CN110756468A - Cleaning method of electronic component - Google Patents
Cleaning method of electronic component Download PDFInfo
- Publication number
- CN110756468A CN110756468A CN201911021582.0A CN201911021582A CN110756468A CN 110756468 A CN110756468 A CN 110756468A CN 201911021582 A CN201911021582 A CN 201911021582A CN 110756468 A CN110756468 A CN 110756468A
- Authority
- CN
- China
- Prior art keywords
- electronic component
- parts
- cleaning
- drying
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 47
- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000001035 drying Methods 0.000 claims abstract description 27
- 239000000428 dust Substances 0.000 claims abstract description 14
- 235000009161 Espostoa lanata Nutrition 0.000 claims abstract description 12
- 240000001624 Espostoa lanata Species 0.000 claims abstract description 12
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 12
- 238000005507 spraying Methods 0.000 claims abstract description 12
- 238000007598 dipping method Methods 0.000 claims abstract description 6
- 238000007790 scraping Methods 0.000 claims abstract description 6
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 22
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 22
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 claims description 11
- 229940117975 chromium trioxide Drugs 0.000 claims description 11
- WGLPBDUCMAPZCE-UHFFFAOYSA-N chromium trioxide Inorganic materials O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 11
- GAMDZJFZMJECOS-UHFFFAOYSA-N chromium(6+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Cr+6] GAMDZJFZMJECOS-UHFFFAOYSA-N 0.000 claims description 11
- 239000012153 distilled water Substances 0.000 claims description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 11
- 238000001816 cooling Methods 0.000 claims description 5
- 239000007921 spray Substances 0.000 claims description 5
- 238000001291 vacuum drying Methods 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 4
- 238000004381 surface treatment Methods 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- B08B1/143—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B5/00—Drying solid materials or objects by processes not involving the application of heat
- F26B5/04—Drying solid materials or objects by processes not involving the application of heat by evaporation or sublimation of moisture under reduced pressure, e.g. in a vacuum
Abstract
The invention provides a cleaning method of an electronic component, and relates to the technical field of electronic components. The cleaning method of the electronic component comprises the following steps: s1, preparing an electronic component pre-cleaning solution; s2, firstly wiping dust on the surface of the electronic component by using a dry towel, and scraping dust in a gap on the surface of the electronic component by using a cotton ball; s3, placing the electronic component in a vacuum environment, and uniformly spraying the prepared pre-cleaning solution on the surface of the electronic component; s4, spraying the electronic components in a vacuum environment for 5-10min, taking out, and then conveying the electronic components into drying equipment for drying; s5, preparing an absolute ethyl alcohol solution, and dipping a proper amount of absolute ethyl alcohol by using a cotton ball to wipe the surface of the electronic component. By reasonably carrying out surface treatment on the electronic components, the cleaning process of the electronic components is optimized, so that the cleaning mode of the electronic components is simpler, the cleaning efficiency is improved, and the cleaning effect of the electronic components is ideal.
Description
Technical Field
The invention relates to the technical field of electronic components, in particular to a cleaning method of an electronic component.
Background
The electronic component includes: the electronic device comprises a resistor, a capacitor, a potentiometer, an electronic tube, a radiator, an electromechanical element, a connector, a semiconductor discrete device, an electroacoustic device, a laser device, an electronic display device, a photoelectric device, a sensor, a power supply, a switch, a micro special motor, an electronic transformer, a relay, a printed circuit board, an integrated circuit, various circuits, piezoelectricity, crystals, quartz, a ceramic magnetic material, a base material substrate for a printed circuit, an electronic function process special material, an electronic adhesive (tape) product, an electronic chemical material, a component and the like, wherein the electronic component is a component of an electronic element and an electronic miniature machine or instrument and is usually composed of a plurality of parts.
