CN213240806U - Photoresist baking device and photoresist baking equipment - Google Patents
Photoresist baking device and photoresist baking equipment Download PDFInfo
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- CN213240806U CN213240806U CN202022005611.9U CN202022005611U CN213240806U CN 213240806 U CN213240806 U CN 213240806U CN 202022005611 U CN202022005611 U CN 202022005611U CN 213240806 U CN213240806 U CN 213240806U
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- 229920002120 photoresistant polymer Polymers 0.000 title claims abstract description 102
- 238000010438 heat treatment Methods 0.000 claims abstract description 100
- 239000000758 substrate Substances 0.000 claims abstract description 51
- 230000000712 assembly Effects 0.000 claims abstract description 26
- 238000000429 assembly Methods 0.000 claims abstract description 26
- 238000009413 insulation Methods 0.000 claims description 3
- 238000003491 array Methods 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 abstract description 5
- 238000000576 coating method Methods 0.000 abstract description 5
- 230000002159 abnormal effect Effects 0.000 description 15
- 238000001514 detection method Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- 239000011521 glass Substances 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000005611 electricity Effects 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
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- 238000000034 method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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Abstract
The utility model relates to the technical field of display, an embodiment of the utility model discloses a photoresistance baking device and photoresistance baking equipment, wherein the photoresistance baking device comprises a baking cavity body formed by enclosing a bottom plate and a cover plate, and also comprises a heating plate positioned on the bottom plate and a controller electrically connected with the heating plate, and the heating plate is used for placing a substrate to be baked; the cover plate is provided with a plurality of temperature adjusting assemblies arranged in an array on one side opposite to the heating plate, the plurality of temperature adjusting assemblies are respectively electrically connected with the controller, and the heating temperature of each temperature adjusting assembly is respectively adjusted through the controller. The photoresist baking device can locally adjust the line width size of a product according to different conditions, so that the uniformity of the line width size of the product is improved; the problem that the local line width of the cutter starting part is larger or smaller in size during photoresist coating can be effectively solved, and the use flexibility of the photoresist baking device is improved. The photoresist baking equipment comprises the photoresist baking device.
Description
Technical Field
The utility model relates to a show technical field, in particular to photoresistance baking equipment and photoresistance baking equipment.
Background
In the prior art, a liquid crystal display device generally includes a liquid crystal display panel and a backlight module. The liquid crystal display panel comprises a thin film transistor substrate, a color filter substrate and a liquid crystal layer, wherein the thin film transistor substrate is arranged opposite to the color filter substrate, and the liquid crystal layer is clamped between the thin film transistor substrate and the color filter substrate.
In the manufacturing process of the thin film transistor substrate, when a certain film layer is formed, a photoresist pattern is usually formed through coating, exposure and development processes, wherein after the photoresist is coated, a part of solvent in the photoresist is extracted through a vacuumizing unit, and is dried and cured through baking equipment, and the residual solvent in the photoresist is removed, so that the adhesion between the photoresist and the glass substrate is enhanced, and a better development effect is achieved.
FIG. 1 is a schematic diagram of a photoresist baking apparatus in the prior art. As shown in fig. 1, the photoresist baking device includes a baking chamber enclosed by a bottom plate 11 and a cover plate 12, a heating plate 13 is disposed on the bottom plate 11, and the glass substrate 1 coated with photoresist is placed on the heating plate 13. When the glass substrate 1 coated with the photoresist is baked, the glass substrate 1 is placed on the heating plate 13, and the chemical substances on the surface of the glass substrate 1 are volatilized by the heat of the heating plate 13, in the process, the heat source of the heating plate 13 comes from the heater at the bottom of the heating plate. The photoresist baking device disclosed in the prior art cannot accurately perform local temperature control, so that the means for performing local compensation on the line width size of the developed photoresist pattern is limited, and the improvement effect on the line width size uniformity is poor, so that the photoresist baking device disclosed in the prior art is poor in use flexibility.
