CN110697252A - Storage and transportation device for semiconductor wafers and using method thereof - Google Patents
Storage and transportation device for semiconductor wafers and using method thereof Download PDFInfo
- Publication number
- CN110697252A CN110697252A CN201910964953.2A CN201910964953A CN110697252A CN 110697252 A CN110697252 A CN 110697252A CN 201910964953 A CN201910964953 A CN 201910964953A CN 110697252 A CN110697252 A CN 110697252A
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- electromagnetic valve
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- control device
- semiconductor wafers
- brush body
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- 235000012431 wafers Nutrition 0.000 title claims abstract description 45
- 238000003860 storage Methods 0.000 title claims abstract description 41
- 239000004065 semiconductor Substances 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 title claims description 11
- 230000007246 mechanism Effects 0.000 claims abstract description 55
- 239000000428 dust Substances 0.000 claims abstract description 30
- 238000010521 absorption reaction Methods 0.000 claims abstract description 18
- 238000004140 cleaning Methods 0.000 claims abstract description 4
- 239000000872 buffer Substances 0.000 claims description 8
- 238000001514 detection method Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000013618 particulate matter Substances 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000000916 dilatatory effect Effects 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
- B65D81/05—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents
Abstract
The invention relates to the technical field of semiconductor production equipment, in particular to a storage and transportation device for semiconductor wafers, which comprises a frame body, a placement mechanism for placing the semiconductor wafers, a dust absorption mechanism for cleaning the surfaces of the placement mechanism and a control device for controlling the placement mechanism and the dust absorption mechanism to operate, wherein the placement mechanism comprises two symmetrically arranged placement frames and two lifting mechanisms arranged on the placement frames, the two dust absorption mechanisms are arranged on the frame body and respectively matched with corresponding skins, and each dust absorption mechanism comprises a push cylinder, a sliding block, a brush body and a second electromagnetic valve.
Description
Technical Field
The invention relates to the technical field of semiconductor production equipment, in particular to a storage and transportation device for semiconductor wafers and a using method thereof.
Background
Semiconductor wafer is in the processing production process, all save and shift the transportation through transfer device, but present semiconductor wafer rack is mostly the individual layer, make every rack can only place a slice semiconductor substrate, it is underneath to have caused conveyer belt base plate conveying efficiency, and the rack is mostly the open-type, in the semiconductor field, need guarantee the purity on base plate surface, avoid the base plate standard to adhere to tiny particle, cause particle pollution to the base plate, make the rack of open-type easily improve base plate surface particle pollution and ask the condition at the in-process of transporting the base plate, get the in-process at the wafer in addition, the dilatory condition appears, easily cause the condition of wearing and tearing to the wafer surface.
Disclosure of Invention
The invention aims to provide a storage and transportation device for semiconductor wafers, which aims to solve the problems that the semiconductor wafers are inconvenient to store and easy to wear the surfaces of the wafers during taking and placing operations in the prior art.
In order to achieve the purpose, the invention provides the following technical scheme: a storage and transportation device for semiconductor wafers comprises a frame body, a storage mechanism for placing the semiconductor wafers, a dust absorption mechanism for cleaning the surfaces of the storage mechanism, and a control device for controlling the storage mechanism and the dust absorption mechanism to operate, wherein the storage mechanism comprises two symmetrically arranged storage racks and a lifting mechanism arranged on the storage racks, the upper surface of each storage rack is provided with a long strip-shaped through groove, a covering is arranged at the opening of the long strip-shaped through groove in a sealing manner, the lifting mechanism comprises a first electromagnetic valve and an air bag, the first electromagnetic valve and the air bag are both arranged in the long strip-shaped through groove, the control end of the first electromagnetic valve is connected with the output end of the control device, the air inlet of the first electromagnetic valve is connected with an external high-pressure air pump, the air outlet of the first electromagnetic valve is communicated with the air hole of the air bag, after high-pressure air is input into the air bag,
the dust absorption mechanism is provided with two on the support body, and two dust absorption mechanisms correspond corresponding covering department respectively and match the setting, and dust absorption mechanism is provided with the spout including pushing away jar, slider, brush body and second solenoid valve on the support body, slider slidable mounting in the spout, pushes away the jar and installs on the support body, and pushes away the telescopic link of jar and be connected with the slider, promotes the slider through pushing away the jar and slides, and the brush body is installed on the slider, and the brush hair part of the brush body sets up corresponding to covering department, be provided with the mutual hole groove that communicates of a plurality of on the brush body towards one side of covering, brush body upper portion is provided with the through-hole that link up with all hole grooves, second solenoid valve is installed on the slider, and the control end and the output of controlling means of second solenoid valve are connected, and the air inlet and the through-hole intercommunication of second solenoid.
