CN110678010A - Manufacturing method of flexible LED display screen - Google Patents
Manufacturing method of flexible LED display screen Download PDFInfo
- Publication number
- CN110678010A CN110678010A CN201910943628.8A CN201910943628A CN110678010A CN 110678010 A CN110678010 A CN 110678010A CN 201910943628 A CN201910943628 A CN 201910943628A CN 110678010 A CN110678010 A CN 110678010A
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- CN
- China
- Prior art keywords
- display screen
- circuit board
- circuit
- led display
- circuit substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a manufacturing method of a flexible LED display screen, which comprises the following welding steps: taking out the circuit substrate to be welded, wherein the circuit substrate is provided with fusion welding materials and components; heating the fusion welding material at a fixed point by using laser, so that the fusion welding material is melted and attached to the circuit substrate and the components; and cooling the material to be welded. The solder paste at the welding part is locally welded at a fixed point by laser, so that the damage of high temperature to a circuit board, an LED lamp source and other components is avoided, the manufacturing process is simplified, the service life of the product is prolonged, and material resources are saved.
Description
Technical Field
The invention relates to the technical field of display screens, in particular to a manufacturing method of a flexible LED display screen.
Background
The LED display screen is composed of small LED light source connecting circuit boards, and information is displayed and transmitted by displaying contents such as characters, pictures, videos and the like on the screen. With the development of science and technology, we have entered the information age, and the development of LED display screens is also rapidly developed with the development of the age, and in order to meet the needs of the society, various LED display screens, such as transparent LED display screens, flexible LED display screens, etc., are now on the market.
At present, no matter what kind of LED display screen is on the market, wave soldering or reflow soldering is mostly adopted for connection and combination between an LED lamp source or other components and a circuit board, the process flow is complex, the whole circuit board, the LED lamp source or other components are transmitted into a cavity heated to a certain temperature for high-temperature heating soldering, so that the circuit board, the LED lamp source or other components are damaged to a certain extent, the circuit board which is not high-temperature resistant in material per se is not suitable, for example, the circuit board which is made of PET and the like is used as a base material, the material is yellow due to high temperature, the circuit board can be melted, conductive adhesive is also adopted in the market to stick the LED lamp source or other components on a transparent flexible circuit board to complete circuit connection operation, but the LED lamp source or other components fall off in the scheme, the welding is not firm, causes LED display screen life not long, the unstable problem of performance.
Therefore, the prior art needs to be improved.
Disclosure of Invention
In view of the above drawbacks and deficiencies of the prior art, that is, in view of the above background art, it is necessary to provide a method for manufacturing a flexible LED display, which not only can get rid of the conventional LED display manufacturing scheme, but also can achieve the purpose of efficiently welding an LED light source or other components in a short time by using local welding in a welding manner, thereby simplifying the process flow.
In order to achieve the purpose, the invention provides a manufacturing method of a flexible LED display screen, which adopts the following technical scheme: a manufacturing method of a flexible LED display screen is characterized by comprising the following steps: a welding step: taking out the circuit substrate to be welded, wherein the circuit substrate is provided with a fusion welding material and a light-emitting component; heating the fusion welding material at a fixed point by using laser, so that the fusion welding material is melted and attached to the circuit substrate and the light-emitting component; and a protective layer pressing step: and taking out the protective layer, arranging a position avoidance hole on the protective layer corresponding to the position of the component, and pressing the protective layer and the circuit substrate to obtain the display screen.
Preferably, the welding step further comprises: printing a welding material: taking out the circuit board, using fusion welding material printing equipment to print fusion welding materials on the welding part of the circuit board, and installing the light-emitting component: and the light-emitting component is pasted or inserted corresponding to the fusion welding material, so that the light-emitting component is initially installed on the circuit board to form the circuit substrate.
Preferably, the step of printing the welding material further comprises a circuit etching step before the step of printing the welding material: and taking out the base material with the conducting layer, washing away the unnecessary conducting layer in an etching mode, and reserving the necessary conducting layer to form the circuit board.
Preferably, the step of circuit etching further comprises, before the step of circuit etching, a step of laminating a conductive layer: and taking out the base material and the conductive film, and laminating the conductive film and the transparent flexible base material to form the base material with the conductive layer.
