CN110708923A - Data center micro-module structure of rear cooling back plate - Google Patents
Data center micro-module structure of rear cooling back plate Download PDFInfo
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- CN110708923A CN110708923A CN201810751739.4A CN201810751739A CN110708923A CN 110708923 A CN110708923 A CN 110708923A CN 201810751739 A CN201810751739 A CN 201810751739A CN 110708923 A CN110708923 A CN 110708923A
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- 238000001816 cooling Methods 0.000 title claims abstract description 98
- 230000003068 static effect Effects 0.000 claims description 33
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- 238000004891 communication Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 13
- 238000005265 energy consumption Methods 0.000 abstract description 5
- 238000012423 maintenance Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 7
- 238000005057 refrigeration Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000013473 artificial intelligence Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 230000002706 hydrostatic effect Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20836—Thermal management, e.g. server temperature control
Abstract
The invention provides a data center micromodule structure of a rear cooling back plate, which comprises: at least one cabinet group, an internal plenum box, a plurality of tunnel front door structures, a top plenum box, and a plurality of cooling backplates. The invention can effectively solve the heat dissipation problem of a plurality of high-heat-density server cabinets in a common machine room, and cools hot air exhausted by the cabinets by introducing the cooling back plate, thereby saving the energy consumption of a fan at the tail end of an air conditioner, improving the heat dissipation efficiency of the cabinets and saving the space of the machine room.
Description
Technical Field
The invention relates to the technical field of data centers, in particular to a data center micro-module structure of a rear cooling back plate.
Background
At present, the development of the data center industry faces unprecedented complex environments due to the rise of new generation information technologies such as artificial intelligence, big data and cloud computing, and the technical field of the data center is promoted to change continuously. The great enrichment of the variety and the number of the network application brings mass data, and more and higher requirements are put forward for an internet infrastructure, namely a data center. With the rise of the AI concept and the falling of more and more AI applications, the demand of the industry for high-speed computation is increasing, the deployment scale of the GPU accelerated computing server in the data center will continue to increase, the heat energy generated by the GPU accelerated computing server is several times of that of the traditional CPU, and the heat dissipation technology of the data center must be changed to adapt to the development of future AI.
However, a large number of original low-heat-density server cabinets are still deployed in the current data center, and conventional machine room air conditioners are used for heat dissipation. The heat discharged by the newly deployed high-heat-density server cabinet is far greater than that of the original low-heat-density server cabinet, and the heat cannot be continuously dissipated by low-cold-quantity heat dissipation equipment such as a machine room air conditioner. In addition, the high heat discharged by the newly deployed high-heat-density server cabinet can also damage the original airflow circulation loop of the data center, so that the overall heat dissipation effect of the data center is influenced.
Therefore, in order to meet the application requirements of a data center integrated with a high-heat-density server rack, a new data center micro-module structure of a rear cooling backplane needs to be provided to solve the above problems.
Disclosure of Invention
In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a new micro-module structure of a data center with a cooling backplane, which is used to solve the problem that the existing data center cannot solve the heat dissipation problem of a high-heat-density server cabinet.
To achieve the above and other related objects, the present invention provides a micro-module structure of a data center with a rear cooling backplane, comprising:
the air conditioner comprises at least one cabinet group, wherein one cabinet group comprises two rows of cabinets arranged at intervals, an air outlet surface and an air inlet surface which are communicated with the interior of the cabinet are arranged on the cabinet, and the air outlet surface and the air inlet surface are respectively arranged on two opposite sides of the cabinet; the air outlet surfaces of the two cabinets in the cabinet group are adjacent;
the internal static pressure box is arranged between the two rows of the cabinets and is connected with the air outlet surface of the cabinet;
the channel type front door structures are respectively arranged on the outer sides of the air inlet surfaces of the cabinets; the interior of the channel type front door structure is hollow, a first air inlet communicated with the interior of the channel type front door structure is formed in the upper portion of one side of the channel type front door structure, and a first air outlet communicated with the interior of the channel type front door structure is formed in the lower portion of the same side;
the top static pressure box is positioned at the upper part of each cabinet and comprises a second air inlet and a second air outlet, the interior of the top static pressure box is communicated with the interior of the interior static pressure box through the second air inlet, and the interior of the top static pressure box is communicated with the first air inlet of the channel type front door structure through the second air outlet;
and the cooling back plates are respectively arranged on the air outlet surfaces of the cabinets.
