CN110739253B - Wafer cassette carrier and wafer cassette carrier apparatus - Google Patents
Wafer cassette carrier and wafer cassette carrier apparatus Download PDFInfo
- Publication number
- CN110739253B CN110739253B CN201810788768.8A CN201810788768A CN110739253B CN 110739253 B CN110739253 B CN 110739253B CN 201810788768 A CN201810788768 A CN 201810788768A CN 110739253 B CN110739253 B CN 110739253B
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- module
- machine body
- movable door
- control module
- wafer box
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- 238000007664 blowing Methods 0.000 claims abstract description 38
- 235000012431 wafers Nutrition 0.000 claims description 213
- 238000004891 communication Methods 0.000 claims description 60
- 238000005192 partition Methods 0.000 claims description 27
- 230000000712 assembly Effects 0.000 claims description 23
- 238000000429 assembly Methods 0.000 claims description 23
- 238000005086 pumping Methods 0.000 claims description 20
- 238000001179 sorption measurement Methods 0.000 claims description 15
- 239000007789 gas Substances 0.000 description 45
- 238000001514 detection method Methods 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a wafer box carrying device, which comprises: the machine comprises a machine body, a control module, a door frame structure and a door body module. The machine body is reserved with a containing space so that related personnel can selectively set the air exhausting module. The machine body is used for bearing a tray body of the wafer box and is provided with a plurality of reserved grooves so as to enable related personnel to selectively set the gas auxiliary assembly. The exhaust module, the gas auxiliary assembly and the control module can be matched with each other to perform gas exchange operation in the wafer box. The door frame structure, the door body module and the control module can be matched with each other to open the cover body of the wafer box. The door frame structure is kept away from the structure, the component that set up the module of blowing in advance in one side of disk body to let relevant personnel set up the module of blowing selectively, thereby make the module of blowing form the air curtain in the one side of the wafer box that is opened.
Description
Technical Field
The present invention relates to a carrier device and a carrier apparatus, and more particularly, to a wafer cassette carrier device and a wafer cassette carrier apparatus for transporting wafer cassettes.
Background
The existing devices for transferring cassettes have mostly only a single function, such as a workstation for temporarily storing cassettes or a workstation for inflating the interior of cassettes. Because of the limited space in the factory building, how to enable a single workstation to support or perform a plurality of different operations has become a requirement of related manufacturers.
Disclosure of Invention
The present invention is directed to a wafer cassette carrier and a wafer cassette carrier apparatus, which are used to solve the problem that the workstation of the wafer cassette cannot support or execute various operations according to the requirements of the manufacturer in the prior art.
In order to achieve the above object, the present invention provides a wafer cassette carrier apparatus comprising: the wafer box comprises a machine body, a plurality of storage tanks and a plurality of storage tanks, wherein the machine body comprises a tray body which comprises a plurality of reserved grooves and is used for providing a wafer box arrangement; each reserved groove is used for arranging a gas auxiliary assembly; the machine body is internally provided with a first accommodating space and a second accommodating space; the second accommodating space is used for accommodating an air pumping and exhausting module, and the air pumping and exhausting module is used for being connected with the gas auxiliary assembly so as to perform gas exchange operation on the inside of the wafer box arranged on the machine body through the gas auxiliary assembly; the control module is arranged in the machine body and is correspondingly positioned in the first accommodating space; the door frame structure is arranged on the machine body and comprises a communication port; the door frame structure is far away from one side of the tray body, and can be provided with an air blowing module; the control module can be electrically connected with the air blowing module so as to control the air blowing module to blow a preset gas to the communication port; the door body module comprises a driving mechanism and a movable door, the driving mechanism is arranged on the machine table body, the movable door is connected with the driving mechanism, and the control module can control the driving mechanism to act so that the movable door shields the communication port or does not shield the communication port; the movable door is provided with a door opening module which can be driven by the driving mechanism to be connected with a cover body of the wafer box arranged on the machine body; when the control module controls the driving mechanism to enable the door opening module of the movable door to be connected with the wafer box arranged on the machine body, the control module can control the driving mechanism to act so that the movable door and a cover body of the wafer box connected with the movable door are separated from the communication port together, and the inside of the wafer box can be communicated with the outside through the communication port; when the door frame structure is provided with the blowing module, and the control module controls the movable door to be connected with the wafer box arranged on the machine body, the control module can control the blowing module to act so as to form air flow flowing towards the machine body in the area of the communication port.
Preferably, the wafer cassette carrier further includes a plurality of gas auxiliary assemblies, each gas auxiliary assembly is detachably disposed in a plurality of the reserved grooves, each gas auxiliary assembly includes a fixing seat and a nozzle, the fixing seat can be fixedly disposed in the reserved groove, the nozzle is disposed in the fixing seat, the nozzle can be mutually fixed with the wafer cassette disposed on the tray body, and the nozzle can mutually cooperate with the air pumping and exhausting module to exchange gas in the wafer cassette; the machine body is provided with a sliding module, the sliding module is mutually connected with the disc body, and the sliding module can be controlled by the control module to drive the disc body to move towards the direction close to the communication port or drive the disc body to move towards the direction far away from the communication port.