In view of the above, the applicant of the present invention has made an intensive conception for various defects and inconveniences caused by the perfection of the design of the photoresist baking apparatus, and has actively researched and developed the present creation by improving and trying.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving the relatively poor technical problem such as the use flexibility of the optical resistance baking equipment among the prior art.
In order to solve the technical problem, the utility model discloses a solution is: the embodiment discloses a photoresist baking device, which is used for baking a substrate to be baked coated with photoresist, and comprises a baking cavity, a heating plate and a controller, wherein the baking cavity is formed by enclosing a bottom plate and a cover plate; wherein, be equipped with the temperature regulation subassembly that a plurality of arrays were arranged on the one side that this apron is relative with this hot plate, a plurality of these temperature regulation subassemblies are connected with this controller electricity respectively to adjust every temperature regulation subassembly's heating temperature respectively through this controller.
Preferably, the cover plate is further provided with a plurality of detection assemblies, the detection assemblies and the temperature adjustment assemblies are arranged in a one-to-one correspondence manner and used for detecting the photoresist thicknesses of different positions on the substrate to be baked, the detection assemblies are further respectively electrically connected with the controller and used for sending the photoresist thicknesses to the controller, and the controller is used for correspondingly setting first compensation parameters according to the photoresist thicknesses so as to adjust the heating temperature of the temperature adjustment assemblies.
Preferably, still be equipped with a plurality of temperature-sensing subassemblies on this apron, a plurality of this temperature-sensing subassemblies and a plurality of this temperature regulation subassemblies one-to-one setting are used for detecting the actual temperature of this internal different positions of toasting, and a plurality of this temperature-sensing subassemblies still are connected with this controller electricity respectively and send this actual temperature for this controller, and this controller sets up the heating temperature of second compensation parameter in order to adjust this temperature regulation subassembly according to this actual temperature correspondence.
Preferably, this hot plate is placed this base plate of waiting to toast in the one side of keeping away from this bottom plate, and this hot plate is equipped with a plurality of first heating element that the array was arranged in one side of being close to this bottom plate, and a plurality of these first heating element are connected with this controller electricity respectively to adjust the temperature of every this first heating element respectively through this controller and heat in order to should waiting to toast the base plate.
Preferably, the number of the temperature adjustment assemblies on the cover plate is greater than the number of the first heating assemblies on the heating plate.
Preferably, the temperature adjusting assembly comprises a second heating assembly and a baffle plate which are arranged in sequence, the baffle plate is arranged opposite to the substrate to be baked, and the controller controls the opening and closing states of the second heating assembly and the baffle plate.
Preferably, the second heating assembly comprises a resistance coil, the temperature adjusting assembly is further provided with an air pipe on one side far away from the baffle, and the controller controls the opening and closing states of the air pipe.
Preferably, the second heating assembly comprises an infrared lamp.
Preferably, the cover plate is provided with an insulating assembly at least at the side remote from the temperature regulating assembly.
The embodiment of the utility model provides a still disclose a photoresistance baking equipment, this photoresistance baking equipment includes as above photoresistance baking equipment.
Compared with the prior art, the utility model provides an above-mentioned embodiment has following beneficial effect: the photoresist baking device and the photoresist baking equipment disclosed by the embodiment can be used for locally adjusting the line width size of a product according to different conditions, so that the uniformity of the line width size of the product is improved; the problem that the local line width of the cutter starting part is larger or smaller in size during photoresist coating can be effectively solved, and the use flexibility of the photoresist baking device is improved.
Drawings
The above and other objects, features and advantages of the present invention will become more apparent from the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:
FIG. 1 is a schematic diagram of a photoresist baking apparatus in the prior art;
FIG. 2 is a schematic perspective exploded view of a photoresist baking apparatus according to an embodiment of the disclosure;
FIG. 3a is a schematic diagram illustrating a first exemplary embodiment of a temperature adjustment assembly of a photoresist baking apparatus;
FIG. 3b is a schematic diagram illustrating a second exemplary embodiment of a temperature adjustment assembly of a photoresist baking apparatus;
FIG. 4a is a schematic view illustrating another structure of a temperature adjustment assembly in a photoresist baking apparatus according to an embodiment of the present disclosure;
FIG. 4b is a schematic diagram illustrating another structure of a temperature adjustment assembly in the photoresist baking apparatus according to the first embodiment;
fig. 5 is a schematic perspective exploded view of the photoresist baking apparatus according to the second embodiment.