As a preferred aspect of the present invention, the data center micro-module structure of the rear cooling back panel further comprises a return air temperature sensor, and the return air temperature sensor is located at one side of the top plenum box close to the channel front door structure.
As a preferable aspect of the present invention, the data center micro-module structure of the rear cooling back plate further includes an outlet air temperature sensor, and the outlet air temperature sensor is located at a side of the top plenum box close to the inner plenum box.
As a preferable aspect of the present invention, the height of the top static pressure box is not less than twice the depth of the tunnel front door structure, and the width of the top static pressure box is equal to the sum of the widths of the single row of the tunnel front door structures in the arrangement direction.
As a preferable aspect of the present invention, the cross-sectional shape of the top plenum box in the depth direction thereof is a rectangular shape of uniform cross-section, and the cross-sectional shape of the top plenum box in the width direction thereof is a rectangular shape of uniform cross-section.
As a preferable aspect of the present invention, the sectional shape of the top plenum box in the depth direction thereof is a rectangular shape with a variable section, and the sectional shape of the top plenum box in the width direction thereof is a uniform sectional pattern.
As a preferable scheme of the present invention, the cooling back plate is a water-cooling back plate or an air-cooling back plate.
As a preferable scheme of the invention, a freezing water coil is arranged inside the water-cooling back plate.
As a preferable scheme of the present invention, the cooling back plate is detachably disposed on the air outlet surface.
As a preferable aspect of the present invention, the width of the tunnel-type front door structure is equal to the width of the cabinet.
As a preferable scheme of the present invention, the tunnel-type front door structure is detachably connected to the cabinet.
As a preferable scheme of the present invention, a rubber pad is disposed between the tunnel-type front door structure and the cabinet.
In a preferred embodiment of the present invention, the top of the tunnel front door structure is an arc-shaped guide surface.
As a preferable aspect of the present invention, the width of the cooling back plate is equal to the width of the cabinet air outlet surface, and the height of the cooling back plate is equal to the height of the cabinet air outlet surface.
In a preferred embodiment of the present invention, the internal plenum box is a rectangular parallelepiped.
As a preferable scheme of the invention, the inner static pressure box is provided with a maintenance door communicated with the inner part of the inner static pressure box.
As a preferred aspect of the present invention, the depth of the internal plenum box is not less than twice the depth of the cabinet; the width of the internal static pressure box is equal to the sum of the widths occupied by the single row of the cabinets; the height of the internal plenum box is no less than the sum of the height of the cabinet and the height of the top plenum box.
As described above, the present invention provides a data center micro-module structure of a rear cooling backplane, which has the following beneficial effects:
according to the invention, the data center micro-module structure of the rear cooling back plate is introduced, so that the heat dissipation problem of multiple high-heat-density server cabinets in a common machine room can be effectively solved, the cooling back plate is used for cooling hot air exhausted by the cabinets, the energy consumption of a fan at the tail end of an air conditioner is saved, the heat dissipation efficiency of the cabinets is improved, and the space of the machine room is saved.
Drawings
Fig. 1 is a top view of a group of cabinets according to a first embodiment of the present invention.
Fig. 2 is a top view of a data center micromodule consisting of a plurality of rack assemblies according to an embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a data center micro-module structure of a rear cooling backplane according to an embodiment of the present invention.
Fig. 4 is a schematic cross-sectional view illustrating a data center micro-module structure of a rear cooling backplane according to an embodiment of the present invention.
FIG. 5 is a schematic view of a variable cross-section top plenum provided in a first embodiment of the present invention.