Preferably, the movable door is provided with a counter; when the movable door is connected with the wafer box arranged on the machine body, and the movable door drives the cover body of the wafer box to move together, the counter can be controlled by the control module to calculate the number of wafers arranged in the wafer box.
Preferably, the counter comprises a transmitting unit and a receiving unit, wherein the transmitting unit is pivoted to the movable door, and the receiving unit is pivoted to the movable door; when the movable door is connected with the wafer box arranged on the machine body, and the movable door drives the cover body of the wafer box to move together, the control module can control the transmitting unit and the receiving unit to rotate relative to the movable door, so that the transmitting unit and the receiving unit are arranged opposite to each other, and the transmitting unit and the receiving unit opposite to each other can move along with the movable door so as to calculate the number of wafers arranged in the wafer box.
Preferably, the door opening module comprises at least two clamping components and at least two adsorption components, and the two clamping components can be controlled by the control module to be mutually clamped with the cover body of the wafer box arranged on the machine body; each adsorption component is connected with the exhaust module; when the two clamping assemblies are mutually clamped with the cover body of the wafer box, the control module can control the air pumping and exhausting module to perform air exchange operation on the wafer box; a partition board is arranged in the machine body, two opposite side surfaces of the partition board are respectively the first accommodating space and the second accommodating space, and the control module is fixedly arranged at one side of the partition board; the other side of the partition board is used for fixing the pumping and exhausting module; the machine body is further provided with a shell below the tray body, the shell is detachably arranged on the machine body, and when the shell is detached from the machine body, the partition plate and the control module can be exposed out of the machine body.
In order to achieve the above object, the present invention also provides a wafer cassette carrier apparatus comprising: a wafer cassette carrier comprising: the wafer cassette comprises a machine body, a wafer storage device and a control device, wherein the machine body comprises a tray body, the tray body comprises a plurality of reserved grooves, and the tray body is used for bearing a wafer box; the machine body is internally provided with a first accommodating space and a second accommodating space; the control module is arranged in the machine body and is correspondingly positioned in the first accommodating space; the door frame structure is arranged on the machine body and comprises a communication port; the door body module comprises a driving mechanism and a movable door, the driving mechanism is arranged on the machine table body, the movable door is connected with the driving mechanism, and the control module can control the driving mechanism to act so that the movable door shields the communication port or does not shield the communication port; the movable door is provided with a door opening module which can be driven by the driving mechanism to be connected with a cover body of the wafer box arranged on the machine body; an auxiliary device, comprising: the blowing module is detachably arranged on one side of the door frame structure, which is far away from the tray body; the air blowing module is electrically connected with the control module, and the control module can control the air blowing module to blow a preset gas to the communication port; the gas auxiliary assemblies are correspondingly arranged on the reserved grooves; the air exhausting module is detachably arranged in the machine body and correspondingly positioned in the second accommodating space, the air exhausting module is connected with a plurality of gas auxiliary assemblies, and the air exhausting module can be controlled to enable at least one gas auxiliary assembly to perform gas exchange operation on the inside of the wafer box arranged on the machine body; when the control module controls the driving mechanism to enable the door opening module of the movable door to be connected with the wafer box arranged on the machine body, the control module can control the driving mechanism to act so that the movable door and a cover body of the wafer box connected with the movable door are separated from the communication port together, and the inside of the wafer box can be communicated with the outside through the communication port; when the control module controls the movable door to be connected with the wafer box arranged on the machine body, the control module can control the air blowing module to act so as to form air flow flowing towards the machine body in the area of the communication port.
Preferably, the wafer cassette carrier further comprises a plurality of gas auxiliary assemblies, each gas auxiliary assembly is detachably disposed in a plurality of the reserved grooves, and each gas auxiliary assembly comprises a fixing seat and a sucker; the machine body is provided with a sliding module, the sliding module is mutually connected with the disc body, and the sliding module can be controlled by the control module to drive the disc body to move towards the direction close to the communication port or drive the disc body to move towards the direction far away from the communication port.
Preferably, the movable door is provided with a counter; when the movable door is connected with the wafer box arranged on the machine body, and the movable door drives the cover body of the wafer box to move together, the counter can be controlled by the control module to calculate the number of wafers arranged in the wafer box.
Preferably, the counter comprises a transmitting unit and a receiving unit, wherein the transmitting unit is pivoted to the movable door, and the receiving unit is pivoted to the movable door; when the movable door is connected with the wafer box arranged on the machine body, and the movable door drives the cover body of the wafer box to move together, the control module can control the transmitting unit and the receiving unit to rotate relative to the movable door, so that the transmitting unit and the receiving unit are arranged opposite to each other, and the transmitting unit and the receiving unit opposite to each other can move along with the movable door so as to calculate the number of wafers arranged in the wafer box.
