CN105914036A - Multilayer ceramic capacitor of low ESL - Google Patents
Multilayer ceramic capacitor of low ESL Download PDFInfo
- Publication number
- CN105914036A CN105914036A CN201610403047.1A CN201610403047A CN105914036A CN 105914036 A CN105914036 A CN 105914036A CN 201610403047 A CN201610403047 A CN 201610403047A CN 105914036 A CN105914036 A CN 105914036A
- Authority
- CN
- China
- Prior art keywords
- ceramic core
- insulation crust
- multilayer ceramic
- low esl
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003985 ceramic capacitor Substances 0.000 title claims abstract description 21
- 239000000919 ceramic Substances 0.000 claims abstract description 44
- 238000003466 welding Methods 0.000 claims abstract description 32
- 238000009413 insulation Methods 0.000 claims description 36
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 239000003990 capacitor Substances 0.000 abstract description 6
- 238000005452 bending Methods 0.000 abstract description 5
- 230000003247 decreasing effect Effects 0.000 abstract 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract 1
- 230000007423 decrease Effects 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Capacitors (AREA)
Abstract
A multilayer ceramic capacitor of a low ESL comprises a ceramic core body, two lead wires conductively connected to the ceramic core body and an insulating shell wrapping the ceramic core body. The lead wires are an ''L''-shaped structure formed by a current-conducting plate and a welding plate which are vertically connected to each other. The current-conducting plate and the ceramic core body are conductively connected and are covered by the insulating shell. The welding plate is located at a bottom of the insulating shell and possesses a welding segment which is laterally stretched out of the insulating shell. Through using the ''L''-shaped lead wires, lead wire lengths are greatly reduced and bending angles of the lead wires are decreased so that the ESL can be greatly reduced, a self-resonant frequency of the capacitor is increased and the capacitor can be applied in a high frequency circuit.
Description
Technical field
The present invention relates to a kind of multilayer ceramic capacitor.
Background technology
As depicted in figs. 1 and 2, multilayer ceramic capacitor, mainly include ceramic core 1, two lead-in wire 2 and absolutely
Edge shell 3, ceramic core 1 includes electrode slice in parallel interval and staggered some first, second, sets
Outside put in first, second that electrode slice in the electrolyte and each first between electrode slice is conductively connected first
The second external electrode sheet that electrode slice is conductively connected with each the second inner electrode sheet, usual ceramic core 1 is rectangular
Body, first, second dispatch from foreign news agency pole piece is arranged in two opposite faces of ceramic core 1, two lead-in wires 2 respectively with first,
The second external electrode sheet is conductively connected, and insulation crust 3 then wraps up ceramic core, insulation crust 3 substantially with
The cuboid that ceramic core 1 shape is suitable.
As depicted in figs. 1 and 2, the multi-layer ceramic capacitance of E shell encapsulating structure, the lead-in wire 2 of this electric capacity is from pottery
The bottom surface of core body 1 extends to side, and stretches out from side, then bending forms pad to bottom, causes and draws
The increase of line length；The standard packaging of E shell a size of 7.3mm × 4.3mm × 4.1mm, the length of lead-in wire 2
It is about 2.8mm.In theory for lead-in wire, 1mm length about produces the inductance value of 1nH, therefore electricity
Sense about increases 2.8nH.On the other hand, there is the bending of 90 °, many places, in altofrequency, big current bar in lead-in wire 2
Under part, the exit of bending can increase eddy current, and directly increases the equivalent inductance (ESL) of capacitor.ESL's
Increase the decline directly resulting in capacitor self-resonant frequency, make capacitor cannot be applied in high-frequency circuit.
Summary of the invention
It is an object of the invention to for the deficiencies in the prior art, it is provided that a kind of simple in construction, be easy to welding and low
The multilayer ceramic capacitor of ESL.
The purpose of the present invention realizes by following technical solution:
The multilayer ceramic capacitor of a kind of low ESL, including ceramic core, is conductively connected on ceramic core
Two lead-in wires, the insulation crust of parcel ceramic core, it is characterised in that: go between as by leading of being mutually connected vertically
Electroplax and " L " shape structure of welded plate composition, conductive plate is conductively connected with ceramic core and is covered by insulation crust
Lid, welded plate is positioned at the bottom of insulation crust and has the welding section extending laterally insulation crust.
