CN110764637A - Manufacturing device, manufacturing method and application of conductive mesh-type touch sensing layer - Google Patents
Manufacturing device, manufacturing method and application of conductive mesh-type touch sensing layer Download PDFInfo
- Publication number
- CN110764637A CN110764637A CN201810846963.1A CN201810846963A CN110764637A CN 110764637 A CN110764637 A CN 110764637A CN 201810846963 A CN201810846963 A CN 201810846963A CN 110764637 A CN110764637 A CN 110764637A
- Authority
- CN
- China
- Prior art keywords
- wire
- insulating glue
- glue solution
- insulating
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Position Input By Displaying (AREA)
Abstract
The invention relates to a manufacturing device, a manufacturing method and application of a conductive mesh-type touch sensing layer. When the manufacturing device is used, the glue wrapping cavity of the printing laying head is filled with insulating glue, and when a conductor to be printed and laid passes through the glue wrapping cavity, the insulating glue can wrap the conductor. When the conducting wire is led out from the wire outlet hole to the substrate, the insulating glue solution wraps the conducting wire and is extruded out along with the conducting wire. The wire wrapped by the insulating glue solution is adhered to the surface of the substrate after contacting the substrate. The insulating glue solution can form an insulating layer after being cured, so that the conductive grid formed on the substrate has insulating characteristics, and the insulating property is good when the conductive grid is overlapped with the metal grids of other layers. The manufacturing device and the manufacturing method of the conductive mesh-type touch sensing layer do not need to preset a special adhesive layer on the substrate to fix the conducting wire, can be paved on the substrates of various materials, structures and shapes, and have the advantages of wide application range, simplicity in operation and the like.
Description
Technical Field
The invention relates to the technical field of touch screens, in particular to a manufacturing device, a manufacturing method and application of a conductive mesh-type touch sensing layer.
Background
Metal mesh is a conductive mesh formed on a substrate by micromachining technology, and has the advantages of good conductivity, high light transmittance, strong anti-interference capability and the like. The traditional micromachining technology for manufacturing the metal grid comprises a yellow light manufacturing process, an embossing process, a silk-screen printing process, a printing process and the like. Wherein, the yellow light process is mainly used for pure metal conductive objects such as copper, nickel, silver and the like; the stamping and silk-screen printing process is mainly used for mixing conductive substances such as silver paste and the like; the printing mode is mainly used for mixed conducting materials, enameled wires and the like. Among the above-described various methods, printing is the easiest and inexpensive. However, the current printed metal grid is mainly laid on a substrate with glue by using enameled wires, and a conductive material is adhered on the substrate by using the viscosity of the glue, and the technology is generally only suitable for being manufactured on a thin film substrate, and has certain limitations and structural limitations. In addition, in terms of reliability, because two layers of wires need to be attached to each other, the prior art has some short circuit risks and insufficient insulation.
Disclosure of Invention
Accordingly, there is a need for a device, a method and an application for manufacturing a conductive mesh-type touch sensing layer with a wide application range and high reliability.
The manufacturing device comprises a printing laying head, wherein a glue wrapping cavity is formed in the printing laying head and used for containing insulating glue, a wire outlet hole is formed in the glue wrapping cavity, a lead to be printed and laid can extend into the glue wrapping cavity, the glue wrapping cavity is used for enabling the insulating glue to wrap the lead, and the wire outlet hole is used for leading out the lead wrapped with the insulating glue.
In one embodiment, the outlet hole is positioned at the bottom of the glue coating cavity, and the bottom of the glue coating cavity is tapered;
the top of wrapping up in the gluey chamber is equipped with the pressure port, the wire can be followed the pressure port stretches into wrap up in the gluey intracavity.
In one embodiment, the difference between the inner diameter of the wire outlet hole and the outer diameter of the wire is not more than 500 μm.
In one embodiment, the manufacturing device of the conductive grid type touch sensing layer further comprises a lead reel, a pressurizing device and/or a driving device;
the wire reel is used for winding a wire, and the wire reel is positioned above the printing and laying head;
the pressurizing device is used for applying air pressure to the adhesive wrapping cavity so that the insulating adhesive liquid flows out of the wire outlet;
the driving device is connected with the printing and laying head to drive the printing and laying head to move at a preset speed and/or a preset path.
