CN116453974A - Matching method and device for wafer furnace tube processing and electronic equipment - Google Patents
Matching method and device for wafer furnace tube processing and electronic equipment Download PDFInfo
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- CN116453974A CN116453974A CN202310395176.0A CN202310395176A CN116453974A CN 116453974 A CN116453974 A CN 116453974A CN 202310395176 A CN202310395176 A CN 202310395176A CN 116453974 A CN116453974 A CN 116453974A
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- 238000000034 method Methods 0.000 title claims abstract description 163
- 238000012545 processing Methods 0.000 title claims abstract description 145
- 235000012431 wafers Nutrition 0.000 claims abstract description 374
- 230000008569 process Effects 0.000 claims abstract description 123
- 238000012216 screening Methods 0.000 claims abstract description 78
- 239000002253 acid Substances 0.000 claims abstract description 50
- 238000005406 washing Methods 0.000 claims abstract description 32
- 238000005554 pickling Methods 0.000 claims description 44
- 238000003912 environmental pollution Methods 0.000 claims description 40
- 238000004140 cleaning Methods 0.000 claims description 18
- 238000003860 storage Methods 0.000 claims description 7
- 238000004590 computer program Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 description 18
- 238000010586 diagram Methods 0.000 description 6
- 238000003672 processing method Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000003754 machining Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000011109 contamination Methods 0.000 description 2
- 238000012217 deletion Methods 0.000 description 2
- 230000037430 deletion Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/04—Programme control other than numerical control, i.e. in sequence controllers or logic controllers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/30—Computing systems specially adapted for manufacturing
Abstract
The application provides a matching method and device for wafer furnace tube processing and electronic equipment, and the matching method for wafer furnace tube processing comprises the following steps: for any batch of wafers to be processed, determining a starting station of the wafers to be processed in the batch entering an acid washing process and a finishing station of the wafers to be processed entering a furnace tube processing process; before the wafers to be processed in the batch enter a starting station of an acid washing process, judging whether the wafers to be processed in the batch are subjected to batch set matching according to preset wafer screening conditions; if yes, controlling the wafers to be processed in the batch to enter a starting station of an acid washing process, and entering the furnace tube processing process according to the batch collection sequence after the acid washing process is completed. The method and the device realize automatic batch set matching of the wafers to be processed, so that the wafers to be processed automatically finish the operation from the acid washing process to the furnace tube high-temperature processing process, and further the yield of the wafers to be processed is improved.
Description
Technical Field
The present disclosure relates to the field of wafer processing technologies, and in particular, to a method and an apparatus for matching wafer furnace tube processing, and an electronic device.
Background
The wafer chips are subjected to an acid cleaning process and a high-temperature processing process in an access furnace tube in an actual manufacturing production line, however, in the conventional wafer chip manufacturing process, the acid cleaning process only supports acid cleaning of wafer chips in a single batch, the high-temperature processing process generally requires processing of wafer chips in a plurality of batches, in the wafer chip manufacturing process, the wafer chips in a plurality of batches after acid cleaning are required to be sent into the furnace tube together for high-temperature processing, and the conventional wafer chip processing process to the furnace tube processing process is generally manually operated by operators, so that the operation time requirement cannot be met, the wafer chips in a plurality of batches cannot be subjected to uniform high-temperature processing, the yield of the wafer chips is affected, and the wafer chips in a plurality of batches are seriously scrapped.
Disclosure of Invention
In view of this, the present application aims to provide a matching method, a device and an electronic device for wafer furnace tube processing, which realize automatic matching of batch sets of wafers to be processed, so that the wafers to be processed automatically complete the operation from an acid washing process to a furnace tube high-temperature processing process, thereby improving the yield of the wafers to be processed and ensuring the stability of wafer processing.
The embodiment of the application provides a matching method for wafer furnace tube processing, which comprises the following steps:
for any batch of wafers to be processed, determining a starting station of the wafers to be processed in the batch entering an acid washing process and a finishing station of the wafers to be processed entering a furnace tube processing process;
before the wafers to be processed in the batch enter a starting station of an acid washing process, judging whether the wafers to be processed in the batch are subjected to batch set matching according to preset wafer screening conditions;
if yes, controlling the wafers to be processed in the batch to enter an initial station of an acid washing process, and entering the furnace tube processing process according to the batch collection sequence after the acid washing process is completed, so that the furnace tube processing of the wafers to be processed is matched at the end station.
