CN110787967A - Photoresist coating system and coating method - Google Patents
Photoresist coating system and coating method Download PDFInfo
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- CN110787967A CN110787967A CN201911098219.9A CN201911098219A CN110787967A CN 110787967 A CN110787967 A CN 110787967A CN 201911098219 A CN201911098219 A CN 201911098219A CN 110787967 A CN110787967 A CN 110787967A
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- photoresist
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- defoaming
- vacuumizing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1039—Recovery of excess liquid or other fluent material; Controlling means therefor
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Abstract
The invention relates to a photoresist coating system, comprising: a glue supply mechanism; the filtering mechanism is connected with the glue supply mechanism; the defoaming mechanism comprises a defoaming container, a vacuumizing device and a vacuumizing pipeline, the defoaming container is connected with the filtering mechanism, a containing cavity is arranged in the defoaming container, the defoaming container is connected with the vacuumizing device through the vacuumizing pipeline, and the vacuumizing pipeline extends into the containing cavity to be matched with the vacuumizing device to vacuumize and remove bubbles of the photoresist; and the scraping and coating mechanism is connected with the defoaming container. A photoresist coating method comprising the steps of: storing the photoresist in a photoresist supply mechanism; pressing the photoresist into a filtering mechanism by a photoresist supply mechanism to filter impurities in the photoresist; the photoresist flows into a defoaming container, and bubbles of the photoresist are removed through a vacuumizing device; the photoresist is conveyed to a blade coating mechanism to be uniformly coated. According to the photoresist coating system, the photoresist coating film layer is more uniform; the photoresist coating method avoids the influence of impurities and bubbles on the photoresist coating quality.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a photoresist coating system and a photoresist coating method.
Background
In the semiconductor manufacturing process, a photolithography process is required to be used many times, and the essence of the photolithography process is to copy a circuit structure in a pattern form onto a wafer to be etched and ion-implanted later, which mainly includes the following steps: firstly, a photoresist thin layer is formed on a wafer by using a photoresist coating system, then parallel light is irradiated on the photoresist thin layer through a mask plate to be exposed and deteriorated, and finally, a developing solution is used for developing to finish pattern transfer. However, when the photoresist is coated, the photoresist coating film layer is not uniform due to the fact that the photoresist contains impurities or bubbles, so that the thickness of the photoresist film layer is deviated or the film layer is scrapped, and the subsequent related processes are affected.
Disclosure of Invention
In view of the above, it is necessary to provide a photoresist coating system and a coating method for solving the problem of non-uniformity of a photoresist coating film.
A photoresist coating system, comprising:
a glue supply mechanism;
the filtering mechanism is connected with the glue supply mechanism;
the defoaming mechanism comprises a defoaming container, a vacuumizing device and a vacuumizing pipeline, wherein the defoaming container is connected with the filtering mechanism, a cavity is arranged in the defoaming container, the defoaming container is connected with the vacuumizing device through the vacuumizing pipeline, and the vacuumizing pipeline extends into the cavity so as to be matched with the vacuumizing device to vacuumize and remove bubbles of photoresist in the cavity; and
and the scraping and coating mechanism is connected with the defoaming container.
According to the photoresist coating system, the filtering mechanism is used for filtering impurities in the photoresist, and the defoaming mechanism is used for eliminating bubbles in the photoresist, so that the photoresist coating quality is better, and the photoresist coating film layer is more uniform.
In one embodiment, the glue supply mechanism comprises a gas supply device, a storage tank and a first pipeline, the storage tank is connected with the filtering mechanism through the first pipeline, and the gas supply device is connected with the storage tank, so that when the gas supply device supplies gas into the storage tank, the photoresist in the storage tank can be sequentially pressed into the first pipeline and the filtering mechanism.
In one embodiment, at least one of the following is included:
the electronic scale or retransmission sensor is arranged below the storage tank and used for monitoring the weight of the photoresist in real time;
the first pipeline is provided with a first valve for controlling the opening and closing of the first pipeline;
and a detection device is arranged on the first pipeline and used for detecting the flow of the photoresist.
In one embodiment, the filtering mechanism includes a body and a filter element, the filter element is disposed in the body, and the body is connected to the defoaming mechanism.
In one embodiment, the defoaming mechanism further includes a glue outlet pipeline, and a mechanical pump is disposed on the glue outlet pipeline to pump the photoresist in the defoaming container to the blade coating mechanism.
