CN110739253A - Wafer cassette carrying device and wafer cassette carrying equipment - Google Patents
Wafer cassette carrying device and wafer cassette carrying equipment Download PDFInfo
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- CN110739253A CN110739253A CN201810788768.8A CN201810788768A CN110739253A CN 110739253 A CN110739253 A CN 110739253A CN 201810788768 A CN201810788768 A CN 201810788768A CN 110739253 A CN110739253 A CN 110739253A
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- 238000007664 blowing Methods 0.000 claims abstract description 31
- 238000005086 pumping Methods 0.000 claims abstract description 8
- 235000012431 wafers Nutrition 0.000 claims description 206
- 230000007246 mechanism Effects 0.000 claims description 53
- 238000004891 communication Methods 0.000 claims description 36
- 238000005192 partition Methods 0.000 claims description 27
- 230000000694 effects Effects 0.000 claims description 24
- 230000004308 accommodation Effects 0.000 claims description 11
- 230000000712 assembly Effects 0.000 claims description 10
- 238000000429 assembly Methods 0.000 claims description 10
- 241000252254 Catostomidae Species 0.000 claims 1
- 239000007789 gas Substances 0.000 description 70
- 238000001179 sorption measurement Methods 0.000 description 9
- 239000011261 inert gas Substances 0.000 description 3
- 239000000969 carrier Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses an wafer cassette carrying device, which comprises a machine table body, a control module, a frame structure and a body module, wherein an accommodating space is reserved in the machine table body to enable related personnel to selectively arrange an air pumping and exhausting module, the machine table body is used for bearing a wafer cassette tray body and is provided with a plurality of reserved grooves to enable the related personnel to selectively arrange an air auxiliary assembly, the air pumping and exhausting module, the air auxiliary assembly and the control module can be mutually matched to carry out air exchange operation in the wafer cassette, the frame structure, the body module and the control module can be mutually matched to open a cover body of the wafer cassette, a structure and a component for arranging an air blowing module are reserved on the side of the frame structure, which is far away from the tray body, to enable the related personnel to selectively arrange the air blowing module, and accordingly the air blowing module forms an air curtain on the side of the opened wafer cassette.
Description
Technical Field
The present invention relates to types of carriers and carriers, and more particularly to a wafer cassette carrier and a wafer cassette carrier for conveying wafer cassettes.
Background
Most of the conventional apparatuses for transferring the pod have only a single function, such as a work station for temporarily storing the pod or a work station for inflating the interior of the pod, and therefore, the space of the factory is limited, so how to enable the single work station to support or perform various operations becomes a demand of related manufacturers.
Disclosure of Invention
The present invention is directed to wafer cassette carrier and apparatus thereof, which are used to improve the problem of the prior art that the workstation of the wafer cassette cannot support or execute a plurality of different operations at the same time according to the needs of the manufacturer.
In order to achieve the above object, the present invention provides a wafer cassette carrier device, comprising a machine body comprising 0 tray body comprising a plurality of preformed grooves, wherein the tray body is used for providing 3 wafer cassettes, each preformed groove is used for providing 5 gas auxiliary components, the machine body is internally provided with a No. 7 accommodating space and a No. 9 accommodating space, the second accommodating space is used for accommodating a gas pumping module, the gas pumping module is used for being connected with the gas auxiliary components so as to perform gas exchange operation on the interior of the wafer cassette arranged on the machine body through the gas auxiliary components, a 0 control module is arranged in the machine body and correspondingly positioned in the No. 5 accommodating space, a 1 frame structure is arranged on the machine body, the 2 frame structure comprises a communication port, the 4 frame structure is far away from the 1 side of the tray body and can provide a gas blowing module, the control module can be electrically connected with the gas blowing module so as to control the communication port, a 8 module comprises a driving mechanism and a movable driving mechanism, the driving mechanism 1 is arranged on the side of the tray body, the movable box, the driving mechanism is connected with the machine body so as to enable the wafer cassette to be connected with the wafer cassette, the driving mechanism, the movable driving mechanism, the driving mechanism is connected with the wafer cassette, the driving mechanism, the wafer cassette is connected with the driving mechanism, the wafer cassette, the driving mechanism, the wafer cassette is connected with the wafer cassette, the driving mechanism, the wafer cassette is connected with the wafer cassette, the wafer cassette driving mechanism, the wafer cassette is connected with the wafer cassette driving mechanism, the wafer cassette is connected with the wafer cassette, the wafer cassette driving mechanism, the wafer cassette driving mechanism, the wafer cassette, the wafer.
