CN110614850A - Liquid ejecting head and liquid ejecting apparatus - Google Patents
Liquid ejecting head and liquid ejecting apparatus Download PDFInfo
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- CN110614850A CN110614850A CN201910515487.XA CN201910515487A CN110614850A CN 110614850 A CN110614850 A CN 110614850A CN 201910515487 A CN201910515487 A CN 201910515487A CN 110614850 A CN110614850 A CN 110614850A
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- China
- Prior art keywords
- head unit
- head
- liquid ejecting
- liquid
- contact
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
Abstract
The invention provides a liquid ejecting head and a liquid ejecting apparatus which suppress the rise of the temperature inside the head unit. The liquid ejecting head includes: a head unit including a liquid ejecting portion that ejects liquid from a nozzle, a drive circuit that drives the liquid ejecting portion, and a housing in which a space for storing the liquid is formed; a fixing plate which is in contact with the head unit on the nozzle side in the head unit; and a support body that is in contact with the fixed plate and supports the head unit, the support body being formed of a material having a higher thermal conductivity than the housing.
Description
Technical Field
The present invention relates to a technique for ejecting a liquid such as ink.
Background
For example, patent document 1 discloses a liquid ejecting head that ejects liquid such as ink from a plurality of nozzles. A drive IC that drives a piezoelectric element that ejects ink from a nozzle is mounted on the liquid ejection head.
In the technique of patent document 1, the drive IC generates heat by driving of the piezoelectric element, and the temperature inside the liquid ejection head rises, thereby changing the viscosity of the ink. Therefore, there is a problem that an error occurs in the ejection characteristics of the ink.
Patent document 1: japanese patent laid-open publication No. 2016-000488
Disclosure of Invention
In order to solve the above problem, a liquid ejecting head according to a preferred embodiment of the present invention includes: a head unit including a liquid ejecting section that ejects liquid from a nozzle, a drive circuit that drives the liquid ejecting section, and a housing that forms a space in which the liquid is stored; a fixing plate which is in contact with the head unit on the nozzle side in the head unit; and a support body that is in contact with the fixed plate and supports the head unit, the support body being formed of a material having a higher thermal conductivity than the housing.
Drawings
Fig. 1 is a block diagram showing a configuration of a liquid ejecting apparatus according to a first embodiment of the present invention.
Fig. 2 is an exploded perspective view of the head unit.
Fig. 3 is a sectional view of the head unit (sectional view taken along line iii-iii in fig. 2).
Fig. 4 is a sectional view of the liquid ejection head (sectional view taken along line iv-iv in fig. 1).
Fig. 5 is a cross-sectional view of a liquid jet head according to a second embodiment.
Fig. 6 is a cross-sectional view of a head unit according to a modification.
Detailed Description
First embodiment
Fig. 1 is a configuration diagram illustrating a liquid ejecting apparatus 100 according to a first embodiment of the present invention. The liquid ejecting apparatus 100 according to the first embodiment is an ink jet type printing apparatus that ejects ink as an example of a liquid onto the medium 12. The medium 12 is typically a printing paper, but a printing object of any material such as a resin film or a fabric may be used as the medium 12. As illustrated in fig. 1, the liquid ejecting apparatus 100 is provided with a liquid container 14 that stores ink. For example, an ink cartridge that is attachable to and detachable from the liquid ejecting apparatus 100, a bag-shaped ink bag formed of a flexible film, or an ink tank that can be replenished with ink may be used as the liquid container 14. A plurality of inks different in color are stored in the liquid container 14.
As illustrated in fig. 1, the liquid ejecting apparatus 100 includes a control unit 20, a transport mechanism 22, a moving mechanism 24, and a liquid ejecting head 26. The control Unit 20 includes a Processing circuit such as a CPU (Central Processing Unit) or an FPGA (Field Programmable Gate Array) and a memory circuit such as a semiconductor memory, and collectively controls each element of the liquid ejecting apparatus 100. The transport mechanism 22 transports the medium 12 in the Y direction under control implemented by the control unit 20.