The surface of the electronic component can be attached with certain dust and dirt along with the prolonging of the service life, and if the dust and dirt on the surface of the electronic component are not cleaned, the service performance of the electronic component can be influenced after a long time, so that the surface of the electronic component needs to be cleaned regularly.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a cleaning method of electronic components, which solves the problems that the cleaning mode of the electronic components is complicated, the cleaning efficiency is low, and the cleaning effect of the electronic components is not ideal.
(II) technical scheme
In order to achieve the purpose, the invention is realized by the following technical scheme: a cleaning method of an electronic component comprises the following steps:
s1, preparing an electronic component pre-cleaning solution;
s2, firstly wiping dust on the surface of the electronic component by using a dry towel, and scraping dust in a gap on the surface of the electronic component by using a cotton ball;
s3, placing the electronic component in a vacuum environment, atomizing and spraying the prepared pre-cleaning solution, and slowly rotating the electronic component to uniformly spray the atomized pre-cleaning solution on the surface of the electronic component;
s4, spraying the electronic component in a vacuum environment for 5-10min, taking out, then sending the electronic component into drying equipment for drying, wherein the drying temperature is within the range of 40-50 ℃, taking down the electronic component after drying for 2 hours, and cooling the electronic component to room temperature under natural conditions;
s5, preparing an absolute ethyl alcohol solution, dipping a proper amount of absolute ethyl alcohol by using a cotton ball to wipe the surface of the electronic component, repeatedly wiping for 3-5 times, and then sending into a vacuum drying oven to carry out drying treatment.
Preferably, the precleaning solution is composed of the following components in parts by weight: 100-120 parts of distilled water, 15-25 parts of chromium trioxide, 20-24 parts of sulfuric acid, 25-30 parts of ammonium fluoride and 25-30 parts of hydrofluoric acid.
Preferably, the precleaning solution is composed of the following components in parts by weight: 100 parts of distilled water, 15 parts of chromium trioxide, 20 parts of sulfuric acid, 25 parts of ammonium fluoride and 25 parts of hydrofluoric acid.
Preferably, the precleaning solution is composed of the following components in parts by weight: 110 parts of distilled water, 20 parts of chromium trioxide, 22 parts of sulfuric acid, 27 parts of ammonium fluoride and 27 parts of hydrofluoric acid.
Preferably, the precleaning solution is composed of the following components in parts by weight: 120 parts of distilled water, 25 parts of chromium trioxide, 24 parts of sulfuric acid, 30 parts of ammonium fluoride and 30 parts of hydrofluoric acid.
(III) advantageous effects
The invention provides a cleaning method of an electronic component. The method has the following beneficial effects:
1. according to the cleaning method of the electronic component, the surface treatment is reasonably carried out on the electronic component, the cleaning flow of the electronic component is optimized, the cleaning mode of the electronic component is simple, the cleaning efficiency is improved, and the cleaning effect of the electronic component is ideal.
2. According to the cleaning method of the electronic component, the pre-cleaning solution is reasonably prepared, so that the electronic component can be cleaned more cleanly, and the normal use of the electronic component is ensured.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to a plurality of embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The first embodiment is as follows:
the embodiment of the invention provides a cleaning method of an electronic component, which comprises the following steps:
s1, preparing an electronic component pre-cleaning solution;
s2, firstly wiping dust on the surface of the electronic component by using a dry towel, and scraping dust in a gap on the surface of the electronic component by using a cotton ball;
s3, placing the electronic component in a vacuum environment, atomizing and spraying the prepared pre-cleaning solution, and slowly rotating the electronic component to uniformly spray the atomized pre-cleaning solution on the surface of the electronic component;
s4, spraying the electronic component in a vacuum environment for 5-10min, taking out, then sending the electronic component into drying equipment for drying, wherein the drying temperature is within the range of 40-50 ℃, taking down the electronic component after drying for 2 hours, and cooling the electronic component to room temperature under natural conditions;
s5, preparing an absolute ethyl alcohol solution, dipping a proper amount of absolute ethyl alcohol by using a cotton ball to wipe the surface of the electronic component, repeatedly wiping for 3-5 times, and then sending into a vacuum drying oven to carry out drying treatment.
