CN110783236A - Method and system for controlling chamber offline - Google Patents
Method and system for controlling chamber offline Download PDFInfo
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- CN110783236A CN110783236A CN201911103566.6A CN201911103566A CN110783236A CN 110783236 A CN110783236 A CN 110783236A CN 201911103566 A CN201911103566 A CN 201911103566A CN 110783236 A CN110783236 A CN 110783236A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Abstract
The invention provides a chamber off-line control method and a system, wherein the chamber off-line control method comprises the following steps: when notification information that a chamber is in an abnormal process state is received, judging whether the chamber contains a wafer or not; if the judgment result is yes, sending a wafer transfer-out instruction to the chamber so as to try to control the chamber to transfer the wafer out of the chamber; judging whether the cavity contains the wafer again; and if the result of the secondary judgment is negative, sending an offline instruction to the chamber to control the chamber to be switched to an offline state. By the invention, the loss of the machine table is reduced.
Description
Technical Field
The invention relates to the field of semiconductor manufacturing, in particular to a method and a system for controlling a chamber offline.
Background
At present, in the semiconductor field, a factory automation system monitors the state Of equipment, in particular, each parameter index Of the equipment in a process, once a certain parameter index Of a certain chamber Of the equipment is Out Of Control (OOC), that is, when a certain parameter index exceeds a preset range, a person is required to stop the work Of the chamber, even if the chamber is offline, the effect Of human factors on the offline mode Of the chamber is large, the time for the person to offline the chamber from receiving a notification is often 1 to 4 hours, so that the person cannot offline the chamber in the first time, subsequent wafers can continuously enter the chamber to perform the process, and the wafer process may not reach the standard or even the wafers are scrapped.
Further, manually taking a chamber off-line may result in other chambers of the entire apparatus being temporarily unavailable, which is time-consuming and laborious and also affects the normal operation and yield of the machine.
Disclosure of Invention
The invention aims to at least solve one of the technical problems in the prior art and provides a chamber offline control method and a chamber offline control system.
To achieve the object of the present invention, there is provided an off-line chamber control method, comprising:
when notification information that a chamber is in an abnormal process state is received, judging whether the chamber contains a wafer or not;
if the judgment result is yes, sending a wafer transfer-out instruction to the chamber so as to try to control the chamber to transfer the wafer out of the chamber;
judging whether the cavity contains the wafer again;
and if the result of the secondary judgment is negative, sending an offline instruction to the chamber to control the chamber to be switched to an offline state.
Preferably, after the step of controlling the chamber to go to the offline state, the method further includes:
judging whether wafers to be processed which belong to the same batch with the wafers in the chamber exist in the current process task;
if the judgment result is yes, scheduling other wafers to be processed to enter the online chamber for processing so as to complete the current process task.
Preferably, after the step of controlling the chamber to go to the offline state, the method further includes:
and sending the fault maintenance information and/or the alarm information to the specified terminal.
Preferably, after the step of receiving the notification that the chamber is in the abnormal process state and before the step of determining whether the chamber contains the wafer, the method further includes: re-acquiring a new material conveying path to complete the process task corresponding to the wafer; after the step of attempting to control the chamber to transfer the wafer out of the chamber and before the step of judging whether the chamber contains the wafer again, the method further comprises the following steps: and conveying the wafer according to the acquired new material conveying path capable of completing the process task of the wafer.
Preferably, said controlling said chamber to go off-line comprises:
controlling the chamber to stop the current process; and controlling the chamber or other equipment which is out of the chamber and is in an online state to refuse to receive the information sent by the chamber in an abnormal process state within a preset time period.
Preferably, the information for notifying the abnormal process state includes:
at least one power value, pressure value and process gas flow value which are out of the preset index range.
Preferably, after the step of controlling the chamber to go to the offline state, the method further includes:
judging whether the wafer is not taken out of the box in the wafer transfer box loaded with the wafer before the wafer enters the chamber;
if the judgment result is yes, stopping picking up the chip from the wafer transfer box.
