CN110773536A - Die container workstation, system and method for processing die container - Google Patents

Abstract

The present disclosure provides a die container workstation, a system and method of die container processing, the workstation including a cleaning station, an inspection station, and a conveyor. A cleaning station configured to clean a die container, wherein the die container is configured to hold a semiconductor die; the inspection station is configured to inspect the die container after cleaning to determine whether the die container is identified as passing the inspection; the conveyor is configured to move the die container between the cleaning station and the inspection station.

Description

Die container workstation, system and method for processing die container

Technical Field

The present disclosure relates to a system and method for processing a die container workstation.

Background

Modern manufacturing processes are highly automated to manipulate materials and devices and produce finished products. However, quality control, packaging, and maintenance procedures often rely on human skill, knowledge, and expertise to process and inspect the finished product during manufacturing and as a finished product.

Disclosure of Invention

According to some embodiments of the present disclosure, a seed container station is provided that includes a cleaning station, an inspection station, and a conveyor. The cleaning station is configured to clean a die container, wherein the die container is configured to hold a semiconductor die; the inspection station is configured to inspect the die container after cleaning to determine whether the die container is identified as passing the inspection; the conveyor is configured to move the die container between the cleaning station and the inspection station.

According to some embodiments of the present disclosure, a system for handling a die container is provided, comprising a die container and a workstation. The die container is configured to hold a semiconductor die; the workstation is configured to process the die container in an automated manner, and includes a cleaning station, an inspection station, and a conveyor. A cleaning station configured to clean the die container; the inspection station is configured to inspect the die container after cleaning to determine whether the die container is identified as passing the inspection; the conveyor is configured to move the die container between the cleaning station and the inspection station, wherein the conveyor is configured to move the die container to a pass-through exit or a fail-through exit based on whether the die container is identified as passing the inspection.

According to some embodiments of the present disclosure, there is provided a method of die container processing, comprising receiving a die container at a cleaning station, the cleaning station configured to clean the die container; receiving the die container at an inspection station configured to inspect the die container after cleaning to determine if the die container is identified as passing inspection; moving the die container along a conveyor between a cleaning station and an inspection station, wherein the conveyor is configured to move the die container to a pass-through exit or a fail-through exit based on whether the die container is identified as passing the inspection.

Drawings

Aspects of the disclosure are best understood from the following detailed description when read with the accompanying drawing figures. It should be noted that the various features are not necessarily drawn to scale. In fact, the dimensions and geometrical dimensions of the various features may be arbitrarily expanded or reduced for clarity.

Fig. 1A is a flow diagram of an integrated semiconductor die container workstation process 100 according to some embodiments.

Fig. 1B is a block diagram of various functional modules of an integrated semiconductor die container workstation functional module according to some embodiments.

Fig. 2A is a diagram of an integrated semiconductor die container workstation according to some embodiments.

Fig. 2B is a perspective view of a processing station portion of a semiconductor die container station according to some embodiments.

Fig. 3 is an illustration of stations aligned with one another such that portions of a conveyor system can convey a die container from one station to another, according to some embodiments.

Fig. 4A is an illustration of a fixture when assembled according to some embodiments.

Fig. 4B is an illustration of a fixture when disassembled, according to some embodiments.

Fig. 5A is an illustration of how a cleaning station performs cleaning according to some embodiments.

Fig. 5B is an illustration of how a drying station performs drying according to some embodiments.

Fig. 6A is an illustration of an image sensor configuration to generate image data characterizing a bottom plate of a die container, in accordance with some embodiments.

Fig. 6B is an illustration of one of the concave receptacles having pins according to some embodiments.

Fig. 6C is an illustration of a line image sensor configuration to generate image data characterizing a bottom plate of a die container, in accordance with some embodiments.

Fig. 7 is a schematic view of a bottom plate of a die container according to some embodiments.

The reference numbers are as follows:

100 treatment

102. 104, 106, 108, 110, 112, 114, 116, 118 operations

150 integrated semiconductor die container workstation function module

154 processor

156 computer readable storage module/computer readable storage

158 network connection module/network connection

160 user interface module/user interface

162 controller module/controller

164 sensor module/sensor

200 semiconductor die container workstation/integrated semiconductor die container workstation

202 load port station

208 disassembly station

210 cleaning station

212. 552 drying station

216 inspection station

216A image sensor station

216B-line point image sensor

218 assembly station

220 through an output station

222 fail output station

226 conveyor system

228. 312, 508, 558 grain container

230 automated material handling system

250 processing station section

254 base

256 wheels

258 leveler foot

302 first station

304 second station

306 third station

310. 420, 554 conveyer belt

320. 642 distance

402 jig

404. 602, 652, 702 backplane

406 cover

421. 506, 556 workpiece

422. 510, 560 guide pin

424 opening

430 manipulator

432 end portion

508A top side

508B bottom side

520 topside nozzle

522A, 522B, 522C, 522D topside brushes

524. 534 bristles

528. 578 direction of travel

530 bottom side nozzle

532A, 532B, 532C, 532D underside brush

570A, 570B, 570C, 570D topside gas nozzles

580A, 580B, 580C, 580D bottom side gas nozzle

600 image sensor

604 field of view

608. 658 concave receptacle

640 pins

643 notation

650 line image sensor

654 one-dimensional line

704 container

706 square corner

708A, 708B pin support

709 grains

Detailed Description

The following disclosure describes many different exemplary embodiments for implementing different features of the disclosure. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, this is merely an example and is not intended to be limiting. For example, it will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may be present.

In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.

In addition, spatially related terms such as: the use of words of "below," "lower," "above," "upper," and the like in … is used herein to facilitate describing the relationship of one element or feature to another element(s) or feature(s) in the figures. These spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The apparatus may be turned to a different orientation (rotated 90 degrees or at other orientations) and the spatially relative terms used herein should be interpreted accordingly.

Systems and methods according to various embodiments are directed to automated and integrated semiconductor die container processing workstations (e.g., platforms) for cleaning and inspection. Typically, the die container is inspected for defects and cleaned manually. A die container is a vessel or container used to hold semiconductor dies in transit. The semiconductor die, which may also be more simply referred to as a die, may be a single chip or die from a semiconductor chip. However, in various embodiments, the die container can be automatically cleaned and inspected without manual intervention. For example, the die container can be disassembled, cleaned, dried, inspected, and reassembled in an automated fashion at the die container processing station.

Disassembling may include separating portions of the die container to facilitate cleaning at the disassembling station. Cleaning may include applying a cleaning fluid at a cleaning station. Heated gas may be applied at the drying station for drying. Inspection may include inspecting the dimensions of the constituent components of the die container, the gasket (gasket) of the die container, and any other aspect of the disassembled die container that can be inspected at an inspection station. The die container can then be reassembled from its constituent components at an assembly station. Finally, the die container can be identified as a die container that passes inspection or a die container that fails inspection. Pass inspection may refer to die containers that meet various thresholds determined during inspection, such as a threshold of minimum acceptable warpage, a distance between pins (e.g., dummy pins), and the presence of a gasket. The inspected die containers may be directed to a pass output station (pass output station), while the non-inspected die containers may be directed to a fail output station (fail output station).

