CN110719935A - Sealing resin composition, reconfigured wafer, semiconductor package, and method for producing semiconductor package - Google Patents
Sealing resin composition, reconfigured wafer, semiconductor package, and method for producing semiconductor package Download PDFInfo
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- CN110719935A CN110719935A CN201880037788.XA CN201880037788A CN110719935A CN 110719935 A CN110719935 A CN 110719935A CN 201880037788 A CN201880037788 A CN 201880037788A CN 110719935 A CN110719935 A CN 110719935A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L21/00—Compositions of unspecified rubbers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
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Abstract
A sealing resin composition which is any one of the following (1) to (4). (1) Comprising a curable resin component, an elastomer component and a filler, and having an elastic modulus at 260 ℃ of 1.0GPa or less when the cured product is produced; (2) the elastomer composition comprises a curable resin component, an elastomer component and a filler, wherein the content of the elastomer component is 1.0-8.0% by mass of the whole; (3) the curable resin composition comprises a curable resin component, a compound having a siloxane bond, and a filler, wherein the proportion of the compound having a siloxane bond in the total of the curable resin component and the compound having a siloxane bond is 20% by mass or more; (4) which comprises a curable resin component, a compound having a siloxane bond, and a filler material, is used for wafer level packaging.
Description
Technical Field
The invention relates to a sealing resin composition, a reconfigured wafer, a semiconductor package, and a method for manufacturing a semiconductor package.
Background
In recent years, a method called Wafer Level Package (WLP) has been studied as a semiconductor mounting technique using a resin sealing material. This method is different from a flip-chip method in which a semiconductor chip and a wiring board are packaged in a state of being connected to each other, and the wiring board is not necessary, so that the package can be thinned. In addition, since two or more semiconductor chips are arranged on a support and then collectively sealed, and then each package is singulated, attention is drawn to a mounting technique having excellent productivity.
In WLP, since one surface of a support having a large area is sealed with a sealing material, warpage is likely to occur due to differences in thermal expansion coefficient, elastic modulus, shrinkage ratio, and the like between the sealing material and the support. As a method for suppressing the warpage of the support after sealing, a technique of increasing the filling amount of the filler has been studied (for example, see patent document 1).
Documents of the prior art
Patent document
Patent document 1: japanese laid-open patent publication No. 2013-10940
Disclosure of Invention
Problems to be solved by the invention
If the amount of the filler in the sealing material is increased, the thermal expansion coefficient of the sealing material is decreased, the difference between the thermal expansion coefficient of the sealing material and the thermal expansion coefficient of the support is decreased, and the warpage of the support is suppressed.
In recent years, the support in WLP has been increased in area, and for example, a wafer having a size of 12 inches is used instead of a conventional wafer having a size of 8 inches. Therefore, it is desirable to provide a resin composition for sealing which suppresses warpage of a sealed support even when the support has a large area, a reconfigured wafer and a semiconductor package obtained using the resin composition, and a method for manufacturing a semiconductor package in which warpage of the sealed support is suppressed.
In view of the above circumstances, an object of the present invention is to provide a sealing resin composition that suppresses warpage of a support after sealing, a reconfigured wafer and a semiconductor package obtained using the same, and a method for manufacturing a semiconductor package that suppresses warpage of a support after sealing.
Means for solving the problems
< 1 > A sealing resin composition which comprises a curable resin component, an elastomer component and a filler and which, when cured, has an elastic modulus at 260 ℃ of 1.0GPa or less.
< 2 > a sealing resin composition comprising a curable resin component, an elastomer component and a filler, wherein the content of the elastomer component is 1.0 to 8.0% by mass based on the whole.
< 3 > the sealing resin composition according to < 1 > or < 2 >, wherein the above-mentioned elastomer component contains a compound having a siloxane bond.
< 4 > a sealing resin composition comprising a curable resin component, a compound having a siloxane bond, and a filler, wherein the proportion of the compound having a siloxane bond in the total of the curable resin component and the compound having a siloxane bond is 20% by mass or more.
< 5 > a sealing resin composition comprising a curable resin component, a compound having a siloxane bond, and a filler, the sealing resin composition being used for wafer level packaging.
< 6 > the resin composition for sealing according to any one of < 3 > to < 5 >, wherein the compound having a siloxane bond comprises a compound having a structural unit represented by the following formula (1).
[ solution 1]
[ in the formula (1), R1And R2Each independently selected from the group consisting of an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a 1-valent organic group having an epoxy group, a 1-valent organic group having a carboxyl group, and a polyalkylene ether group having 3 to 500 carbon atoms.]
< 7 > the resin composition for sealing < 6 >, wherein the compound having the structural unit represented by the formula (1) further has a structural unit represented by the following formula (2).
[ solution 2]
[ in the formula (2), R3Is an alkylene group having 1 to 10 carbon atoms.]
< 8 > the sealing resin composition according to < 6 > or < 7 >, wherein the compound having the structural unit represented by the formula (1) is a compound having a structure represented by the following formula (3).
[ solution 3]
[ in the formula (3), n is an integer of 1 to 200, and m1And m2Are respectively independentThe ground is an integer of 1-200, R1And R2Independently selected from alkyl group with 1-10 carbon atoms, aryl group with 6-10 carbon atoms, alkoxy group with 1-10 carbon atoms, 1-valent organic group with epoxy group, 1-valent organic group with carboxyl group and polyalkylene ether group with 3-500 carbon atoms, R3Each independently an alkylene group having 1 to 10 carbon atoms, R4Each independently is a C1-10 2-valent hydrocarbon group.]
< 9 > the sealing resin composition according to any one of < 1 > to < 8 >, wherein the curable resin component comprises an epoxy resin and a curing agent.
< 10 > the sealing resin composition according to < 9 >, wherein the curing agent comprises a phenol curing agent.
< 11 > the resin composition for sealing according to any one of < 1 > to < 4 > for wafer level packaging.
< 12 > the sealing resin composition according to any one of < 1 > -11 > for use in FO-WLP.
< 13 > the resin composition for sealing according to any one of < 1 > to < 12 > for sealing by compression molding.
< 14 > the resin composition for sealing as set forth in any one of < 1 > to < 13 > in a powdery form.
< 15 > a reconfigured wafer comprising a support, two or more semiconductor chips arranged on the support, and a cured product of the sealing resin composition described in any one of < 1 > to < 14 > sealing the semiconductor chips.
< 16 > a semiconductor package comprising a support, a semiconductor chip disposed on the support, and a cured product of the sealing resin composition described in any one of < 1 > - < 14 > for sealing the semiconductor chip.
< 17 > a method for manufacturing a semiconductor package, comprising the steps of: disposing two or more semiconductor chips on a support; disposing the sealing resin composition of any one of < 1 > -to < 14 > on the support on which the semiconductor chip is disposed; curing the sealing resin composition disposed on the support to seal the semiconductor chip; and a step of singulating the semiconductor chip.
Effects of the invention
According to the present invention, there are provided a sealing resin composition in which warpage of a support after sealing is suppressed, a reconfigured wafer and a semiconductor package obtained using the same, and a method for manufacturing a semiconductor package in which warpage of a support after sealing is suppressed.
Detailed Description
Hereinafter, embodiments for carrying out the present invention will be described in detail. However, the present invention is not limited to the following embodiments. In the following embodiments, the constituent elements (including element steps) are not essential unless otherwise explicitly stated. Numerical values and ranges thereof are also not intended to limit the invention.
