CN110708920A - Data center micromodule structure - Google Patents
Data center micromodule structure Download PDFInfo
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- CN110708920A CN110708920A CN201810750548.6A CN201810750548A CN110708920A CN 110708920 A CN110708920 A CN 110708920A CN 201810750548 A CN201810750548 A CN 201810750548A CN 110708920 A CN110708920 A CN 110708920A
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- 238000001816 cooling Methods 0.000 claims abstract description 39
- 230000003068 static effect Effects 0.000 claims description 35
- 238000012423 maintenance Methods 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 238000004891 communication Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 13
- 238000005265 energy consumption Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 description 7
- 238000005057 refrigeration Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000013473 artificial intelligence Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 230000002706 hydrostatic effect Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20745—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/2079—Liquid cooling without phase change within rooms for removing heat from cabinets
Abstract
The invention provides a data center micromodule structure, which comprises: at least one cabinet group, an internal plenum box, a plurality of tunnel-type rear door structures, a top plenum box, and a plurality of cooling back panels. The invention can effectively solve the heat dissipation problem of a plurality of high-heat-density server cabinets in a common machine room, and cools hot air exhausted by the cabinets by introducing the cooling back plate, thereby saving the energy consumption of a fan at the tail end of an air conditioner, improving the heat dissipation efficiency of the cabinets and saving the space of the machine room.
Description
Technical Field
The invention relates to the technical field of data centers, in particular to a data center micromodule structure.
Background
At present, the development of the data center industry faces unprecedented complex environments due to the rise of new generation information technologies such as artificial intelligence, big data and cloud computing, and the technical field of the data center is promoted to change continuously. The great enrichment of the variety and the number of the network application brings mass data, and more and higher requirements are put forward for an internet infrastructure, namely a data center. With the rise of the AI concept and the falling of more and more AI applications, the demand of the industry for high-speed computation is increasing, the deployment scale of the GPU accelerated computing server in the data center will continue to increase, the heat energy generated by the GPU accelerated computing server is several times of that of the traditional CPU, and the heat dissipation technology of the data center must be changed to adapt to the development of future AI.
However, a large number of original low-heat-density server cabinets are still deployed in the current data center, and conventional machine room air conditioners are used for heat dissipation. The heat discharged by the newly deployed high-heat-density server cabinet is far greater than that of the original low-heat-density server cabinet, and the heat cannot be continuously dissipated by low-cold-quantity heat dissipation equipment such as a machine room air conditioner. In addition, the high heat discharged by the newly deployed high-heat-density server cabinet can also damage the original airflow circulation loop of the data center, so that the overall heat dissipation effect of the data center is influenced.
Therefore, in order to meet the application requirements of a data center integrating high-heat-density server cabinets, a new data center micro-module structure is needed to solve the above problems.
Disclosure of Invention
In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a novel micro-module structure of a data center, which is used to solve the problem that the existing data center cannot solve the heat dissipation problem of a high-heat-density server cabinet.
To achieve the above and other related objects, the present invention provides a data center micro-module structure, comprising:
the air conditioner comprises at least one cabinet group, wherein one cabinet group comprises two rows of cabinets arranged at intervals, an air outlet surface and an air inlet surface which are communicated with the interior of the cabinet are arranged on the cabinet, and the air outlet surface and the air inlet surface are respectively arranged on two opposite sides of the cabinet; the air inlet surfaces of the two cabinets in the cabinet group are adjacent;
the internal static pressure box is arranged between the two rows of cabinets and is connected with the air inlet surface of the cabinet;
the channel type rear door structures are respectively arranged at the outer sides of the air outlet surfaces of the cabinets; the interior of the channel type rear door structure is hollow, a first air outlet communicated with the interior of the channel type rear door structure is arranged at the upper part of one side surface of the channel type rear door structure, and a first air inlet communicated with the interior of the channel type rear door structure is arranged at the lower part of the same side surface;
the top static pressure box is positioned at the upper part of each cabinet and comprises a second air outlet and a second air inlet, the interior of the top static pressure box is communicated with the interior of the interior static pressure box through the second air outlet, and the interior of the top static pressure box is communicated with the first air outlet of the channel type rear door structure through the second air inlet;
and the cooling back plates are respectively arranged on the air outlet surfaces of the cabinets.