The moving mechanism 24 reciprocates the head unit 261 in the X direction under the control of the control unit 20. The X direction is a direction intersecting (typically orthogonal to) the Y direction in which the medium 12 is conveyed. The moving mechanism 24 of the first embodiment includes a substantially box-shaped conveying body 242 (carriage) that houses the head unit 261, and a conveying belt 244 to which the conveying body 242 is fixed. Further, a plurality of head units 261 may be mounted on the carrier 242, or the liquid container 14 may be mounted on the carrier 242 together with the head units 261.
The liquid ejecting head 26 includes a plurality of head units 261. Each head unit 261 ejects ink supplied from the liquid container 14 to the medium 12 from a plurality of nozzles (i.e., ejection holes) under control implemented by the control unit 20. By carrying out the conveyance of the medium 12 by the conveyance mechanism 22 and the repeated reciprocating movement of the conveyance body 242 in parallel and ejecting ink from the head unit 261 to the medium 12, a desired image is formed on the surface of the medium 12. Further, hereinafter, a direction perpendicular to the X-Y plane is denoted as a Z direction. The ejection direction of the ink ejected by the head unit 261 corresponds to the Z direction. The X-Y plane is, for example, a plane parallel to the surface of the medium 12. The Z direction is typically vertical.
Fig. 2 is an exploded perspective view of the head unit 261, and fig. 3 is a sectional view taken along line iii-iii in fig. 2. As illustrated in fig. 2, the head unit 261 includes a plurality of nozzles N arranged in the Y direction. The plurality of nozzles N of the first embodiment are divided into a first row L1 and a second row L2 that are arranged in parallel with each other at intervals in the X direction. Each of the first row L1 and the second row L2 is a set of a plurality of nozzles N arranged linearly in the Y direction. Although the positions of the nozzles N in the Y direction may be different between the first row L1 and the second row L2 (i.e., staggered arrangement or offset arrangement), a configuration in which the positions of the nozzles N in the Y direction are aligned in the first row L1 and the second row L2 will be described below for convenience of description. As is understood from fig. 3, the head unit 261 of the first embodiment has a structure in which the elements related to the respective nozzles N of the first row L1 and the elements related to the respective nozzles N of the second row L2 are arranged substantially in line symmetry.
As illustrated in fig. 2 and 3, the head unit 261 includes: a liquid ejecting portion 50 that ejects ink from the nozzles N; a drive circuit 80 for driving the liquid ejecting section 50; and a container 90 having a space for storing ink.
The liquid ejecting section 50 includes: a flow channel structure 30 in which a pressure chamber C communicating with the nozzle N is formed; a piezoelectric element 44 that changes the pressure of the pressure chamber C; and a wiring board 46 on which wiring for electrically connecting the drive circuit 80 and the piezoelectric element 44 is formed. The piezoelectric element 44 is an example of a driving element.
The flow channel structure 30 is a structure that forms a flow channel for supplying ink to the plurality of nozzles N. The flow channel structure 30 of the first embodiment is composed of a flow channel substrate 32, a pressure chamber substrate 34, a vibration plate 42, a nozzle plate 62, and a vibration absorber 64. Each member constituting the flow channel structure 30 is a plate-like member elongated in the Y direction. The housing 90 and the pressure chamber substrate 34 are provided on the surface of the flow path substrate 32 on the negative side in the Z direction. On the other hand, a nozzle plate 62 and a shock absorber 64 are provided on the surface of the flow channel substrate 32 on the positive side in the Z direction. The respective components are fixed, for example, by an adhesive.
The nozzle plate 62 is a plate-like member formed with a plurality of nozzles N. Each of the plurality of nozzles N is a circular through-hole through which ink passes. The nozzle plate 62 of the first embodiment is provided with a plurality of nozzles N constituting the first row L1 and a plurality of nozzles N constituting the second row L2. The nozzle plate 62 is manufactured by processing a silicon (Si) single crystal substrate using, for example, a semiconductor manufacturing technique (e.g., a processing technique such as dry etching or wet etching). However, any known material and method may be used for manufacturing the nozzle plate 62.
