CN110718508A - 一种电子元件封装结构、电器设备及电子元件的封装方法 - Google Patents
一种电子元件封装结构、电器设备及电子元件的封装方法 Download PDFInfo
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Abstract
本发明提供了一种电子元件封装结构、电器设备及电子元件的封装方法,涉及电子元件技术领域,解决了现有技术中存在的封装结构吸湿率大导致的电子元件可靠性降低的技术问题。电子元件封装结构包括电子元件、载体和水汽隔离层,所述电子元件安装在所述载体上,所述水汽隔离层覆盖于所述电子元件的外侧以及所述电子元件的周围载体上;所述水汽隔离层至少能够防止水汽沿所述电子元件的上方和周围入侵所述电子元件。通过在电子元件之外以及电子元件周围的载体上设置水汽隔离层来防止水汽入侵电子元件,还能缓冲电子元件的内部应力,提高电子元件的可靠性,延长电子元件的使用寿命。
Description
技术领域
本发明涉及电子元件技术领域,尤其是涉及一种电子元件封装结构、电器设备及电子元件的封装方法。
背景技术
封装,就是把集成电路装配为芯片最终产品的过程,简单地说,就是把集成电路裸片放在一块起到承载作用的基板上,把管脚引出来,然后固定包装成为一个整体。
电子元件封装结构是影响电子元件可靠性的主要因素之一。封装结构的防水性能直接影响至电子元件的可靠性,防水性差将会导致湿气渗透到电子元件的表面甚至内部,电子元件极易产生失效损坏,导致产品不良,甚至无法正常使用。
发明内容
本发明的目的在于提供一种电子元件封装结构、电器设备及电子元件的封装方法,以解决现有技术中存在的封装结构吸湿率大导致的电子元件可靠性降低的技术问题。本发明提供的诸多技术方案中的优选技术方案所能产生的诸多技术效果详见下文阐述。
为实现上述目的,本发明提供了以下技术方案:
本发明提供的一种电子元件封装结构,包括电子元件、载体和水汽隔离层,所述电子元件安装在所述载体上,所述水汽隔离层覆盖于所述电子元件的外侧且延伸至所述电子元件周围的所述载体上。
可选地,所述载体上开设有凹槽,所述电子元件设置于所述凹槽内,所述水汽隔离层覆盖于所述电子元件的外侧且设置于所述凹槽内。
可选地,所述水汽隔离层还设置于所述电子元件的下方,且介于所述电子元件与所述载体之间,能够防止水汽通过所述载体入侵所述电子元件
可选地,所述水汽隔离层的吸湿率小于等于0.03%。
可选地,所述水汽隔离层采用弹性材料制造。
可选地,所述水汽隔离层包括防水胶。
可选地,所述电子元件通过导体与引脚或其他电子元件相连接,且所述水汽隔离层也覆盖于导体与所述电子元件的连接处以及所述连接处的周围。
可选地,所述水汽隔离层点注或灌注于所述电子元件的表面。
可选地,所述电子元件为功率器件
可选地,所述载体为引线框架。
可选地,电子元件封装结构还包括保护层,所述水汽隔离层介于所述电子元件与所述保护层之间。
可选地,所述保护层塑封、陶封和/或金封于所述水汽隔离层的外侧。
本发明提供的一种电器设备,包括上述的各种电子元件封装结构。
可选地,所述电器设备为空调器。
本发明提供的一种电子元件的封装方法,包括以下步骤:
步骤A:将所述电子元件安装在所述载体上;
步骤B:所述水汽隔离层覆盖于所述电子元件的外侧并延伸至电子元件的周围载体上,所述水汽隔离层至少能够防止水汽沿电子元件的上方和周围入侵所述电子元件。
本发明提供的一种电子元件封装结构、电器设备及电子元件的封装方法,通过在电子元件的外侧设置水汽隔离层来防止水汽入侵电子元件,水汽隔离层延伸至电子元件周围的载体上,进一步提高防水性能,提高电子元件的可靠性,延长使用寿命。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1是现有技术IGBT芯片封装结构的正视结构示意图;
图2是本发明一种实施方式中IGBT芯片封装结构的正视结构示意图;