A manufacturing method of a conductive mesh-type touch sensing layer comprises the following steps:
coating a layer of insulating glue solution on the surface of a wire to be printed and laid;
controlling the lead wrapped with the insulating glue solution to be laid on the substrate at a preset path and/or a preset speed;
and curing the insulating glue solution on the surface of the lead to form a first conductive grid on the substrate, wherein the lead is bonded with the substrate through the cured insulating glue solution and is wrapped and insulated by the cured insulating glue solution.
In one embodiment, the two ends of the wire are also wrapped with the insulating glue.
In one embodiment, the method for manufacturing the conductive grid type touch sensing layer further includes the step of continuously manufacturing a second conductive grid adhered and insulated with the first conductive grid on the first conductive grid, or manufacturing a second conductive grid on another substrate and placing the substrate provided with the second conductive grid opposite to the substrate provided with the first conductive grid.
A manufacturing method of an OGS touch component comprises the following steps:
coating a layer of insulating glue solution on the surface of a wire to be printed and laid;
controlling the lead wrapped with the insulating glue solution to be laid on the silk-screen printing surface of the cover plate glass of the induction layer to be manufactured in a preset path and/or at a preset speed;
solidifying the insulating glue solution on the surface of the lead, forming a first conductive grid on the cover plate glass, wherein the lead of the first conductive grid is bonded with the cover plate glass through the solidified insulating glue solution and is wrapped and insulated by the solidified insulating glue solution;
controlling the lead wrapped with the insulating glue solution to be laid on the first conductive grid in a preset path and/or at a preset speed;
and curing the insulating glue solution laid on the surface of the lead on the first conductive grid, and forming a second conductive grid which is bonded and insulated with the first conductive grid on the first conductive grid to obtain the conductive grid.
The utility model provides an OGS touch-control subassembly, includes cover plate glass, first electrically conductive net and the electrically conductive net of second, first electrically conductive net is directly established on cover plate glass's the silk screen printing face, the electrically conductive net of second is directly established on the first electrically conductive net, first electrically conductive net with the electrically conductive net of second is extended along predetermined route by the wire that surface coating has insulating glue solution and is formed, just first electrically conductive net through the solidification insulating glue solution with cover plate glass bonds, the electrically conductive net of second through the solidification insulating glue solution with first electrically conductive net bonds and insulating.
In one embodiment, the size of the OGS touch component is not less than 21.5 inches.
When the manufacturing device of the conductive mesh-type touch sensing layer is used, the insulating glue solution is contained in the glue wrapping cavity of the printing laying head, and when a lead to be printed and laid passes through the glue wrapping cavity, the insulating glue solution can wrap the lead. When the conducting wire wrapped with the insulating glue is led out to the substrate from the wire outlet hole, the insulating glue wraps the conducting wire and is extruded out along with the conducting wire. The wire wrapped by the insulating glue solution is adhered to the surface of the substrate after contacting the substrate. By using the viscosity of the insulating glue solution and the movement of the printing laying head, the tension on the lead can be generated, the lead is continuously pulled down and released from the wire outlet hole, and finally the lead is fixed on the surface of the substrate. Because the insulating glue solution can form the insulating layer after solidifying, therefore the conductive grid formed on the substrate has insulating characteristics, when overlapping with the metal grids of other layers, no matter the node of the single substrate or the double substrate which is overlapped by the two layers of metal grids can not generate short circuit, and the insulating property is good.
The manufacturing device and the manufacturing method of the conductive mesh-type touch sensing layer do not need to preset a special adhesive layer on the substrate to fix the conducting wire, can be paved on the substrates of various materials, structures and shapes, and have the advantages of wide application range, simplicity in operation and the like.
Particularly, a traditional medium-large-sized product (for example, more than 21.5 inches) can be supported only by a glass + film + film and a glass + glass substrate (GG) structure mode, and an OGS (one glass solution) scheme cannot be used, that is, the traditional OGS touch product is difficult to manufacture into a large size or the manufactured large-size OGS touch product has very high cost. Because the mode of printing and laying the conducting wires is adopted, the cost is far cheaper than that of an embossed metal grid and a yellow metal grid, the substrate is not required to be manufactured, the insulating glue is not required to be pre-coated, and the manufacturing cost is lower. In addition, the printing and paving mode is adopted for manufacturing, no pollution (yellow light process) is generated, no complex production equipment is needed, and the production efficiency is high.