Preferably, the upper surface of the skin is covered with a flexible rubber layer.
Preferably, the support body is in a frame shape, the front side of the support body is used for opening, and the rear side of the support body is closed.
Preferably, an infrared geminate transistor sensor is arranged at the opening setting end on the rack body, and the signal output end of the infrared geminate transistor sensor is connected with the input end of the control device.
Preferably, the pushing cylinder is installed in the frame body close to the rear side of the frame body, and the control end of the pushing cylinder is connected with the output end of the control device.
Preferably, a plurality of quick connectors are arranged on the frame body, the first electromagnetic valve and the second electromagnetic valve are respectively communicated with corresponding quick connector pipelines, the external high-pressure air pump is connected with the quick connector connected with the first electromagnetic valve, and the air aspirator is connected with the quick connector connected with the second electromagnetic valve.
Preferably, the hydraulic buffers are respectively arranged at the positions, corresponding to the sliding blocks, of the front side and the rear side of the frame body, and the sliding blocks slide forwards and backwards and can respectively abut against the corresponding hydraulic buffers.
Preferably, the bristle part of the brush body is a flexible brush.
Preferably, the object placing mechanisms are arranged on the rack body in a multi-layer mode, and each object placing mechanism is matched with the corresponding dust collection mechanism.
In order to achieve the above purpose, the invention also provides the following technical scheme: a method for using a storage and transportation device for semiconductor wafers comprises the following steps:
(1) the initial state is a push cylinder extension state, the slide block is positioned at the opening of the frame body, the brush body is positioned at the front end of the skin, and the first electromagnetic valve and the second electromagnetic valve are both in a closed state;
(2) when the semiconductor wafer is required to be placed on the shelf, the wafer moves to the opening of the shelf body;
(3) the infrared geminate transistor sensor detects the position of the wafer and outputs a detection signal, and the control device controls the conduction of the second electromagnetic valve, so that the aspirator generates strong suction at the hole groove of the brush body;
(4) then the control device controls the push cylinder to retract, so that the sliding block drives the brush body to move towards the rear side, the brush body cleans the surface of the flexible rubber layer, and dust is absorbed by attached tiny dust;
(5) after the push cylinder is completely retracted, the control device controls the second electromagnetic valve to be closed, then the control device controls the first electromagnetic valve to be conducted, gas of the high-pressure gas pump enters the gas bag, the gas bag expands and presses the skin, and the skin forms a long strip-shaped bulge on the storage rack;
(6) then the semiconductor wafer is placed on the raised flexible rubber layer;
(7) after the semiconductor chip is taken out of the storage rack, the infrared geminate transistor sensor can not detect the chip signal;
(8) the control device controls the first electromagnetic valve to be closed, and as no other input exists in the air bag, the air bag slowly reduces the pressure, and the skin retracts, so that the flexible rubber layer returns to the planar state;
(9) the control device then controls the push cylinder to extend, so that the brush body is restored to the initial state position.