In a preferred embodiment of the present invention, the data center micro-module structure further comprises a return air temperature sensor located inside the top plenum box on a side thereof adjacent to the inner plenum box.
As a preferable solution of the present invention, the data center micro-module structure further includes an outlet air temperature sensor, and the outlet air temperature sensor is located at one side of the top static pressure box near the channel-type rear door structure.
As a preferable aspect of the present invention, the height of the top static pressure box is not less than twice the depth of the channel type rear door structure, and the width of the top static pressure box is equal to the sum of the widths of the single row channel type rear door structures in the arrangement direction.
As a preferable aspect of the present invention, the top static pressure tank is rectangular in uniform cross section in the depth direction thereof, and the top static pressure tank is rectangular in uniform cross section in the width direction thereof.
As a preferable aspect of the present invention, the top plenum box is rectangular in a variable cross section in a depth direction thereof, and the top plenum box is a uniform cross-sectional pattern in a width direction thereof.
As a preferable scheme of the present invention, the cooling back plate is a water-cooling back plate or an air-cooling back plate.
As a preferable scheme of the invention, a freezing water coil is arranged inside the water-cooling back plate.
As a preferable scheme of the present invention, the cooling back plate is detachably disposed on the air outlet surface.
As a preferable aspect of the present invention, the width of the tunnel-type rear door structure is equal to the width of the cabinet.
As a preferable scheme of the present invention, the channel-type back door structure is detachably connected to the cabinet.
As a preferable scheme of the present invention, a rubber cushion is disposed between the channel-type rear door structure and the cabinet.
As a preferable scheme of the invention, the top of the channel type rear door structure is an arc-shaped guide surface.
As a preferable aspect of the present invention, the width of the cooling back plate is equal to the width of the cabinet air outlet surface, and the height of the cooling back plate is equal to the height of the cabinet air outlet surface.
In a preferred embodiment of the present invention, the internal plenum box is a rectangular parallelepiped.
As a preferable scheme of the invention, the return air channel is provided with a maintenance door communicated with the inside of the return air channel.
As a preferred aspect of the present invention, the depth of the internal plenum box is not less than twice the depth of the cabinet; the width of the internal static pressure box is equal to the sum of the widths occupied by the single row of the cabinets; the height of the internal plenum box is no less than the sum of the height of the cabinet and the height of the top plenum box.
As described above, the present invention provides a data center micro-module structure, which has the following beneficial effects:
according to the invention, by introducing the data center micro-module structure, the heat dissipation problem of multiple high-heat-density server cabinets in a common machine room can be effectively solved, and the cooling back plate is used for cooling hot air exhausted by the cabinets, so that the energy consumption of a fan at the tail end of an air conditioner is saved, the heat dissipation efficiency of the cabinets is improved, and the space of the machine room is saved.
Drawings
Fig. 1 is a top view of a group of cabinets according to a first embodiment of the present invention.
Fig. 2 is a top view of a data center micro-module structure formed by a plurality of cabinet groups according to an embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a data center micro-module structure according to an embodiment of the present invention.
Fig. 4 is a schematic cross-sectional view illustrating a data center micromodule structure according to an embodiment of the present invention.
FIG. 5 is a schematic view of a variable cross-section top plenum provided in a first embodiment of the present invention.
Fig. 6 is a schematic structural diagram of a data center micro-module structure according to a second embodiment of the present invention.
Fig. 7 is a schematic structural diagram of a data center micro-module structure provided in the third embodiment of the present invention.
Fig. 8 is a schematic cross-sectional view of a data center micromodule structure provided in the third embodiment of the present invention.
Description of the element reference numerals
11 machine cabinet
12 air outlet surface
13 air intake surface
14-channel type rear door structure
15 internal plenum box
16 top static pressure box
17 cooled back plate
18 maintenance door
Width of D1 cooling back plate
Width of D2 tunnel type rear door structure
Width of D3 top plenum box
Depth of W1 tunnel type rear door structure
Depth of hydrostatic box inside W2
Depth of W3 cabinet
Height of H1 top plenum box
Height of H2 Cooling Back plate
Height of H3 internal plenum box
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
Please refer to fig. 1 to 8. It should be noted that the drawings provided in the present embodiment are only schematic and illustrate the basic idea of the present invention, and although the drawings only show the components related to the present invention and are not drawn according to the number, shape and size of the components in actual implementation, the form, quantity and proportion of the components in actual implementation may be changed arbitrarily, and the layout of the components may be more complicated.