Detailed Description
In order to further explain the technical solution of the present invention, the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiment of the present invention, and it is obvious that the described embodiment is only a part of the embodiment of the present invention, but not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example one
Fig. 2 is a schematic perspective exploded view of a photoresist baking apparatus according to an embodiment of the disclosure.
As shown in fig. 2, the present embodiment discloses a photoresist baking apparatus for baking a substrate 100 to be baked coated with photoresist, which includes a bottom plate 210 and a cover plate 220, wherein the bottom plate 210 and the cover plate 220 enclose a baking chamber (not shown), an opening/closing inlet (not shown) is disposed on one side of the bottom plate 210, and a robot arm delivers the substrate 100 to be baked into the photoresist baking apparatus from the inlet. The photoresist baking apparatus further comprises a heating plate 230 disposed on the bottom plate 210 and a controller 300 electrically connected to the heating plate 230, wherein the heating plate 230 is used for placing the substrate 100 to be baked. Wherein the size of the substrate 100 to be baked is equal to or smaller than the size of the heating plate 230; the size of the heating plate 230 is substantially the same as that of the base plate 210; the size of the bottom plate 210 is equal to the size of the cover plate 220. I.e., the heating plate 230 has substantially the same size as the cover plate 220.
Specifically, the substrate 100 to be baked is placed on one side of the heating plate 230 away from the bottom plate 210, nine first heating elements 231 arranged in an array are disposed on one side of the heating plate 230 close to the bottom plate 210, the nine first heating elements 231 are electrically connected to the controller 300, and the controller 300 is used to adjust the temperature of each first heating element 231 to heat the substrate 100 to be baked. In other embodiments, a greater number of the first heating elements 231 may be provided, and the greater the number of the first heating elements 231, the more precise the heating plate 230 heats the positions of the substrate 100 to be baked, and therefore, the number of the first heating elements 231 is not limited in this embodiment.
In this embodiment, sixteen temperature adjustment assemblies 221 are disposed on the side of the cover plate 220 opposite to the heating plate 230, and the sixteen temperature adjustment assemblies 221 are electrically connected to the controller 300 respectively, and adjust the heating temperature of each temperature adjustment assembly 221 through the controller 300 respectively. In other embodiments, a greater number of the temperature adjustment assemblies 221 may be provided, and likewise, the greater the number of the temperature adjustment assemblies 221, the more precise the heating of the cover plate 220 to the various positions of the substrate 100 to be baked, and therefore, the number of the temperature adjustment assemblies 221 is not limited in this embodiment.
In the present embodiment, the number of the temperature adjustment members 221 on the cover plate 220 is greater than the number of the first heating members 231 on the heating plate 230, i.e., the size of a single first heating member 231 on the heating plate 230 is greater than the size of a single temperature adjustment member 221 on the cover plate 220. This allows for locally accurate temperature control to compensate for line width dimensions. In other embodiments, the two may be set to have the same number and correspond to each other, and the embodiment is not limited herein.
In this embodiment, the cover plate 220 is provided with a heat insulation assembly (not shown) at a side away from the temperature adjustment assembly 221, so that on one hand, heat inside the baking cavity is not lost, and on the other hand, safety of an operator can be improved. In other embodiments, the heat insulation assembly may be disposed around the entire cover plate 220, and the embodiment is not limited herein.
In this embodiment, sixteen detecting elements 222 are further disposed on the cover plate 220, sixteen detecting elements 222 and sixteen temperature adjusting elements 221 are disposed in a one-to-one correspondence manner and are used for detecting the photoresist thickness at different positions on the substrate 100 to be baked, sixteen detecting elements 222 are further electrically connected to the controller 300 respectively and transmit the photoresist thickness to the controller 300, and the controller 300 sets a first compensation parameter according to the photoresist thickness to adjust the heating temperature of the temperature adjusting elements 221.