Preferably, after the step of determining whether the chamber contains a wafer,
if the judgment result is negative, an offline instruction is directly sent to the chamber to control the chamber to be switched to an offline state.
A chamber offline control system, comprising: the device comprises a state judgment module and an off-line control module;
the state judgment module is used for judging whether a chamber contains a wafer or not when receiving notification information that the chamber is in an abnormal process state; if the judgment result is yes, sending a wafer outgoing instruction to the offline control module;
the state judgment module is also used for judging whether the cavity contains the wafer again; if the cavity does not contain the wafer, sending an offline command to the offline control device;
the off-line control module is used for attempting to control the chamber to transfer the wafer out of the chamber when receiving the wafer transfer-out instruction; and controlling the chamber to be switched to an off-line state when the off-line instruction is received.
Preferably, the method further comprises the following steps:
and the alarm module is used for sending fault maintenance and/or alarm information to a specified terminal after the chamber is converted into an offline state.
The invention has the following beneficial effects:
according to the technical scheme of the chamber offline control method and system, when notification information that a chamber is in an abnormal process state is received, whether the chamber contains a wafer is judged; if yes, sending a wafer transfer-out instruction to the chamber to try to control the chamber to transfer the wafer out of the chamber; judging whether the cavity contains the wafer again; if the result of the second judgment is negative, an offline instruction is sent to the chamber to control the chamber to be switched to an offline state. Therefore, after the OOC of the process is met, the equipment can automatically receive the command, identify whether the chamber has wafers which are not discharged, if yes, the wafers are not discharged, and simultaneously wait for the wafers with the OOC problem to be discharged from the chamber and then immediately go off-line from the chamber, so that the current operation work does not need to be stopped manually by personnel, more importantly, the condition that the process quality of the subsequent wafers is influenced and even the subsequent wafers are scrapped due to the fact that the subsequent wafers can not enter the OOC chamber again can be ensured, the loss of a machine table is reduced, and the yield of the machine table is improved.
Drawings
Fig. 1 is a flow chart of a chamber off-line control method according to an embodiment of the present invention;
fig. 2 is a flow chart of a chamber off-line control method according to a second embodiment of the present invention;
fig. 3 is a flow chart of a chamber off-line control method according to a third embodiment of the present invention;
fig. 4 is a flowchart illustrating a chamber off-line control method according to a fourth embodiment of the present invention;
fig. 5 is a flowchart illustrating a chamber off-line control method according to a fifth embodiment of the present invention;
fig. 6 is a schematic structural diagram of an off-line chamber control system according to a sixth embodiment of the present invention;
fig. 7 is a schematic structural diagram of a chamber offline control system according to a seventh embodiment of the present invention.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the chamber off-line control method and system provided by the present invention are described in detail below with reference to the accompanying drawings.
Example one
As shown in fig. 1, which is a flow chart of a chamber offline control method according to a first embodiment of the present invention, the chamber offline control method according to the first embodiment of the present invention includes:
step 101: when notification information that a chamber is in an abnormal process state is received, judging whether the chamber contains a wafer or not; if yes, go to step 102.
Specifically, the notification information of the abnormal process state includes: at least one power value, pressure value and process gas flow value which are out of the preset index range.
Further, the preset index range is different parameter index range values set for different parameter indexes, and the different parameter index range values are determined by different process requirements and different machine models.
Step 102: a wafer transfer-out command is sent to the chamber to attempt to control the chamber to transfer the wafer out of the chamber.
Step 103: judging whether the cavity contains the wafer again; if not, go to step 104.
Step 104: and sending an off-line instruction to the chamber to control the chamber to be switched to an off-line state.
Specifically, controlling the chamber to transition to an offline state includes: controlling the chamber to stop the current process; and controlling the chamber or other equipment out of the chamber in an on-line state to refuse to receive the information sent by the chamber in an abnormal process state within a preset time period.
Specifically, the preset time may be determined by process requirements.