Example one
As shown in fig. 1 to 5, the present invention provides a data center micro-module structure, including:
the air conditioner comprises at least one cabinet group 10, wherein one cabinet group 10 comprises two rows of cabinets 11 which are arranged at intervals, an air inlet surface 12 and an air outlet surface 13 which are communicated with the interiors of the cabinets 11 are arranged on the cabinets 11, and the air inlet surface 12 and the air outlet surface 13 are respectively arranged on two opposite sides of the cabinets 11; the air inlet surfaces 12 of the two cabinets 11 in the cabinet group 10 are adjacent;
the internal static pressure box 15 is arranged between the two rows of the cabinets 11 and is connected with the air inlet surface 12 of the cabinet 11;
the channel type rear door structures 14 are respectively arranged on the outer sides of the air outlet surfaces 13 of the cabinets 11; the channel type rear door structure 14 is hollow, a first air outlet communicated with the interior of the channel type rear door structure is arranged at the upper part of one side surface of the channel type rear door structure, and a first air inlet communicated with the interior of the cabinet 11 is arranged at the lower part of the same side surface;
a top plenum box 16 located at an upper portion of each of the cabinets 11, the top plenum box 16 including a second air outlet and a second air inlet, the interior of the top plenum box 16 being in communication with the interior of the interior plenum box 15 via the second air outlet, and the interior of the top plenum box 16 being in communication with the first air outlet of the tunnel-type rear door structure 14 via the second air inlet;
and the cooling back plates 17 are respectively arranged on the air outlet surfaces 12 of the cabinets 11.
As shown in fig. 1, the top view of a set of cabinet group 10 is shown, one set of the cabinet group 10 is formed by a pair of cabinets 11 arranged at intervals, an air inlet surface 12 and an air outlet surface 13 communicated with the internal space of the cabinets 11 are arranged on the cabinets 11, wherein the air inlet surface 12 is located on one adjacent surface between the pair of cabinets 11, and the air outlet surface 13 is located on the other side opposite to the air inlet surface 12. The proximity of the air inlet surfaces 12 of the two cabinets 11 in the cabinet group 10 means that the air inlet surfaces 12 of the two cabinets 11 are located on the left and right opposite sides of the internal static pressure box 15 between the two cabinets 11. Each cabinet 11 is provided with a corresponding channel-type rear door structure 14, and the channel-type rear door structure 14 is located on the outer side of the air outlet surface 13 of the cabinet 11. Each cabinet 11 is further provided with a corresponding cooling back plate 17, which is located on the air outlet surface 13 of the cabinet 11. An internal plenum box 15 is provided between the air intake surfaces 12 of the two cabinets 11.
As shown in fig. 2, it is a top view of a data center micro-module structure composed of several sets of cabinet groups 10, and five sets of cabinet groups 10 are arranged along the direction a shown by the arrow. Each cabinet 11 is provided with a corresponding channel-type rear door structure 14, and the channel-type rear door structure 14 is located on the outer side of the air outlet surface 13 of the cabinet 11. Each cabinet 11 in each row is provided with a corresponding cooling back plate 17, which is located on the air outlet surface 13 of each cabinet 11. The gap between the air inlet surfaces 12 of the two rows of cabinets 11 forms an internal plenum box 15. The width D1 of the cooling back panel 17 is equal to the width of the cabinet outlet face 13. The width D2 of the tunnel-type rear door structure 14 is equal to the width of the cabinet 11. The width of the internal plenum box 15 is equal to the sum of the widths occupied by the cabinets 11 in a single row.
