CN110728920A - 一种led透明显示屏及其制作方法 - Google Patents

一种led透明显示屏及其制作方法 Download PDF

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CN110728920A
CN110728920A CN201911045920.4A CN201911045920A CN110728920A CN 110728920 A CN110728920 A CN 110728920A CN 201911045920 A CN201911045920 A CN 201911045920A CN 110728920 A CN110728920 A CN 110728920A
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transparent glass
led
display screen
led lamp
transparent
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魏飞
马鹏
陈玲
向延旺
夏越
江文文
叶传秀
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Hunan Helilai Wisdom Display Technology Co Ltd
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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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Abstract

本发明公开了一种LED透明显示屏，包括透明玻璃基板和透明玻璃盖板，透明玻璃基板上成形有蛇形槽，蛇形槽内固定有导电材料；导电材料上连接有若干LED灯珠；所述透明玻璃盖板上成形有若干与LED灯珠配合的条形凹槽，条形凹槽内成形有弧形条状凸起。本发明结构简单，制作方便，提高了LED灯珠的有效光距，此外提供了一种快速简单那的制作方法。

Description

一种LED透明显示屏及其制作方法
技术领域
本发明属于一种LED屏领域，尤其涉及一种LED透明显示屏及其制作方法。
背景技术
目前LED显示屏安装的应用越来越多，尤其是针对玻璃幕墙、商场橱窗等安装的LED屏，其对屏体通透性有较高要求。但是现有的透明LED屏，其对应灯珠的凹槽通常为矩形凹槽，而灯珠发明是沿其径向呈周围扩散状发出，导致现有的LED屏远距离后很容易看不清楚，有效视距较低。
发明内容
本发明的目的是设计一种LED透明显示屏及其制作方法，本发明结构简单，制作方便，提高了LED灯珠的有效光距，此外提供了一种快速简单那的制作方法。
为了达到上述目的，本发明的技术方案如下：
一种LED透明显示屏，包括透明玻璃基板和透明玻璃盖板，透明玻璃基板上成形有蛇形槽，蛇形槽内固定有导电材料；导电材料上连接有若干LED灯珠；所述透明玻璃盖板上成形有若干与LED灯珠配合的条形凹槽，条形凹槽内成形有弧形条状凸起。
进一步的改进，所述透明玻璃基板和透明玻璃盖板通过透明胶黏贴固定。
进一步的改进，所述LED灯珠为RGB三色灯LED灯珠。
一种LED透明显示屏的制作方法，包括如下步骤：
步骤一、在透明玻璃基板上涂上石蜡并且暴露出蛇形槽区域；
步骤二、将透明玻璃基板放在刻蚀液中刻蚀形成蛇形槽；
步骤三、蛇形槽内填充导电材料；
步骤四、将采用砂轮机打磨出透明玻璃盖板上的条形凹槽和弧形条状凸起；所述砂轮机的砂轮上成形有内凹弧形槽；
步骤五、将LED灯珠固定到导电材料上；
步骤六、在透明玻璃基板边沿涂上透明胶，然后盖住透明玻璃盖板黏贴固定。
进一步的改进，所述砂轮连接有电机，电机轴接有提手。
进一步的改进，所述LED灯珠成阵列式排列。
进一步的改进，其特征在于，所述导电材料为银胶。
进一步的改进，所述LED灯珠为RGB三色灯LED灯珠。
附图说明
图1为本发明的整体结构示意图；
图2为透明玻璃基板的俯视结构示意图；
图3为透明玻璃盖板的加工结构示意图。
具体实施方式
实施例1
如图1所示的一种LED透明显示屏，包括透明玻璃基板1和透明玻璃盖板2，透明玻璃基板1上成形有蛇形槽3，蛇形槽3内固定有导电材料4；导电材料4上连接有若干LED灯珠5；所述透明玻璃盖板2上成形有若干与LED灯珠5配合的条形凹槽6，条形凹槽6内成形有弧形条状凸起7。
透明玻璃基板1和透明玻璃盖板2通过透明胶黏贴固定。
LED灯珠5为RGB三色灯LED灯珠。
一种LED透明显示屏的制作方法，包括如下步骤：
步骤一、在透明玻璃基板1上涂上石蜡并且暴露出蛇形槽区域；
步骤二、将透明玻璃基板1放在刻蚀液中刻蚀形成蛇形槽3；这样在蛇形槽3首尾分别加装正极和负极即可实现电路的整体通电。
步骤三、蛇形槽3内填充导电材料4；
步骤四、将采用砂轮机打磨出透明玻璃盖板2上的条形凹槽6和弧形条状凸起7；所述砂轮机的砂轮8上成形有内凹弧形槽9；这样和条形凹槽6和弧形条状凸起7同时被加工出来，并且通过弧形条状凸起7形成凸透镜产生聚光效果，从而使得LED灯组成的字或图案更加清晰，传递的有效距离更远。
步骤五、将LED灯珠5固定到导电材料4上；
步骤六、在透明玻璃基板1边沿涂上透明胶，然后盖住透明玻璃盖板2黏贴固定。
砂轮8连接有电机11，电机11轴接有提手10。LED灯珠5成阵列式排列。导电材料为银胶。
上述实施例仅仅是本发明的一个具体实施方式，不作为对本发明的限定。

Claims (8)

1.一种LED透明显示屏，其特征在于，包括透明玻璃基板(1)和透明玻璃盖板(2)，透明玻璃基板(1)上成形有蛇形槽(3)，蛇形槽(3)内固定有导电材料(4)；导电材料(4)上连接有若干LED灯珠(5)；所述透明玻璃盖板(2)上成形有若干与LED灯珠(5)配合的条形凹槽(6)，条形凹槽(6)内成形有弧形条状凸起(7)。
2.如权利要求1所述的LED透明显示屏，其特征在于，所述透明玻璃基板(1)和透明玻璃盖板(2)通过透明胶黏贴固定。
3.如权利要求1所述的LED透明显示屏，其特征在于，所述LED灯珠(5)为RGB三色灯LED灯珠。
4.一种LED透明显示屏的制作方法，其特征在于，包括如下步骤：
步骤一、在透明玻璃基板(1)上涂上石蜡并且暴露出蛇形槽区域；
步骤二、将透明玻璃基板(1)放在刻蚀液中刻蚀形成蛇形槽(3)；
步骤三、蛇形槽(3)内填充导电材料(4)；
步骤四、将采用砂轮机打磨出透明玻璃盖板(2)上的条形凹槽(6)和弧形条状凸起(7)；所述砂轮机的砂轮(8)上成形有内凹弧形槽(9)；
步骤五、将LED灯珠(5)固定到导电材料(4)上；
步骤六、在透明玻璃基板(1)边沿涂上透明胶，然后盖住透明玻璃盖板(2)黏贴固定。
5.如权利要求4所述的LED透明显示屏的制作方法，其特征在于，所述砂轮(8)连接有电机(11)，电机(11)轴接有提手(10)。
6.如权利要求4所述的LED透明显示屏的制作方法，其特征在于，所述LED灯珠(5)成阵列式排列。
7.如权利要求4所述的LED透明显示屏的制作方法，其特征在于，所述导电材料为银胶。
8.如权利要求1所述的LED透明显示屏及其制作方法，其特征在于，所述LED灯珠(5)为RGB三色灯LED灯珠。
CN201911045920.4A 2019-10-30 2019-10-30 一种led透明显示屏及其制作方法 Withdrawn CN110728920A (zh)

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Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103165027A (zh) * 2011-12-09 2013-06-19 上海本星电子科技有限公司 透明led显示屏及其应用
CN103358200A (zh) * 2012-03-26 2013-10-23 旭硝子株式会社 玻璃基板的端面磨削装置和端面磨削方法
CN203573583U (zh) * 2013-09-30 2014-04-30 广东锐拓照明景观艺术设计工程有限公司 一种led玻璃显示屏
CN104086085A (zh) * 2014-06-30 2014-10-08 常州大学 一种载玻片表面刻蚀规则微井阵列的方法
CN104376789A (zh) * 2013-08-14 2015-02-25 天津顺保科技有限公司 一种新型led广告窗体
CN105487150A (zh) * 2016-01-06 2016-04-13 利亚德光电股份有限公司 反射面罩及具有其的led显示装置
CN105913775A (zh) * 2016-06-29 2016-08-31 深圳市联建光电股份有限公司 一种新型的led透明显示屏及其制作方法
CN106271956A (zh) * 2016-08-15 2017-01-04 安徽省银锐玻璃机械有限公司 用于玻璃磨边的复合液
US20170300142A1 (en) * 2015-07-24 2017-10-19 Guangdong Oppo Mobile Telecommunications Corp., Ltd. Display Screen Assembly, Terminal Front Cover, and Terminal
CN108401049A (zh) * 2018-05-25 2018-08-14 Oppo广东移动通信有限公司 壳体、电子装置和壳体的制造方法
CN108929042A (zh) * 2018-08-31 2018-12-04 信利光电股份有限公司 一种玻璃盖板加工方法、玻璃盖板及终端设备
CN209133127U (zh) * 2018-12-19 2019-07-19 深圳市真屏科技发展有限公司 防蓝光棱台透镜led显示屏

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103165027A (zh) * 2011-12-09 2013-06-19 上海本星电子科技有限公司 透明led显示屏及其应用
CN103358200A (zh) * 2012-03-26 2013-10-23 旭硝子株式会社 玻璃基板的端面磨削装置和端面磨削方法
CN104376789A (zh) * 2013-08-14 2015-02-25 天津顺保科技有限公司 一种新型led广告窗体
CN203573583U (zh) * 2013-09-30 2014-04-30 广东锐拓照明景观艺术设计工程有限公司 一种led玻璃显示屏
CN104086085A (zh) * 2014-06-30 2014-10-08 常州大学 一种载玻片表面刻蚀规则微井阵列的方法
US20170300142A1 (en) * 2015-07-24 2017-10-19 Guangdong Oppo Mobile Telecommunications Corp., Ltd. Display Screen Assembly, Terminal Front Cover, and Terminal
CN105487150A (zh) * 2016-01-06 2016-04-13 利亚德光电股份有限公司 反射面罩及具有其的led显示装置
CN105913775A (zh) * 2016-06-29 2016-08-31 深圳市联建光电股份有限公司 一种新型的led透明显示屏及其制作方法
CN106271956A (zh) * 2016-08-15 2017-01-04 安徽省银锐玻璃机械有限公司 用于玻璃磨边的复合液
CN108401049A (zh) * 2018-05-25 2018-08-14 Oppo广东移动通信有限公司 壳体、电子装置和壳体的制造方法
CN108929042A (zh) * 2018-08-31 2018-12-04 信利光电股份有限公司 一种玻璃盖板加工方法、玻璃盖板及终端设备
CN209133127U (zh) * 2018-12-19 2019-07-19 深圳市真屏科技发展有限公司 防蓝光棱台透镜led显示屏

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