图3是本发明一种实施方式中IGBT芯片封装结构的俯视结构示意图;
图4-图8为本发明一种IGBT芯片封装过程中各步骤的结构示意图。
图1中:1'、IGBT芯片;2'、引线框架;3'、环氧树脂;4'、铝线;5'、结合材;
图2-图8中:1、IGBT芯片;2、引线框架;21、凹槽;3、环氧树脂;4、铝线;5、结合材;6、防水胶。
具体实施方式
为使本发明的目的、技术方案和优点更加清楚,下面将对本发明的技术方案进行详细的描述。显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动的前提下所得到的所有其它实施方式,都属于本发明所保护的范围。
随着半导体器件技术的发展,半导体器件一直在往高性能、高可靠性发展。如图1所示,传统功率器件采用引线框架2'为载体,在引线框架2'上焊接IGBT芯片1'、用铝线4'将芯片与引线框架2'的管脚相连、然后注塑环氧树脂3';由于环氧树脂3'在常温下的吸湿率为0.2%左右,长期存储可能导致湿气渗透到芯片表面出现可靠性失效;同时环氧树脂3'与芯片直接粘结且环氧树脂3'的热膨胀系数是IGBT芯片1'的五倍,这容易导致IGBT芯片1'在高低温循环工作时应力不匹配,出现芯片与树脂结合面分层,严重的可导致芯片裂纹损伤、焊线脱落。
为了解决现有封装技术存在的上述问题,本发明提供了一种电子元件封装结构,包括电子元件、载体和水汽隔离层,所述电子元件安装在所述载体上,所述水汽隔离层覆盖于所述电子元件的外侧且延伸至所述电子元件周围的所述载体上。
通过在电子元件的外侧设置水汽隔离层来防止水汽入侵电子元件,水汽隔离层延伸至电子元件周围的载体上,进一步提高防水性能,提高电子元件的可靠性,延长电子元件的使用寿命
作为可选地实施方式,载体上开设有凹槽21,电子元件设置于凹槽21内,水汽隔离层覆盖于电子元件的外侧且设置于所述凹槽21内。。
载体上开设凹槽21,电子元件焊接在凹槽21处,防止水汽隔离层在灌注时溢出,保证水汽隔离层的防水作用。
作为可选地实施方式,水汽隔离层的吸湿率为0.03%。
作为可选地实施方式,作为保护层的环氧树脂3塑封于水汽隔离层的外侧。
环氧树脂3在常温下的吸湿率为0.2%左右,选择吸湿率远小于环氧树脂3的水汽隔离层,能够有效防止水汽入侵电子元件。
作为可选地实施方式,电子元件通过导体与引脚相连接,水汽隔离层也覆盖于导体与电子元件的连接部之外。
水汽隔离层也覆盖于导体与电子元件的连接处以及连接处的周围,提高连接部的强度,延长器件使用寿命。
作为可选地实施方式,水汽隔离层采用弹性材料制造,且水汽隔离层材料的热膨胀系数大于保护层材料的热膨胀系数。
水汽隔离层采用弹性材料制造,在高低温循环时弹性水汽隔离层起到应力缓冲作用,提高器件使用寿命,提高器件可靠性。
作为可选地实施方式,水汽隔离层为防水胶6固化而成。
用常见的防水胶6作为水汽隔离层,在保证水汽隔离效果的同时降低成本。
作为可选地实施方式,水汽隔离层点注或灌注于电子元件的表面。
水汽隔离层点注或灌注于电子元件的表面,保证水汽隔离层的厚度
作为可选地实施方式,凹槽21的深度在200μm~2000μm。
凹槽21的深度在200μm~2000μm,能够保证水汽隔离层覆盖于所述电子元件之外特别是电子元件周围的载体上,达到水汽隔离的目的。
作为可选地实施方式,电子元件为功率器件,如IGBT芯片1。
作为可选地实施方式,载体为引线框架2。
作为可选地实施方式,电子元件封装结构还包括保护层,所述水汽隔离层介于所述电子元件与所述保护层之间,保护层的材料为环氧树脂3。
采用防水胶6和环氧树脂3双层封装结构,保证机械连接、电连接性能的同时,提高电子元件的防水汽入侵功能,电子元件可靠性大幅度提高。
本发明提供了一种空调器,包括上述的各种电子元件封装结构。
本发明提供了一种电子元件封装结构的构造方法,包括以下步骤:
步骤A:将所述电子元件安装在所述载体上;
步骤B:水汽隔离层覆盖于电子元件的外侧并延伸至电子元件周围的载体上,水汽隔离层至少能够防止水汽沿电子元件的上方和周围入侵电子元件。
如图2和图3所示,一种高可靠性电子元件封装结构包括IGBT芯片1、环氧树脂3、引线框架2、防水胶6、结合材5和焊线,其中,环氧树脂3在熔融状态下将IGBT芯片1及内部结构包裹起来,提供物理和电气保护,防止外部环境的冲击,铜引线框架2背面露出胶体;引线框架2为IGBT芯片1的载体及电性管脚的引出端;防水胶6覆盖在IGBT芯片1及焊盘上方,为IGBT芯片1抵御水汽入侵及提供应力缓冲;结合材5实现IGBT芯片1背面电极与引线框架2物理和电性连接;焊线为铝线4,铝线4通过超声波将IGBT芯片1与引线框架2相连,实现电性连接。
如图4至图8所示,本发明一种电子元件的封装方法包括:第一步,准备引线框架2;第二步,通点涂或喷的方式在相应IGBT芯片1位置配置锡膏;第三部,放置IGBT芯片1然后再回流焊接;第四步,铝线4焊接,将IGBT芯片1与基板实现电性连接;第五步,在IGBT芯片1上方点或灌注防水胶6;第六步,环氧树脂3注塑成型。
防水胶6防止水汽入侵IGBT芯片1,而且能够缓冲IGBT芯片1的内部应力,提高IGBT芯片1的可靠性,延长其使用寿命。
以上所述,仅为本发明的具体实施方式,但本发明的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本发明揭露的技术范围内,可轻易想到变化或替换,都应涵盖在本发明的保护范围之内。因此,本发明的保护范围应以权利要求的保护范围为准。
Claims (15)
1.一种电子元件封装结构,其特征在于,包括电子元件、载体和水汽隔离层,所述电子元件安装在所述载体上,所述水汽隔离层覆盖于所述电子元件的外侧且延伸至所述电子元件周围的所述载体上。
2.根据权利要求1所述的电子元件封装结构,其特征在于,所述载体上开设有凹槽(21),所述电子元件设置于所述凹槽(21)内,所述水汽隔离层覆盖于所述电子元件的外侧且设置于所述凹槽(21)内。
3.根据权利要求1所述的电子元件封装结构,其特征在于,所述水汽隔离层还设置于所述电子元件的下方,且介于所述电子元件与所述载体之间,能够防止水汽通过所述载体入侵所述电子元件。
4.根据权利要求1所述的电子元件封装结构,其特征在于,所述水汽隔离层的吸湿率小于等于0.03%。
5.根据权利要求1所述的电子元件封装结构,其特征在于,所述水汽隔离层采用弹性材料制造。
6.根据权利要求1所述的电子元件封装结构,其特征在于,所述水汽隔离层包括防水胶(6)。
7.根据权利要求1所述的电子元件封装结构,其特征在于,所述电子元件通过导体与引脚或其他电子元件相连接,且所述水汽隔离层也覆盖于导体与所述电子元件的连接处以及所述连接处的周围。
8.根据权利要求1所述的电子元件封装结构,其特征在于,所述水汽隔离层点注或灌注于所述电子元件的表面。
9.根据权利要求1所述的电子元件封装结构,其特征在于,所述电子元件为功率器件。
10.根据权利要求1所述的电子元件封装结构,其特征在于,所述载体为引线框架(2)。
11.根据权利要求1-10任一所述的电子元件封装结构,其特征在于,还包括保护层,所述水汽隔离层介于所述电子元件与所述保护层之间。
12.根据权利要求11所述的电子元件封装结构,其特征在于,所述保护层塑封、陶封和/或金封于所述水汽隔离层的外侧。
13.一种电器设备,其特征在于,包括权利要求1-12任一所述的电子元件封装结构。
14.根据权利要求13所述的电器设备,其特征在于,所述电器设备为空调器。
15.一种采用权利要求1-12任一所述的电子元件封装结构的封装方法,其特征在于,包括以下步骤:
步骤A:将所述电子元件安装在所述载体上;
步骤B:所述水汽隔离层覆盖于所述电子元件的外侧并延伸至所述电子元件周围的载体上,所述水汽隔离层至少能够防止水汽沿电子元件的上方和周围入侵所述电子元件。
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