Preferably, the wafer cassette carrying device further comprises a plurality of gas auxiliary assemblies, each gas auxiliary assembly is detachably arranged in the plurality of reserved grooves and comprises an fixing seat and a nozzle, the fixing seat can be fixedly arranged in the reserved grooves, the nozzles are arranged on the fixing seats and can be mutually fixed with the wafer cassettes arranged on the tray body, the nozzles can be mutually matched with the exhaust module to exchange gas in the wafer cassettes, the machine table body is provided with a sliding module, the sliding module is mutually connected with the tray body, and the sliding module can be controlled by the control module to drive the tray body to move towards the direction close to the communicating port or drive the tray body to move towards the direction far away from the communicating port.
Preferably, the activity is provided with a counter, and when the activity is connected to the wafer cassette disposed on the machine body and the activity drives the cover of the wafer cassette to move, the counter can be controlled by the control module to count the number of wafers disposed in the wafer cassette.
Preferably, the counter comprises emitting units and receiving units, the emitting units are pivoted to the movable , the receiving units are pivoted to the movable , when the movable and the wafer cassette disposed on the machine body are connected with each other and the movable drives the cover of the wafer cassette to move together, the control module can control the emitting units and the receiving units to rotate relative to the movable , so that the emitting units and the receiving units are disposed facing each other, and the emitting units and the receiving units facing each other can move along with the movable to calculate the number of wafers disposed in the wafer cassette.
Preferably, the opening module includes at least two engaging elements and at least two adsorbing elements, the two engaging elements can be controlled by the control module to engage with a lid of the wafer cassette disposed on the machine body, each adsorbing element is connected to the exhaust module, when the two engaging elements engage with the lid of the wafer cassette, the control module can control the exhaust module to perform gas exchange operation on the wafer cassette, a partition plate is disposed in the machine body, two opposite side surfaces of the partition plate are the accommodating space and the second accommodating space, the control module is fixedly disposed on the side of the partition plate, the other side of the partition plate is used to fix the exhaust module, the machine body is further provided with a casing below the disk body, the casing is detachably disposed on the machine body, and when the casing is detached from the machine body, the partition plate and the control module can be exposed to the machine body.
In order to achieve the above object, the invention further provides wafer cassette carrying equipment comprising a wafer cassette carrying device, a machine table body, a control module, a frame structure, a 3 body module, an opening 1 module, a blowing control module and a blowing control module, wherein the wafer cassette carrying device comprises 2 machine table body comprising 4 disc bodies comprising a plurality of reserved grooves, the disc bodies are used for carrying 5 wafer cassettes, the machine table body is internally provided with a 0 th accommodating space and a 3 th second accommodating space, the control module is arranged in the machine table body and correspondingly positioned in the 6 th accommodating space, the frame structure is 0 arranged in the machine table body, the frame structure 1 comprises 7 communication openings, the body module comprises 8 driving mechanisms and 9 movement 6, the driving mechanisms are arranged in the machine table body, the movement 7 is connected with the driving mechanisms, the control module can control the driving mechanisms to actuate, so that the movement 8 shields the communication openings or does not shield the communication openings, the movement 9 is provided with the opening 1 module, the 2 module can be driven by the driving mechanisms to be mutually connected with a cover body of the wafer cassette arranged on the machine table body, the wafer cassette carrying module, the blowing control module is detachably arranged in the machine table body and correspondingly connected with the blowing control modules, the gas exchange modules, the blowing control modules are detachably arranged in the machine table body and correspondingly connected with the gas exchange modules, and the gas exchange modules, the blowing control modules are detachably connected with the gas exchange modules, and the gas exchange modules, when the gas exchange modules, the gas exchange modules are detachably connected with the gas exchange modules, the gas exchange modules are detachably arranged in the gas exchange modules, and the gas exchange modules, the gas exchange modules are detachably connected with the gas exchange modules, and the gas exchange modules are detachably connected with the gas exchange modules.
Preferably, the wafer cassette carrying device further comprises a plurality of gas auxiliary assemblies, each gas auxiliary assembly is detachably arranged in the plurality of reserved grooves and comprises an fixing seat and a sucking disc, the machine table body is provided with a sliding module, the sliding module is connected with the disc body, and the sliding module can be controlled by the control module to drive the disc body to move towards the direction close to the communication port or drive the disc body to move towards the direction far away from the communication port.
Preferably, the activity is provided with a counter, and when the activity is connected to the wafer cassette disposed on the machine body and the activity drives the cover of the wafer cassette to move, the counter can be controlled by the control module to count the number of wafers disposed in the wafer cassette.