Fig. 6 is a schematic structural diagram illustrating a data center micro-module structure of a rear cooling backplane according to a second embodiment of the present invention.
Fig. 7 is a schematic structural diagram of a data center micro-module structure of a rear cooling backplane according to a third embodiment of the present invention.
Fig. 8 is a schematic cross-sectional view illustrating a data center micro-module structure of a rear cooling backplane according to a third embodiment of the present invention.
Description of the element reference numerals
11 machine cabinet
12 air outlet surface
13 air intake surface
14-channel front door structure
15 internal plenum box
16 top static pressure box
17 cooled back plate
18 maintenance door
Width of D1 cooling back plate
Width of D2 tunnel front door structure
Width of D3 top plenum box
Depth of W1 tunnel front door structure
Depth of hydrostatic box inside W2
Depth of W3 cabinet
Height of H1 top plenum box
Height of H2 Cooling Back plate
Height of H3 internal plenum box
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
Please refer to fig. 1 to 8. It should be noted that the drawings provided in the present embodiment are only schematic and illustrate the basic idea of the present invention, and although the drawings only show the components related to the present invention and are not drawn according to the number, shape and size of the components in actual implementation, the form, quantity and proportion of the components in actual implementation may be changed arbitrarily, and the layout of the components may be more complicated.
Example one
As shown in fig. 1 to 5, the present invention provides a data center micro-module structure of a rear cooling backplane, comprising:
the air conditioner comprises at least one cabinet group 10, wherein one cabinet group 10 comprises two rows of cabinets 11 which are arranged at intervals, an air outlet surface 12 and an air inlet surface 13 which are communicated with the interiors of the cabinets 11 are arranged on the cabinets 11, and the air outlet surface 12 and the air inlet surface 13 are respectively arranged on two opposite sides of the cabinets 11; the air outlet surfaces 12 of the two cabinets 11 in the cabinet group 10 are adjacent;
the internal static pressure box 15 is arranged between the two rows of the cabinets 11 and is connected with the air outlet surface 12 of the cabinet 11;
a plurality of channel-type front door structures 14 respectively arranged at the outer sides of the air inlet surfaces 13 of the cabinets 11; the interior of the channel-type front door structure 14 is hollow, the upper part of one side of the channel-type front door structure is provided with a first air inlet communicated with the interior of the channel-type front door structure, and the lower part of the same side is provided with a first air outlet communicated with the interior of the cabinet 11;
a top plenum box 16 located at an upper portion of each of the cabinets 11, the top plenum box 16 including a second air inlet and a second air outlet, the interior of the top plenum box 16 being in communication with the interior of the interior plenum box 15 via the second air inlet, and the interior of the top plenum box 16 being in communication with the first air inlet of the tunnel front door structure 14 via the second air outlet;
and the cooling back plates 17 are respectively arranged on the air outlet surfaces 12 of the cabinets 11.
As shown in fig. 1, the top view of a set of cabinet group 10 is shown, one set of the cabinet group 10 is formed by a pair of cabinets 11 arranged at intervals, an air outlet surface 12 and an air inlet surface 13 communicated with the internal space of the cabinets 11 are arranged on the cabinets 11, wherein the air outlet surface 12 is located on one adjacent surface between the pair of cabinets 11, and the air inlet surface 13 is located on the other side opposite to the air outlet surface 12. The fact that the air outlet surfaces 12 of the two cabinets 11 in the cabinet group 10 are adjacent means that the air outlet surfaces 12 of the two cabinets 11 are located on the left and right opposite sides of the internal static pressure box 15 between the two cabinets 11. Each cabinet 11 is provided with a corresponding channel-type front door structure 14, and the channel-type front door structure 14 is located on the outer side of the air inlet surface 13 of the cabinet 11. Each cabinet 11 is further provided with a corresponding cooling back plate 17, which is located on the air outlet surface 12 of the cabinet 11. An internal plenum box 15 is provided between the outlet faces 12 of the two cabinets 11.