Semiconductor die container handling workstations may provide an integrated platform (integrated platform) in which each station is connected to another station in an automated fashion. Each station may be a fixed point or location for handling the die container from the initial load port station to the final output station, whether through the output station or not. Thus, the die container need only be brought to the load port station of the semiconductor die container processing station to be processed. The die container can then be disassembled, cleaned, dried, inspected, and reassembled from the semiconductor die container processing station for shipment, all without manual or human intervention by an operator of the semiconductor die container processing station.

In various embodiments, each of the semiconductor die container processing stations may be interconnected via a conveyor system. The conveyor system may describe automated interconnections between stations to bring the die containers from one station to another. Thus, the conveyor system may form a transport path from which the die containers may be conveyed (e.g. from start to finish) through a plurality of stations of the die container handling stations. In some embodiments, the conveyor system may include a robotic arm and conveyor belt system configured to receive a die container at one station and move the die container for receipt (e.g., processing) at another station.

The die container may be a tray (tray), boat (boat), jig (jig) or any type of vessel for transporting semiconductor dies. The die container including the base and the lid may be referred to as a jig. A die container that includes only a bottom plate (e.g., without a lid) may be referred to as a boat or tray. The die container may be made of any type of material suitable for semiconductor die transport, such as plastic or metal. In particular embodiments, the grain containers may be made of polymer, silicon nitride (SiN), and silicon dioxide (SiO) ₂) A multilayer composition of at least one of (a). In some embodiments, the die container that is a jig may have a bottom plate and a lid of the same material (e.g., plastic or metal). In other embodiments, the die container that is a jig may have a base and a lid of different materials (e.g., one plastic and the other metal). Also, in particular embodiments, the bottom panel of the die container can include a plurality of concave receptacles (e.g., pockets) in which individual dies can be placed (e.g., housed). The dies may optionally be further attached in place by rotatable pin clips that may contact the top surface of the die when the die rests on the bottom surface on the die container.

Fig. 1A is a flow diagram of an integrated semiconductor die container workstation process 100 according to some embodiments. The integrated semiconductor die container workstation process 100 may be performed by an integrated semiconductor die container workstation. It should be noted that process 100 is merely an example and is not intended to limit the present disclosure. Thus, it should be understood that additional operations may be provided before, during, and after process 100 of fig. 1A, that certain operations may be omitted, that certain operations may be performed concurrently with other operations, and that certain other operations may only be briefly described herein.

At operation 102, the die container can be brought to a load port station. The load port station may be an entry point to the integrated semiconductor die container workstation. The access point may be configured to interface with, for example, an automated material handling system (interface), or may be used to manually process (e.g., position) the die container to the load port station.

In various embodiments, the load port station can interface with a conveyor system of the integrated semiconductor die container station. The conveyor system may be an automated system for moving the die containers within the integrated semiconductor die container workstation between stations. For ease of illustration, the conveyor system may be considered separate from the stations (e.g., with reference to a transport path for the die containers, each portion of the conveyor system at each station readily traverses a semiconductor die container workstation), however, in practice, portions of the conveyor system may form part of each individual station. For example, the conveyor system may include various conveyor belts and/or robotic arms. These carousels may be provided as interconnected workstations, and robotic arms may move the die containers to and from the carousels and workstations, and/or from the workstations to automated material handling systems, as desired. In some embodiments, the robot arm may include a manipulator to manipulate or move portions of the die container, for example, for assembly or disassembly.

In certain embodiments, the conveyor belt may be comprised of a plurality of links such that openings in the conveyor belt allow access to the underside of objects (e.g., die containers or disassembled die containers) being transported by the conveyor belt. In other embodiments, the conveyor belt may contact the underside of some, but not all, of the objects (e.g., die containers or disassembled die containers) being conveyed by the conveyor belt. For example, the conveyor belt may contact the sides of the die container to move the die container. Further discussion of the conveyor belt will be provided below.

At operation 104, the die container may enter a disassembly station. The conveyor system can bring the die container from the load port station to the removal station. The disassembly station may be configured to disassemble the die container for cleaning and inspection as needed. As described above, the die container as a jig may include a lid in addition to the bottom plate. The lid may cover the top of the die container so that a die loaded in a receptacle (receptacle) of the base plate may be secured to the die container by having the lid over the base plate.

Thus, in some embodiments, the disassembly station may remove the lid from the base plate so that the base plate may be separated from the lid for inspection and cleaning. The cover may be removed from the base plate in various ways. For example, a suction force may be provided to the localized area via a manipulator (e.g., a suction tube) or other structural configuration to selectively apply a suction force to the lid to remove the lid from the base plate. The removed lids may then be placed on a conveyor system (e.g., on a conveyor belt of the conveyor system) for further processing and transport.

In other embodiments, the removal station may take no action if the die container is not a fixture or does not have a lid other than a base plate. Thus, die containers without lids or not jigs can be handled by the disassembly station and not at the disassembly station.

In various embodiments, the disassembly station may be configured to handle a certain type of die container. For example, the conveyor system may be configured to process die containers that are jigs at certain times (e.g., die containers with a lid and a bottom plate), or to process die containers that are boats or trays at other times (e.g., die containers with only a bottom plate, boats or trays without a lid). In various embodiments, the detachment system may include a die container lid sensor to determine whether the die container is a jig, boat, or tray. For example, the detachment system may include a container lid sensor that is a weight sensor configured to determine the weight of the boat, tray, or tool, such as a tool that is the first stage having the greatest weight and the boat or tray that is the second stage having a lesser weight. In other embodiments, the die container lid sensor may be an image sensor configured to obtain an image of the die container to determine whether it is a fixture (e.g., with a lid) or a boat or tray (e.g., without a lid). A computer readable code or indicia on the die container (e.g., a die container identification code) may be read from the image of the die container and processed to determine if the die container has a lid (e.g., it is a jig or boat/tray). Thus, based on the die container lid sensor, the disassembly station can determine whether to handle the die container as a jig (e.g., remove the lid), or as a boat or tray (e.g., without performing disassembly).

In operation 106, the die container may enter a cleaning station. The cleaning station may clean the bottom plate and, in some embodiments, the lid of the die container. For example, the cleaning station may apply a cleaning fluid (e.g., deionized water, air, or any liquid or gas) to the bottom plate and, in some embodiments, the lid of the die container. The cleaning fluid may be applied from above and below the bottom plate and, in some embodiments, the lid of the die container. The cleaning station may also physically contact the base and, in some embodiments, the lid, using a brush or other device, to clean the base and lid.