Preferably, the counter comprises emitting units and receiving units, the emitting units are pivoted to the movable , the receiving units are pivoted to the movable , when the movable and the wafer cassette disposed on the machine body are connected with each other and the movable drives the cover of the wafer cassette to move together, the control module can control the emitting units and the receiving units to rotate relative to the movable , so that the emitting units and the receiving units are disposed facing each other, and the emitting units and the receiving units facing each other can move along with the movable to calculate the number of wafers disposed in the wafer cassette.
Preferably, the opening module includes at least two engaging elements and at least two adsorbing elements, the two engaging elements can be controlled by the control module to engage with a lid of the wafer cassette disposed on the machine body, each adsorbing element is connected to the exhaust module, when the two engaging elements engage with the lid of the wafer cassette, the control module can control the exhaust module to perform gas exchange operation on the wafer cassette, a partition plate is disposed in the machine body, two opposite side surfaces of the partition plate are the accommodating space and the second accommodating space, the control module is fixedly disposed on the side of the partition plate, the other side of the partition plate is used to fix the exhaust module, the machine body is further provided with a casing below the disk body, the casing is detachably disposed on the machine body, and when the casing is detached from the machine body, the partition plate and the control module can be exposed to the machine body.
The wafer box carrying device has the beneficial effects that the plurality of reserved grooves and the second accommodating space are arranged on the disc body of the wafer box carrying device, so that relevant manufacturers of the wafer box carrying device can add the gas auxiliary assembly and the exhaust module in the reserved grooves and the second accommodating space according to the requirements of relevant users, and the wafer box carrying device can open the cover body of the wafer box by using the module so that relevant personnel or equipment can take and place wafers in the wafer box, and can also use the mutual matching of the gas auxiliary assembly and the exhaust module so as to carry out gas exchange operation on the interior of the wafer box.
Drawings
Fig. 1 is a schematic view of a wafer cassette carrier apparatus of the present invention.
Fig. 2 is a partially exploded view of the wafer cassette carrier apparatus of the present invention.
Fig. 3 is a partially enlarged schematic view of the wafer cassette carrier apparatus of the present invention.
Fig. 4 is a partially exploded view of the wafer cassette carrier apparatus of the present invention.
Fig. 5 is a schematic view of another perspective of the wafer cassette carrier apparatus of the present invention.
Fig. 6 is another partially exploded view of the wafer cassette carrier apparatus of the present invention.
Fig. 7 is a schematic view of a wafer cassette.
Fig. 8 is a schematic view of the wafer cassette carrying apparatus of the present invention provided with a wafer cassette.
Fig. 9 is an operation diagram of the wafer cassette loading apparatus of the present invention with the wafer cassette.
Fig. 10 is a schematic view showing the gas flow inside the wafer cassette mounted on the wafer cassette carrier apparatus of the present invention.
Detailed Description
Please , refer to fig. 1 to 4, which are schematic diagrams of the wafer cassette carrier apparatus 100 comprising a wafer cassette carrier 10 and a auxiliary device 20. the wafer cassette carrier 10 comprises a machine body 11, a control module 12, a frame structure 13 and a body module 14. the auxiliary device 20 comprises a blowing module 21, a plurality of gas auxiliary components 22 and a pumping module 23.
The machine body 11 is provided with tray 111 and casing 112, the casing 112 is detachably disposed on the machine body 11, a partition 113 is disposed in the machine body 11, the partition 113 and the casing 112 can form th th accommodation spaces SP1 and second accommodation space sp2 corresponding to the machine body 11, the control module 12 is fixedly disposed on the side of the partition 113, the control module 12 is disposed on the other side of the partition 113 corresponding to the th accommodation space sp1, the exhaust module 23 is disposed on the second accommodation space sp2, in practical applications, the exhaust module 23 can be electrically connected to the control module 12 through related electrical connection lines, electrical connectors, and the control module 12 can control the operation of the exhaust module 23 accordingly.
The tray 111 has a plurality of pre-grooves 1111, a plurality of gas assist devices 22 are detachably disposed in the pre-grooves 1111, each gas assist device 22 may include holders 221 and nozzles 222, the holders 221 may be fixedly disposed on the machine body 11 and correspondingly disposed in the pre-grooves 1111, the nozzles 222 are fixedly disposed in the holders 221, and portions of the nozzles 222 may protrude out of the tray 111. the plurality of gas assist devices 22 are connected to the evacuation module 23 through a plurality of pipes (not shown). when the cassette F is disposed on the tray 111, the plurality of nozzles 222 may be connected to a plurality of gas holes F111 (as shown in fig. 6) of the cassette F, and the evacuation module 23 may draw gas from the cassette F through at least nozzles 222, and send at least predetermined gases (such as clean gases like XCDA, CDA, etc. or inert gases, etc.) into the cassette F through at least nozzles 222, and may be detachably disposed on a bottom portion of the tray 111F 6326, a cover 9638F 6326, a base 9611F 6326F, a base 6326F is detachably disposed on a bottom side of the tray 111F 6326, and a pedestal 6326F.