Further, the bottom surface of described welded plate and the bottom surface of insulation crust are equal.
Further, the front end edge of described welding section is formed with concaveconvex structure.
Further, described ceramic core is cuboid, and described insulation crust is substantially fitted mutually with ceramic core
The cuboid joined.
Further, described in two, the conductive plate of lead-in wire is attached on two opposite faces of described ceramic core respectively,
Two opposite faces of described ceramic core are respectively arranged with the dispatch from foreign news agency pole piece being conductively connected with described conductive plate.
Further, described conductive plate is suitable with the size of two opposite faces of described ceramic core.
Further, described conductive plate and welded plate are one-body molded.
Further, described conductive plate and welded plate are rectangle.
The multilayer ceramic capacitor of a kind of low ESL, including ceramic core, is conductively connected on ceramic core
Two lead-in wires, the insulation crust of parcel ceramic core, it is characterised in that: conductive plate that lead-in wire includes vertically extending,
Connect conductive plate horizontal-extending horizontal welding fishplate bar and connect horizontal welding fishplate bar the vertical welding vertically extended
Plate, conductive plate is conductively connected with ceramic core and is covered by insulation crust, and horizontal welding fishplate bar is positioned at insulation crust
Bottom, vertical welded plate is positioned at the side of insulation crust, and at least bottom surface of horizontal welding fishplate bar and vertically weldering
The lateral surface of fishplate bar is exposed to outside insulation crust.
Further, described vertical welded plate is formed the fill solder hole near horizontal welding fishplate bar, is used for
Increase the loading of solder, improve weld strength.
There is advantages that
Compared with prior art, embodiment one use conductive plate that the lead-in wire of " L " shape and embodiment two use,
Horizontal welding fishplate bar and the structure of vertical welded plate, not only substantially reduce wire length, and decrease lead-in wire
Bending angle, thus can be substantially reduced ESL, improve the self-resonant frequency of electric capacity, make electric capacity can be applicable to
In high-frequency circuit；And the welding section of the welded plate of embodiment one extends laterally insulation crust, and embodiment two
Vertical welded plate, not only make capacitor be applicable to reflow soldering process, and be applicable to manual welding, and can
Observe welding quality easily；The front end edge of welding section forms concaveconvex structure and the fill solder hole of embodiment two,
The contact area of solder and welding section can be increased, increase adhesion amount and the adhesive strength of solder.
Accompanying drawing explanation
Below in conjunction with the accompanying drawings the present invention is described in further detail.
Fig. 1 is the axonometric chart of existing ceramic capacitor.
Fig. 2 is the component decomposition map of existing ceramic capacitor.
Fig. 3 is the axonometric chart of embodiment one ceramic core and lead-in wire.
Fig. 4 is the axonometric chart of embodiment one.
Fig. 5 is the axonometric chart of embodiment two.
Fig. 6 is the axonometric chart of embodiment two ceramic core and lead-in wire.
Detailed description of the invention
Embodiment one, with reference to shown in Fig. 3 and Fig. 4, the multilayer ceramic capacitor of a kind of low ESL, including pottery
Porcelain core body 5, two lead-in wire 6 and insulation crust 7.
Ceramic core 5 is cuboid, is mainly made up of electrolyte, interior electrode slice and dispatch from foreign news agency pole piece, two dispatches from foreign news agency
Pole piece is arranged on two opposite faces of ceramic core 5, for known prior art, the most no longer describes in detail.
" L " shape structure that lead-in wire 6 is formed in one, by the conductive plate 61 being mutually connected vertically and welded plate 62
Composition, conductive plate 61 and welded plate 62 are substantially rectangular, and conductive plate 61 has and is connected with welded plate 62
Protuberance 611.
The conductive plate 61 of two lead-in wires 6 is attached to respectively on two opposite faces of ceramic core 5 and leads with dispatch from foreign news agency pole piece
Electrical connection, the welded plate 62 of lead-in wire 6 is positioned at the bottom of insulation crust 7 and has from insulation crust 7 lateral
The welding section 62a stretched out, the bottom surface of welded plate 62 is equal with the bottom surface of insulation crust 7, and is exposed to insulation
Outside shell 7, the front end edge of welding section 62a is formed with concaveconvex structure 621, i.e. insulation crust 7 and wraps up pottery
Core body 5, conductive plate 61 and the local top surface of welded plate 62 and side, insulation crust 7 substantially with ceramic core
The cuboid that body 5 is suitable.
