CN104134620A - Monitoring method for semiconductor manufacturing process and semiconductor producing method - Google Patents
Monitoring method for semiconductor manufacturing process and semiconductor producing method Download PDFInfo
- Publication number
- CN104134620A CN104134620A CN201410390822.5A CN201410390822A CN104134620A CN 104134620 A CN104134620 A CN 104134620A CN 201410390822 A CN201410390822 A CN 201410390822A CN 104134620 A CN104134620 A CN 104134620A
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- Prior art keywords
- supervising
- key equipment
- semiconductor fabrication
- measurement
- product
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
Abstract
The invention discloses a monitoring method for the semiconductor manufacturing process. The monitoring method for the semiconductor manufacturing process comprises the steps that a matching relation is defined between a key device and a measuring device; for a definition spot check mode of the key device, the spot check mode is related to idle time or continuous operation batches of the key device; according to the definition spot check mode, products are measured on the matched measuring device, and if the measurement result indicates failure, the key device is set in a non-operation state. According to the spot check mode of the monitoring method for the semiconductor manufacturing process, arrangement can be carried out flexibly according to actual situations, the operation state of the key device can be fed back in time and controlled by means of the measurement results of corresponding measuring stations, and maximization of the yield and the efficiency of the key device can be achieved. The invention further discloses a method for producing semiconductors according to the monitoring method for the semiconductor manufacturing process.
Description
Technical field
The present invention relates to technical field of semiconductors, particularly relate to a kind of method for supervising and semiconductor production method of semiconductor fabrication.
Background technology
Semiconductor chip integrated level is more and more higher at present, and chip production process period is more and more longer, and therefore the monitoring for critical process process equipment in the technological process of production seems particularly important.If can find timely certain batch of (lot) product quality problem of operation on critical process process equipment at follow-up measurement website, and stop in time monitored key equipment continuation operation, so just can retrieve unnecessary loss.
If measured but each product through key equipment processing carries out follow-up measurement website, so can extend the production cycle of product, reduce the shipment efficiency of factory.Therefore how between raising product yield and raising factory shipment efficiency, averaging out to the production manager of factory is a very large challenge.
Summary of the invention
The object of the invention is to, a kind of method for supervising and semiconductor production method of semiconductor fabrication is provided, to solve the too small problem of method for supervising mobility of semiconductor fabrication.
For solving the problems of the technologies described above, the invention provides a kind of method for supervising of semiconductor fabrication, comprising:
Matching relationship between definition key equipment and measurement equipment;
For key equipment definition sampling observation mode, free time of described sampling observation mode and key equipment or work continuously batch relevant;
According to the sampling observation mode of definition, product is measured on the measurement equipment of coupling, if measurement is unsuccessfully, be set to can not job state for described key equipment.
Optionally, for the method for supervising of described semiconductor fabrication, described sampling observation mode comprises:
If the free time of described key equipment exceeds the scheduled time, firstling is inspected by random samples.
Optionally, for the method for supervising of described semiconductor fabrication, the described scheduled time is for being more than or equal to 20 minutes.
Optionally, for the method for supervising of described semiconductor fabrication, described sampling observation mode comprises:
If working continuously, described key equipment batch meets or exceeds setting quantity, to inspecting by random samples in setting number integer product doubly.
Optionally, for the method for supervising of described semiconductor fabrication, described setting quantity is more than or equal to 5.
Optionally, for the method for supervising of described semiconductor fabrication, when inspecting by random samples, follow-up batch products normal operation.
Optionally, for the method for supervising of described semiconductor fabrication, if measurement is unsuccessfully, be set to can not job state for described key equipment, and the follow-up product through operation is added to inspection.
Accordingly, the present invention also provides a kind of semiconductor production method, comprises and utilizes the method for supervising of described semiconductor fabrication to carry out the processing of product.
Compared with prior art, in the method for supervising of semiconductor fabrication provided by the invention and semiconductor production method, the matching relationship between definition key equipment and measurement equipment; For key equipment definition sampling observation mode, free time of described sampling observation mode and key equipment or work continuously batch relevant; According to the sampling observation mode of definition, product is measured on the measurement equipment of coupling, if measurement is unsuccessfully, be set to can not job state for described key equipment.Compared to existing technology, sampling observation mode can be according to actual conditions flexible configuration, can job state by the timely FEEDBACK CONTROL key equipment of corresponding amount survey station point measurement, can realize the maximization of key equipment yield and efficiency.
Accompanying drawing explanation
Fig. 1 is the flow chart of the method for supervising of semiconductor fabrication of the present invention;
Fig. 2 be in the embodiment of the present invention according to the method for supervising of semiconductor fabrication the processing process chart to product.
Embodiment
Below in conjunction with schematic diagram, the method for supervising of semiconductor fabrication of the present invention and semiconductor production method are described in more detail, the preferred embodiments of the present invention have wherein been represented, should be appreciated that those skilled in the art can revise the present invention described here, and still realize advantageous effects of the present invention.Therefore, following description is appreciated that extensively knowing for those skilled in the art, and not as limitation of the present invention.
