CN109830452A - A kind of substrate apparatus for baking and substrate baking method - Google Patents
A kind of substrate apparatus for baking and substrate baking method Download PDFInfo
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- CN109830452A CN109830452A CN201910075371.9A CN201910075371A CN109830452A CN 109830452 A CN109830452 A CN 109830452A CN 201910075371 A CN201910075371 A CN 201910075371A CN 109830452 A CN109830452 A CN 109830452A
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Abstract
This application involves a kind of substrate apparatus for baking and substrate baking method, which includes: baking cavity；Multiple support plates, multiple support plates are located in baking cavity, and are arranged along preset direction parallel interval, when support plate is in unfolded state, corresponding heating chamber are formed between two neighboring support plate, heating chamber is used to toast into substrate therein；The side of first movement unit, support plate is connect with first movement unit, is moved for controlling support plate along preset direction；The temperature conditioning unit of multiple independent controls, for making substrate that there is different baking temperatures.In this way, substrate is toasted in heating chamber, and make the indoor substrate of heating chamber that there is different baking temperatures by mobile support plate, to realize the heating or cooling of substrate, can reduce substrate be sent into or take out oven when and external environment the temperature difference, thus avoid due to oven internal-external temperature difference it is larger caused by quality problems.
Description
[technical field]
This application involves display panel manufacturing technology fields, and in particular to a kind of substrate apparatus for baking and substrate baking side
Method.
[background technique]
In low temperature polycrystalline silicon (LTPS) manufacturing process, glass substrate is by techniques such as cleaning, coating, exposure, development, bleachings
Afterwards, it is sent in oven and is toasted, resin and light-sensitive compound in photoresist is made to crosslink simultaneously Reflow Soldering, penetrated with being promoted
Rate, and photoresist is hardened and adjusted photoresist figure and is tapered angle.
Currently, the oven that LTPS manufacturing process uses is mainly heated-air drying, compare and infra-red drying, with price
Lower, the advantages that volatile matter treatment Countermeasures are more excellent, slot pitch is smaller, and equal height can correspond to more furnace layer.But existing oven is adopted
With integral type heating method, when there is exception or fragmentation, whole shut down is needed to stop line, can not separate chamber processing, in addition,
When substrate is sent into or takes out oven, since oven internal-external temperature difference is larger, glass substrate, organic film surface, metal film surface are easily caused
Equal processing procedures substance instant exploding, so as to cause display brightness is uneven and quality problems.
[summary of the invention]
The application's is designed to provide a kind of substrate apparatus for baking and substrate baking method, to substrate in heating chamber
It is toasted, and makes the indoor substrate of heating chamber that there is different baking temperatures by mobile support plate, to realize the liter of substrate
Temperature or cooling, can reduce substrate be sent into or take out oven when and external environment the temperature difference, to avoid due to inside and outside oven
Quality problems caused by the temperature difference is larger.
To solve the above-mentioned problems, the embodiment of the present application provides a kind of substrate apparatus for baking, the substrate apparatus for baking packet
Include baking cavity；Multiple support plates, multiple support plates are located in baking cavity, and are arranged along preset direction parallel interval, work as branch
When fagging is in unfolded state, corresponding heating chamber is formed between two neighboring support plate, heating chamber is used for into wherein
Substrate toasted；The side of first movement unit, support plate is connect with first movement unit, for controlling support plate along pre-
Set direction is mobile；The temperature conditioning unit of multiple independent controls, for making substrate that there is different baking temperatures.
Further, baking cavity includes the first side wall being oppositely arranged and second sidewall, and the first side wall and second side
Wall is located at the two sides of support plate, multiple air inlet holes is offered on the first side wall, and multiple air inlet holes are along preset direction interval point
Cloth, offers multiple exhaust vents in second sidewall, and exhaust vent is corresponded and is oppositely arranged with air inlet hole.
Further, the corresponding air inlet hole of each temperature conditioning unit, temperature conditioning unit includes blower and heater, the gas of blower
Enter baking cavity through air inlet hole.