In one embodiment, the recovery device further comprises a recovery mechanism, wherein the recovery mechanism comprises a recovery groove, a bus bar and a recovery tank, the recovery groove is arranged below the scraping mechanism, the recovery groove is connected with the bus bar, and the bus bar is connected with the recovery tank, so that waste liquid on the scraping mechanism sequentially flows through the recovery groove and the bus bar to the recovery tank.
In one embodiment, the recovery tank and the bus plate are tapered along the axial direction.
In one embodiment, the cleaning device further comprises a cleaning pipeline, wherein the cleaning pipeline comprises two branches and is respectively connected with the scraping and coating mechanism and the bus board so as to be used for cleaning waste liquid residues.
In one embodiment, the filtering mechanism further includes a second pipeline, and one end of the second pipeline is connected to the filtering mechanism and the other end of the second pipeline is connected to the collecting plate, so as to discharge impurities stored in the filtering mechanism.
A photoresist coating method comprising the steps of:
storing the photoresist in a photoresist supply mechanism;
pressing the photoresist into a filtering mechanism by a photoresist supply mechanism to filter impurities in the photoresist;
the photoresist with impurities filtered flows into a defoaming container, and bubbles of the photoresist in the defoaming container are removed through a vacuumizing device;
the photoresist with the bubbles removed is conveyed to a blade coating mechanism to be uniformly coated on the semiconductor wafer.
According to the photoresist coating method, after the photoresist is filtered to remove impurities, the bubbles are removed in a vacuumizing mode, new impurities cannot be introduced, the impurities and the bubbles can be prevented from influencing the photoresist coating quality, and the photoresist coating film layer is more uniform.
Drawings
Fig. 1 is a schematic structural diagram of a photoresist coating system of the present embodiment.
Detailed Description
The photoresist coating system and coating method will be further described with reference to the drawings and the specific embodiments.
Referring to fig. 1, a photoresist coating system according to an embodiment includes a photoresist supplying mechanism 100, a filtering mechanism 200, a defoaming mechanism 300, a blade coating mechanism 400 and a recycling mechanism 500, wherein photoresist is stored in the photoresist supplying mechanism 100, sequentially conveyed to the filtering mechanism 200 to filter impurities and the defoaming mechanism 300 to remove bubbles, and then conveyed to the blade coating mechanism 400 to be uniformly coated on a wafer (not shown in the drawings) to be coated with photoresist.
Referring to fig. 1, the glue supplying mechanism 100 includes a gas supplying device (not shown), a storage tank 110 and a first pipeline 120, the gas supplying device is connected to the storage tank 110 and seals the connection, one end of the first pipeline 120 extends into the storage tank 110 and contacts the photoresist in the storage tank 110, the other end of the first pipeline 120 is connected to a filtering mechanism 200, when the gas supplying device fills the storage tank 110 with gas, the photoresist in the storage tank 110 is pressed out due to the increase of gas pressure, and the pressed photoresist flows to the filtering mechanism 200 through the first pipeline 120. Further, the gas supply device is provided with a pressure gauge, a pressure regulating valve and a pressure relief valve (not shown in the figure), the pressure gauge is used for monitoring the pressure value in real time, the pressure regulating valve is used for regulating the pressure during gas input, the pressure relief valve is convenient for pressure relief after the gluing is finished, and bubbles caused by gas dissolving in the photoresist due to long-time pressure supply are prevented. Specifically, the gas is clean compressed air or nitrogen. In order to accurately control the amount of the photoresist, the first pipeline 120 is further provided with a first valve 121 and a detection device 122, the first valve 121 is used for controlling the opening and closing of the first pipeline 120, and the detection device 122 is used for monitoring the flow rate of the photoresist in real time. Specifically, the first valve 121 is a mechanical valve, and the detection device 122 is a flow meter.
Furthermore, in the present embodiment, the glue supply mechanism 100 further includes an electronic scale 130 disposed below the storage tank 110, so as to monitor the weight of the photoresist in the storage tank 110 in real time, and the electronic scale 130 can set an alarm limit, so that when the photoresist is used to be close to the alarm limit, an alarm can be given to prompt, thereby facilitating the timely replacement of the photoresist. In other embodiments, the electronic scale 130 may be replaced with a load cell, and may monitor the weight of the photoresist in the storage tank 110 in real time.