In the drawings, the tray 111 has six pre-grooves 1111, but the number and the arrangement position of the pre-grooves may be changed according to the sizes and the types of the cassettes F. In a specific application, the evacuation module 23 may be adapted to two or four gas assist elements 22 according to the number of the gas holes F111 of the wafer cassette F to perform gas exchange operation on the interior of the wafer cassette F.
it should be noted that the tray 111 may further have a plurality of communicating grooves 1112, the communicating grooves 1112 and the pre-grooves 1111 are communicated with each other, and the tube (not shown) connecting the gas auxiliary units 22 can be correspondingly disposed in the communicating grooves 1112. of course, in different applications, the tube connecting the gas auxiliary units 22 can be hidden in the machine body 11, and the tray 111 does not have the communicating grooves 1112.
In order to effectively fix the wafer cassette F disposed on the tray 111, the tray 111 may be provided with fixing elements 114, a plurality of auxiliary positioning elements 115, and a plurality of different detecting elements 116, 117, the fixing elements 114 may be substantially disposed at a central position of the tray 111, and the fixing elements 114 may have engaging structures 1141, and the engaging structures 1141 may be controlled by the control module 12 to ascend and descend relative to the tray 111. when the wafer cassette F is fixedly disposed on the tray 111, the engaging structures 1141 may be controlled to ascend and descend and correspondingly enter the corresponding engaging holes F112 (as shown in fig. 6) of the wafer cassette F, and then the control module 12 may further control the engaging structures 1141 to rotate, so that the engaging structures 1141 and the wafer cassette F are engaged with each other.
The detecting elements 116 can read data stored in corresponding components of the wafer cassette F in a wireless manner, for example, the detecting elements 116 can read data stored in corresponding components (e.g., electronic tags) disposed on the wafer cassette F by using an RFID technology, the detecting elements 117 can detect whether the wafer cassette F is disposed on the tray 111, the detecting elements 117 can detect the type of the wafer cassette F disposed on the tray 111, and the control module 12 can correspondingly control the operation of the evacuation modules 23 and according to the results detected by the detecting elements 116 and 117.
Please referring to fig. 4 to 6, body module 14 is disposed on the machine body 11, body module 14 includes driving mechanism 141 and activity 2142, driving mechanism 141 is disposed on the machine body 11, activity 3142 is connected to driving mechanism 141, driving mechanism 141 is electrically connected to control module 12, control module 12 can control driving mechanism 141 to actuate, so that activity 4142 shields the communication port 13A or does not shield the communication port 13A, specifically, activity 5142 and blowing module 21 are disposed on the opposite side of the machine body 11 from the side where the tray 111 is disposed, and activity 6142 can be driven by driving mechanism 141 to move relative to the machine body 11, and accordingly activity 7142 can move from the position where the communication port 13A is shielded to the position where the communication port 13A is not shielded, or from the position where the communication port 13A is not shielded to the position where the communication port 13A is shielded, in this embodiment, when activity is driven in the state of shielding the communication port 13A, the direction of the activity is not changed relative to the connection with the connection of the connection mechanism 5813A, but the connection mechanism is restricted to the connection with the connection of the connection mechanism 142.
As shown in fig. 5 to 7, the movable has an open module 15, and the open module 15 can be driven by the driving mechanism 141 to connect with a lid F2 of a pod F disposed on the machine body 11, specifically, the open module 15 includes a latching element 151 and two suction elements 152. the latching element 151 includes two anchors 1511 and linkage mechanisms 1512, each anchor 1511 has a end exposed to the side of the movable F142, the linkage mechanisms 1512 and the two anchors 1511 are connected to each other, and the linkage mechanisms 1512 can be controlled by the control module 12 to drive the two anchors 1511 to actuate, so that the two anchors 1511 and the fixing hole F21 of the lid F2 of the pod F engage with each other, when the two anchors 1511 and the fixing hole F21 of the lid F2 engage with each other, the control module 12 can control the driving mechanism 141 to enable the movable and F2 to move in a direction away from the frame structure 6313, so that the interior of the pod F may communicate with the wafer through the wafer box F68613, and the wafer taking-out port, thereby enabling communication between the wafer taking-out equipment and the wafer taking-out equipment.