Further, after entering the furnace tube processing technology according to the batch collection sequence, the matching method of wafer furnace tube processing further comprises:
judging whether the clamping time between the starting station of the wafer to be processed entering the pickling process and the ending station of the furnace tube processing process of any batch is out of a preset clamping time threshold range or not;
if yes, sending out an alarm reminding for the wafers to be processed in the batch.
Further, the preset wafer screening conditions include preset wafer parameter screening conditions and preset environmental pollution degree screening conditions, and the judging whether the wafers to be processed in the batch are subjected to batch set matching according to the preset wafer screening conditions includes:
and judging whether the wafers to be processed in the batch are subjected to batch set matching according to the preset wafer parameter screening conditions, and judging whether the wafers to be processed in the batch are subjected to batch set matching according to the preset environmental pollution degree screening conditions.
Further, the preset wafer parameter screening conditions include a preset wafer film thickness and a preset wafer line width, and the steps of determining whether the wafers to be processed in the lot are subjected to lot set matching according to the preset wafer parameter screening conditions, and determining whether the wafers to be processed in the lot are subjected to lot set matching according to the preset environmental pollution degree screening conditions include:
judging whether the wafers to be processed in the batch conform to the preset wafer film thickness and the preset wafer line width;
if yes, judging whether the wafers to be processed in the batch are subjected to batch set matching according to the preset environmental pollution degree screening conditions.
Further, if yes, judging whether the wafers to be processed in the batch are subjected to batch set matching according to the preset environmental pollution degree screening conditions, including:
if yes, judging whether the actual environmental pollution degree of the target machine where the wafers to be processed are positioned in the batch meets the preset environmental pollution degree.
The embodiment of the application also provides a matching device for wafer furnace tube processing, the matching device for wafer furnace tube processing comprises:
the determining module is used for determining a start station of the wafers to be processed in any batch entering the pickling process and a stop station of the wafers to be processed in the batch entering the furnace tube processing process aiming at the wafers to be processed in any batch;
the first judging module is used for judging whether the wafers to be processed in the batch are subjected to batch set matching according to preset wafer screening conditions before the wafers to be processed in the batch enter a starting station of an acid washing process;
and the processing module is used for controlling the wafers to be processed under the batch to enter a starting station of an acid cleaning process if the wafers to be processed enter the furnace tube processing process according to the batch collection sequence after the acid cleaning process is completed, so that the furnace tube processing of the wafers to be processed is matched at the ending station.
Further, the matching device for processing the wafer furnace tube further comprises:
the second judging module is used for judging whether the clamping time between the starting station of the wafer to be processed entering the pickling process and the ending station of the wafer to be processed entering the furnace tube processing process of any batch is out of a preset clamping time threshold value range or not;
and the alarm module is used for sending alarm reminding to the wafers to be processed in the batch if the wafers to be processed are in the batch.
Further, the preset wafer screening conditions include preset wafer parameter screening conditions and preset environmental pollution degree screening conditions, and the first judging module is specifically configured to:
and judging whether the wafers to be processed in the batch are subjected to batch set matching according to the preset wafer parameter screening conditions, and whether the wafers to be processed in the batch are subjected to batch set matching according to the preset environmental pollution degree screening conditions.
Further, the preset wafer parameter screening conditions include a preset wafer film thickness and a preset wafer line width, and the determining whether the wafers to be processed in the lot are subjected to lot set matching according to the preset wafer parameter screening conditions, and whether the wafers to be processed in the lot are subjected to lot set matching according to the preset environmental pollution degree screening conditions includes:
judging whether the wafers to be processed in the batch conform to the preset wafer film thickness and the preset wafer line width;
if yes, judging whether the wafers to be processed in the batch are subjected to batch set matching according to the preset environmental pollution degree screening conditions.
The embodiment of the application also provides electronic equipment, which comprises: the device comprises a processor, a memory and a bus, wherein the memory stores machine-readable instructions executable by the processor, when the electronic device is running, the processor and the memory are communicated through the bus, and the machine-readable instructions are executed by the processor to execute the steps of the matching method for wafer furnace tube processing.