Preferably, the door opening module comprises at least two clamping components and at least two adsorption components, and the two clamping components can be controlled by the control module to be mutually clamped with the cover body of the wafer box arranged on the machine body; each adsorption component is connected with the exhaust module; when the two clamping assemblies are mutually clamped with the cover body of the wafer box, the control module can control the air pumping and exhausting module to perform air exchange operation on the wafer box; a partition board is arranged in the machine body, two opposite side surfaces of the partition board are respectively the first accommodating space and the second accommodating space, and the control module is fixedly arranged at one side of the partition board; the other side of the partition board is used for fixing the pumping and exhausting module; the machine body is further provided with a shell below the tray body, the shell is detachably arranged on the machine body, and when the shell is detached from the machine body, the partition plate and the control module can be exposed out of the machine body.
The beneficial effects of the invention can be as follows: the tray body of the wafer box carrying device is provided with a plurality of reserved grooves and a second accommodating space, so that a relevant manufacturer of the wafer box carrying device can add the gas auxiliary components and the gas pumping and exhausting modules in the reserved grooves and the second accommodating space according to the requirements of relevant users, thereby the wafer box carrying device can not only utilize the door body module to open the cover body of the wafer box so as to enable relevant personnel or equipment to take and put wafers in the wafer box, but also utilize the mutual matching of the gas auxiliary components and the gas pumping and exhausting modules to carry out gas exchange operation on the interior of the wafer box. The wafer box carrying equipment of the invention not only can open the cover body of the wafer box so that related personnel or equipment can take and place the wafers arranged in the wafer box, but also can perform gas exchange operation in the wafer box.
Drawings
Fig. 1 is a schematic view of a wafer cassette carrier apparatus of the present invention.
Fig. 2 is a partially exploded view of the wafer cassette carrier apparatus of the present invention.
Fig. 3 is an enlarged partial schematic view of the wafer cassette carrier apparatus of the present invention.
Fig. 4 is a partially exploded view of the wafer cassette carrier apparatus of the present invention.
Fig. 5 is a schematic view of another view of the wafer cassette carrier apparatus of the present invention.
Fig. 6 is another partially exploded view of the wafer cassette carrier apparatus of the present invention.
Fig. 7 is a schematic view of a wafer cassette.
Fig. 8 is a schematic view of a cassette carrier apparatus of the present invention provided with a cassette.
Fig. 9 is a schematic view illustrating the operation of the cassette loading apparatus of the present invention provided with a cassette.
FIG. 10 is a schematic view of the flow of gas inside a wafer cassette disposed on a cassette carrier apparatus of the present invention.
Detailed Description
Referring to fig. 1-4, a schematic diagram of a wafer cassette carrier apparatus according to the present invention is shown. The cassette carrier apparatus 100 includes a cassette carrier 10 and an auxiliary device 20. The wafer cassette carrier 10 includes a platen body 11, a control module 12, a door frame structure 13, and a door module 14. The auxiliary device 20 comprises a blowing module 21, a plurality of gas auxiliary components 22 and an exhausting module 23.
The machine body 11 is provided with a tray 111 and a housing 112. The housing 112 is detachably disposed on the machine body 11. The machine body 11 is provided with a partition board 113, and the partition board 113 and the housing 112 can form a first accommodating space SP1 and a second accommodating space SP2 corresponding to the machine body 11. The control module 12 is fixedly disposed on one side of the partition 113, and the control module 12 is correspondingly disposed in the first accommodating space SP1. The other side of the partition 113 is provided with an exhaust module 23, and the exhaust module 23 is correspondingly located in the second accommodating space SP2. In practical applications, the exhaust module 23 can be electrically connected to the control module 12 through related electrical connection wires, electrical connectors, etc., and the control module 12 can control the operation of the exhaust module 23 accordingly.
The tray 111 has a plurality of pre-grooves 1111, and a plurality of gas assist assemblies 22 are detachably disposed in the plurality of pre-grooves 1111. Each gas auxiliary assembly 22 may include a fixing base 221 and a nozzle 222, where the fixing base 221 can be fixedly disposed on the machine body 11 and correspondingly located in the reserved groove 1111, the nozzle 222 is fixedly disposed in the fixing base 221, and a portion of the nozzle 222 may protrude outside the disc 111. The plurality of gas assist assemblies 22 are connected to the pumping module 23 through a plurality of tubes (not shown). When the wafer cassette F is disposed on the tray 111, the plurality of nozzles 222 can be correspondingly connected to the plurality of air holes F111 (as shown in fig. 6) of the wafer cassette F, and the air exhausting module 23 can exhaust the air in the wafer cassette F through at least one nozzle 222, and send at least one predetermined air (such as XCDA, CDA, or inert gas) into the wafer cassette F through at least one nozzle 222. As shown in fig. 7, the wafer cassette F of the present embodiment includes a body F1 and a cover F2, a space is formed in the body F1, the cover F2 is detachably disposed on one side of the body F1, a base F11 is disposed at the bottom of the body F1, and the base F11 is used for fixing the body F1 on the tray 111.