The manufacturing device of the conductive grid type touch sensing layer can overcome the defects that the traditional OGS structure cannot be large-sized and is high in cost, and therefore the manufacturing device can be widely popularized and applied to the field of manufacturing of various touch products such as OGS.
Drawings
FIG. 1 is a schematic structural diagram of a device for manufacturing a conductive grid-type touch sensing layer according to an embodiment of the invention;
FIG. 2 is a schematic diagram of insulated contacts between wires of a metal grid manufactured by the manufacturing method of the present invention;
fig. 3 is a schematic structural diagram of an OGS touch device manufactured according to an embodiment.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
As shown in fig. 1, an apparatus 10 for manufacturing a conductive grid type touch sensitive layer according to an embodiment of the present invention has a print head 100. The print-and-place head 100 has a glue chamber 102 inside. The glue coating cavity 102 is used for containing insulating glue solution 20. The glue coating cavity 102 has an outlet hole 104. The lead 30 to be printed and laid can extend into the glue coating cavity 102 to be coated with the insulating glue solution 20, and the lead 30 coated with the insulating glue solution 20 can be led out from the outlet hole 104.
In the specific example shown in fig. 1, the outlet hole 104 is located at the bottom of the glue cavity 102. The bottom of the whole glue wrapping cavity 102 is conical, and the size of the conical bottom is smaller, so that the insulating glue solution 20 can flow out conveniently. The top of the glue coating cavity 102 is provided with a pressurizing opening 106. The pressurizing port 106 is used for being connected with a pressurizing device so as to apply air pressure to the insulating glue solution 20 in the glue wrapping cavity 102, so that the insulating glue solution 20 is enabled to continuously flow out from the wire outlet hole 104, and the continuity and uniformity of the insulating glue solution 20 wrapping the lead 30 are ensured. In addition, the glue wrapping cavity 102 is also provided with a glue supplementing hole for supplementing the insulating glue solution 20 into the glue wrapping cavity 102 in real time.
The inner diameter of the wire outlet hole 104 is larger than the outer diameter of the wire 30, for example, in one embodiment, the difference between the inner diameter of the wire outlet hole 104 and the outer diameter of the wire 30 is no greater than 500 μm. The difference between the inner diameter and the outer diameter can be small, such as 20-100 μm, for insulating glue solutions such as paint, and the difference between the inner diameter and the outer diameter is large, such as 200-500 μm, for insulating glue solutions such as UV curing glue, so the difference between the inner diameter and the outer diameter can be properly adjusted according to the actual effect, and is preferably 20-300 μm. The difference between the inner diameter and the outer diameter needs to be controlled reasonably, so that the outlet hole 104 is not opened too much to cause leakage, and the continuity and uniformity of the insulating glue solution 20 wrapping the lead 30 can be further improved.
Further, in one specific example, the apparatus 10 for manufacturing a touch-sensitive layer in a conductive mesh format further includes a wire reel 200. A wire spool 200 is located above the print laying head 100 for winding the wire 30. The wire 30 is wound by the wire reel 200, so that the wire 30 can be prevented from being tangled, and the stability of subsequent printing and laying can be ensured.
Further, in one specific example, the apparatus 10 for making a touch-sensitive layer in a conductive mesh format further comprises a pressurizing device. The pressurizing device is used for applying air pressure to the inside of the glue wrapping cavity 102 so as to enable the insulating glue solution 20 to flow out of the outlet hole 104. The pressurizing device may be various blowing or blowing devices, for example, may be connected to the top pressurizing port 106 of the glue-wrapping chamber 102 to pressurize the insulating glue solution 20 from above.
Still further, in a specific example, the apparatus 10 for manufacturing the touch sensing layer in conductive mesh format further includes a driving device. A drive is coupled to print-laying head 100 to drive print-laying head 100 at a predetermined rate and/or along a predetermined path. The driving device can be various mechanisms which can realize the motion in at least two-dimensional planes, for example, the driving device can be driven by a stepping motor and a transmission belt mechanism to move, or the driving device can be driven by a stepping motor and a screw rod transmission structure to move precisely and the like.