As illustrated in fig. 2 and 3, the flow channel substrate 32 is provided with a space Ra, a plurality of supply flow channels 322, a plurality of communication flow channels 324, and a supply liquid chamber 326 in each of the first row L1 and the second row L2. The space Ra is an elongated opening formed along the Y direction in a plan view (i.e., when viewed from the Z direction), and the supply flow path 322 and the communication flow path 324 are through-holes formed for each nozzle N. The supply liquid chamber 326 is a space that extends over the plurality of nozzles N and is formed in an elongated shape along the Y direction, and the space Ra and the plurality of supply flow channels 322 communicate with each other. The plurality of communication flow passages 324 overlap with one nozzle N corresponding to the communication flow passage 324 in a plan view.
As illustrated in fig. 2 and 3, the pressure chamber substrate 34 is a plate-like member in which a plurality of pressure chambers C are formed for each of the first row L1 and the second row L2. The plurality of pressure chambers C are arranged in the Y direction. Each pressure chamber C (cavity) is an elongated space formed for each nozzle N and extending along the X direction in a plan view. The flow path substrate 32 and the pressure chamber substrate 34 are manufactured by processing a silicon single crystal substrate by, for example, a semiconductor manufacturing technique, as in the nozzle plate 62 described above. However, any known material or manufacturing method may be used for manufacturing the flow channel substrate 32 and the pressure chamber substrate 34.
As illustrated in fig. 3, a vibration plate 42 is formed on a surface of the pressure chamber substrate 34 on the opposite side to the flow path substrate 32. The diaphragm 42 of the first embodiment is an elastic and vibratable plate-like member. In addition, a part or the whole of the vibration plate 42 may be formed integrally with the pressure chamber substrate 34 by selectively removing a part in the plate thickness direction with respect to a region corresponding to the pressure chamber C in a plate-shaped member having a predetermined plate thickness.
As understood from fig. 3, the pressure chamber C is a space between the flow channel substrate 32 and the vibration plate 42. The plurality of pressure chambers C are aligned in the Y direction for each of the first row L1 and the second row L2. As illustrated in fig. 2 and 3, the pressure chamber C communicates with the communication flow passage 324 and the supply flow passage 322. Therefore, the pressure chamber C communicates with the nozzle N via the communication flow passage 324, and communicates with the space Ra via the supply flow passage 322 and the supply liquid chamber 326.
As illustrated in fig. 2 and 3, the piezoelectric element 44 is located on the surface of the flow channel structure 30 opposite to the nozzle N. Specifically, on the surface of the diaphragm 42 of the flow channel structure 30 on the side opposite to the pressure chambers C, a plurality of piezoelectric elements 44 corresponding to different nozzles N are formed for each of the first row L1 and the second row L2. Each piezoelectric element 44 is a passive element that changes the pressure of the pressure chamber C by being deformed by a drive signal supplied from the drive circuit 80. The drive signal output from the drive circuit 80 is supplied to each piezoelectric element 44 via the connection terminal T of the wiring board 46. The drive signal is a signal for driving the piezoelectric element 44.
The wiring board 46 in fig. 2 is a plate-like member facing the surface of the diaphragm 42 on which the plurality of piezoelectric elements 44 are formed with a gap. That is, the wiring substrate 46 is located on the opposite side of the flow channel structure 30 as viewed from the piezoelectric element 44. Wiring for electrically connecting the drive circuit 80 and the piezoelectric element 44 is formed on the wiring substrate 46. The wiring board 46 of the first embodiment also functions as a reinforcing plate for reinforcing the mechanical strength of the head unit 261 and a sealing plate for protecting and sealing the piezoelectric element 44. The wiring board 46 is electrically connected to the control unit 20 via an external wiring 52. The external wiring 52 is a flexible wiring board for supplying a drive signal from the control unit 20 to the wiring board 46. As the external wiring 52, a connection member such as FPC (Flexible Printed Circuits) or FFC (Flexible Flat Cable) is preferably used.