In a specific embodiment, as shown in fig. 4, the machine body 11 may further include sliding modules 16, the tray 111 and the sliding modules 16 are connected to each other, and the sliding modules 16 can be controlled by the control module 12 to drive the tray 111 to move toward the communication opening 13A or drive the tray 111 to move away from the communication opening 13A. in practical applications, the sliding modules 16 may include, for example, a linear rail and a slider, in a specific implementation, the control module 12 can control the tray 111 to move toward the communication opening 13A of the frame structure 13 when the wafer cassette F is stably disposed on the tray 111 according to the results detected by the detecting elements 116 and 117.
The specific embodiment of the control module 12 controlling the opening module 15 to drive the cover F2 of the wafer cassette F by using the movable part 142 may be that the control module 12 first controls the sliding module 16 to make the tray 111 drive the wafer cassette F to move relative to the machine body 11, so that the cover F2 of the wafer cassette F can be correspondingly attached to the side of the movable part 142, and then the control module 12 controls the linking mechanism 1512 to operate by using a related detector (not shown) disposed on the movable part 142 to confirm that the cover F2 is indeed attached to the side of the movable part 142, so as to mutually fix the two fixing parts 1511 and the cover F2.
In different applications, the movable part 142 may be matched with the driving mechanism 141, and the driving mechanism 141 may be controlled by the control module 12, so that the movable part 142 moves toward the cover F2 to be attached to the cover F2 of the wafer cassette F, in other words, in different embodiments, the machine body 11 may not be provided with the sliding module 16, and the movable part 142 may be controlled by the driving mechanism 141 to move toward or away from the wafer cassette F relative to the machine body 11.
The two adsorption assemblies 152 may be connected to the air exhaust module 23, or may be independently connected to another air exhaust modules, which is not limited herein, each adsorption assembly 152 may include adsorption trays 1521 and air nozzles 1522, the adsorption tray 1521 is used for being adsorbed on the cover F2, the air nozzles 1522 are disposed in the adsorption tray 1521, and portions of the air nozzles 1522 may be exposed out of the adsorption tray 1521, each air exhaust module 23 may be matched with the air nozzles 1522 to suck air through the air nozzles 1522, or exhaust air through the air nozzles 1522.
As shown in fig. 5, 6, and 8 to 10, the activity 142 may further include a counter 17, when the activity 142 is connected to the wafer cassette F disposed on the machine body 11, and the activity 142 drives the lid F2 of the wafer cassette F to move, the counter 17 may be controlled by the control module 12 to count the number of wafers disposed in the wafer cassette F, and the counter 17 may count the wafers in the wafer cassette F, for example, by optical detection, image capture and image analysis, without limitation.
For example, the counter 17 may include emitting units 171 and receiving units 172, the emitting unit 171 is pivotally connected to the movable portion 142, the receiving unit 172 is pivotally connected to the movable portion 142, the emitting unit 171 may be a member emitting infrared rays, and the receiving unit 172 may be a member capable of receiving infrared rays correspondingly, when the movable portion 142 is connected to the wafer box F disposed on the machine body 11, and the movable portion 142 drives the cover F2 of the wafer box F to move, the control module 12 can first control the emitting unit 171 and the receiving unit 172 to rotate relative to the movable portion 142, so that the emitting unit 171 and the receiving unit 172 respectively extend into the wafer box F, and the emitting unit 171 and the receiving unit 172 can be disposed substantially opposite to each other, so that the emitting unit 171 and the receiving unit 172 can cooperate with each other, and the movable portion 142 moves relative to the wafer box F, thereby calculating the number of wafers disposed in the wafer box F.
As shown in fig. 2, 3 and 10, when the cover F2 is moved away from the wafer cassette F by the movement 142, the interior of the wafer cassette F can be connected to the exterior, at this time, the control module 12 can control the evacuation module 23 to cooperate with the gas assist module 22 to perform gas exchange operation on the interior of the wafer cassette F, and the control module 12 can control the evacuation module 23 to cooperate with the blowing module 21 to form a gas curtain around the wafer cassette F, thereby effectively preventing the contamination from the exterior from entering the wafer cassette F.