As shown in fig. 2, it is a top view of a data center micro-module formed by several groups of cabinet groups 10, and five groups of cabinet groups 10 are arranged along the direction a shown by the arrow. Each cabinet 11 is provided with a corresponding channel-type front door structure 14, and the channel-type front door structure 14 is located on the outer side of the air inlet surface 13 of the cabinet 11. Each cabinet 11 in each row is provided with a corresponding cooling back plate 17, and is located on the air outlet surface 12 of each cabinet 11. The gap between the air outlet surfaces 12 of the two rows of cabinets 11 forms an internal plenum box 15. The width D1 of the cooling back panel 17 is equal to the width of the cabinet outlet 12. The width D2 of the gangway front door structure 14 is equal to the width of the cabinet 11. The width of the internal plenum box 15 is equal to the sum of the widths occupied by the cabinets 11 in a single row.
Fig. 3 is a schematic structural diagram of the data center micro-module structure of the rear cooling backplane according to the embodiment, and it should be noted that, in order to make details of the drawing easier to show, the cabinet 11, the internal plenum box 15, and the tunnel-type front door structure 14 are all partially transparent. As shown in fig. 3, the top plenum box 16 is disposed above the cabinet 11, communicates between the tunnel-type front door structure 14 and the internal plenum box 15, and is isolated from the outside without exchanging heat with the outside air. Preferably, the tunnel-type front door structure 14 is detachably connected to the cabinet 11 for disassembly during maintenance, and a rubber pad is disposed at the connection to ensure the tightness of the system. The internal plenum box 15 is of rectangular parallelepiped configuration. A maintenance door 18 is arranged at one side of the inner static pressure box 15, which is not connected with the cabinet 11, so that maintenance personnel can go in and out of the inner static pressure box 15 for maintenance, and when the maintenance door 18 is closed, the inner static pressure box 15 is completely sealed, so that the air in the micro-module is not subjected to heat exchange with the external air. In this example, the shape of the tunnel front door structure 14 may be rectangular, that is, the top of the tunnel front door structure 14 is a planar guide surface, and the top of the tunnel front door structure 14 is vertically connected to the side wall of the tunnel front door structure 14.
Fig. 4 is a cross-sectional view of the data center micro-module structure of the rear cooling backplane provided in the present embodiment, wherein arrows indicate the flowing direction of air. When the hot air in the cabinet 11 is exhausted through the air outlet surface 12, the hot air is cooled to be cold air through the cooling back plate 17 and enters the internal static pressure box 15; the cool air enters the tunnel-type front door structure 14 through the inner plenum box 15 and the top plenum box 16, enters the cabinet 11 through the air intake surface 13, and removes heat from the cabinet 11. Preferably, the height H2 of the cooling back plate 17 is equal to the height of the cabinet air outlet 12. The depth W2 of the internal plenum box 15 is no less than twice the depth W3 of the cabinet 11. The height H3 of the internal plenum box 15 is no less than the sum of the heights of the cabinet 11 and the top plenum box 16 (H1+ H2).
By way of example, the data center micro-module structure of the rear cooling back panel further includes a return air temperature sensor located within the top plenum box 16 on a side proximate to the channeled front door structure 14. To monitor the return air temperature of the air entering the interior of the tunnel front door structure 14 from the top plenum box 16, the present invention provides a return air temperature sensor in the top plenum box 16 on the side adjacent to the tunnel front door structure 14 to accurately monitor the return air temperature of the air passing into the tunnel front door structure 14. When the return air temperature sensor detects that the return air temperature deviates from a set standard value, an alarm can be given in time, and the phenomenon that the temperature in the cabinet 11 is too high to cause the shutdown of the server is avoided.
As an example, the data center micro-module structure of the rear cooling back plate further includes an outlet air temperature sensor, which is located inside the top static pressure box 16 and close to one side of the inner static pressure box 15. Through the monitoring of the outlet air temperature entering the top static pressure box 16, the cooling effect of the cooling back plate 17 can be accurately grasped, the refrigeration efficiency of the cooling back plate 17 is adjusted in real time, and the temperature in the whole system is maintained within a set range.