The container 90 is a case for storing ink supplied to the plurality of pressure chambers C. The positive surface of the receptacle 90 in the Z direction is bonded to the flow path substrate 32 with an adhesive, for example. As illustrated in fig. 3, the space Rb for storing ink is formed in the housing 90. The space Rb is a space elongated in the Y direction. In the first embodiment, the space Rb is formed for each of the first line L1 and the second line L2. The space Rb of the housing 90 and the space Ra of the flow path substrate 32 communicate with each other. The space formed by the spaces Ra and Rb functions as a liquid storage chamber (reservoir) R that stores ink supplied to the plurality of pressure chambers C. The ink is supplied to the liquid storage chamber R through an inlet 482 formed in the housing 90. The ink in the liquid storage chamber R is supplied to the pressure chamber C through the liquid supply chamber 326 and the supply flow paths 322. The housing 90 is formed by injection molding of a resin material, for example.
The vibration absorber 64 is an element for absorbing pressure fluctuations of the ink in the liquid storage chamber R. The vibration absorber 64 of the first embodiment includes an elastic film 641 and a support plate 643. The elastic film 641 is a flexible member formed in a thin film shape. The elastic membrane 641 of the first embodiment is provided on the surface of the flow path substrate 32 so as to close the space Ra, the connection flow path 326, and the supply flow path 322, thereby constituting the bottom surface of the common liquid chamber R. The support plate 643 is a flat plate made of a material having high rigidity such as stainless steel, and supports the elastic membrane 641 on the surface of the flow path substrate 32 so that the opening formed in the flow path substrate 32 is closed by the elastic membrane 641. The elastic film 641 deforms in accordance with the pressure of the ink in the storage chamber R, thereby suppressing pressure fluctuations in the liquid storage chamber R.
The wiring board 46 includes a base portion 70 and a plurality of wires 72. The base portion 70 is an insulating plate-like member elongated in the Y direction, and is located between the flow channel structure 30 and the drive circuit 80. The base portion 70 is manufactured by processing a silicon single crystal substrate using, for example, a semiconductor manufacturing technique. However, any known material or method may be used for manufacturing the base body 70. The wiring 72 transmits, for example, a drive signal. The plurality of wires 72 are located at the end portion on the negative side in the Y direction in the first surface F1 of the base body portion 70.
As illustrated in fig. 2, the base portion 70 includes a first surface F1 and a second surface F2 located on opposite sides to each other, and is fixed to a surface of the pressure chamber substrate 34 or the vibration plate 42 on the side opposite to the flow path substrate 32 by, for example, an adhesive. Specifically, the base portion 70 is provided such that the second surface F2 faces the surface of the diaphragm 42 with a gap therebetween.
As illustrated in fig. 2, the drive circuit 80 and the external wiring 52 are mounted on the first surface F1 of the base body portion 70. That is, the drive circuit 80 and the external wiring 52 are mounted on the surface of the wiring substrate 46 on the side opposite to the flow channel structure 30. The drive circuit 80 is an elongated IC chip extending in the longitudinal direction (Y direction) of the base portion 70. The external wiring 52 is attached to the negative-side end portion in the Y direction in the first surface F1 of the base body portion 70. A plurality of lines for transmitting drive signals to the wiring board 46 are formed in the external lines 52, for example. The plurality of wires 72 of the wiring board 46 are electrically connected to the plurality of wires of the external wires 52. The drive circuit 80 generates heat by the operation of driving the piezoelectric element 44.
Fig. 4 is a sectional view taken along line iv-iv in fig. 1 (a sectional view of the liquid ejection head 26). As illustrated in fig. 4, the liquid ejecting head 26 includes, in addition to the plurality of head units 261, a fixed plate 263 that fixes the head units 261, and a support body 265 that supports the head units 261 and the fixed plate 263.
The fixing plate 263 is a member formed of, for example, a highly rigid metal, and fixes each head unit 261. The fixed plate 263 is formed of, for example, stainless steel. As illustrated in fig. 4, the fixed plate 263 according to the first embodiment includes a fixed portion 631 and a peripheral portion 633. The fixed portion 631 is a flat plate-like portion extending in the X direction in cross-sectional view. On the other hand, the peripheral edge portion 633 is a portion extending from the surface of the fixed portion 631 toward the negative side in the Z direction, and is formed as a portion along the Y direction in the outer periphery of the fixed portion 631.
