CN110780133B - 用于测试电子部件的分选机 - Google Patents

用于测试电子部件的分选机 Download PDF

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Publication number
CN110780133B
CN110780133B CN201911041722.0A CN201911041722A CN110780133B CN 110780133 B CN110780133 B CN 110780133B CN 201911041722 A CN201911041722 A CN 201911041722A CN 110780133 B CN110780133 B CN 110780133B
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China
Prior art keywords
temperature
pusher
electronic
electronic component
cooling
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Active
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CN201911041722.0A
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English (en)
Chinese (zh)
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CN110780133A (zh
Inventor
李秉哲
金是勇
金奉洙
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Techwing Co Ltd
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Techwing Co Ltd
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Priority claimed from KR1020150145852A external-priority patent/KR102433967B1/ko
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Publication of CN110780133A publication Critical patent/CN110780133A/zh
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Publication of CN110780133B publication Critical patent/CN110780133B/zh
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
CN201911041722.0A 2014-11-28 2015-10-28 用于测试电子部件的分选机 Active CN110780133B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
KR10-2014-0168196 2014-11-28
KR20140168196 2014-11-28
KR10-2015-0145852 2015-10-20
KR1020150145852A KR102433967B1 (ko) 2014-11-28 2015-10-20 전자부품 테스트용 핸들러
CN201580058183.5A CN107110910B (zh) 2014-11-28 2015-10-28 用于测试电子部件的分选机

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201580058183.5A Division CN107110910B (zh) 2014-11-28 2015-10-28 用于测试电子部件的分选机

Publications (2)

Publication Number Publication Date
CN110780133A CN110780133A (zh) 2020-02-11
CN110780133B true CN110780133B (zh) 2022-01-04

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ID=56074627

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Application Number Title Priority Date Filing Date
CN201911041722.0A Active CN110780133B (zh) 2014-11-28 2015-10-28 用于测试电子部件的分选机

Country Status (2)

Country Link
CN (1) CN110780133B (ko)
WO (1) WO2016085135A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3988160B1 (en) 2020-10-23 2023-07-05 Oticon Medical A/S Cochlear implant device with a flexible electrode array
WO2023236182A1 (zh) * 2022-06-10 2023-12-14 致茂电子股份有限公司 电子元件检测设备的温度控制系统及其方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020053406A (ko) * 2000-12-27 2002-07-05 정문술 반도체 소자 테스트용 핸들러
JP2006343174A (ja) * 2005-06-08 2006-12-21 Seiko Epson Corp 温度制御装置、電子部品ハンドラ並びに電子部品の温度制御方法
CN101137911A (zh) * 2005-01-10 2008-03-05 埃里希·赖廷格 使用温度可调的卡盘设备来测试半导体晶片的方法和装置
JP2014190708A (ja) * 2013-03-26 2014-10-06 Seiko Epson Corp 電子部品押圧装置、電子部品の温度制御方法、ハンドラーおよび検査装置
CN104096684A (zh) * 2013-04-03 2014-10-15 泰克元有限公司 半导体元件测试用分选机

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006337359A (ja) * 2005-05-02 2006-12-14 Daytona Control Co Ltd 温度制御装置
JP2009250810A (ja) * 2008-04-07 2009-10-29 Seiko Epson Corp 電子部品の温度制御装置およびハンドラ装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020053406A (ko) * 2000-12-27 2002-07-05 정문술 반도체 소자 테스트용 핸들러
CN101137911A (zh) * 2005-01-10 2008-03-05 埃里希·赖廷格 使用温度可调的卡盘设备来测试半导体晶片的方法和装置
JP2006343174A (ja) * 2005-06-08 2006-12-21 Seiko Epson Corp 温度制御装置、電子部品ハンドラ並びに電子部品の温度制御方法
JP2014190708A (ja) * 2013-03-26 2014-10-06 Seiko Epson Corp 電子部品押圧装置、電子部品の温度制御方法、ハンドラーおよび検査装置
CN104096684A (zh) * 2013-04-03 2014-10-15 泰克元有限公司 半导体元件测试用分选机

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Publication number Publication date
WO2016085135A1 (ko) 2016-06-02
CN110780133A (zh) 2020-02-11

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