Embodiment two, its basic structure is identical with embodiment one, differs primarily in that the structure of lead-in wire 8, should
Lead-in wire 8 includes the conductive plate 81 vertically extended, connects conductive plate 81 horizontal-extending horizontal welding fishplate bar 82
With connect horizontal welding fishplate bar 82 the vertical welded plate 83 that vertically extends, conductive plate 81 is led with ceramic core 5
Electrical connection is also covered by insulation crust 7, and horizontal welding fishplate bar 82 is positioned at the bottom of insulation crust 7, vertically welds
Plate 83 is positioned at the side of insulation crust 7, and at least bottom surface of horizontal welding fishplate bar 82 and vertical welded plate 83
Lateral surface is exposed to outside insulation crust 7, vertical welded plate 83 is formed near horizontal welding fishplate bar 82
Three fill solder holes 831, fill solder hole 831 arranges along the width of vertical welded plate 83.
The above, only presently preferred embodiments of the present invention, therefore can not limit what the present invention implemented with this
Scope, the equivalence change i.e. made according to scope of the present invention patent and description and modification, all should be still
Remain within the scope of the patent.
Claims (10)
1. a multilayer ceramic capacitor of low ESL, including ceramic core, is conductively connected on ceramic core
Two lead-in wires, the insulation crust of parcel ceramic core, it is characterised in that: go between as by being mutually connected vertically
Conductive plate and " L " shape structure of welded plate composition, conductive plate and ceramic core are conductively connected and by insulation crust
Covering, welded plate is positioned at the bottom of insulation crust and has the welding section extending laterally insulation crust.
The multilayer ceramic capacitor of a kind of low ESL the most according to claim 1, it is characterised in that: institute
The bottom surface stating welded plate is equal with the bottom surface of insulation crust.
The multilayer ceramic capacitor of a kind of low ESL the most according to claim 1, it is characterised in that: institute
The front end edge stating welding section is formed with concaveconvex structure.
4. according to the multilayer ceramic capacitor of a kind of low ESL described in claim 1 or 2 or 3, its feature
It is: described ceramic core is cuboid, substantially suitable with ceramic core rectangular of described insulation crust
Body.
The multilayer ceramic capacitor of a kind of low ESL the most according to claim 4, it is characterised in that: two
The conductive plate of described lead-in wire is attached on two opposite faces of described ceramic core respectively, the two of described ceramic core
Opposite face is respectively arranged with the dispatch from foreign news agency pole piece being conductively connected with described conductive plate.
The multilayer ceramic capacitor of a kind of low ESL the most according to claim 5, it is characterised in that: institute
State conductive plate suitable with the size of two opposite faces of described ceramic core.
7. according to the multilayer ceramic capacitor of a kind of low ESL described in claim 1 or 2 or 3, its feature
It is: described conductive plate and welded plate are one-body molded.
8. according to the multilayer ceramic capacitor of a kind of low ESL described in claim 1 or 2 or 3, its feature
It is: described conductive plate and welded plate are rectangle.
9. a multilayer ceramic capacitor of low ESL, including ceramic core, is conductively connected on ceramic core
Two lead-in wires, the insulation crust of parcel ceramic core, it is characterised in that: lead-in wire includes the conduction that vertically extends
Plate, connect conductive plate horizontal-extending horizontal welding fishplate bar and connect horizontal welding fishplate bar and vertically extend vertical
Welded plate, conductive plate is conductively connected with ceramic core and is covered by insulation crust, and horizontal welding fishplate bar is positioned at insulation
The bottom of shell, vertical welded plate is positioned at the side of insulation crust, and at least bottom surface of horizontal welding fishplate bar and perpendicular
The lateral surface of straight welded plate is exposed to outside insulation crust.
