CN108684150B - Hole limit calculation method and system for printed circuit board drilling - Google Patents
Hole limit calculation method and system for printed circuit board drilling Download PDFInfo
- Publication number
- CN108684150B CN108684150B CN201811012613.1A CN201811012613A CN108684150B CN 108684150 B CN108684150 B CN 108684150B CN 201811012613 A CN201811012613 A CN 201811012613A CN 108684150 B CN108684150 B CN 108684150B
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- circuit board
- laminated structure
- ith
- obtaining
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
The invention relates to a hole limit calculation method and a hole limit calculation system for printed circuit board drilling. The hole limit S and the comprehensive hardness H are expressed by establishing a mathematical modelPCBMaximum wear VmaxIn which the combined hardness HPCBOnly the corresponding parameters of the laminated structure of the printed circuit board are required to be obtained and calculated according to a formula, and the maximum abrasion loss V is obtainedmaxMay also be obtained by testing. Then the comprehensive hardness H is adjustedPCBMaximum wear VmaxThe numerical value is substituted into the mathematical model, and the hole limit S can be calculated. The hole limit calculation method and the hole limit calculation system for the printed circuit board drilling can quickly and accurately determine the hole limit of the drilling, can ensure the quality of the hole wall of the machined hole, can reduce the production cost, and have great application value to actual production.
Description
Technical Field
The invention relates to the technical field of printed circuit board processing, in particular to a hole limit calculation method and system for printed circuit board drilling.
Background
As electronic products tend to be highly intelligent and multifunctional, printed circuit boards (also called PCBs) used as devices and signal transmission carriers also tend to be multilayered and highly heat-dissipating. The number of layers, the thickness and the copper thickness of the printed circuit board are continuously increased, and higher requirements are also put forward on the processing technology of the printed circuit board. For drilling of the printed circuit board, the influence of the laminated structure of the printed circuit board on the quality of the drilled hole is large, and it is generally difficult to determine appropriate processing parameters based on the laminated structure condition of the printed circuit board, especially for manufacturers of various printed circuit boards with small batch.
When the hole limit of a drill hole (also called as a service life parameter of a drill cutter, which represents the limit drilling times of the drill cutter) is determined, the hole limit is usually determined by testing a test board with a certain number of layers, thickness and copper thickness. However, when the thickness and copper thickness of the actual printed circuit board laminated structure are greatly different from those of the test board, if the hole limit obtained by the conventional method is still used as the processing basis, the quality of the hole wall of the processed hole is reduced or the production cost is increased. For example, when the thickness of the actual printed circuit board lamination is larger than the thickness of the test board, the wear is too large to cut sharply when the drill is not used to the set hole limit, the copper foil, the resin and the glass fiber cloth are extruded and pulled, and the secondary cutting edge loses the effect of trimming the hole wall at right angles, so that the quality problems of halo, thick hole, nail head and the like are easily generated. When the thickness of the actual printed circuit board laminated structure is smaller than that of the test board, the drill tool can still continuously process the processing hole meeting the hole wall quality requirement when the drill tool is used to the set hole limit, and if the drill tool is not used at the moment, the waste of the production cost can be caused.
Disclosure of Invention
Therefore, it is necessary to provide a hole limit calculation method and system for drilling a printed circuit board, which can solve the problem that when the thickness and copper thickness of the actual printed circuit board laminated structure are greatly different from those of the test board, if the hole limit obtained by the conventional method is still used as the processing basis, the quality of the hole wall of the processed hole is reduced or the production cost is increased.
A hole limit calculation method for printed circuit board drilling comprises the following steps:
inquiring the laminated structure of the printed circuit board;
obtaining the number n of core plates in the laminated structure of the printed circuit board1Obtaining the number n of copper foils in the laminated structure of the printed circuit board2Obtaining the number n of prepregs in the laminated structure of the printed circuit board3Obtaining the hardness H of the ith core board in the laminated structure of the printed circuit board after removing the outer layer copper foil1iObtaining the hardness H of the glass fiber cloth of the ith core plate in the laminated structure of the printed circuit board2iObtaining the hardness H of the ith layer of copper foil in the laminated structure of the printed circuit board3iObtaining the hardness H of the cured ith prepreg in the laminated structure of the printed circuit board4iObtaining the hardness H of the glass fiber cloth of the ith prepreg in the laminated structure of the printed circuit board5iObtained byTaking the thickness h of the ith core board in the laminated structure of the printed circuit board after removing the outer layer copper foil1iObtaining the thickness h of the glass fiber cloth of the ith core plate in the laminated structure of the printed circuit board2iObtaining the thickness h of the ith layer of copper foil in the laminated structure of the printed circuit board3iObtaining the thickness h of the cured ith prepreg in the laminated structure of the printed circuit board4iObtaining the thickness h of the glass fiber cloth of the ith prepreg in the laminated structure of the printed circuit board5i；
Calculating the comprehensive hardness H of the laminated structure of the printed circuit board according to the following formulaPCB：
Obtaining the maximum abrasion loss V under the condition that the drill bit can still process the processed hole meeting the hole wall quality requirementmax；
The pore limit S is calculated according to the following mathematical model:
wherein k is1＝(0.95～1.05)×0.0141，k2＝(0.95～1.05)×0.000333，k3＝(0.95～1.05)×0.001257，k4＝(0.95～1.05)×0.316，k5＝(0.95～1.05)×35.53，k6＝(0.95～1.05)×0.011，k7＝(0.95～1.05)×0.038，Hmax＝(0.95～1.05)×275，h1iIn units of mm, h2iIn units of mm, h3iIn units of mm, h4iIn units of mm, h5iIn units of mm, HPCBIs in units of HV, HmaxThe unit of (d) is HV.