When the photoresist baking device disclosed in this embodiment is used to bake the substrate 100 to be baked, the substrate 100 to be baked enters the baking cavity through the inlet, and then the inlet is closed, so that the baking cavity forms a closed space, and at this time, the substrate 100 to be baked is placed on the heating plate 230 in the baking cavity; then, the first heating element 231 is turned on, so that the substrate 100 to be baked can be baked and heated; after heating for a period of time, the detecting element 222 on the cover plate 220 starts to detect the photoresist thickness at different positions on the substrate 100 to be baked and sends the photoresist thickness to the controller 300, and the controller 300 sets a first compensation parameter according to the photoresist thickness to adjust the heating temperature of the temperature adjusting element 221.
Specifically, when one of the inspection elements 222 detects that the thickness of the photoresist in a corresponding region of the substrate 100 to be baked is too thin, the line width of the abnormal region will be too small and the hole size will be too large without any processing. The detecting component 222 of the present embodiment sends the information that the photoresist thickness is thin to the controller 300. The controller 300 receives the information that the photoresist thickness is too thin, sets a first compensation parameter accordingly, and sends the first compensation parameter to the temperature adjustment assembly 221. The information of the thinner photoresist layer is configured with a first compensation parameter, for example, to raise the temperature of the abnormal region, so that the temperature adjustment element 221 corresponding to the detection element 222 starts to heat up. The temperature heating of the abnormal area can accurately compensate the line width dimension, so that the photoresist of the abnormal area is drier, the line width dimension is larger after the photoresist is drier, and the problems of thin film thickness and small line width dimension of the abnormal area can be compensated.
When one of the inspection elements 222 detects that the photoresist thickness of a region of the substrate 100 to be baked corresponding to the inspection element is too thick, the line width of the abnormal region will be too large and the hole size will be too small without any processing. The detecting component 222 of the present embodiment sends the information of the thickness of the photoresist to the controller 300. The controller 300 receives the information of the excessive thickness of the photoresist, sets a first compensation parameter accordingly, and sends the first compensation parameter to the temperature adjustment assembly 221, wherein the information of the excessive thickness of the photoresist sets the first compensation parameter accordingly, for example, the temperature of other normal regions is increased, the abnormal region forms a relatively low temperature region, and the temperature adjustment assembly 221 of other regions starts to heat. By so setting, the line width dimension can be accurately compensated, thereby achieving an improvement in the overall line width dimension uniformity.
In other embodiments, when one of the detecting elements 222 detects that the photoresist thickness of a region of the substrate 100 to be baked is thinner, the detecting element 222 of the present embodiment sends the information that the photoresist thickness is thinner to the controller 300. The controller 300 receives the information that the thickness of the photoresist is too thin, sets a first compensation parameter correspondingly, and sends the first compensation parameter to the first heating element 231 on the heating plate 230, so as to increase the heating temperature of the first heating element 231 corresponding to the detecting element 222.
When one of the detecting elements 222 detects that the photoresist thickness of a certain region of the substrate 100 to be baked is thicker, the detecting element 222 of the present embodiment sends the information that the photoresist thickness is thicker to the controller 300. The controller 300 receives the information that the thickness of the photoresist is too thick, sets a first compensation parameter correspondingly, and sends the first compensation parameter to the first heating element 231 on the heating plate 230, so as to lower the heating temperature of the first heating element 231 corresponding to the detecting element 222.
By controlling the temperature adjustment member 221 of the cover plate 220 and the first heating member 231 of the heating plate 230 simultaneously, precise compensation for the local linewidth dimension can be further improved, thereby achieving an improved uniformity of the overall linewidth dimension.