When the related equipment or personnel do not need to pick up or place the wafer in the wafer box F, the control module 12 may control the driving mechanism 141, so that the movable body 142 drives the cover body F2, and the cover body F2 is disposed back on the wafer box F, and then the control module 12 may control the exhaust module 23 to perform gas exchange operation on the inside of the wafer box F by using the gas auxiliary assembly 22 and the two adsorption assemblies 152, for example, the two adsorption assemblies 152 may be used to fill clean gas such as XCDA, CDA, or the like or inert gas into the wafer box F, and at least gas auxiliary assemblies 22 may be used to exhaust the gas in the wafer box F, wherein when the movable body 142 and the cover body F2 are fixed, the gas nozzles 1522 of the two adsorption assemblies 152 may be correspondingly communicated with the gas holes F22 of the cover body F2, so that the exhaust module 23 can send the predetermined gas into the wafer box F through the gas nozzles 1522.
Please , refer to fig. 2, 4 and 6, which are schematic views of the wafer cassette carrier of the present invention, wherein only some components of the wafer cassette carrier 10 are emphasized, and the rest of the components not described are the same as the previous embodiments and will not be described again.
As shown in fig. 2, the machine body 11 of the wafer cassette loading apparatus 10 of the present invention is provided with a partition 113, the side of the partition 113 is provided with the control module 12, and the other of the partition 113 is provided with the evacuation module 23 of the auxiliary device 20 according to the requirements of the relevant manufacturer, in other words, the machine body 11 of the wafer cassette loading apparatus 10 has a space (i.e., the second accommodating space SP2 in the foregoing embodiment) reserved for the relevant manufacturer to install the evacuation module 23, and the manufacturer of the wafer cassette loading apparatus 10 can install or not install the evacuation module 23 in the machine body 11 according to the requirements of the purchaser of the wafer cassette loading apparatus 10.
As shown in FIG. 4, the tray 111 of the wafer cassette carrier 10 of the present invention may have a plurality of pre-grooves 1111, and the plurality of pre-grooves 1111 may be provided with a plurality of gas assist members 22 according to the requirements of the manufacturers. The plate 111 may also have a plurality of communicating grooves 1112, the communicating grooves 1112 are connected to the plurality of pre-grooves 1111, and the communicating grooves 1112 can be used to provide the pipeline for connecting the plurality of gas auxiliary modules 22. In other words, the tray 111 disposed on the machine body 11 of the pod carrier 10 has a plurality of grooves 1111 reserved for installing the gas assist devices 22 by manufacturers, and manufacturers of the pod carrier 10 may install or not install a plurality of gas assist devices 22 on the tray 111 according to the requirements of purchasers of the pod carrier 10.
As shown in fig. 6, the frame structure 13 of the wafer cassette carrier 10 of the present invention may be provided with the blow module 21 as required, i.e., the side of the frame structure 13 opposite to the tray 111 is reserved with relevant structures and components for installing the blow module 21, and the manufacturer of the wafer cassette carrier 10 may install or not install the blow module 21 in the frame structure 13 according to the requirements of the purchaser of the wafer cassette carrier 10.
As described above, the wafer cassette carrier 10 of the present invention has a reserved space in the machine body 11, a plurality of reserved grooves 1111 are reserved on the tray 111, and the frame structure 13 also reserves the related structures and components for installing the blowing module 21, so that manufacturers of the wafer cassette carrier 10 can additionally install the exhausting module 23, the gas auxiliary module 22 and the blowing module 21 on the wafer cassette carrier 10 according to the requirements of purchasers, and in the case that the wafer cassette carrier 10 is not provided with a plurality of gas auxiliary modules 22, the exhausting module 23 and the blowing module 21, the wafer cassette carrier 10 can utilize the mutual cooperation of the tray 111, the frame structure 13 and the opening module 15 to carry the wafer cassette F and open the cover F2 of the wafer cassette F, so that the related devices or persons can fetch and place wafers in the wafer cassette F.
In the case that the wafer cassette carrier 10 is provided with the plurality of gas auxiliary assemblies 22, the pumping and exhausting module 23, and the blowing module 21, the wafer cassette carrier 10 can perform gas exchange operation in the wafer cassette F in addition to the functions of carrying the wafer cassette F and opening the lid F2 of the wafer cassette F, and the wafer cassette carrier 10 can also utilize the blowing module 21 to prevent the outside contaminants of the wafer cassette F from easily entering the wafer cassette F.