According to the chamber offline control method provided by the embodiment of the invention, when notification information that a chamber is in an abnormal process state is received, whether the chamber contains a wafer is judged; if yes, sending a wafer transfer-out instruction to the chamber to try to control the chamber to transfer the wafer out of the chamber; judging whether the cavity contains the wafer again; if the result of the second judgment is negative, an offline instruction is sent to the chamber to control the chamber to be switched to an offline state. Therefore, after the OOC of the process is met, the equipment can automatically receive the command, identify whether the chamber has wafers which are not discharged, if yes, the wafers are not discharged, and simultaneously wait for the wafers with the OOC problem to be discharged from the chamber and then immediately go off-line from the chamber, so that the current operation work does not need to be stopped manually by personnel, more importantly, the condition that the process quality of the subsequent wafers is influenced and even the subsequent wafers are scrapped due to the fact that the subsequent wafers can not enter the OOC chamber again can be ensured, the loss of a machine table is reduced, and the yield of the machine table is improved.
Example two
As shown in fig. 2, which is a flow chart of a chamber offline control method according to a second embodiment of the present invention, the chamber offline control method according to the second embodiment of the present invention includes:
step 201: when notification information that a chamber is in an abnormal process state is received, judging whether the chamber contains a wafer or not; if yes, go to step 202; if not, go to step 204.
Step 202: a wafer transfer-out command is sent to the chamber to attempt to control the chamber to transfer the wafer out of the chamber.
Step 203: judging whether the cavity contains the wafer again; if not, go to step 204.
Step 204: and sending an off-line instruction to the chamber to control the chamber to be switched to an off-line state.
Step 205: judging whether wafers to be processed which belong to the same batch with the wafers in the chamber exist in the current process task; if yes, go to step 206.
Step 206: and scheduling the wafer to be processed to enter the online chamber for processing, and finishing the current process task.
In the chamber offline control method provided by the second embodiment of the present invention, for a wafer that is not taken out of the wafer box, the wafer box is not taken out, and for a wafer to be processed in the same batch in the same chamber that is taken out of the wafer box, the wafer to be processed is controlled to enter the chamber in the previous state, so as to perform a process on the wafer to be processed. On one hand, the chamber can be designated offline in time, the situation that the wafer which is discharged enters the problematic chamber again is avoided, the wafer which is discharged is processed by the online chamber until the operator on duty comes to the equipment end to inspect the problematic chamber, and the loss of the machine is reduced; on the other hand, guarantee the board can not make whole board stop work because of the cavity that has the problem, influence board output.
EXAMPLE III
As shown in fig. 3, which is a flow chart of a chamber offline control method provided in a third embodiment of the present invention, the chamber offline control method in the third embodiment of the present invention includes:
step 301: when notification information that a chamber is in an abnormal process state is received, judging whether the chamber contains a wafer or not; if yes, go to step 302; if not, go to step 304.
Step 302: a wafer transfer-out command is sent to the chamber to attempt to control the chamber to transfer the wafer out of the chamber.
Step 303: judging whether the cavity contains the wafer again; if not, go to step 304.
Step 304: and sending an off-line instruction to the chamber to control the chamber to be switched to an off-line state.
Step 305: and sending the fault maintenance information and/or the alarm information to the specified terminal.
Specifically, the designated terminal may be a terminal of a maintenance worker, and fault repair information and/or alarm information is sent to the designated terminal, so that the maintenance worker can obtain information in time.
The chamber offline control method provided by the third embodiment of the invention further sends out notification information and/or alarm indicating the inspection of the designated chamber after controlling the designated chamber to be offline, so as to effectively prompt an operator to overhaul the designated chamber, and further improve the working efficiency of the machine.
Example four
As shown in fig. 4, a flow chart of a chamber offline control method according to a fourth embodiment of the present invention is provided, in the fourth embodiment of the present invention, the chamber offline control method includes:
step 401: a notification that the chamber is in an abnormal process state is received.
Step 402: and re-acquiring a new material transmission path to complete the corresponding process task of the wafer.
Step 403: judging whether the chamber contains a wafer or not; if yes, go to step 404; if not, go to step 407.