FIG. 3a is a schematic diagram illustrating a first exemplary embodiment of a temperature adjustment assembly of a photoresist baking apparatus; fig. 3b is a schematic structural diagram of a temperature adjustment assembly in the photoresist baking apparatus according to the first embodiment. As shown in fig. 2, 3a and 3b, the temperature adjustment assembly 221 includes a second heating assembly and a baffle 2213 sequentially disposed, the baffle 2213 is disposed opposite to the substrate 100 to be baked, and the controller 300 controls the open and closed states of the second heating assembly and the baffle 2213.
In this embodiment, the second heating assembly comprises a resistance coil 2212, the temperature adjustment assembly 221 further comprises an air duct 2211 on a side away from the baffle 2213, and the controller 300 controls the opening and closing states of the air duct 2211.
In this embodiment, the resistance coil 2212 may be provided in a plurality of layers or in a grid pattern, and the controller 300 may control the heating temperature of the resistance coil 2212 to be 30 to 160 ℃.
As shown in fig. 2 and 3a, when the baffle 2213 and the resistance coil 2212 are both in the closed state, the temperature regulating assembly 221 does not regulate the temperature of the toasting cavity. As shown in fig. 2 and fig. 3b, when the baffle 2213 and the resistance coil 2212 are both in an open state, the temperature adjusting assembly 221 adjusts the temperatures of different positions of the toasting cavity according to the detection result of the detecting assembly 222.
FIG. 4a is a schematic view illustrating another structure of a temperature adjustment assembly in a photoresist baking apparatus according to an embodiment of the present disclosure; fig. 4b is a schematic view illustrating another structure of a temperature adjustment assembly in the photoresist baking apparatus according to the first embodiment. As shown in fig. 2, 4a and 4b, in the present embodiment, the second heating assembly includes an infrared lamp 2214, and the controller 300 controls the on and off states of the infrared lamp 2214.
In this embodiment, the infrared lamp 2214 is used to irradiate the substrate 100 to be baked to perform local temperature control, and the controller 300 is used to increase or decrease the temperature, wherein the heating temperature range is 30-160 ℃.
As shown in fig. 2 and 4a, when the baffle 2213 and the infrared lamp 2214 are both in the off state, the temperature regulating assembly 221' does not regulate the temperature of the toasting cavity. As shown in fig. 2 and 4b, when the baffle 2213 and the infrared lamp 2214 are both in the on state, the temperature adjusting assembly 221' adjusts the temperatures of different positions of the toasting cavity according to the detection result of the detecting assembly 222.
Compared with the prior art, the embodiment also has the following beneficial effects: the photoresist baking device disclosed by the embodiment can be used for locally adjusting the line width size of a product according to different conditions, so that the uniformity of the line width size of the product is improved; the problem that the local line width of the cutter starting part is larger or smaller in size during photoresist coating can be effectively solved, and the use flexibility of the photoresist baking device is improved.
Example two
Fig. 5 is a schematic perspective exploded view of the photoresist baking apparatus according to the second embodiment.
As shown in fig. 5, in this embodiment, sixteen temperature sensing assemblies 223 are further disposed on the cover plate 220, sixteen temperature sensing assemblies 223 are disposed in one-to-one correspondence with the plurality of temperature adjusting assemblies 221 and are used for detecting actual temperatures at different positions in the baking cavity, sixteen temperature sensing assemblies 223 are further electrically connected to the controller 300 respectively and send the actual temperatures to the controller 300, and the controller 300 correspondingly sets second compensation parameters according to the actual temperatures to adjust the heating temperatures of the temperature adjusting assemblies 221.
When the photoresist baking apparatus disclosed in this embodiment is used to bake the substrate 100 to be baked, for example, the substrate 100 to be baked enters the baking cavity from the entrance, and then the entrance is closed, so that the baking cavity forms a closed space, at this time, the substrate 100 to be baked is placed on the heating plate 230 in the baking cavity, and then the first heating element 231 is activated, so that the substrate 100 to be baked can be baked and heated; after heating for a period of time, the temperature sensing element 223 on the cover plate 220 detects actual temperatures of different positions on the substrate 100 to be baked and sends the actual temperatures to the controller 300, and the controller 300 correspondingly sets a second compensation parameter according to the actual temperatures to adjust the heating temperature of the temperature adjustment element 221.