In the drawings, the tray 111 has six pre-grooves 1111 as an example, but the number and arrangement positions thereof may be changed according to different sizes and types of wafer cassettes F. In a specific application, the exhaust module 23 may be matched with two or four gas auxiliary components 22 according to the number of the air holes F111 of the wafer cassette F to perform gas exchange operation on the interior of the wafer cassette F.
It should be noted that the tray 111 may further have a plurality of communication slots 1112, the plurality of communication slots 1112 are in communication with the plurality of reserved slots 1111, and a pipe (not shown) for connecting the plurality of gas auxiliary assemblies 22 can be correspondingly disposed in the plurality of communication slots 1112. Of course, in different applications, the pipe body connecting the plurality of gas auxiliary assemblies 22 may be hidden in the machine body 11, and the tray 111 is not provided with the communication groove 1112.
In order to effectively fix the wafer cassette F disposed on the tray 111, the tray 111 may be provided with a fixing element 114, a plurality of auxiliary positioning elements 115, and a plurality of different detecting elements 116, 117. The fixing component 114 may be disposed at a central position of the tray 111, and the fixing component 114 may have a locking structure 1141, where the locking structure 1141 can be controlled by the control module 12 to lift and lower relative to the tray 111. When the wafer cassette F is fixedly disposed on the tray 111, the engaging structure 1141 can be controlled to be lifted and correspondingly enter the engaging hole F112 (as shown in fig. 6) of the wafer cassette F, and then the control module 12 can further control the engaging structure 1141 to rotate, so that the engaging structure 1141 and the wafer cassette F are engaged with each other.
The auxiliary positioning elements 115 may protrude from the positioning posts of the tray 111, and may be engaged with corresponding holes of the wafer cassette F. The detecting component 116 may read the data stored in the corresponding component on the wafer cassette F wirelessly, for example, the detecting component 116 may read the data stored in the corresponding component (e.g., electronic tag) disposed on the wafer cassette F using RFID technology. The detecting component 117 may be used to detect whether the wafer cassette F is disposed on the tray 111, and the detecting component 117 may also be used to detect the type of the wafer cassette F disposed on the tray 111; the control module 12 can correspondingly control the operations of the air exhausting module 23 and the door module 14 according to the detected results of the detecting components 116 and 117.
The door frame structure 13 is disposed on the machine body 11, and the door frame structure 13 is correspondingly disposed on one side of the tray 111, where the door frame structure 13 includes a communication opening 13A. The aperture of the communication port 13A is larger than the lid F2 of the wafer cassette F. The side of the door frame structure 13 away from the tray 111 can be provided with a blowing module 21, and the blowing module 21 is detachably arranged on the door frame structure 13. The air blowing module 21 can be controlled by the control module 12 to blow a predetermined air (such as XCDA, CDA, or inert gas) toward the machine body 11, so as to form an air curtain flowing toward the machine body 11at a side of the communication port 13A away from the tray 111. In a specific application, the air blowing module 21 may have at least one air hole plate 211 therein, and the air introduced into the air blowing module 21 may pass through the air hole plate 211 and then be uniformly discharged from the air blowing module 21.
Referring to fig. 4 to 6, the door module 14 is disposed on the machine body 11. The door module 14 includes a driving mechanism 141 and a movable door 142, the driving mechanism 141 is disposed on the machine body 11, and the movable door 142 is connected to the driving mechanism 141. The driving mechanism 141 is electrically connected to the control module 12, and the control module 12 can control the driving mechanism 141 to operate so that the movable door 142 covers the communication opening 13A or does not cover the communication opening 13A. Specifically, the movable door 142 and the air blowing module 21 are disposed on the opposite side of the machine body 11 to the side on which the tray 111 is disposed, and the movable door 142 can be driven by the driving mechanism 141 to move relative to the machine body 11, so that the movable door 142 can move from a position where the communication port 13A is shielded to a position where the communication port 13A is not shielded, or from a position where the communication port 13A is not shielded to a position where the communication port 13A is shielded. In the present embodiment, when the movable door 142 is driven in a state of shielding the communication port 13A, the movable door 142 will move in a direction away from the door frame structure 13, but the movable door 142 is correspondingly hidden under the communication port 13A, but the movement mode and the position of the movable door 142 may be changed according to the requirement. The manner in which the driving mechanism 141 is connected to the movable door 142 is not limited thereto.