As an example, the height H1 of the top plenum box 16 is not less than twice the depth W1 of the tunnel front door structure 14, and the width D3 of the top plenum box 16 is equal to the sum of the widths occupied by the single row of tunnel front door structures 14 in the array direction. As shown in fig. 4, the height H1 of the top plenum box 16 is at least not less than twice the depth W1 of the channel front door structure 14, which ensures that the top plenum box 16 has a certain airflow area that helps to increase the static pressure effect of the top plenum box 16. As shown in fig. 3, the width D3 of the top plenum box 16 is equal to the sum of the widths of the single row of tunnel-type front door structures 14 in the row direction, which ensures that the top plenum box 16 can smoothly communicate between the tunnel-type front door structures 14 and the interior plenum boxes 15.
As an example, the top plenum box 16 is rectangular with a uniform cross section in its depth direction, and the top plenum box 16 is rectangular with a uniform cross section in its width direction. I.e. the top plenum box 16 is a box having a rectangular parallelepiped configuration.
As an example, the top plenum box 16 is rectangular with a varying cross-section in its depth direction, and the top plenum box 16 is of a uniform cross-sectional profile in its width direction. Referring to fig. 5, as a preferred embodiment of the present invention, the top plenum 16 may be rectangular with gradually increasing or decreasing cross-sections in the depth direction a1 and uniform cross-sectional shape in the width direction a 2. The variation in the cross-section of the top plenum box 16 in the depth direction a1 may help optimize the internal airflow flow of the post-cooling backplane data center micro-module structure, further increasing the heat dissipation efficiency of the system.
As an example, the cooling back plate 17 is a water cooling back plate or an air cooling back plate. As a preferable scheme of the invention, the water-cooling back plate is used as a means for cooling hot air, so that the heat generated by the server with high heat density can be eliminated to the maximum extent, and the invention has the advantages of high efficiency and low energy consumption. Of course, other cooling means such as an air-cooled back plate may be used in other embodiments.
As an example, the water-cooling back plate is internally provided with a chilled water coil. The refrigeration water coil pipe cools air passing through the surface of the refrigeration water coil pipe through heat exchange of low-temperature circulating water flow in the refrigeration water coil pipe, and is a high-efficiency and low-energy-consumption refrigeration means.
As an example, the cooling back plate 17 is detachably disposed on the air outlet surface 12. The cooling back plate 17 can be disassembled as required for maintenance by maintenance personnel.
Example two
As shown in fig. 6, the present invention further provides a data center micro-module structure of a rear cooling backplane, the specific structure of the data center micro-module structure of the rear cooling backplane in this embodiment is substantially the same as the specific structure of the data center micro-module structure of the rear cooling backplane in the first embodiment, and the difference between the two structures is that: in the data center micro-module structure of the rear cooling backplane according to the first embodiment, the top of the tunnel-type front door structure 17 is a planar guide surface, while in the present embodiment, the top of the tunnel-type front door structure 14 is an arc-shaped guide surface. The arrangement of the arc-shaped guide surface fully considers the hydrodynamics inside the data center micro-module structure of the rear cooling back plate, so that the air flow inside the channel type front door structure 14 is smooth, and the heat dissipation efficiency of the data center micro-module structure of the rear cooling back plate is improved.
Other structures of the data center micro-module structure of the rear cooling backplane in this embodiment are the same as those of the data center micro-module structure of the rear cooling backplane in the first embodiment, and refer to the first embodiment specifically, and will not be described here again.