Specifically, when one of the temperature sensing elements 223 detects that the actual temperature of a corresponding region of the substrate 100 to be baked is relatively low, the line width of the abnormal region will be relatively small and the hole size will be relatively large if no processing is performed. The temperature sensing component 223 of this embodiment sends the actual temperature lower information to the controller 300. The controller 300 receives the information that the actual temperature is lower, sets a second compensation parameter accordingly, and sends the second compensation parameter to the temperature adjustment component 221. The information of the actual temperature being lower is correspondingly set with a second compensation parameter, for example, the temperature of the abnormal region is increased, so that the temperature adjustment assembly 221 corresponding to the temperature sensing assembly 223 starts to heat. The temperature heating of the abnormal area can accurately compensate the line width dimension, so that the photoresist of the abnormal area is drier, the line width dimension is larger after the photoresist is drier, and the problems of lower actual temperature and smaller line width dimension of the abnormal area can be compensated.
When one of the temperature sensing elements 223 detects that the actual temperature of a corresponding region of the substrate 100 to be baked is higher, the line width of the abnormal region will be larger and the hole size will be smaller without any processing. The temperature sensing component 223 of this embodiment sends the actual temperature-over-high information to the controller 300. The controller 300 correspondingly sets a second compensation parameter after receiving the actual temperature-higher information, and sends the second compensation parameter to the temperature adjustment assembly 221, wherein the actual temperature-higher information correspondingly sets the second compensation parameter, for example, the temperature of other normal areas is increased, the abnormal area forms a relatively low temperature area, and the temperature adjustment assembly 221 of other areas starts to heat. Or, the actual higher temperature information is correspondingly set with a second compensation parameter, for example, to reduce the temperature of the abnormal region. By so doing, it is possible to accurately compensate for the local line width dimension, thereby achieving an improvement in the overall line width dimension uniformity.
In other embodiments, when one of the temperature sensing elements 223 detects that the photoresist thickness of a corresponding region of the substrate 100 to be baked is thinner, the temperature sensing element 223 of the present embodiment sends the information that the photoresist thickness is thinner to the controller 300. The controller 300 receives the information that the thickness of the photoresist is too thin, sets a first compensation parameter correspondingly, and sends the first compensation parameter to the first heating element 231 on the heating plate 230, so as to increase the heating temperature of the first heating element 231 corresponding to the temperature sensing element 223.
When one of the temperature sensing elements 223 detects that the photoresist thickness of a region of the substrate 100 to be baked is thicker, the temperature sensing element 223 of the present embodiment sends the photoresist thickness information to the controller 300. The controller 300 receives the information that the thickness of the photoresist is too thick, sets a first compensation parameter correspondingly, and sends the first compensation parameter to the first heating element 231 on the heating plate 230, so as to lower the heating temperature of the first heating element 231 corresponding to the temperature sensing element 223.
By controlling the temperature adjustment member 221 of the cover plate 220 and the first heating member 231 of the heating plate 230 simultaneously, precise compensation for the local linewidth dimension can be further improved, thereby achieving an improved uniformity of the overall linewidth dimension.
Compared with the prior art, the embodiment also has the following beneficial effects: the photoresist baking device disclosed by the embodiment can be used for locally adjusting the line width size of a product according to different conditions, so that the uniformity of the line width size of the product is improved; the problem that the local line width of the cutter starting part is larger or smaller in size during photoresist coating can be effectively solved, and the use flexibility of the photoresist baking device is improved.
EXAMPLE III
The photoresist baking device disclosed by the embodiment is provided with the detection assembly and the temperature sensing assembly on the cover plate simultaneously, so that the line width size of a product can be compensated better. The structure and the arrangement mode of the detection assembly are consistent with those of the detection assembly disclosed in the first embodiment, and the structure and the arrangement mode of the temperature sensing assembly are consistent with those of the temperature sensing assembly disclosed in the second embodiment, which are not described herein again.