Referring to fig. 1, the filtering mechanism 200 is connected to the glue supplying mechanism 100. Specifically, the filtering mechanism 200 includes a body and a filter element (not shown in the figure), the filter element is disposed in the body, one end of the first pipeline 120 in the photoresist supplying mechanism 100 extends into the storage tank 110, the other end of the first pipeline 120 is connected to the body, and the photoresist is conveyed from the photoresist supplying mechanism 100 to the filtering mechanism 200 through the first pipeline 120 to filter out impurities such as broken residues in the photoresist. In this embodiment, the filter precision of the filter element is 1.5 microns, that is, the filter element is provided with a plurality of filter holes with the aperture of 1.5 microns, and impurities with the size larger than 1.5 microns can be intercepted by the filter element, so as to avoid affecting the coating effect of the photoresist. In other embodiments, the filtering precision of the filter element can be more or less than 1.5 microns, and can be adjusted according to actual needs. In this embodiment, the filter element has a single-layer structure. In other embodiments, the filter element can also be of a multilayer laminated structure, so that the impurity filtering range is expanded, and the filtering precision is improved. In this embodiment, the filter element is made of polytetrafluoroethylene. In other embodiments, the filter element material may also be polypropylene or glass fiber.
Referring to fig. 1, the defoaming mechanism 300 is connected to the filtering mechanism 200. Specifically, the defoaming mechanism 300 includes a defoaming container 310, a vacuumizing device 320, a glue inlet pipe 330, a vacuumizing pipe 340 and a glue outlet pipe 350, the defoaming container 310 includes a tank body and a tank cover (not shown in the drawings), the tank body is provided with a cavity, the tank cover is provided with a first hole, a second hole and a third hole (not shown in the drawings), one end of the glue inlet pipe 330 is connected with the body of the filtering mechanism 200, the other end of the glue inlet pipe 330 extends into the cavity of the defoaming container 310 through the first hole, and the photoresist in the filtering mechanism 200 is conveyed to the cavity of the defoaming container 310 through the glue inlet pipe 330. The deaeration container 310 is connected with the vacuumizing device 320 through a vacuumizing pipeline 340, and the vacuumizing pipeline 340 is communicated with the containing cavity of the tank body through a second hole of the deaeration container 310 so as to cooperate with the vacuumizing device 320 to vacuumize the tank body to form a vacuum environment, so that bubbles in the photoresist are separated from the photoresist under the action of buoyancy and are discharged out of the deaeration container 310 through the vacuumizing device 320. Specifically, the vacuum-pumping device 320 is a vacuum pump.
Further, in the present embodiment, the glue inlet pipeline 330 is further provided with a second valve 331 and a third valve 332, so as to better control the opening and closing of the glue inlet pipeline 330. Specifically, the second valve 331 is a mechanical valve, the third valve 332 is a pneumatic valve, and when the glue scraping pipeline 330 needs to be opened, the third valve 332 is opened only after the second valve 331 needs to be manually opened, and a pressure signal is received; when the glue inlet pipeline 330 needs to be closed, the third valve 332 is gradually closed due to the fact that the pressure signal is weakened to be zero, and meanwhile the second valve 331 is manually closed, so that the situation that the glue inlet pipeline 330 is not completely closed due to the fact that the third valve 332 is not completely closed due to a fault is avoided. In other embodiments, the glue inlet pipe 330 may be provided with only the second valve 331 or the third valve 332, and the opening and closing of the glue inlet pipe 330 may also be controlled.
Referring to fig. 1, a blade coating mechanism 400 is connected to the defoaming mechanism 300. Specifically, one end of the glue outlet pipeline 350 of the defoaming mechanism 300 extends into the defoaming container 310 through the third hole, the other end of the glue outlet pipeline 350 is connected with the blade coating mechanism 400, and the glue outlet pipeline 350 is provided with a mechanical pump 351, so that when the gas supply device in the glue supply mechanism 100 supplies gas to press the photoresist in the storage tank 110 into the filtering mechanism 200 and the defoaming mechanism 300 in sequence, the mechanical pump 351 can accurately control the glue injection amount to pump the photoresist in the defoaming container 300 to the blade coating mechanism 400. In the present embodiment, the mechanical pump 351 is a servo pump. In other embodiments, the mechanical pump 351 may also be a stepper pump. In this embodiment, the coating mechanisms 400 are coating blades and are one in number. In other embodiments, the scraping mechanism 400 is a plurality of scrapers, and the plurality of scrapers are spaced and arranged side by side to improve the scraping efficiency and the scraping effect.
Referring to fig. 1, the recycling mechanism 500 includes a recycling tank 510, a flow-collecting plate 520 and a recycling tank 530, the recycling tank 510 is disposed below the blade coating mechanism 400, the recycling tank 510 is connected to the flow-collecting plate 520, and the flow-collecting plate 520 is connected to the recycling tank 530, so that the waste liquid on the blade coating mechanism 400 flows into the recycling tank 530. The recycling tank 510 and the flow collecting plate 520 are tapered along the axial direction, so that the waste liquid flows to the bottoms of the recycling tank 510 and the flow collecting plate 520.