Compared with the prior art, the invention has the beneficial effects that: the electromagnetic valve I is matched with the air bag, and the skin is arranged. The rapid bulge arrangement can be realized, the rapid operation of the bulge and the plane can be realized, and the operation efficiency is improved;
through the arrangement of the flexible rubber layer, the contact area between the wafer and the rubber layer can be increased, the static friction force between the wafer and the flexible rubber layer is increased, the situation that the wafer is subjected to sliding abrasion due to the shaking of the frame body is avoided, and the situation that the wafer is damaged due to collision in the wafer placing process can be avoided to the maximum extent through the flexible rubber;
through the arrangement of the dust collection mechanism, the surface of the rubber layer can be cleaned and subjected to dust collection operation, and the damage of dust on the surface of the flexible rubber layer to the operation of the wafer is avoided;
through the arrangement of the hydraulic buffer, the situation that the slide block is in strong collision with the frame body when the slide block is positioned at the front end and the rear end in the sliding process due to the rapid operation of the push cylinder can be avoided;
through the setting of infrared geminate transistor inductor, can detect the position of wafer on the support body, realize automatic equipment control, avoid manual operation's loaded down with trivial details step and low operating efficiency, and can realize the interactive operation of interconnection between automatic equipment.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a front cross-sectional view of the shelf of the present invention;
FIG. 3 is a side cross-sectional view of the present invention;
FIG. 4 is a front cross-sectional view of a brush body of the present invention;
FIG. 5 is a side view of the brush body of the present invention;
fig. 6 is a schematic structural view of the multi-layer placement mechanism of the present invention.
In the figure: 1. a frame body; 2. a rack; 3. a first electromagnetic valve; 4. air bags; 5. a strip-shaped through groove; 6. covering a skin; 7. a flexible rubber layer; 8. pushing the cylinder; 9. a slider; 10. a brush body; 11. a second electromagnetic valve; 12. an infrared pair tube sensor; 13. a hydraulic buffer.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 6, the present invention provides a technical solution: a storage and transportation device for semiconductor wafers comprises a frame body 1, a storage mechanism for placing the semiconductor wafers, a dust absorption mechanism for cleaning the surface of the storage mechanism, and a control device for controlling the storage mechanism and the dust absorption mechanism to operate, wherein the storage mechanism comprises two symmetrically arranged storage racks 2 and lifting mechanisms arranged on the storage racks 2, the upper surface of each storage rack 2 is provided with a strip-shaped through groove 5, the opening of the strip-shaped through groove 5 is sealed and provided with a skin 6, each lifting mechanism comprises a first electromagnetic valve 3 and an air bag 4, the first electromagnetic valve 3 and the air bag 4 are both arranged in the strip-shaped through groove 5, the control end of the first electromagnetic valve 3 is connected with the output end of the control device, the air inlet of the first electromagnetic valve 3 is connected with an external high-pressure air pump, the air outlet of the first electromagnetic valve 3 is communicated with the air holes of the air, the air bag 4 expands and presses the skin 6, the skin 6 is arranged at the opening of the strip-shaped through groove 5 in a protruding way,
the two dust absorption mechanisms are arranged on the frame body 1 and are respectively matched and arranged corresponding to the corresponding skin 6, each dust absorption mechanism comprises a push cylinder 8, a slide block 9, a brush body 10 and a second electromagnetic valve 11, a slide groove is arranged on the frame body 1, the slide block 9 is slidably arranged in the slide groove, the push cylinder 8 is arranged on the frame body 1, the telescopic rod of the push cylinder 8 is connected with the slide block 9, the sliding block 9 is pushed to slide by the pushing cylinder 8, the brush body 10 is arranged on the sliding block 9, the brush part of the brush body 10 is arranged corresponding to the skin 6, a plurality of communicated hole grooves are arranged on one side of the brush body 10 facing the skin 6, through holes communicated with all the hole grooves are arranged on the upper part of the brush body 10, the second electromagnetic valve 11 is installed on the sliding block 9, the control end of the second electromagnetic valve 11 is connected with the output end of the control device, the air inlet of the second electromagnetic valve 11 is communicated with the through hole, and the air outlet of the second electromagnetic valve 11 is communicated with the input end of the external air aspirator.
The concrete installation process spout replaces through the slide rail, installs the slider on the slide rail, realizes the slip of slider.
The control device is a PLC controller, and the control of the electromagnetic valve is realized through the PLC controller.
The skin 6 is made of a strong pressure-resistant composite material, and the two pairs of convex heights of the skin 6 are arranged in a limiting mode, so that the air bag 4 is in an air blowing state, and the convex heights of the skin 6 are consistent all the time.