The hole limit calculation method for the drilling of the printed circuit board expresses the hole limit S and the comprehensive hardness H by establishing a mathematical modelPCBMaximum wear VmaxIn which the combined hardness HPCBOnly the corresponding parameters of the laminated structure of the printed circuit board are acquired and calculated according to a formula, and the maximum abrasion is obtainedQuantity VmaxMay also be obtained by testing. Then the comprehensive hardness H is adjustedPCBMaximum wear VmaxThe numerical value is substituted into the mathematical model, and the hole limit S can be calculated. The hole limit calculation method for the printed circuit board drilling can quickly and accurately determine the hole limit of the drilling, can ensure the quality of the hole wall of the machined hole, can reduce the production cost, and has great application value to actual production.
In one embodiment, the hardness H of the ith core board in the laminated structure of the printed circuit board after removing the outer copper foil is obtained1iThe method specifically comprises the following steps:
providing a core plate sample consistent with the ith core plate type;
etching to remove the outer copper foil of the core plate sample;
measuring the hardness value of the core plate sample after removing the outer copper foil by adopting a microhardness meter as H1i。
Providing a core plate sample with the same type as the ith core plate, and measuring the hardness value of the core plate sample after removing the outer copper foil by using a microhardness meter to obtain the hardness value H1iTherefore, the accuracy of the result is ensured, and the convenience of operation is improved.
In one embodiment, the hardness H of the glass fiber cloth of the ith core plate in the laminated structure of the printed circuit board is obtained2iThe method specifically comprises the following steps:
providing a glass fiber cloth sample corresponding to the ith core plate;
measuring the hardness value of the glass fiber cloth sample by adopting a microhardness meter as H2i。
Providing a glass fiber cloth sample corresponding to the ith core plate, and measuring the hardness value of the glass fiber cloth sample by using a microhardness meter as H2iTherefore, the accuracy of the result is ensured, and the convenience of operation is improved.
In one embodiment, the hardness H of the ith copper foil in the laminated structure of the printed circuit board is obtained3iThe method specifically comprises the following steps:
providing a copper foil sample consistent with the type of the ith layer of copper foil;
measuring the hardness value of the copper foil sample by using a microhardness meter as H3i。
By providing a copper foil sample with the same type as the ith copper foil and measuring the hardness value of the copper foil sample by using a microhardness meter as H3iTherefore, the accuracy of the result is ensured, and the convenience of operation is improved.
In one embodiment, the hardness H of the cured ith prepreg in the laminated structure of the printed circuit board is obtained4iThe method specifically comprises the following steps:
providing a prepreg sample consistent with the i-th prepreg type;
measuring the hardness value of the cured prepreg sample by using a microhardness meter as H4i。
Providing a prepreg sample with the same type as the ith prepreg, and measuring the hardness value of the cured prepreg sample by using a microhardness meter as H4iTherefore, the accuracy of the result is ensured, and the convenience of operation is improved.
In one embodiment, the hardness H of the glass fiber cloth of the ith prepreg in the laminated structure of the printed circuit board is obtained5iThe method specifically comprises the following steps:
providing a glass fiber cloth sample corresponding to the ith prepreg;
measuring the hardness value of the glass fiber cloth sample by adopting a microhardness meter as H5i。
The hardness value of the glass fiber cloth sample is measured as H by providing the glass fiber cloth sample corresponding to the ith prepreg and adopting a microhardness meter5iTherefore, the accuracy of the result is ensured, and the convenience of operation is improved.
In one embodiment, k1＝0.0141，k2＝0.000333，k3＝0.001257，k4＝0.316，k5＝35.53，k6＝0.011，k7＝0.038，Hmax275. The hole limit S and the comprehensive hardness H calculated by adopting the parametersPCBMaximum amount of wearVmaxThe relationship between them is more accurate.