In order to discharge the impurities stored in the filtering mechanism 200, the filtering mechanism 200 further includes a second pipe 210 disposed at the bottom of the body, a fourth valve 211 is disposed on the second pipe 210 to control the opening and closing of the second pipe 210, the other end of the second pipe 210 is connected to the bus plate 520 after being converged, and when the impurities in the filtering mechanism 200 are more, the second pipe 210 is opened to discharge the impurities to the bus plate 520.
Further, in order to exhaust the gas stored in the filtering mechanism 200, the filtering mechanism 200 further includes another second pipeline 210a disposed at the top of the body, a fourth valve 211a is disposed on the second pipeline 210a to control the opening and closing of the second pipeline 210a, the other end of the second pipeline 210a is connected to the confluence plate 520 after confluence, and when the gas in the filtering mechanism 200 is more, the second pipeline 210a is opened to exhaust the gas.
Furthermore, after the coating process is finished, the blade coating mechanism 400 and the bus board 520 are convenient to clean, a cleaning pipeline 600 is further provided, the cleaning pipeline 600 comprises a cleaning main path 610, a first cleaning branch path 620 and a second cleaning branch path 630, the cleaning main path 610 is connected with the first cleaning branch path 620 and the second cleaning branch path 630 through a tee joint (not shown in the figure), the number of the first cleaning branch paths 620 is two, the first cleaning branch paths are connected with two ends of the blade coating mechanism 400, the blade coating mechanism 400 is convenient to clean, and the second cleaning branch paths 630 are connected with the bus board 520. Further, a fifth valve 611 is disposed on the main cleaning path 610, a sixth valve 621 is disposed on the first cleaning branch 620, and a seventh valve 631 is disposed on the second cleaning branch 630, for controlling the opening and closing of the cleaning pipeline 600 and the amount of the cleaning liquid in the cleaning pipeline 600. Specifically, the fourth valve 611, the fifth valve 621, and the sixth valve 631 are mechanical valves or pneumatic valves.
According to the photoresist coating system, impurities in the photoresist are filtered through the filtering mechanism 200, and bubbles in the photoresist are eliminated through the defoaming mechanism 300, so that the photoresist coating quality is better, and a photoresist coating film layer is more uniform; valves are arranged on the pipelines so as to control the opening and closing of the pipelines and the dosage of the photoresist; be equipped with recovery mechanism 500, effectively to the recycle of waste liquid, avoid the wasting of resources, be favorable to the environmental protection.
The invention also provides a photoresist coating method, which comprises the following steps:
storing the photoresist in the photoresist supply mechanism 100;
the photoresist is pressed into the filtering mechanism 200 by the photoresist supplying mechanism to filter the impurities in the photoresist. Specifically, two ends of the first pipeline 120 are respectively connected with the storage tank 110 and the filtering mechanism 200, the gas supply device is connected with the storage tank 110 and makes the connection airtight, when gas is filled into the storage tank 110 through the gas supply device, photoresist is pressed out due to the increase of gas pressure in the storage tank 110, the pressed photoresist flows to the filtering mechanism 200 through the first pipeline 120, and a filter element of the filtering mechanism 200 filters impurities such as broken slag in the photoresist;
the photoresist with the impurities filtered flows into the deaeration container 300, and bubbles of the photoresist in the deaeration container 300 are removed by the vacuum extractor 320. Specifically, the photoresist in the filtering mechanism 200 is conveyed into the cavity of the deaeration container 310 through the photoresist inlet pipe 330, the deaeration container 310 is connected with the vacuum-pumping device 320 through the vacuum-pumping pipe 340, and the vacuum-pumping pipe 340 is communicated with the cavity of the tank body through the second hole of the deaeration container 310 to cooperate with the vacuum-pumping device 320 to vacuum the tank body, so as to form a vacuum environment, so that the bubbles in the photoresist are separated from the photoresist under the action of buoyancy and are discharged out of the deaeration container 310 through the vacuum-pumping device 320;
the photoresist from which the bubbles have been removed is conveyed to a blade coating mechanism and uniformly coated. Specifically, the photoresist in the deaeration container 310 is conveyed to the blade coating mechanism 400 through the photoresist outlet pipeline 350 by the aid of the mechanical pump 341, the blade coating mechanism 400 uniformly coats the photoresist on the wafer to be scraped, the waste liquid is recovered through the recovery mechanism 500 after the photoresist scraping is completed, and the blade coating mechanism 400 and the bus plate 520 are cleaned through the cleaning pipeline 600.