As illustrated in fig. 4, the plurality of head units 261 are fixed to the surface of the fixing portion 631 on the support 265 side. The plurality of head units 261 are fixed to the fixing portion 631 at intervals. A portion on the nozzle side (i.e., the positive side in the Z direction) in the head unit 261 contacts the fixing portion 631. That is, the flow path structure 30 of the head unit 261 contacts the fixing portion 631. Specifically, the surface of the support plate 643 of the vibration absorber 64 on the side opposite to the elastic membrane 641 is in contact with the fixing portion 631. As illustrated in fig. 4, the fixing portion 631 has an opening O formed therein so as to correspond to the outer shape of the nozzle plate 62. Therefore, the nozzle N is exposed from the opening O.
The support 265 is a box-shaped structure including a flat surface portion 653 and a frame-shaped side wall portion protruding from the peripheral edge of the flat surface portion 653 toward the front side in the Z direction. As illustrated in fig. 4, the side wall portion includes a first side wall portion 651 and a second side wall portion 652 that are opposed to each other. The first and second side wall portions 651, 652 are flat plate-like portions extending in the Z direction. The first and second side wall portions 651 and 652 are formed so as to correspond to portions along the Y direction at the positive and negative sides in the X direction in the outer periphery of the fixed portion 631. The plurality of head units 261 are located between the first and second side wall portions 651 and 652. The positive side portion in the Z direction of each side wall portion is joined to the peripheral edge portion 633 and the fixing portion 631 of the fixing plate 263. As illustrated in fig. 4, the end portion of the side wall portion on the positive side in the Z direction is in contact with the surface of the fixing portion 631, and the surface of the side wall portion on the opposite side from the head unit 261 is in contact with the peripheral edge portion 633. That is, the fixed plate 263 and the side wall portion are joined to each other such that the peripheral edge portion 633 engages with the side wall portion. As understood from the above description, the support 265 contacts the fixed plate 263 at the outer periphery of the fixed plate 263.
As illustrated in fig. 4, the flat surface 653 faces the fixed plate 263 through the head unit 261. A head unit 261 is bonded to a surface on the fixed plate 263 side in the planar portion 653. For example, a portion of the housing 90 of the head unit 261 facing the flat surface 653 is bonded to the flat surface 653 with an adhesive B. A through hole H for supplying ink from the liquid container to the inlet 482 is formed in the planar portion 653 and the adhesive B.
The support 265 is formed of a material having higher thermal conductivity than the housing 90 and the fixed plate 263 of the head unit 261. The support 265 is formed of a metal such as aluminum or copper. In the first embodiment, the entirety of the support 265 is formed of metal. By forming the support 265 of a material having higher thermal conductivity than the housing 90 and the fixed plate 263, heat generated inside the head unit 261 is radiated to the support 265 through the fixed plate 263 in contact with the head unit 261. Specifically, the heat generated in the drive circuit 80 of the head unit 261 is transmitted to the fixed plate 263 that is in contact with the support 265 of the vibration absorber 64 via the housing 90 and the flow path structure 30 located around the drive circuit 80. The heat transferred to the fixed plate 263 is released to the outside air through the support 265 contacting the fixed plate 263. Therefore, an increase in the temperature inside the head unit 261 can be suppressed.
For example, in a configuration in which the support 265 is formed of a material having a lower thermal conductivity than the housing 90 and the fixed plate 263 (hereinafter, referred to as a "comparative example"), there is a problem in that heat generated by the drive circuit 80 is hardly released to the outside of the head unit 261, and the temperature inside the head unit 261 increases. In contrast, according to the configuration of the first embodiment in which the support 265 is formed of a material having higher thermal conductivity than the housing 90 and the fixed plate 263 of the head unit 261, heat generated in the drive circuit 80 is effectively dissipated from the fixed plate 263 through the support 265 as compared with the comparative example. Specifically, since the area available for heat dissipation is increased as compared with the comparative example, the rise in temperature inside the head unit 261 can be suppressed. Therefore, an error in the ink ejection characteristics due to an increase in the temperature inside the head unit 261 can be reduced.