EXAMPLE III
Referring to fig. 7 to 8, the present invention further provides a data center micro-module structure of a rear cooling backplane. As shown in fig. 7, the specific structure of the data center micro-module structure of the rear cooling backplane in this embodiment is substantially the same as the specific structure of the data center micro-module structure of the rear cooling backplane in the second embodiment, and the difference between them is that: the data center micro-module configuration of the rear cooling back panel described in this embodiment further increases the height H3 of the internal plenum box 15. This makes it possible to increase the volume of the internal plenum box 16 not only when the depth W2 of the internal plenum box 16 is constant; or when the volume of the internal static pressure box 16 is not changed, the occupied area of the internal static pressure box 16 is reduced as much as possible, so that the occupied area of the whole data center micro-module structure of the rear cooling back plate is smaller while a certain static pressure effect is ensured, and the occupied space is saved. Fig. 8 is a schematic cross-sectional view of a micro module structure of a data center of the rear cooling backplane according to this embodiment. Wherein, the height H3 of the inner static pressure box 15 is increased compared with the second embodiment, and a middle convex structure is introduced, thereby improving the static pressure effect of the inner static pressure box 15; the arc-shaped guide surface is arranged at the top of the channel type front door structure 14, so that the circulation efficiency of internal air flow is increased, and the cooling effect is further improved. Arrows in the figure indicate the airflow direction in the data center micro-module structure of the rear cooling back panel, and when the hot air in the cabinet 11 is exhausted through the air outlet surface 12, the hot air is cooled to be cold air through the cooling back panel 17 and enters the internal plenum box 15; the cold air enters the tunnel front door structure 14 through the inner plenum box 15 and the top plenum box 16, enters the cabinet 11 through the air inlet surface 13, and carries away heat of the cabinet 11, and the arc-shaped guide surfaces enable the cold air to smoothly circulate in the tunnel front door structure 14.
In summary, the present invention provides a data center micro module structure of a rear cooling backplane, including: at least one cabinet group, an internal plenum box, a plurality of tunnel front door structures, a top plenum box, and a plurality of cooling backplates. The invention can effectively solve the heat dissipation problem of a plurality of high-heat-density server cabinets in a common machine room, and cools hot air exhausted by the cabinets by introducing the cooling back plate, thereby saving the energy consumption of a fan at the tail end of an air conditioner, improving the heat dissipation efficiency of the cabinets and saving the space of the machine room.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (17)
1. A data center micro-module structure of a rear cooling backplane, comprising:
the air conditioner comprises at least one cabinet group, wherein one cabinet group comprises two rows of cabinets arranged at intervals, an air outlet surface and an air inlet surface which are communicated with the interior of the cabinet are arranged on the cabinet, and the air outlet surface and the air inlet surface are respectively arranged on two opposite sides of the cabinet; the air outlet surfaces of the two cabinets in the cabinet group are adjacent;
the internal static pressure box is arranged between the two rows of the cabinets and is connected with the air outlet surface of the cabinet;
the channel type front door structures are respectively arranged on the outer sides of the air inlet surfaces of the cabinets; the interior of the channel type front door structure is hollow, a first air inlet communicated with the interior of the channel type front door structure is formed in the upper portion of one side of the channel type front door structure, and a first air outlet communicated with the interior of the channel type front door structure is formed in the lower portion of the same side;
the top static pressure box is positioned at the upper part of each cabinet and comprises a second air inlet and a second air outlet, the interior of the top static pressure box is communicated with the interior of the interior static pressure box through the second air inlet, and the interior of the top static pressure box is communicated with the first air inlet of the channel type front door structure through the second air outlet;
and the cooling back plates are respectively arranged on the air outlet surfaces of the cabinets.
2. The back cooling backplane data center micro-module structure of claim 1, further comprising a return air temperature sensor located within the top plenum box on a side proximate to the aisle front door structure.
3. The back-cooling panel data center micro-module structure of claim 1, further comprising an outlet air temperature sensor located inside the top plenum box on a side adjacent to the inner plenum box.
4. The data center micro-module structure of a rear cooling back panel according to claim 1, wherein the height of the top plenum box is not less than twice the depth of the tunnel front door structure, and the width of the top plenum box is equal to the sum of the widths of the single row of tunnel front door structures in the arrangement direction.