Preferably, the soldering step further comprises a flexible circuit board pressing step: pressing one end of the flexible circuit board corresponding to the circuit interface of the circuit substrate; and an assembling step: and connecting the other end of the flexible circuit board with a controller.
Preferably, the dispensing step after the protective layer pressing step: and filling the gap between the avoiding hole and the component by using a photo-adhesive.
Preferably, the fusion welding material is low-temperature solder paste, and the components are LED lamp beads.
Preferably, the circuit substrate is a transparent flexible circuit substrate.
Preferably, the laser welding temperature is 0-150 ℃.
Preferably, the temperature of the laser welding is 125 ℃.
Preferably, the time for heating the fusion welding material by using the laser is 0.1-1 second.
Has the advantages that:
1. compared with the prior art, the manufacturing method of the flexible LED display screen disclosed by the invention has the advantages that the solder paste at the part to be welded is subjected to fixed-point laser welding in a laser welding mode, the solder paste can be rapidly melted in a short time, the LED lamp source or other components and the circuit board are welded together, and the solder paste can be rapidly shaped in a short time after the laser is removed to realize welding and fixing, so that the process flow is simplified, and the working efficiency is improved.
2. The solder paste at the welding part is locally welded at a fixed point by laser, except that the solder paste at the welding part can bear the temperature, the circuit board and other components cannot bear high-temperature heating, the damage of high temperature to the circuit board, the LED lamp source and other components is avoided, the service life of the product is prolonged, and material resources are saved.
3. The solder paste at the welding position is locally welded at a fixed point by laser, so that the problems that an LED lamp source or other components fall off and the performance is unstable in a conductive adhesive bonding connection mode are solved, and a circuit board which is made of materials and does not resist high temperature can be taken into consideration, so that the manufacturing process of the LED display screen is more perfect.
4. The gap between the avoiding hole and the component is filled by the optical cement to realize secondary limiting, so that the LED lamp source or other components are fixed in the optical cement, and the LED lamp source or other components cannot fall off due to left-right shaking. Even adopt conducting resin to paste LED lamp source or other components and parts and accomplish circuit connection on transparent flexible circuit board, the steadiness of guarantee LED lamp source or other components and parts that also can be fine realizes the stability of circuit, and product life increases.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a block diagram of an embodiment flow structure;
FIG. 2 is a schematic diagram of a display screen according to an embodiment;
FIG. 3 is a schematic view of a solder paste structure according to an embodiment.
The reference numbers illustrate:
1. the circuit board, 2, the melting welding material, 2, the tin cream, 3, light emitting component, 3, LED lamp pearl, 30, pin, 4, flexible line way board, 5, controller, 6, the laminating glue, 7, protective layer, 70, keep away the hole, 8, welding part, 9, copper foil circuit.
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In the present invention, unless otherwise expressly stated or limited, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
Please refer to fig. 1, fig. 2, and fig. 3, which illustrate a method for manufacturing a flexible LED display screen, wherein, for convenience of description, fig. 3 is a schematic structural diagram illustrating a light emitting device 3 standing up, and the method specifically includes the following steps:
s1, conducting layer laminating step: taking out a base material and a conductive film, and laminating the conductive film and the transparent flexible base material, wherein the base material can be a transparent flexible film material such as PI, PEN, PET, and the like, the conductive film can be a copper foil film, zinc oxide, tin, and the like, and the invention is not particularly limited.
S2: circuit etching step: taking out the substrate with the conducting layer, washing off the unnecessary conducting layer by an etching mode, and reserving the required conducting layer to form the circuit board, wherein the etching mode is a chemical etching or laser etching technical mode and is a conventional means in the technical field, and in the embodiment, the circuit board is a transparent flexible circuit board with a copper foil circuit 9.
S3: and 2, printing the welding material: using a welding material 2 printing device or using a spot coating device to spot coat the welding material 2 on the welding part 8; the spot printing of the soldering material 2 is performed on the soldering portion 8 of the circuit board. The circuit board is placed on the carrier, so that the circuit board is kept flat, the solder paste 2 is convenient to print, and the solder paste 2 is printed by using solder paste printing equipment commonly used by a Surface Mount Technology (SMT). The invention is not limited specifically, the welding material 2 may be conductive adhesive, low temperature solder paste 2 or normal temperature solder paste 2, and in this embodiment, the welding material 2 is the low temperature solder paste 2, so that the welding temperature of the solder paste 2 is not too high, the welding time and the cooling time of the solder paste 2 are reduced, the process flow is shortened, and the component damage is reduced.