According to the structure of the first embodiment in which the support 265 is formed of metal, there is an advantage that heat generated in the drive circuit 80 can be effectively released. In the first embodiment, the support 265 is in contact with the fixed plate 263 at the outer periphery of the fixed plate 263, so that heat of the drive circuit 80 can be released from the outer periphery of the fixed plate 263.
Second embodiment
A second embodiment of the present invention will be explained. In the following examples, elements having the same functions as those in the first embodiment are denoted by the same reference numerals as those in the first embodiment, and detailed descriptions thereof are omitted as appropriate.
Fig. 5 is a cross-sectional view of a liquid ejecting head 26 according to a second embodiment. The structure of the support 265 in the liquid ejecting head 26 of the second embodiment is different from that of the first embodiment. The head unit 261 and the fixing plate 263 have the same configuration as that of the first embodiment.
As illustrated in fig. 5, the support body 265 according to the second embodiment includes a contact portion 654 in addition to the first and second side wall portions 651 and 652 and the flat surface portion 653. The contact portion 654 is a portion that contacts the fixing plate 263 between the first side wall portion 651 and the second side wall portion 652. A flat plate-like portion extending from the flat surface portion 653 toward the fixed plate 263 is a contact portion 654.
A structure in which the first head unit 261a, the second head unit 261b, and the third head unit 261c are fixed to the fixed plate 263 is assumed. The contact portion 654a contacts the fixed plate 263 between the first head unit 261a and the second head unit 261 b. Similarly, the contact portion 654b contacts the fixed plate 263 between the second head unit 261b and the third head unit 261 c. The Z-direction end of the contact portion 654(654a, 654b) is joined to the surface of the fixed plate 263 with, for example, an adhesive. One of the first head unit 261a and the second head unit 261b is an example of a first head unit, and the other is an example of a second head unit. One of the second head unit 261b and the third head unit 261c is an example of a first head unit, and the other is an example of a second head unit.
In the second embodiment, since the support body 265 includes the first side wall portion 651 and the second side wall portion 652 that are in contact with the outer periphery of the fixed plate 263, and the contact portion 654 that is in contact with the fixed plate 263 between the first side wall portion 651 and the second side wall portion 652, it is possible to release heat of the drive circuit 80 from between the first side wall portion 651 and the second side wall portion 652 in addition to the outer periphery of the fixed plate 263. Heat is particularly liable to be trapped between the respective head units 261(261a, 261b, 261 c). In the second embodiment, since the support 265 includes the contact portion 654 that contacts the fixed plate 263 between the head units 261, there is an advantage in that heat accumulated between the head units 261 can be efficiently released.
Modification example
The above-described embodiments may be modified in various ways. Hereinafter, specific modifications that can be applied to the above-described respective modes will be exemplified. Two or more arbitrarily selected from the following examples can be combined as appropriate within a range not inconsistent with each other.
(1) The structure of the support 265 is not limited to the above-described embodiments. The shape of the support 265 may be any shape as long as the support 265 includes a portion that contacts the fixed plate 263. For example, the support 265 may include a different element from the side wall portion and the contact portion 654, or the support 265 may not include the flat surface portion 653. The portion of the fixed plate 263 that contacts the support 265 may be appropriately changed according to the structure of the support 265. That is, the portion of the fixed plate 263 that the support 265 contacts is not limited to the outer periphery of the fixed plate 263 or the space between the first and second side wall portions 651, 652.
(2) Although the fixed plate 263 is configured by the fixing portion 631 and the peripheral portion 633 in each of the above embodiments, the shape of the fixed plate 263 is not limited to the above example. For example, the peripheral edge 633 may be omitted. However, according to the structure in which the fixed plate 263 includes the peripheral edge portion 633 and the fixing portion 631, for example, the area in which the fixed plate 263 contacts the support 265 is increased as compared with the structure in which the fixed plate 263 does not include the peripheral edge portion 633. Therefore, heat generated from the drive circuit 80 can be efficiently released from the support 265 via the fixed plate 263. The fixed plate 263 may include elements different from the fixed portion 631 and the peripheral portion 633.
(3) Although the support 265 is formed of a material having higher thermal conductivity than the housing 90 and the fixed plate 263 in each of the above-described embodiments, it is not essential to form the support 265 of a material having higher thermal conductivity than the fixed plate 263. If the support 265 is formed of a material having a higher thermal conductivity than the housing 90, the above-described effect can be achieved, such as the ability to release heat generated in the drive circuit 80 from the fixed plate 263 through the support 265. However, according to the structure in which the support 265 is formed of a material having higher thermal conductivity than the fixed plate 263, the heat transferred from the drive circuit 80 to the fixed plate 263 is easily transferred to the support 265. Therefore, there is an advantage that heat of the driver circuit 80 can be effectively released, compared to a structure in which the support 265 has a lower thermal conductivity than the fixed plate 263.
(4) In each of the above embodiments, the entire support 265 is formed of a metal material having a higher thermal conductivity than the housing 90, but a part of the support 265 may be formed of a material having a higher thermal conductivity than the housing 90. For example, the side wall portion contacting the fixed plate 263 may be formed of a material having a higher thermal conductivity than the housing 90, and the other portions may be formed of a material having a lower thermal conductivity than the housing 90. In the second embodiment, the contact portion 654 may be formed of a material having a higher thermal conductivity than the housing 90.
(5) In each of the above-described embodiments, the support plate 643 of the vibration absorber 64 is in contact with the fixed plate 263, but the portion of the flow path structure 30 in contact with the fixed plate 263 is not limited to the support body 265. For example, in the case where the support plate 643 is omitted from the vibration absorber 64, the elastic membrane 641 is in contact with the fixed plate 263. In the case where the vibration absorbing body 64 is omitted from the flow channel structure 30, the flow channel base plate 32 is in contact with the fixed plate 263. As described above, the portion of the flow channel structure 30 that contacts the fixed plate 263 can be changed as appropriate depending on the structure of the flow channel structure 30. The structure of the flow channel structure 30 is not limited to the above-described examples of the respective embodiments.
(6) Although the support 265 is formed of metal in each of the above embodiments, the material of the support 265 may be any material as long as it has a higher thermal conductivity than the housing 90. For example, the support 265 may be formed of a high heat conductive resin.
(7) In each of the above-described embodiments, the drive circuit 80 is mounted on the surface of the wiring substrate 46 on the side opposite to the flow channel structure 30, but the position where the drive circuit 80 is mounted is not limited to the above example. For example, as illustrated in fig. 6, a configuration may be adopted in which the drive circuit 80 is mounted on the flexible wiring board 46 whose end portion is joined to the flow channel structure 30. In the above configuration, the piezoelectric element 44 is covered with the sealing portion 49. However, in the configurations illustrated in the above-described respective embodiments, the heat generated in the drive circuit 80 is more likely to be accumulated in the head unit 261 than in the configuration illustrated in fig. 6. Therefore, the structure in which the support 265 contacting the fixed plate 263 is formed of a material having higher thermal conductivity than the housing 90 of the head unit 261 is more effective.
(8) The driving element for ejecting the ink in the pressure chamber C from the nozzle N is not limited to the piezoelectric element 44 illustrated in the above embodiments. For example, a heating element that generates bubbles in the pressure chamber C by heating and varies the pressure may be used as the driving element. As understood from the above examples, the driving element is generally represented as an element for ejecting the liquid in the pressure chamber C from the nozzle N, and an operation mode (piezoelectric mode/thermal mode) or a specific configuration is not required.
(9) Although the serial-type liquid ejecting apparatus 100 that reciprocates the transport body 242 on which the head unit 261 is mounted has been described as an example in each of the above embodiments, the present invention can be applied to a line-type liquid ejecting apparatus in which a plurality of nozzles N are distributed across the entire width of the medium 12. In the line-type liquid ejecting apparatus, the liquid ejecting head is a line-type head, and a frame body that is in contact with the support body and to which the liquid ejecting head is fixed is used. According to the above configuration, since the support 265 is in contact with the housing to which the liquid ejecting head is fixed, there is an advantage that heat of the head unit can be released through the housing.
(10) The liquid ejecting apparatus 100 exemplified in the above-described embodiments can be used for various apparatuses such as a facsimile machine and a copying machine, in addition to the apparatus dedicated to printing. However, the application of the liquid ejecting apparatus of the present invention is not limited to printing. For example, a liquid ejecting apparatus that ejects a solution of a color material is used as an apparatus for manufacturing a color filter that forms a display device such as a liquid crystal display panel. Further, a liquid ejecting apparatus that ejects a solution of a conductive material can be used as a manufacturing apparatus for forming wiring or electrodes of a wiring board. In addition, a liquid ejecting apparatus that ejects a solution of an organic substance related to a living body can be used as a manufacturing apparatus for manufacturing a biochip, for example.
Description of the symbols
100 … liquid ejection device; 12 … medium; 14 … a liquid container; 20 … control unit; 22 … conveying mechanism; 24 … moving mechanism; 242 … conveyance; 244 … conveyor belts; 26 … liquid jet head; 261 … head element; 263 … fixing the plate; 265 an 265 … support body; 30 … flow channel structure; 32 … flow channel substrate; 34 … pressure chamber base plate; 42 … diaphragm; 44 … piezoelectric element; 46 … wiring board; 50 … liquid ejection portion; 52 … external wiring; 62 … a nozzle plate; 631 … a fixed part; 633 … peripheral edge portions; 64 … absorber; 70 … base portion; 72 … wiring; 80 … driver circuit; 90 … container.
Claims (9)
1. A liquid ejecting head includes:
a head unit including a liquid ejecting portion that ejects liquid from a nozzle, a drive circuit that drives the liquid ejecting portion, and a housing in which a space for storing the liquid is formed;
a fixing plate which is in contact with the head unit on the nozzle side in the head unit;
a support body that is in contact with the fixing plate and supports the head unit,
the support body is formed of a material having a higher thermal conductivity than the housing.
2. The liquid ejection head according to claim 1,
the support is formed of metal.
3. The liquid ejection head as claimed in claim 1 or claim 2,
the liquid ejecting section includes:
a flow channel structure in contact with the fixed plate and having a pressure chamber formed therein, the pressure chamber being in communication with the nozzle;
a driving element that is located on an opposite side of the flow channel structure from the nozzle and changes a pressure of the pressure chamber;
a wiring board which is located on the opposite side of the flow channel structure when viewed from the driving element and on which wiring for electrically connecting the driving circuit and the driving element is formed,
the drive circuit is mounted on a surface of the wiring substrate on a side opposite to the flow channel structure.
4. The liquid ejection head according to claim 1,
the support body is in contact with the fixing plate at an outer periphery of the fixing plate.
5. The liquid ejecting head as claimed in claim 4,
the support body includes a first side wall portion and a second side wall portion that contact the outer periphery of the fixing plate,
the head unit is located between the first sidewall portion and the second sidewall portion,
the support body includes a contact portion that contacts the fixing plate between the first side wall portion and the second side wall portion.
6. The liquid ejection head according to claim 1,
a plurality of head units including a first head unit and a second head unit,
the support body includes a contact portion that contacts the fixing plate between the first head unit and the second head unit.
7. The liquid ejection head according to claim 1,
the support body has higher thermal conductivity than the fixing plate.
8. A liquid ejecting apparatus includes:
the liquid ejection head as claimed in any one of claims 1 to 7.
9. The liquid ejecting apparatus as claimed in claim 8,
the liquid ejection head is a line head,
the liquid ejecting apparatus includes a housing that is in contact with the support body and to which the liquid ejecting head is fixed.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018-116136 | 2018-06-19 | ||
| JP2018116136 | 2018-06-19 |
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| CN110614850A true CN110614850A (en) | 2019-12-27 |
| CN110614850B CN110614850B (en) | 2020-12-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910515487.XA Active CN110614850B (en) | 2018-06-19 | 2019-06-14 | Liquid ejecting head and liquid ejecting apparatus |
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| Country | Link |
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| JP (1) | JP7196641B2 (en) |
| CN (1) | CN110614850B (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP7196641B2 (en) | 2022-12-27 |
| JP2019217755A (en) | 2019-12-26 |
| CN110614850B (en) | 2020-12-01 |
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