The multilayer ceramic capacitor of a kind of low ESL the most according to claim 9, it is characterised in that:
The fill solder hole near horizontal welding fishplate bar it is formed with on described vertical welded plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610403047.1A CN105914036A (en) | 2016-06-08 | 2016-06-08 | Multilayer ceramic capacitor of low ESL |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610403047.1A CN105914036A (en) | 2016-06-08 | 2016-06-08 | Multilayer ceramic capacitor of low ESL |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105914036A true CN105914036A (en) | 2016-08-31 |
Family
ID=56749959
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610403047.1A Pending CN105914036A (en) | 2016-06-08 | 2016-06-08 | Multilayer ceramic capacitor of low ESL |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105914036A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110270733A (en) * | 2019-05-06 | 2019-09-24 | 福建火炬电子科技股份有限公司 | A kind of welding fixture and welding method of ceramic capacitor |
| CN110277243A (en) * | 2018-03-15 | 2019-09-24 | 卓英社有限公司 | Multilayer ceramic capacitor array |
| CN111048311A (en) * | 2018-10-12 | 2020-04-21 | 太阳诱电株式会社 | Ceramic electronic component, method for producing same, and ceramic electronic component-mounted circuit board |
| CN112133561A (en) * | 2020-10-26 | 2020-12-25 | 广州天极电子科技有限公司 | Lead-bondable multilayer capacitor and manufacturing method |
| CN113711323A (en) * | 2019-04-25 | 2021-11-26 | 阿维科斯公司 | Low inductance assembly |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000049042A (en) * | 1998-07-31 | 2000-02-18 | Kyocera Corp | Capacitor device |
| JP2000243660A (en) * | 1999-02-22 | 2000-09-08 | Murata Mfg Co Ltd | Ceramic electronic component |
| US6515844B1 (en) * | 1998-05-28 | 2003-02-04 | Murata Manufacturing Co., Ltd. | Electronic part |
| JP2003124059A (en) * | 2001-10-16 | 2003-04-25 | Tdk Corp | Capacitor and power supply device |
| CN205692698U (en) * | 2016-06-08 | 2016-11-16 | 福建火炬电子科技股份有限公司 | A kind of multilayer ceramic capacitor of low ESL |
-
2016
- 2016-06-08 CN CN201610403047.1A patent/CN105914036A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6515844B1 (en) * | 1998-05-28 | 2003-02-04 | Murata Manufacturing Co., Ltd. | Electronic part |
| JP2000049042A (en) * | 1998-07-31 | 2000-02-18 | Kyocera Corp | Capacitor device |
| JP2000243660A (en) * | 1999-02-22 | 2000-09-08 | Murata Mfg Co Ltd | Ceramic electronic component |
| JP2003124059A (en) * | 2001-10-16 | 2003-04-25 | Tdk Corp | Capacitor and power supply device |
| CN205692698U (en) * | 2016-06-08 | 2016-11-16 | 福建火炬电子科技股份有限公司 | A kind of multilayer ceramic capacitor of low ESL |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110277243A (en) * | 2018-03-15 | 2019-09-24 | 卓英社有限公司 | Multilayer ceramic capacitor array |
| CN111048311A (en) * | 2018-10-12 | 2020-04-21 | 太阳诱电株式会社 | Ceramic electronic component, method for producing same, and ceramic electronic component-mounted circuit board |
| CN111048311B (en) * | 2018-10-12 | 2021-12-31 | 太阳诱电株式会社 | Ceramic electronic component, method for producing same, and ceramic electronic component-mounted circuit board |
| CN113711323A (en) * | 2019-04-25 | 2021-11-26 | 阿维科斯公司 | Low inductance assembly |
| US11621129B2 (en) | 2019-04-25 | 2023-04-04 | KYOCERA AVX Components Corporation | Low inductance component |
| US12051548B2 (en) | 2019-04-25 | 2024-07-30 | KYOCERA AVX Components Corporation | Low inductance component |
| CN110270733A (en) * | 2019-05-06 | 2019-09-24 | 福建火炬电子科技股份有限公司 | A kind of welding fixture and welding method of ceramic capacitor |
| CN110270733B (en) * | 2019-05-06 | 2024-04-02 | 福建火炬电子科技股份有限公司 | Welding jig and welding method for ceramic capacitor |
| CN112133561A (en) * | 2020-10-26 | 2020-12-25 | 广州天极电子科技有限公司 | Lead-bondable multilayer capacitor and manufacturing method |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160831 |