An embodiment of the present invention further provides a method for manufacturing a touch sensing layer in a conductive mesh format, which includes the following steps:
coating a layer of insulating glue solution on the surface of a wire to be printed and laid;
controlling the lead wrapped with the insulating glue solution to be laid on the substrate at a preset path and/or a preset speed;
and curing the insulating glue solution on the surface of the lead, forming a first conductive grid on the substrate, and bonding the lead with the substrate through the cured insulating glue solution and wrapping and insulating the lead by the cured insulating glue solution.
When the wire is wrapped with the insulating glue solution, the two end parts of the wire are also wrapped with the insulating glue solution.
Further, the manufacturing method of the conductive mesh-type touch sensing layer further comprises the step of continuously manufacturing a second conductive mesh which is bonded with and insulated from the first conductive mesh on the first conductive mesh, or manufacturing the second conductive mesh on another substrate and oppositely placing the substrate provided with the second conductive mesh and the substrate provided with the first conductive mesh.
The following further demonstrates a specific embodiment of the method for manufacturing the conductive mesh-type touch sensing layer by using the apparatus 10 for manufacturing the conductive mesh-type touch sensing layer provided above.
Referring to fig. 1, a method for manufacturing the device 10 using the conductive grid type touch sensing layer includes the following steps:
the method comprises the following steps: and adding insulating glue solution 20 into the glue coating cavity 102, and leading out the lead 30 to be printed and laid from the outlet hole 104 to the substrate 40 to be manufactured with the induction layer through the glue coating cavity 102.
The insulating glue solution 20 described in this embodiment may be various ultraviolet curing glue solutions, infrared curing glue solutions, or naturally curing glue solutions, such as UV (ultraviolet) curing acrylic glue, insulating ink, and the like.
The wire 30 of the present embodiment may be an enameled wire or a bare wire (a wire without an insulation layer), wherein the enameled wire itself has an insulation layer, and the insulation performance is better. The conductive material of the conductive wire 30 may be metal (such as copper, silver, etc., preferably copper) or mixed conductive material (such as silver paste, carbon paste, etc.). The diameter of the wire 30 is 20 μm or less. Because the resistance of the lead is inversely proportional to the diameter, in order to ensure that the voltage drop of the product is within a proper range and the thickness of the touch layer is not too thick to influence the wrapping effect of the insulating glue solution, preferably, the diameter of the lead is between 5 and 15 micrometers, and more preferably is 10 nm.
Because the manufacturing method of this embodiment does not need to pre-manufacture an adhesive layer on the substrate 40, the substrate 40 described in this embodiment has a wide range of options, such as a glass substrate, a PET (Polyethylene terephthalate) substrate, a COP (cyclic olefin polymers) substrate, a PCB (Printed circuit board) substrate, a PI (Polyimide) substrate, a PC (Polycarbonate) substrate, or a COC (cyclic olefin polymers) substrate; the surface of the substrate 40 on which the laid conductor is to be printed may be a planar, curved or profiled surface.
Step two: and controlling the printing and laying head 100 to move at a preset path and/or a preset speed, and extruding the insulating glue solution 20 from the wire outlet 104 to wrap the wire 30 and coat the wire 30 on the substrate 40.
The present embodiment lays the conductive lines 30 on the substrate 40 using the print laying head 100, and can lay an arbitrary shape. The insulating glue 20 is inside the printing and laying head 100, and when the conducting wire 30 is led out from the printing and laying head 100, the insulating glue 20 wraps the conducting wire 30 and extrudes out together with the conducting wire 30 from the outlet hole 104. The lead 30 wrapped by the insulating glue 20 is adhered to the surface of the substrate 40 after contacting the substrate 40, so as to fix the lead 30 on the surface of the substrate 40.
In a specific example, the lead 30 is placed above the print-laying head 100 through the lead reel 200, and after the lead 30 is contacted with the substrate 40, the viscosity of the insulating glue 20 and the movement of the print-laying head 100 can generate a pulling force on the lead 30, so that the lead 30 is continuously released from the lead reel 200.