Further, first movement unit includes: the first movable bar and the second movable bar, the first movable bar and
Two movable bars are relatively arranged on the two sides of support plate, and connect with the corresponding side surface of support plate；Motor, motor is for driving the
One movable bar and the second movable bar, to drive support plate to move along preset direction.
Further, support plate includes the first foldable plate and the second foldable plate, the side of the first foldable plate and the
The connection of one movable bar, the side of the second foldable plate are connect with the second movable bar, wherein in the deployed state, first can
Folded sheet and the second foldable plate are spliced to form support plate；In folding process, the other side direction first of the first foldable plate
Movable bar folds, and the other side of the second foldable plate is folded towards the second movable bar, and when folding completion, first is foldable
Spacing distance between plate and the second foldable plate is less than the length of substrate.
Further, substrate apparatus for baking further includes the second mobile unit, and the second mobile unit can be rolled over for controlling first
Lamination and the second foldable plate are mobile, to adjust the distance between the first foldable plate and the second foldable plate.
Further, substrate apparatus for baking further includes displacement sensor, and displacement sensor is used in mobile support plate pair
It is detected the shift position of heating chamber.
Further, several thimbles are provided in support plate, to reduce the contact area between substrate and support plate.
To solve the above-mentioned problems, the embodiment of the present application also provides a kind of substrate baking method, the substrate baking methods
Applied to any of the above-described substrate apparatus for baking, comprising: substrate to be put into the support plate of predetermined position；Utilize first movement
Unit drives support plate to move along preset direction is intermittent, there is the default residence time between adjacent moving operation twice；Pre-
If in the residence time, controlling corresponding temperature conditioning unit and heating the substrate.
Further, within the default residence time, the step of corresponding temperature conditioning unit heats the substrate is controlled, it is specific to wrap
It includes: in the default residence time between first time moving operation and second of moving operation, controlling the first temperature conditioning unit with the
One baking temperature heats the substrate；The default residence time between second of moving operation and third time moving operation
Interior, the second temperature conditioning unit of control is heated the substrate with the second baking temperature.
The beneficial effect of the application is: being different from the prior art, substrate apparatus for baking provided by the present application, in heating chamber
It is interior that substrate is toasted, and make the indoor substrate of heating chamber that there is different baking temperatures by mobile support plate, to realize
The heating or cooling of substrate, can reduce substrate be sent into or take out oven when and external environment the temperature difference, thus avoid due to
Quality problems caused by oven internal-external temperature difference is larger.
[Detailed description of the invention]
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for
For those skilled in the art, without creative efforts, it can also be obtained according to these attached drawings other attached
Figure.
Fig. 1 is the structural schematic diagram of substrate apparatus for baking provided by the embodiments of the present application；
Fig. 2 is the fragmentary sectional elevation view of the substrate apparatus for baking in Fig. 1；
Fig. 3 is the structural schematic diagram after the substrate apparatus for baking in Fig. 2 once moves support plate；
Fig. 4 is another structural schematic diagram after the substrate apparatus for baking in Fig. 2 once moves support plate；
Fig. 5 is another fragmentary sectional elevation view of the substrate apparatus for baking in Fig. 1；
Fig. 6 is the structural schematic diagram after the substrate apparatus for baking in Fig. 5 once moves support plate；
Fig. 7 is the easy structure schematic diagram of first movement unit 103 in Fig. 1；
Fig. 8 be the substrate apparatus for baking in Fig. 1 support plate 102 be foldable plate when structural schematic diagram；
Fig. 9 is the flow diagram of substrate baking method provided by the embodiments of the present application.
[specific embodiment]
With reference to the accompanying drawings and examples, the application is described in further detail.It is emphasized that following implement
Example is merely to illustrate the application, but is not defined to scope of the present application.Likewise, following embodiment is only the portion of the application
Point embodiment and not all embodiments, institute obtained by those of ordinary skill in the art without making creative efforts
There are other embodiments, shall fall in the protection scope of this application.
