CN110676050A - Ceramic capacitor - Google Patents
Ceramic capacitor Download PDFInfo
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- CN110676050A CN110676050A CN201911043990.6A CN201911043990A CN110676050A CN 110676050 A CN110676050 A CN 110676050A CN 201911043990 A CN201911043990 A CN 201911043990A CN 110676050 A CN110676050 A CN 110676050A
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- metal
- electrode layer
- metal pin
- ceramic capacitor
- pin
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- 239000003985 ceramic capacitor Substances 0.000 title claims abstract description 33
- 239000002184 metal Substances 0.000 claims abstract description 128
- 229910052751 metal Inorganic materials 0.000 claims abstract description 128
- 239000010410 layer Substances 0.000 claims abstract description 66
- 239000004033 plastic Substances 0.000 claims abstract description 36
- 238000003466 welding Methods 0.000 claims abstract description 27
- 239000000919 ceramic Substances 0.000 claims abstract description 23
- 239000002356 single layer Substances 0.000 claims abstract description 21
- 239000000463 material Substances 0.000 claims abstract description 12
- 238000004891 communication Methods 0.000 claims abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 7
- 229910052737 gold Inorganic materials 0.000 claims description 7
- 239000010931 gold Substances 0.000 claims description 7
- 210000003739 neck Anatomy 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 239000004332 silver Substances 0.000 claims description 7
- 239000004593 Epoxy Substances 0.000 claims description 4
- 239000003063 flame retardant Substances 0.000 claims description 4
- 230000007704 transition Effects 0.000 claims description 4
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 3
- 239000010409 thin film Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 7
- 230000005684 electric field Effects 0.000 abstract description 3
- 239000003990 capacitor Substances 0.000 description 17
- 238000007747 plating Methods 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 5
- 239000010408 film Substances 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000009499 grossing Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002990 reinforced plastic Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000005253 cladding Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/236—Terminals leading through the housing, i.e. lead-through
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/258—Temperature compensation means
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention relates to a ceramic capacitor, which comprises a plastic package body 1, a first metal electrode layer 2, a second metal electrode layer 3, a first metal pin 4, a second metal pin 5 and a single-layer ceramic medium 6, wherein the plastic package body is made of a plastic material; the first metal electrode layer 2 and the second metal electrode layer 3 are respectively attached to two opposite surfaces of the single-layer ceramic medium 6; the first metal pin 4 and the second metal pin 5 are respectively in welding electrical communication with the first metal electrode layer 2 and the second metal electrode layer 3; the ceramic capacitor is SMD packaged. The invention sets electrode layers on two sides of the single-layer ceramic dielectric, connects the electrode layers through the pins, generates an electric field between the two electrode layers, and generates a capacitive effect between the two pins.
Description
Technical Field
The invention belongs to the technical field of capacitors, and particularly relates to a ceramic capacitor.
Background
At present, ceramic dielectric capacitors account for about 70% of the capacitor market, and become indispensable parts in electronic equipment, mainly including multilayer ceramic capacitors and single-layer ceramic capacitors.
The traditional laminated ceramic capacitor has the defects of more electrodes, more current loops between dielectric layers, large inductance and poor high-frequency characteristics.
The single-layer ceramic capacitor has better high-frequency characteristic, but the low, medium and high voltage single-layer ceramic capacitor basically adopts a plug-in type packaging structure, has larger volume and is inconvenient to assemble.
Disclosure of Invention
The present invention provides a ceramic capacitor for solving the above-mentioned problems.
The technical scheme for solving the technical problems is as follows: a ceramic capacitor comprises a plastic package body, a first metal electrode layer, a second metal electrode layer, a first metal pin, a second metal pin and a single-layer ceramic medium;
the first metal electrode layer and the second metal electrode layer are respectively attached to two opposite surfaces of the single-layer ceramic medium;
the first metal pin and the second metal pin are respectively in welding electrical communication with the first metal electrode layer and the second metal electrode layer;
the ceramic capacitor is SMD packaged.