Step 404: a wafer transfer-out command is sent to the chamber to attempt to control the chamber to transfer the wafer out of the chamber.
Step 405: the wafers are transported according to the new material transport path that has been acquired to be able to complete the processing tasks of the wafers.
Step 406: judging whether the cavity contains the wafer again; if not, go to step 407.
Step 407: and sending an off-line instruction to the chamber to control the chamber to be switched to an off-line state.
According to the chamber offline control method provided by the fourth embodiment of the invention, when the chamber offline instruction is received, the new material transmission path is recalculated, and the corresponding process task of the wafer is completed according to the new material transmission path, so that the machine can continue to enable the chambers outside the specified chamber to participate in work when the specified chamber is about to be offline, and the work efficiency of the machine is ensured.
EXAMPLE five
As shown in fig. 5, a flow chart of a chamber offline control method according to a fifth embodiment of the present invention is provided, in the fifth embodiment of the present invention, the chamber offline control method includes:
step 501: when notification information that a chamber is in an abnormal process state is received, judging whether the chamber contains a wafer or not; if yes, go to step 502.
Step 502: a wafer transfer-out command is sent to the chamber to attempt to control the chamber to transfer the wafer out of the chamber.
Step 503: judging whether the cavity contains the wafer again; if not, go to step 504.
Step 504: and sending an off-line instruction to the chamber to control the chamber to be switched to an off-line state.
Step 505: judging whether the wafer is not taken out of the box in the wafer transmission box loaded with the wafer before the wafer enters the chamber; if yes, go to step 506.
Step 506: the pick-up of the chip from the foup is stopped.
In the chamber offline control method provided by the fifth embodiment of the present invention, after the control chamber is switched to the offline state, whether the wafer in the wafer transfer box loaded with the wafer has a non-out-of-box wafer is determined before the wafer enters the chamber, and if so, the wafer is stopped being picked up from the wafer transfer box. Through this embodiment, the security of wafer transmission in the cassette transport box has been improved.
EXAMPLE six
As shown in fig. 6, which is a schematic structural diagram of a chamber offline control system according to a sixth embodiment of the present invention, in the sixth embodiment of the present invention, the chamber offline control system includes: a state judgment module 1 and an off-line control device 2.
The state judgment module 1 is used for judging whether the chamber contains the wafer or not when receiving the notification information that the chamber is in the abnormal process state; if the judgment result is yes, sending a wafer outgoing instruction to the offline control module;
the state judgment module 1 is also used for judging whether the cavity contains the wafer again; if the cavity does not contain the wafer, sending an offline command to an offline control device;
the off-line control module 2 is used for trying to control the chamber to transfer the wafer out of the chamber when receiving the wafer transfer-out command; when an off-line command is received, the control chamber is switched to an off-line state.
According to the chamber offline control system provided by the sixth embodiment of the invention, after OOC of the process is encountered, the device can automatically receive the command, identify whether the chamber has wafers which are not discharged, and if yes, the wafers are not discharged, and simultaneously wait for the wafers with OOC problems to be discharged from the chamber and then immediately take the chamber offline, so that the current operation work does not need to be stopped manually by personnel, and more importantly, the condition that the process quality of the subsequent wafers is influenced or even scrapped when the subsequent wafers are prevented from entering the OOC chamber again can be ensured, the loss of a machine table is reduced, and the yield of the machine table is improved.
EXAMPLE seven
As shown in fig. 7, which is a schematic structural diagram of a chamber offline control system according to a seventh embodiment of the present invention, which is equivalent to the embodiment shown in fig. 6, in the seventh embodiment, the chamber offline control system further includes: an alarm module 3.
The alarm module 3 is used for sending fault maintenance and/or alarm information to a specified terminal after the chamber is converted into an offline state.
In the chamber offline control system provided by the seventh embodiment of the invention, the alarm module sends out the notification information and/or alarm for checking the designated chamber after controlling the designated chamber to be offline, so as to effectively prompt the operator to overhaul the designated chamber, thereby further improving the working efficiency of the machine.