As shown in fig. 5 to 7, the movable door 142 is provided with a door opening module 15, and the door opening module 15 can be driven by the driving mechanism 141 to be connected with the cover F2 of the wafer cassette F provided on the machine body 11. Specifically, the door opening module 15 includes a locking component 151 and two adsorbing components 152. The locking assembly 151 includes two fixing members 1511 and a linkage 1512, wherein one end of each fixing member 1511 is exposed out of one side of the movable door 142, the linkage 1512 is connected with the two fixing members 1511, and the linkage 1512 can be controlled by the control module 12 to drive the two fixing members 1511 to actuate, so that the two fixing members 1511 are locked with the fixing holes F21 of the cover F2 of the wafer cassette F. After the two fixing members 1511 are engaged with the fixing holes F21 of the cover F2, the control module 12 can control the driving mechanism 141 to move the movable door 142 and the cover F2 together in a direction away from the door frame 13, so that the inside F1a of the wafer cassette F can be communicated with the outside through the communication port 13A, and therefore, related devices or personnel can take out the wafers in the wafer cassette F through the communication port 13A or set the wafers in the wafer cassette F.
In a specific embodiment, as shown in fig. 4, the machine body 11 may further be provided with a sliding module 16, where the tray 111 is connected with the sliding module 16, and the sliding module 16 can be controlled by the control module 12 to drive the tray 111 to move in a direction approaching the communication port 13A or drive the tray 111 to move in a direction separating from the communication port 13A. In practical applications, the sliding module 16 may include a wired rail, a slider, and the like, for example. In a specific implementation, the control module 12 may control the tray 111 to move toward the communication port 13A of the door frame structure 13 when the wafer cassette F is stably disposed on the tray 111 according to the detection result of the detection components 116 and 117.
The embodiment in which the control module 12 controls the door opening module 15 to drive the cover F2 of the wafer cassette F by using the movable door 142 may be that the control module 12 first controls the sliding module 16 to make the tray 111 drive the wafer cassette F to move relative to the machine body 11, so that the cover F2 of the wafer cassette F can be correspondingly attached to one side of the movable door 142. Then, the control module 12 uses a related detector (not shown) disposed on the movable door 142 to control the linkage mechanism 1512 to act when confirming that the cover F2 is attached to one side of the movable door 142, so as to fix the two fixing members 1511 and the cover F2 to each other.
In a different application, the movable door 142 may also cooperate with the driving mechanism 141, and the driving mechanism 141 can be controlled by the control module 12 to move the movable door 142 toward the cover F2, so as to be attached to the cover F2 of the wafer cassette F; in other words, in different embodiments, the table body 11 may not be provided with the sliding module 16, and the movable door 142 may be controlled by the driving mechanism 141 to move in a direction approaching or separating from the wafer cassette F relative to the table body 11.
The two adsorption assemblies 152 may be connected to the pumping module 23 or may be independently connected to another pumping module, without limitation. Each of the adsorption elements 152 may include an adsorption plate 1521 and an air tap 1522, wherein the adsorption plate 1521 is used for adsorbing the cover F2, the air tap 1522 is disposed in the adsorption plate 1521, and a portion of the air tap 1522 may be exposed to the adsorption plate 1521. Each of the pump out modules 23 can cooperate with the air tap 1522 to draw in air through the air tap 1522 or to exhaust air through the air tap 1522.
As shown in fig. 5, 6 and 8 to 10, the movable door 142 may be further provided with a counter 17. When the movable door 142 is connected with the wafer cassette F disposed on the machine body 11, and the movable door 142 drives the cover F2 of the wafer cassette F to move together, the counter 17 can be controlled by the control module 12 to count the number of wafers disposed in the wafer cassette F. The method for counting the wafers in the wafer cassette F by the counter 17 may be, for example, optical detection, image capturing and image analysis, etc., which are not limited thereto.
For example, the counter 17 may include a transmitting unit 171 and a receiving unit 172, wherein the transmitting unit 171 is pivotally connected to the movable door 142, and the receiving unit 172 is pivotally connected to the movable door 142. The transmitting unit 171 may be, for example, a member that emits infrared rays, and the receiving unit 172 may be a member that can correspondingly receive infrared rays. When the movable door 142 is connected to the wafer cassette F disposed on the machine body 11, and the movable door 142 drives the cover F2 of the wafer cassette F to move together, the control module 12 can control the transmitting unit 171 and the receiving unit 172 to rotate relative to the movable door 142, so that the transmitting unit 171 and the receiving unit 172 extend into the wafer cassette F respectively, and the transmitting unit 171 and the receiving unit 172 can be disposed substantially opposite to each other, so that the transmitting unit 171 and the receiving unit 172 can cooperate with each other, and the number of wafers disposed in the wafer cassette F can be calculated as the movable door 142 moves relative to the wafer cassette F.
As shown in fig. 2, 3 and 10, when the movable door 142 brings the cover F2 away from the cassette F, the inside of the cassette F can communicate with the outside. At this time, the control module 12 may control the air-extracting and exhausting module 23, and cooperate with the air-assisting component 22 to perform air exchange operation on the inside of the wafer box F, and the control module 12 may simultaneously control the air-extracting and exhausting module 23, cooperate with the air-blowing module 21 to form an air curtain outside the wafer box F, thereby effectively preventing external dirt from entering the wafer box F.