Fig. 3 is a schematic structural diagram of the data center micro-module structure of the present embodiment, and it should be noted that, in order to make details of the drawing easier to show, the cabinet 11, the internal plenum box 15, and the tunnel-type back door structure 14 are all partially transparent. As shown in fig. 3, the top plenum box 16 is disposed above the cabinet 11, communicates with the tunnel-type rear door structure 14 and the interior plenum box 15, and is isolated from the outside and does not exchange heat with the outside air. Preferably, the channel type rear door structure 14 is detachably connected with the cabinet 11 so as to be detached during maintenance, and a rubber pad is arranged at the connection position so as to ensure the tightness of the system. The internal plenum box 15 is of rectangular parallelepiped configuration. A maintenance door 18 is arranged at one side of the inner static pressure box 15, which is not connected with the cabinet 11, so that maintenance personnel can go in and out of the inner static pressure box 15 for maintenance, and when the maintenance door 18 is closed, the inner static pressure box 15 is completely sealed, so that the air in the micro-module is not subjected to heat exchange with the external air. In this example, the shape of the tunnel-type rear door structure 14 may be rectangular, that is, the top of the tunnel-type rear door structure 14 is a planar guide surface, and the top of the tunnel-type rear door structure 14 is vertically connected with the side wall of the tunnel-type rear door structure 14.
Fig. 4 is a cross-sectional view of the data center micro-module structure provided in this embodiment, in which arrows indicate the air flow direction. When the hot air in the cabinet 11 is exhausted through the air outlet surface 13, the hot air is cooled to be cold air through the cooling back plate 17, and enters the channel-type rear door structure 14; the cool air enters the inner plenum 15 through the channeled back door structure 14 and the top plenum 16, enters the cabinet 11 through the air intake surface 12, and removes heat from the cabinet 11. Preferably, the height H2 of the cooling back panel 17 is equal to the height of the cabinet air outlet 13. The depth W2 of the internal plenum box 15 is no less than twice the depth W3 of the cabinet 11. The height H3 of the internal plenum box 15 is no less than the sum of the heights of the cabinet 11 and the top plenum box 16 (H1+ H2).
Illustratively, the data center micromodule structure further includes a return air temperature sensor located within the top plenum box 16 on a side adjacent to the interior plenum box 15. In order to monitor the return air temperature of the air entering the interior of the interior plenum box 15 from the top plenum box 16, the present invention provides a return air temperature sensor in the top plenum box 16 on the side adjacent to the interior plenum box 15 to accurately monitor the return air temperature of the air passing into the interior plenum box 15. When the return air temperature sensor detects that the return air temperature deviates from a set standard value, an alarm can be given in time, and the phenomenon that the temperature in the cabinet 11 is too high to cause the shutdown of the server is avoided.
By way of example, the data center micro-module structure further includes an outlet air temperature sensor located on a side of the top plenum box 16 adjacent to the tunnel-type rear door structure 14. Through the monitoring of the outlet air temperature entering the top static pressure box 16, the cooling effect of the cooling back plate 17 can be accurately grasped, the refrigeration efficiency of the cooling back plate 17 is adjusted in real time, and the temperature in the whole system is maintained within a set range.
As an example, the height H1 of the top plenum box 16 is not less than twice the depth W1 of the rear gate structure 14, and the width D3 of the top plenum box 16 is equal to the sum of the widths of the single row of rear gate structures 14 in the row direction. As shown in fig. 4, the height H1 of the top plenum 16 is at least not less than twice the depth W1 of the channel tailgate structure 14, which ensures that the top plenum 16 has a certain airflow area that helps to increase the static pressure effect of the top plenum 16. As shown in fig. 3, the width D3 of the top plenum box 16 is equal to the sum of the widths of the single row of the channel back door structures 14 in the row direction, which ensures that the top plenum box 16 is able to smoothly communicate the channel back door structures 14 with the interior plenum boxes 15.
As an example, the top plenum box 16 is rectangular with a uniform cross section in its depth direction, and the top plenum box 16 is rectangular with a uniform cross section in its width direction. I.e. the top plenum box 16 is a box having a rectangular parallelepiped configuration.
As an example, the top plenum box 16 is rectangular with a varying cross-section in its depth direction, and the top plenum box 16 is of a uniform cross-sectional profile in its width direction. Referring to fig. 5, as a preferred embodiment of the present invention, the top plenum 16 may be rectangular with gradually increasing or decreasing cross-sections in the depth direction a1 and uniform cross-sectional shape in the width direction a 2. The variation in the cross-section of the top plenum box 16 in the depth direction a1 may help optimize the internal airflow of the data center micro-module structure, further increasing the heat dissipation efficiency of the system.