In one embodiment, the maximum abrasion loss V of the drill bit can still process a processed hole meeting the quality requirement of the hole wallmaxThe method specifically comprises the following steps:
providing a test board;
drilling the test board by using a drill;
testing the abrasion loss of the drill under different set hole limits and the hole wall quality of the machined hole corresponding to the abrasion loss;
determining the maximum abrasion loss V according to the quality requirement of the hole wall of the machined holemax。
When drilling parameters (the rotating speed of the drill cutter, the feeding speed of the drill cutter and the retracting speed of the drill cutter) are fixed, the hole wall quality of a machined hole machined by the drill cutter is basically influenced only by the abrasion loss, and the maximum abrasion loss V of the drill cutter can be quickly and accurately determined by testing the abrasion loss of the drill cutter under different set hole limits and the hole wall quality of the machined hole corresponding to the abrasion loss and screening the corresponding abrasion loss meeting the hole wall quality requirement of the machined holemax。
In one embodiment, when the drill is used to drill the test board, the rotation speed of the drill is 80-120 krpm, the feeding speed of the drill is 20-30 mm/s, and the retracting speed of the drill is 80-120 mm/s. The test board is drilled by adopting the parameters, the wear loss of the drill cutter obtained by testing under different set hole limits is changed stably, and the maximum wear loss V of the drill cutter is screened out favorablymax。
A system for realizing the hole limit calculation method for the drilling of the printed circuit board comprises the following steps:
a parameter acquisition module for acquiring the number n of core plates in the laminated structure of the printed circuit board1Obtaining the number n of copper foils in the laminated structure of the printed circuit board2Obtaining the number n of prepregs in the laminated structure of the printed circuit board3Obtaining the hardness H of the ith core board in the laminated structure of the printed circuit board after removing the outer layer copper foil1iObtaining the hardness H of the glass fiber cloth of the ith core plate in the laminated structure of the printed circuit board2iObtaining the hardness H of the ith layer of copper foil in the laminated structure of the printed circuit board3iObtaining the hardness H of the cured ith prepreg in the laminated structure of the printed circuit board4iObtaining the hardness H of the glass fiber cloth of the ith prepreg in the laminated structure of the printed circuit board5iObtaining the thickness h of the ith core board in the laminated structure of the printed circuit board after the outer layer copper foil is removed1iObtaining the thickness h of the glass fiber cloth of the ith core plate in the laminated structure of the printed circuit board2iObtaining the thickness h of the ith layer of copper foil in the laminated structure of the printed circuit board3iObtaining the thickness h of the cured ith prepreg in the laminated structure of the printed circuit board4iObtaining the thickness h of the glass fiber cloth of the ith prepreg in the laminated structure of the printed circuit board5i(ii) a And is also used for obtaining the maximum abrasion loss V under the condition that the drill bit can still process the processed hole meeting the hole wall quality requirementmax；
A result operation module for substituting the parameters into the following formula to calculate the comprehensive hardness H of the laminated structure of the printed circuit boardPCB：
And the method is also used for substituting the parameters into the following mathematical model to calculate the hole limit S:
the hole limit calculation system for the drilling of the printed circuit board obtains the comprehensive hardness H by obtaining the corresponding parameters of the laminated structure of the printed circuit board and calculating according to a formulaPCBAnd then by combining the overall hardness HPCBMaximum wear VmaxThe numerical value is substituted into the mathematical model, and the hole limit S can be calculated. The hole limit calculation system for the drilling of the printed circuit board can quickly and accurately determine the hole limit of the drilling, can ensure the hole wall quality of a machined hole, can reduce the production cost, and has a great application value to actual production.
Drawings
Fig. 1 is a schematic flow chart of a method for calculating a hole limit of a printed circuit board drilling hole according to an embodiment of the present invention.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1, in an embodiment, a method for calculating a hole limit of a printed circuit board drilling hole is provided, including the following steps:
s100: inquiring the laminated structure of the printed circuit board;
s200: obtaining the number n of core plates in the laminated structure of the printed circuit board1Obtaining the number n of copper foils in the laminated structure of the printed circuit board2Obtaining the number n of prepregs in the laminated structure of the printed circuit board3Obtaining a printed circuit board laminateIn the structure, the hardness H of the ith core board after the outer layer copper foil is removed1iObtaining the hardness H of the glass fiber cloth of the ith core plate in the laminated structure of the printed circuit board2iObtaining the hardness H of the ith layer of copper foil in the laminated structure of the printed circuit board3iObtaining the hardness H of the cured ith prepreg in the laminated structure of the printed circuit board4iObtaining the hardness H of the glass fiber cloth of the ith prepreg in the laminated structure of the printed circuit board5iObtaining the thickness h of the ith core board in the laminated structure of the printed circuit board after the outer layer copper foil is removed1iObtaining the thickness h of the glass fiber cloth of the ith core plate in the laminated structure of the printed circuit board2iObtaining the thickness h of the ith layer of copper foil in the laminated structure of the printed circuit board3iObtaining the thickness h of the cured ith prepreg in the laminated structure of the printed circuit board4iObtaining the thickness h of the glass fiber cloth of the ith prepreg in the laminated structure of the printed circuit board5i；
S300: calculating the comprehensive hardness H of the laminated structure of the printed circuit board according to the following formulaPCB：
S400: obtaining the maximum abrasion loss V under the condition that the drill bit can still process the processed hole meeting the hole wall quality requirementmax；
S500: the pore limit S is calculated according to the following mathematical model:
wherein k is1＝(0.95～1.05)×0.0141，k2＝(0.95～1.05)×0.000333，k3＝(0.95～1.05)×0.001257，k4＝(0.95～1.05)×0.316，k5＝(0.95～1.05)×35.53，k6＝(0.95～1.05)×0.011，k7＝(0.95～1.05)×0.038，Hmax＝(0.95～1.05)×275，h1iIn units of mm, h2iIn units of mm, h3iIn units of mm, h4iIs in mm，h5iIn units of mm, HPCBIs in units of HV, HmaxThe unit of (d) is HV.
The hole limit calculation method for the drilling of the printed circuit board expresses the hole limit S and the comprehensive hardness H by establishing a mathematical modelPCBMaximum wear VmaxIn which the combined hardness HPCBOnly the corresponding parameters of the laminated structure of the printed circuit board are required to be obtained and calculated according to a formula, and the maximum abrasion loss V is obtainedmaxMay also be obtained by testing. Then the comprehensive hardness H is adjustedPCBMaximum wear VmaxThe numerical value is substituted into the mathematical model, and the hole limit S can be calculated. The hole limit calculation method for the printed circuit board drilling can quickly and accurately determine the hole limit of the drilling, can ensure the quality of the hole wall of the machined hole, can reduce the production cost, and has great application value to actual production.
