (en) * | 2017-03-28 | 2017-06-20 | 武汉华星光电技术有限公司 | Photoresistance roasting plant |
| CN107193142A (en) * | 2017-07-19 | 2017-09-22 | 武汉华星光电技术有限公司 | Alignment film cure system |
| CN107747861A (en) * | 2017-11-24 | 2018-03-02 | 中山深宝电器制造有限公司 | Tunnel type toasts production line |
| CN208284459U (en) * | 2018-04-18 | 2018-12-25 | 昆山国显光电有限公司 | A kind of substrate apparatus for baking |
| CN109830452A (en) * | 2019-01-25 | 2019-05-31 | 武汉华星光电半导体显示技术有限公司 | A kind of substrate apparatus for baking and substrate baking method |
-
2019
- 2019-10-15 CN CN201910975877.5A patent/CN110787974A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070048979A1 (en) * | 2005-08-31 | 2007-03-01 | Tokyo Electron Limited | Heating apparatus, and coating and developing apparatus |
| JP2008053454A (en) * | 2006-08-24 | 2008-03-06 | Dainippon Printing Co Ltd | Baking apparatus and baking method |
| KR20110036416A (en) * | 2009-10-01 | 2011-04-07 | 삼성전자주식회사 | Bake apparatus and bake method |
| CN102508381A (en) * | 2011-11-29 | 2012-06-20 | 深圳市华星光电技术有限公司 | Baking device for liquid crystal display panel |
| CN106873200A (en) * | 2017-03-28 | 2017-06-20 | 武汉华星光电技术有限公司 | Photoresistance roasting plant |
| CN107193142A (en) * | 2017-07-19 | 2017-09-22 | 武汉华星光电技术有限公司 | Alignment film cure system |
| CN107747861A (en) * | 2017-11-24 | 2018-03-02 | 中山深宝电器制造有限公司 | Tunnel type toasts production line |
| CN208284459U (en) * | 2018-04-18 | 2018-12-25 | 昆山国显光电有限公司 | A kind of substrate apparatus for baking |
| CN109830452A (en) * | 2019-01-25 | 2019-05-31 | 武汉华星光电半导体显示技术有限公司 | A kind of substrate apparatus for baking and substrate baking method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100931570B1 (en) | Press apparatus | |
| JP3052116B2 (en) | Heat treatment equipment | |
| CN103529599B (en) | The orientation equipment of a kind of air-flotation type crystal liquid substrate and method | |
| CN105702603A (en) | Heat treatment apparatus and heat treatment method | |
| JP2000012447A (en) | Heat treatment apparatus and method therefor | |
| CN107505739A (en) | Substrate support and alignment film preliminary drying roasting device | |
| CN110787974A (en) | Substrate baking treatment device | |
| KR20010029969A (en) | Substrate processing apparatus and substrate processing method | |
| KR20140098170A (en) | Batch annealing furnace for coils | |
| US9809491B2 (en) | Device and method for baking substrate | |
| JP3274089B2 (en) | Hybrid type heat treatment equipment | |
| CN104979239A (en) | Substrate processing apparatus and substrate holding member | |
| KR101166839B1 (en) | apparatus for testing for LCD panel | |
| JP3373413B2 (en) | Heat treatment equipment for uniformly heating flat workpieces by changing the wind speed | |
| CN220672522U (en) | Semiconductor process chamber | |
| KR100978262B1 (en) | Apparatus for testing liquid crystal dispaly devce | |
| JP7109211B2 (en) | Substrate processing equipment | |
| KR102594817B1 (en) | glass forming apparatus and method for vehicle display | |
| CN204125344U (en) | A kind of clean refrigerating unit of liquid crystal glass base Continuous maching | |
| CN209103053U (en) | A kind of substrate alignment liquid precuring device | |
| JP3261442B2 (en) | Vertical heat treatment furnace | |
| KR20210004426A (en) | Substrate bonding press apparatus and method | |
| KR20070077992A (en) | Apparatus and method for curing polyimide | |
| CN117889654A (en) | Heating furnace and heating method thereof | |
| JP2013040072A (en) | Method for manufacturing optical device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200214 |
|
| RJ01 | Rejection of invention patent application after publication |