CN110769602B - Copper-clad plate processing management system - Google Patents

Copper-clad plate processing management system Download PDF

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CN110769602B
CN110769602B CN201910951240.2A CN201910951240A CN110769602B CN 110769602 B CN110769602 B CN 110769602B CN 201910951240 A CN201910951240 A CN 201910951240A CN 110769602 B CN110769602 B CN 110769602B
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copper
clad plate
pressing
self
information
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CN110769602A (en
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黄锐平
邱醒亚
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Shenzhen Fastprint Circuit Tech Co Ltd
Guangzhou Fastprint Circuit Technology Co Ltd
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Shenzhen Fastprint Circuit Tech Co Ltd
Guangzhou Fastprint Circuit Technology Co Ltd
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16Inspection; Monitoring; Aligning
    • H05K2203/163Monitoring a manufacturing process

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention discloses a copper-clad plate processing management system, which comprises: the processor is used for judging whether the copper-clad plate data can be subjected to self-pressing or not, and if so, self-pressing order information is issued; if the judgment result is no, a purchase processing instruction is carried out; the drawing design unit is used for generating a copper-clad plate laminated structure drawing according to the self-pressure data; the process design unit is used for generating a manufacturing process according to the copper-clad plate lamination and generating cutting information; the cutting unit is used for cutting materials according to the cutting information so as to manufacture plates; the pressing unit is used for pressing the plate to manufacture the copper-clad plate; and the detection unit is used for detecting whether the copper-clad plate meets the requirements.