It should be noted that there is no front-back order relationship between S400 and S200 and S300, that is, S400 may be executed first and then S200 and S300 may be executed, or S200 and S300 may be executed first and then S400 may be executed.
Generally, when the materials used for the layers in the printed circuit board are the same, the hardness H of each core board after removing the outer copper foil is high1iEqual, hardness H of glass fiber cloth of each core board2iAnd also equal, hardness H of each copper foil3iAnd also equal, hardness H of each semi-cured sheet4iAnd equal, hardness H of glass fiber cloth of each semi-cured sheet5iAnd are also equal. Accordingly, the comprehensive hardness HPCBThe calculation formula of (2) can be simplified as:
wherein the content of the first and second substances,
it should be noted that, Σ represents a summation operation, (0.95 to 1.05) means that it can be varied in a floating manner within a range of 0.95 to 1.05, and for example, it may be 0.95, 0.98, 0.985, 0.99, 1, 1.01, 1.02, 1.05, etc.
Preferably, k is1＝0.0141，k2＝0.000333，k3＝0.001257，k4＝0.316，k5＝35.53，k6＝0.011，k7＝0.038，Hmax275. The hole limit S and the comprehensive hardness H calculated by adopting the parametersPCBMaximum wear VmaxThe relationship between them is more accurate.
In S200, the number n of core boards in the laminated structure of the printed circuit board is obtained1Obtaining the number n of copper foils in the laminated structure of the printed circuit board2Obtaining the number n of prepregs in the laminated structure of the printed circuit board3And the method can be directly obtained according to the laminated structure of the printed circuit board.
In S200, acquiring the hardness H of the ith core board in the laminated structure of the printed circuit board after removing the outer copper foil1iThe method specifically comprises the following steps:
providing a core plate sample consistent with the ith core plate type;
etching to remove the outer copper foil of the core plate sample;
measuring the hardness value of the core plate sample after removing the outer copper foil by adopting a microhardness meter as H1i。
Providing a core plate sample with the same type as the ith core plate, and measuring the hardness value of the core plate sample after removing the outer copper foil by using a microhardness meter to obtain the hardness value H1iTherefore, the accuracy of the result is ensured, and the convenience of operation is improved.
In S200, acquiring the hardness H of the glass fiber cloth of the ith core board in the laminated structure of the printed circuit board2iThe method specifically comprises the following steps:
providing a glass fiber cloth sample corresponding to the ith core plate;
measuring the hardness value of the glass fiber cloth sample by adopting a microhardness meter as H2i。
Providing a glass fiber cloth sample corresponding to the ith core plate, and measuring the hardness value of the glass fiber cloth sample by using a microhardness meter as H2iTherefore, the accuracy of the result is ensured, and the convenience of operation is improved.
In S200, acquiring the hardness H of the ith copper foil in the laminated structure of the printed circuit board3iThe method specifically comprises the following steps:
providing a copper foil sample consistent with the type of the ith layer of copper foil;
measuring the hardness value of the copper foil sample by using a microhardness meter as H3i。
Measuring the hardness value of the glass fiber cloth sample by adopting a microhardness meter as H2i。
By providing a copper foil sample with the same type as the ith copper foil and measuring the hardness value of the copper foil sample by using a microhardness meter as H3iTherefore, the accuracy of the result is ensured, and the convenience of operation is improved.
In S200, acquiring the hardness H of the cured ith prepreg in the laminated structure of the printed circuit board4iThe method specifically comprises the following steps:
providing a prepreg sample consistent with the i-th prepreg type;
measuring the hardness value of the cured prepreg sample by using a microhardness meter as H4i。
Providing a prepreg sample with the same type as the ith prepreg, and measuring the hardness value of the cured prepreg sample by using a microhardness meter as H4iTherefore, the accuracy of the result is ensured, and the convenience of operation is improved.
In S200, acquiring the hardness H of the glass fiber cloth of the ith prepreg in the laminated structure of the printed circuit board5iThe method specifically comprises the following steps:
providing a glass fiber cloth sample corresponding to the ith prepreg;
measuring the hardness value of the glass fiber cloth sample by adopting a microhardness meter as H5i。
The hardness value of the glass fiber cloth sample is measured as H by providing the glass fiber cloth sample corresponding to the ith prepreg and adopting a microhardness meter5iTherefore, the accuracy of the result is ensured, and the convenience of operation is improved.
In S200, obtaining the thickness h of the ith core board in the laminated structure of the printed circuit board after removing the outer copper foil1iThe method specifically comprises the following steps:
providing a core plate sample consistent with the ith core plate type;
etching to remove the outer copper foil of the core plate sample;
measuring the thickness value of the core plate sample after removing the outer copper foil by adopting a micro thickness gauge as h1i。
Providing a core plate sample with the same type as the ith core plate, and measuring the thickness value of the core plate sample after removing the outer copper foil by adopting a micro thickness gauge as h1iTherefore, the accuracy of the result is ensured, and the convenience of operation is improved.
In S200, acquiring the thickness h of the glass fiber cloth of the ith core board in the laminated structure of the printed circuit board2iThe method specifically comprises the following steps:
providing a glass fiber cloth sample corresponding to the ith core plate;
measuring the thickness value of the glass fiber cloth sample by adopting a micro thickness gauge as h2i。
Providing a glass fiber fabric sample corresponding to the ith core plate, and measuring the thickness value of the glass fiber fabric sample by using a micro thickness gauge as h2iTherefore, the accuracy of the result is ensured, and the convenience of operation is improved.
In S200, acquiring the thickness h of the ith copper foil in the laminated structure of the printed circuit board3iThe method specifically comprises the following steps:
providing a copper foil sample consistent with the type of the ith layer of copper foil;
measuring the thickness value of the copper foil sample by adopting a micro thickness gauge as h3i。
By providing a copper foil sample in accordance with the type of the ith copper foil and adoptingMeasuring the thickness value of the copper foil sample by using a micro thickness gauge as h3iTherefore, the accuracy of the result is ensured, and the convenience of operation is improved.
In S200, obtaining the cured thickness h of the ith prepreg in the laminated structure of the printed circuit board4iThe method specifically comprises the following steps:
providing a prepreg sample consistent with the i-th prepreg type;
measuring the thickness value of the cured prepreg sample by adopting a microscopic thickness gauge as h4i。
Providing a prepreg sample with the same type as the ith prepreg, and measuring the cured thickness value of the prepreg sample by adopting a micro thickness gauge as h4iTherefore, the accuracy of the result is ensured, and the convenience of operation is improved.
In S200, acquiring the thickness h of the glass fiber cloth of the ith prepreg in the laminated structure of the printed circuit board5iThe method specifically comprises the following steps:
providing a glass fiber cloth sample corresponding to the ith prepreg;
measuring the thickness value of the glass fiber cloth sample by adopting a micro thickness gauge as h5i。
Providing a glass fiber cloth sample corresponding to the ith prepreg, and measuring the thickness value of the glass fiber cloth sample by using a micro thickness gauge as h5iTherefore, the accuracy of the result is ensured, and the convenience of operation is improved.
In S400, the maximum abrasion loss V under the condition that the drill bit can still process the processed hole meeting the hole wall quality requirement is obtainedmaxThe method specifically comprises the following steps:
providing a test board;
drilling the test board by using a drill;
testing the abrasion loss of the drill under different set hole limits and the hole wall quality of the machined hole corresponding to the abrasion loss;
determining the maximum abrasion loss V according to the quality requirement of the hole wall of the machined holemax。
When drilling parameters (the rotating speed of the drill cutter, the feeding speed of the drill cutter and the retracting speed of the drill cutter) are fixed, the hole wall quality of a machined hole machined by the drill cutter is basically influenced only by the abrasion loss, and the maximum abrasion loss V of the drill cutter can be quickly and accurately determined by testing the abrasion loss of the drill cutter under different set hole limits and the hole wall quality of the machined hole corresponding to the abrasion loss and screening the corresponding abrasion loss meeting the hole wall quality requirement of the machined holemax。
For example, the test panel may be selected from the 8 sheets shown in the following table:
| number of layers | Type (B) | Parameter(s) |
| L1 | Outer layer copper foil | 0.5oz |
| Prepreg | 2116*1 | |
| L2/L3 | Core board | 0.5/0.5oz 0.125mm 2116*1 |
| Prepreg | 2116*2 | |
| L4/L5 | Core board | 2/2oz 0.125mm 2116*1 |
| Prepreg | 2116*2 | |
| L6/L7 | Core board | 0.5/0.5oz 0.125mm 2116*1 |
| Prepreg | 2116*1 | |
| L8 | Outer layer copper foil | 0.5oz |
It should be noted that the number of layers of the test board may be the same as or different from the number of layers of the actual printed circuit board stacked structure, as long as the material selected for the test board is consistent with the material selected for the actual printed circuit board stacked structure. To ensure accuracy, the process parameters for drilling the test board should be as consistent as possible with the process parameters for drilling the actual printed circuit board stack.
Optionally, when the test board is drilled by using the drill, the rotation speed of the drill is 80-120 krpm, the feeding speed of the drill is 20-30 mm/s, and the retracting speed of the drill is 80-120 mm/s. The test board is drilled by adopting the parameters, the wear loss of the drill cutter obtained by testing under different set hole limits is changed stably, and the maximum wear loss V of the drill cutter is screened out favorablymax。
The feasibility of the above method for calculating the hole limit of the drilled holes in the printed circuit board is verified by taking a certain high-speed material, a certain FR4 material and a certain high-frequency material as an example to manufacture 24 layers shown in the following table:
| layer classification | Categories | Laminated profile |
| L1 | Copper foil | 0.5oz |
| Prepreg | 1080*1 | |
| L2/3 | Core board | 0.5/0.5 0.1mm 106*2 |
| Prepreg | 2116*1 | |
| L4/5 | Core board | 0.5/0.5 0.1mm 106*2 |
| Prepreg | 2116*1 | |
| L6/7 | Core board | 0.5/0.5 0.1mm 106*2 |
| Prepreg | 2116*1 | |
| L8/9 | Core board | 0.5/0.5 0.1mm 106*2 |
| Prepreg | 1080*1+2116*1 | |
| L10/11 | Core board | 2/2 0.125mm 2116*2 |
| Prepreg | 1080*1+2116*1 | |
| L12/13 | Core board | 0.5/0.5 0.1mm 106*2 |
| Prepreg | 1080*1+2116*1 | |
| L14/15 | Core board | 2/2 0.125mm 2116*2 |
| Prepreg | 1080*1+2116*1 | |
| L16/17 | Core board | 0.5/0.5 0.1mm 106*2 |
| Prepreg | 2116*1 | |
| L18/19 | Core board | 0.5/0.5 0.1mm 106*2 |
| Prepreg | 2116*1 | |
| L20/21 | Core board | 0.5/0.5 0.1mm 106*2 |
| Prepreg | 2116*1 | |
| L22/23 | Core board | 0.5/0.5 0.1mm 106*2 |
| Prepreg | 1080*1 | |
| L24 | Copper foil | 0.5oz |
In the verification process, the hole limit S is calculated by using the hole limit calculation method for drilling the printed circuit board, then the laminated structure of the printed circuit board after etching and laminating is drilled, and the hole limit of drilling is set according to the calculated hole limit S. And stopping drilling when the drill cutter is used to the set hole limit, actually measuring and fitting by adopting a high-precision microscope, calculating the actual abrasion loss of the drill cutter, and observing whether the hole wall quality of the processed hole of the printed circuit board meets the requirement or not by slicing. Wherein, the hole wall quality requirement of processing hole is: firstly, the halo is less than or equal to 80 mu m; the hole diameter is less than or equal to 30 mu m, and the nail head is less than or equal to 1.5.
The specific results are shown in the following table:
from the specific results, the hole limit S calculated by the hole limit calculation method for the printed circuit board drilling is used as a set hole limit for drilling, and the actually measured abrasion loss of the drill bit used to the set hole limit and the maximum abrasion loss V of the drill bit are usedmaxBasically meets the requirements, and the quality of the hole wall of the processed hole meets the requirements.
In an embodiment, a system for implementing the method for calculating the hole limit of the printed circuit board drilling hole includes:
a parameter acquisition module for acquiringNumber n of core boards in laminated structure of printed circuit board1Obtaining the number n of copper foils in the laminated structure of the printed circuit board2Obtaining the number n of prepregs in the laminated structure of the printed circuit board3Obtaining the hardness H of the ith core board in the laminated structure of the printed circuit board after removing the outer layer copper foil1iObtaining the hardness H of the glass fiber cloth of the ith core plate in the laminated structure of the printed circuit board2iObtaining the hardness H of the ith layer of copper foil in the laminated structure of the printed circuit board3iObtaining the hardness H of the cured ith prepreg in the laminated structure of the printed circuit board4iObtaining the hardness H of the glass fiber cloth of the ith prepreg in the laminated structure of the printed circuit board5iObtaining the thickness h of the ith core board in the laminated structure of the printed circuit board after the outer layer copper foil is removed1iObtaining the thickness h of the glass fiber cloth of the ith core plate in the laminated structure of the printed circuit board2iObtaining the thickness h of the ith layer of copper foil in the laminated structure of the printed circuit board3iObtaining the thickness h of the cured ith prepreg in the laminated structure of the printed circuit board4iObtaining the thickness h of the glass fiber cloth of the ith prepreg in the laminated structure of the printed circuit board5i(ii) a And is also used for obtaining the maximum abrasion loss V under the condition that the drill bit can still process the processed hole meeting the hole wall quality requirementmax；
A result operation module for substituting the parameters into the following formula to calculate the comprehensive hardness H of the laminated structure of the printed circuit boardPCB：
And the method is also used for substituting the parameters into the following mathematical model to calculate the hole limit S:
the hole limit calculation system for the drilling of the printed circuit board obtains the comprehensive hardness H by obtaining the corresponding parameters of the laminated structure of the printed circuit board and calculating according to a formulaPCBAnd then by combining the overall hardness HPCBMaximum wear and tearQuantity VmaxThe numerical value is substituted into the mathematical model, and the hole limit S can be calculated. The hole limit calculation system for the drilling of the printed circuit board can quickly and accurately determine the hole limit of the drilling, can ensure the hole wall quality of a machined hole, can reduce the production cost, and has a great application value to actual production.
Optionally, the parameter acquisition module and the result operation module are made into software in a programming mode to realize programming, the software can be butted with a printed circuit board laminated structure design system and an ERP system, the hole limit of the drilled hole is calculated in real time based on the printed circuit board laminated structure, automatic calculation is completed, manual interference is not needed, and the labor input is reduced.
In addition, the core board has a hardness H after the outer copper foil is removed1iHardness H of glass fiber cloth of core plate2iHardness H of copper foil3iHardness H of prepreg4iHardness H of glass fiber cloth of prepreg5iThe parameters can be measured for different materials, the results are imported into a database, and the drilling hole limit is calculated and then exported by a parameter acquisition module. The maximum abrasion loss V under the condition that the drill bit can still process the processed hole meeting the hole wall quality requirementmaxThe test board can be used for measuring corresponding parameters aiming at different materials, the results are led into the database, and the parameters are led out by the parameter acquisition module when the hole limit of the drilled hole is calculated.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A hole limit calculation method for printed circuit board drilling is characterized by comprising the following steps:
inquiring the laminated structure of the printed circuit board;
obtaining the number n of core plates in the laminated structure of the printed circuit board1Obtaining the number n of copper foils in the laminated structure of the printed circuit board2Obtaining the number n of prepregs in the laminated structure of the printed circuit board3Obtaining the hardness H of the ith core board in the laminated structure of the printed circuit board after removing the outer layer copper foil1iObtaining the hardness H of the glass fiber cloth of the ith core plate in the laminated structure of the printed circuit board2iObtaining the hardness H of the ith layer of copper foil in the laminated structure of the printed circuit board3iObtaining the hardness H of the cured ith prepreg in the laminated structure of the printed circuit board4iObtaining the hardness H of the glass fiber cloth of the ith prepreg in the laminated structure of the printed circuit board5iObtaining the thickness h of the ith core board in the laminated structure of the printed circuit board after the outer layer copper foil is removed1iObtaining the thickness h of the glass fiber cloth of the ith core plate in the laminated structure of the printed circuit board2iObtaining the thickness h of the ith layer of copper foil in the laminated structure of the printed circuit board3iObtaining the thickness h of the cured ith prepreg in the laminated structure of the printed circuit board4iObtaining the thickness h of the glass fiber cloth of the ith prepreg in the laminated structure of the printed circuit board5i；
Calculating the comprehensive hardness H of the laminated structure of the printed circuit board according to the following formulaPCB：
Obtaining the maximum abrasion loss V under the condition that the drill bit can still process the processed hole meeting the hole wall quality requirementmax；
The pore limit S is calculated according to the following mathematical model:
wherein k is1＝(0.95～1.05)×0.0141，k2＝(0.95～1.05)×0.000333，k3＝(0.95～1.05)×0.001257，k4＝(0.95～1.05)×0.316，k5＝(0.95～1.05)×35.53，k6＝(0.95～1.05)×0.011，k7＝(0.95～1.05)×0.038，Hmax＝(0.95～1.05)×275，h1iIn units of mm, h2iIn units of mm, h3iIn units of mm, h4iIn units of mm, h5iIn units of mm, HPCBIs in units of HV, HmaxThe unit of (d) is HV.
2. The method of claim 1, wherein the hardness H of the ith core board in the laminated structure of the PCB is obtained after removing the outer copper foil1iThe method specifically comprises the following steps:
providing a core plate sample consistent with the ith core plate type;
etching to remove the outer copper foil of the core plate sample;
measuring the hardness value of the core plate sample after removing the outer copper foil by adopting a microhardness meter as H1i。
3. The method of claim 1, wherein the hardness H of the glass fiber cloth of the ith core board in the laminated structure of the printed circuit board is obtained2iThe method specifically comprises the following steps:
providing a glass fiber cloth sample corresponding to the ith core plate;
measuring the hardness value of the glass fiber cloth sample by adopting a microhardness meter as H2i。
4. The method of claim 1, wherein the hardness H of the ith copper foil in the laminated structure of the PCB is obtained3iThe method specifically comprises the following steps:
providing a copper foil sample consistent with the type of the ith layer of copper foil;
measuring the hardness value of the copper foil sample by using a microhardness meter as H3i。
5. The method for calculating the hole limit of the drilled hole of the printed circuit board according to claim 1, wherein the hardness H of the cured ith prepreg in the laminated structure of the printed circuit board is obtained4iThe method specifically comprises the following steps:
providing a prepreg sample consistent with the i-th prepreg type;
measuring the hardness value of the cured prepreg sample by using a microhardness meter as H4i。
6. The method for calculating the hole limit of the printed circuit board drilling hole according to claim 1, wherein the hardness H of the glass fiber cloth of the ith prepreg in the laminated structure of the printed circuit board is obtained5iThe method specifically comprises the following steps:
providing a glass fiber cloth sample corresponding to the ith prepreg;
measuring the hardness value of the glass fiber cloth sample by adopting a microhardness meter as H5i。
7. The method of claim 1, wherein k is k1＝0.0141，k2＝0.000333，k3＝0.001257，k4＝0.316，k5＝35.53，k6＝0.011，k7＝0.038，Hmax＝275。
8. The method for calculating the hole limit of the printed circuit board drilling hole according to any one of claims 1 to 7, wherein the maximum abrasion amount V under the condition that the drill still can machine the machined hole meeting the hole wall quality requirement is obtainedmaxThe method specifically comprises the following steps:
providing a test board;
drilling the test board by using a drill;
testing the abrasion loss of the drill under different set hole limits and the hole wall quality of the machined hole corresponding to the abrasion loss;
determining the maximum abrasion loss V according to the quality requirement of the hole wall of the machined holemax。
9. The method of claim 8, wherein the drill speed of the drill is 80-120 krpm, the feed speed of the drill is 20-30 mm/s, and the retract speed of the drill is 80-120 mm/s.
10. A system for implementing the method for calculating the hole limit of the printed circuit board drilling hole according to any one of claims 1 to 9, comprising:
a parameter acquisition module for acquiring the number n of core plates in the laminated structure of the printed circuit board1Obtaining the number n of copper foils in the laminated structure of the printed circuit board2Obtaining the number n of prepregs in the laminated structure of the printed circuit board3Obtaining the hardness H of the ith core board in the laminated structure of the printed circuit board after removing the outer layer copper foil1iObtaining the hardness H of the glass fiber cloth of the ith core plate in the laminated structure of the printed circuit board2iObtaining the hardness H of the ith layer of copper foil in the laminated structure of the printed circuit board3iObtaining the hardness H of the cured ith prepreg in the laminated structure of the printed circuit board4iObtaining the hardness H of the glass fiber cloth of the ith prepreg in the laminated structure of the printed circuit board5iObtaining the thickness h of the ith core board in the laminated structure of the printed circuit board after the outer layer copper foil is removed1iObtaining the thickness h of the glass fiber cloth of the ith core plate in the laminated structure of the printed circuit board2iObtaining the thickness h of the ith layer of copper foil in the laminated structure of the printed circuit board3iObtaining the thickness h of the cured ith prepreg in the laminated structure of the printed circuit board4iObtaining the thickness h of the glass fiber cloth of the ith prepreg in the laminated structure of the printed circuit board5i(ii) a And is also used for obtaining the maximum abrasion under the condition that the drill bit can still process the processed hole meeting the hole wall quality requirementQuantity Vmax；
A result operation module for substituting the parameters into the calculation to obtain the comprehensive hardness H of the laminated structure of the printed circuit boardPCB：
And the method is also used for substituting the parameters into the following mathematical model to calculate the hole limit S:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811012613.1A CN108684150B (en) | 2018-08-31 | 2018-08-31 | Hole limit calculation method and system for printed circuit board drilling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811012613.1A CN108684150B (en) | 2018-08-31 | 2018-08-31 | Hole limit calculation method and system for printed circuit board drilling |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108684150A CN108684150A (en) | 2018-10-19 |
| CN108684150B true CN108684150B (en) | 2019-12-24 |
Family
ID=63815624
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811012613.1A Active CN108684150B (en) | 2018-08-31 | 2018-08-31 | Hole limit calculation method and system for printed circuit board drilling |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108684150B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113038722A (en) * | 2021-02-01 | 2021-06-25 | 广州广合科技股份有限公司 | PCB hole burr improving method |
| CN113111292B (en) * | 2021-03-01 | 2023-05-26 | 广州广合科技股份有限公司 | Method for automatically calculating back drilling depth, electronic equipment and storage medium |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101510278A (en) * | 2009-01-12 | 2009-08-19 | 广州杰赛科技股份有限公司 | Drill automatic matching business system and ERP system for integrating the business system |
| CN106021796A (en) * | 2016-06-03 | 2016-10-12 | 上海工具厂有限公司 | Remaining-life predicting method for ball end mill for chrome steel blade profile |
| CN106304642A (en) * | 2016-08-26 | 2017-01-04 | 广州兴森快捷电路科技有限公司 | The hole limit computational methods of thick copper coin boring and the method for building up of the hole limit mathematical model of thick copper coin boring |
| CN106736859A (en) * | 2017-01-19 | 2017-05-31 | 株洲钻石切削刀具股份有限公司 | Turning insert service life control methods |
-
2018
- 2018-08-31 CN CN201811012613.1A patent/CN108684150B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101510278A (en) * | 2009-01-12 | 2009-08-19 | 广州杰赛科技股份有限公司 | Drill automatic matching business system and ERP system for integrating the business system |
| CN106021796A (en) * | 2016-06-03 | 2016-10-12 | 上海工具厂有限公司 | Remaining-life predicting method for ball end mill for chrome steel blade profile |
| CN106304642A (en) * | 2016-08-26 | 2017-01-04 | 广州兴森快捷电路科技有限公司 | The hole limit computational methods of thick copper coin boring and the method for building up of the hole limit mathematical model of thick copper coin boring |
| CN106736859A (en) * | 2017-01-19 | 2017-05-31 | 株洲钻石切削刀具股份有限公司 | Turning insert service life control methods |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108684150A (en) | 2018-10-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108684150B (en) | Hole limit calculation method and system for printed circuit board drilling | |
| CN104270889B (en) | Partial high-precision printed wiring board and preparation method thereof | |
| CN112165780B (en) | Expansion and contraction plate dividing device | |
| CN107567191B (en) | It is a kind of to improve the process that precision is bored outside mechanical blind hole plate | |
| CN107094349A (en) | Printed circuit board and preparation method thereof | |
| CN107770974B (en) | Manufacturing method of interlayer alignment detection module | |
| CN104023467B (en) | Multi-layer circuit board with high mechanical hole drilling yield and manufacturing method thereof | |
| CN108304963B (en) | Expansion and shrinkage prediction method for multilayer circuit board | |
| CN106304654B (en) | A kind of method promoting back drill STUB precision and the PCB using this method | |
| CN105043828B (en) | A kind of method of accurate grinding and polishing of PCB microsections in place | |
| CN106604546A (en) | Printed-circuit board short-slot slotted hole forming method | |
| CN102111961B (en) | Method for detecting process capability of inner and outer layers of circuit board | |
| CN110876240A (en) | Method for detecting drilling deviation of multilayer circuit board | |
| CN104159394B (en) | A kind of PCB sections and preparation method thereof | |
| CN203457418U (en) | Circuit board capable of testing back drill holes | |
| CN214592110U (en) | Multilayer printed circuit board, mould and interlayer offset measuring mechanism | |
| KR101763768B1 (en) | Target board for verifying the accuracy of X-ray Drill Holes | |
| TWI778606B (en) | Machining station and method for machining workpieces | |
| CN109348634A (en) | It is a kind of to improve the process that precision is bored outside mechanical blind hole plate | |
| CN203912324U (en) | Multilayer circuit board with high qualified rate of mechanical boring | |
| CN107148170A (en) | A kind of core material riveting bad method partially in reduction PCB multilayer board | |
| Sathish Kumar et al. | Optimization of drilling parameters on Alkaline treated jute fiber sandwich material | |
| EP1567302B1 (en) | Laser trimming of resistors | |
| CN110933855B (en) | PTFE high-frequency circuit board blind drilling process for 5G signal communication | |
| CN104977071A (en) | Lateral gram weight determining method of paper machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |