CN110736910B - Flying probe test method, test device, test equipment and storage medium of PCB - Google Patents
Flying probe test method, test device, test equipment and storage medium of PCB Download PDFInfo
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- CN110736910B CN110736910B CN201810791568.8A CN201810791568A CN110736910B CN 110736910 B CN110736910 B CN 110736910B CN 201810791568 A CN201810791568 A CN 201810791568A CN 110736910 B CN110736910 B CN 110736910B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/002—Measuring arrangements characterised by the use of optical techniques for measuring two or more coordinates
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
Abstract
The invention belongs to the technical field of PCB testing, and relates to a flying probe testing method, a testing device, testing equipment and a storage medium of a PCB. The flying probe test method of the PCB comprises the following steps: calculating mechanical coordinates (c1, d1) of the first camera to the corresponding test point; calculating mechanical coordinates (c2, d2) of the second camera to the corresponding test point; the first camera moves to the mechanical coordinates (c1, d1) to acquire a contour image of a test point at the mechanical coordinates (c1, d 1); calculating the mechanical coordinates (g1, h1) of said first probe to the center of the contour image; the second camera moves to the mechanical coordinates (c2, d2), and a contour image of a test point at the mechanical coordinates (c2, d2) is acquired; the mechanical coordinates (g2, h2) of the second probe to the center of the contour image are calculated. The invention is beneficial to improving the accuracy of the flying probe for testing the PCB open circuit point.
Description
Technical Field
The invention belongs to the technical field of Printed Circuit Board (PCB) testing, and relates to a flying probe testing method, a testing device, testing equipment and a storage medium of a PCB.
Background
At present, the PCB is gradually thinned, the circuit structure thereof becomes more and more complex, and the requirement for reliability is also higher and higher. Generally, after the PCB is printed, a probe is used to detect the circuit of the PCB, for example, to test whether the circuit of the PCB is abnormally opened.
The prior art typically uses a flying probe test method to test the open point of a PCB. When the solder joint interval of the size of the welding pad of the PCB is small, the flying probe testing method in the prior art cannot ensure the testing accuracy, so that some false open points are easy to appear during testing, and the testing is often required to be carried out again at the moment. However, the reason why the flying probe testing method in the prior art tests the false open circuit point is often because the probe deviates from the test point, so the flying probe testing method in the prior art cannot guarantee the accuracy of the secondary test.
The inventor finds that the flying probe testing method in the prior art has the technical problems of low testing accuracy and the like in the process of researching the invention.
Disclosure of Invention
The embodiment of the invention discloses a flying probe testing method, a testing device, testing equipment and a storage medium of a PCB, aiming at improving the accuracy of testing an open circuit point of the PCB by a flying probe.
One or more embodiments of the present invention disclose a flying probe testing method of a PCB. The flying probe test method of the PCB comprises the following steps: obtaining paired test points to be tested on a PCB; acquiring mechanical coordinates (a1, b1) from the first probe to the corresponding test point and mechanical coordinates (a2, b2) from the second probe to the corresponding test point; calculating mechanical coordinates (c1, d1) of the first camera to the corresponding test point; calculating mechanical coordinates (c2, d2) of the second camera to the corresponding test point; the first camera moves to the mechanical coordinates (c1, d1) to acquire a contour image of a test point at the mechanical coordinates (c1, d 1); calculating the mechanical coordinates (g1, h1) of said first probe to the center of the contour image; the second camera moves to the mechanical coordinates (c2, d2), and a contour image of a test point at the mechanical coordinates (c2, d2) is acquired; calculating the mechanical coordinates (g2, h2) of said second probe to the center of the contour image; the first probe is moved to the mechanical coordinates (g1, h1) for testing while the second probe is moved to the mechanical coordinates (g2, h2) for testing.
In one or more embodiments of the present invention, the flying probe testing method of the PCB further includes: when the paired test points tested by the first probe and the second probe have an open circuit problem, moving the position of the first probe and/or the second probe on the test points, and continuing to test the paired test points.
In one or more embodiments of the present invention, the flying probe testing method of the PCB further includes: when the paired test points tested by the first probe and the second probe have an open circuit problem, the first probe moves to the mechanical coordinates (g2, h2) for testing, and meanwhile the second probe moves to the mechanical coordinates (g1, h1) for testing.
In one or more embodiments of the present invention, the flying probe testing method of the PCB further includes: acquiring a distance delta X1 between the first probe and the first camera in the X-axis direction and a distance delta Y1 between the first probe and the first camera in the Y-axis direction, and acquiring a distance delta X2 between the second probe and the second camera in the X-axis direction and a distance delta Y2 in the Y-axis direction in a probe coordinate system;
acquiring a ratio delta of the unit length to the number of pixels, wherein delta is s/n, s is 1mm, and n is the number of pixels;
calculating mechanical coordinates (c1, d1) of the first camera to the corresponding test point from the positional relationship of the first probe to the first camera in combination with the mechanical coordinates (α 1, β 1), the distance Δ x1, and the distance Δ y 1;
calculating mechanical coordinates (c2, d2) of the second camera to the corresponding test point from the positional relationship of the second probe to the second camera in combination with the mechanical coordinates (α 2, β 2), the distance Δ x2, and the distance Δ y 2;
the first camera moves to a corresponding test point to obtain a contour image of the test point, an offset value phi 1 between the center of the contour image and the center of a window of the first camera is calculated in a camera coordinate system, the offset value phi 1 is converted into a length value lambda 1 according to the ratio delta, and a mechanical coordinate (e1, f1) from the center of the window of the first camera to the center of the contour image is calculated by combining the length value lambda 1; -calculating mechanical coordinates (g1, h1) of said first probe to the centre of the contour image in combination with said mechanical coordinates (e1, f1), said distance Δ x1 and said distance Δ y 1;
the second camera moves to a corresponding test point, a contour image of the test point is obtained, an offset value phi 2 between the center of the contour image and the center of a window of the second camera is calculated in a camera coordinate system, the offset value phi 2 is converted into a growth value lambda 2 according to the ratio delta, and a mechanical coordinate (e2, f2) from the center of the window of the second camera to the center of the contour image is calculated by combining the length value lambda 2; calculating mechanical coordinates (g2, h2) of the second probe to the center of the contour image in combination with the mechanical coordinates (e2, f 2).
One or more embodiments of the present invention disclose a flying probe testing device of a PCB. The flying probe testing device of the PCB comprises: the device comprises an acquisition module, a coordinate processing module, a camera driving module and a probe testing module; wherein the content of the first and second substances,
the acquisition module is used for realizing that: obtaining paired test points to be tested on a PCB; acquiring mechanical coordinates (a1, b1) from the first probe to the corresponding test point and mechanical coordinates (a2, b2) from the second probe to the corresponding test point;
the coordinate processing module is used for realizing that: calculating mechanical coordinates (c1, d1) of the first camera to the corresponding test point; calculating mechanical coordinates (c2, d2) of the second camera to the corresponding test point;
the camera driving module is used for realizing that: the first camera moves to the mechanical coordinates (c1, d1) to acquire a contour image of a test point at the mechanical coordinates (c1, d 1); calculating the mechanical coordinates (g1, h1) of said first probe to the center of the contour image; the second camera moves to the mechanical coordinates (c2, d2), and a contour image of a test point at the mechanical coordinates (c2, d2) is acquired; calculating the mechanical coordinates (g2, h2) of said second probe to the center of the contour image;
the probe test module is used for realizing that: the first probe is moved to the mechanical coordinates (g1, h1) for testing while the second probe is moved to the mechanical coordinates (g2, h2) for testing.
In one or more embodiments of the invention, the probe test module is further configured to implement: when the paired test points tested by the first probe and the second probe have an open circuit problem, moving the position of the first probe and/or the second probe on the test points, and continuing to test the paired test points.
In one or more embodiments of the invention, the probe test module is further configured to implement: when the paired test points tested by the first probe and the second probe have an open circuit problem, the first probe moves to the mechanical coordinates (g2, h2) for testing, and meanwhile the second probe moves to the mechanical coordinates (g1, h1) for testing.
In one or more embodiments of the invention, the coordinate processing module is further configured to implement:
acquiring a distance delta X1 between the first probe and the first camera in the X-axis direction and a distance delta Y1 between the first probe and the first camera in the Y-axis direction, and acquiring a distance delta X2 between the second probe and the second camera in the X-axis direction and a distance delta Y2 in the Y-axis direction in a probe coordinate system;
acquiring a ratio delta of the unit length to the number of pixels, wherein delta is s/n, s is 1mm, and n is the number of pixels;
calculating mechanical coordinates (c1, d1) of the first camera to the corresponding test point from the positional relationship of the first probe to the first camera in combination with the mechanical coordinates (α 1, β 1), the distance Δ x1, and the distance Δ y 1;
calculating mechanical coordinates (c2, d2) of the second camera to the corresponding test point from the positional relationship of the second probe to the second camera in combination with the mechanical coordinates (α 2, β 2), the distance Δ x2, and the distance Δ y 2;
the first camera moves to a corresponding test point to obtain a contour image of the test point, an offset value phi 1 between the center of the contour image and the center of a window of the first camera is calculated in a camera coordinate system, the offset value phi 1 is converted into a length value lambda 1 according to the ratio delta, and a mechanical coordinate (e1, f1) from the center of the window of the first camera to the center of the contour image is calculated by combining the length value lambda 1; -calculating mechanical coordinates (g1, h1) of said first probe to the centre of the contour image in combination with said mechanical coordinates (e1, f1), said distance Δ x1 and said distance Δ y 1;
the second camera moves to a corresponding test point, a contour image of the test point is obtained, an offset value phi 2 between the center of the contour image and the center of a window of the second camera is calculated in a camera coordinate system, the offset value phi 2 is converted into a growth value lambda 2 according to the ratio delta, and a mechanical coordinate (e2, f2) from the center of the window of the second camera to the center of the contour image is calculated by combining the length value lambda 2; calculating mechanical coordinates (g2, h2) of the second probe to the center of the contour image in combination with the mechanical coordinates (e2, f 2).
One or more embodiments of the present invention disclose a flying probe testing apparatus. The flying probe test apparatus includes: the device comprises a control part, a driving part, a PCB bearing platform, a camera part and a flying probe testing part; wherein the control part is used for controlling the driving part, the camera part and the flying probe testing part; the driving part is used for driving the camera part and the flying probe testing part; the PCB bearing platform is used for loading a PCB; the camera part is used for acquiring an image from the PCB; the flying probe testing part is used for carrying out flying probe testing on the PCB; the flying probe test equipment is applied to any one of the flying probe test methods of the PCB.
One or more embodiments of the invention disclose a non-transitory computer-readable storage medium. The non-transitory computer readable storage medium has stored therein computer instructions adapted to be loaded by a processor to implement any of the above-described PCB flying probe testing methods.
One or more embodiments of the invention disclose an electronic device applied to a flying probe test equipment. The electronic device applied to the flying probe test equipment comprises: at least one processor, at least one memory, at least one input device, and at least one output device. The processor, the memory, the input device and the output device are connected through a bus. The electronic device applied to the flying probe test equipment is used for realizing the flying probe test method of any PCB.
Compared with the prior art, the technical scheme disclosed by the invention mainly has the following beneficial effects:
in an embodiment of the invention, the mechanical coordinates (c1, d1) of the first camera to the corresponding test point and the mechanical coordinates (c2, d2) of the second camera to the corresponding test point are first calculated. The first camera is then moved to the mechanical coordinates (c1, d1), a contour image of the test point at the mechanical coordinates (c1, d1) is acquired and the mechanical coordinates (g1, h1) of the first probe to the center of the contour image are calculated. And in addition, the second camera moves to the mechanical coordinates (c2, d2), a contour image of a test point at the mechanical coordinates (c2, d2) is acquired, and the mechanical coordinates (g2, h2) of the second probe to the center of the contour image are calculated. Finally, the first probe is moved to the mechanical coordinates (g1, h1) for testing, while the second probe is moved to the mechanical coordinates (g2, h2) for testing. In the embodiment of the invention, the first probe is fixed relative to the first camera, and the second probe is fixed relative to the second camera, so that the flying probe testing method of the PCB in the embodiment of the invention can accurately obtain the mechanical coordinates of the paired testing points, and is favorable for improving the accuracy of testing the PCB open circuit point by the flying probe.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive labor.
FIG. 1 is a schematic flow chart illustrating a flying probe testing method for a PCB according to an embodiment of the present invention;
fig. 2 is a schematic flow chart illustrating a retest of an open point on a PCB by the flying probe testing method of the PCB according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a flying probe testing device for PCB according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a flying probe test apparatus for a PCB according to an embodiment of the present invention;
fig. 5 is a schematic diagram of an electronic device according to an embodiment of the invention.
Description of reference numerals:
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
At present, the PCB is gradually thinned, the circuit structure thereof becomes more and more complex, and the requirement for reliability is also higher and higher. Generally, after the PCB is printed, a probe is used to detect the circuit of the PCB, for example, to test whether the circuit of the PCB is abnormally opened.
Some embodiments of the invention disclose a flying probe test method of a PCB for testing the open circuit problem of the PCB.
Fig. 1 is a schematic flow chart illustrating a method for testing a flying probe of a PCB according to an embodiment of the present invention. Those skilled in the art will appreciate that the order of the steps illustrated in fig. 1 is not absolute.
As illustrated in fig. 1, the flying probe testing method of the PCB includes:
step 1: and acquiring paired test points to be tested on the PCB.
Step 2: mechanical coordinates (a1, b1) of the first probe to the corresponding test point and mechanical coordinates (a2, b2) of the second probe to the corresponding test point are obtained.
And step 3: calculating mechanical coordinates (c1, d1) of the first camera to the corresponding test point; calculating mechanical coordinates (c2, d2) of the second camera to the corresponding test point.
And 4, step 4: the first camera moves to the mechanical coordinates (c1, d1) to acquire a contour image of a test point at the mechanical coordinates (c1, d 1); calculating the mechanical coordinates (g1, h1) of said first probe to the center of the contour image; the second camera moves to the mechanical coordinates (c2, d2), and a contour image of a test point at the mechanical coordinates (c2, d2) is acquired; the mechanical coordinates (g2, h2) of the second probe to the center of the contour image are calculated.
And 5: the first probe is moved to the mechanical coordinates (g1, h1) for testing while the second probe is moved to the mechanical coordinates (g2, h2) for testing.
In an embodiment of the invention, the mechanical coordinates (c1, d1) of the first camera to the corresponding test point and the mechanical coordinates (c2, d2) of the second camera to the corresponding test point are first calculated. The first camera is then moved to the mechanical coordinates (c1, d1), a contour image of the test point at the mechanical coordinates (c1, d1) is acquired and the mechanical coordinates (g1, h1) of the first probe to the center of the contour image are calculated. And in addition, the second camera moves to the mechanical coordinates (c2, d2), a contour image of a test point at the mechanical coordinates (c2, d2) is acquired, and the mechanical coordinates (g2, h2) of the second probe to the center of the contour image are calculated. Finally, the first probe is moved to the mechanical coordinates (g1, h1) for testing, while the second probe is moved to the mechanical coordinates (g2, h2) for testing. In the embodiment of the invention, the first probe is fixed relative to the first camera, and the second probe is fixed relative to the second camera, so that the flying probe testing method of the PCB in the embodiment of the invention can accurately obtain the mechanical coordinates of the paired testing points, and is favorable for improving the accuracy of testing the PCB open circuit point by the flying probe.
In some embodiments of the present invention, in order to further improve the accuracy of the flying probe testing PCB open point, the flying probe testing method of the PCB further comprises: when the paired test points tested by the first probe and the second probe have an open circuit problem, moving the position of the first probe and/or the second probe on the test points, and continuing to test the paired test points.
By moving the position of the first probe and/or the second probe on the test point, the problems of poor contact between the first probe and/or the second probe and the test point caused by etching defects of the PCB and the fact that the test point is shielded by stains can be solved, and the accuracy of testing the PCB open point by the flying probe is further improved.
In some embodiments of the present invention, in order to further improve the accuracy of the flying probe testing PCB open point, the flying probe testing method of the PCB further comprises: when the paired test points tested by the first probe and the second probe have an open circuit problem, the first probe moves to the mechanical coordinates (g2, h2) for testing, and meanwhile the second probe moves to the mechanical coordinates (g1, h1) for testing.
By exchanging the test points of the first probe and the second probe on the PCB, the problem that the first probe and/or the second probe is in poor contact with the test point due to probe defects is solved, and the accuracy of testing the PCB open-circuit point by the flying probe is further improved.
In some embodiments of the present invention, the flying probe test method of the PCB further comprises: in the probe coordinate system, a distance Δ X1 in the X-axis direction and a distance Δ Y1 in the Y-axis direction between the first probe and the first camera are acquired, and a distance Δ X2 in the X-axis direction and a distance Δ Y2 in the Y-axis direction between the second probe and the second camera are acquired. The ratio δ of unit length to number of pixels is obtained, δ being s/n, s being 1mm, n being the number of pixels. Calculating mechanical coordinates (c1, d1) of the first camera to the corresponding test point from the positional relationship of the first probe to the first camera in combination with the mechanical coordinates (α 1, β 1), the distance Δ x1, and the distance Δ y 1. Calculating mechanical coordinates (c2, d2) of the second camera to the corresponding test point from the positional relationship of the second probe to the second camera in combination with the mechanical coordinates (α 2, β 2), the distance Δ x2, and the distance Δ y 2. The first camera moves to a corresponding test point to obtain a contour image of the test point, an offset value phi 1 between the center of the contour image and the center of a window of the first camera is calculated in a camera coordinate system, the offset value phi 1 is converted into a length value lambda 1 according to the ratio delta, and a mechanical coordinate (e1, f1) from the center of the window of the first camera to the center of the contour image is calculated by combining the length value lambda 1; -calculating mechanical coordinates (g1, h1) of said first probe to the center of the contour image in combination with said mechanical coordinates (e1, f1), said distance Δ x1 and said distance Δ y 1. The second camera moves to a corresponding test point, a contour image of the test point is obtained, an offset value phi 2 between the center of the contour image and the center of a window of the second camera is calculated in a camera coordinate system, the offset value phi 2 is converted into a growth value lambda 2 according to the ratio delta, and a mechanical coordinate (e2, f2) from the center of the window of the second camera to the center of the contour image is calculated by combining the length value lambda 2; calculating mechanical coordinates (g2, h2) of the second probe to the center of the contour image in combination with the mechanical coordinates (e2, f 2).
In some embodiments of the invention, c1 ═ α 1 ±. Δ x1 in the mechanical coordinates (c1, d1) and d1 ═ β 1 ±. Δ y1 in the mechanical coordinates (c1, d 1). C2 ═ α 2 ±. Δ x2 in the mechanical coordinates (c2, d2), and d2 ═ β 2 ±. Δ y2 in the mechanical coordinates (c2, d 2).
In some embodiments of the present invention, the mechanical coordinate of the center of the viewing window of the first camera is (m1, n1), e1 in the mechanical coordinate (e1, f1) is m1 ± λ 1, and f1 in the mechanical coordinate (e1, f1) is n1 ± λ 1. The mechanical coordinates of the center of the window of the second camera are (m2, n2), e2 in the mechanical coordinates (e2, f2) is m2 ± λ 2, and f2 in the mechanical coordinates (e2, f2) is n2 ± λ 2.
In some embodiments of the invention, g1 ═ e1 ±. Δ x1 in the mechanical coordinates (g1, h1) and h1 ═ f1 ±. Δ y1 in the mechanical coordinates (g1, h 1). G2 ═ e2 ±. Δ x2 in the mechanical coordinates (g2, h2), and h2 ═ f2 ±. Δ y2 in the mechanical coordinates (g2, h 2).
The above calculation methods help to quickly and accurately calculate the mechanical coordinates (g1, h1) of the first probe to the center of the contour image and the mechanical coordinates (g2, h2) of the second probe to the center of the contour image.
The flying probe test method of the PCB will be further explained below.
Fig. 2 is a schematic flow chart illustrating retesting the open point on the PCB by the flying probe testing method of the PCB according to an embodiment of the present invention.
In the process shown in fig. 2, the flying probe test method of the PCB is used to retest the result of the PCB open point measured by the universal testing machine. It will be appreciated that the example of figure 2 is only one possible application of the flying probe test method of the PCB. The flying probe test method of the PCB can also be applied in other forms.
In the process shown in fig. 2, the position of the first probe and/or the second probe on the test point may be moved for multiple times, specifically: the first probe is moved to mechanical coordinates (g 1-D/4, h1) while/or the second probe is moved to mechanical coordinates (g 2-L/4, h 2). Wherein D is the diameter of the contour image corresponding to the mechanical coordinates (g1, h1), and L is the diameter of the contour image corresponding to the mechanical coordinates (g2, h 2).
If the paired test points tested by the first probe and the second probe still have an open circuit problem, the position of the first probe and/or the second probe on the test point can be continuously moved, specifically: the first probe is moved to mechanical coordinates (g 1-D/4 + D/2, h1) while/or the second probe is moved to mechanical coordinates (g 2-L/4 + L/2, h 2).
If the paired test points tested by the first probe and the second probe still have an open circuit problem, the position of the first probe and/or the second probe on the test point can be continuously moved, specifically: the first probe is moved to mechanical coordinates (g 1-D/4 + D/2-D/4, h1+ D/4) while/or the second probe is moved to mechanical coordinates (g 2-L/4 + L/2-L/4, h2+ L/4).
If the paired test points tested by the first probe and the second probe still have an open circuit problem, the position of the first probe and/or the second probe on the test point can be continuously moved, specifically: the first probe is moved to mechanical coordinates (g 1-D/4 + D/2-D/4, h1+ D/4-D/2) while/or the second probe is moved to mechanical coordinates (g 2-L/4 + L/2-L/4, h2+ L/4-L/2).
It will be appreciated that the position of the first probe and/or the second probe on the test site may be selected to be moved one or more times as desired. The general technical idea is to eliminate the etching defect of the PCB by moving the position of the first probe and/or the second probe on the test point and the problem that the test point is shielded by the smudge to cause poor contact between the first probe and/or the second probe and the test point.
Some embodiments of the invention disclose a flying probe testing device for a PCB.
Fig. 3 is a schematic diagram of a flying probe testing apparatus for PCB according to an embodiment of the present invention. As illustrated in fig. 3, the flying probe testing apparatus of the PCB includes: an acquisition module 10, a coordinate processing module 20, a camera driving module 30, and a probe testing module 40.
Wherein the obtaining module 10 is configured to implement: obtaining paired test points to be tested on a PCB; mechanical coordinates (a1, b1) of the first probe to the corresponding test point and mechanical coordinates (a2, b2) of the second probe to the corresponding test point are obtained.
The coordinate processing module 20 is configured to implement: calculating mechanical coordinates (c1, d1) of the first camera to the corresponding test point; calculating mechanical coordinates (c2, d2) of the second camera to the corresponding test point.
The camera driving module 30 is configured to implement: the first camera moves to the mechanical coordinates (c1, d1) to acquire a contour image of a test point at the mechanical coordinates (c1, d 1); calculating the mechanical coordinates (g1, h1) of said first probe to the center of the contour image; the second camera moves to the mechanical coordinates (c2, d2), and a contour image of a test point at the mechanical coordinates (c2, d2) is acquired; the mechanical coordinates (g2, h2) of the second probe to the center of the contour image are calculated.
The probe test module 40 is configured to implement: the first probe is moved to the mechanical coordinates (g1, h1) for testing while the second probe is moved to the mechanical coordinates (g2, h2) for testing.
In some embodiments of the present invention, the probe test module 40 is further configured to: when the paired test points tested by the first probe and the second probe have an open circuit problem, moving the position of the first probe and/or the second probe on the test points, and continuing to test the paired test points.
In some embodiments of the present invention, the probe test module 40 is further configured to: when the paired test points tested by the first probe and the second probe have an open circuit problem, the first probe moves to the mechanical coordinates (g2, h2) for testing, and meanwhile the second probe moves to the mechanical coordinates (g1, h1) for testing.
In some embodiments of the present invention, the coordinate processing module 20 is further configured to implement:
in the probe coordinate system, a distance Δ X1 in the X-axis direction and a distance Δ Y1 in the Y-axis direction between the first probe and the first camera are acquired, and a distance Δ X2 in the X-axis direction and a distance Δ Y2 in the Y-axis direction between the second probe and the second camera are acquired.
The ratio δ of unit length to number of pixels is obtained, δ being s/n, s being 1mm, n being the number of pixels.
Calculating mechanical coordinates (c1, d1) of the first camera to the corresponding test point from the positional relationship of the first probe to the first camera in combination with the mechanical coordinates (α 1, β 1), the distance Δ x1, and the distance Δ y 1.
Calculating mechanical coordinates (c2, d2) of the second camera to the corresponding test point from the positional relationship of the second probe to the second camera in combination with the mechanical coordinates (α 2, β 2), the distance Δ x2, and the distance Δ y 2.
The first camera moves to a corresponding test point to obtain a contour image of the test point, an offset value phi 1 between the center of the contour image and the center of a window of the first camera is calculated in a camera coordinate system, the offset value phi 1 is converted into a length value lambda 1 according to the ratio delta, and a mechanical coordinate (e1, f1) from the center of the window of the first camera to the center of the contour image is calculated by combining the length value lambda 1; -calculating mechanical coordinates (g1, h1) of said first probe to the center of the contour image in combination with said mechanical coordinates (e1, f1), said distance Δ x1 and said distance Δ y 1.
The second camera moves to a corresponding test point, a contour image of the test point is obtained, an offset value phi 2 between the center of the contour image and the center of a window of the second camera is calculated in a camera coordinate system, the offset value phi 2 is converted into a growth value lambda 2 according to the ratio delta, and a mechanical coordinate (e2, f2) from the center of the window of the second camera to the center of the contour image is calculated by combining the length value lambda 2; calculating mechanical coordinates (g2, h2) of the second probe to the center of the contour image in combination with the mechanical coordinates (e2, f 2).
One embodiment of the invention discloses flying probe testing equipment.
Fig. 4 is a schematic diagram of a flying probe testing apparatus for a PCB according to an embodiment of the present invention. As illustrated in fig. 4, the flying probe testing apparatus includes: the flying probe test system comprises a control part 100, a driving part 200, a PCB carrying platform 300, a camera part 400 and a flying probe test part 500; wherein the control unit 100 is configured to control the driving unit 200, the camera unit 400, and the flying probe testing unit 500; the driving part 200 is used for driving the camera part 400 and the flying probe testing part 500; the PCB loading platform 300 is used for loading a PCB; the camera part 400 is used for acquiring images from the PCB; the flying probe testing part 500 is used for performing a flying probe test on a PCB. The flying probe testing equipment in the embodiment of the invention is used for realizing any one of the PCB flying probe testing methods.
In the embodiment of the present invention, the driving part 200 drives the camera part 400 and the flying probe testing part 500 to move in the mechanical coordinate system, so that the camera part 400 and the flying probe testing part 500 need to obtain corresponding mechanical coordinates to reach a specified position.
An embodiment of the invention discloses an electronic device. The electronic device is applied to flying probe test equipment of the PCB. Fig. 5 is a schematic view of an electronic device according to an embodiment of the invention. As illustrated in fig. 5, the electronic device applied to the flying probe testing apparatus includes: at least one processor 201, at least one memory 202, at least one input device 203, and at least one output device 204. The processor 201, memory 202, input device 203, and output device 204 are connected by a bus 205. The electronic device is used for realizing any one of the PCB flying probe testing methods.
An embodiment of the present invention discloses a non-transitory computer-readable storage medium. The non-transitory computer readable storage medium has stored therein computer instructions adapted to be loaded by a processor to implement any of the above-described PCB flying probe testing methods.
When the techniques in the various embodiments described above are implemented using software, the computer instructions and/or data to implement the various embodiments described above may be stored on a computer-readable medium or transmitted as one or more instructions or code on a readable medium. Computer-readable media includes both computer storage media and communication media including any medium that facilitates transfer of a computer program from one place to another. A storage media may be any available media that a computer can store. Taking this as an example but not limiting: computer-readable media can include RAM, ROM, EEPROM, CD-ROM or other optical disk storage, magnetic disk storage or other magnetic storage devices, or any other medium that can carry or store desired program code in the form of instructions or data structures and that can be accessed by a computer. Further, any connection is properly termed a computer-readable medium. For example, if the software is transmitted from a website, server, or other remote source using a coaxial cable, fiber optic cable, twisted pair, Digital Subscriber Line (DSL), or wireless technologies such as infrared, radio, and microwave, then the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave are included in the definition of medium.
Finally, it should be noted that: the above examples are only for illustrating the technical solutions of the present application, and are not limited thereto. Although the present application has been described in detail with reference to the foregoing embodiments, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention. And such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.
Claims (8)
1. A flying probe test method of a PCB is characterized by comprising the following steps:
obtaining paired test points to be tested on a PCB;
acquiring mechanical coordinates (a1, b1) from the first probe to the corresponding test point and mechanical coordinates (a2, b2) from the second probe to the corresponding test point;
calculating mechanical coordinates (c1, d1) of the first camera to the corresponding test point; calculating mechanical coordinates of the second camera to the corresponding test point (c2, d 2);
the first camera moves to the mechanical coordinates (c1, d1) to acquire a contour image of a test point at the mechanical coordinates (c1, d 1); calculating the mechanical coordinates (g1, h1) of said first probe to the center of the contour image;
the second camera moves to the mechanical coordinates (c2, d2), and a contour image of a test point at the mechanical coordinates (c2, d2) is acquired; calculating the mechanical coordinates (g2, h2) of said second probe to the center of the contour image;
the first probe is moved to the mechanical coordinates (g1, h1) for testing while the second probe is moved to the mechanical coordinates (g2, h2) for testing;
when the paired test points tested by the first probe and the second probe have an open circuit problem, the position of the first probe and/or the second probe on the test point is moved for multiple times, and the paired test points are continuously tested.
2. The flying probe test method of PCB as claimed in claim 1, wherein when there is an open circuit problem in the paired test points tested by the first probe and the second probe, the first probe moves to the mechanical coordinates (g2, h2) for testing, and simultaneously the second probe moves to the mechanical coordinates (g1, h1) for testing.
3. The flying probe testing method of the PCB of claim 1, wherein:
acquiring a distance delta X1 between the first probe and the first camera in the X-axis direction and a distance delta Y1 between the first probe and the first camera in the Y-axis direction, and acquiring a distance delta X2 between the second probe and the second camera in the X-axis direction and a distance delta Y2 in the Y-axis direction in a probe coordinate system;
acquiring a ratio delta of the unit length to the number of pixels, wherein delta is s/n, s is 1mm, and n is the number of pixels;
calculating mechanical coordinates (c1, d1) of the first camera to the corresponding test point from the positional relationship of the first probe to the first camera in combination with the mechanical coordinates (α 1, β 1), the distance Δ x1, and the distance Δ y 1;
calculating mechanical coordinates (c2, d2) of the second camera to the corresponding test point from the positional relationship of the second probe to the second camera in combination with the mechanical coordinates (α 2, β 2), the distance Δ x2, and the distance Δ y 2;
the first camera moves to a corresponding test point to obtain a contour image of the test point, an offset value phi 1 between the center of the contour image and the center of a window of the first camera is calculated in a camera coordinate system, the offset value phi 1 is converted into a length value lambda 1 according to the ratio delta, and a mechanical coordinate (e1, f1) from the center of the window of the first camera to the center of the contour image is calculated by combining the length value lambda 1; -calculating mechanical coordinates (g1, h1) of said first probe to the centre of the contour image in combination with said mechanical coordinates (e1, f1), said distance Δ x1 and said distance Δ y 1;
the second camera moves to a corresponding test point, a contour image of the test point is obtained, an offset value phi 2 between the center of the contour image and the center of a window of the second camera is calculated in a camera coordinate system, the offset value phi 2 is converted into a growth value lambda 2 according to the ratio delta, and a mechanical coordinate (e2, f2) from the center of the window of the second camera to the center of the contour image is calculated by combining the length value lambda 2; calculating mechanical coordinates (g2, h2) of the second probe to the center of the contour image in combination with the mechanical coordinates (e2, f 2).
4. A flying probe testing device of a PCB is characterized by comprising: the device comprises an acquisition module (10), a coordinate processing module (20), a camera driving module (30) and a probe testing module (40); wherein the content of the first and second substances,
the acquisition module (10) is configured to implement: obtaining paired test points to be tested on a PCB; acquiring mechanical coordinates (a1, b1) from the first probe to the corresponding test point and mechanical coordinates (a2, b2) from the second probe to the corresponding test point;
the coordinate processing module (20) is configured to implement: calculating mechanical coordinates (c1, d1) of the first camera to the corresponding test point; calculating mechanical coordinates of the second camera to the corresponding test point (c2, d 2);
the camera driving module (30) is used for realizing: the first camera moves to the mechanical coordinates (c1, d1) to acquire a contour image of a test point at the mechanical coordinates (c1, d 1); calculating the mechanical coordinates (g1, h1) of said first probe to the center of the contour image; the second camera moves to the mechanical coordinates (c2, d2), and a contour image of a test point at the mechanical coordinates (c2, d2) is acquired; calculating the mechanical coordinates (g2, h2) of said second probe to the center of the contour image;
the probe test module (40) is used for realizing that: the first probe is moved to the mechanical coordinates (g1, h1) for testing while the second probe is moved to the mechanical coordinates (g2, h2) for testing;
the probe test module (40) is further configured to implement: when the paired test points tested by the first probe and the second probe have an open circuit problem, the position of the first probe and/or the second probe on the test point is moved for multiple times, and the paired test points are continuously tested.
5. The flying probe testing device of PCB as recited in claim 4, wherein the probe testing module (40) is further configured to implement: when the paired test points tested by the first probe and the second probe have an open circuit problem, the first probe moves to the mechanical coordinates (g2, h2) for testing, and meanwhile the second probe moves to the mechanical coordinates (g1, h1) for testing.
6. Flying probe testing device of a PCB according to claim 4, characterized in that the coordinate processing module (20) is further adapted to realize:
acquiring a distance delta X1 between the first probe and the first camera in the X-axis direction and a distance delta Y1 between the first probe and the first camera in the Y-axis direction, and acquiring a distance delta X2 between the second probe and the second camera in the X-axis direction and a distance delta Y2 in the Y-axis direction in a probe coordinate system;
acquiring a ratio delta of the unit length to the number of pixels, wherein delta is s/n, s is 1mm, and n is the number of pixels;
calculating mechanical coordinates (c1, d1) of the first camera to the corresponding test point from the positional relationship of the first probe to the first camera in combination with the mechanical coordinates (α 1, β 1), the distance Δ x1, and the distance Δ y 1;
calculating mechanical coordinates (c2, d2) of the second camera to the corresponding test point from the positional relationship of the second probe to the second camera in combination with the mechanical coordinates (α 2, β 2), the distance Δ x2, and the distance Δ y 2;
the first camera moves to a corresponding test point to obtain a contour image of the test point, an offset value phi 1 between the center of the contour image and the center of a window of the first camera is calculated in a camera coordinate system, the offset value phi 1 is converted into a length value lambda 1 according to the ratio delta, and a mechanical coordinate (e1, f1) from the center of the window of the first camera to the center of the contour image is calculated by combining the length value lambda 1; -calculating mechanical coordinates (g1, h1) of said first probe to the centre of the contour image in combination with said mechanical coordinates (e1, f1), said distance Δ x1 and said distance Δ y 1;
the second camera moves to a corresponding test point, a contour image of the test point is obtained, an offset value phi 2 between the center of the contour image and the center of a window of the second camera is calculated in a camera coordinate system, the offset value phi 2 is converted into a growth value lambda 2 according to the ratio delta, and a mechanical coordinate (e2, f2) from the center of the window of the second camera to the center of the contour image is calculated by combining the length value lambda 2; calculating mechanical coordinates (g2, h2) of the second probe to the center of the contour image in combination with the mechanical coordinates (e2, f 2).
7. A flying probe test apparatus of a PCB, comprising: the device comprises a control part (100), a driving part (200), a PCB bearing platform (300), a camera part (400) and a flying probe testing part (500); wherein the control part (100) is used for controlling the driving part (200), the camera part (400) and the flying probe testing part (500); the driving part (200) is used for driving the camera part (400) and the flying probe testing part (500); the PCB bearing platform (300) is used for loading a PCB; the camera part (400) is used for acquiring images from the PCB; the flying probe testing part (500) is used for performing flying probe testing on the PCB;
the flying probe testing apparatus is applied to the flying probe testing method of the PCB according to any one of claims 1 to 3.
8. A non-transitory computer readable storage medium having stored therein computer instructions adapted to be loaded by a processor to implement the flying probe testing method of a PCB of any of claims 1 to 3.
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| CN114441942B (en) * | 2022-01-28 | 2023-10-03 | 苏州格拉尼视觉科技有限公司 | Flying probe testing method, system and equipment for PCB and storage medium |
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