5. The data center micromodule structure of a rear cooling back panel according to claim 1, wherein the cross-sectional shape of the top plenum box along the depth direction thereof is a rectangle of uniform cross-section, and the cross-sectional shape of the top plenum box along the width direction thereof is a rectangle of uniform cross-section.
6. The data center micromodule structure of a rear cooling panel according to claim 1, wherein the cross-sectional shape of the top plenum box along the depth direction thereof is a rectangular shape with a variable cross-section, and the cross-sectional shape of the top plenum box along the width direction thereof is a uniform cross-sectional pattern.
7. The data center micro-module structure of a rear cooling back plate according to claim 1, wherein the cooling back plate is a water cooling back plate or an air cooling back plate.
8. The data center micro-module structure of a rear cooling back plate according to claim 7, wherein a chilled water coil is installed inside the water cooling back plate.
9. The data center micro-module structure of a rear cooling back panel according to claim 1, wherein the cooling back panel is detachably disposed on the air outlet surface.
10. The data center micro-module structure of a rear cooling back panel according to claim 1, wherein the width of the tunnel front door structure is equal to the width of the cabinet.
11. The data center micro-module structure of a rear cooling back panel according to claim 1, wherein the channeled front door structure is removably connected to the cabinet.
12. The data center micro-module structure of a rear cooling back panel according to claim 1, wherein a rubber gasket is provided between the tunnel front door structure and the cabinet.
13. The data center micro-module structure of a rear cooling back panel according to claim 1, wherein the top of the tunnel front door structure is an arc-shaped guide surface.
14. The data center micro-module structure of a rear cooling back panel according to claim 1, wherein the width of the cooling back panel is equal to the width of the cabinet outlet, and the height of the cooling back panel is equal to the height of the cabinet outlet.
15. The data center micromodule structure of a rear cooling backplane of claim 1, wherein the internal plenum box is a rectangular parallelepiped structure.
16. The data center micromodule structure of a rear cooling backplane according to claim 1, wherein the inner plenum box is provided with a service door in communication with the interior thereof.
17. The data center micro-module structure of a rear cooling back panel according to claim 1, wherein the depth of the internal plenum box is not less than twice the depth of the cabinet; the width of the internal static pressure box is equal to the sum of the widths occupied by the single row of the cabinets; the height of the internal plenum box is no less than the sum of the height of the cabinet and the height of the top plenum box.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810751739.4A CN110708923A (en) | 2018-07-10 | 2018-07-10 | Data center micro-module structure of rear cooling back plate |
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| CN201810751739.4A CN110708923A (en) | 2018-07-10 | 2018-07-10 | Data center micro-module structure of rear cooling back plate |
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| US20100317278A1 (en) * | 2009-06-10 | 2010-12-16 | Blackrock, Inc. | Cooling System for a Computer Server Cabinet in a Data Center |
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| JP2014191811A (en) * | 2013-03-28 | 2014-10-06 | Sanki Eng Co Ltd | Air conditioning system |
| CN106961819A (en) * | 2016-01-11 | 2017-07-18 | 上海宽带技术及应用工程研究中心 | A kind of overhead type data center refrigeration system |
| CN208445914U (en) * | 2018-07-10 | 2019-01-29 | 上海宽带技术及应用工程研究中心 | Data center's micromodule structure of the cooling backboard of postposition |
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| US20100317278A1 (en) * | 2009-06-10 | 2010-12-16 | Blackrock, Inc. | Cooling System for a Computer Server Cabinet in a Data Center |
| CN103174308A (en) * | 2013-03-15 | 2013-06-26 | 北京百度网讯科技有限公司 | Machine room |
| JP2014191811A (en) * | 2013-03-28 | 2014-10-06 | Sanki Eng Co Ltd | Air conditioning system |
| CN106961819A (en) * | 2016-01-11 | 2017-07-18 | 上海宽带技术及应用工程研究中心 | A kind of overhead type data center refrigeration system |
| CN208445914U (en) * | 2018-07-10 | 2019-01-29 | 上海宽带技术及应用工程研究中心 | Data center's micromodule structure of the cooling backboard of postposition |
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