S4: light-emitting component 3 mounting step: light-emitting component 3 corresponds solder paste 2 carries out paster or grafting, makes its preliminary mounting form on the circuit board circuit substrate 1, light-emitting component 3 can be emitting diode, LED lamp unit etc. in this embodiment light-emitting component 3 is LED lamp pearl 3, the pin 30 of light-emitting component 3 is also the lamp base and the contact of solder paste 2 of LED lamp pearl 3 in this example exactly to can adhere to just when melting on component pin 30 is upper, in this embodiment light-emitting component 3 is LED lamp pearl 3. Specifically, the circuit board printed with the solder paste 2 is placed into SMT equipment by a carrier, and the LED lamp beads 3 are mounted on the circuit board. For products with large size specifications, the mechanical arm mode can be used for carrying out surface mounting on the 2 side of the circuit board.
S5, welding: taking out and waiting to weld circuit substrate 1, be equipped with solder paste 2 and LED lamp pearl 3 on circuit substrate 1, it is right to use laser solder paste 2 heats, makes the melting welding material 2 melt and adhere to on circuit substrate 1 and the components and parts, laser welding is realized through the laser instrument, puts into the laser instrument with circuit substrate 1, sweeps the mode of penetrating solder paste 2 through the laser, melts solder paste 2 in the twinkling of an eye, when waiting that melting welding material 2 cools off, the lamp pearl has just welded on circuit substrate 1, accomplishes the welding of lamp pearl. In order to improve the welding efficiency, a multi-head laser can be used, and all laser heads work simultaneously to weld. The wavelength and the welding time of the laser are adjusted according to different conditions such as the type of the solder paste 2 and the printing amount of the solder paste 2, corresponding parameters are adjusted, the welding temperature generated by the laser is 0-150 ℃, 0-130 ℃, 50-110 ℃ and the like, the welding temperature generated by the laser is 125 ℃ in the embodiment, the heating time of the fusion welding material 2 is 0.1-1 second, the laser can melt the solder paste 2 instantly, the damage of high temperature to components can be reduced to the maximum extent, the solder paste 2 can be rapidly shaped in a short time after the laser is moved away, welding fixation is realized, the process flow is simplified, and the working efficiency is improved.
S6: and (3) pressing the protective layer 7: taking out the protective layer 7, arranging a position avoiding hole 70 on the protective layer 7 corresponding to the component, and pressing the protective layer 7 and the circuit substrate 1 to expose the LED lamp bead 3 from the position avoiding hole 70 to obtain the display screen. One side of the protection layer 7 is slightly shorter than the circuit substrate 1, so that one edge of the circuit substrate 1 exposes the circuit interface of the circuit substrate 1.
S7: dispensing: glue 6 is used for filling the clearance between the avoiding hole 70 and the component, so that the LED lamp beads 3 are surrounded by the photosynthetic glue 6 or are wrapped and limited, in the embodiment, the LED lamp beads 3 are surrounded by the photosynthetic glue 6 without clearance to realize secondary limitation, and the combination of the LED lamp beads 3 and the circuit substrate 1 is more stable. The glue may be a photosynthetic glue, a shadowless glue (UVglue), a thermosetting glue, etc., the present invention is not limited specifically, in this embodiment, the glue is a shadowless glue, and the glue is dispensed by a dispensing device, which is a common device, and is cured by UV light.
S8: a second pressing step: and pressing one end of the flexible circuit board 4 corresponding to the interface circuit of the circuit substrate 1 to complete the circuit connection of the circuit substrate 1 and the flexible circuit board 4.
S9, an assembling step: and connecting the other end of the flexible circuit board 4 with a controller 5 to complete the manufacture of the flexible transparent LED display screen.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A manufacturing method of a flexible LED display screen is characterized by comprising the following steps:
a welding step: taking out the circuit substrate to be welded, wherein the circuit substrate is provided with a fusion welding material and a light-emitting component;
heating the fusion welding material at a fixed point by using laser, so that the fusion welding material is melted and attached to the circuit substrate and the light-emitting component;
and (3) a protective layer pressing step: and taking out the protective layer, arranging a position avoidance hole on the protective layer corresponding to the position of the component, and pressing the protective layer and the circuit substrate to obtain the display screen.