In operation 108, the die container may enter a drying station. The drying station may include applying a gas (e.g., a heated gas) to the grain container to dry the grain container. In certain embodiments, the gas may be heated to a temperature of about 60 degrees celsius to about 100 degrees celsius. In other embodiments, the gas may be set to a temperature of about 10 degrees celsius to about 150 degrees celsius. The gas may be, for example, nitrogen (e.g., N) ₂) Or clean dry air (e.g., ambient air that has been filtered of impurities). In addition, the gas application may be from above and below the bottom plate and, in some embodiments, the lid of the die container.

At operation 110, the die container may enter an inspection station. A conveyor system may bring the die container from the drying station to an inspection station. The inspection station may be configured to inspect the die container for defects. For example, the inspection station may be configured to inspect the die container for defects, such as to confirm that the die container includes the correct dimensions (e.g., size and shape) and/or whether the die container has unexpected surface features or non-uniformity (non-uniformity). In various embodiments, the inspection station may include an image sensor configured to obtain image data of the die container at a known (e.g., predetermined or expected) location on the die container. The image sensor may be, for example, an Automated Optical Inspection (AOI) image sensor and/or a line point (line point) image sensor. As will be discussed further below, if a defect is present, a repair step may be performed, for example, by moving the defective die container associated with the defect to a failed output station of the semiconductor die container workstation for repair. Alternatively, if no defects are detected, the conveyor system may move the die container past the output station.

In some embodiments, the inspection at the inspection station may check whether the pins are 0.075 millimeters apart, whether a gasket is present on the die container, and/or whether there is less than 200 microns of warpage on the die container (e.g., along the base or lid) compared to the planar direction. In other words, a die container may be considered defective if the pins are not separated by about 0.075 millimeters, when no gasket is present on the die container, and/or if the warpage is up to or greater than 200 microns compared to the planar direction.

At operation 112, the die container may enter an assembly station. The conveyor system can take the die container from the inspection station to the assembly station. The assembly station may be configured to assemble the die container as needed after cleaning and inspection. As described above, the die container as a jig may include a lid in addition to the bottom plate. The lid may form the top of the die container so that a die loaded in a receptacle of the base plate may be secured to the die container by having the lid over the base plate.

Thus, in certain embodiments, the assembly station may place (e.g., replace) the lid atop the base plate so that the base plate may be assembled with the lid. The lid may be placed on the base plate in various ways. For example, the cover may be configured via a manipulator (e.g., suction tube) or other structure to provide selective suction to localized areas to move the cover over the base and to position the cover on the base.

In other embodiments, the assembly station may take no action if the die container is not a jig or does not have a lid other than a base plate. Thus, die containers without lids or jigs may pass through the assembly station without being handled at the assembly station.

In some embodiments, the assembly station may mark the die container with a lid when processed from the disassembly station. The assembly station can then note whether the die container has the label of the lid and process accordingly. For example, as described above, a die container without a lid may not be otherwise processed at the assembly station. However, the die container with the lid can be assembled at an assembly station (e.g., lid assembled on the base plate).

At operation 114, a determination may be made whether the die container passes inspection. As described above, the inspection station may be configured to inspect the die container for defects, such as to confirm that the die container includes the correct dimensions (e.g., size and shape) and/or whether the die container has unexpected surface features or non-uniformity. If there are no defects, process 100 may move to operation 116 to pass the die container. If a defect exists, process 100 may move to operation 118 so that the die container does not pass or fails inspection.

At operation 116, the conveyor system may move past the inspected die container (e.g., no defects detected in operation 110) to a pass-out station. In certain embodiments, a conveyor system at the output station may interact with an automated material handling system to move the die container out of the through output station.

At operation 118, the conveyor system may move the die container that failed inspection (e.g., has a defect detected in operation 110) to a failed output station. In certain embodiments, a conveyor system at the non-passing output station may interact with the automated material handling system to remove the die container from the non-passing output station.

Fig. 1B is a block diagram of various functional modules of the integrated semiconductor die container workstation functional module 150 according to some embodiments. The integrated semiconductor die container workstation function module 150 may be part of an integrated semiconductor die container workstation. The integrated semiconductor die container workstation function module 150 may include a processor 154. In further embodiments, the processor 154 may be implemented with one or more processors.

The processor 154 may be operatively connected to a computer-readable storage module 156 (e.g., memory and/or data storage), a network connection module 158, a user interface module 160, a controller module 162, and a sensor module 164. In some embodiments, computer-readable storage module 156 may include logic that may configure processor 154 to perform various processes discussed herein. The computer-readable storage module may also store data such as sensor data collected by an image sensor of the inspection station, image data for identifying defects, identification codes for dies, identification codes for die containers, identification codes for sensors, and any other parameters or information that may be used to perform the various processes discussed herein.

The network connection module 158 may facilitate network connection of the integrated semiconductor die container workstation with various devices and/or components of the workstation to enable communication within or with the outside of the integrated semiconductor die container workstation function module 150. In certain embodiments, the network connection module 158 may facilitate a physical connection, such as a wire or bus. In other embodiments, the network connection module 158 may facilitate wireless connectivity through the use of transmitters, receivers, and/or transceivers, such as via a Wireless Local Area Network (WLAN). For example, network connection module 158 may facilitate wireless or wired connections to various portions of the integrated semiconductor die container workstation.

The integrated semiconductor die container workstation function module 150 may also include a user interface module 160. The user interface module 160 may include any type of interface for an operator to input and/or output to the integrated semiconductor die container workstation, including but not limited to a display, laptop, tablet, or mobile device, etc.

The integrated semiconductor die container workstation function module 150 may include a controller module 162. In certain embodiments, the controller module 162 may be implemented as (e.g., as part of) the processor 154. The controller module 162 may be configured to control various physical devices, such as a conveyor system, that may control the movement or function of the integrated semiconductor die container workstation. For example, the controller module 162 may be configured to control movement or function of at least one of a conveyor belt, a robotic arm, and the like. For example, the controller module 162 may control a motor that may move at least one of the conveyor belt and/or the robot arm. The controller module 162 may be controlled by the processor 154 and may perform various aspects of the various processes discussed herein.

The integrated semiconductor die container workstation function module 150 may include a sensor module 164. Sensor module 164 may represent a sensor configured to collect sensor data that may be used to inspect defects and/or die container lids. For example, the sensor module 164 may represent a die container lid sensor configured to inspect the die container lid for the presence and/or an inspection sensor (e.g., an image sensor of an inspection station) configured to inspect the die container for defects.