According to the photoresist coating method, after the photoresist is filtered to remove impurities, the bubbles are removed in a vacuumizing mode, new impurities cannot be introduced, the impurities and the bubbles can be prevented from influencing the photoresist coating quality, and the photoresist coating film layer is more uniform.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above examples only show some embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A photoresist coating system, comprising:
a glue supply mechanism;
the filtering mechanism is connected with the glue supply mechanism;
the defoaming mechanism comprises a defoaming container, a vacuumizing device and a vacuumizing pipeline, wherein the defoaming container is connected with the filtering mechanism, a cavity is arranged in the defoaming container, the defoaming container is connected with the vacuumizing device through the vacuumizing pipeline, and the vacuumizing pipeline extends into the cavity so as to be matched with the vacuumizing device to vacuumize and remove bubbles of photoresist in the cavity; and
and the scraping and coating mechanism is connected with the defoaming container.
2. The resist coating system according to claim 1, wherein the supply mechanism includes a gas supply device, a storage tank, and a first pipe, the storage tank and the filter mechanism are connected by the first pipe, and the gas supply device is connected to the storage tank so that the resist in the storage tank can be sequentially pushed into the first pipe and the filter mechanism when the gas supply device supplies gas into the storage tank.
3. The photoresist coating system of claim 2, comprising at least one of:
the electronic scale or retransmission sensor is arranged below the storage tank and used for monitoring the weight of the photoresist in real time;
the first pipeline is provided with a first valve for controlling the opening and closing of the first pipeline;
and a detection device is arranged on the first pipeline and used for detecting the flow of the photoresist.
4. The photoresist coating system of claim 1, wherein the filter mechanism comprises a body and a filter element, the filter element is disposed in the body, and the body is connected to the de-bubbling mechanism.
5. The photoresist coating system of claim 1, wherein the defoaming mechanism further comprises a photoresist outlet pipeline, and a mechanical pump is arranged on the photoresist outlet pipeline to pump the photoresist in the defoaming container to the blade coating mechanism.
6. The photoresist coating system of claim 1, further comprising a recycling mechanism, wherein the recycling mechanism comprises a recycling tank, a bus plate and a recycling tank, the recycling tank is disposed below the blade coating mechanism, the recycling tank is connected with the bus plate, and the bus plate is connected with the recycling tank, so that waste liquid on the blade coating mechanism sequentially flows through the recycling tank and the bus plate into the recycling tank.
7. The photoresist coating system of claim 6, wherein the recovery tank and the bus plate are tapered in an axial direction.
8. The photoresist coating system of claim 6, further comprising a cleaning pipeline, wherein the cleaning pipeline comprises two branches and is respectively connected with the blade coating mechanism and the bus plate for cleaning waste liquid residues.
9. The photoresist coating system of claim 7, wherein the filter mechanism further comprises a second pipe, one end of the second pipe is connected with the filter mechanism and the other end is connected with the bus plate to discharge impurities stored in the filter mechanism.
10. A photoresist coating method is characterized by comprising the following steps:
storing the photoresist in a photoresist supply mechanism;
pressing the photoresist into a filtering mechanism by a photoresist supply mechanism to filter impurities in the photoresist;
the photoresist with impurities filtered flows into a defoaming container, and bubbles of the photoresist in the defoaming container are removed through a vacuumizing device;
the photoresist with the bubbles removed is conveyed to a blade coating mechanism to be uniformly coated on the semiconductor wafer.
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| CN201911098219.9A CN110787967A (en) | 2019-11-12 | 2019-11-12 | Photoresist coating system and coating method |
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| CN111897187A (en) * | 2020-06-22 | 2020-11-06 | 中国科学院微电子研究所 | Photoresist coating system and method for replacing photoresist |
| CN112076959A (en) * | 2020-09-29 | 2020-12-15 | 广汽本田汽车有限公司 | Liquid supply system |
| CN112965336A (en) * | 2020-10-14 | 2021-06-15 | 深圳市路维光电股份有限公司 | Method and device for repairing mask defect |
| CN113093474A (en) * | 2021-03-31 | 2021-07-09 | 华虹半导体(无锡)有限公司 | Method and equipment for eliminating pipeline bubbles of photoresist coating equipment |
| CN113341654A (en) * | 2020-02-18 | 2021-09-03 | 长鑫存储技术有限公司 | Photoresist supply device |
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| CN113093474B (en) * | 2021-03-31 | 2024-04-23 | 华虹半导体(无锡)有限公司 | Method and equipment for eliminating pipeline bubbles of photoresist coating equipment |
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Application publication date: 20200214 |