In summary, according to the chamber offline control method and system provided by the embodiments of the present invention, after a process OOC occurs, a device can automatically receive a command, perform scheduling calculation again, identify whether there are any wafers that have not been processed at a device end, if there are any wafers that have not been processed, and wait for a wafer that has an OOC problem to be transferred from the chamber and then immediately take off-line the chamber, for a wafer that has been processed, the device end is used to complete the process by using other chambers, and finally returns to a wafer box, and a person on duty comes to the device end to check the chamber that has a problem, and does not need to manually terminate the currently running work, and what is more important is to ensure that the process quality of the subsequent wafer is affected even scrapped when the subsequent wafer is not entered.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (10)
1. A method for off-line chamber control, the method comprising:
when notification information that a chamber is in an abnormal process state is received, judging whether the chamber contains a wafer or not;
if the judgment result is yes, sending a wafer transfer-out instruction to the chamber so as to try to control the chamber to transfer the wafer out of the chamber;
judging whether the cavity contains the wafer again;
and if the result of the secondary judgment is negative, sending an offline instruction to the chamber to control the chamber to be switched to an offline state.
2. The method of claim 1, further comprising, after the step of controlling the chamber to go off-line:
judging whether wafers to be processed which belong to the same batch with the wafers in the chamber exist in the current process task;
if the judgment result is yes, scheduling other wafers to be processed to enter the online chamber for processing so as to complete the current process task.
3. The method of claim 1, further comprising, after the step of controlling the chamber to go off-line:
and sending the fault maintenance information and/or the alarm information to the specified terminal.
4. The chamber off-line control method of claim 1,
after the step of receiving the notification message that the chamber is in the abnormal process state and before the step of judging whether the chamber contains the wafer, the method further comprises the following steps: re-acquiring a new material conveying path to complete the process task corresponding to the wafer; and
after the step of attempting to control the chamber to transfer the wafer out of the chamber and before the step of determining whether the chamber contains the wafer again, the method further comprises: and conveying the wafer according to the acquired new material conveying path capable of completing the process task of the wafer.
5. The method of claim 1, wherein controlling the chamber to go offline comprises:
controlling the chamber to stop the current process; and controlling the chamber or other equipment which is out of the chamber and is in an online state to refuse to receive the information sent by the chamber in an abnormal process state within a preset time period.
6. The chamber offline control method of claim 1, wherein the notification of the abnormal process state comprises:
at least one power value, pressure value and process gas flow value which are out of the preset index range.
7. The method of claim 1, further comprising, after the step of controlling the chamber to go off-line:
judging whether the wafer is not taken out of the box in the wafer transfer box loaded with the wafer before the wafer enters the chamber;
if the judgment result is yes, stopping picking up the chip from the wafer transfer box.
8. The method of claim 1, wherein after the step of determining whether the chamber contains a wafer,
if the judgment result is negative, an offline instruction is directly sent to the chamber to control the chamber to be switched to an offline state.
9. An off-line chamber control system, comprising: the device comprises a state judgment module and an off-line control module;
the state judgment module is used for judging whether a chamber contains a wafer or not when receiving notification information that the chamber is in an abnormal process state; if the judgment result is yes, sending a wafer outgoing instruction to the offline control module;
the state judgment module is also used for judging whether the cavity contains the wafer again; if the cavity does not contain the wafer, sending an offline command to the offline control device;
the off-line control module is used for attempting to control the chamber to transfer the wafer out of the chamber when receiving the wafer transfer-out instruction; and controlling the chamber to be switched to an off-line state when the off-line instruction is received.
10. The chamber offline control system of claim 9, further comprising:
and the alarm module is used for sending fault maintenance and/or alarm information to a specified terminal after the chamber is converted into an offline state.
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| CN112484922A (en) * | 2020-11-13 | 2021-03-12 | 北京北方华创微电子装备有限公司 | Process chamber leakage rate detection method and semiconductor process equipment |
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