When the related equipment or personnel does not need to pick up and put the wafers in the wafer cassette F, the control module 12 can control the driving mechanism 141 to make the movable door 142 drive the cover body F2, so as to set the cover body F2 back onto the wafer cassette F; the control module 12 may control the exhaust module 23 to perform gas exchange operation inside the wafer cassette F by using the gas assist assembly 22 and the two adsorption assemblies 152, for example, the two adsorption assemblies 152 may be used to charge clean gas such as XCDA, CDA, etc. or inert gas into the wafer cassette F, and at least one gas assist assembly 22 may be used to exhaust the gas in the wafer cassette F. When the movable door 142 and the cover F2 are fixed to each other, the air nozzles 1522 of the two adsorption assemblies 152 are correspondingly communicated with the air holes F22 of the cover F2, so that the air pumping and exhausting module 23 can send the predetermined gas into the wafer box F through the air nozzles 1522.
Referring to fig. 2,4 and 6, a schematic diagram of the wafer cassette carrier of the present invention is also shown. Only some of the components of the wafer cassette carrier apparatus 10 will be emphasized below, and the remaining non-described components are the same as those in the foregoing embodiments and will not be described again.
As shown in fig. 2, the wafer cassette carrier apparatus 10 of the present invention includes a partition 113 disposed in the main body 11, a control module 12 disposed on one side of the partition 113, and an exhaust module 23 disposed on the other side of the partition 113 according to the requirements of the manufacturer. In other words, the cabinet body 11 of the wafer cassette carrier 10 has a space (i.e., the second accommodating space SP2 in the foregoing embodiment) reserved for installing the exhaust module 23 to the relevant manufacturer, and the manufacturer of the wafer cassette carrier 10 can install or not install the exhaust module 23 in the cabinet body 11 according to the requirement of the purchaser of the wafer cassette carrier 10.
As shown in fig. 4, the tray 111 of the wafer cassette carrier 10 of the present invention may have a plurality of pre-grooves 1111, and the plurality of pre-grooves 1111 may be provided with a plurality of gas auxiliary components 22 according to the requirements of the related manufacturer. The tray 111 may also have a plurality of communication slots 1112, wherein the plurality of communication slots 1112 are interconnected with the plurality of pre-grooves 1111, and the plurality of communication slots 1112 can be configured to provide a conduit for connecting the plurality of gas auxiliary assemblies 22. In other words, the tray 111 disposed on the base 11 of the wafer cassette carrier 10 has a plurality of pre-grooves 1111 reserved for installing the gas auxiliary components 22 to the relevant manufacturer, and the manufacturer of the wafer cassette carrier 10 can install or not install a plurality of gas auxiliary components 22 on the tray 111 according to the requirement of the purchaser of the wafer cassette carrier 10.
As shown in fig. 6, the door frame structure 13 of the wafer cassette carrier 10 of the present invention may be provided with the air blowing module 21 according to the requirement, that is, the side of the door frame structure 13 opposite to the tray 111 is reserved with the related structure and components for installing the air blowing module 21, and the manufacturer of the wafer cassette carrier 10 may install or not install the air blowing module 21 on the door frame structure 13 according to the requirement of the purchaser of the wafer cassette carrier 10.
As described above, in the wafer cassette carrier apparatus 10 of the present invention, since the reserved space is provided in the main body 11 of the platen, the reserved grooves 1111 are provided on the platen 111, and the related structures and components for installing the air blowing module 21 are reserved on the door frame structure 13, the manufacturer of the wafer cassette carrier apparatus 10 can install the air exhausting module 23, the air assisting component 22 and the air blowing module 21 on the wafer cassette carrier apparatus 10 according to the requirement of the buyer. In the wafer box carrier 10, without the plurality of gas auxiliary components 22, the air exhausting module 23 and the air blowing module 21, the wafer box carrier 10 can utilize the cooperation of the tray 111, the door frame structure 13 and the door opening module 15 to carry the wafer box F and open the cover F2 of the wafer box F, so that related equipment or personnel can take and put the wafers in the wafer box F.
In the case that the wafer box carrier 10 is provided with a plurality of gas auxiliary components 22, a pumping and exhausting module 23 and a blowing module 21, the wafer box carrier 10 can not only achieve the functions of carrying the wafer box F and opening the cover body F2 of the wafer box F, but also perform gas exchange operation in the wafer box F, and the wafer box carrier 10 can also utilize the blowing module 21 to avoid that dirt outside the wafer box F easily enters the wafer box F.