Fig. 2A is a diagram of an integrated semiconductor die container workstation 200 according to some embodiments. The integrated semiconductor die container workstation 200 may include a plurality of stations 202 and 222 connected via a conveyor system 226. The conveyor system 226 may describe automated interconnections at and between the stations 202-222 to bring the die container 228 to the stations 202-222 and/or to remove the die container 228 from the stations 202-222. In some embodiments, the conveyor system may convey the die container 228 via a conveyor belt configured to receive the die container at one station and move the die container to receive (e.g., process) at another station. The conveyor belt may represent any physical device configured to move substantially laterally, such as a conveyor belt having rollers and pulleys, through which the die container may be conveyed. For example, the conveyor system 226 may sequentially connect the load port station 202, the unload station 208, the clean station 210, the dry station 212, the inspection station 216, the assembly station 218, and either the pass out station 220 or the fail out station 222. Each station may be a fixed point or location for processing the die container 228 during processing by the semiconductor die container workstation 200, from the initial load port station 202 to the final pass-out station or fail-out station 222. For emphasis, the die container 228 is shown in various positions as the die container 228 is moved along the semiconductor die container workstation 200 in the direction of the arrow that overlaps the die container 228. Further, the automated material handling system 230 may be configured to move the die container to and/or from the initial load port station 202, the final pass out station 220, and/or the final fail out station 222. The automated material handling system 230 may include, for example, robotic arms, automated navigation vehicles, and/or any other mechanism for manipulating and moving the die containers at the initial load port station 202, the final pass out station 220, and/or the fail out station 222.

Thus, the integrated semiconductor die container workstation may provide an integrated platform in which each station is connected to another station in an automated fashion. The die container need only be brought to the load port station of the integrated semiconductor die container workstation for processing. The die containers can then be disassembled, cleaned, dried, inspected, reassembled, and sorted (e.g., via placement in pass-out station 220 and/or fail-out station 222) for shipment from the integrated semiconductor die container workstation, all without requiring manual or human intervention by an operator of the semiconductor die container processing workstation.

In various embodiments, the load port station 202 may be an entry point to the semiconductor die container workstation 200. This access point may be configured to interface with, for example, an automated material processing system 230 or may manually process (e.g., position) the die container 228 to the load port station 202.

In various embodiments, the load port station may interface with the conveyor system 226 of the integrated semiconductor die container workstation 200. The conveyor system may be an automated system for moving the die containers within the integrated semiconductor die container workstation 200 between the stations 202-222. For example, the conveyor system 226 may include various conveyor belts. These conveyor belts may be arranged to interconnect the work stations 202-222 so that the grain containers may travel along the path provided by the conveyor belts. In certain embodiments, conveyor system 226 may include a robotic arm that can move a die container and/or a portion of a die container to and from a conveyor belt and a workstation, and/or from a workstation to an automated material handling system.

In some embodiments, the conveyor belt may be comprised of a plurality of links such that openings in the conveyor belt allow access to the underside of objects being conveyed by the conveyor belt. In other embodiments, the conveyor belt may contact the underside of some, but not all, of the objects being conveyed by the conveyor belt. For example, the conveyor belt may contact the sides of the die container 228 to move the die container 228.

The conveyor system 226 may carry the die container 228 from the load port station 202 to the unload station 208. The disassembly station 208 may be configured to disassemble the die container 228 for cleaning and inspection as needed. As described above, the die container 228, which is a jig, may include a cover in addition to the bottom plate. The lid may form the top of the die container so that a die loaded in a receptacle of the base plate may be secured to the die container by having the lid over the base plate.

Thus, in certain embodiments, the disassembly station 208 may remove the cover from the base plate so that the base plate may be separated from the cover for inspection and cleaning. The cover may be removed from the base plate in various ways. For example, a suction tube may be configured via a manipulator (e.g., suction tube) or other structure to provide selective suction to localized areas to remove the lid from the base plate. The removed lids may then be placed on a conveyor system for further processing. For example, the removed lids may be placed on a conveyor system adjacent the base plate to be transported with the base plate.

In other embodiments, the removal station 208 may take no action if the die container 228 is not a fixture or has no lid other than a base plate. Thus, die containers 228 without lids or jigs may be processed through the disassembly station 208 without being processed at the disassembly station 208.

In various embodiments, the disassembly station 208 may be configured to handle some type of die container 228. For example, the conveyor system 226 may be configured at certain times to handle die containers 228 that are jigs (e.g., die containers having both a lid and a bottom plate), or at other times to handle die containers 228 that are boats or trays (e.g., die containers having only a bottom plate, which are boats or trays without lids). In various embodiments, the removal station 208 may include a die container lid sensor to determine whether the die container 228 is a jig, boat, or tray. For example, the removal station 208 may include a die container lid sensor that is a weight sensor configured to determine the weight of the boat, tray, or tool, such as a tool that is the first stage having the greatest weight and a boat or tray that is the second stage having a lesser weight. In other embodiments, the die container lid sensor may be an image sensor configured to obtain an image of the die container 228 to determine whether it is a fixture (e.g., with a lid) or a boat or tray (e.g., without a lid). A computer readable code or indicia on the die container (e.g., a die container identification code) can be read from the image of the die container and processed to determine if the die container has a lid (e.g., if it is a jig or boat/tray). Thus, based on the die container lid sensor, the docking station 208 may determine whether to handle the die container 228 as a jig (e.g., remove the lid), or as a boat or tray (e.g., no docking needs to be performed). As described above, the removed lids may be placed on a conveyor system adjacent the base plate to be transported with the base plate.

The conveyor system 226 may carry the die container 228 from the disassembly station 208 to the cleaning station 210. The cleaning station 210 may clean the floor and, if applicable, the lid of the die container 228. For example, the cleaning station 210 may apply a cleaning fluid (e.g., deionized water, air, or any liquid or gas) to the floor and, in some embodiments, the lid of the die container 228. The cleaning fluid may be applied from above and below the floor and, in some embodiments, the lid of the die container 228. The cleaning station 210 may also physically contact the base plate and, in some embodiments, the lid using brushes or other devices to clean the base plate and lid.

The conveyor system 226 may carry the die container 228 from the cleaning station 210 to the drying station 212. The drying station 212 may include applying a gas (e.g., a heated gas) to the die container to dry the die container. In certain embodiments, the gas may be heated to a temperature of about 60 degrees celsius to about 100 degrees celsius. The gas may be, for example, nitrogen (e.g., N) ₂) Or clean dry air. Alternatively, the gas may be applied from above and below the floor and, if applicable, the lid of die container 228. In some embodiments, a gas may be applied to the base plate and the lid to dry the die container.