For clear, whole features of practical embodiments are not described.They in the following description, are not described in detail known function and structure, because can make the present invention chaotic due to unnecessary details.Will be understood that in the exploitation of any practical embodiments, must make a large amount of implementation details to realize developer's specific objective, for example, according to the restriction of relevant system or relevant business, by an embodiment, change into another embodiment.In addition, will be understood that this development may be complicated and time-consuming, but be only routine work to those skilled in the art.
In the following passage, with reference to accompanying drawing, with way of example, the present invention is more specifically described.According to the following describes and claims, advantages and features of the invention will be clearer.It should be noted that, accompanying drawing all adopts very the form of simplifying and all uses non-ratio accurately, only in order to convenient, the object of the aid illustration embodiment of the present invention lucidly.
Core concept of the present invention is, a kind of method for supervising of semiconductor fabrication is provided, and comprising: step S101: the matching relationship between definition key equipment and measurement equipment; Step S102: for key equipment definition sampling observation mode, free time of described sampling observation mode and key equipment or work continuously batch relevant; Step S103: according to the sampling observation mode of definition, product is measured on the measurement equipment of coupling, if measurement is unsuccessfully, be set to can not job state for described key equipment.
Below enumerate the method for supervising of described semiconductor fabrication and the preferred embodiment of semiconductor production method, to clearly demonstrate content of the present invention, will be clear that, content of the present invention is not restricted to following examples, and other improvement by those of ordinary skills' routine techniques means are also within thought range of the present invention.
Please refer to Fig. 1, the method for supervising of embodiment of the present invention semiconductor fabrication comprises:
Step S101: the matching relationship between definition key equipment and measurement equipment.Conventionally, key equipment comprises the equipment that in processing procedure process, committed step is produced, such as mask aligner, etching machine etc.; Measurement equipment is the equipment of after a certain or some step, the structure of rete, parameter etc. being tested in the course of processing for product.According to the manufacturing technique requirent of each key equipment, mate with measurement equipment, and be recorded in MES system.
Then, carry out step S102: for key equipment definition sampling observation mode, free time of described sampling observation mode and key equipment or work continuously batch relevant.
Preferably, described sampling observation mode can be: set according to (idle) time free time of key equipment, if the free time of described key equipment exceeds the scheduled time, firstling is inspected by random samples.The described scheduled time should be set flexibly according to physical device state, different website process requirements etc., and conventionally, the scheduled time can be more than 20 minutes, such as half an hour, 1 hour etc.
In addition, such as in the situations such as production line pressure is large, key equipment can be in continuous operation state, and this situation can be set sampling observation according to the product batches of continuous operation.If working continuously, described key equipment batch meets or exceeds setting quantity, to inspecting by random samples in setting number integer product doubly.Described setting quantity can be to be for example more than or equal to 5, such as every 5 batches, 6 batches, 10 batches etc., inspects by random samples.The setting of this quantity also needs to consider the actual state of key equipment, if for example for the key equipment of poor-performing, can be every 3 batches and carry out single sampling inspection, excessive to avoid losing.
In this step, in order to enhance productivity, when inspecting by random samples, follow-up batch products normal operation.
Then, carry out step S103: according to the sampling observation mode of definition, product is measured on the measurement equipment of coupling, if measurement is unsuccessfully, be set to can not job state for described key equipment.And the subsequent job product that this need be inspected by random samples to product measures, and processes according to actual measurement situation.
At measurement, be failed in the situation that, also need to notify person skilled, carry out in time troubleshooting processing.
Method for supervising according to above-mentioned semiconductor fabrication provided by the invention, when actual production, can carry out according to flow process as shown in Figure 2.Specific as follows:
When product arrives key equipment, first judge that can described key equipment operation.If for example measurement failure when product is inspected by random samples before, described key equipment can not operation, needs to make separate arrangements to arriving the product of described key equipment, can be to wait for, or select other key equipments to carry out operation.
If described key equipment can carry out operation, further judge whether to meet sampling observation condition.For example whether described key equipment is idle surpasses setting-up time, or whether described product just in time reaches sampling observation order.After carrying out this judgement, if do not need, do not inspect by random samples, directly carry out operation; If desired inspect by random samples, the key equipment measurement parameters of this product (key tool lot flag) is set, make this product after operation, inlet survey station point.
When described product arrives after measurement equipment, first confirm key equipment measurement parameters, if occur, key equipment measurement parameters do not mate and adjusts in time.After confirmation, this product is measured, and judge measurement in time, if measurement is normal, lets pass and carry out subsequent job; If measurement is unsuccessfully, be set to can not job state for described key equipment, also needs to notify person skilled, carries out in time troubleshooting processing.Need Related product to process simultaneously.
Obviously, those skilled in the art can carry out various changes and modification and not depart from the spirit and scope of the present invention the present invention.Like this, if within of the present invention these are revised and modification belongs to the scope of the claims in the present invention and equivalent technologies thereof, the present invention is also intended to comprise these changes and modification interior.
Claims (8)
1. a method for supervising for semiconductor fabrication, comprising:
Matching relationship between definition key equipment and measurement equipment;
For key equipment definition sampling observation mode, free time of described sampling observation mode and key equipment or work continuously batch relevant;
According to the sampling observation mode of definition, product is measured on the measurement equipment of coupling, if measurement is unsuccessfully, be set to can not job state for described key equipment.
2. the method for supervising of semiconductor fabrication as claimed in claim 1, is characterized in that, described sampling observation mode comprises:
If the free time of described key equipment exceeds the scheduled time, firstling is inspected by random samples.
3. the method for supervising of semiconductor fabrication as claimed in claim 2, is characterized in that, the described scheduled time is for being more than or equal to 20 minutes.
4. the method for supervising of semiconductor fabrication as claimed in claim 1, is characterized in that, described sampling observation mode comprises:
If working continuously, described key equipment batch meets or exceeds setting quantity, to inspecting by random samples in setting number integer product doubly.
5. the method for supervising of semiconductor fabrication as claimed in claim 4, is characterized in that, described setting quantity is more than or equal to 5.
6. the method for supervising of the semiconductor fabrication as described in claim 3 or 5, is characterized in that, when inspecting by random samples, and follow-up batch products normal operation.
7. the method for supervising of semiconductor fabrication as claimed in claim 6, is characterized in that, if measurement is unsuccessfully, be set to can not job state for described key equipment, and the follow-up product through operation is added to inspection.
8. a semiconductor production method, comprises and utilizes the method for supervising of the semiconductor fabrication as described in any one in claim 1～7 to carry out the processing of product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201410390822.5A CN104134620B (en) | 2014-08-08 | 2014-08-08 | The monitoring method and semiconductor manufacturing process of semiconductor fabrication |
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| CN201410390822.5A CN104134620B (en) | 2014-08-08 | 2014-08-08 | The monitoring method and semiconductor manufacturing process of semiconductor fabrication |
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| CN104134620A true CN104134620A (en) | 2014-11-05 |
| CN104134620B CN104134620B (en) | 2017-07-28 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107015532A (en) * | 2017-02-23 | 2017-08-04 | 惠科股份有限公司 | Display panel online quality control method and device |
| CN109283899A (en) * | 2018-09-17 | 2019-01-29 | 沈机（上海）智能系统研发设计有限公司 | Workpiece quality detecting method and its device, medium, digital control system and quality inspection system |
| WO2022041955A1 (en) * | 2020-08-28 | 2022-03-03 | 长鑫存储技术有限公司 | Detection method and apparatus for wafer production process, and electronic device |
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| JPH11163065A (en) * | 1997-12-01 | 1999-06-18 | Seiko Epson Corp | Semiconductor device |
| CN102709206A (en) * | 2012-01-12 | 2012-10-03 | 上海华力微电子有限公司 | Automatic defect scanning and casual inspecting method and automatic defect scanning and casual inspecting device for controlling abnormality during silicon wafer production |
| CN103367103A (en) * | 2012-03-28 | 2013-10-23 | 无锡华润上华科技有限公司 | Semiconductor product production method and system thereof |
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2014
- 2014-08-08 CN CN201410390822.5A patent/CN104134620B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11163065A (en) * | 1997-12-01 | 1999-06-18 | Seiko Epson Corp | Semiconductor device |
| CN102709206A (en) * | 2012-01-12 | 2012-10-03 | 上海华力微电子有限公司 | Automatic defect scanning and casual inspecting method and automatic defect scanning and casual inspecting device for controlling abnormality during silicon wafer production |
| CN103367103A (en) * | 2012-03-28 | 2013-10-23 | 无锡华润上华科技有限公司 | Semiconductor product production method and system thereof |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107015532A (en) * | 2017-02-23 | 2017-08-04 | 惠科股份有限公司 | Display panel online quality control method and device |
| CN107015532B (en) * | 2017-02-23 | 2018-03-09 | 惠科股份有限公司 | Display panel online quality control method and device |
| WO2018153120A1 (en) * | 2017-02-23 | 2018-08-30 | 惠科股份有限公司 | Detection method and detection apparatus for display panel |
| US11294361B2 (en) * | 2017-02-23 | 2022-04-05 | HKC Corporation Limited | Inspection method for inspecting display panel and inspection apparatus |
| CN109283899A (en) * | 2018-09-17 | 2019-01-29 | 沈机（上海）智能系统研发设计有限公司 | Workpiece quality detecting method and its device, medium, digital control system and quality inspection system |
| WO2022041955A1 (en) * | 2020-08-28 | 2022-03-03 | 长鑫存储技术有限公司 | Detection method and apparatus for wafer production process, and electronic device |
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| CN104134620B (en) | 2017-07-28 |
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