Claims (10)
1. A wafer cassette carrier, the wafer cassette carrier comprising:
the wafer box comprises a machine body, a plurality of storage tanks and a plurality of storage tanks, wherein the machine body comprises a tray body which comprises a plurality of reserved grooves and is used for providing a wafer box arrangement; each reserved groove is used for arranging a gas auxiliary assembly; the machine body is internally provided with a first accommodating space and a second accommodating space; the second accommodating space is used for accommodating an air pumping and exhausting module, and the air pumping and exhausting module is used for being connected with the gas auxiliary assembly so as to perform gas exchange operation on the inside of the wafer box arranged on the machine body through the gas auxiliary assembly;
The control module is arranged in the machine body and is correspondingly positioned in the first accommodating space;
the door frame structure is arranged on the machine body and comprises a communication port; the door frame structure is far away from one side of the tray body, and can be provided with an air blowing module; the control module can be electrically connected with the air blowing module so as to control the air blowing module to blow a preset gas to the communication port;
the door body module comprises a driving mechanism and a movable door, the driving mechanism is arranged on the machine table body, the movable door is connected with the driving mechanism, and the control module can control the driving mechanism to act so that the movable door shields the communication port or does not shield the communication port; the movable door is provided with a door opening module which can be driven by the driving mechanism to be connected with a cover body of the wafer box arranged on the machine body;
when the control module controls the driving mechanism to enable the door opening module of the movable door to be connected with the wafer box arranged on the machine body, the control module can control the driving mechanism to act so as to enable the movable door and a cover body of the wafer box connected with the movable door to be separated from the communication port together, and enable the interior of the wafer box to be communicated with the outside through the communication port;
When the door frame structure is provided with the blowing module, and the control module controls the movable door to be connected with the wafer box arranged on the machine body, the control module can control the blowing module to act so as to form air flow flowing towards the machine body in the area of the communication port.
2. The wafer cassette carrier of claim 1, further comprising a plurality of said gas assist assemblies, each of said gas assist assemblies being removably disposed in a plurality of said recesses, each of said gas assist assemblies comprising a holder fixedly disposed in said recesses and a nozzle fixedly disposed in said holder, said nozzle being capable of being secured to said wafer cassette disposed on said tray, said nozzle being capable of cooperating with said evacuation module for exchanging gas within said wafer cassette; the machine body is provided with a sliding module, the sliding module is mutually connected with the disc body, and the sliding module can be controlled by the control module to drive the disc body to move towards the direction close to the communication port or drive the disc body to move towards the direction far away from the communication port.
3. The wafer cassette carrier of claim 1, wherein the moveable door is provided with a counter; when the movable door is connected with the wafer box arranged on the machine body, and the movable door drives the cover body of the wafer box to move together, the counter can be controlled by the control module to calculate the number of wafers arranged in the wafer box.
4. The wafer cassette carrier of claim 3, wherein the counter comprises a transmitter unit and a receiver unit, the transmitter unit being pivotally coupled to the moveable door, the receiver unit being pivotally coupled to the moveable door; when the movable door is connected with the wafer box arranged on the machine body, and the movable door drives the cover body of the wafer box to move together, the control module can control the transmitting unit and the receiving unit to rotate relative to the movable door, so that the transmitting unit and the receiving unit are arranged opposite to each other, and the transmitting unit and the receiving unit opposite to each other can move along with the movable door so as to calculate the number of wafers arranged in the wafer box.
5. The wafer cassette carrier of claim 1, wherein the door opening module comprises at least two engaging components and at least two adsorbing components, the two engaging components being capable of being controlled by the control module to engage with a cover of the wafer cassette disposed on the machine body; each adsorption component is connected with the exhaust module; when the two clamping assemblies are mutually clamped with the cover body of the wafer box, the control module can control the air pumping and exhausting module to perform air exchange operation on the wafer box; a partition board is arranged in the machine body, two opposite side surfaces of the partition board are respectively the first accommodating space and the second accommodating space, and the control module is fixedly arranged at one side of the partition board; the other side of the partition board is used for fixing the pumping and exhausting module; the machine body is further provided with a shell below the tray body, the shell is detachably arranged on the machine body, and when the shell is detached from the machine body, the partition plate and the control module can be exposed out of the machine body.