The invention has the beneficial effects that: through setting up the electrode layer on individual layer ceramic dielectric both sides to connect the electrode layer through the pin, produce the electric field at two electrode layers, make and produce the capacitive effect between two pins, through selecting for use individual layer ceramic dielectric and SMD encapsulation, make ceramic capacitor have small, the product size is more standardized, assembly efficiency is high, the yields is high, and has the advantage that high frequency performance is good.
Further, the first metal pin and the second metal pin respectively comprise a connecting part, an extending part and a welding part which are integrally formed and connected, and the connecting part of the first metal pin and the second metal pin is flat and is respectively welded with the first metal electrode layer and the second metal electrode layer to be electrically conducted; the welding parts of the first metal pins and the second metal pins are flat-shaped, are parallel to the lower surface of the plastic package body, and are exposed out of the plastic package body from the lower part of the plastic package body.
The further technical scheme has the advantages that the height of the ceramic capacitor is reduced, and the volume is smaller; the contact area is increased, so that the welding is firmer; the exposed area of the welding part is increased, heat dissipation is more convenient, and the welding part and the welding pad are more convenient to weld.
Furthermore, the extending parts of the first metal pin and the second metal pin are flat-shaped, and the extending parts of the first metal pin and the second metal pin protrude out of the plastic package body from the left end surface and the right end surface.
The beneficial effect of adopting above-mentioned further technical scheme is that, further reinforcing radiating effect can also conveniently carry out the maintenance test through the extension of protrusion in the plastic-sealed body.
Furthermore, a gap capable of penetrating is formed between the extension parts of the first metal pin and the second metal pin and the plastic package body.
The further technical scheme has the advantages that air convection can be further formed, and the heat dissipation effect is enhanced; in addition, in some special occasions, welding is not needed, and simple electrical connection is conveniently carried out in a mode that a lead penetrates through a gap to be spliced.
Furthermore, the extending parts of the first metal pin and the second metal pin are provided with protrusions, and the protruding direction of the protrusions is the direction departing from the single-layer ceramic medium.
Adopt above-mentioned further technical scheme's beneficial effect be, further increase creepage distance, improve the high voltage resistance performance of condenser.
Furthermore, the protrusions of the extension parts of the first metal pin and the second metal pin are provided with corresponding necks in arc transition.
The technical scheme has the advantages that the processing and forming of the convex part are facilitated, and the high-frequency and high-voltage performance of the capacitor can be further improved.
Further, the extending portions of the first metal pin and the second metal pin have through holes near the edge portions of the plastic package body.
The technical scheme has the advantages that the filling density of the part of the reinforced plastic package body is further improved, the part is prevented from being filled unevenly, and the physical connection between the pins and the plastic package body is firmer.
Further, the first metal electrode layer and the second metal electrode layer are films made of copper, silver or gold materials, and the edges of the films are subjected to circular arc smoothing treatment; the single-layer ceramic medium is a horizontally arranged round sheet.
The adoption of the further technical scheme has the beneficial effects that the conductivity and the temperature stability of the electrode layer are improved; the high-frequency performance of the capacitor is further improved; the height of the capacitor is lower, and the capacitor is convenient to mount; the high-frequency and high-voltage performance of the capacitor can be further improved.
Further, a cushion layer integrally formed with the plastic package body is further arranged between the welding parts of the first metal pin and the second metal pin.
Adopt above-mentioned further technical scheme's beneficial effect to be, increase creepage distance, further improve the high voltage resistance performance of condenser.
Further, the edges of the first metal pin and the second metal pin are processed by round lead angle, the outer surfaces of the first metal pin and the second metal pin are provided with a copper plating layer, a silver plating layer or a gold plating layer, and the plastic package body is made of epoxy flame retardant material.
The high-frequency capacitor has the advantages that the high-frequency performance of the capacitor can be further improved, the temperature stability and the conductivity can be further improved, and the safety of the capacitor can be improved.