The upper surface of the skin 6 is covered with a flexible rubber layer 7.
The frame body 1 is in a frame shape, the front side of the frame body 1 is used for opening, and the rear side of the frame body 1 is closed.
An infrared geminate transistor sensor 12 is arranged at the opening setting end of the frame body 1, and the signal output end of the infrared geminate transistor sensor 12 is connected with the input end of the control device.
The pushing cylinder 8 is installed in the frame body 1 and close to the rear side of the frame body 1, and the control end of the pushing cylinder 8 is connected with the output end of the control device.
The frame body 1 is provided with a plurality of quick connectors, the first electromagnetic valve 3 and the second electromagnetic valve 11 are respectively communicated with corresponding quick connector pipelines, the external high-pressure air pump is connected with the quick connectors connected with the first electromagnetic valve 3, and the air suction machine is connected with the quick connectors connected with the second electromagnetic valve 11.
The second electromagnetic valve 11 is connected with the quick connector through the flexible air pipe, so that when the sliding block 9 moves, the air pipe can be adjusted, and the problem that the air pipe cannot be adjusted due to the second electromagnetic valve 11 is solved.
The front side and the rear side of the frame body 1 are respectively provided with a hydraulic buffer 13 corresponding to the slide block 9, and the slide block 9 slides forwards and backwards and can respectively abut against the corresponding hydraulic buffers 13.
The bristle part of the brush body 10 is a flexible brush.
The object placing mechanisms are arranged on the frame body 1 in a multilayer mode, and each object placing mechanism is matched with a corresponding dust collection mechanism.
After the multiple layers of storage mechanisms are installed on the shelf body 1, infrared pair tube sensors 12 are required to be installed at each layer of storage mechanism, so that each sensor 12 is detected and controlled corresponding to the storage mechanism.
A method for using a storage and transportation device for semiconductor wafers comprises the following steps:
(1) the initial state is the extension state of the push cylinder 8, the slide block 9 is positioned at the opening of the frame body 1, the brush body 10 is positioned at the front end of the skin 6, and the first electromagnetic valve 3 and the second electromagnetic valve 11 are both in a closed state;
(2) when the semiconductor chip is required to be placed on the shelf 2, the chip moves to the opening of the shelf body 1;
(3) the infrared geminate transistor sensor 12 detects the position of the wafer and outputs a detection signal, and the control device controls the conduction of the second electromagnetic valve 11, so that the aspirator generates strong suction at the hole groove of the brush body 10;
(4) then the control device controls the push cylinder 8 to retract, so that the sliding block 9 drives the brush body 10 to move towards the rear side, the brush body 10 cleans the surface of the flexible rubber layer 7, and dust is sucked to the attached tiny dust;
(5) after the push cylinder 8 is completely retracted, the control device controls the second electromagnetic valve 11 to be closed, then the control device controls the first electromagnetic valve 3 to be conducted, air of the high-pressure air pump enters the air bag 4, the air bag 4 is expanded and supports and presses the skin 6, and the skin 6 forms a long strip-shaped bulge on the storage rack 2;
(6) then the semiconductor chip is placed on the raised flexible rubber layer 7;
(7) after the semiconductor chip is taken out from the shelf 2, the infrared pair tube sensor 12 can not detect the chip signal;
(8) the control device controls the first electromagnetic valve 3 to be closed, and as no other input exists in the air bag 4, the air bag 4 slowly reduces the pressure, and the skin 6 retracts, so that the flexible rubber layer 7 returns to the planar state;