The insulating paste 20 is in a solution state, and thus the wire 30 is wrapped by the insulating paste 20 after passing through the insulating paste 20. Preferably, the insulating glue solution 20 in the printing and laying head 100 can be continuously extruded out along with the conducting wire 30 from the printing and laying head 100 by synchronously increasing the air pressure to the insulating glue solution 20, and meanwhile, the extruding pulling force is generated on the conducting wire 30, so that the conducting wire 30 is further extruded out. The extrusion rate of the conductive wire 30 and the insulating glue solution 20 can be controlled by controlling and adjusting the moving speed of the printing and laying head 100 and/or the pressure of the applied air pressure in the glue wrapping chamber 102.
Step three: after the insulating glue solution 20 is cured, a first conductive grid is formed on the substrate 40, and the wire 30 is bonded with the substrate 40 through the insulating glue solution 20 and is wrapped and insulated by the insulating glue solution 20.
The curing method may be determined according to the type of the insulation glue solution 20, such as ultraviolet curing, infrared curing, heating and drying, or natural curing. The bonding substance formed after the insulating glue solution is cured can enable the lead 30 and the substrate 40 to be bonded more firmly and reliably.
The manufacturing method of the conductive mesh-type touch sensing layer further comprises the step of continuously manufacturing a second conductive mesh bonded with the first conductive mesh on the first conductive mesh by using the manufacturing device, or manufacturing the second conductive mesh on another substrate by using the manufacturing device. The second conductive grid can be laid directly on the cured first conductive grid of the insulating glue 20, using the same manufacturing method, or it can be made using a separate further substrate.
When the manufacturing device 10 of the conductive mesh-type touch sensing layer is used, the insulating glue solution 20 is contained in the glue wrapping cavity 102 of the printing laying head 100, and when a lead 30 to be printed and laid passes through the glue wrapping cavity 102, the lead 30 is wrapped by the insulating glue solution 20. When the conducting wire 30 wrapped with the insulating glue solution 20 is led out from the wire outlet 104 to the substrate 40, the insulating glue solution 20 wraps the conducting wire 30 and is extruded out along the same. The conductive wires 30 wrapped with the insulating paste 20 adhere to the surface of the substrate 40 after contacting the substrate 40. By using the viscosity of the insulating glue 20 and the movement of the print head 100, a pulling force can be generated on the wires 30, so that the wires 30 are released from the wire outlet 104 by being pulled continuously and are finally fixed on the surface of the substrate 40. Since the insulating glue 20 is cured to form an insulating layer, the conductive grid formed on the substrate 40 has an insulating characteristic, and as shown in fig. 2, when the conductive grid is overlapped with the metal grids of other layers, no short circuit occurs at the node where the two metal grids are overlapped, regardless of whether the single substrate or the double substrate, and the insulating property is good.
The manufacturing device 10 and the manufacturing method of the conductive mesh-type touch sensing layer of the invention can be applied to various different substrates 40, and have the advantages of wide application range, simple operation and the like. For example, in one embodiment, a method for manufacturing an OGS touch component and the OGS touch component are provided.
Specifically, the fabrication method of the OGS touch component can be performed according to, but not limited to, the following steps:
coating a layer of insulating glue solution on the surface of a wire to be printed and laid;
controlling the lead wrapped with the insulating glue solution to be laid on the silk-screen printing surface of the cover plate glass of the induction layer to be manufactured in a preset path and/or at a preset speed;
solidifying the insulating glue solution on the surface of the lead, forming a first conductive grid on the cover plate glass, wherein the lead of the first conductive grid is bonded with the cover plate glass through the solidified insulating glue solution and is wrapped and insulated by the solidified insulating glue solution;
controlling the lead wrapped with the insulating glue solution to be laid on the first conductive grid in a preset path and/or at a preset speed;
and curing the insulating glue solution laid on the surface of the lead on the first conductive grid, and forming a second conductive grid which is bonded and insulated with the first conductive grid on the first conductive grid to obtain the conductive grid.
More specifically, the method for manufacturing the OGS touch component may use the apparatus 10 for manufacturing the conductive grid type touch sensing layer, which may include the following steps:
adding insulating glue solution into the glue coating cavity, and leading out the lead to be printed and laid from the wire outlet hole to the silk-screen surface of the cover glass of the induction layer to be manufactured through the glue coating cavity;
controlling the printing laying head to move at a preset path and/or a preset speed, extruding the insulated glue solution wrapped wires from the wire outlet holes together with the wires and laying the insulated glue solution on the cover plate glass;
after the insulating glue solution is solidified, forming a first conductive grid on the cover plate glass, and bonding the conducting wire with the cover plate glass through the insulating glue solution and wrapping and insulating the conducting wire by the insulating glue solution;
and leading out the lead to be printed and laid from the wire outlet hole to the first conductive grid through the glue wrapping cavity, controlling the printing and laying head to move at a preset path and/or a preset speed, and forming a second conductive grid on the first conductive grid after the insulating glue solution is solidified after printing.