It, can not when in order to solve to cause exception or fragmentation occur using integral type heating method due to existing baking oven
The problem of separate chamber processing, and cause to be also easy to produce when substrate is sent into or takes out oven since oven internal-external temperature difference is larger
Quality problems, substrate is toasted in heating chamber, and by mobile support plate there is the indoor substrate of heating chamber
Different baking temperatures, to realize the heating or cooling of substrate, can reduce substrate when being sent into or taking out oven with extraneous ring
The temperature difference in border, thus avoid due to oven internal-external temperature difference it is larger caused by quality problems.
Fig. 1 and Fig. 2 are please referred to, Fig. 1 is the structural schematic diagram of substrate apparatus for baking provided by the embodiments of the present application, and Fig. 2 is
The fragmentary sectional elevation view of substrate apparatus for baking in Fig. 1.The substrate apparatus for baking 100 includes baking cavity 101, multiple supports
The temperature conditioning unit 104 of plate 102, first movement unit 103 and multiple independent controls.Multiple support plates 102 are located at baking cavity 101
It is interior, and be arranged along preset direction Z parallel interval, corresponding heating chamber 105 is formed between two neighboring support plate 102, at this
In embodiment, support plate 102 can be foldable plate, when support plate 102 is foldable plate, in the deployed state, adjacent two
Corresponding heating chamber 105 is formed between a support plate 102.Heating chamber 105 is used to dry into substrate 106 therein
It is roasting.The side of support plate 102 is connect with first movement unit 103, and first movement unit 103 is for controlling support plate 102 along pre-
Set direction Z is mobile.The temperature conditioning unit 104 of multiple independent controls is for making substrate 106 have different baking temperatures.
In the present embodiment, by moving support plate 102 along preset direction Z, heating chamber 105 can be driven along default side
Mobile to Z, when heating chamber 105 is moved to a certain predeterminated position, the corresponding temperature conditioning unit 104 of the predeterminated position is dried with default
Roasting temperature toasts substrate 106.Wherein, multiple temperature conditioning units 104 are corresponding with multiple predeterminated positions, each predeterminated position pair
A baking temperature is answered, by mobile heating chamber 105 to different predeterminated positions, the base into the heating chamber 105 can be made
Plate 106 has different baking temperatures.
It is different from the prior art, the substrate apparatus for baking of the present embodiment toasts substrate in heating chamber, and lead to
It crosses and moves support plate and make the indoor substrate of heating chamber that there is different baking temperatures, it, can be with to realize the heating or cooling of substrate
Reduce substrate be sent into or take out oven when and external environment the temperature difference, to avoid causing since oven internal-external temperature difference is larger
Quality problems.
With continued reference to Fig. 1 and Fig. 2, which includes baking cavity 101, multiple support plates 102, first
The temperature conditioning unit 104 of mobile unit 103 and multiple independent controls.Multiple support plates 102 are located in baking cavity 102, and along pre-
Set direction Z parallel interval is arranged, and forms corresponding heating chamber 105 between two neighboring support plate 102, in the present embodiment,
Support plate 102 can be foldable plate, when support plate 102 is foldable plate, in the deployed state, two neighboring support plate
Corresponding heating chamber 105 is formed between 102.Heating chamber 105 is used to toast into substrate 106 therein.Support
The side of plate 102 is connect with first movement unit 103, and first movement unit 103 is for controlling support plate 102 along preset direction Z
It is mobile.The temperature conditioning unit 104 of multiple independent controls is for making substrate 106 have different baking temperatures.
In the present embodiment, baking cavity 101 includes the first side wall 1011 that is oppositely arranged and second sidewall 1012, and the
One side wall 1011 and second sidewall 1012 are located at the two sides of support plate 102, and multiple air inlet holes are offered on the first side wall 1011
107, and multiple air inlet holes 107 are spaced apart along preset direction Z, multiple exhaust vents 108 are offered in second sidewall 1012, out
Air holes 107 is corresponded and is oppositely arranged with air inlet hole 108.
Wherein, the corresponding air inlet hole 107 of each temperature conditioning unit 104, temperature conditioning unit 104 include blower 1041 and heater
1042, the gas of blower 1041 enters baking cavity 101 through air inlet hole 107.Specifically, as shown in Fig. 2, arrow generation in Fig. 2
The path of table air, blower 1041 draw air into air duct 1043, and heater 1042 heats the air in air duct 1043,
To form hot wind, and hot wind enters baking cavity 101 through air inlet hole 107.In the present embodiment, it can be controlled by blower 1041
The air quantity of hot wind, and the temperature using the control hot wind of heater 1042, wherein air duct 1043 can be plastic flexible pipe.
When substrate apparatus for baking 100 is in normal operating conditions, above-mentioned preset direction Z is generally gravity direction.It is propping up
When fagging 102 is moved up and down along gravity direction, the heating chamber 105 formed between two neighboring support plate 102 also can with one of
Movement is played, and after movement, each heating chamber 105 is corresponding with an air inlet hole 107, an exhaust vent 108 and a temperature control list
Member 104, wherein temperature conditioning unit 104 provides hot wind and hot wind is sent into corresponding heating chamber 105 from air inlet hole 107, hot wind into
Placement substrate 106 therein is toasted after entering heating chamber 105, is then discharged from corresponding exhaust vent 108.
In the present embodiment, multiple air inlet holes 107 are arranged along gravity direction interval, and different air inlet holes 107 is corresponding different
Hot blast temperature, heating chamber 105 can be one or multiple.
When heating chamber 105 is multiple, it can choose and substrate 106 is sent into corresponding add in baking 101 bottom of cavity
Hot chamber 105, and by the corresponding hot blast temperature of air inlet hole 107 be set as with air inlet hole 107 apart from baking 101 bottom of cavity away from
It is increased from increase.For example, four heating chambers 105 are stacked from lower to upper with continued reference to Fig. 2, and at a time, first
The hot blast temperature of the corresponding air inlet hole 107 of heating chamber 1051 is 400 DEG C, the corresponding air inlet hole 107 of the second heating chamber 1052
Hot blast temperature be 300 DEG C, the hot blast temperature of the corresponding air inlet hole 107 of third heating chamber 1053 is 200 DEG C, the 4th heating chamber
The hot blast temperature of the corresponding air inlet hole 107 in room 1054 is 100 DEG C.
After carrying out movement for the first time, as shown in figure 3, the 4th heating chamber 1054 is moved upward to original third heating chamber
The position of room 1053, third heating chamber 1053 are moved upward to the position of original second heating chamber 1052, the second heating chamber
Room 1052 is moved upward to the position of original first heating chamber 1051, correspondingly, the corresponding hot wind temperature of each heating chamber 105
Degree can also change.
About the first heating chamber 1051, if there is also other heating chambers on the position of original first chamber 1051,
Then the first heating chamber 1051 can be moved up to replace heating chamber disposed thereon, further, if the first heating
There is no the tops that other heating chambers or the first heating chamber 1051 have arrived at baking cavity 101 on chamber 1051
Portion then can be moved to another baking cavity from baking 101 top area of cavity, and in another baking cavity, to first
Substrate 106 in baking cavity 1051 takes out after being cooled down.
For example, as shown in figure 4, substrate apparatus for baking 100 further include be located at baking cavity 101 on and with baking cavity 101
The cooling baking cavity 201 being stacked, the cooling are toasted cavity 201 and are with the difference for toasting cavity 101, cooling baking chamber
The corresponding hot blast temperature of air inlet hole is set to increase with the distance of air inlet hole distance cooling baking 201 bottom of cavity in body 201
And it reduces.Above-mentioned first heating chamber 1051 from baking 101 top area of cavity be moved to cooling baking 201 bottom of cavity after,
It continues up and intermittently moves, the temperature of substrate 106 can gradually decrease in the first heating chamber 1051, finally toast from cooling
The top area of cavity 201 is taken out.Similarly, above-mentioned second heating chamber 1052, third heating chamber 1053, the 4th heating chamber
Room 1054 and the heating chamber under the 4th heating chamber 1054 finally can intermittently be moved to cooling baking
The top area of cavity 201 and taking-up.
In this way, by putting substrate 106 into the bottom section of baking cavity 101, and at the top of cooling baking cavity 201
Substrate 106 is taken out in region, can effectively avoid substrate 106 when being sent into or taking out substrate apparatus for baking 100 due to internal-external temperature difference
Caused by show uneven and quality problems, in addition, a point multiple heating chambers 105 toast substrate 106, when some
When occurring abnormal inside heating chamber 105, can separate chamber processing, and will not influence normally making for other heating chambers 105
With.
When heating chamber 105 is one, Fig. 5 and Fig. 6 are please referred to, can choose and toasting 101 bottom of cavity for substrate
106 are put into the heating chamber 105, and the corresponding hot blast temperature of air inlet hole 107 is set as with air inlet hole 107 apart from baking cavity
The distance of 101 bottoms increases and increases, then by intermittently moving the heating chamber 105 upwards, so that the temperature of substrate 106
Degree gradually rises, and further, after substrate 106 completes baking, intermittently moves the heating chamber 105 still further below, so that
The temperature of substrate 106 gradually decreases, and substrate 106 is finally taken out from heating chamber 105, is being put into or is taking to reduce substrate 106
Internal-external temperature difference when substrate apparatus for baking 100 out, and substrate 106 is toasted using heating chamber 105, there is exception
When can be handled with separate chamber.
Optionally, the aperture for being set to multiple air inlet holes 107 on the first side wall 1011 is identical, and equidistant intervals, right
Ying Di, multiple support plates 102 in baking cavity 101 are also spaced set, and between two neighboring support plate 102
Spacing distance is not less than the aperture of air inlet hole 107, in this way, more heating chambers 105 are advantageously formed, to improve substrate baking
The working efficiency of roasting device 100.
Further, substrate apparatus for baking 100 can also include displacement sensor (not shown), as grating scale is displaced
Sensor, for being detected in mobile support plate 102 to the shift position of heating chamber 105, to ensure every time mobile knot
Heating chamber 105 can accurately reach predeterminated position after beam.
Optionally, with continued reference to Fig. 2, when substrate 106 is put into heating chamber 105, the corresponding support of heating chamber 105
Plate 102 is supported substrate 106, to avoid causing substrate 106 heated since support plate 102 is directly contacted with substrate 106
The problem of uneven and pollution, is provided with several thimbles 109 in support plate 102, and the height of thimble 109 is 5mm or so, is passed through
Substrate 106 is placed on thimble 109, to reduce the contact area between substrate 106 and support plate 102.
Optionally, referring to Fig. 7, Fig. 7 is the easy structure schematic diagram of first movement unit 103 in Fig. 1, first movement list
Member 103 includes the first movable bar 1031, the second movable bar 1032 and motor (not shown), the first movable bar
1031 and second movable bar 1032 be relatively arranged on the two sides of support plate 102, and connect with the corresponding side surface of support plate 102,
Motor is for driving the first movable bar 1031 and the second movable bar 1032, to drive support plate 102 to move along preset direction Z
It is dynamic.Specifically, the first movable bar 1031 and the second movable bar 1032 are relatively arranged on the side wall of baking cavity 101, and
It can be moved relative to the side wall of baking cavity 101 along preset direction, wherein the first, second movable bar 1031/1032 can be with
The tangent setting of side wall of cavity 101 is toasted, the cunning extended along preset direction Z can also be set on the side wall of baking cavity 101
Road, and the first, second movable bar 1031/1032 is set in the slideway.
In one embodiment, substrate apparatus for baking 100 further includes board transport unit.Specifically, as shown in figure 8, branch
Fagging 102 includes the first foldable plate 1021 and the second foldable plate 1022, and the side and first of the first foldable plate 1021 can
Mobile bar 1031 connects, and the side of the second foldable plate 1022 is connect with the second movable bar 1032, wherein in unfolded state
Under, as shown in (a) in Fig. 8, the first foldable plate 1021 and the second foldable plate 1022 are spliced to form monolith support plate 102,
In folding process, the other side of the first foldable plate 1021 is folded towards the first movable bar 1031, the second foldable plate
1022 other side is folded towards the second movable bar 1032.When folding completion, as shown in (b) in Fig. 8, first is foldable
Plate 1021, the second foldable plate 1022 and first movement unit 103 constitute board transport unit, can be used for along preset direction Z
Transmission base plate 106.Also, during transmission base plate 106, between the first foldable plate 1021 and the second foldable plate 1022
Spacing distance be less than the length of substrate 106, the first foldable plate 1021 and the second foldable plate 1022 are to substrate 106 opposite two
The fringe region at end is supported.
Substrate apparatus for baking 100 in actual use, can first control support plate 102 and fold, with correspondence
Board transport unit is formed, substrate 106 is then moved to initial preset position using the board transport unit.Detecting base
After plate 106 reaches initial preset position, control support plate 102 is unfolded, so that substrate 106 is located at two neighboring support plate 102
Between in the heating chamber 105 that is formed, the heating chamber 105 is then intermittently moved, with different temperature to heating chamber
Substrate 106 in room 105 is toasted into property, wherein the description that specific operating method can be mobile to heating chamber with reference to front.
In this way, in the deployed state, heating chamber 105 is formed, to realize substrate 106 gradually using the foldability energy of support plate 102
Heating or cooling form board transport unit, in a folded configuration with bulk transfer substrate 106.In substrate apparatus for baking 100
In actual use, by both states of flexible utilization support plate 102, substrate apparatus for baking 100 can be played
Maximum utilization rate.
It should be noted that support plate 102 in folding process and when folding completion, is arranged in support plate 102
Thimble 109 will not influence the folding of support plate 102 due to highly smaller.In addition, in other embodiments, above-mentioned first
Two foldable plates 1021/1022 can also be substituted with retractable plate.
Further, in order to avoid aforesaid substrate transmission unit is during transmission base plate 106, the both ends of substrate 106
The side wall of distance baking cavity 101 is too close, is unfavorable for subsequent baking operation, and substrate apparatus for baking 100 further includes second mobile
Unit (not shown), the second mobile unit is mobile for controlling the first foldable plate 1021 and the second foldable plate 1022,
To adjust the distance between the first foldable plate 1021 and the second foldable plate 1022.For example, being controlled using the second mobile unit
First/second folded sheet 1021/1022 moves left and right, to adjust the distance between first/second folded sheet 1021/1022, into
And adjust the distance between substrate 106 and baking 101 side wall of cavity.Wherein, the second mobile unit can use and first movement
The similar structure design of unit 103, such as the second mobile unit may include third movable bar, the 4th movable bar, Yi Ji electricity
Machine.
Optionally, in the above-described embodiments, the material of support plate 102 is heat preserving and insulating material, and can be single layer knot
Structure may be multilayered structure.
It being different from the prior art, the substrate apparatus for baking in the present embodiment toasts substrate in heating chamber, and
The indoor substrate of heating chamber is set to have different baking temperatures can to realize the heating or cooling of substrate by mobile support plate
With reduce substrate be sent into or take out oven when and external environment the temperature difference, to avoid leading since oven internal-external temperature difference is larger
The quality problems of cause.
Referring to Fig. 9, Fig. 9 is the flow diagram of substrate baking method provided by the embodiments of the present application.Substrate baking
Method is applied to the substrate apparatus for baking of any of the above-described embodiment, wherein substrate apparatus for baking includes baking cavity, multiple supports
The temperature conditioning unit of plate, first movement unit and multiple independent controls.Multiple support plates are located in baking cavity, and along preset direction
Parallel interval is arranged, and forms corresponding heating chamber between two neighboring support plate, and in the present embodiment, support plate can be can
Folded sheet in the deployed state, forms corresponding heating chamber when support plate is foldable plate between two neighboring support plate
Room.Heating chamber is used to toast into substrate therein.The side of support plate is connect with first movement unit, and first moves
Moving cell is moved for controlling support plate along preset direction.The temperature conditioning unit of multiple independent controls is different for having substrate
Baking temperature.Description is described in detail in the above-described embodiments as described in substrate apparatus for baking, and details are not described herein again.
The substrate baking method the following steps are included:
S91: substrate is put into the support plate of predetermined position.
In the present embodiment, predeterminated position can be the corresponding support plate of heating chamber for being located at baking cavity bottom,
It can be the corresponding support plate of heating chamber being located at the top of baking cavity.Wherein, the corresponding substrate baking temperature of predetermined position
Degree can be environment temperature or be minimum baking temperature.
Optionally, S91 can be specifically included:
Substrate is put into the support plate in board transport unit；
Substrate is moved to predeterminated position by control base board transmission unit；
Control base board transmission unit is unfolded by support plate, so that the heating that substrate is formed between two neighboring support plate
In chamber.
S92: driving support plate to move along preset direction is intermittent using first movement unit, adjacent moving operation twice it
Between there is the default residence time.
In the default residence time between adjacent moving operation twice, it is corresponding with a default baking temperature, to substrate
It is heated.Wherein, corresponding baking temperature of different default residence times is different, and the length of each default residence time should
Long enough, so that the temperature of substrate has reached the default residence time corresponding baking when starting moving operation next time
Temperature.
S93: it within the default residence time, controls corresponding temperature conditioning unit and heats the substrate.
Optionally, S93 is specifically included:
Sub-step A: in the default residence time between first time moving operation and second of moving operation, control first
Temperature conditioning unit is heated the substrate with the first baking temperature；
Sub-step B: in the default residence time between second of moving operation and third time moving operation, control second
Temperature conditioning unit is heated the substrate with the second baking temperature, wherein the second baking temperature is greater than the first baking temperature.
And so on, the increase with mobile number, the default stop between adjacent moving operation twice can be set
Corresponding baking temperature gradually rises in time, and to realize being gradually warmed up for substrate, substrate baking dress can be put into avoid substrate
When setting due to internal-external temperature difference it is larger caused by quality problems.
In the actual operation process, can specifically set the increase with mobile number, adjacent moving operation twice it
Between the default residence time in corresponding baking temperature it is incremented by successively, wherein the optimum value of incremental amplitude every time, can be by not
Disconnected test is with determination.
Further, after above-mentioned sub-step B, can also include:
Sub-step C: in the default residence time between third time moving operation and the 4th moving operation, third is controlled
Temperature conditioning unit is heated the substrate with third baking temperature, wherein third baking temperature is less than the second baking temperature；
Sub-step D: in the default residence time between the 4th moving operation and the 5th moving operation, control the 4th
Temperature conditioning unit is heated the substrate with the 4th baking temperature, wherein the 4th baking temperature is less than third baking temperature.
And so on, baking temperature corresponding in the default residence time between adjacent moving operation twice can be set
Are as follows: it with the increase of mobile number, first gradually rises to maximum preset baking temperature, is then gradually decrease to minimum default temperature again
Degree is gradually warmed up with to realize substrate when being put into and is gradually cooled down when taking out, and can be put into or be taken out substrate to avoid substrate and dry
When roasting device due to internal-external temperature difference it is larger caused by quality problems.
It being different from the prior art, the substrate baking method in the present embodiment toasts substrate in heating chamber, and
The indoor substrate of heating chamber is set to have different baking temperatures can to realize the heating or cooling of substrate by mobile support plate
With reduce substrate be sent into or take out oven when and external environment the temperature difference, to avoid leading since oven internal-external temperature difference is larger
The quality problems of cause.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (10)
1. a kind of substrate apparatus for baking characterized by comprising
Toast cavity；
Multiple support plates, multiple support plates are located in the baking cavity, and are arranged along preset direction parallel interval, work as institute
When stating support plate in unfolded state, corresponding heating chamber is formed between the two neighboring support plate, the heating chamber is used
It is toasted in into substrate therein；
First movement unit, the side of the support plate are connect with the first movement unit, for controlling the support plate edge
The preset direction is mobile；
The temperature conditioning unit of multiple independent controls, for making the substrate that there is different baking temperatures.
2. substrate apparatus for baking according to claim 1, which is characterized in that the baking cavity includes the be oppositely arranged
One side wall and second sidewall, and the first side wall and the second sidewall are located at the two sides of the support plate, described first
Multiple air inlet holes are offered on side wall, and multiple air inlet holes are spaced apart along the preset direction, in the second sidewall
On offer multiple exhaust vents, the exhaust vent is corresponded and is oppositely arranged with the air inlet hole.
3. substrate apparatus for baking according to claim 2, which is characterized in that each temperature conditioning unit corresponding one it is described into
Air holes, the temperature conditioning unit include blower and heater, and the gas of the blower enters the baking cavity through the air inlet hole.
4. substrate apparatus for baking according to claim 1, which is characterized in that the first movement unit includes:
First movable bar and the second movable bar, first movable bar and second movable bar are relatively arranged on institute
The two sides of support plate are stated, and are connect with the corresponding side surface of the support plate；
Motor, the motor is for driving first movable bar and second movable bar, to drive the support plate
It is moved along the preset direction.
5. substrate apparatus for baking according to claim 4, which is characterized in that the support plate include the first foldable plate and
The side of second foldable plate, the first foldable plate is connect with first movable bar, the second foldable plate
Side is connect with second movable bar, wherein
In the deployed state, the described first foldable plate and the described second foldable plate are spliced to form the support plate；
In folding process, the other side of the first foldable plate is folded towards first movable bar, and described second can
The other side of folded sheet is folded towards second movable bar, when fold complete when, the first foldable plate and described the
Spacing distance between two foldable plates is less than the length of the substrate.
6. substrate apparatus for baking according to claim 5, which is characterized in that the substrate apparatus for baking further includes the second shifting
Moving cell, second mobile unit is mobile for controlling the described first foldable plate and the second foldable plate, with adjustment
The distance between the first foldable plate and the second foldable plate.
7. substrate apparatus for baking according to claim 1, which is characterized in that the substrate apparatus for baking further includes that displacement passes
Sensor, institute's displacement sensors are for detecting the shift position of the heating chamber in the movement support plate.
8. substrate apparatus for baking according to claim 1, which is characterized in that several thimbles are provided in the support plate,
To reduce the contact area between the substrate and the support plate.
9. a kind of substrate baking method is applied to such as described in any item substrate apparatus for baking of claim 1-8, feature and exists
In, which comprises
The substrate is put into the support plate of predetermined position；
The support plate is driven to move along the preset direction is intermittent using the first movement unit, adjacent behaviour mobile twice
There is the default residence time between work；
Within the default residence time, controls the corresponding temperature conditioning unit and the substrate is heated.
10. according to the method described in claim 9, control is corresponding it is characterized in that, described within the default residence time
The step of temperature conditioning unit heats the substrate, specifically includes:
In the default residence time between first time moving operation and second of moving operation, the first temperature conditioning unit is controlled
The substrate is heated with the first baking temperature；
In the default residence time between second of moving operation and third time moving operation, the second temperature control is controlled
Unit heats the substrate with the second baking temperature.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110787974A (en) * | 2019-10-15 | 2020-02-14 | 深圳市华星光电半导体显示技术有限公司 | Substrate baking treatment device |
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| KR20180020907A (en) * | 2016-08-18 | 2018-02-28 | 가부시키가이샤 스크린 홀딩스 | Thermal processing device, substrate processing apparatus, thermal processing method and substrate processing method |
| KR20180077385A (en) * | 2016-12-28 | 2018-07-09 | 주식회사 비아트론 | Heat-Treatment Apparatus and Method of Substrate Using Polygon Scanner |
| CN108615674A (en) * | 2009-10-09 | 2018-10-02 | 应用材料公司 | Apparatus and method for for improving control heating and cooling substrate |
| CN108735628A (en) * | 2017-04-21 | 2018-11-02 | 东京毅力科创株式会社 | Substrate heating equipment |
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| JPH09159369A (en) * | 1995-12-05 | 1997-06-20 | Kokusai Denki Erutetsuku:Kk | Heat treatmetn furnace |
| CN108615674A (en) * | 2009-10-09 | 2018-10-02 | 应用材料公司 | Apparatus and method for for improving control heating and cooling substrate |
| KR20180020907A (en) * | 2016-08-18 | 2018-02-28 | 가부시키가이샤 스크린 홀딩스 | Thermal processing device, substrate processing apparatus, thermal processing method and substrate processing method |
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