(9) the control device then controls the push cylinder 8 to extend so that the brush body 10 is restored to the initial state position.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. A storage and transportation device for semiconductor wafers, characterized by: comprises a frame body, a placement mechanism for placing a semiconductor wafer, a dust absorption mechanism for cleaning the surface of the placement mechanism and a control device for controlling the operation of the placement mechanism and the dust absorption mechanism, the article placing mechanism comprises two article placing frames which are symmetrically arranged and a lifting mechanism arranged on the article placing frames, the upper surface of the shelf is provided with a strip-shaped through groove, the opening of the strip-shaped through groove is provided with a covering in a sealing way, the lifting mechanism comprises a first electromagnetic valve and an air bag, the first electromagnetic valve and the air bag are both arranged in the strip-shaped through groove, the control end of the first electromagnetic valve is connected with the output end of the control device, the air inlet of the first electromagnetic valve is connected with an external high-pressure air pump, the air outlet of the first electromagnetic valve is communicated with the air hole of the air bag, after high-pressure air is input into the air bag, the air bag expands and presses the skin, the skin is convexly arranged at the opening of the strip-shaped through groove,
the dust absorption mechanism is provided with two on the support body, and two dust absorption mechanisms correspond corresponding covering department respectively and match the setting, and dust absorption mechanism is provided with the spout including pushing away jar, slider, brush body and second solenoid valve on the support body, slider slidable mounting in the spout, pushes away the jar and installs on the support body, and pushes away the telescopic link of jar and be connected with the slider, promotes the slider through pushing away the jar and slides, and the brush body is installed on the slider, and the brush hair part of the brush body sets up corresponding to covering department, be provided with the mutual hole groove that communicates of a plurality of on the brush body towards one side of covering, brush body upper portion is provided with the through-hole that link up with all hole grooves, second solenoid valve is installed on the slider, and the control end and the output of controlling means of second solenoid valve are connected, and the air inlet and the through-hole intercommunication of second solenoid.
2. A storage and transportation device for semiconductor wafers as recited in claim 1, further comprising: the upper surface of the skin is covered with a flexible rubber layer.
3. A storage and transportation device for semiconductor wafers as recited in claim 1, further comprising: the support body is the frame shape setting, and the support body front side is used for the opening setting, and the rear side of support body is for sealing the setting.
4. A storage and transportation device for semiconductor wafers as recited in claim 3, wherein: an infrared geminate transistor sensor is arranged at the opening setting end on the frame body, and the signal output end of the infrared geminate transistor sensor is connected with the input end of the control device.
5. A storage and transportation device for semiconductor wafers as recited in claim 3, wherein: the pushing cylinder is arranged in the frame body and close to the rear side of the frame body, and the control end of the pushing cylinder is connected with the output end of the control device.
6. A storage and transportation device for semiconductor wafers as claimed in claim 5, wherein: the frame body is provided with a plurality of quick connectors, the first electromagnetic valve and the second electromagnetic valve are respectively communicated with corresponding quick connector pipelines, the external high-pressure air pump is connected with the quick connectors connected with the first electromagnetic valve, and the air suction machine is connected with the quick connectors connected with the second electromagnetic valve.
7. A storage and transportation device for semiconductor wafers as claimed in claim 5, wherein: the front side and the rear side of the frame body are respectively provided with a hydraulic buffer corresponding to the sliding block, and the sliding block slides forwards and backwards and can respectively abut against the corresponding hydraulic buffers.
8. A storage and transportation device for semiconductor wafers as recited in claim 1, further comprising: the brush hair part of the brush body is a flexible brush.
9. A storage and transportation device for semiconductor wafers as recited in claim 1, further comprising: the object placing mechanisms are arranged on the frame body in a multilayer mode, and each object placing mechanism is matched with the corresponding dust collection mechanism.