Drawings
FIG. 1 is a front view of an embodiment of the present invention;
FIG. 2 is a side view of an embodiment of the present invention;
FIG. 3 is a top view of an embodiment of the present invention;
FIG. 4 is a schematic diagram of an internal structure of an embodiment of the present invention;
FIG. 5 is a second schematic diagram of the internal structure of the embodiment of the present invention;
in the drawings, the components represented by the respective reference numerals are listed below:
1. the plastic package body comprises a plastic package body, 2, a first metal electrode layer, 3, a second metal electrode layer, 4, a first metal pin, 5, a second metal pin, 6, a single-layer ceramic medium, 7, a connecting part, 8, an extending part, 9, a welding part, 10, a protrusion, 11, a neck part, 12, a through hole, 13 and a cushion layer.
Detailed Description
The principles and features of this invention are described below in conjunction with the following drawings, which are set forth by way of illustration only and are not intended to limit the scope of the invention.
As shown in fig. 1, fig. 2, fig. 3, fig. 4, and fig. 5, a ceramic capacitor includes a plastic package body 1, a first metal electrode layer 2, a second metal electrode layer 3, a first metal pin 4, a second metal pin 5, and a single-layer ceramic dielectric 6;
the first metal electrode layer 2 and the second metal electrode layer 3 are respectively attached to two opposite surfaces of the single-layer ceramic medium 6;
the first metal pin 4 and the second metal pin 5 are respectively in welding electrical communication with the first metal electrode layer 2 and the second metal electrode layer 3;
the ceramic capacitor is SMD packaged.
SMD packaging, namely surface mount packaging. The assembly height of the traditional vertical single-layer ceramic capacitor is about 10-20 mm, and the assembly height of the embodiment is only about 1.5-2.5 mm;
the traditional vertical plug-in is manually assembled in 2-3 seconds, the embodiment is applied to the whole machine PCB paster assembly, the time is less than 1 second approximately, and the assembly efficiency is greatly improved; in the above embodiment, through setting up the electrode layer on individual layer ceramic dielectric both sides to connect the electrode layer through the pin, produce the electric field at two electrode layers, make and produce the capacitive effect between two pins, through selecting for use individual layer ceramic dielectric and SMD encapsulation, make ceramic capacitor have small, the product size is standardized more, assembly efficiency is high, the yields is high, and has the advantage that high frequency performance is good.
Optionally, as shown in fig. 4, the first metal pin 4 and the second metal pin 5 respectively include a connecting portion 7, an extending portion 8 and a welding portion 9 that are integrally connected, and the connecting portion 7 of the first metal pin 4 and the second metal pin 5 is flat and is electrically connected to the first metal electrode layer 2 and the second metal electrode layer 3 by welding; the welding parts 9 of the first metal pins 4 and the second metal pins 5 are flat, parallel to the lower surface of the plastic package body 1, and exposed out of the plastic package body 1 from the lower part of the plastic package body 1.
In the embodiment, the flat-plate structure is adopted, so that the height of the ceramic capacitor can be reduced, and the volume is smaller; the contact area is increased, so that the welding is firmer; the welding part is of a flat-plate-shaped structure, so that the exposed area of the welding part is increased, heat dissipation is more convenient, and the welding part and the welding pad are more convenient to weld.
Optionally, as shown in fig. 4, the extension portions 8 of the first metal pin 4 and the second metal pin 5 are flat, and the extension portions 8 of the first metal pin 4 and the second metal pin 5 protrude from the plastic package body 1 from left and right end surfaces.
In the above embodiment, the extension portion protrudes from the plastic package body, so that the heat dissipation effect is further enhanced, the ceramic capacitor can be conveniently used under the conditions of high voltage and high power consumption, and the maintenance test can be conveniently performed through the extension portion protruding from the plastic package body under the condition that the welding portion of the ceramic capacitor is welded on the PCB.