Embodiments of the present application also provide a computer readable storage medium having a computer program stored thereon, which when executed by a processor performs the steps of a matching method for wafer furnace processing as described above.
Compared with the wafer processing method in the prior art, the matching method, the device and the electronic equipment for the wafer furnace tube processing provided by the embodiment of the application are characterized in that whether the wafers to be processed in the batch are matched in a batch set according to preset wafer screening conditions is judged by determining the starting station of the wafers to be processed in any batch entering the pickling process and the ending station of the wafer to be processed in the furnace tube processing process before the wafers to be processed in the batch enter the starting station of the pickling process; if yes, controlling wafers to be processed under the batch to enter an initial station of the pickling process, and entering a furnace tube processing process according to a batch collection sequence after the pickling process is completed, so that the furnace tube processing of the wafers to be processed is completed at a termination station, the batch collection automatic matching of the wafers to be processed is realized, the wafers to be processed automatically complete the operation from the pickling process to the furnace tube high-temperature processing process, the yield of the wafers to be processed is further improved, and the processing stability of the wafers is ensured.
In order to make the above objects, features and advantages of the present application more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered limiting the scope, and that other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 shows one of the flowcharts of a matching method for wafer furnace processing according to embodiments of the present application;
FIG. 2 is a flow chart illustrating a second method for matching wafer furnace processing according to an embodiment of the present disclosure;
FIG. 3 is a block diagram illustrating a wafer furnace processing matching apparatus according to an embodiment of the present disclosure;
FIG. 4 is a block diagram illustrating a second embodiment of a matching apparatus for wafer furnace processing;
fig. 5 shows a schematic structural diagram of an electronic device according to an embodiment of the present application.
In the figure:
300-a matching device for processing the wafer furnace tube; 310-determining a module; 320-a first judging module; 330-a processing module; 340-a second judging module; 350-an alarm module; 500-an electronic device; 510-a processor; 520-memory; 530-bus.
Detailed Description
For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, which are generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present application, as provided in the accompanying drawings, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. Based on the embodiments of the present application, every other embodiment that a person skilled in the art would obtain without making any inventive effort is within the scope of protection of the present application.
First, application scenarios applicable to the present application will be described. The method and the device can be applied to the technical field of wafer processing.
According to research, the wafer chips are subjected to an acid washing process in an actual manufacturing production line and are connected into a furnace tube to perform a high-temperature processing process, however, in the conventional wafer chip manufacturing process, the acid washing process only supports single-batch wafer chips to perform acid washing, the high-temperature processing process generally needs to process multiple batches of wafer chips, in the wafer chip manufacturing process, the multiple batches of wafer chips after acid washing are required to be sent into a furnace tube machine together to perform high-temperature processing, and the conventional acid washing process to the furnace tube processing process are generally manually operated by operators, so that the operation time requirement cannot be met, the wafer chips of the multiple batches cannot be subjected to uniform high-temperature processing, the yield of the wafer chips is affected, and the wafer chips of the multiple batches are seriously processed and scrapped.
Based on the above, the embodiment of the application provides a matching method, a device and electronic equipment for wafer furnace tube processing, which realize automatic matching of batch sets of wafers to be processed, so that the wafers to be processed automatically finish the operation from an acid washing process to a furnace tube high-temperature processing process, further improve the yield of the wafers to be processed and ensure the processing stability of the wafers.
Referring to fig. 1, fig. 1 is a flowchart of a matching method for wafer furnace processing according to an embodiment of the present disclosure. As shown in fig. 1, the matching method for processing a wafer furnace tube provided in the embodiment of the application includes the following steps:
s101, determining a start station of the wafers to be processed in any batch entering an acid washing process and a stop station of the wafers to be processed in the batch entering a furnace tube processing process aiming at the wafers to be processed in any batch.
In the step, in the process of producing and manufacturing any batch of wafers to be processed, before the batch of wafers to be processed are subjected to an acid cleaning process and a furnace tube processing process, a start station of the batch of wafers to be processed entering the acid cleaning process and a stop station of the wafers to be processed entering the furnace tube processing process are firstly determined.
Here, wafers to be processed in different batches sequentially enter the pickling process, and the wafers to be processed in the same batch cannot be configured in a crossing manner in the process of configuring the starting station of the pickling process and the ending station of the furnace tube processing process, so that the configuration errors of the wafers to be processed in the same batch are avoided.
S102, before the wafers to be processed in the batch enter a starting station of an acid washing process, judging whether the wafers to be processed in the batch are subjected to batch set matching according to preset wafer screening conditions.
In the step, before the pickling process is performed on the wafers to be processed in different batches, it is first determined and judged whether the wafers to be processed in the batch are already subjected to batch set matching, and if the wafers to be processed in the batch are not subjected to batch set matching, the wafers to be processed in the batch are not allowed to be subjected to the pickling process.
Optionally, the preset wafer screening conditions include preset wafer parameter screening conditions and preset environmental pollution level screening conditions, so the step S102 includes the following substeps:
and step 1021, before the wafers to be processed in the batch enter the starting station of the pickling process, judging whether the wafers to be processed in the batch are subjected to batch set matching according to the preset wafer parameter screening conditions, and judging whether the wafers to be processed in the batch are subjected to batch set matching according to the preset environmental pollution degree screening conditions.
In this step, determining whether the wafers to be processed in the lot match the lot set according to a preset wafer screening condition may specifically but not be limited to including:
judging whether the parameter conditions of the wafers to be processed in the batch meet the preset wafer parameter screening conditions required by the furnace tube machine table or not, and whether the environmental pollution degree of the wafers to be processed in the batch meets the preset environmental pollution degree screening conditions or not.
Here, preset wafer parameter screening conditions and preset environmental pollution degree screening conditions are used for filtering out wafers in the batch, so that the work efficiency is improved, the yield of processed wafers is greatly improved, the processed wafers are convenient to process in advance, and unnecessary subsequent processing work is avoided.
Optionally, the substep 1021 includes the substeps of:
and 10211, before the wafers to be processed in the batch enter the initial station of the pickling process, judging whether the wafers to be processed in the batch conform to the preset wafer film thickness and the preset wafer line width.
In this step, the preset wafer parameter screening conditions in the embodiments provided herein include, but are not limited to, a preset wafer film thickness and a preset wafer line width, that is, the preset wafer parameter screening conditions in the embodiments provided herein are basic workpieces of the wafer.
Here, it is assumed that the preset wafer parameter screening condition in the embodiment provided in the present application is that the preset wafer film thickness is 0.8um or less.
And 10212, if yes, judging whether the wafers to be processed in the batch are subjected to batch set matching according to the preset environmental pollution degree screening conditions.
In the step, after the wafers to be processed in the batch meet the preset wafer parameter screening conditions, the pollution degree of the wafers to be processed in the batch is compared with the preset environmental pollution degree of the wafer processing furnace tube, so that whether the wafers to be processed in the batch are subjected to batch collection matching according to the preset environmental pollution degree screening conditions is determined.
Here, the contamination levels of wafers to be processed are different in different batches, and the contamination levels of wafer processing furnace tubes are also different. Wafers to be processed in different batches in the batch set can not be processed in the wafer processing furnace tube, the wafers to be processed with higher pollution degree than the wafer processing furnace tube machine table can cause the pollution in the wafer processing furnace tube, and at the moment, the production manufacturing execution system (Manufacturing execution system) can carry out clamping control to avoid continuous processing of the wafers to be processed.
The production and manufacturing execution system can help enterprises to realize production plan management, production process control, product quality management, workshop inventory management, project billboard management and the like, so that the manufacturing execution capacity of the enterprises is improved.
Optionally, if yes, determining whether the wafers to be processed in the lot are matched in a lot set according to the preset environmental pollution degree screening condition, including:
if yes, judging whether the actual environmental pollution degree of the target machine where the wafers to be processed are positioned in the batch meets the preset environmental pollution degree.
In the step, whether the actual environmental pollution degree of a target machine where the wafers to be processed are positioned in any batch is smaller than or equal to the preset environmental pollution degree or not is judged, and the wafers to be processed in the batch are sent to a furnace tube processing technology station by a pickling technology station.
And S103, if so, controlling the wafers to be processed in the batch to enter an initial station of an acid washing process, and after the acid washing process is finished, entering the furnace tube processing process according to the batch collection sequence so as to finish the matching of furnace tube processing of the wafers to be processed at the end station.
In the step, if the wafers to be processed in the batch are subjected to batch collection matching according to preset wafer screening conditions, controlling the wafers to be processed in the batch to enter a start station of an acid washing process, entering the furnace tube processing process according to the batch collection sequence after the acid washing process is completed, and in the process of entering a stop station of the furnace tube processing process, continuously performing addition or deletion operation on the wafers to be processed in other batches in the batch collection where the wafers to be processed in the batch are located, and stopping the addition or deletion operation on the batch collection after the wafers to be processed in the batch enter the furnace tube processing process.
Here, after the furnace tube processing process is completed on the wafers to be processed in the batch, the batch set of the wafers to be processed in the batch is automatically separated, a plurality of batches of wafers to be processed including the batch are reformed, and the wafers to be processed in different batches are sequentially input to the next processing process station after the furnace tube processing process.
Compared with the wafer processing method in the prior art, the wafer furnace tube processing matching method provided by the embodiment of the invention has the advantages that the starting station of the wafer to be processed in any batch entering the pickling process and the ending station of the wafer to be processed in the furnace tube processing process are determined, and before the wafer to be processed in the batch enters the starting station of the pickling process, whether the wafer to be processed in the batch is subjected to batch collection matching according to the preset wafer screening conditions is judged; if yes, controlling wafers to be processed under the batch to enter an initial station of the pickling process, and entering a furnace tube processing process according to a batch collection sequence after the pickling process is completed, so that the furnace tube processing of the wafers to be processed is completed at a termination station, the batch collection automatic matching of the wafers to be processed is realized, the wafers to be processed automatically complete the operation from the pickling process to the furnace tube high-temperature processing process, the yield of the wafers to be processed is further improved, and the processing stability of the wafers is ensured.
Referring to fig. 2, fig. 2 is a second flowchart of a matching method for wafer furnace processing according to an embodiment of the present application. As shown in fig. 2, the matching method for wafer furnace tube processing provided in the embodiment of the present application includes the following steps:
s201, determining a start station of the wafers to be processed in any batch entering an acid washing process and a stop station of the wafers to be processed in the batch entering a furnace tube processing process aiming at the wafers to be processed in any batch.
S202, before the wafers to be processed in the batch enter a starting station of an acid washing process, judging whether the wafers to be processed in the batch are subjected to batch set matching according to preset wafer screening conditions.
And S203, if yes, controlling the wafers to be processed in the batch to enter an initial station of an acid washing process, and after the acid washing process is completed, entering the furnace tube processing process according to the batch collection sequence so as to complete the matching of furnace tube processing of the wafers to be processed at the end station.
S204, judging whether the clamping time between the start site of the wafer to be processed entering the pickling process and the end site of the wafer to be processed entering the furnace tube processing process is out of a preset clamping time threshold range.
In the step, a pickling process to a furnace tube machining process are required to be preset and are out of a preset clamping time threshold range, the clamping time between a start station of any batch of wafers to be machined entering the pickling process and a stop station of the furnace tube machining process is compared with the preset clamping time threshold range, whether the batch of wafers to be machined meets machining requirements or not is sequentially determined, and when the clamping time corresponding to the batch of wafers to be machined is out of the preset clamping time threshold range, the batch of wafers to be machined are scrapped, and continuous machining production of the batch of wafers to be machined is stopped.
S205, if yes, sending out an alarm reminding for the wafers to be processed in the batch.
In the step, if the corresponding clamping time of the batch of wafers to be processed is out of the preset clamping time threshold value range, an alarm prompt is sent out to the batch of wafers to be processed, and scrapping treatment is carried out. Here, the alert in the embodiments provided in the present application includes, but is not limited to, a short message, an instant messaging tool message, a phone call, a mail, a voice broadcast, a large screen notification, and the like.
The descriptions of S201 to S203 may refer to the descriptions of S101 to S103, and the same technical effects can be achieved, which will not be described in detail.
Compared with the wafer processing method in the prior art, the wafer furnace tube processing matching method provided by the embodiment of the invention has the advantages that the starting station of the wafer to be processed in any batch entering the pickling process and the ending station of the wafer to be processed in the furnace tube processing process are determined, and before the wafer to be processed in the batch enters the starting station of the pickling process, whether the wafer to be processed in the batch is subjected to batch collection matching according to the preset wafer screening conditions is judged; if yes, controlling wafers to be processed under the batch to enter an initial station of the pickling process, and entering a furnace tube processing process according to a batch collection sequence after the pickling process is completed, so that the furnace tube processing of the wafers to be processed is completed at a termination station, the batch collection automatic matching of the wafers to be processed is realized, the wafers to be processed automatically complete the operation from the pickling process to the furnace tube high-temperature processing process, the yield of the wafers to be processed is further improved, and the processing stability of the wafers is ensured.
Referring to fig. 3 and 4, fig. 3 is a first block diagram of a matching device for wafer furnace processing according to an embodiment of the present application, and fig. 4 is a second block diagram of a matching device for wafer furnace processing according to an embodiment of the present application. As shown in fig. 3, the matching device 300 for wafer furnace tube processing includes:
a determining module 310, configured to determine, for any batch of wafers to be processed, a start station at which the wafers to be processed in the batch enter the pickling process and an end station at which the wafers to be processed enter the furnace tube processing process.
A first judging module 320, configured to judge whether the wafers to be processed in the lot are matched in a lot set according to a preset wafer screening condition before the wafers to be processed in the lot enter a start station of an acid cleaning process.
Optionally, the preset wafer screening conditions include preset wafer parameter screening conditions and preset environmental pollution level screening conditions, and the first judging module 320 is specifically configured to:
and judging whether the wafers to be processed in the batch are subjected to batch set matching according to the preset wafer parameter screening conditions, and whether the wafers to be processed in the batch are subjected to batch set matching according to the preset environmental pollution degree screening conditions.
Optionally, the preset wafer parameter screening conditions include a preset wafer film thickness and a preset wafer line width, and the determining whether the wafers to be processed in the lot are subjected to lot set matching according to the preset wafer parameter screening conditions, and determining whether the wafers to be processed in the lot are subjected to lot set matching according to the preset environmental pollution degree screening conditions includes:
and judging whether the wafers to be processed in the batch accord with the preset wafer film thickness and the preset wafer line width.
If yes, judging whether the wafers to be processed in the batch are subjected to batch set matching according to the preset environmental pollution degree screening conditions.
Optionally, if yes, determining whether the wafers to be processed in the lot are matched in a lot set according to the preset environmental pollution degree screening condition, including:
if yes, judging whether the actual environmental pollution degree of the target machine where the wafers to be processed are positioned in the batch meets the preset environmental pollution degree.
And the processing module 330 is configured to control the wafers to be processed in the batch to enter a start station of an acid cleaning process if the wafers to be processed enter the acid cleaning process, and enter the furnace tube processing process according to the batch collection sequence after the acid cleaning process is completed, so as to complete the matching of furnace tube processing of the wafers to be processed at the end station.
Compared with the wafer processing method in the prior art, the matching device 300 for processing the wafer furnace tube provided by the embodiment of the invention determines whether the wafers to be processed in any batch enter the starting station of the pickling process and the ending station of the furnace tube processing process, and judges whether the wafers to be processed in the batch are subjected to batch set matching according to the preset wafer screening conditions before the wafers to be processed in the batch enter the starting station of the pickling process; if yes, controlling wafers to be processed under the batch to enter an initial station of the pickling process, and entering a furnace tube processing process according to a batch collection sequence after the pickling process is completed, so that the furnace tube processing of the wafers to be processed is completed at a termination station, the batch collection automatic matching of the wafers to be processed is realized, the wafers to be processed automatically complete the operation from the pickling process to the furnace tube high-temperature processing process, the yield of the wafers to be processed is further improved, and the processing stability of the wafers is ensured.
As shown in fig. 4, the matching device 300 for wafer furnace tube processing includes:
a determining module 310, configured to determine, for any batch of wafers to be processed, a start station at which the wafers to be processed in the batch enter the pickling process and an end station at which the wafers to be processed enter the furnace tube processing process.
A first judging module 320, configured to judge whether the wafers to be processed in the lot are matched in a lot set according to a preset wafer screening condition before the wafers to be processed in the lot enter a start station of an acid cleaning process.
And the processing module 330 is configured to control the wafers to be processed in the batch to enter a start station of an acid cleaning process if the wafers to be processed enter the acid cleaning process, and enter the furnace tube processing process according to the batch collection sequence after the acid cleaning process is completed, so as to complete the matching of furnace tube processing of the wafers to be processed at the end station.
The second determining module 340 is configured to determine whether a clamping time between a start station of the wafer to be processed entering the pickling process and a stop station of the wafer to be processed entering the furnace tube processing process is outside a preset clamping time threshold.
And the alarm module 350 is configured to send an alarm to the wafers to be processed in the lot if the wafers to be processed are in the lot.
Compared with the wafer processing method in the prior art, the matching device 300 for processing the wafer furnace tube provided by the embodiment of the invention determines whether the wafers to be processed in any batch enter the starting station of the pickling process and the ending station of the furnace tube processing process, and judges whether the wafers to be processed in the batch are subjected to batch set matching according to the preset wafer screening conditions before the wafers to be processed in the batch enter the starting station of the pickling process; if yes, controlling wafers to be processed under the batch to enter an initial station of the pickling process, and entering a furnace tube processing process according to a batch collection sequence after the pickling process is completed, so that the furnace tube processing of the wafers to be processed is completed at a termination station, the batch collection automatic matching of the wafers to be processed is realized, the wafers to be processed automatically complete the operation from the pickling process to the furnace tube high-temperature processing process, the yield of the wafers to be processed is further improved, and the processing stability of the wafers is ensured.
Referring to fig. 5, fig. 5 is a schematic structural diagram of an electronic device according to an embodiment of the present application. As shown in fig. 5, the electronic device 500 includes a processor 510, a memory 520, and a bus 530.
The memory 520 stores machine-readable instructions executable by the processor 510, and when the electronic device 500 is running, the processor 510 communicates with the memory 520 through the bus 530, and when the machine-readable instructions are executed by the processor 510, the steps of the matching method for wafer furnace processing in the method embodiments shown in fig. 1 and fig. 2 can be executed, and detailed implementation manners can refer to method embodiments and are not repeated herein.
The embodiment of the present application further provides a computer readable storage medium, where a computer program is stored on the computer readable storage medium, and when the computer program is executed by a processor, the steps of the matching method for wafer furnace tube processing in the method embodiments shown in fig. 1 and fig. 2 may be executed, and a specific implementation manner may refer to the method embodiment and will not be described herein.
It will be clear to those skilled in the art that, for convenience and brevity of description, specific working procedures of the above-described systems, apparatuses and units may refer to corresponding procedures in the foregoing method embodiments, and are not repeated herein.
In the several embodiments provided in this application, it should be understood that the disclosed systems, devices, and methods may be implemented in other manners. The above-described apparatus embodiments are merely illustrative, for example, the division of the units is merely a logical function division, and there may be other manners of division in actual implementation, and for example, multiple units or components may be combined or integrated into another system, or some features may be omitted, or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be through some communication interface, device or unit indirect coupling or communication connection, which may be in electrical, mechanical or other form.
The units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
In addition, each functional unit in each embodiment of the present application may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit.
The functions, if implemented in the form of software functional units and sold or used as a stand-alone product, may be stored in a non-volatile computer readable storage medium executable by a processor. Based on such understanding, the technical solution of the present application may be embodied essentially or in a part contributing to the prior art or in a part of the technical solution, in the form of a software product stored in a storage medium, including several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the methods described in the embodiments of the present application. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a random access Memory (Random Access Memory, RAM), a magnetic disk, or an optical disk, or other various media capable of storing program codes.
Finally, it should be noted that: the foregoing examples are merely specific embodiments of the present application, and are not intended to limit the scope of the present application, but the present application is not limited thereto, and those skilled in the art will appreciate that while the foregoing examples are described in detail, the present application is not limited thereto. Any person skilled in the art may modify or easily conceive of the technical solution described in the foregoing embodiments, or make equivalent substitutions for some of the technical features within the technical scope of the disclosure of the present application; such modifications, changes or substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present application, and are intended to be included in the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. The matching method for the wafer furnace tube processing is characterized by comprising the following steps of:
for any batch of wafers to be processed, determining a starting station of the wafers to be processed in the batch entering an acid washing process and a finishing station of the wafers to be processed entering a furnace tube processing process;
before the wafers to be processed in the batch enter a starting station of an acid washing process, judging whether the wafers to be processed in the batch are subjected to batch set matching according to preset wafer screening conditions;
if yes, controlling the wafers to be processed in the batch to enter an initial station of an acid washing process, and entering the furnace tube processing process according to the batch collection sequence after the acid washing process is completed, so that the furnace tube processing of the wafers to be processed is matched at the end station.
2. The method of matching wafer furnace processing of claim 1, further comprising, after said entering the furnace processing process in the batch set order:
judging whether the clamping time between the starting station of the wafer to be processed entering the pickling process and the ending station of the furnace tube processing process of any batch is out of a preset clamping time threshold range or not;
if yes, sending out an alarm reminding for the wafers to be processed in the batch.
3. The method for matching wafer furnace tube processing according to claim 1, wherein the preset wafer screening conditions include preset wafer parameter screening conditions and preset environmental pollution level screening conditions, and the determining whether the wafers to be processed in the lot are subjected to lot set matching according to the preset wafer screening conditions comprises:
and judging whether the wafers to be processed in the batch are subjected to batch set matching according to the preset wafer parameter screening conditions, and judging whether the wafers to be processed in the batch are subjected to batch set matching according to the preset environmental pollution degree screening conditions.
4. The method for matching wafer furnace tube processing according to claim 3, wherein the preset wafer parameter screening conditions include a preset wafer film thickness and a preset wafer line width, the determining whether the wafers to be processed in the lot are subjected to batch set matching according to the preset wafer parameter screening conditions, and the determining whether the wafers to be processed in the lot are subjected to batch set matching according to the preset environmental pollution degree screening conditions includes:
judging whether the wafers to be processed in the batch conform to the preset wafer film thickness and the preset wafer line width;
if yes, judging whether the wafers to be processed in the batch are subjected to batch set matching according to the preset environmental pollution degree screening conditions.
5. The method for matching wafer furnace tube processing according to claim 4, wherein if yes, determining whether the wafers to be processed in the lot are matched in a lot set according to the preset environmental pollution level screening condition comprises:
if yes, judging whether the actual environmental pollution degree of the target machine where the wafers to be processed are positioned in the batch meets the preset environmental pollution degree.
6. The utility model provides a matching device of wafer furnace tube processing which characterized in that, matching device of wafer furnace tube processing includes:
the determining module is used for determining a start station of the wafers to be processed in any batch entering the pickling process and a stop station of the wafers to be processed in the batch entering the furnace tube processing process aiming at the wafers to be processed in any batch;
the first judging module is used for judging whether the wafers to be processed in the batch are subjected to batch set matching according to preset wafer screening conditions before the wafers to be processed in the batch enter a starting station of an acid washing process;
and the processing module is used for controlling the wafers to be processed under the batch to enter a starting station of an acid cleaning process if the wafers to be processed enter the furnace tube processing process according to the batch collection sequence after the acid cleaning process is completed, so that the furnace tube processing of the wafers to be processed is matched at the ending station.
7. The wafer furnace tube processing matching apparatus of claim 6, further comprising:
the second judging module is used for judging whether the clamping time between the starting station of the wafer to be processed entering the pickling process and the ending station of the wafer to be processed entering the furnace tube processing process of any batch is out of a preset clamping time threshold value range or not;
and the alarm module is used for sending alarm reminding to the wafers to be processed in the batch if the wafers to be processed are in the batch.
8. The apparatus of claim 7, wherein the preset wafer screening conditions include a preset wafer parameter screening condition and a preset environmental pollution level screening condition, and the first determining module is specifically configured to:
and judging whether the wafers to be processed in the batch are subjected to batch set matching according to the preset wafer parameter screening conditions, and whether the wafers to be processed in the batch are subjected to batch set matching according to the preset environmental pollution degree screening conditions.
9. An electronic device, comprising: a processor, a memory and a bus, said memory storing machine readable instructions executable by said processor, said processor and said memory communicating via the bus when the electronic device is running, said machine readable instructions when executed by said processor performing the steps of the matching method of wafer furnace processing according to any of the preceding claims 1 to 5.
10. A computer readable storage medium, characterized in that it has stored thereon a computer program which, when executed by a processor, performs the steps of the matching method of wafer furnace processing according to any of the preceding claims 1 to 5.
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