Wherein the precleaning solution comprises the following components in parts by weight: 100 parts of distilled water, 15 parts of chromium trioxide, 20 parts of sulfuric acid, 25 parts of ammonium fluoride and 25 parts of hydrofluoric acid.
Example two:
the embodiment of the invention provides a cleaning method of an electronic component, which comprises the following steps:
s1, preparing an electronic component pre-cleaning solution;
s2, firstly wiping dust on the surface of the electronic component by using a dry towel, and scraping dust in a gap on the surface of the electronic component by using a cotton ball;
s3, placing the electronic component in a vacuum environment, atomizing and spraying the prepared pre-cleaning solution, and slowly rotating the electronic component to uniformly spray the atomized pre-cleaning solution on the surface of the electronic component;
s4, spraying the electronic component in a vacuum environment for 5-10min, taking out, then sending the electronic component into drying equipment for drying, wherein the drying temperature is within the range of 40-50 ℃, taking down the electronic component after drying for 2 hours, and cooling the electronic component to room temperature under natural conditions;
s5, preparing an absolute ethyl alcohol solution, dipping a proper amount of absolute ethyl alcohol by using a cotton ball to wipe the surface of the electronic component, repeatedly wiping for 3-5 times, and then sending into a vacuum drying oven to carry out drying treatment.
Wherein the precleaning solution comprises the following components in parts by weight: 110 parts of distilled water, 20 parts of chromium trioxide, 22 parts of sulfuric acid, 27 parts of ammonium fluoride and 27 parts of hydrofluoric acid.
Example three:
the embodiment of the invention provides a cleaning method of an electronic component, which comprises the following steps:
s1, preparing an electronic component pre-cleaning solution;
s2, firstly wiping dust on the surface of the electronic component by using a dry towel, and scraping dust in a gap on the surface of the electronic component by using a cotton ball;
s3, placing the electronic component in a vacuum environment, atomizing and spraying the prepared pre-cleaning solution, and slowly rotating the electronic component to uniformly spray the atomized pre-cleaning solution on the surface of the electronic component;
s4, spraying the electronic component in a vacuum environment for 5-10min, taking out, then sending the electronic component into drying equipment for drying, wherein the drying temperature is within the range of 40-50 ℃, taking down the electronic component after drying for 2 hours, and cooling the electronic component to room temperature under natural conditions;
s5, preparing an absolute ethyl alcohol solution, dipping a proper amount of absolute ethyl alcohol by using a cotton ball to wipe the surface of the electronic component, repeatedly wiping for 3-5 times, and then sending into a vacuum drying oven to carry out drying treatment.
Wherein the precleaning solution comprises the following components in parts by weight: 120 parts of distilled water, 25 parts of chromium trioxide, 24 parts of sulfuric acid, 30 parts of ammonium fluoride and 30 parts of hydrofluoric acid.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. A method for cleaning an electronic component, comprising: the method comprises the following steps:
s1, preparing an electronic component pre-cleaning solution;
s2, firstly wiping dust on the surface of the electronic component by using a dry towel, and scraping dust in a gap on the surface of the electronic component by using a cotton ball;
s3, placing the electronic component in a vacuum environment, atomizing and spraying the prepared pre-cleaning solution, and slowly rotating the electronic component to uniformly spray the atomized pre-cleaning solution on the surface of the electronic component;
s4, spraying the electronic component in a vacuum environment for 5-10min, taking out, then sending the electronic component into drying equipment for drying, wherein the drying temperature is within the range of 40-50 ℃, taking down the electronic component after drying for 2 hours, and cooling the electronic component to room temperature under natural conditions;
s5, preparing an absolute ethyl alcohol solution, dipping a proper amount of absolute ethyl alcohol by using a cotton ball to wipe the surface of the electronic component, repeatedly wiping for 3-5 times, and then sending into a vacuum drying oven to carry out drying treatment.