In the present disclosure, the term "step" includes not only a step that is separated from other steps but also a step that is not clearly distinguished from other steps as long as the purpose of the step is achieved.
In the present disclosure, the numerical range shown by "to" includes numerical values before and after "to" as a minimum value and a maximum value, respectively.
In the present disclosure, in the numerical ranges described in stages, the upper limit value or the lower limit value described in one numerical range may be replaced with the upper limit value or the lower limit value described in other numerical ranges described in stages. In the numerical ranges disclosed in the present disclosure, the upper limit or the lower limit of the numerical range may be replaced with the values shown in the examples.
In the present disclosure, each ingredient may contain two or more substances in accordance therewith. When two or more substances corresponding to each component are present in the composition, the content or content of each component refers to the content or content of the two or more substances present in the composition in total, unless otherwise specified.
In the present disclosure, each ingredient may comprise two or more particles in line therewith. When two or more kinds of particles corresponding to each component are present in the composition, the particle diameter of each component refers to a value related to a mixture of the two or more kinds of particles present in the composition unless otherwise specified.
< sealing resin composition (first embodiment) >
The sealing resin composition of the present embodiment contains a curable resin component, an elastomer component, and a filler, and has an elastic modulus at 260 ℃ of 1.0GPa or less when a cured product is obtained.
As a result of studies by the present inventors, it was found that the resin composition for sealing having the above-described configuration can suppress warpage of a support after sealing. The reason is not necessarily clear, but is presumed as follows: by including the elastomer component, the thermal expansion coefficient of the cured product is decreased, the difference between the thermal expansion coefficient of the cured product and the thermal expansion coefficient of the support is decreased, and the decrease in the elastic modulus at 260 ℃ of the cured product causes the decrease in warpage. The reason why the elastic modulus at 260 ℃ is decreased is considered to be, for example: the elastomer component, which is phase-separated in the resin matrix formed of the curable resin component, exists in island shapes.
Further, when the sealing resin composition contains an elastomer component, the proportion of the curable resin component is relatively decreased. The results are considered to be: a resin composition for sealing which is suppressed in increase of thermal expansion coefficient and is excellent in effects of reducing elasticity and suppressing warpage.
In the present disclosure, the elastic modulus at 260 ℃ when the sealing resin composition is formed into a cured product is a value measured by the method described in examples. From the viewpoint of suppressing warpage of the support, the elastic modulus is preferably 1.0GPa or less, and more preferably 0.5GPa or less.
The sealing resin composition may be solid or liquid. The shape of the sealing resin composition in the case of a solid may be, for example, a powder shape or a plate shape. From the viewpoint of handling properties, the sealing resin composition is preferably solid at the time of use, and more preferably in the form of a powder.
(elastomer component)
The kind of the elastomer component is not particularly limited. Specific examples of the elastomer component include: a compound having a siloxane bond (Si — O — Si) in the molecule (hereinafter also referred to as a siloxane compound), an acrylic resin block copolymer, NBR rubber, butadiene rubber, core-shell particles, an indene-styrene-coumarone copolymer, and the like. The elastomer component may be used alone or in combination of two or more.
In the present disclosure, when the elastomer component is also a compound corresponding to the curable resin component (for example, the elastomer component has a functional group such as an epoxy group which undergoes a curing reaction), the compound is classified as the elastomer component.
The elastomer component preferably contains a silicone compound from the viewpoint of suppressing warpage of the support. When the elastomer component contains a silicone compound, the proportion of the silicone compound in the total of the curable resin component and the elastomer component is preferably 20% by mass or more, more preferably 30% by mass or more, and still more preferably 40% by mass or more.
The molecular weight of the siloxane compound is not particularly limited. The number average molecular weight of the siloxane compound is preferably 10000 or more, more preferably 15000 or more, from the viewpoint of suppressing warpage of the support. The upper limit of the number average molecular weight is not particularly limited, and is preferably 30000 or less, more preferably 20000 or less, from the viewpoint of handling properties.
In the present disclosure, the number average molecular weight (Mn) of the siloxane compound is a value measured according to Gel Permeation Chromatography (GPC) using a standard curve based on standard polystyrene. Specifically, for example, a pump (model L-6200, manufactured by Hitachi, Ltd.), a column (TSKgel-G5000 HXL and TSKgel-G2000 HXL, both trade names manufactured by Tosoh corporation) and a detector (model L-3300 RI, manufactured by Hitachi, Ltd.) were used in GPC, and a value measured at a temperature of 30 ℃ and a flow rate of 1.0 ml/min was obtained using tetrahydrofuran as an eluent.
From the viewpoint of suppressing warpage of the support, the siloxane compound is preferably a siloxane compound having a structural unit represented by the following formula (1).
[ solution 4]
In the formula (1), R1And R2Each independently selected from the group consisting of an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a 1-valent organic group having an epoxy group, a 1-valent organic group having a carboxyl group, and a polyalkylene ether group having 3 to 500 carbon atoms.
From the viewpoint of the effect of suppressing warpage of the support, R1And R2Each independently preferably an alkyl group having 1 to 10 carbon atoms or an aryl group having 6 to 10 carbon atoms, more preferably a methyl group or a phenyl group, and still more preferably a methyl group. When two or more structural units represented by the formula (1) are present, two or more R1And more than two R2May be the same or different.
In the case of the siloxane compound, R in the formula (1)1And R2At least 1 of the groups may be at least 1 selected from a 1-valent organic group having an epoxy group and a polyalkylene ether group having 3 to 500 carbon atoms.
As R1And R2The 1-valent organic group having an epoxy group includes an alkyl group having an epoxy group and having 1 to 10 carbon atoms.
Examples of the polyalkylene ether group having 3 to 500 carbon atoms include: a 1-valent group having a structure in which two or more alkylene structures having 1 to 10 carbon atoms are connected by an ether bond. Mention may be made, for example, of 1-valent groups comprising oxyethylene groups (EO structure), oxypropylene structures (PO structure) or combinations thereof.
In the siloxane compound having the structural unit represented by the formula (1), the number of the structural unit represented by the formula (1) is not particularly limited. For example, the amount of the surfactant can be selected from 1 to 200, and more preferably from 5 to 150.
The siloxane compound having a structural unit represented by formula (1) preferably has a structural unit represented by formula (1) and an alkylene group having 1 to 10 carbon atoms forming a main chain. Examples of such a siloxane compound include siloxane compounds having a structural unit represented by formula (1) and a structural unit represented by formula (2).
[ solution 5]
In the formula (2), R3Preferably C1-10 alkylene group, C1-5 alkylene group. When two or more structural units represented by the formula (2) are present, two or more R3May be the same or different.
According to the studies of the present inventors, it was known that: the sealing resin composition containing a siloxane compound having a structural unit represented by formula (1) and a structural unit represented by formula (2) has a tendency to be less likely to cause appearance defects such as whitening on the surface of a cured product in addition to the effect of suppressing warpage of a support. We believe that the reason for this is: the silicone compound having the structural unit represented by formula (1) and the structural unit represented by formula (2) has more excellent compatibility with the curable resin component than the silicone compound having only the structural unit represented by formula (1), and the bleeding of the silicone compound from the sealing resin composition is further suppressed.
In the siloxane compound having the structural unit represented by the formula (1) and the structural unit represented by the formula (2), the number of the structural unit represented by the formula (2) is not particularly limited. For example, the selection range is 2 to 400, and more preferably 3 to 300.
In the siloxane compound having the structural unit represented by formula (1) and the structural unit represented by formula (2), the mass ratio of the structural unit represented by formula (1) to the structural unit represented by formula (2) (formula (1)/formula (2)) is not particularly limited.
In the siloxane compound having the structural unit represented by the formula (1) and the structural unit represented by the formula (2), the arrangement state of the structural unit represented by the formula (1) and the structural unit represented by the formula (2) is not particularly limited, and may be a block or a random. From the viewpoint of the effect of suppressing the warpage of the support, the block shape is preferable, and the arrangement is more preferably performed in the order of the block composed of the structural unit represented by formula (2), the block composed of the structural unit represented by formula (1), and the block composed of the structural unit represented by formula (2).
Examples of the siloxane compound having a structural unit represented by formula (1) and a structural unit represented by formula (2) include compounds having a structural unit represented by formula (3) (hereinafter, also referred to as specific siloxane compounds).
[ solution 6]
In the formula (3), n is an integer of 1 to 200, and m1And m2Each independently is an integer of 1 to 200, R1And R2Independently selected from alkyl group with 1-10 carbon atoms, aryl group with 6-10 carbon atoms, alkoxy group with 1-10 carbon atoms, 1-valent organic group with epoxy group, 1-valent organic group with carboxyl group and polyalkylene ether group with 3-500 carbon atoms, R3Each independently an alkylene group having 1 to 10 carbon atoms, R4Each independently is a C1-10 2-valent hydrocarbon group.
In the formula (3), n is preferably an integer of 5 to 200, and m is preferably an integer of1And m2Each independently preferably is an integer of 3 to 200.
R1～R3Preferred examples of (3) and R in the formulae (1) and (2)1～R3The same applies to preferred examples of the same.
R4Each independently preferably an alkylene group having 1 to 10 carbon atoms.
The specific siloxane compound can be produced by a known method. For example, the polysiloxane compound can be produced by reacting a polysiloxane compound corresponding to the structural unit represented by formula (1) with a compound corresponding to the structural unit represented by formula (2) (for example, a cyclic ester compound such as epsilon-caprolactone or a polymer thereof).
When a specific siloxane compound is prepared by the above method, a specific siloxane compound having a desired structure can be obtained by appropriately selecting the ratio of each compound.
The specific siloxane compound is solid (powder) at ordinary temperature (25 ℃). Therefore, when a solid sealing resin composition is prepared, there is an advantage that the amount of the silicone compound to be added can be increased as compared with a liquid silicone compound.
In the sealing resin composition, as the silicone compound, a specific silicone compound and a silicone compound different from the specific silicone compound may be contained. In this case, the ratio of the two is not particularly limited.
In the case of using a specific siloxane compound, and a siloxane compound other than the specific siloxane compound in combination as the siloxane compound, the kind of the siloxane compound other than the specific siloxane compound is not particularly limited. For example, it can be selected from siloxane compounds having a structural unit represented by formula (1).
(curable resin component)
The type of the curable resin component contained in the sealing resin composition is not particularly limited. From the viewpoint of balance of characteristics as a sealing material, a combination of an epoxy resin and a curing agent is preferable.
The type of the epoxy resin is not particularly limited, and may be selected according to the desired properties of the resin composition for sealing and the like. Specific examples of the epoxy resin include: epoxy resins obtained by epoxidizing a phenol novolac resin obtained by condensing or co-condensing a phenolic compound selected from at least 1 of phenol compounds such as phenol, cresol, xylenol, resorcinol, catechol, bisphenol a, and bisphenol F, and naphthol compounds such as α -naphthol, β -naphthol, and dihydroxynaphthalene, and an aliphatic aldehyde compound such as formaldehyde, acetaldehyde, propionaldehyde, or the like, in an acidic catalyst, that is, a phenol novolac type epoxy resin (such as a phenol novolac type epoxy resin and an o-cresol novolac type epoxy resin); an epoxy resin obtained by epoxidizing a triphenylmethane type phenol resin obtained by condensing or co-condensing the above phenolic compound with an aromatic aldehyde compound such as benzaldehyde or salicylaldehyde under an acidic catalyst, that is, a triphenylmethane type epoxy resin; an epoxy resin obtained by epoxidizing a phenol novolac resin obtained by co-condensing the phenol compound, the naphthol compound and the aldehyde compound with an acidic catalyst, that is, a copolymer epoxy resin; diglycidyl ethers of bisphenol a, bisphenol F, and the like, i.e., diphenylmethane-type epoxy resins; diglycidyl ethers of alkyl-substituted or unsubstituted diphenols, i.e. biphenyl-type epoxy resins; diglycidyl ethers of stilbene-based phenol compounds, i.e., stilbene-type epoxy resins; diglycidyl ethers of bisphenol S and the like, that is, epoxy resins containing a sulfur atom; epoxy resins as glycidyl ethers of alcohols such as butanediol, polyethylene glycol, and polypropylene glycol; glycidyl ester type epoxy resins, which are glycidyl esters of polycarboxylic acid compounds such as phthalic acid, isophthalic acid, and tetrahydrophthalic acid; glycidyl amine type epoxy resins, which are epoxy resins obtained by substituting an active hydrogen bonded to a nitrogen atom of aniline, diaminodiphenylmethane, isocyanuric acid, or the like with a glycidyl group; epoxy resin obtained by epoxidizing co-condensation resin of dicyclopentadiene and phenol compound, namely dicyclopentadiene type epoxy resin; alicyclic epoxy resins such as vinylcyclohexene dioxide, 3, 4-epoxycyclohexylmethyl-3, 4-epoxycyclohexanecarboxylate, and 2- (3, 4-epoxy) cyclohexyl-5, 5-spiro (3, 4-epoxy) cyclohexane-m-dioxane, which are epoxy resins obtained by epoxidizing intramolecular ethylenic bonds; glycidyl ether of p-xylene-modified phenolic resin, namely p-xylene-modified epoxy resin; glycidyl ether of m-xylene-modified phenolic resin, i.e., m-xylene-modified epoxy resin; glycidyl ethers of terpene-modified phenolic resins, i.e., terpene-modified epoxy resins; glycidyl ether of dicyclopentadiene-modified phenol resin, i.e., dicyclopentadiene-modified epoxy resin; glycidyl ether of cyclopentadiene-modified phenol resin, namely cyclopentadiene-modified epoxy resin; glycidyl ether of polycyclic aromatic ring modified phenolic resin, namely polycyclic aromatic ring modified epoxy resin; glycidyl ethers of phenolic resins containing naphthalene rings, namely naphthalene-type epoxy resins; a halogenated phenol novolac type epoxy resin; p-phenylene bisphenol type epoxy resin; trimethylolpropane type epoxy resins; linear aliphatic epoxy resins obtained by oxidizing olefinic bonds with peracids such as peracetic acid; an aralkyl type epoxy resin, which is an epoxy resin obtained by epoxidizing an aralkyl type phenol resin such as a phenol aralkyl resin or a naphthol aralkyl resin; and the like. These epoxy resins may be used alone or in combination of two or more.
The epoxy equivalent (molecular weight/number of epoxy groups) of the epoxy resin is not particularly limited. From the viewpoint of balance among various properties such as moldability, reflow resistance and electrical reliability, it is preferably from 100 to 1000g/eq, more preferably from 150 to 500 g/eq.
The epoxy equivalent of the epoxy resin may be determined, for example, by using a resin composition based on JIS K7236: 2009 by the method.
In the case where the epoxy resin is a solid, the softening point or melting point thereof is not particularly limited. From the viewpoint of handling properties in the production of the sealing resin composition, it is preferably from 50 ℃ to 130 ℃.
The melting point or softening point of the epoxy resin is set to be measured by Differential Scanning Calorimetry (DSC) or a melting point based on JIS K7234: 1986 (Ring and ball method).
(curing agent)
The type of the curing agent is not particularly limited, and may be selected according to the desired properties of the sealing resin composition, and the like. As the curing agent in the case where the resin used in combination is an epoxy resin, there can be mentioned: phenol curing agents, amine curing agents, acid anhydride curing agents, polythiol curing agents, polyaminoamide curing agents, isocyanate curing agents, blocked isocyanate curing agents, and the like. From the viewpoint of heat resistance, the curing agent is preferably a curing agent having a phenolic hydroxyl group in the molecule (phenolic curing agent).
Specific examples of the phenol curing agent include: polyhydric phenol compounds such as resorcinol, catechol, bisphenol a, bisphenol F, and substituted or unsubstituted diphenols; phenol novolac resins obtained by condensing or co-condensing a phenolic compound with an aliphatic aldehyde compound such as formaldehyde, acetaldehyde, or propionaldehyde under an acidic catalyst, wherein the phenolic compound is at least one selected from phenol compounds such as phenol, cresol, xylenol, resorcinol, catechol, bisphenol a, bisphenol F, phenylphenol, and aminophenol, and naphthol compounds such as α -naphthol, β -naphthol, and dihydroxynaphthalene; aralkyl phenol resins such as phenol aralkyl resins and naphthol aralkyl resins synthesized from the above phenolic compounds and dimethoxyp-xylene, bis (methoxymethyl) biphenyl and the like; a phenolic resin modified with at least one of para-xylene or meta-xylene; melamine modified phenolic resin; terpene-modified phenolic resin; dicyclopentadiene type phenol resins and dicyclopentadiene type naphthol resins synthesized by copolymerization of the above-mentioned phenolic compounds with dicyclopentadiene; cyclopentadiene-modified phenol resin; polycyclic aromatic ring-modified phenol resins; biphenyl type phenol resin; a triphenylmethane-type phenol resin obtained by condensing or co-condensing the above phenolic compound with an aromatic aldehyde compound such as benzaldehyde or salicylaldehyde under an acidic catalyst; a phenol resin obtained by copolymerizing two or more of these; and the like. These phenol curing agents may be used alone or in combination of two or more.
The functional group equivalent of the curing agent (hydroxyl group equivalent in the case of a phenol curing agent) is not particularly limited. From the viewpoint of balance among various properties such as moldability, reflow resistance and electrical reliability, it is preferably from 70 to 1000g/eq, more preferably from 80 to 500 g/eq.
The functional group equivalent (hydroxyl group equivalent in the case of a phenol curing agent) of the curing agent can be determined, for example, by using a curing agent based on JISK 0070: 1992.
In the case where the curing agent is a solid, the softening point or melting point thereof is not particularly limited. From the viewpoint of moldability and reflow resistance, it is preferably from 40 ℃ to 180 ℃, and from the viewpoint of handling properties in the production of the resin composition for sealing, it is more preferably from 50 ℃ to 130 ℃.
The melting point or softening point of the curing agent is a value measured in the same manner as the melting point or softening point of the epoxy resin.
The equivalent ratio of the curable resin to the curing agent, that is, the ratio of the number of functional groups in the curing agent to the number of functional groups in the curable resin (the number of functional groups in the curing agent/the number of functional groups in the curable resin) is not particularly limited. From the viewpoint of suppressing the amount of unreacted components, the amount is preferably in the range of 0.5 to 2.0, and more preferably in the range of 0.6 to 1.3. From the viewpoint of moldability and reflow resistance, the range of 0.8 to 1.2 is more preferable.
(Filler)
The kind of the filler is not particularly limited. Specifically, there may be mentioned: inorganic materials such as silica (fused silica, crystalline silica, etc.), glass, alumina, calcium carbonate, zirconium silicate, calcium silicate, silicon nitride, aluminum nitride, boron nitride, beryllium oxide, zirconium oxide, zircon, forsterite, steatite, spinel, mullite, titanium dioxide, talc, clay, mica, and the like. A filler material having a flame retardant effect may be used. Examples of the filler having a flame retardant effect include aluminum hydroxide, magnesium hydroxide, a composite metal hydroxide such as a composite hydroxide of magnesium and zinc, zinc borate, and the like.
Among the above fillers, silica is preferable from the viewpoint of reducing the linear expansion coefficient, and alumina is preferable from the viewpoint of high thermal conductivity. The filler may be used alone or in combination of two or more. Examples of the state of the filler include powder, beads obtained by spheroidizing the powder, and fibers.
The content of the filler contained in the sealing resin composition is not particularly limited. From the viewpoint of fluidity and strength, the volume of the entire sealing resin composition is preferably 30 to 90 vol%, more preferably 35 to 80 vol%, and still more preferably 40 to 70 vol%. When the content of the filler is 30 vol% or more of the entire sealing resin composition, the properties of the cured product, such as the thermal expansion coefficient, thermal conductivity, and elastic modulus, tend to be further improved. When the content of the filler is 90 vol% or less of the entire sealing resin composition, the viscosity of the sealing resin composition is inhibited from increasing, the flowability of the sealing resin composition is further improved, and the moldability tends to be further improved.
When the filler is in the form of particles, the average particle diameter thereof is not particularly limited. For example, the volume average particle diameter is preferably 0.2 to 20 μm, more preferably 0.5 to 15 μm. When the volume average particle diameter is 0.2 μm or more, the viscosity of the sealing resin composition tends to be further inhibited from increasing. When the volume average particle diameter is 20 μm or less, the filling property into a narrow gap tends to be further improved. The volume average particle size of the filler material may be determined in the form of a particle size (D50), which particle size (D50) refers to: the particle size at which the volume accumulation from the small diameter side reaches 50% in the volume-based particle size distribution obtained by the laser scattering diffraction particle size distribution measuring apparatus.
(curing accelerators)
The sealing resin composition may contain a curing accelerator. The type of the curing accelerator is not particularly limited, and may be selected according to the type of the curable resin, the desired properties of the sealing resin composition, and the like.
Examples of the curing accelerator include: diazabicycloalkenes such as 1, 5-diazabicyclo [4.3.0] nonene-5 (DBN) and 1, 8-diazabicyclo [5.4.0] undecene-7 (DBU), and cyclic amidine compounds such as 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole and 2-heptadecylimidazole; derivatives of the above cyclic amidine compounds; phenol novolac salts of the above cyclic amidine compounds or derivatives thereof; compounds having intramolecular polarization obtained by adding a quinone compound such as maleic anhydride, 1, 4-benzoquinone, 2, 5-toluquinone, 1, 4-naphthoquinone, 2, 3-dimethylbenzoquinone, 2, 6-dimethylbenzoquinone, 2, 3-dimethoxy-5-methyl-1, 4-benzoquinone, 2, 3-dimethoxy-1, 4-benzoquinone, phenyl-1, 4-benzoquinone, or a compound having a pi bond such as diazophenylmethane to these compounds; cyclic amidine (Japanese: アミジニウ ム) compounds such as tetraphenylborate of DBU, tetraphenylborate of DBN, tetraphenylborate of 2-ethyl-4-methylimidazole and tetraphenylborate of N-methylmorpholine; tertiary amine compounds such as pyridine, triethylamine, triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, and tris (dimethylaminomethyl) phenol; derivatives of the above tertiary amine compounds; ammonium salt compounds such as tetra-n-butylammonium acetate, tetra-n-butylammonium phosphate, tetraethylammonium acetate, tetra-n-hexylammonium benzoate, tetrapropylammonium hydroxide and the like; tertiary phosphines such as triphenylphosphine, diphenyl (p-tolyl) phosphine, tri (alkylphenyl) phosphine, tri (alkoxyphenyl) phosphine, tri (alkyl-alkoxyphenyl) phosphine, tri (dialkylphenyl) phosphine, tri (trialkylphenyl) phosphine, tri (tetraalkylphenyl) phosphine, tri (dialkoxyphenyl) phosphine, tri (trialkoxyphenyl) phosphine, tri (tetraalkoxyphenyl) phosphine, trialkylphosphine, dialkylarylphosphine, and alkyldiarylphosphine; phosphine compounds such as complexes of the above tertiary phosphines with organic boron compounds; a compound having intramolecular polarization obtained by adding the tertiary phosphine or the phosphine compound to a compound having a pi bond such as maleic anhydride, 1, 4-benzoquinone, 2, 5-toluquinone, 1, 4-naphthoquinone, 2, 3-dimethylbenzoquinone, 2, 6-dimethylbenzoquinone, 2, 3-dimethoxy-5-methyl-1, 4-benzoquinone, 2, 3-dimethoxy-1, 4-benzoquinone, phenyl-1, 4-benzoquinone, or the like, or diazophenylmethane; a compound having intramolecular polarization obtained by reacting the tertiary phosphine or the phosphine compound with a halogenated phenol compound such as 4-bromophenol, 3-bromophenol, 2-bromophenol, 4-chlorophenol, 3-chlorophenol, 2-chlorophenol, 4-iodophenol, 3-iodophenol, 2-iodophenol, 4-bromo-2-methylphenol, 4-bromo-3-methylphenol, 4-bromo-2, 6-dimethylphenol, 4-bromo-3, 5-dimethylphenol, 4-bromo-2, 6-di-tert-butylphenol, 4-chloro-1-naphthol, 1-bromo-2-naphthol, 6-bromo-2-naphthol, or 4-bromo-4' -hydroxybiphenyl, followed by a dehydrohalogenation step; tetra-substituted phosphonium such as tetraphenylphosphonium, tetra-p-tolylborate, etc. which are free from phenyl groups bonded to boron atoms; salts of tetraphenylphosphonium with phenol compounds, and the like.
When the sealing resin composition contains a curing accelerator, the amount thereof is preferably 0.1 to 30 parts by mass, and more preferably 1 to 15 parts by mass, per 100 parts by mass of the curable resin component.
[ various additives ]
The sealing resin composition may contain various additives such as a coupling agent, a release agent, and a colorant, which are exemplified below, in addition to the above components. The sealing resin composition may contain, in addition to the additives exemplified below, various additives known in the art as needed.
(coupling agent)
The sealing resin composition may contain a coupling agent for improving the adhesion between the resin component and the filler. Examples of the coupling agent include known coupling agents such as silane compounds such as epoxy silane, mercapto silane, amino silane, alkyl silane, ureido silane, and vinyl silane, titanium compounds, aluminum chelate compounds, and aluminum/zirconium compounds. Among them, a silane compound is preferable from the viewpoint of handling property. One kind of coupling agent may be used alone, or two or more kinds may be used in combination.
When the sealing resin composition contains a coupling agent, the amount of the coupling agent is preferably 0.05 to 5 parts by mass, and more preferably 0.1 to 2.5 parts by mass, per 100 parts by mass of the filler.
(mold releasing agent)
The sealing resin composition may contain a release agent from the viewpoint of obtaining good releasability from a mold during molding. The release agent is not particularly limited, and a conventionally known release agent can be used. Specifically, there may be mentioned: and higher fatty acids such as carnauba wax, montanic acid, stearic acid, etc., ester waxes such as higher fatty acid metal salts, montanic acid esters, etc., and polyolefin waxes such as oxidized polyethylene, non-oxidized polyethylene, etc. The release agent may be used alone or in combination of two or more.
When the sealing resin composition contains a release agent, the amount thereof is preferably 0.01 to 10 parts by mass, and more preferably 0.1 to 5 parts by mass, based on 100 parts by mass of the total of the curable resin component and the elastomer component.
(coloring agent)
The sealing resin composition may further contain a colorant. Examples of the colorant include known colorants such as carbon black, organic dyes, organic pigments, titanium oxide, red lead, and red iron oxide. The content of the colorant may be appropriately selected depending on the purpose and the like. The colorant may be used alone or in combination of two or more.
When the sealing resin composition contains a colorant, the amount thereof is preferably 0.01 to 10 parts by mass, and more preferably 0.1 to 5 parts by mass, based on 100 parts by mass of the total of the curable resin component and the elastomer component.
< sealing resin composition (second embodiment) >
The sealing resin composition of the present embodiment includes a curable resin component, an elastomer component, and a filler, and the content of the elastomer component is 1.0 to 8.0 mass% of the entire (sealing resin composition).
The studies carried out by the inventors have led to the knowledge that: the sealing resin composition having the above-described structure is excellent in strength while suppressing warpage of a support after sealing. The reason why the warpage of the support is suppressed is not necessarily clear, but is presumed as follows: by containing a specific amount of the elastomer component, the thermal expansion coefficient of the cured product decreases, the difference between the thermal expansion coefficient of the cured product and the thermal expansion coefficient of the support becomes small, and the decrease in the elastic modulus leads to a decrease in warpage. The reason why the elastic modulus is decreased is considered to be, for example, as follows: the elastomer component, which is phase-separated in the resin matrix formed of the curable resin component, exists in island shapes.
Further, when the sealing resin composition contains an elastomer component, the proportion of the curable resin component is relatively decreased. The results are considered to be: a resin composition for sealing which is suppressed in increase of thermal expansion coefficient and is excellent in effects of reducing elasticity and suppressing warpage.
From the viewpoint of effectively suppressing the warpage of the support, the content of the elastomer component is preferably 1.5% by mass or more, more preferably 1.7% by mass or more, and still more preferably 2.0% by mass or more of the entire sealing resin composition.
The content of the elastomer component is preferably 7.0% by mass or less, more preferably 6.0% by mass or less, and still more preferably 5.0% by mass or less of the entire sealing resin composition, from the viewpoints of handling properties and strength after sealing.
Preferred examples of the elastomer component include: the elastomer described as the elastomer component contained in the sealing resin composition according to the first embodiment.
< sealing resin composition (embodiment 3) >)
The sealing resin composition of the present embodiment includes a curable resin component, a compound having a siloxane bond (siloxane compound), and a filler, and the proportion of the siloxane compound in the total of the curable resin component and the siloxane compound is 20% by mass or more.
The studies carried out by the inventors have led to the knowledge that: a resin composition for sealing, which contains a siloxane compound in an amount of 20 mass% or more of the total of a curable resin component and the siloxane compound, is suppressed in warpage of a support after sealing. The reason is not necessarily clear, but is presumed as follows: by containing the siloxane compound, the thermal expansion coefficient of the cured product is decreased, the difference between the thermal expansion coefficient of the cured product and the thermal expansion coefficient of the support is reduced, and the decrease in the elastic modulus leads to a decrease in warpage. The reason why the elastic modulus is decreased is considered to be, for example, as follows: the siloxane compound that phase separates in the resin matrix formed of the curable resin component exists in island shapes.
Further, when the sealing resin composition contains a siloxane compound, the proportion of the curable resin component is relatively decreased. The results are considered to be: a resin composition for sealing which is suppressed in increase of thermal expansion coefficient and is excellent in effects of reducing elasticity and suppressing warpage.
The proportion of the siloxane compound in the total of the curable resin component and the siloxane compound is preferably 30 mass% or more, and more preferably 40 mass% or more, from the viewpoint of suppressing warpage of the support.
The upper limit of the proportion of the siloxane compound in the total of the curable resin component and the siloxane compound is not particularly limited. From the viewpoint of handling properties, it is preferably 70% by mass or less, more preferably 60% by mass or less, and still more preferably 50% by mass or less.
The siloxane compound contained in the sealing resin composition is not particularly limited as long as it is a compound having a siloxane bond (Si — O — Si), and may be one kind or two or more kinds. In the case where the siloxane compound also corresponds to a curable resin component (for example, the siloxane compound has a functional group such as an epoxy group which undergoes a curing reaction), the compound is classified as a siloxane compound.
Preferred examples of the silicone compound include: the silicone compound described as the silicone compound contained in the sealing resin composition according to the first embodiment.
< sealing resin composition (embodiment 4) >)
The sealing resin composition of the present embodiment includes a curable resin component, a siloxane compound, and a filler, and is a sealing resin composition for wafer level packaging. The resin composition for sealing of the present embodiment has an excellent effect of suppressing warpage of a support after sealing.
The siloxane compound contained in the sealing resin composition is not particularly limited as long as it is a compound having a siloxane bond (Si — O — Si), and may be one kind or two or more kinds. In the case where the siloxane compound also corresponds to a curable resin component (for example, the siloxane compound has a functional group such as an epoxy group which undergoes a curing reaction), the compound is classified as a siloxane compound.
Preferred examples of the silicone compound include: the silicone compound described as the silicone compound contained in the sealing resin composition according to the first embodiment.
The detailed and preferred embodiments of the sealing resin composition described in each of embodiments 1 to 4 are the same in all embodiments.
(use of the sealing resin composition)
The sealing resin composition of the above embodiment can be used for various mounting techniques. The sealing resin composition of the present embodiment has an excellent effect of suppressing warpage of the support, and therefore is also suitable for use in a mounting technique for sealing a large area (for example, performing a sealing step before singulation of packages). As such mounting techniques, there are exemplified: FO-WLP (Fan-Out Wafer Level Package), FI-WLP (Fan In Wafer Level Package), and other Wafer Level packages.
As a method for sealing a semiconductor chip using the sealing resin composition, compression molding, transfer molding, injection molding, and the like can be mentioned, and any of these can be used.
The material of the support when sealing is performed using the sealing resin composition is not particularly limited. Examples thereof include semiconductors such as silicon, glass, and ceramics. The shape of the support is not particularly limited, and may be a disk (wafer) or other shapes. The area of the support is not particularly limited, and the sealing resin composition of the present embodiment may have a large area because it has an excellent effect of suppressing the warpage of the support. For example, the wafer may have a diameter of 12 inches or more.
The sealing thickness when sealing is performed using the sealing resin composition is not particularly limited, and may be selected according to the size of a semiconductor chip to be sealed, and the like. The sealing resin composition of the present embodiment is excellent in the effect of suppressing warpage of the support, and therefore can be suitably used even when the sealing thickness is large (for example, 200 μm to 1000 μm).
< Reconfiguration wafer and semiconductor package >
The reconfiguration wafer of the present embodiment includes a support, two or more semiconductor chips arranged on the support, and a cured product of the sealing resin composition sealing the semiconductor chips.
The semiconductor package of the present embodiment includes a support, a semiconductor chip disposed on the support, and a cured product of the sealing resin composition sealing the semiconductor chip. The semiconductor package can be obtained by, for example, singulating the reconfigured wafer.
In the reconfigured wafer of the present embodiment, warpage of the support is suppressed. Therefore, the support can be suitably used for manufacturing a semiconductor package even if the support has a large area. For example, the support may be a wafer having a diameter of 12 inches or more.
The thickness of the cured product of the encapsulating resin composition for encapsulating the semiconductor chip is not particularly limited, and may be selected according to the size of the semiconductor chip to be encapsulated. The sealing resin composition of the present embodiment is excellent in the effect of suppressing warpage of the support, and therefore can be suitably used even when the sealing thickness is large (for example, 200 μm to 1000 μm).
The type of the support and the semiconductor chip used for reconfiguring the wafer and the semiconductor package are not particularly limited, and may be selected from those generally used.
< method for manufacturing semiconductor Package >
The method for manufacturing a semiconductor package according to the present embodiment includes the steps of: disposing two or more semiconductor chips on a support; disposing the sealing resin composition on the support on which the semiconductor chip is disposed; curing the sealing resin composition disposed on the support to seal the semiconductor chip; and a step of singulating the support.
In the method for manufacturing a semiconductor package according to the present embodiment, the warpage of the support after the semiconductor chip is sealed by curing the sealing resin composition is suppressed. Therefore, positional deviation and the like are less likely to occur in the post-sealing step, and the product yield is high.
The method for disposing the sealing resin composition on the support on which the semiconductor chip is disposed is not particularly limited. For example, when the sealing resin composition is in a powder form, the sealing resin composition may be spread on the support.
The method of sealing the semiconductor chip by curing the sealing resin composition disposed on the support is not particularly limited. For example, it is preferably performed by compression molding. The compression molding can be carried out, for example, by using a compression molding machine under the conditions of a predetermined pressure (for example, 2MPa to 10MPa), temperature (for example, 120 ℃ to 150 ℃) and time (for example, 200 seconds to 600 seconds).
Examples
The embodiments are specifically described below by way of examples, but the scope of the embodiments is not limited to these examples.
< example 1 >
(preparation of sealing resin composition)
The components shown in table 1 were mixed in the amounts (parts by mass) shown in table 1 to prepare a resin composition for sealing.
In the production, a kneader, a planetary mixer, a 3-roll mill, a twin-screw extruder, or the like is preferably used. In the present invention, the materials are mixed, kneaded by a twin-screw extruder in which the internal temperature of the apparatus is adjusted to 70 to 100 ℃, cooled, and then pulverized to obtain a resin composition for sealing. The details of each component are as follows.
Epoxy resin 1 … Biphenylaryl epoxy resin, trade name "NC-3000", Nippon Kabushiki Kaisha
Epoxy resin 2 … polyfunctional epoxy resin, trade name "EPPN-501 HY", Nippon Kagaku Kogyo Co., Ltd
Curing agent 1 … Biphenylaryl phenol-formaldehyde resin, trade name "MEHC-7851 SS", Minghe Kabushiki Kaisha
Curing agent 2 … polyfunctional phenol resin, trade name "HE 910-10", Airwater corporation
Curing agent 3 … phenol novolac resin, trade name "HP 850N", Hitachi chemical Co., Ltd
Cure Accelerator 1 … reaction product of tetrabutylphosphonium and cyclohexanedicarboxylic acid
Elastomer component 1 (siloxane Compound) … caprolactone-modified dimethyl Silicone at both ends, trade name "DBL-C32", Gelest
Elastomer component 1 is R in the formula (3)1Is methyl, R2Is methyl, R3Is pentylidene, R4N is 63 to 78, m is not disclosed1And m2Are each 7 to 10.
Elastomer component 2 (siloxane compound) … dimethyl silicone with modified side chain epoxy group, trade name "KF-1001", shin-Etsu chemical Co., Ltd
Elastomer component 3 … indene-styrene-coumarone copolymer, trade name "NH-100S", Nissan chemical Co., Ltd
Coupling agent 1 … N-phenyl-3-aminopropyltrimethoxysilane, trade name "KBM-573", shin-Etsu chemical Co., Ltd
Coupling agent 2 … 3-glycidoxypropyltrimethoxysilane, trade name "KBM-403", shin-Etsu chemical Co., Ltd
Coupling agent 3 … 3-methacryloxypropyltrimethoxysilane, trade name "KBM-503", shin-Etsu chemical Co., Ltd
Coupling agent 4 … Diphenyldimethoxysilane, trade name "KBM-202 SS", shin-Etsu chemical industries Co., Ltd
Colorant 1 … carbon Black, trade name "MA 600", Mitsubishi chemical corporation
Release agent 1 … Hester wax, trade name "HW-E", Clariant Chemicals Corp
Filler 1 … spherical fused silica having an average particle diameter of 11 μm, trade name "ST 7010-2", Micron Kabushiki Kaisha
Filler 2 … spherical fused silica having an average particle diameter of 0.6 μm, trade name "SO-25R", manufactured by Admatechs
(preparation of cured product)
Using the prepared sealing resin composition, a cured product was produced as follows. In the molding, a mold including an upper mold, a middle mold, and a lower mold is used. As the middle mold, a mold having a size of 10mm × 60mm × 5mm or 3mm × 3mm × 15mm was used, and a sealing resin composition was placed in an amount corresponding to the volume of the cutout portion of the middle mold placed on the lower mold, and the mold was held by the upper mold, and molded under vacuum at 130 ℃ for 10 minutes and 5MPa by using a manual hydraulic vacuum heating and pressurizing machine. The obtained molded article was cured at 175 ℃ for 6 hours to obtain a cured product.
(evaluation of thermal expansion coefficient)
The thermal expansion coefficient of a cured product having a size of 3 mm. times.3 mm. times.10 mm was measured by using "TMA 2940" manufactured by TA instruments. The measurement was carried out at a temperature rising rate of 5 ℃/min at 0 ℃ to 260 ℃. The CTE1 was the coefficient of thermal expansion (ppm/. degree. C.) of 10 to 30 ℃ and the CTE2 was the coefficient of thermal expansion (ppm/. degree. C.) of 200 to 220 ℃. The results are shown in Table 1.
(evaluation of modulus of elasticity)
The elastic modulus of a cured product having a size of 10 mm. times.50 mm. times.3 mm was measured using "RSAIII" manufactured by TA instruments. The measurement was carried out at a temperature rise rate of 10 ℃/min from 30 ℃ to 300 ℃. The elastic modulus (GPa) measured at 40 ℃ and 260 ℃ is shown in Table 1 as the elastic modulus at 40 ℃ and the elastic modulus at 260 ℃.
(evaluation of amount of warpage)
A layer of the sealing resin composition was formed on a silicon wafer having a thickness of 750 μm and a diameter of 300mm to have a thickness of 250 μm or 500 μm, and cured by heating at 130 ℃ for 10 minutes to prepare a sample. The prepared cured product was cured at 175 ℃ for 6 hours to obtain a sealing material sample with a silicon wafer. The amount of warpage (. mu.m) of the sample at 30 ℃ was evaluated using a 3D heated surface shape measuring apparatus "AXP" manufactured by Akrometrix. The maximum value of the warpage amount is shown in table 1.
[ Table 1]
As shown in table 1, the warpage amount of the substrate was suppressed in the samples formed using the sealing resin composition of examples in which the elastic modulus at 260 ℃ when the curable resin component, the elastomer component and the filler were contained and the cured product was formed, or in which the siloxane compound was contained as the elastomer component and the proportion of the siloxane compound in the total of the curable resin component and the siloxane compound was 20 mass% or more, compared with the samples formed using the sealing resin composition of comparative examples in which the elastomer component was not contained or the elastic modulus at 260 ℃ when the elastomer component was contained and the cured product was formed, exceeded 1.0 GPa.
< example 2 >
The components shown in table 2 were mixed in the amounts (g) shown in table 2, and a sealing resin composition was prepared in the same manner as in example 1. Details of the components used for the preparation of the sealing resin composition are as follows.
Epoxy resin 1 … polyfunctional epoxy resin, trade name "EPPN-501 HY", Nippon Kagaku Kogyo Co., Ltd
Curing agent 1 … polyfunctional phenol resin, trade name "HE 910-10", manufactured by Airwater corporation
Cure Accelerator 1 … 2-phenyl-4-methyl-5-hydroxymethyl imidazole, Shikoku Kabushiki Kaisha
Elastomer component 1 … caprolactone-modified dimethyl Silicone at both ends, trade name "DBL-C32", Gelest
Elastomer component 1 is R in the formula (3)1Is methyl, R2Is methyl, R3Is pentylidene, R4N is 63 to 78, m is not disclosed1And m2Are each 7 to 10.
Elastomer component 2 … Dimethicone having side chains modified with epoxy groups and polyether groups, trade name "Y-19268", Momentive Performance Materials Ltd
Elastomer component 3 … indene-styrene-coumarone copolymer, trade name "NH-100S", Nissan chemical Co., Ltd
Coupling agent 1 … 3-glycidoxypropyltrimethoxysilane, trade name "KBM-403", shin-Etsu chemical Co., Ltd
Coupling agent 2 … 3-methacryloxypropyltrimethoxysilane, trade name "KBM-503", shin-Etsu chemical Co., Ltd
Coupling agent 3 … Diphenyldimethoxysilane, trade name "KBM-202 SS", shin-Etsu chemical industries Co., Ltd
Colorant 1 … carbon Black, trade name "MA 600", Mitsubishi chemical corporation
Release agent 1 … Hester wax, trade name "HW-E", Clariant Chemicals Corp
Filler 1 … spherical fused silica having an average particle diameter of 11 μm, trade name "ST 7010-2", Micron Kabushiki Kaisha
Filler 2 … spherical fused silica having an average particle diameter of 0.6 μm, trade name "SO-25R", manufactured by Admatechs
The prepared sealing resin composition was evaluated for elastic modulus, coefficient of thermal expansion, and amount of warpage in the same manner as in example 1. Further, the sealing surface of the sealing material sample with a silicon wafer produced in the same manner as in example 1 was visually observed, and the one with visible streaks, unevenness and whitening on the surface was evaluated as defective, and the one with no unevenness and uniform surface was evaluated as good. The results are shown in Table 2.
[ Table 2]
As shown in Table 2, the samples formed using the sealing resin compositions of examples containing an elastomer component in a content ratio of 1.0 to 8.0% by mass based on the entire sealing resin composition exhibited a suppressed amount of warpage of the substrates as compared with the samples formed using the sealing resin compositions of comparative examples 2-1 to 2-3 containing no elastomer component or an elastomer component in a content ratio of less than 1.0% by mass. In addition, the sealing resin compositions of the examples also showed good results of appearance evaluation.
The disclosures of japanese patent applications nos. 2017-.
All documents, patent applications, and technical standards described in the present specification are incorporated by reference to the same extent as if each document, patent application, and technical standard was specifically and individually described, and are further incorporated into the present specification.
Claims (17)
1. A sealing resin composition which comprises a curable resin component, an elastomer component and a filler and which, when formed into a cured product, has an elastic modulus at 260 ℃ of 1.0GPa or less.
2. A resin composition for sealing, which comprises a curable resin component, an elastomer component and a filler, wherein the content of the elastomer component is 1.0 to 8.0% by mass of the whole composition.
3. The sealing resin composition according to claim 1 or claim 2, wherein the elastomer component contains a compound having a siloxane bond.
4. A resin composition for sealing, which comprises a curable resin component, a compound having a siloxane bond, and a filler, wherein the proportion of the compound having a siloxane bond in the total of the curable resin component and the compound having a siloxane bond is 20% by mass or more.
5. A sealing resin composition comprising a curable resin component, a compound having a siloxane bond, and a filler, the sealing resin composition being used for wafer level packaging.
6. The sealing resin composition according to any one of claims 3 to 5, wherein the compound having a siloxane bond comprises a compound having a structural unit represented by the following formula (1),
in the formula (1), R1And R2Each independently selected from the group consisting of an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a 1-valent organic group having an epoxy group, a 1-valent organic group having a carboxyl group, and a polyalkylene ether group having 3 to 500 carbon atoms.
7. The sealing resin composition according to claim 6, wherein the compound having the structural unit represented by formula (1) further has a structural unit represented by the following formula (2),
in the formula (2), R3Is an alkylene group having 1 to 10 carbon atoms.
8. The sealing resin composition according to claim 6 or claim 7, wherein the compound having the structural unit represented by formula (1) is a compound having a structure represented by formula (3),
in the formula (3), n is an integer of 1 to 200, and m1And m2Each independently is an integer of 1 to 200, R1And R2Independently selected from alkyl group with 1-10 carbon atoms, aryl group with 6-10 carbon atoms, alkoxy group with 1-10 carbon atoms, 1-valent organic group with epoxy group, 1-valent organic group with carboxyl group and polyalkylene ether group with 3-500 carbon atoms, R3Each independently an alkylene group having 1 to 10 carbon atoms, R4Each independently is a C1-10 2-valent hydrocarbon group.
9. The sealing resin composition according to any one of claims 1 to 8, wherein the curable resin component comprises an epoxy resin and a curing agent.
10. The sealing resin composition according to claim 9, wherein the curing agent comprises a phenol curing agent.
11. The sealing resin composition according to any one of claims 1 to 4, which is used for wafer level packaging.
12. The sealing resin composition according to any one of claims 1 to 11, which is used for FO-WLP.
13. The sealing resin composition according to any one of claims 1 to 12, which is used for sealing by compression molding.
14. The sealing resin composition according to any one of claims 1 to 13, which is in a powder form.
15. A reconfigured wafer comprising a support, two or more semiconductor chips arranged on the support, and a cured product of the sealing resin composition according to any one of claims 1 to 14 for sealing the semiconductor chips.
16. A semiconductor package comprising a support, a semiconductor chip disposed on the support, and a cured product of the sealing resin composition according to any one of claims 1 to 14, which seals the semiconductor chip.
17. A method for manufacturing a semiconductor package, comprising the steps of: disposing two or more semiconductor chips on a support; disposing the sealing resin composition according to any one of claims 1 to 14 on the support on which the semiconductor chip is disposed; curing the sealing resin composition disposed on the support to seal the semiconductor chip; and a step of singulating the semiconductor chip.
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-127852 | 2017-06-29 | ||
| JP2017127852 | 2017-06-29 | ||
| JP2017127855 | 2017-06-29 | ||
| JP2017127856 | 2017-06-29 | ||
| JP2017-127855 | 2017-06-29 | ||
| JP2017-127856 | 2017-06-29 | ||
| PCT/JP2018/024935 WO2019004458A1 (en) | 2017-06-29 | 2018-06-29 | Resin composition for encapsulation, rearranged wafer, semiconductor package, and method for manufacturing semiconductor package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110719935A true CN110719935A (en) | 2020-01-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880037788.XA Pending CN110719935A (en) | 2017-06-29 | 2018-06-29 | Sealing resin composition, reconfigured wafer, semiconductor package, and method for producing semiconductor package |
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| JP (2) | JPWO2019004458A1 (en) |
| CN (1) | CN110719935A (en) |
| TW (2) | TW202317669A (en) |
| WO (1) | WO2019004458A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020136600A (en) * | 2019-02-25 | 2020-08-31 | 東レ株式会社 | Self-adhesive film for semiconductor or electronic component production, and production method of semiconductor or electronic component |
| JP7452028B2 (en) * | 2020-01-23 | 2024-03-19 | 株式会社レゾナック | Encapsulating resin composition, electronic component device, and method for manufacturing electronic component device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5037898A (en) * | 1990-02-27 | 1991-08-06 | Shell Oil Company | Polysiloxane-polylactone block copolymer modified thermostat compositions |
| WO2016136741A1 (en) * | 2015-02-26 | 2016-09-01 | 日立化成株式会社 | Sealing film and electronic component device using same |
| JP2016166373A (en) * | 2010-03-31 | 2016-09-15 | 日立化成株式会社 | Epoxy resin molding material for sealing, and electronic component device |
| JP2016169367A (en) * | 2015-03-10 | 2016-09-23 | 住友ベークライト株式会社 | Sealing resin composition, method for producing electronic component, and electronic component |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2862777B2 (en) * | 1993-11-05 | 1999-03-03 | 住友ベークライト株式会社 | Epoxy resin composition |
| JPH07242799A (en) * | 1994-09-19 | 1995-09-19 | Toray Ind Inc | Epoxy resin composition for semiconductor sealing |
| JP2003292739A (en) * | 2002-04-08 | 2003-10-15 | Kyocera Chemical Corp | Resin composition for sealing and device for sealing electronic part |
| JP2008163116A (en) * | 2006-12-27 | 2008-07-17 | Wacker Asahikasei Silicone Co Ltd | Resin composition for sealing semiconductor, and semiconductor device |
| JP6315170B2 (en) * | 2013-09-30 | 2018-04-25 | ナガセケムテックス株式会社 | Epoxy resin composition for semiconductor encapsulation, semiconductor packaging structure, and method for producing the same |
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2018
- 2018-06-29 WO PCT/JP2018/024935 patent/WO2019004458A1/en active Application Filing
- 2018-06-29 TW TW111150208A patent/TW202317669A/en unknown
- 2018-06-29 JP JP2019527080A patent/JPWO2019004458A1/en active Pending
- 2018-06-29 TW TW107122469A patent/TWI790246B/en active
- 2018-06-29 CN CN201880037788.XA patent/CN110719935A/en active Pending
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2023
- 2023-02-08 JP JP2023017662A patent/JP2023054037A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5037898A (en) * | 1990-02-27 | 1991-08-06 | Shell Oil Company | Polysiloxane-polylactone block copolymer modified thermostat compositions |
| JP2016166373A (en) * | 2010-03-31 | 2016-09-15 | 日立化成株式会社 | Epoxy resin molding material for sealing, and electronic component device |
| WO2016136741A1 (en) * | 2015-02-26 | 2016-09-01 | 日立化成株式会社 | Sealing film and electronic component device using same |
| JP2016169367A (en) * | 2015-03-10 | 2016-09-23 | 住友ベークライト株式会社 | Sealing resin composition, method for producing electronic component, and electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI790246B (en) | 2023-01-21 |
| JPWO2019004458A1 (en) | 2020-04-30 |
| JP2023054037A (en) | 2023-04-13 |
| TW201905103A (en) | 2019-02-01 |
| WO2019004458A1 (en) | 2019-01-03 |
| TW202317669A (en) | 2023-05-01 |
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