A conveyor system 226 may carry the die container 228 from the drying station 212 to the inspection station 216. Inspection station 216 may be configured to inspect die container 228 for defects. For example, inspection station 216 may be configured to inspect die container 228 for defects, such as to confirm that die container 228 includes the correct dimensions (e.g., size and shape) and/or whether die container 228 has unexpected surface features or non-uniformities. In various embodiments, the inspection station can include an image sensor configured to obtain image data of the die container at a known (e.g., predetermined or expected) location on the die container. The image sensor may be, for example, an Automated Optical Inspection (AOI) image sensor and/or a line-point image sensor. As will be discussed further below, if a defect exists, a repair step may be performed, such as by moving the defective die container associated with the defect by conveyor system 226 to the failed output station 222 of the integrated semiconductor die container workstation 200 for repair. Alternatively, if no defects are detected, conveyor system 226 may move die container 228 through output station 220. In some embodiments, the inspection station may inspect the base plate and lid during inspection of the die container. In other embodiments, the inspection station may only inspect the base plate and not the lid during inspection of the die container.

In some embodiments, the check at the check station 216 may be to check whether the pins are 0.075 millimeters apart, whether a gasket is present on the die container, and/or whether there is less than 200 microns of warpage on the die container (e.g., along the base or lid) compared to the planar direction. In other words, a die container may be considered defective if the pins are not separated by about 0.075 millimeters, when no gasket is present on the die container, and/or if the warpage is up to or greater than 200 microns compared to the planar direction.

A conveyor system 226 may carry the die container 228 from the inspection station 216 to the assembly station 218. Assembly station 218 may be configured to assemble die container 228 as needed after inspection. As described above, the die container 228, which is a jig, may include a cover in addition to the bottom plate. A lid may cover the top of die container 228 such that a die loaded within a receptacle of the base plate is secured to die container 228 by having the lid over the base plate.

Thus, in certain embodiments, the assembly station 218 may place (e.g., replace) the lid atop the base plate so that the base plate may be assembled with the lid. The lid may be placed on the base plate in various ways. For example, the lid may be configured via a manipulator (e.g., suction tube) or other structure to provide selective suction to the lid to move the lid over the base and to position the lid on the base. As described above, the removed cover (e.g., removed at the disassembly station 208) may be placed on a conveyor system adjacent the base plate to be transported with the base plate to the assembly station 218. In some embodiments, the removed lid may also withstand.

In other embodiments, assembly station 218 may take no action if die container 228 is not a fixture or has no lid other than a base plate. Thus, die containers 228 without lids or jigs may pass through assembly station 218 without being processed at assembly station 218.

In some embodiments, assembly station 218 may obtain information from the processing of disassembly station 208 that characterizes whether the die container has a lid. For example, the indication of whether the die container has a lid may be noted (e.g., recorded) at the disassembly station and then transferred to the assembly station. As described above, the uncapped die container 228 may not be otherwise processed at the assembly station 218. However, the die container 228 with the lid may be assembled at the assembly station 218 (e.g., lid assembled on the base plate). In various embodiments, assembly station 218 may assemble the die container regardless of whether the die container passes or fails inspection.

The conveyor system 226 may move past the inspected die container 228 (e.g., no defects detected while being inspected at inspection station 216) to past the output station 220. In certain embodiments, the conveyor system 226 at the pass-through output station 220 may interact with the automated material handling system 230 to move the die container 228 out of the pass-through output station. Alternatively, the conveyor system 226 may move a die container 228 that fails inspection (e.g., detects a defect while being inspected at inspection station 216) to the fail output station 222. In certain embodiments, the conveyor system 226 at the non-passing output station may interact with the automated material handling system 230 to remove the die container 228 from the non-passing output station 222.

Fig. 2B is a perspective view of a processing station portion 250 of a semiconductor die container station according to some embodiments. The processing station portion 250 may include a disassembly station 208, a cleaning station 210, a drying station 212, an inspection station Automated Optical Inspection (AOI) image sensor station 216A, an inspection station line point image sensor 216B, and an assembly station 218.

Further, each of the stations 208 and 218 may be configured to move in a modular fashion. For example, each of the stations 208 and 210 may be on top of a base 254 that includes wheels 256 and leveler feet (leveler foot) 258. Wheels 256 may enable the station to move (e.g., rotate about the wheels). Also, the leveler feet 258 can be configured to secure the station in place as desired. For example, each of the leveler feet 258 and wheels 256 may be attached to the bottom of the base 254. The leveler foot may be configured to extend from the bottom of the base (e.g., via the threads of the swivel screw) to a height greater than the height of the wheel, thereby lifting the wheel off the ground and immovably securing the base to the ground. Alternatively, the leveler foot may be configured to extend from the bottom of the base (e.g., via the threads of the swivel screw) to a height less than the height of the wheel, such that the wheel may contact the ground, thereby allowing the base to be moved via rotational movement of the wheel contacting the ground.

In various embodiments, portions of the conveyor system may be located at each station. Thus, the stations can be aligned such that the parts of the conveyor system at the respective stations are sufficiently aligned to transport the grain containers from one station to another. Fig. 3 is an illustration of stations aligned with one another such that portions of a conveyor system can convey a die container from one station to another, according to some embodiments. As shown, the first station 302, the second station 304, and the third station 306 may be aligned such that the belts 310 of their respective conveyor systems are at the same level and close enough so that the grain containers 312 may be moved from one belt on one station to another belt on another station. In certain embodiments, the distance 320 between the stations may be about 10 millimeters, or about 1 millimeter to about 100 millimeters.

Fig. 4A is an illustration of a fixture 402 when assembled according to some embodiments. As mentioned above, the assembled jig 402 may be a seed container. The assembly fixture 402 may include a base 404 and a cover 406. The jig 402 is movable along a conveyor belt 420 of the conveyor system. The conveyor belt 420 (e.g., the belt of the conveyor belt 420) may include intermittent (endless) workpieces 421 that are flexibly strung together such that various openings 424 remain in the conveyor belt 420. As will be discussed further below, cleaning and/or drying the underside of the floor 404 may be facilitated via these openings 424. In certain embodiments, the guide pins 422 may be located on the sides of the backplane 404 to delineate (delithreaded) the location where the backplane is placed on the conveyor 420. In various embodiments, the guide pins may move with the conveyor belt 420 (e.g., in the direction of movement of the conveyor belt, such as from left to right). In some embodiments, the lid 406 may be disposed in place over the base 404 via structural interlocking features (not shown for simplicity of illustration) between the lid 406 and the base 404.

In a further embodiment, at least one manipulator 430 (shown in phantom because it is not part of fixture 402) may be utilized to move the lid from above the base. The manipulator 430 may be part of a disassembly station and/or an assembly station, and may contact and secure the lid 406 via a suction force at an end 432 of the manipulator 430, which may selectively affix the lid 406 to the manipulator 430 (e.g., via selective application of a suction force) such that the manipulator 430 may move the lid from the base plate 404.

Fig. 4B is an illustration of the fixture 402 when disassembled, according to some embodiments. When disassembled, the fixture 402 may be separated into its component parts (e.g., the cover 406 and the base 404) such that the cover 406 is not atop the base 404. In addition, both the lid and the base can be placed on a conveyor 420 for transport throughout the semiconductor die container station 200. As described above, the at least one manipulator 430 may be used to move the lid 406 from the top of the base 404 and back onto the top of the base 404, as desired, by selectively applying a suction force and movement of the at least one manipulator 430.

Fig. 5A is an illustration of how the cleaning station 502 performs cleaning according to some embodiments. The conveyor belt 504 of the conveyor system may pass through the cleaning station 502. A die container 508 (e.g., the floor of the die container 508) may be disposed on the conveyor 504 in the space between the guide pins 510 on the conveyor 504. As described above, in some embodiments, the guide pins 510 may be fixed with the conveyor belt 504 and may move with the conveyor belt 504.

As described above, the conveyor belt 504 may include intermittent workpieces 506 that are flexibly strung together such that various openings are maintained between the intermittent workpieces 506 in the conveyor belt 504. Thus, various nozzles and brushes can be disposed above and below the die container 508 (e.g., the floor of the die container 508) to clean the die container 508. In certain embodiments, the nozzle may be configured to dispense cleaning fluid with droplets having a diameter of less than 20 microns. Thus, in certain embodiments, the cleaning fluid droplets may also be configured to clean particles on the grains that are less than 20 microns in diameter. Also, the cleaning fluid may be discharged from the nozzle under pressure such that the cleaning fluid is sprayed (e.g., jetted) from the nozzle onto the die container 508. For example, the top side nozzle 520 may be configured to dispense a cleaning fluid (e.g., deionized water, air, or any liquid or gas) onto the top side 508A of the die container 508. In some embodiments, the cleaning fluid may be dispensed at an angle that is not perpendicular to topside 508A of die container 508. Also, the top side brushes 522A, 522B, 522C, 522D may be configured to perform cleaning on the top side 508A of the die receptacle 508 by mechanical contact of the bristles 524 of the top side brushes 522A, 522B, 522C, 522D. In various embodiments, the top-side brushes 522A, 522B, 522C, 522D may be configured to rotate in a clockwise or counterclockwise manner. For example, as the die container 508 moves within the cleaning station 502 along a direction of travel 528 (e.g., forward motion of the conveyor belt 504), each of the topside brushes 522A, 522B, 522C, 522D it encounters may be configured to rotate in alternating clockwise and counterclockwise directions. In some embodiments, the rotation may be up to or greater than 20 degrees before the single continuous motion stops. For example, the top-side brush 522A may be configured to rotate in a clockwise direction, the top-side brush 522B may be configured to rotate in a counterclockwise direction, the top-side brush 522C may be configured to rotate in a clockwise direction, and the top-side brush 522D may be configured to rotate in a counterclockwise direction.

In some embodiments, the bottom side nozzle 530 may be configured to dispense a cleaning fluid (e.g., deionized water, air, or any liquid or gas) onto the bottom side 508B of the die container 508. In certain embodiments, the nozzle may be configured to dispense cleaning fluid with droplets having a diameter of less than 20 microns. Thus, in certain embodiments, the cleaning fluid droplets may be configured to clean particles on the grains that are less than 20 microns in diameter. Also, the cleaning fluid may be discharged from the nozzle under pressure such that the cleaning fluid is sprayed (e.g., jetted) from the nozzle onto the die container 508. In some embodiments, the cleaning fluid may be dispensed at an angle that is not perpendicular to the bottom side 508B of the die container 508. Also, the bottom side brushes 532A, 532B, 532C, 532D may be configured to perform cleaning on the bottom side 508B of the die receptacle 508 by mechanical contact of the bristles 534 of the bottom side brushes 532A, 532B, 532C, 532D. In various embodiments, the bottom side brushes 532A, 532B, 532C, 532D may be configured to rotate in a clockwise or counterclockwise manner. For example, as the die container 508 moves within the cleaning station 502 along the direction of travel 528 (e.g., forward motion of the conveyor belt 504), each of the bottom side brushes 532A, 532B, 532C, 532D it encounters may be configured to rotate in alternating clockwise and counterclockwise directions. In some embodiments, the rotation may be up to or greater than 20 degrees before the single continuous motion stops. For example, the bottom side brush 532A may be configured to rotate in a clockwise direction, the bottom side brush 532B may be configured to rotate in a counterclockwise direction, the bottom side brush 532C may be configured to rotate in a clockwise direction, and the bottom side brush 532D may be configured to rotate in a counterclockwise direction.

Fig. 5B is an illustration of how the drying station 552 performs drying according to some embodiments. The conveyor belt 554 of the conveyor system may pass through a drying station 552. A die container 558 (e.g., the floor of the die container 558) can be disposed in a space on the conveyor belt 554 delineated by at least one guide pin 560 on the conveyor belt 554.

As described above, the conveyor belt 554 may include intermittent workpieces 556 that are flexibly strung together such that various openings are maintained between the intermittent workpieces 556 in the conveyor belt 554. In certain embodiments, the various openings may have different sizes (e.g., non-uniform). Accordingly, various gas nozzles may be disposed above and below die container 558 (e.g., the floor of die container 558) to dry die container 558. For example, the top side gas nozzles 570A-570D may be configured to dispense a dry gas (e.g., clean dry air or nitrogen (N) ₂) To top side 558A of die container 558. Also, the drying gas may be heated to a range of about 60 degrees celsius to about 100 degrees celsius. In certain embodiments, the drying gas may be dispensed at an angle that is not perpendicular to the top side 558A of the die container 558. For example, some of the top side gas nozzles 570A-570D that the die container 558 encounters may be configured to face left or right as it moves in the drying station 552 in the direction of travel 578 (e.g., forward movement of the conveyor belt 554). For example, the top side gas nozzles 570A may be configured to face at an angle to the left (e.g., configured to dispense gas along the top side 558A of the die container 558 in a left-angled direction), the top side gas nozzles 570B may be configured to face at an angle to the right (e.g., configured to dispense gas along the top side 558A of the die container 558 in a right-angled direction), and the top side gas nozzles 570C may be configured to face at an angle to the left (e.g., configured to face along the die container 558 in a right-angled direction), and the top side gas nozzles 570C may be configured to face at an angleTop side 558A of container 558 dispenses gas in a left angled direction), and top side gas nozzle 570D may be configured to face to the left at an angle (e.g., configured to dispense gas in a left angled direction along top side 558A of die container 558).

In certain embodiments, the bottom side gas nozzles 580A-580D may be configured to inject a dry gas (e.g., clean dry air or nitrogen (N) ₂) Is dispensed onto bottom side 558B of die container 558. In some embodiments, the drying gas may be dispensed at an angle that is not perpendicular to the bottom side 558B of the die container 558. For example, some of the bottom side gas nozzles 580A-580D that it encounters may be configured to face left or right as the die container 558 moves in the drying station 552 in the direction of travel 578 (e.g., forward movement of the conveyor belt 554). For example, bottom side gas nozzles 580A may be configured to face at an angle to the left (e.g., configured to dispense gas along bottom side 558B of die container 558 in a left oblique direction), bottom side gas nozzles 580B may be configured to face at an angle to the right (e.g., configured to dispense gas along bottom side 558B of die container 558 in a right oblique direction), bottom side gas nozzles 580C may be configured to face at an angle to the left (e.g., configured to dispense gas along bottom side 558B of die container 558 in a left oblique direction), and bottom side gas nozzles 580D may be configured to face at an angle to the left (e.g., configured to dispense gas along bottom side 558B of die container 558 in a left oblique direction).

Fig. 6A is an illustration of an image sensor 600 configured to generate image data characterizing a bottom plate 602 of a die container, according to some embodiments. As described above, the bottom 602 of the die container may be the entire die container when the die container does not have a lid, or may be the bottom from which the lid is removed when the die container is a jig. In some embodiments, the image sensor 600 may be configured to obtain image data from the image sensor's field of view 604, which image data characterizes a portion of the base 602 that includes a concave receptacle 608 (e.g., a pocket) in which an individual die may be placed (e.g., housed). The dies may be further attached in place by selectively rotatable pin clips that contact the top surface of the die when the die rests on the bottom surface on the die container. The pin clip will be discussed further below in conjunction with fig. 7. Also, as will be discussed further below, the image data may be used to determine the distance between the individual pins. In particular embodiments, the die container may have 2 to 10 pins (e.g., dummy pins). In some embodiments, the image data may be used to determine whether the pins are not, for example, about 0.075 mm apart.

Fig. 6B is an illustration of a concave receptacle 608 having pins 640 according to some embodiments. As described above, in some embodiments, the distance 642 between the pins 640 may be measured using an image sensor. As shown, the distance 642 may traverse (cross) the corresponding pins on the opposite side of the female receptacle 608. For example, it can be determined whether the pins are spaced apart by a distance other than, for example, about 0.075 mm using image data generated by the image sensor. Further, as described above, the die container lid sensor may be an image sensor configured to obtain an image of the die container to determine whether it is a fixture (e.g., with a lid) or a boat or tray (e.g., without a lid). A computer readable code or indicia on the die container (e.g., a die container identification code such as a barcode (e.g., a one-dimensional barcode or a two-dimensional matrix barcode such as a QR code)) 643 may be read from an image of the die container and processed to determine whether the die container has a lid (e.g., whether it is a jig or boat/tray). Further discussion of the die container (e.g., the bottom plate of the die container) is provided below in conjunction with fig. 7.

Fig. 6C is an illustration of a line image sensor 650 configured to generate image data characterizing a bottom plate 652 of a die container, according to some embodiments. As described above, the bottom 652 of the die container may be the entire die container when the die container does not have a lid, or may be the bottom from which the lid is removed when the die container is a jig. In some embodiments, line image sensor 650 may be configured to obtain image data from the field of view of the image sensor in one dimension line 654, this image data characterizing a portion of the backplane including a concave receptacle 658 (e.g., a pocket) in which an individual die may be placed (e.g., housed). Line image sensor 650 may be configured to view along a one-dimensional line 654 of line image sensor 650 to determine whether warping or curvature variation is present. For example, line image sensor 650 may be part of a profilometer (e.g., a conventional profilometer including a Charged Coupled Device (CCD) or a complementary metal-oxide-semiconductor (CMOS) linear image sensor). In some embodiments, image data generated by line image sensor 650 may be used to determine whether the warpage of base 652 is equal to or greater than 200 microns as compared to the planar orientation. In some embodiments, line image sensor 650 may be configured to characterize or detect warpage or curvature changes of 200 microns or less compared to a planar direction.

Fig. 7 is a schematic diagram of a bottom plate 702 of a die container according to some embodiments. The base 702 may include a plurality of receptacles 704 in which dies may be placed. For example, there may be eight receptacles 704, as shown in the embodiment of FIG. 7. Each receptacle may be substantially rectangular in shape with additional protrusions along the square corners 706 of the respective receptacle 704. Optionally, each of the square corners 706 may be adjacent to a pin in which the pin supports 708A, 708B may be disposed. The pin supports 708A, 708B may be configured (e.g., rotated) to be secured at the pins and disposed on the die when the die is transported using the die container and removed from the die when the die is not transported using the die container. For example, pin support 708A (drawn in phantom) shows how pin support 708A is disposed over die 709 (drawn in phantom) when die container 702 is used to transport the die. Also, pin support 708B (drawn in phantom) illustrates how pin support 708B is not disposed on die 709 when die 709 is not shipped (e.g., removed from) using the die container. In some embodiments, the die container is not configured to hold a die while being processed by the integrated semiconductor die container workstation, so the pin supports 708 are not disposed on any die while being processed by the die container workstation. In various embodiments, the gasket may be an intermediate structure between two other structures on the die container. For example, the gasket may be an intermediate structure between the pin supports 708A, 708B and the backplane 702.

In certain embodiments, a seed container station is provided that includes a cleaning station, an inspection station, and a conveyor. The cleaning station is configured to clean a die container, wherein the die container is configured to hold a semiconductor die. The inspection station is configured to inspect the die container after cleaning to determine if the die container is identified as passing inspection. The conveyor is configured to move the die container between the cleaning station and the inspection station. In some embodiments, the conveyor is configured to move the die container to pass or not pass the exit based on whether the die container is identified as passing the inspection. In some embodiments, wherein the automated material handling system is interfaced with through an outlet. In some embodiments, wherein the die container is identified as passing inspection in response to a defect not being detected by the inspection station. In some embodiments, wherein the die container comprises a plurality of portions configured to be separated, wherein the workstation further comprises a disassembly station configured to separate the plurality of portions; and an assembly station configured to assemble the plurality of parts. In some embodiments, the die container station further comprises a drying station configured to dry the plurality of portions. In some embodiments, the conveyor is configured to move the die container from the disassembly station to the cleaning station, the drying station, the inspection station, and the assembly station.

In some embodiments, a system for handling a die container is provided that includes a die container and a workstation. The die container is configured to hold a semiconductor die. The workstation is configured to process the die container in an automated manner, and includes a cleaning station, an inspection station, and a conveyor. The cleaning station is configured to clean the die container. The inspection station is configured to inspect the die container after cleaning to determine if the die container is identified as passing inspection. The conveyor is configured to move the die container between the cleaning station and the inspection station, wherein the conveyor is configured to move the die container to a pass-through exit or a fail-through exit based on whether the die container is identified as passing the inspection. In some embodiments, wherein the inspection station is configured to inspect the die container for a distance between two legs on the die container. In some embodiments, wherein the conveyor is configured to move the die container out of the exit in response to the distance between the two pins being other than 0.075 millimeters. In some embodiments, wherein the inspection station is configured to inspect the die container for warpage. In some embodiments, wherein the conveyor is configured to move the die container out of the exit port in response to a warp on the die container reaching or greater than 200 microns. In some embodiments, wherein the cleaning station and the inspection station both include a plurality of wheels and are configured to be stationary when in use and to be moved using the plurality of wheels when not in use. In some embodiments, wherein the conveyor is a conveyor belt. In some embodiments, wherein the conveyor belt comprises a cleaning station portion and an inspection station portion that are physically separated from each other.

In certain embodiments, a method of processing a seed container is provided, comprising: receiving the die container at a cleaning station, the cleaning station configured to clean the die container; receiving the die container at an inspection station configured to inspect the die container after cleaning to determine if the die container is identified as passing inspection; moving the die container along a conveyor between a cleaning station and an inspection station, wherein the conveyor is configured to move the die container to a pass-through exit or a fail-through exit based on whether the die container is identified as passing the inspection. In some embodiments, the die container includes a plurality of die pockets each configured to receive a die. In some embodiments, each of the die pockets includes a recess configured to contact a die on the bottom surface; and at least one pin support configured to contact the die on a top surface opposite the bottom surface. In some embodiments, the method further comprises: in response to the distance between the two pins on the die container not being 0.075 mm, the die container is moved out of the exit. In some embodiments, the method further comprises moving the die container out of the exit port in response to warpage on the die container reaching or greater than 200 microns.

The foregoing outlines features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that the present disclosure may be readily utilized as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent configurations do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions and alterations herein without departing from the spirit and scope of the present disclosure.

As used herein, the term "module" may refer to software, firmware, hardware, or any combination of these elements configured to perform the specified function. Moreover, for purposes of discussion, the different modules are described as separate modules; however, it will be apparent to those skilled in the art that two or more modules may be combined to form a single module, and the single module may perform related functions according to embodiments of the present invention.

It will be further appreciated by those of skill in the art that any of the various illustrative logical blocks, modules, processors, means, circuits, methods, and functions described herein, in connection with the aspects of the disclosure, may be implemented as electronic hardware (e.g., digital, analog, or combinations thereof), firmware, program in various forms or design code containing instructions (which may be referred to herein, for convenience, as "software" or "software modules"), or combinations of any of these techniques. To clearly illustrate this interchangeability of hardware, firmware, and software, various illustrative components, blocks, modules, circuits, and steps have been described above generally in terms of their functionality. Whether such functionality is implemented as hardware, firmware, or software, or a combination of such technologies, depends upon the particular application and design constraints imposed on the overall system. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions do not depart from the scope of the present disclosure.

Moreover, those skilled in the art will appreciate that the various illustrative logical blocks, modules, devices, means, and circuits described herein may be implemented within or through an Integrated Circuit (IC), which may include a general purpose processor, a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), a Field Programmable Gate Array (FPGA), other programmable logic devices (FPGA), or any combination thereof. The logic blocks, modules, and circuits may further include antennas and/or transceivers to communicate with various components in a network or device. A general-purpose processor may be a microprocessor, but in the alternative, the processor may be any known processor, controller, or state machine. A processor may also be implemented as a combination of computing devices, e.g., a combination of a digital signal processor and a microprocessor, a plurality of microprocessors, one or more microprocessors in conjunction with a digital signal processor core, or any other suitable structure for performing the functions described herein.

Unless specifically stated otherwise, conditional language such as "may", "might", or "may" are generally understood in the context of this disclosure to convey that particular embodiments include particular features, elements, and/or steps, while other embodiments do not include particular features, elements, and/or steps. Thus, such conditional language is not generally intended to imply that features, elements, and/or steps of one or more embodiments are in any way required or that one or more embodiments necessarily include logic for decision making, with or without user input or actuation, whether or not such features, elements, and/or steps are included or are performed in any particular embodiment.

Further, after reading this disclosure, one skilled in the art would be able to configure the functional physics to perform the operations mentioned herein. As used herein, the term "configured" with respect to a particular operation or function may refer to a system, device, component, circuit, structure, machine, etc., that is physically or physically configured, programmed, and/or arranged to perform the particular operation or function.

Unless specifically stated otherwise, a term of choice (disjunction), such as at least one of the sentences "X, Y, Z," is generally understood in the context of being used to represent that an item, etc., can be one of X, Y, Z or any combination thereof (e.g., X, Y, and/or Z). Thus, such language selection is not generally intended, and should not imply that a particular embodiment requires at least one X, at least one Y, or at least one Z to occur.

It should be emphasized that many variations and modifications may be made to the above-described embodiments, and other known components in the acceptable examples. All such modifications and variations are intended to be included herein within the scope of this disclosure and protected by the following claims.

Claims (10)

1. A seed container workstation comprising:

a cleaning station configured to clean a die container, wherein the die container is configured to hold a semiconductor die;

an inspection station configured to inspect the die container after cleaning to determine whether the die container is identified as passing inspection; and

a conveyor configured to move the die container between the cleaning station and the inspection station.

2. A system for handling containers of crystalline particles, comprising

A die container configured to hold a semiconductor die;

a workstation configured to process the die container in an automated manner, the workstation comprising:

a cleaning station configured to clean the die container;

an inspection station configured to inspect the die container after cleaning to determine whether the die container is identified as passing inspection; and

a conveyor configured to move the die container between the cleaning station and the inspection station, wherein the conveyor is configured to move the die container to a pass-through exit or a fail-through exit based on whether the die container is identified as passing inspection.

3. The die container processing system of claim 2, wherein the inspection station is configured to inspect the die container for a distance between two pins on the die container.

4. The system of claim 3, wherein the conveyor is configured to move the die container to the non-pass-through exit in response to the distance between the two pins being other than 0.075 millimeters.

5. The die container handling system of claim 2, wherein the inspection station is configured to inspect the die container for warpage.

6. The die container handling system of claim 5, wherein the conveyor is configured to move the die container to the non-pass-through outlet in response to the warpage on the die container reaching 200 microns or greater than 200 microns.

7. The die container processing system of claim 2, wherein the cleaning station and the inspection station both include wheels and are configured to be stationary when in use and to move using the wheels when not in use.

8. A method of seed container processing, comprising:

receiving a die container at a cleaning station, the cleaning station configured to clean the die container;

receiving the die container at an inspection station configured to inspect the die container after cleaning to determine if the die container is identified as passing inspection; and

moving the die container along a conveyor between the cleaning station and the inspection station, wherein the conveyor is configured to move the die container to a pass-through exit or a fail-through exit based on whether the die container is identified as passing inspection.

9. The method of die container processing according to claim 8, wherein the die container comprises a plurality of die pockets each configured to receive a die.

10. A method of die container processing as claimed in claim 9, wherein each die pocket comprises:

a recess configured to contact the die on a bottom surface; and

at least one pin support configured to contact the die on a top surface opposite the bottom surface.

Images