2. A method for cleaning an electronic component as claimed in claim 1, characterized in that: the precleaning solution comprises the following components in parts by weight: 100-120 parts of distilled water, 15-25 parts of chromium trioxide, 20-24 parts of sulfuric acid, 25-30 parts of ammonium fluoride and 25-30 parts of hydrofluoric acid.
3. A method for cleaning an electronic component as claimed in claim 2, characterized in that: the precleaning solution comprises the following components in parts by weight: 100 parts of distilled water, 15 parts of chromium trioxide, 20 parts of sulfuric acid, 25 parts of ammonium fluoride and 25 parts of hydrofluoric acid.
4. A method for cleaning an electronic component as claimed in claim 2, characterized in that: the precleaning solution comprises the following components in parts by weight: 110 parts of distilled water, 20 parts of chromium trioxide, 22 parts of sulfuric acid, 27 parts of ammonium fluoride and 27 parts of hydrofluoric acid.
5. A method for cleaning an electronic component as claimed in claim 2, characterized in that: the precleaning solution comprises the following components in parts by weight: 120 parts of distilled water, 25 parts of chromium trioxide, 24 parts of sulfuric acid, 30 parts of ammonium fluoride and 30 parts of hydrofluoric acid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911021582.0A CN110756468A (en) | 2019-10-25 | 2019-10-25 | Cleaning method of electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911021582.0A CN110756468A (en) | 2019-10-25 | 2019-10-25 | Cleaning method of electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110756468A true CN110756468A (en) | 2020-02-07 |
Family
ID=69333914
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911021582.0A Pending CN110756468A (en) | 2019-10-25 | 2019-10-25 | Cleaning method of electronic component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110756468A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112247511A (en) * | 2020-10-09 | 2021-01-22 | 深圳市浩林自动化设备有限公司 | Assembling process and assembling equipment of camera module |
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|---|---|---|---|---|
| CN104831297A (en) * | 2015-05-08 | 2015-08-12 | 天津市津一电镀有限公司 | Chromium-plated part cleaning solution and use method thereof |
| CN108296215A (en) * | 2018-03-06 | 2018-07-20 | 中核(天津)科技发展有限公司 | A kind of stripping method of spraying hanging tool |
| CN108325915A (en) * | 2018-03-28 | 2018-07-27 | 安徽尼古拉电子科技有限公司 | A kind of electronic component surface film oxide cleaning device and method |
| CN108754460A (en) * | 2018-05-18 | 2018-11-06 | 蚌埠心里程电子科技有限公司 | A kind of Metal surface anti-corrosion automatically cleaning processing method |
| CN208800457U (en) * | 2018-08-17 | 2019-04-30 | 深圳市崧茂科技有限公司 | A kind of cleaning device after chip cutting |
-
2019
- 2019-10-25 CN CN201911021582.0A patent/CN110756468A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104831297A (en) * | 2015-05-08 | 2015-08-12 | 天津市津一电镀有限公司 | Chromium-plated part cleaning solution and use method thereof |
| CN108296215A (en) * | 2018-03-06 | 2018-07-20 | 中核(天津)科技发展有限公司 | A kind of stripping method of spraying hanging tool |
| CN108325915A (en) * | 2018-03-28 | 2018-07-27 | 安徽尼古拉电子科技有限公司 | A kind of electronic component surface film oxide cleaning device and method |
| CN108754460A (en) * | 2018-05-18 | 2018-11-06 | 蚌埠心里程电子科技有限公司 | A kind of Metal surface anti-corrosion automatically cleaning processing method |
| CN208800457U (en) * | 2018-08-17 | 2019-04-30 | 深圳市崧茂科技有限公司 | A kind of cleaning device after chip cutting |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112247511A (en) * | 2020-10-09 | 2021-01-22 | 深圳市浩林自动化设备有限公司 | Assembling process and assembling equipment of camera module |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20200207 |
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| WD01 | Invention patent application deemed withdrawn after publication |