As shown in fig. 3, in the manufactured OGS touch device, the grid lines of the first conductive grid 310 and the second conductive grid 320 run approximately perpendicular, for example, the grid line of the first conductive grid 310 located below extends approximately along the X-axis, and the grid line of the second conductive grid 320 located above extends approximately along the Y-axis. The first conductive grid 310 and the second conductive grid 320 may serve as a driving layer (TX) and a sensing layer (RX), respectively, of the capacitive screen.
An OGS touch-control subassembly of mode preparation laid through the aforesaid printing, it includes the glass of apron, first electrically conductive net and the electrically conductive net of second, wherein, first electrically conductive net is directly established on the silk screen printing face of glass of apron, the electrically conductive net of second is directly established on first electrically conductive net, first electrically conductive net and the electrically conductive net of second extend along the route of predetermineeing by the wire that the surface parcel has insulating glue solution and form, and first electrically conductive net bonds with the glass of apron through the insulating glue solution of solidification, the electrically conductive net of second bonds and is insulating through the insulating glue solution of solidification and first electrically conductive net. The dimensions of the OGS touch component are preferably no less than 21.5 inches.
The manufacturing device 10 of the conductive grid type touch sensing layer can overcome the defects that the traditional OGS structure cannot be manufactured in a large size and is high in cost, so that the manufacturing device 10 can be widely popularized and applied to the manufacturing field of various touch products such as OGS.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. The manufacturing device for the conductive mesh-type touch sensing layer is characterized by comprising a printing laying head, wherein a glue wrapping cavity is arranged inside the printing laying head and used for containing insulating glue, a wire outlet hole is formed in the glue wrapping cavity, a wire to be printed and laid can extend into the glue wrapping cavity, the glue wrapping cavity is used for enabling the insulating glue to wrap the wire, and the wire outlet hole is used for leading out the wire wrapped with the insulating glue.
2. The apparatus of claim 1, wherein the wire hole is located at a bottom of the adhesive coating cavity, and the bottom of the adhesive coating cavity is tapered;
the top of wrapping up in the gluey chamber is equipped with the pressure port, the wire can be followed the pressure port stretches into wrap up in the gluey intracavity.
3. The apparatus of claim 1, wherein the difference between the inner diameter of the wire outlet and the outer diameter of the wire is not greater than 500 μm.
4. The apparatus for manufacturing a touch sensor layer in a conductive mesh format according to any one of claims 1 to 3, further comprising a wire reel, a pressing device and/or a driving device;
the wire reel is used for winding a wire, and the wire reel is positioned above the printing and laying head;
the pressurizing device is used for applying air pressure to the adhesive wrapping cavity so that the insulating adhesive liquid flows out of the wire outlet;
the driving device is connected with the printing and laying head to drive the printing and laying head to move at a preset speed and/or a preset path.
5. A manufacturing method of a conductive mesh-type touch sensing layer is characterized by comprising the following steps:
coating a layer of insulating glue solution on the surface of a wire to be printed and laid;
controlling the lead wrapped with the insulating glue solution to be laid on the substrate at a preset path and/or a preset speed;
and curing the insulating glue solution on the surface of the lead to form a first conductive grid on the substrate, wherein the lead is bonded with the substrate through the cured insulating glue solution and is wrapped and insulated by the cured insulating glue solution.
6. The method of claim 5, wherein the two ends of the conductive wire are covered with the insulating glue.
7. The method of claim 5 or 6, further comprising the step of continuing to form a second conductive mesh on the first conductive mesh, bonded to and insulated from the first conductive mesh, or forming a second conductive mesh on another substrate and placing the substrate provided with the second conductive mesh opposite the substrate provided with the first conductive mesh.
8. A manufacturing method of an OGS touch component is characterized by comprising the following steps:
coating a layer of insulating glue solution on the surface of a wire to be printed and laid;
controlling the lead wrapped with the insulating glue solution to be laid on the silk-screen printing surface of the cover plate glass of the induction layer to be manufactured in a preset path and/or at a preset speed;
solidifying the insulating glue solution on the surface of the lead, forming a first conductive grid on the cover plate glass, wherein the lead of the first conductive grid is bonded with the cover plate glass through the solidified insulating glue solution and is wrapped and insulated by the solidified insulating glue solution;
controlling the lead wrapped with the insulating glue solution to be laid on the first conductive grid in a preset path and/or at a preset speed;
and curing the insulating glue solution laid on the surface of the lead on the first conductive grid, and forming a second conductive grid which is bonded and insulated with the first conductive grid on the first conductive grid to obtain the conductive grid.
9. The utility model provides an OGS touch-control subassembly, its characterized in that includes cover plate glass, first electrically conductive net and the electrically conductive net of second, first electrically conductive net is directly established on cover plate glass's the silk screen face, the electrically conductive net of second is directly established on the first electrically conductive net, first electrically conductive net with the electrically conductive net of second is formed along the extension of predetermined route by the wire that surface coating has insulating glue solution, just first electrically conductive net through the solidification insulating glue solution with cover plate glass bonds, the electrically conductive net of second through the solidification insulating glue solution with first electrically conductive net bonds and insulating.
10. The OGS touch of claim 9, wherein the OGS touch is no less than 21.5 inches in size.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810846963.1A CN110764637B (en) | 2018-07-27 | 2018-07-27 | Manufacturing device, manufacturing method and application of conductive mesh-type touch sensing layer |
| PCT/CN2019/098007 WO2020020371A1 (en) | 2018-07-27 | 2019-07-26 | Manufacturing apparatus and manufacturing method for conductive mesh touch sensing layer and application |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810846963.1A CN110764637B (en) | 2018-07-27 | 2018-07-27 | Manufacturing device, manufacturing method and application of conductive mesh-type touch sensing layer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110764637A true CN110764637A (en) | 2020-02-07 |
| CN110764637B CN110764637B (en) | 2023-03-07 |
Family
ID=69181342
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810846963.1A Active CN110764637B (en) | 2018-07-27 | 2018-07-27 | Manufacturing device, manufacturing method and application of conductive mesh-type touch sensing layer |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110764637B (en) |
| WO (1) | WO2020020371A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111176498A (en) * | 2020-03-31 | 2020-05-19 | 朱恒 | Single-layer glass metal grid capacitive touch cover plate and preparation method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4918260A (en) * | 1985-07-26 | 1990-04-17 | Preleg, Inc. | Adhesive-coated wire and method and printed circuit board using same |
| JPH07117337A (en) * | 1993-10-27 | 1995-05-09 | Casio Comput Co Ltd | Method for formation of color material transferred image by conducting current |
| US6071553A (en) * | 1996-08-02 | 2000-06-06 | Alcatel | Method for producing melt-bonding wires |
| DE102007037165A1 (en) * | 2007-08-07 | 2009-02-12 | Mühlbauer Ag | Wire installing method for smart card, involves providing connection of thin conducting wire and substrate surface, and fixing up wire for hardening connecting material by utilizing electrostatic pressing force on substrate |
| WO2013034549A2 (en) * | 2011-09-06 | 2013-03-14 | Empa Eidgenössische Materialprüfungs- Und Forschungsanstalt | Elastomer coating head with a coating nozzle and use of expanding means |
| WO2015185879A1 (en) * | 2014-06-03 | 2015-12-10 | Ronald Peter Binstead | Method and apparatus for forming a wire structure |
| US20160042836A1 (en) * | 2014-08-08 | 2016-02-11 | Hitachi, Ltd. | Insulated Wire, Rotary Electric Machine, and Method for Manufacturing Insulated Wire |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8212139B2 (en) * | 2008-01-18 | 2012-07-03 | Tenksolar, Inc. | Thin-film photovoltaic module |
| CN103309506A (en) * | 2013-05-30 | 2013-09-18 | 南昌欧菲光科技有限公司 | One-layer multi-point touch control conductive film and manufacturing method thereof |
| CN104347153A (en) * | 2013-07-31 | 2015-02-11 | 南昌欧菲光科技有限公司 | Transparent conducting film |
| CN105353915B (en) * | 2015-12-01 | 2018-06-22 | 信利光电股份有限公司 | A kind of touch screen production method |
| CN106406615A (en) * | 2016-09-19 | 2017-02-15 | 广州视源电子科技股份有限公司 | A TDR touch screen manufacturing method |
-
2018
- 2018-07-27 CN CN201810846963.1A patent/CN110764637B/en active Active
-
2019
- 2019-07-26 WO PCT/CN2019/098007 patent/WO2020020371A1/en active Application Filing
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4918260A (en) * | 1985-07-26 | 1990-04-17 | Preleg, Inc. | Adhesive-coated wire and method and printed circuit board using same |
| JPH07117337A (en) * | 1993-10-27 | 1995-05-09 | Casio Comput Co Ltd | Method for formation of color material transferred image by conducting current |
| US6071553A (en) * | 1996-08-02 | 2000-06-06 | Alcatel | Method for producing melt-bonding wires |
| DE102007037165A1 (en) * | 2007-08-07 | 2009-02-12 | Mühlbauer Ag | Wire installing method for smart card, involves providing connection of thin conducting wire and substrate surface, and fixing up wire for hardening connecting material by utilizing electrostatic pressing force on substrate |
| WO2013034549A2 (en) * | 2011-09-06 | 2013-03-14 | Empa Eidgenössische Materialprüfungs- Und Forschungsanstalt | Elastomer coating head with a coating nozzle and use of expanding means |
| WO2015185879A1 (en) * | 2014-06-03 | 2015-12-10 | Ronald Peter Binstead | Method and apparatus for forming a wire structure |
| US20160042836A1 (en) * | 2014-08-08 | 2016-02-11 | Hitachi, Ltd. | Insulated Wire, Rotary Electric Machine, and Method for Manufacturing Insulated Wire |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111176498A (en) * | 2020-03-31 | 2020-05-19 | 朱恒 | Single-layer glass metal grid capacitive touch cover plate and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110764637B (en) | 2023-03-07 |
| WO2020020371A1 (en) | 2020-01-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105969237B (en) | The preparation method of anisotropic conductive film | |
| JP6560835B2 (en) | Filaments for hot melt lamination including electronic components | |
| CN101233655B (en) | Anisotropic conductive film and method for producing same | |
| CN105094425A (en) | Touch sensor, preparation method thereof and display device provided with touch sensor | |
| CN110764637B (en) | Manufacturing device, manufacturing method and application of conductive mesh-type touch sensing layer | |
| CN111610870A (en) | Touch panel | |
| CN109143699A (en) | A kind of display panel and its manufacturing method and display device | |
| KR101297369B1 (en) | Multilayer Elastomer Components having electric and elastic properties and Method for manufacturing the same | |
| CN111552411A (en) | Touch screen and preparation method thereof | |
| CN108492935B (en) | Method for preparing flexible stretchable conductive adhesive transparent conductive film | |
| CN204855991U (en) | Adjust luminance device and contain printing opacity volume variable sector of this device of flexibility | |
| JP2007531035A5 (en) | ||
| CN207458004U (en) | A kind of Trackpad and LED display | |
| JP5889623B2 (en) | System for attaching microwires | |
| TWI707258B (en) | Touch-sensing cover and manufacturing method thereof | |
| KR100666124B1 (en) | Method of fabricating anisotropic conductive film using electrospun | |
| CN108845707B (en) | Touch panel and manufacturing method thereof | |
| JP4463013B2 (en) | Narrow frame touch panel circuit forming apparatus and circuit forming method using the same | |
| JPWO2007108478A1 (en) | Electromagnetic wave absorber and absorbed electromagnetic wave control method | |
| CN212031896U (en) | Light adjusting film | |
| CN100384302C (en) | Electroluminescenjt tube illuminant line and its production method | |
| WO2017087475A1 (en) | Process for binding conductive ink to glass | |
| US20210319955A1 (en) | Ultrathin and flexible devices including circuit dies | |
| Sakai et al. | Printing and application of flexible and sodlerable electrodes for LED sheets | |
| CN110164291A (en) | Metal wire-drawing the panel tab, brush coating device and its production technology |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |