CN110637364A - 改进的引线框系统 - Google Patents

改进的引线框系统 Download PDF

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CN110637364A
CN110637364A CN201680085798.1A CN201680085798A CN110637364A CN 110637364 A CN110637364 A CN 110637364A CN 201680085798 A CN201680085798 A CN 201680085798A CN 110637364 A CN110637364 A CN 110637364A
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leadframe strip
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马敏晖
胡清华
A·T·金-赛恩
R·D·小罗尔达
邓星亮
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Texas Instruments Inc
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Abstract

一种具有波纹锯切道金属(504、506)的引线框条(500)，其中所述波纹锯切道金属(510、512)由所述引线框条金属的部分厚度构成。一种具有波纹锯切道金属(504、506)的引线框条(500)，其中所述波纹锯切道金属(510、512)由所述引线框条金属的一半厚度构成。

Description

改进的引线框系统
技术领域
本公开涉及集成电路封装领域。更具体地说，本公开涉及引线框。
背景技术
通常为半导体装置提供主要由铜或铜合金制成的引线框条，以便提供稳定支撑来将集成电路(IC)芯片牢固地定位在封装内以及通过电路板将IC芯片电连接到各种其它组件。引线框在大小方面不同。引线框的大小通常取决于IC芯片的大小以及与IC芯片进行的连接的数目。连接的数目可不同，从几个到超过一百个。
如图1中所说明，引线框条100可由通过锯切道110连接在一起的多个引线框101构成。
如图2A中所说明，引线框201通常由多个焊线垫102构成，所述多个焊线垫彼此电隔离且与居中定位的IC芯片垫104电隔离。IC芯片垫104提供IC芯片202(图2B)可安装于其上的表面。焊线垫102通常通过系结条108连接到锯切划痕110。焊线206(图2B和2C)通常用于将IC芯片202上的个别接合垫电连接到个别焊线垫102。图2A中的说明性实例具有四个焊线102，但引线框201可具有任何数目的焊线垫102。一些引线框201具有超过一百个的焊线垫102。
图3A中说明替代的引线框301。此引线框301通常被称为引线上芯片(COL)引线框。如图3A中所展示，COL没有IC芯片垫104。COL仅具有焊线垫102。如图3B的俯视图和图3C的横截面中所说明，IC芯片302安装在焊线垫102中的至少两个焊线垫的边缘顶部上。不导电的支撑件304为IC芯片302提供支撑，且还将IC芯片302与焊线垫102的边缘电隔离。
锯切道110和系结条108通常由引线框101之间的薄金属条构成。锯切道110在裸片附接(IC芯片与引线框的附接)、线接合(将IC接合垫线连接到焊线垫)和灌注(利用封装材料包封IC芯片、焊线和引线框101)期间支撑引线框101。接着，沿着锯切道110的锯切用以分离个别已封装IC芯片。
图4A、4B、4C、4D和4E说明具有四个焊线垫102的用于IC芯片201的引线框。
图4A是引线框400的俯视图。实例引线框400容纳四个IC芯片400与四个居中定位的IC芯片垫104的附接。在此说明性实例中，IC芯片垫104的每一侧上存在一个焊线垫102。焊线垫102通过引线框中的槽形开口106与IC芯片垫104分开。IC芯片垫104和焊线垫102用全厚度的引线框金属形成。锯切分道110以及将IC芯片垫104和焊线垫102连接到锯切道110的系结条108通常用部分厚度的引线框金属(通常一半厚度)形成。
如沿着图4A中的切割线424获取的横截面中展示，全厚度IC芯片垫104在底部侧附接到引线框支撑带112。将IC芯片垫104连接到锯切划痕110的半厚度系结条108与引线框支撑带112分开一定空隙114。
如沿着图4A中的切割线422获取的横截面中展示，全厚度焊线垫102在底部侧附接到引线框支撑带112。将焊线垫102连接到锯切道110的半厚度系结条108与引线框支撑带112分开一定空隙114。
如沿着图4A中的切割线420获取的横截面中展示，全厚度焊线垫102在底部侧附接到引线框支撑带112。半厚度锯切道110与引线框带112分开一定空隙114。
如沿着图4A中的切割线426获取的横截面中展示，半厚度锯切道110与引线框支撑带112分开一定空隙114。
图5A中的引线框的平面图展示通过沿着水平锯切道504且沿着竖直锯切道502锯切移除的引线框材料分离已封装裸片520，如图5B、5C和5D中展示。
图5C是贯穿一个已封装裸片520的横截面。所述横截面贯穿居中定位的IC芯片垫104和两个焊线垫102。IC芯片(裸片)202安装于居中定位的IC芯片垫104上。焊线206将IC芯片202上的接合垫电连接到焊线垫102。
在IC芯片202安装于IC芯片垫104上且通过焊线206连接到焊线垫102之后，将引线框201、IC芯片202、焊线垫102和焊线206包封于封装材料508中以提供机械稳定性和抵抗环境损害的保护。接着，从引线框400的底部移除第一引线框支撑带，且将第二引线框支撑带512施用于封装材料508的顶部表面。
封装材料508、半厚度锯切道110金属和半厚度系结条108金属从划痕道502和504锯切以分离已封装裸片520，如图5C中所展示。
图5D展示沿着图5B中的切割线516获取的贯穿两个焊线垫102的两个已封装裸片520的横截面。已封装裸片520附接到第二引线框带512。
图5E展示沿着切割线518获取的贯穿居中定位的IC芯片垫104和所附接IC芯片202的两个已封装裸片520的横截面。已封装裸片520附接到第二引线框带512。
图5F展示沿着图5B中的切割线522获取的在锯切之后贯穿锯切道502和504的横截面。如所展示，所有封装材料508、半厚度锯切划痕金属110和半厚度系结条金属108都通过锯切移除。仅第二引线框支撑带512在锯切之后保持在锯切划痕502和504区中。
发明内容
以下呈现简化概述，以便提供对本发明的一或多个方面的基本理解。此概述并非本发明的广泛概述，且既非意图识别本发明的关键或重要元件，也非意图划定其范围。实际上，概述的主要目的是以简化形式呈现本发明的一些概念，作为稍后呈现的更详细描述的序言。
一种具有波纹锯切道金属的引线框条，其中所述波纹锯切道金属由部分厚度的引线框条金属构成。一种具有波纹锯切道金属的引线框条，其中所述波纹锯切道金属由半厚度的引线框条金属构成。
附图说明
图1(现有技术)是引线框条的平面图。
图2A和2B(现有技术)是引线框和IC芯片垫的平面图，其中4个封装引线安装于引线框上。
图2C(现有技术)是沿着图2B中的平面图中的切割线的横截面。
图3A和3B(现有技术)是具有6个封装引线的引线上芯片IC封装的平面图。
图3C(现有技术)是沿着图3B中的平面图中的切割线的横截面。
图4A(现有技术)是具有4个引线框的引线框条的平面图。
图4B、4C、4D和4E(现有技术)是沿着图4A中的平面图中的切割线的横截面。
图5A(现有技术)是具有4个引线框的引线框条的平面图。
图5B(现有技术)是通过沿着图5A的锯切道锯切而分离的两个引线框的平面图。
图5C、5D、5E和5F(现有技术)是沿着图5B中的平面图中的切割线的横截面。
图6是具有9个引线框且具有实施例波纹锯切道的引线框条的平面图。
图7A、7B和7C是沿着贯穿图6中的平面图中的实施例锯切道的切割线的横截面。
具体实施方式
参考附图来描述本公开的实施例。各图未按比例绘制，且各图仅提供来说明本公开。以下参考用于说明的实例应用来描述实施例的若干方面。应理解，阐述众多具体细节、关系和方法以提供对本公开的理解。然而，相关领域的技术人员应易于认识到，本公开可在无所述具体细节中的一或多个的情况下或利用其它方法实践。在其它情况下，未详细展示众所周知的结构或操作以避免混淆本公开。实施例不限于动作或事件的所说明排序，因为一些动作可按不同次序和/或与其它动作或事件同时发生。此外，并非需要所有所说明动作或事件来实施根据本公开的方法。
图6和7中说明实例改进引线框条600。图6A中展示的引线框条600的部分由通过半厚度金属竖直锯切道602和半厚度金属水平锯切道604连接在一起的9个引线框606(图6B)构成。
如沿着切割线622获取的贯穿图6A中的水平波纹锯切道604的横截面图7B和沿着切割线620获取的贯穿竖直波纹锯切道602的图7C中展示，波纹锯切道602和604中的半厚度金属具有波纹以使得波纹划痕道602和604中的半厚度金属的一部分附接到引线框支撑带112。实施例半厚度金属波纹锯切道602和604的第一部分610与第一引线框支撑带112分开一定空隙114，且实施例半厚度金属波纹锯切道602和604的第二部分612附接到第一引线框支撑带112的表面。半厚度金属锯切道602和604的波纹大体上提高引线框在线接合期间以及在封装材料注射期间的机械稳定性。通过减少因引线框弯曲时引起的应力所致的与芯片上的接合垫剥离或与封装引线剥离的球焊接头的数目，引线框增加的强度会提高成出率。
锯切道602和604中的半厚度金属的波纹为波纹锯切道602和604添加显著强度和刚度，且几乎不增大用于制造引线框条600的金属量且几乎不增大在分离已封装裸片时锯切透的金属量。这保持了引线框制造成本，且还避免锯条的过度磨损和更换。
实施例经图解说明为使用具有四个焊线垫的引线框。此想法具通用性，且可用于通过具有任何数目的焊线垫的引线框改进引线框条。
尽管上文已描述本公开的各种实施例，但应理解，它们仅通过举例而非限制的方式呈现。在不脱离本公开的精神或范围的情况下，可根据本文中的公开内容对所公开实施例进行许多改变。因此，本发明的广度和范围不应受上文描述实施例中任一个的限制。实际上，应根据所附权利要求书和其等同物来限定本公开的范围。

Claims (15)

1.一种具有由波纹金属构成的波纹锯切道的引线框条，其中所述波纹锯切道的一部分附接到引线框条支撑带。
2.根据权利要求1所述的引线框条，其进一步包括通过系结条耦合到所述波纹锯切道的多个引线框，其中所述引线框的厚度是全引线框条金属厚度，且其中所述波纹金属和所述系结条的厚度是部分引线框条金属厚度。
3.根据权利要求1所述的引线框条，其进一步包括通过系结条耦合到所述锯切道的多个引线框，其中所述引线框的厚度是全引线框条金属厚度，且其中所述波纹金属和所述系结条的厚度是半引线框条金属厚度。
4.根据权利要求1所述的引线框条，其进一步包括通过所述波纹锯切道耦合在一起的多个引线框。
5.根据权利要求4所述的引线框条，其中所述引线框含有一个IC芯片垫且含有多个焊线垫。
6.根据权利要求4所述的引线框条，其中所述引线框含有多个焊线垫，且不含IC芯片垫。
7.根据权利要求5所述的引线框条，其中所述IC芯片垫和所述多个焊线垫经形成具有全引线框条金属厚度，且附接到所述引线框条支撑带。
8.根据权利要求1所述的引线框条，其中所述引线框条由铜或铜合金构成。
9.一种引线框条，其包括：
引线框条支撑带；
多个波纹锯切道，其由具有引线框条金属的部分厚度的波纹金属构成，且其中所述波纹锯切道的第一部分与所述引线框条支撑带分开一定空隙，且其中所述波纹锯切道的第二部分附接到所述引线框条支撑带。
多个引线框，其在所有侧上耦合到波纹锯切道；以及
每个引线框内的多个焊线垫，其由全厚度的引线框条金属构成，且附接到所述引线框条支撑带以及耦合到所述波纹锯切道。
10.根据权利要求9所述的引线框条，其中所述波纹锯切道的所述部分厚度是所述引线框条金属厚度的厚度的30％到60％。
11.根据权利要求9所述的引线框条，其中所述波纹锯切道的所述部分厚度是所述引线框条金属厚度的厚度的约一半。
12.根据权利要求9所述的引线框条，其进一步包括IC芯片垫，所述IC芯片垫由全引线框条金属厚度构成，且耦合到所述波纹锯切道以及与所述焊线垫电隔离。
13.根据权利要求12所述的引线框条，其中所述IC芯片垫通过系结条耦合到所述波纹锯切道，其中所述系结条由部分厚度的引线框条金属构成。
14.根据权利要求9所述的引线框条，其进一步包括具有所述引线框条金属的部分厚度的系结条，且其中所述系结条将所述焊线垫耦合到所述波纹锯切道。
15.根据权利要求9所述的引线框条，其中所述引线框条由铜或铜合金构成。
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