As an example, the cooling back plate 17 is a water cooling back plate or an air cooling back plate. As a preferable scheme of the invention, the water-cooling back plate is used as a means for cooling hot air, so that the heat generated by the server with high heat density can be eliminated to the maximum extent, and the invention has the advantages of high efficiency and low energy consumption. Of course, other cooling means such as an air-cooled back plate may be used in other embodiments.
As an example, the water-cooling back plate is internally provided with a chilled water coil. The refrigeration water coil pipe cools air passing through the surface of the refrigeration water coil pipe through heat exchange of low-temperature circulating water flow in the refrigeration water coil pipe, and is a high-efficiency and low-energy-consumption refrigeration means.
As an example, the cooling back plate 17 is detachably disposed on the air intake surface 12. The cooling back plate 17 can be disassembled as required for maintenance by maintenance personnel.
Example two
As shown in fig. 6, the present invention further provides a data center micro-module structure, the specific structure of the data center micro-module structure in this embodiment is substantially the same as the specific structure of the data center micro-module structure in the first embodiment, and the difference between the two structures is as follows: in the data center micro-module structure described in the first embodiment, the top of the tunnel-type rear door structure 14 is a planar guide surface, while in the present embodiment, the top of the tunnel-type rear door structure 14 is an arc-shaped guide surface. The arrangement of the arc-shaped guide surface fully considers the hydrodynamics inside the data center micro-module structure, so that the air flow inside the channel type rear door structure 14 is smooth, and the heat dissipation efficiency of the data center micro-module structure is improved.
The other structures of the data center micro-module structure described in this embodiment are the same as those of the data center micro-module structure described in the first embodiment, and refer to the first embodiment specifically, and will not be described here again.
EXAMPLE III
Referring to fig. 7 to fig. 8, the present invention further provides a data center micro module structure. As shown in fig. 7, the specific structure of the data center micro-module structure described in this embodiment is substantially the same as the specific structure of the data center micro-module structure described in the second embodiment, and the difference between them is that: the data center micromodule configuration described in this embodiment further increases the height H3 of the internal plenum box 15. This makes it possible to increase the volume of the internal plenum box 16 not only when the depth W2 of the internal plenum box 16 is constant; when the volume of the internal static pressure box 16 is not changed, the occupied area of the internal static pressure box 16 can be reduced as much as possible, a certain static pressure effect is ensured, and meanwhile, the occupied area of the whole data center micromodule structure is smaller, and the occupied space is saved. Fig. 8 is a schematic cross-sectional view of the data center micro-module structure in this embodiment. Wherein, the height H3 of the inner static pressure box 15 is increased compared with the second embodiment, and a middle convex structure is introduced, thereby improving the static pressure effect of the inner static pressure box 15; the arc-shaped guide surface is arranged at the top of the channel type rear door structure 14, so that the circulation efficiency of internal air flow is increased, and the cooling effect is further improved. Arrows in the figure indicate the airflow direction in the data center micro-module structure, and when the hot air in the cabinet 11 is exhausted through the air outlet surface 13, the hot air is cooled to be cold air through the cooling back plate 17 and enters the channel type rear door structure 14; the cold air enters the inner static pressure box 15 through the channel type rear door structure 14 and the top static pressure box 16, enters the cabinet 11 through the air inlet surface 12 and takes away heat of the cabinet 11, and the circulation of the cold air in the channel type rear door structure 14 is smoother due to the arc-shaped guide surface.
In summary, the present invention provides a data center micro module structure, which includes: at least one cabinet group, an internal plenum box, a plurality of tunnel-type rear door structures, a top plenum box, and a plurality of cooling back panels. The invention can effectively solve the heat dissipation problem of a plurality of high-heat-density server cabinets in a common machine room, and cools hot air exhausted by the cabinets by introducing the cooling back plate, thereby saving the energy consumption of a fan at the tail end of an air conditioner, improving the heat dissipation efficiency of the cabinets and saving the space of the machine room.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (17)
1. A data center micro-module structure, comprising:
the air conditioner comprises at least one cabinet group, wherein one cabinet group comprises two rows of cabinets arranged at intervals, an air outlet surface and an air inlet surface which are communicated with the interior of the cabinet are arranged on the cabinet, and the air outlet surface and the air inlet surface are respectively arranged on two opposite sides of the cabinet; the air inlet surfaces of the two cabinets in the cabinet group are adjacent;
the internal static pressure box is arranged between the two rows of cabinets and is connected with the air inlet surface of the cabinet;
the channel type rear door structures are respectively arranged at the outer sides of the air outlet surfaces of the cabinets; the interior of the channel type rear door structure is hollow, a first air outlet communicated with the interior of the channel type rear door structure is arranged at the upper part of one side surface of the channel type rear door structure, and a first air inlet communicated with the interior of the channel type rear door structure is arranged at the lower part of the same side surface;
the top static pressure box is positioned at the upper part of each cabinet and comprises a second air outlet and a second air inlet, the interior of the top static pressure box is communicated with the interior of the interior static pressure box through the second air outlet, and the interior of the top static pressure box is communicated with the first air outlet of the channel type rear door structure through the second air inlet;
and the cooling back plates are respectively arranged on the air outlet surfaces of the cabinets.
2. The data center micromodule structure of claim 1, further comprising a return air temperature sensor positioned within the top plenum box on a side adjacent to the interior plenum box.
3. The data center micro-module structure of claim 1, further comprising an outlet air temperature sensor located within the top plenum box on a side proximate to the channeled back door structure.
4. The data center micromodule structure of claim 1, wherein the height of the top plenum box is not less than twice the depth of the channel back door structure, and the width of the top plenum box is equal to the sum of the widths of the single row of channel back door structures in the direction of their arrangement.
5. The data center micromodule structure of claim 1, wherein the top plenum box is rectangular with equal cross-section in the depth direction and the top plenum box is rectangular with equal cross-section in the width direction.
6. The data center micromodule structure of claim 1, wherein the top plenum is rectangular in cross-section in the depth direction and the top plenum is of uniform cross-sectional profile in the width direction.
7. The data center micro-module structure of claim 1, wherein the cooling backplane is a water-cooled backplane or an air-cooled backplane.
8. The data center micro-module structure of claim 7, wherein the water-cooled back plate has chilled water coils therein.
9. The data center micro-module structure of claim 1, wherein the cooling backplane is removably disposed on the air outlet face.
10. The data center micro-module structure of claim 1, wherein the width of the channeled back door structure is equal to the width of the cabinet.
11. The data center micro-module structure of claim 1, wherein the channeled back door structure is removably coupled to the cabinet.
12. The data center micro-module structure of claim 1, wherein a rubber gasket is disposed between the channeled back door structure and the cabinet.
13. The data center micro-module structure of claim 1, wherein the top of the channeled back door structure is an arcuate guide surface.
14. The data center micro-module structure of claim 1, wherein the cooling backplane has a width equal to a width of the cabinet exit and a height equal to a height of the cabinet exit.
15. The data center micromodule structure of claim 1, wherein the internal plenum box is a rectangular parallelepiped structure.
16. The data center micro-module structure of claim 1, wherein the return air channel is provided with a maintenance door in communication with the interior thereof.
17. The data center micro-module structure of claim 1, wherein the depth of the internal plenum box is no less than twice the depth of the cabinet; the width of the internal static pressure box is equal to the sum of the occupied widths of the cabinets in the single row, and the height of the internal static pressure box is not less than the sum of the heights of the cabinets and the top static pressure box.
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| JP2014191811A (en) * | 2013-03-28 | 2014-10-06 | Sanki Eng Co Ltd | Air conditioning system |
| CN106961819A (en) * | 2016-01-11 | 2017-07-18 | 上海宽带技术及应用工程研究中心 | A kind of overhead type data center refrigeration system |
| CN107454809A (en) * | 2017-09-11 | 2017-12-08 | 郑州云海信息技术有限公司 | A kind of efficiently micromodule data center |
| CN208609319U (en) * | 2018-07-10 | 2019-03-15 | 上海宽带技术及应用工程研究中心 | Data center's micromodule structure |
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