Example four
The embodiment also discloses photoresist baking equipment which comprises the photoresist baking device and has the beneficial effects as described above.
The foregoing is a complete disclosure of the present invention, and in this specification, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, including other elements not expressly listed, in addition to those elements listed.
In the present specification, the terms of front, rear, upper, lower and the like are defined by the positions of the components in the drawings and the positions of the components relative to each other, and are only used for the sake of clarity and convenience in technical solution. It is to be understood that the use of the directional terms should not be taken to limit the scope of the claims.
The above description is only the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the principle of the present invention should be included within the protection scope of the present invention.
Claims (10)
1. A photoresistance baking device is used for baking a substrate to be baked coated with photoresistance, and comprises a baking cavity body formed by enclosing a bottom plate and a cover plate, and is characterized by also comprising a heating plate positioned on the bottom plate and a controller electrically connected with the heating plate, wherein the heating plate is used for placing the substrate to be baked;
the cover plate is provided with a plurality of temperature adjusting assemblies arranged in an array on one side opposite to the heating plate, the temperature adjusting assemblies are electrically connected with the controller respectively, and the heating temperature of each temperature adjusting assembly is adjusted by the controller respectively.
2. The photoresist baking apparatus according to claim 1, wherein a plurality of detecting elements are further disposed on the cover plate, the detecting elements and the temperature adjusting elements are disposed in a one-to-one correspondence manner and are used for detecting photoresist thicknesses at different positions on the substrate to be baked, the detecting elements are further electrically connected to the controller respectively and transmit the photoresist thicknesses to the controller, and the controller correspondingly sets a first compensation parameter according to the photoresist thicknesses to adjust the heating temperatures of the temperature adjusting elements.
3. The photoresist baking apparatus of claim 1, wherein the cover plate further has a plurality of temperature sensing assemblies, the plurality of temperature sensing assemblies and the plurality of temperature adjusting assemblies are disposed in a one-to-one correspondence for detecting actual temperatures at different positions in the baking cavity, the plurality of temperature sensing assemblies are further electrically connected to the controller respectively and transmit the actual temperatures to the controller, and the controller correspondingly sets a second compensation parameter according to the actual temperatures to adjust the heating temperatures of the temperature adjusting assemblies.
4. The photoresist baking apparatus of claim 1, wherein the heating plate is disposed on a side of the substrate to be baked away from the bottom plate, the first heating elements are arranged in a plurality of arrays, the first heating elements are electrically connected to the controller, and the controller is used to adjust the temperature of each first heating element to heat the substrate to be baked.
5. The photoresist baking apparatus of claim 4, wherein the number of the temperature adjustment elements on the cover plate is greater than the number of the first heating elements on the heater plate.
6. The photoresist baking apparatus of claim 1, wherein the temperature adjustment assembly comprises a second heating assembly and a baffle plate sequentially arranged, the baffle plate is arranged opposite to the substrate to be baked, and the controller controls the opening and closing states of the second heating assembly and the baffle plate.
7. The photoresist baking apparatus of claim 6, wherein the second heating element comprises a resistance coil, the temperature adjustment element further comprises an air duct on a side away from the baffle, and the controller controls an open and a close state of the air duct.
8. The photoresist baking apparatus of claim 6, wherein the second heating element comprises an infrared lamp.
9. The photoresist baking apparatus of claim 1, wherein the cover plate is provided with a thermal insulation assembly at least at a side away from the temperature adjustment assembly.
10. A photoresist baking apparatus, characterized in that the photoresist baking apparatus comprises: the resist baking apparatus according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022005611.9U CN213240806U (en) | 2020-09-14 | 2020-09-14 | Photoresist baking device and photoresist baking equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022005611.9U CN213240806U (en) | 2020-09-14 | 2020-09-14 | Photoresist baking device and photoresist baking equipment |
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| CN213240806U true CN213240806U (en) | 2021-05-18 |
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| CN202022005611.9U Active CN213240806U (en) | 2020-09-14 | 2020-09-14 | Photoresist baking device and photoresist baking equipment |
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