Description

Copper-clad plate processing management system
Technical Field
The invention relates to the field of copper-clad plate production, in particular to a copper-clad plate processing management system.
Background
The existing copper-clad plate has various materials involved in the manufacture, and the order manufacture process is unstable, so that the situations that the order is lack of materials or no materials are available for a feeding plate frequently occur. Due to the fact that the purchase period of the materials is too long, the delivery period of the order and the delivery experience of a client are seriously affected, the delivery period of the product is shortened for reducing the situation of order shortage, and the order shortage is reduced to a certain extent by optimizing self-pressure rules, processing flows and production parameters.
Disclosure of Invention
The present invention is directed to solving, at least to some extent, one of the technical problems in the related art. Therefore, the invention aims to provide a copper-clad plate processing management system.
The technical scheme adopted by the invention is as follows:
in a first aspect, the present invention provides a copper-clad plate processing management system, comprising: the processor is used for acquiring copper-clad plate data, judging whether the self-pressing can be carried out or not, and issuing self-pressing order information if the self-pressing order information can be judged to be the self-pressing order information; if the judgment result is no, a purchase processing instruction is carried out;
the drawing design unit is used for generating a drawing of the laminated structure of the copper-clad plate according to the self-pressure data;
the flow design unit is used for generating a manufacturing flow according to the drawing of the laminated structure of the self-pressing plate and generating cutting information;
the cutting unit is used for cutting materials according to the cutting information so as to manufacture plates;
the pressing unit is used for pressing the plate to manufacture the copper-clad plate;
and the detection unit is used for judging whether the copper-clad plate meets the requirements or not.
Further, the copper-clad plate data comprises impedance tolerance, the number of layers of the self-pressing plate and the copper-clad plate material.
Further, the autogenous pressure order information is the underfeed board information and the autogenous pressure prepreg information.
Further, the autogenous pressure order information is the underfeed board information and the autogenous pressure prepreg information.
Further, the short material plate information main comprises the thickness of the short material plate, the structure of the product, the thickness of the copper foil and the type of the copper foil.
Further, the cutting information comprises the glue content, the cutting size, the warp and weft directions, and the type, the thickness and the size of the copper foil.
Further, the cutting information comprises the glue content, the cutting size, the warp and weft directions, and the type, the thickness and the size of the copper foil.
Further, the detection unit detects whether the copper-clad plate meets the requirements, and comprises the step of detecting the lamination information of the copper-clad plate, wherein the lamination information comprises the configuration structure, the copper thickness, the type and the quantity of the copper foil.
The invention has the beneficial effects that: the invention reduces the number of the material shortage of the order to a certain extent and improves the satisfaction degree of the customer delivery period by optimizing the self-pressure rule, the processing flow and the production parameters.
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FIG. 1 shows a copper-clad plate processing management system according to an embodiment of the present invention.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
Prepregs, also known as "PP sheets", are one of the main materials in the production of multilayer boards, and mainly comprise resins and reinforcing materials, the reinforcing materials are classified into several types such as glass fiber cloth, paper base, composite materials, and the like, and most prepregs (bonding sheets) used for manufacturing multilayer circuit boards use glass fiber cloth as the reinforcing material.
The multilayer circuit board comprises a double-sided circuit board and a multilayer circuit board. The double-sided circuit board is provided with a medium layer in the middle and wiring layers on two sides. The multilayer board is a multilayer wiring layer, and a dielectric layer is arranged between every two layers and can be made very thin. The multilayer circuit board has at least three conductive layers, two of which are on the outer surface and the remaining one is incorporated in an insulating board. The electrical connections between them are usually made through plated-through holes in the cross-section of the circuit board.
Referring to fig. 1, fig. 1 is a processing management system for a copper-clad plate according to an embodiment of the present invention. As shown in fig. 1, a copper-clad plate processing management system includes: the processor is used for acquiring copper-clad plate data, judging whether the self-pressing can be carried out or not, and issuing self-pressing order information if the self-pressing order information can be judged to be the self-pressing order information; if the judgment result is no, a purchase processing instruction is carried out;
the drawing design unit is used for generating a drawing of the laminated structure of the copper-clad plate according to the self-pressure data;
the flow design unit is used for generating a manufacturing flow according to the drawing of the laminated structure of the self-pressing plate and generating cutting information;
the cutting unit is used for cutting according to the cutting information so as to manufacture the plate;
the pressing unit is used for pressing the plate to manufacture the copper-clad plate;
and the detection unit is used for detecting whether the copper-clad plate meets the requirements.
The copper-clad plate data comprises impedance tolerance, the number of layers of the self-pressing plate and the copper-clad plate material.
Autogenous press order information, starved plate information, and autogenous press prepreg information.
The short material plate information comprises the thickness of the short material plate, the structure of the product, the thickness of the copper foil and the type of the copper foil.
The cutting information comprises the glue content, the cutting size, the warp and weft directions, and the type, the thickness and the size of the copper foil.
The detection unit detects whether the copper-clad plate meets the requirements or not, and comprises the step of detecting the lamination information of the copper-clad plate, wherein the lamination information comprises the structure of the copper, the copper thickness, the type and the number of the copper foils.
The processor judges whether the copper clad laminate data can be subjected to self-pressing and needs to detect and judge the impedance tolerance, the number of layers of the self-pressing plate and the copper clad laminate material.
The logic for judging the impedance tolerance test is as follows, and judges whether the impedance tolerance requirement is smaller than that of a conventional product, wherein the conventional tolerance is as follows: if the impedance tolerance of 50ohm is less than +/-10%, the output result is that the self-pressing material can not be used, and a purchase processing instruction is output.
And the self-pressing order information comprises the material shortage plate information and the prepreg cutting information. The short material plate information main comprises the thickness of the short material plate, the structure of the product, the thickness of the copper foil and the type of the copper foil. The prepreg cutting information comprises the gel content, the cutting size, the warp and weft directions, and the type, the thickness and the size of the copper foil.
The detection unit detects whether the copper-clad plate meets the requirements, and the detection unit needs to detect the lamination information of the self-pressing plate, wherein the lamination information comprises the structure of the copper foil, the thickness of the copper foil, the type and the number of the copper foil.
In addition, the processor also needs to perform function check and appearance detection on the formed target copper-clad plate, if the product does not conform to the product which is checked and accepted according to the GJB-362 requirement, the processor outputs the result that the product cannot be made of the self-pressing material, and outputs a purchasing processing instruction.
The processor judges whether the self-pressing plate needs self-pressing partially, if so, the processor outputs a result that the self-pressing plate cannot be manufactured by self-pressing materials, and outputs a purchasing processing instruction.
And the processor judges the number of the orders generated by the self-pressing plate, presets an N value, judges whether the number of the orders is greater than N, and if so, outputs a result that the self-pressing material cannot be used for manufacturing and outputs a purchasing processing instruction.
And the processor judges the number of layers of the self-pressing plate and the conductor distance, if the number of layers of the self-pressing plate is more than or equal to 12 and the distance between the hole and the conductor is less than or equal to 6mil, if the judgment result is yes, the processor outputs the result that the self-pressing material cannot be used for manufacturing, and outputs a purchase processing instruction.
If the judgment result is yes, the processor outputs the result that the self-pressure material cannot be manufactured and outputs a purchase processing instruction.
And traversing the judgment process by the processor, and generating a self-pressure instruction and issuing self-pressure order information only when all judgment results are negative.
The selection of the thickness of the copper foil needs to be selected according to the defective specification, and the type of the self-pressing copper foil needs to be judged to be HTE, RTF or HVLP according to the specification information of the defective plate.
In addition, when judging whether the self-pressing is available, the processor also needs to judge according to the thickness, copper thickness and the configuration structure of the lack material plate by combining a self-pressing specification table;
TABLE 1
Figure BDA0002225784320000041
And when the judgment result is that the self-pressing is available and the prepregs and the copper foils with the corresponding specifications are stored, generating cutting information of the prepregs and the copper foils.
The cutting information comprises the information of the lack material plate and the information of the self-pressing prepreg, wherein the information comprises the thickness of the lack material plate, the structure of the joint, the thickness of the copper foil, the type of the copper foil, the model of the prepreg to be self-pressed, the glue content of the prepreg, the size of the joint and the required quantity. The specific pattern of the cutting information is shown in table 2.
TABLE 2
Figure BDA0002225784320000042
In addition, the copper-clad plate needs to be subjected to material control, and if the copper-clad plate is re-ordered and placed, the cutting unit firstly judges whether the plate is stored and preferentially uses the plate. When the inventory is insufficient, the cutting unit pre-calculates the number of the copper-clad plates capable of being produced by self-pressing. The cutting unit judges whether the self-pressure exists according to the preset delivery date, and if the self-pressure does not exist, a purchasing processing instruction is carried out; and if so, cutting according to the cutting information to manufacture the plate.
And the drawing design unit is used for generating a drawing of the copper-clad plate laminated structure according to the pressure data, and the processor issues the drawing design requirement to the drawing design unit. ,
when the laminated structure drawing is designed, a system generates a computer-aided manufacturing process, wherein the manufacturing process comprises the following steps: cutting material [ open prepreg → open copper foil ] → pressing copper clad laminate [ prearranged → arrange board → press ] → finished product warehouse [ warehouse in ]
The flows of prepreg opening, copper foil opening and copper-clad plate pressing are only limited to copper-clad plate selection, and other orders cannot be selected.
Filling copper-clad plate cutting process information: the system needs to indicate the type, the glue content, the cutting size, the warp and weft directions of the self-pressing plate, the type, the thickness, the size and other information of the copper foil.
To ensure that the thickness of the copper clad laminate meets the requirement, the dimensions of the self-pressing board and the copper foil are calculated according to the following rule, and the system calculates the required dimensions of the self-pressing board, for example, as shown in Table 3
TABLE 3
Book matching structure Prepreg oversized compared to the splice Copper foil increases size than whole makeup
1-3 prepregs The length and the short side are respectively increased by 0.5inch Each long and short side is increased by 2inch
4 pieces of or more than half-solidChemical sheet Each long and short side is increased by 2inch Each long and short side is enlarged by 5inch
Specific examples are as follows: the required dimension of the self-pressing plate is 16 x 18inch, the self-pressing plate (0.15mm thickness) of the structure 2 x 1080 is adopted, the indicator controls the semi-cured sheet plate to be cut, the target dimension information is 16.5 x 18.5inch, and the copper foil dimension is 18 x 20 inch.
When the self-pressing plate in the same batch has the structure of the original single prepreg and the original configuration of the plurality of prepregs, the indication information is filled according to the maximum increasing size.
For example: not only needs to press the prepreg with the thickness of 0.1mm and the thickness of 3313X 1 to prepare the structure, but also needs to press the prepreg with the thickness of 0.8mm and the thickness of 7628X 4 to prepare the structure, so that the prepreg is increased by 2 inches on one side when cutting, and the copper foil is increased by 5 inches on one side compared with the prepreg.
According to the design and manufacturing process of the self-pressing plate lamination, the thickness and the lamination information of the self-pressing theoretical plate are filled according to the relevant information of the pre-checked lamination, and when 3 or more prepregs are used in the lamination, the symmetry of the lamination is required to be ensured (the lamination sequence is required to be reflected by the lamination section diagram on the lamination process card). When the configuration of the self-pressing plate core is 2116X 1+ 7628X 4, 2 prepregs are placed at the positions close to the copper foils on the upper layer and the lower layer and are placed at the middle position; and selecting a pressing program according to the type of the prepreg, and indicating the copper-clad plate to select the pressing program in the system.
In addition, the cutting information needs to pay attention to a plurality of requirements:
1) during cutting, attention needs to be paid to the resin content and size of the prepreg, which are marked in the order work card, and the prepreg with other resin content cannot be used for replacing the prepreg, otherwise, the plate thickness is abnormal;
2) during cutting, the warp and weft directions of N are required to be consistent with the requirements;
3) during cutting, the copper foil type needs to be consistent with that of the order work card, and the copper foil type cannot be replaced with the order work card (HTE, RTF and HVLP copper foil).
Wherein the requirements for autogenous platen production and inspection include: 1) whether the lamination procedure in the copper-clad plate manufacturing process accords with the preset lamination information: the structure is matched (note: the sequence is not disordered), the copper thickness, the copper foil types and the number are pre-arranged, and a special self-pressing program indicated by a system is adopted for pressing, wherein the pressing program needs to calculate the pressure according to the actual size of the prepreg and the size of a press (a large press or a small press). 2) And after lamination is finished, the self-pressed plate is self-inspected by a lamination process according to lamination specifications, and the self-pressed plate comprises plate surface quality and plate thickness.
In addition, the quality of the board surface of the self-pressing board needs to be detected, and the detection types comprise whether the board surface has scratches, pits, adhesive residues and the like. If the board surface has residual glue, conveying the self-pressing board to a copper process for removing the glue; the thickness part of the self-pressing plate is checked by a long-arm thickness measuring instrument, each order randomly measures 2 blocks (when the number of the blocks is less than or equal to 2 blocks, the whole order is measured), a 5-point method (4 points on the plate edge and 1 point in the center) is adopted for measurement (the distance between the test point of the plate edge and the plate edge is more than or equal to 1inch), whether the copper-clad plate meets the requirement is judged according to the IPC-4101C/M standard, and corresponding thickness data is recorded.
After the self-inspection is passed, the self-pressing plate is transferred to the next process, and meanwhile, the final inspection process is used for inspecting the plate thickness, the copper thickness and the plate surface quality of the copper-clad plate (such as scratches, pits, adhesive residues and the like);
the copper-clad plate is taken out from a central warehouse after entering a finished product warehouse, edges are cut by a cutting process according to the required core plate size, and the sizes of the edges cut from the upper edge, the lower edge, the left edge and the right edge are approximately equal when the edges are cut (if the sizes of the jointed boards are 16 × 18inch, and the sizes of the prepreg cut are 17 × 19inch, the edges are cut while the edges are cut, the edges are respectively cut to remove about 0.5inch of gummosis edges).
When the copper-clad plate is used in the cutting process, the information of the thickness, the quantity and the like of the copper foil needs to be checked according to the conventional process, and the plate is dried after cutting according to the standard requirement.
The method is optimized and corrected according to the pressing thickness of the self-pressing plate, and the type and related information of the self-pressing material can be increased according to the order requirement.
The cutting unit is used for cutting prepregs and copper foils. Therefore, the cutting information comprises prepreg cutting information and copper foil cutting information. The prepreg cutting information comprises the type, the glue content, the size, the warp and weft directions and the like of the prepreg, and the copper foil cutting information comprises the type, the thickness, the size and the like of the copper foil.
The process of pressing the plate by the pressing unit comprises a plurality of steps including pre-arranging, arranging and pressing.
An impedance tolerance identification method comprises the following steps: the impedance of the self-pressing plate is detected by the detection device, and an impedance tolerance, such as an impedance tolerance, is calculated.
While the preferred embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (6)

1. The copper-clad plate processing management system is characterized by comprising: the processor is used for judging whether the copper-clad plate data can be subjected to self-pressing or not, and if so, self-pressing order information is issued; if the judgment result is no, a purchase processing instruction is carried out;
the drawing design unit is used for generating a copper-clad plate laminated structure drawing according to the self-pressure data;
the process design unit is used for generating a manufacturing process according to the copper-clad plate lamination and generating cutting information;
the cutting unit is used for cutting materials according to the cutting information so as to manufacture plates;
the pressing unit is used for pressing the plate to manufacture the copper-clad plate;
the detection unit is used for detecting whether the copper-clad plate meets the requirements or not;
the copper-clad plate data comprises impedance tolerance, the number of self-pressing plate layers and a copper-clad plate material.
2. The copper-clad plate processing management system of claim 1, wherein the autogenous pressure order information comprises starved plate information and autogenous pressure prepreg information.
3. The copper-clad plate processing management system of claim 2, wherein the material shortage information comprises material shortage thickness, basic structure, copper foil thickness, and copper foil type.
4. The copper-clad plate processing management system of claim 1, wherein the cutting information comprises gel content, cutting size, warp and weft directions, and type, thickness and size of copper foil.
5. The copper-clad plate processing management system of claim 1, wherein the detection unit detects whether the copper-clad plate meets the requirements, including detection of lamination information of the copper-clad plate, wherein the lamination information includes a configuration structure, copper thickness, copper foil type and number.
6. A computer-readable storage medium, on which a computer program is stored, wherein the program, when executed by a processor, implements the steps of the copper-clad plate processing management system of any one of claims 1 to 5.
CN201910951240.2A 2019-10-08 2019-10-08 Copper-clad plate processing management system Active CN110769602B (en)

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CN103077432A (en) * 2011-10-26 2013-05-01 周增涛 Printed circuit board (PCB) production management system
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