2. The method for manufacturing a flexible LED display screen according to claim 1, wherein the welding step further comprises:
printing a welding material: taking out the circuit board, and printing the fusion welding material on the welding part of the circuit board by using fusion welding material printing equipment;
a light-emitting component mounting step: and the light-emitting component is pasted or inserted corresponding to the fusion welding material, so that the light-emitting component is initially installed on the circuit board to form the circuit substrate.
3. The method of claim 2, wherein the step of printing the fusion welding material further comprises a step of etching a circuit:
and taking out the base material with the conducting layer, washing off the unnecessary conducting layer in a circuit etching mode, and reserving the necessary conducting layer to form the circuit board.
4. The method for manufacturing the flexible LED display screen according to claim 3, wherein the step of circuit etching further comprises a step of conductive layer lamination:
and taking out the base material and the conductive film, and laminating the conductive film and the transparent flexible base material to form the base material with the conductive layer.
5. The method for manufacturing a flexible LED display screen according to claim 1, wherein the step of welding further comprises:
flexible circuit board pressfitting step: pressing one end of the flexible circuit board corresponding to the circuit interface of the circuit substrate;
assembling: and connecting the other end of the flexible circuit board with a controller.
6. The method for manufacturing the flexible LED display screen according to claim 1, wherein a dispensing step after the protective layer laminating step is as follows: and filling the gap between the avoiding hole and the component by using glue.
7. The method according to any one of claims 1 to 6, wherein the solder material is solder paste, the components are LED beads, and the circuit substrate is a transparent flexible thin film circuit substrate.
8. The manufacturing method of the flexible LED display screen according to claim 1, wherein the laser welding temperature is 0-150 ℃.
9. The method as claimed in claim 8, wherein the laser welding temperature is 125 ℃.
10. The method for manufacturing the flexible LED display screen according to claim 1, wherein the time for heating the fusion welding material by the laser is 0.1-1 second.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910943628.8A CN110678010A (en) | 2019-09-30 | 2019-09-30 | Manufacturing method of flexible LED display screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910943628.8A CN110678010A (en) | 2019-09-30 | 2019-09-30 | Manufacturing method of flexible LED display screen |
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| CN110678010A true CN110678010A (en) | 2020-01-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910943628.8A Pending CN110678010A (en) | 2019-09-30 | 2019-09-30 | Manufacturing method of flexible LED display screen |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111698840A (en) * | 2020-05-08 | 2020-09-22 | 南昌欧菲显示科技有限公司 | Light-emitting module, manufacturing method thereof and electronic equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201639853U (en) * | 2009-11-17 | 2010-11-17 | 王定锋 | Printed circuit board for attaching insulating film after SMT placing components |
| CN107087352A (en) * | 2017-06-12 | 2017-08-22 | 大族激光科技产业集团股份有限公司 | A kind of method of the weldering component of patch on circuit boards |
| CN109585629A (en) * | 2018-11-21 | 2019-04-05 | 大连集思特科技有限公司 | A kind of LED display and preparation method thereof of transparent membrane composition |
| CN109658828A (en) * | 2018-11-27 | 2019-04-19 | 李成奎 | Transparent flexible display screen and its transparent circuitry |
-
2019
- 2019-09-30 CN CN201910943628.8A patent/CN110678010A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201639853U (en) * | 2009-11-17 | 2010-11-17 | 王定锋 | Printed circuit board for attaching insulating film after SMT placing components |
| CN107087352A (en) * | 2017-06-12 | 2017-08-22 | 大族激光科技产业集团股份有限公司 | A kind of method of the weldering component of patch on circuit boards |
| CN109585629A (en) * | 2018-11-21 | 2019-04-05 | 大连集思特科技有限公司 | A kind of LED display and preparation method thereof of transparent membrane composition |
| CN109658828A (en) * | 2018-11-27 | 2019-04-19 | 李成奎 | Transparent flexible display screen and its transparent circuitry |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111698840A (en) * | 2020-05-08 | 2020-09-22 | 南昌欧菲显示科技有限公司 | Light-emitting module, manufacturing method thereof and electronic equipment |
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Application publication date: 20200110 |