10. A method of using a storage and transportation device for semiconductor wafers, comprising: the method comprises the following steps:
(1) the initial state is a push cylinder extension state, the slide block is positioned at the opening of the frame body, the brush body is positioned at the front end of the skin, and the first electromagnetic valve and the second electromagnetic valve are both in a closed state;
(2) when the semiconductor wafer is required to be placed on the shelf, the wafer moves to the opening of the shelf body;
(3) the infrared geminate transistor sensor detects the position of the wafer and outputs a detection signal, and the control device controls the conduction of the second electromagnetic valve, so that the aspirator generates strong suction at the hole groove of the brush body;
(4) then the control device controls the push cylinder to retract, so that the sliding block drives the brush body to move towards the rear side, the brush body cleans the surface of the flexible rubber layer, and dust is absorbed by attached tiny dust;
(5) after the push cylinder is completely retracted, the control device controls the second electromagnetic valve to be closed, then the control device controls the first electromagnetic valve to be conducted, gas of the high-pressure gas pump enters the gas bag, the gas bag expands and presses the skin, and the skin forms a long strip-shaped bulge on the storage rack;
(6) then the semiconductor wafer is placed on the raised flexible rubber layer;
(7) after the semiconductor chip is taken out of the storage rack, the infrared geminate transistor sensor can not detect the chip signal;
(8) the control device controls the first electromagnetic valve to be closed, and as no other input exists in the air bag, the air bag slowly reduces the pressure, and the skin retracts, so that the flexible rubber layer returns to the planar state;
(9) the control device then controls the push cylinder to extend, so that the brush body is restored to the initial state position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910964953.2A CN110697252B (en) | 2019-10-11 | 2019-10-11 | Storage and transportation device for semiconductor wafers and using method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910964953.2A CN110697252B (en) | 2019-10-11 | 2019-10-11 | Storage and transportation device for semiconductor wafers and using method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN110697252A true CN110697252A (en) | 2020-01-17 |
| CN110697252B CN110697252B (en) | 2021-09-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910964953.2A Active CN110697252B (en) | 2019-10-11 | 2019-10-11 | Storage and transportation device for semiconductor wafers and using method thereof |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0442780A1 (en) * | 1990-02-06 | 1991-08-21 | Saint-Gobain Vitrage International | Pallet for transport of glass panels |
| KR20130007324A (en) * | 2011-06-30 | 2013-01-18 | (주)둔포기계 | Subtrate storage container |
| CN103129858A (en) * | 2011-12-05 | 2013-06-05 | 陕西子竹电子有限公司 | Printed circuit board (PCB) anti-static turnover box |
| CN109230317A (en) * | 2018-09-25 | 2019-01-18 | 刘林琴 | A kind of transhipment cabin for semiconductor substrate storage transport |
| CN208994123U (en) * | 2018-10-18 | 2019-06-18 | 无锡百晟科技有限公司 | Circuit board flashboard rack with deashing device |
-
2019
- 2019-10-11 CN CN201910964953.2A patent/CN110697252B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0442780A1 (en) * | 1990-02-06 | 1991-08-21 | Saint-Gobain Vitrage International | Pallet for transport of glass panels |
| KR20130007324A (en) * | 2011-06-30 | 2013-01-18 | (주)둔포기계 | Subtrate storage container |
| CN103129858A (en) * | 2011-12-05 | 2013-06-05 | 陕西子竹电子有限公司 | Printed circuit board (PCB) anti-static turnover box |
| CN109230317A (en) * | 2018-09-25 | 2019-01-18 | 刘林琴 | A kind of transhipment cabin for semiconductor substrate storage transport |
| CN208994123U (en) * | 2018-10-18 | 2019-06-18 | 无锡百晟科技有限公司 | Circuit board flashboard rack with deashing device |
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| Publication number | Publication date |
|---|---|
| CN110697252B (en) | 2021-09-14 |
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Effective date of registration: 20210830 Address after: Room c-712, No. 198, Qidi Road, Xiaoshan Economic and Technological Development Zone, Xiaoshan District, Hangzhou City, Zhejiang Province Applicant after: Hangzhou Xiangyi Technology Co.,Ltd. Address before: 215000 No.6, Weizhong Road, Weitang Town, Xiangcheng District, Suzhou City, Jiangsu Province Applicant before: Wang Huazhen |
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Effective date of registration: 20240423 Address after: Room 1812, Building 1, Qiantang Aviation Building, Shangcheng District, Hangzhou City, Zhejiang Province, 310000 Patentee after: Hangzhou Pinde Holding Co.,Ltd. Country or region after: China Address before: Room c-712, No. 198, Qidi Road, Xiaoshan Economic and Technological Development Zone, Xiaoshan District, Hangzhou City, Zhejiang Province Patentee before: Hangzhou Xiangyi Technology Co.,Ltd. Country or region before: China |