Optionally, as shown in fig. 4, a gap is formed between the extension portion 8 of the first metal pin 4 and the extension portion 8 of the second metal pin 5 and the plastic package body 1.
In the embodiment, through the arrangement of the penetrable gap, air convection can be further formed, and the heat dissipation effect is enhanced; in addition, the lead can conveniently penetrate through the gap, and in some special occasions, the simple electrical connection can be conveniently carried out in a manner that the lead penetrates through the gap to be spliced without welding.
Optionally, as shown in fig. 4, the extending portions 8 of the first metal pin 4 and the second metal pin 5 each have a protrusion 10, and a protruding direction of the protrusion 10 is a direction away from the single-layer ceramic medium 6.
In the above embodiment, the creepage distance is further increased by providing the protrusion, and the high voltage resistance of the capacitor is improved.
Optionally, as shown in fig. 5, the protrusions 10 of the extension portions 8 of the first metal pin 4 and the second metal pin 5 have corresponding necks 11 with circular arc transition.
In the above embodiment, the neck is arranged on the raised part of the pin, so that the strength of the neck is slightly less than that of the rest part, the raised part is convenient to machine and form, and the neck is in smooth transition to avoid the tip, so that the high-frequency and high-voltage performance of the capacitor can be further improved.
Optionally, as shown in fig. 5, the extending portions 8 of the first metal pin 4 and the second metal pin 5 have through holes 12 near the edge portion of the plastic package body 1.
In the embodiment, the through holes are arranged, so that the filling density of the part of the reinforced plastic package body is further improved, the part is prevented from being filled unevenly, and the physical connection between the pins and the plastic package body is firmer.
Optionally, as shown in fig. 5, the first metal electrode layer 2 and the second metal electrode layer 3 are films of copper, silver or gold material, and the edges of the films are subjected to circular arc smoothing treatment; the single-layer ceramic medium 6 is a horizontally arranged round sheet.
In the above embodiments, the conductive property and temperature stability of the electrode layer are improved by using a material such as copper, silver, or gold, and the high-frequency performance of the capacitor is further improved by forming the thin film into a circular arc-shaped smooth shape; the capacitor is lower in height and convenient to mount by adopting the horizontal single-layer ceramic dielectric; the ceramic dielectric is set to be circular, so that the sharp end is avoided, and the high-frequency and high-voltage performance of the capacitor can be further improved.
Optionally, as shown in fig. 4, a cushion layer 13 integrally formed with the plastic package body 1 is further disposed between the first metal pin 4 and the soldering portion 9 of the second metal pin 5.
In the above embodiment, the plastic package cushion layer is arranged between the welding parts of the two pins, so that the creepage distance is increased, and the high voltage resistance of the capacitor is further improved.
Optionally, as shown in the figure, the edges of the first metal pin 4 and the second metal pin 5 are subjected to round chamfering treatment, the outer surfaces of the first metal pin 4 and the second metal pin 5 are provided with a copper plating layer, a silver plating layer or a gold plating layer, and the plastic package body 1 is made of an epoxy flame retardant material.
In the above embodiment, through circular lead angle processing, avoid the pointed end, can further improve the high frequency performance of condenser, through setting up the cladding material, further improve temperature stability and electric conductive property, improve the security of condenser through adopting fire-retardant epoxy material.
In the present invention, the term "plurality" means two or more unless explicitly defined otherwise. The terms "mounted," "connected," "fixed," and the like are to be construed broadly, and for example, "connected" may be a fixed connection, a removable connection, or an integral connection; "coupled" may be direct or indirect through an intermediary. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", and the like indicate orientations or positional relationships based on those shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the referred device or unit must have a specific direction, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
In the description herein, the description of the terms "one embodiment," "some embodiments," "specific embodiments," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (10)
1. A ceramic capacitor is characterized by comprising a plastic package body (1), a first metal electrode layer (22), a second metal electrode layer (3), a first metal pin (4), a second metal pin (5) and a single-layer ceramic medium (6);
the first metal electrode layer (2) and the second metal electrode layer (3) are respectively attached to two opposite surfaces of the single-layer ceramic medium (6);
the first metal pin (4) and the second metal pin (5) are respectively in welding electrical communication with the first metal electrode layer (2) and the second metal electrode layer (3);
the ceramic capacitor is SMD packaged.
2. A ceramic capacitor as claimed in claim 1, wherein the first metal lead (4) and the second metal lead (5) respectively comprise a connecting portion (7), an extending portion (8) and a welding portion (9) which are integrally connected, and the connecting portion (7) of the first metal lead (4) and the second metal lead (5) is in a flat plate shape and is in welding electrical conduction with the first metal electrode layer (2) and the second metal electrode layer (3); the welding parts (9) of the first metal pins (4) and the second metal pins (5) are flat-plate-shaped, are parallel to the lower surface of the plastic package body (1), and are exposed out of the plastic package body (1) from the lower part of the plastic package body (1).
3. The ceramic capacitor as claimed in claim 2, wherein the extension portions (8) of the first metal pin (4) and the second metal pin (5) are flat, and the extension portions (8) of the first metal pin (4) and the second metal pin (5) protrude from the plastic package body (1) from left and right end surfaces.
4. A ceramic capacitor as claimed in claim 3, wherein there is a gap between the extension (8) of the first metal pin (4) and the second metal pin (5) and the plastic package body (61).
5. A ceramic capacitor as claimed in claim 3, characterized in that the extensions (8) of the first metal lead (4) and the second metal lead (5) each have a protrusion (10), the protrusion (10) protruding in a direction away from the single layer of ceramic dielectric (6).
6. A ceramic capacitor as claimed in claim 5, characterized in that the projections (10) of the extensions (8) of the first metal pin (4) and the second metal pin (5) have corresponding necks (11) which transition in the shape of a circular arc.
7. A ceramic capacitor as claimed in claim 3, characterized in that the extensions (8) of the first metal lead (4) and the second metal lead (5) have through holes (12) near the edge of the plastic package body (1).
8. A ceramic capacitor as claimed in claim 1, wherein the first metal electrode layer (2) and the second metal electrode layer (3) are thin films of copper, silver or gold material, and the edges of the thin films are smoothed in the shape of a circular arc; the single-layer ceramic medium (6) is a horizontally arranged round sheet.
9. A ceramic capacitor as claimed in claim 1, characterized in that a backing layer (13) is provided between the soldering portions (9) of the first metal lead (4) and the second metal lead (5), which backing layer is formed integrally with the plastic-encapsulated body (1).
10. The ceramic capacitor according to claim 1, wherein the edges of the first metal pin (4) and the second metal pin (5) are rounded and chamfered, the outer surfaces of the first metal pin (4) and the second metal pin (5) are plated with copper, silver or gold, and the plastic package body (1) is made of epoxy flame retardant material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911043990.6A CN110676050A (en) | 2019-10-30 | 2019-10-30 | Ceramic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911043990.6A CN110676050A (en) | 2019-10-30 | 2019-10-30 | Ceramic capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110676050A true CN110676050A (en) | 2020-01-10 |
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ID=69085173
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911043990.6A Withdrawn CN110676050A (en) | 2019-10-30 | 2019-10-30 | Ceramic capacitor |
Country Status (1)
| Country | Link |
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| CN (1) | CN110676050A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113185280A (en) * | 2021-04-27 | 2021-07-30 | 四川海祥电子科技有限公司 | Preparation method of high-Qf microwave dielectric material |
-
2019
- 2019-10-30 CN CN201911043990.6A patent/CN110676050A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113185280A (en) * | 2021-04-27 | 2021-07-30 | 四川海祥电子科技有限公司 | Preparation method of high-Qf microwave dielectric material |
| CN113185280B (en) * | 2021-04-27 | 2022-06-28 | 四川海祥电子科技有限公司 | Preparation method of high-Qf microwave dielectric material |
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Application publication date: 20200110 |