Claims (10)
1, wafer cassette carrier device, comprising:
machine body, including disk body, the disk body includes a plurality of reserved grooves, the disk body is used to provide wafer box, each reserved groove is used to provide gas auxiliary components, the machine body has th accommodation space and second accommodation space, the second accommodation space is used to provide gas pumping module accommodation, the gas pumping module is used to connect with the gas auxiliary components, so as to exchange gas to the wafer box inside of the machine body through the gas auxiliary components;
control module disposed in the machine body and correspondingly located in the accommodating space;
frame structure, which is arranged on the machine body, wherein the frame structure comprises communication port, the frame structure is far away from side of the tray body and can provide blowing module arrangement, the control module can be electrically connected with the blowing module to control the blowing module to blow preset gas to the communication port;
body module, including driving mechanism and movable , the driving mechanism is installed on the machine body, the movable is connected with the driving mechanism, the control module can control the driving mechanism to act, so that the movable shields the communicating opening or does not shield the communicating opening, the movable is installed with opening module, the opening module can be driven by the driving mechanism to connect with the cover of the wafer box installed on the machine body;
when the control module controls the driving mechanism to connect the opening module of the movable part with the wafer cassette disposed on the machine body, the control module can control the driving mechanism to operate, so that the movable part and the cover body of the wafer cassette connected with the movable part are away from the communication port, and the inside of the wafer cassette can be communicated with the outside through the communication port;
when the frame structure is provided with the blowing module, and the control module controls the activity to be connected with the wafer cassette arranged on the machine body, the control module can control the blowing module to actuate, so that an air flow flowing towards the machine body is formed in the area of the communication port.
2. The wafer cassette carrier of claim 1 further comprising a plurality of gas assist assemblies, each gas assist assembly being detachably disposed in a plurality of the pre-grooves, each gas assist assembly comprising holders and nozzles, the holders being fixedly disposed in the pre-grooves, the nozzles being disposed in the holders and being capable of being fixed to the wafer cassettes disposed on the tray, the nozzles being capable of cooperating with the evacuation module for exchanging gas within the wafer cassettes, the tool body being provided with a slide module, the slide module being interconnected to the tray, the slide module being controllable by the control module to move the tray in a direction closer to the communication opening or move the tray in a direction away from the communication opening.
3. The wafer cassette carrier of claim 1 wherein the activity is configured with a counter that is controllable by the control module to count the number of wafers disposed in the wafer cassette when the activity is interconnected with the wafer cassette disposed on the tool body and the activity moves the lid of the wafer cassette.
4. The wafer cassette carrier apparatus of claim 3, wherein the counter comprises emitters and receivers, the emitters are pivotally connected to the movable , the receivers are pivotally connected to the movable , when the movable is connected to the wafer cassette mounted on the platform body and the movable drives the lid of the wafer cassette to move, the control module controls the emitters and receivers to rotate relative to the movable , such that the emitters and receivers are disposed facing each other, and the emitters and receivers facing each other move along with the movable to count the number of wafers mounted in the wafer cassette.
5. The wafer cassette carrier apparatus as claimed in claim 1, wherein the opening module comprises at least two engaging elements and at least two adsorbing elements, the two engaging elements are controlled by the control module to engage with a lid of the wafer cassette disposed on the machine body, each adsorbing element is connected to the evacuation module, the control module controls the evacuation module to perform gas exchange operation on the wafer cassette when the two engaging elements engage with the lid of the wafer cassette, a partition is disposed in the machine body, two opposite sides of the partition are the accommodating space and the second accommodating space, the control module is fixed on the side of the partition, the other side of the partition is used for fixing the evacuation module, the machine body further has a casing disposed under the disk, the casing is detachably disposed on the machine body, and when the casing is detached from the machine body, the partition and the control module are exposed to the machine body.
6, a wafer cassette carrier apparatus, comprising:
A wafer cassette carrier comprising:
machine body, including tray body, the tray body includes a plurality of reserved grooves, the tray body is used to bear wafer box, the machine body has the th accommodation space and the second accommodation space;
control module disposed in the machine body and located in the accommodating space;
frame structure disposed on the machine body, wherein the frame structure comprises communication port, and
body module including driving mechanism and movable , the driving mechanism is disposed on the machine body, the movable is connected with the driving mechanism, the control module can control the driving mechanism to act so that the movable shields or does not shield the communication opening, the movable is provided with opening module, the opening module can be driven by the driving mechanism to connect with the cover of the wafer box disposed on the machine body, and
an accessory device, comprising:
air blowing module detachably arranged at side of the frame structure far away from the tray body, wherein the air blowing module is electrically connected with the control module, and the control module can control the air blowing module to blow predetermined air to the communication port;
the gas auxiliary assemblies are correspondingly arranged in the reserved grooves; and
exhaust module detachably disposed in the machine body and located in the second accommodation space, wherein the exhaust module is connected to the plurality of gas-assisted components and can be controlled to enable at least gas-assisted components to perform gas exchange operation on the inside of the wafer cassette disposed on the machine body;
when the control module controls the driving mechanism to connect the opening module of the movable part with the wafer cassette disposed on the machine body, the control module can control the driving mechanism to operate, so that the movable part and the cover body of the wafer cassette connected with the movable part are away from the communication port, and the inside of the wafer cassette can be communicated with the outside through the communication port;
when the control module controls the movable part to be connected with the wafer cassette disposed on the machine body, the control module can control the blowing module to actuate, so as to form an air flow flowing towards the machine body in the area of the communication port.
7. The wafer cassette carrier apparatus of claim 6, further comprising a plurality of gas assist modules, each gas assist module being detachably disposed in the plurality of pre-formed grooves, each gas assist module comprising fixing seats and suckers, wherein the machine body is provided with a sliding module, the sliding module being connected to the tray body, and the sliding module being controlled by the control module to move the tray body in a direction close to the communication opening or move the tray body in a direction away from the communication opening.
8. The wafer cassette carrier apparatus of claim 6 wherein the activity is configured with a counter that is controllable by the control module to count the number of wafers disposed in the wafer cassette when the activity is interconnected with the wafer cassette disposed on the tool body and the activity moves the lid of the wafer cassette.
9. The wafer cassette carrier apparatus of claim 8 wherein the counter comprises emitters and receivers, the emitters are pivotally connected to the movable and the receivers are pivotally connected to the movable . when the movable is connected to the wafer cassette mounted on the platform body and the movable moves the lid of the wafer cassette, the control module can control the emitters and receivers to rotate relative to the movable such that the emitters and receivers face each other and move with the movable to count the number of wafers mounted in the wafer cassette.
10. The wafer cassette loading apparatus as claimed in claim 9, wherein the opening module comprises at least two engaging elements and at least two adsorbing elements, the two engaging elements are controlled by the control module to engage with a lid of the wafer cassette disposed on the machine body, each adsorbing element is connected to the evacuation module, the control module can control the evacuation module to perform gas exchange operation on the wafer cassette when the two engaging elements engage with the lid of the wafer cassette, a partition is disposed in the machine body, two opposite sides of the partition are the accommodating space and the second accommodating space, the control module is fixedly disposed on the side of the partition, the other side of the partition is used for fixing the evacuation module, the machine body further has a casing disposed under the disk, the casing is detachably disposed on the machine body, and when the casing is detached from the machine body, the partition and the control module are exposed to the machine body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810788768.8A CN110739253A (en) | 2018-07-18 | 2018-07-18 | Wafer cassette carrying device and wafer cassette carrying equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810788768.8A CN110739253A (en) | 2018-07-18 | 2018-07-18 | Wafer cassette carrying device and wafer cassette carrying equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110739253A true CN110739253A (en) | 2020-01-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810788768.8A Pending CN110739253A (en) | 2018-07-18 | 2018-07-18 | Wafer cassette carrying device and wafer cassette carrying equipment |
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| Country | Link |
|---|---|
| CN (1) | CN110739253A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20220216081A1 (en) * | 2021-01-07 | 2022-07-07 | Hon Hai Precision Industry Co., Ltd. | Method and device for detecting placement of wafers in wafer cassette |
| CN115863248A (en) * | 2023-03-01 | 2023-03-28 | 昆山芯物联电子通讯有限公司 | Inflatable clamping device for wafer conveying carrier |
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| CN207602534U (en) * | 2017-10-26 | 2018-07-10 | 华景电通股份有限公司 | Wafer cassette bogey |
| CN207602538U (en) * | 2017-10-23 | 2018-07-10 | 华景电通股份有限公司 | Wafer cassette carrier system |
| CN208507641U (en) * | 2018-07-18 | 2019-02-15 | 华景电通股份有限公司 | Wafer cassette carrying device and wafer cassette carrier equipment |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN207602538U (en) * | 2017-10-23 | 2018-07-10 | 华景电通股份有限公司 | Wafer cassette carrier system |
| CN207602534U (en) * | 2017-10-26 | 2018-07-10 | 华景电通股份有限公司 | Wafer cassette bogey |
| CN208507641U (en) * | 2018-07-18 | 2019-02-15 | 华景电通股份有限公司 | Wafer cassette carrying device and wafer cassette carrier equipment |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US20220216081A1 (en) * | 2021-01-07 | 2022-07-07 | Hon Hai Precision Industry Co., Ltd. | Method and device for detecting placement of wafers in wafer cassette |
| CN115863248A (en) * | 2023-03-01 | 2023-03-28 | 昆山芯物联电子通讯有限公司 | Inflatable clamping device for wafer conveying carrier |
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