6. A wafer cassette carrier apparatus, the wafer cassette carrier apparatus comprising:
a wafer cassette carrier comprising:
The wafer box comprises a machine body, a plurality of storage racks and a plurality of storage racks, wherein the machine body comprises a tray body which comprises a plurality of reserved grooves and is used for bearing a wafer box; the machine body is internally provided with a first accommodating space and a second accommodating space;
The control module is arranged in the machine body and is correspondingly positioned in the first accommodating space;
the door frame structure is arranged on the machine body and comprises a communication port; and
The door body module comprises a driving mechanism and a movable door, the driving mechanism is arranged on the machine table body, the movable door is connected with the driving mechanism, and the control module can control the driving mechanism to act so that the movable door shields the communication port or does not shield the communication port; the movable door is provided with a door opening module which can be driven by the driving mechanism to be connected with a cover body of the wafer box arranged on the machine body; and
An auxiliary device, comprising:
The blowing module is detachably arranged on one side of the door frame structure, which is far away from the tray body; the air blowing module is electrically connected with the control module, and the control module can control the air blowing module to blow a preset gas to the communication port;
the gas auxiliary assemblies are correspondingly arranged on the reserved grooves; and
The air exhausting module is detachably arranged in the machine body and correspondingly positioned in the second accommodating space, the air exhausting module is connected with a plurality of gas auxiliary assemblies, and the air exhausting module can be controlled to enable at least one gas auxiliary assembly to perform gas exchange operation in the wafer box arranged on the machine body;
when the control module controls the driving mechanism to enable the door opening module of the movable door to be connected with the wafer box arranged on the machine body, the control module can control the driving mechanism to act so as to enable the movable door and a cover body of the wafer box connected with the movable door to be separated from the communication port together, and enable the interior of the wafer box to be communicated with the outside through the communication port;
when the control module controls the movable door to be connected with the wafer box arranged on the machine body, the control module can control the air blowing module to act so as to form air flow flowing towards the machine body in the area of the communication port.
7. The wafer cassette carrier apparatus of claim 6, wherein the wafer cassette carrier apparatus further comprises a plurality of gas assist assemblies, each gas assist assembly being removably disposed in a plurality of the pre-grooves, each gas assist assembly comprising a holder and a chuck; the machine body is provided with a sliding module, the sliding module is mutually connected with the disc body, and the sliding module can be controlled by the control module to drive the disc body to move towards the direction close to the communication port or drive the disc body to move towards the direction far away from the communication port.
8. The wafer cassette carrier apparatus of claim 6, wherein the movable door is provided with a counter; when the movable door is connected with the wafer box arranged on the machine body, and the movable door drives the cover body of the wafer box to move together, the counter can be controlled by the control module to calculate the number of wafers arranged in the wafer box.
9. The wafer cassette carrier apparatus of claim 8, wherein the counter comprises a transmitting unit and a receiving unit, the transmitting unit being pivotally coupled to the movable door, the receiving unit being pivotally coupled to the movable door; when the movable door is connected with the wafer box arranged on the machine body, and the movable door drives the cover body of the wafer box to move together, the control module can control the transmitting unit and the receiving unit to rotate relative to the movable door, so that the transmitting unit and the receiving unit are arranged opposite to each other, and the transmitting unit and the receiving unit opposite to each other can move along with the movable door so as to calculate the number of wafers arranged in the wafer box.
10. The wafer cassette carrier apparatus of claim 9, wherein the door opening module comprises at least two engaging components and at least two adsorbing components, the two engaging components being capable of being controlled by the control module to engage with a cover of the wafer cassette disposed on the machine body; each adsorption component is connected with the exhaust module; when the two clamping assemblies are mutually clamped with the cover body of the wafer box, the control module can control the air pumping and exhausting module to perform air exchange operation on the wafer box; a partition board is arranged in the machine body, two opposite side surfaces of the partition board are respectively the first accommodating space and the second accommodating space, and the control module is fixedly arranged at one side of the partition board; the other side of the partition board is used for fixing the pumping and exhausting module; the machine body is further provided with a shell below the tray body, the shell is detachably arranged on the machine body, and when the shell is detached from the machine body, the partition plate and the control module can be exposed out of the machine body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810788768.8A CN110739253B (en) | 2018-07-18 | 2018-07-18 | Wafer cassette carrier and wafer cassette carrier apparatus |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810788768.8A CN110739253B (en) | 2018-07-18 | 2018-07-18 | Wafer cassette carrier and wafer cassette carrier apparatus |
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| CN110739253A CN110739253A (en) | 2020-01-31 |
| CN110739253B true CN110739253B (en) | 2024-09-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810788768.8A Active CN110739253B (en) | 2018-07-18 | 2018-07-18 | Wafer cassette carrier and wafer cassette carrier apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114740017A (en) * | 2021-01-07 | 2022-07-12 | 富泰华工业（深圳）有限公司 | Method and system for detecting wafer arrangement state in wafer box |
| CN115863248B (en) * | 2023-03-01 | 2023-05-23 | 昆山芯物联电子通讯有限公司 | Wafer conveying carrier inflating and clamping device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN208507641U (en) * | 2018-07-18 | 2019-02-15 | 华景电通股份有限公司 | Wafer cassette carrying device and wafer cassette carrier equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN207602538U (en) * | 2017-10-23 | 2018-07-10 | 华景电通股份有限公司 | Wafer cassette carrier system |
| CN207602534U (en) * | 2017-10-26 | 2018-07-10 | 华景电通股份有限公司 | Wafer cassette bogey |
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| CN208507641U (en) * | 2018-07-18 | 2019-02-15 | 华景电通股份有限公司 | Wafer cassette carrying device and wafer cassette carrier equipment |
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