Disclosure of Invention
In order to solve the problems and optimize the cutting process, the invention provides a novel PCB cutting device which can realize accurate positioning and cutting and improve the cutting rate.
In order to achieve the purpose, the technical scheme adopted by the invention for solving the technical problems is as follows:
in a first aspect, the present invention provides a novel PCB cutting apparatus, which is characterized in that: comprises a plurality of parallel circular cutters; the plurality of circular cutters are coaxially arranged and positioned above the left conveyor belt and the right conveyor belt, and the central axes of the plurality of circular cutters are mutually vertical to the projection line of the connecting line of the central points of the left conveyor belt and the right conveyor belt on the horizontal plane; a receiving cylinder is arranged between the left conveyor belt and the right conveyor belt; the receiving cylinder is positioned under the plurality of circular cutters and is arranged in parallel with the central axes of the plurality of circular cutters;
the plurality of circular cutters and the receiving cylinder are connected with a control device; the control device controls the movement speeds of the plurality of circular cutters and the contact points of the receiving cylinders and the PCB, and the transmission directions of the plurality of circular cutters, the receiving cylinders and the PCB are consistent and the speeds of the plurality of circular cutters, the receiving cylinders and the PCB are equal; the contact point is a contact point right below the PCB and the circular cutter during cutting;
the device also comprises a CCD visual positioning system and a dust collection pipe, wherein the CCD visual positioning system is positioned above the plurality of circular cutters; the dust collection pipe is positioned below the bearing cylinder and is connected with a dust collector; the dust collector is connected with a filter box, and a filter screen is arranged in the filter box to prevent dust from polluting the environment.
Preferably, the circular cutter is made of ultrathin diamond material.
In a second aspect, the present invention provides a novel PCB cutting method, which is characterized in that: the novel PCB cutting device is adopted; the method comprises the following steps:
1) the left conveyor belt conveys the PCB to the right conveyor belt, the CCD vision positioning system rapidly moves to the position of a Mark Mark point of the PCB, then the Mark point of the PCB is captured, the expansion ratio and the rotation ratio of the PCB are calculated, and corresponding compensation is carried out by adjusting the position of the blade so as to improve the cutting precision; wherein:
(1.1) capturing Mark points: in the early PCB punching process, drilling a circular Mark hole on a PCB as a Mark point; taking the Mark point as a reference, and taking an image by taking a CCD camera as a tool to obtain the actual position of the Mark point; the CCD camera is vertically arranged above the cutting device, an X-Y plane image of a circular hole on the PCB is obtained through shooting, edge information and a central point coordinate of a marking hole are extracted through image processing, and then a coordinate of a Mark point under a camera coordinate system is obtained;
(1.2) detecting and identifying Mark points on the substrate by using a high-resolution CCD (charge coupled device) camera, and comparing the detected data with stored data file data to calculate the position deviation degree of the PCB; meanwhile, the modified processing data are sent to a control device, and the control device adjusts the position of the circular cutter to perform corresponding compensation;
2) the circular cutter moves downwards under the control of the control device to cut the PCB placed in a single layer, and the speeds of the circular cutter at the contact points are equal, so that the section of the PCB obtained by cutting is vertically flat; simultaneously owing to be equipped with and accept the cylinder, make PCB board tangent point department has the bearing, and the cutting process is steady, the condition of PCB board both ends perk can not appear.
The invention has the following advantages and beneficial effects:
1. enough support is provided right below the tangent point, so that the PCB can be cut more stably;
2. the blade continuously rotates, and the recovery motion is not required to be designed, so that the service life of the cutting device is prolonged;
3. the position of the cutter is adjusted in real time by using a CCD visual positioning technology, so that the cutting precision is improved.
Detailed Description
The invention will be further elucidated and described with reference to the embodiments and drawings of the specification:
the novel PCB cutting apparatus as shown in the drawings comprises a plurality of parallel arranged circular cutters 31; the plurality of circular cutters 31 are coaxially arranged and are positioned above the left conveyor belt 1 and the right conveyor belt 2, and the central axes of the plurality of circular cutters 31 are mutually vertical to the projection line of the connecting line of the central points of the left conveyor belt 1 and the right conveyor belt 2 on the horizontal plane; a receiving cylinder 32 is arranged between the left conveyor belt 1 and the right conveyor belt 2; the receiving cylinder 32 is positioned right below the plurality of circular cutters 31 and is arranged in parallel with the central axes of the plurality of circular cutters 31; the plurality of circular cutters 31 and the receiving cylinder 32 are connected with a control device; the control device controls the movement speed of the contact points of the plurality of circular cutters 31 and the receiving cylinders 32 and the PCB 5, and enables the transmission directions of the plurality of circular cutters 31, the receiving cylinders 32 and the PCB 5 to be consistent and the speeds to be equal; the contact point is the contact point right below the PCB 5 and the circular cutter 31 during cutting; the device also comprises a CCD visual positioning system 4 and a dust collection pipe, wherein the CCD visual positioning system 4 is positioned above the plurality of circular cutters 31; the dust suction pipe is positioned below the bearing cylinder 32 and is connected with a dust collector; the dust collector is connected with a filter box, and a filter screen is arranged in the filter box to prevent dust from polluting the environment. The circular cutter 31 is an ultra-thin diamond material.
The use method is as follows: the PCB is conveyed to the right conveyor belt 2 by the left conveyor belt, the CCD vision positioning system 4 above the cutting device 3 moves to the position of a Mark point of the circuit board quickly, then the Mark point is captured, the expansion ratio and the rotation ratio are calculated, corresponding compensation is carried out by adjusting the position of the circular blade 31, and the cutting precision is improved. The circular cutter 31 gradually moves downwards under the control of the control device to cut the PCB 5 placed in a single layer, and the speeds of the contact points are equal, so that the section of the PCB 5 obtained by cutting is vertically flat; meanwhile, due to the existence of the bearing cylinder 32, the tangent point is supported, the cutting process is stable, and the situation that two ends of the PCB are tilted cannot occur.