JP7196641B2 - Liquid ejecting head and liquid ejecting device - Google Patents

Description

The present invention relates to technology for ejecting liquid such as ink.

For example, Patent Document 1 discloses a liquid jet head that jets liquid such as ink from a plurality of nozzles. A driving IC for driving a piezoelectric element for ejecting ink from a nozzle is mounted on the liquid ejection head.

JP 2016-000488 A

In the technique disclosed in Japanese Patent Application Laid-Open No. 2002-200011, the drive IC generates heat by driving the piezoelectric element, and the temperature inside the liquid ejection head rises, thereby changing the viscosity of the ink. Therefore, there is a problem that an error occurs in the ink ejection characteristics.

In order to solve the above problems, a liquid jet head according to a preferred aspect of the present invention includes: a liquid ejecting section that ejects liquid from a nozzle; a drive circuit that drives the liquid ejecting section; and a space that stores the liquid. a head unit including an accommodation body formed with a; a fixed plate that contacts the head unit on the nozzle side of the head unit; and a support that contacts the fixed plate and supports the head unit. and the support is made of a material having a higher thermal conductivity than the container.

1 is a block diagram showing the configuration of a liquid ejecting apparatus according to a first embodiment of the invention; FIG. 4 is an exploded perspective view of the head unit; FIG. FIG. 3 is a cross-sectional view of the head unit (a cross-sectional view taken along line III-III in FIG. 2); 2 is a cross-sectional view of the liquid jet head (a cross-sectional view taken along line IV-IV in FIG. 1); FIG. FIG. 5 is a cross-sectional view of a liquid jet head according to a second embodiment; FIG. 11 is a cross-sectional view of a head unit according to a third embodiment; FIG. 11 is a cross-sectional view of a head unit according to a fourth embodiment; FIG. 11 is a cross-sectional view of a head unit according to a modified example;

<First embodiment>
FIG. 1 is a configuration diagram illustrating a liquid ejecting apparatus 100 according to the first embodiment of the invention. A liquid ejecting apparatus 100 according to the first embodiment is an inkjet printing apparatus that ejects ink, which is an example of liquid, onto a medium 12 . The medium 12 is typically printing paper, but any material, such as resin film or cloth, can be used as the medium 12 to be printed. As illustrated in FIG. 1, a liquid container 14 that stores ink is installed in the liquid ejecting apparatus 100 . For example, a cartridge detachable from the liquid ejecting apparatus 100, a bag-shaped ink pack made of flexible film, or an ink tank capable of replenishing ink is used as the liquid container 14. FIG. A plurality of types of ink with different colors are stored in the liquid container 14 .

As illustrated in FIG. 1, the liquid ejecting apparatus 100 includes a control unit 20, a transport mechanism 22, a moving mechanism 24, and a liquid ejecting head . The control unit 20 includes a processing circuit such as a CPU (Central Processing Unit) or FPGA (Field Programmable Gate Array) and a memory circuit such as a semiconductor memory, and controls each element of the liquid ejecting apparatus 100 in an integrated manner. The control unit 20 is an example of a control section. The transport mechanism 22 transports the medium 12 in the Y direction under the control of the control unit 20 .

The moving mechanism 24 reciprocates the head unit 261 in the X direction under the control of the control unit 20 . The X direction is the direction that intersects (typically perpendicular to) the Y direction in which the medium 12 is transported. The moving mechanism 24 of the first embodiment includes a substantially box-shaped transport body 242 (carriage) that accommodates the head unit 261, and a transport belt 244 to which the transport body 242 is fixed. A configuration in which a plurality of head units 261 are mounted on the carrier 242 or a configuration in which the liquid container 14 is mounted on the carrier 242 together with the head units 261 may also be employed.

The liquid jet head 26 has a plurality of head units 261 . Each head unit 261 ejects ink supplied from the liquid container 14 onto the medium 12 from a plurality of nozzles (that is, ejection holes) under the control of the control unit 20 . A desired image is formed on the surface of the medium 12 by the head unit 261 ejecting ink onto the medium 12 in parallel with the conveyance of the medium 12 by the conveyance mechanism 22 and the repetitive reciprocation of the conveyance body 242 . Note that the direction perpendicular to the XY plane is hereinafter referred to as the Z direction. The direction in which ink is ejected by the head unit 261 corresponds to the Z direction. The XY plane is, for example, a plane parallel to the surface of medium 12 . The Z direction is typically vertical.

2 is an exploded perspective view of the head unit 261, and FIG. 3 is a sectional view taken along line III--III in FIG. As illustrated in FIG. 2, the head unit 261 has a plurality of nozzles N arranged in the Y direction. The plurality of nozzles N of the first embodiment are divided into a first row L1 and a second row L2 arranged side by side in the X direction with a space therebetween. Each of the first row L1 and the second row L2 is a set of a plurality of nozzles N linearly arranged in the Y direction. It is also possible to make the positions of the nozzles N in the Y direction different between the first row L1 and the second row L2 (that is, staggered arrangement or staggered arrangement). A configuration in which the positions of the nozzles N in the Y direction are matched by and will be exemplified below for convenience. As can be understood from FIG. 3, in the head unit 261 of the first embodiment, the elements related to the nozzles N in the first row L1 and the elements related to the nozzles N in the second row L2 are arranged substantially line symmetrically. It is a structured structure.

As illustrated in FIGS. 2 and 3, the head unit 261 includes a liquid ejecting portion 50 that ejects ink from nozzles N, a drive circuit 80 that drives the liquid ejecting portion 50, and a space for storing ink. and a container 90 .

The liquid ejecting unit 50 electrically connects the flow path structure 30 in which the pressure chambers C communicating with the nozzles N are formed, the piezoelectric elements 44 that change the pressure of the pressure chambers C, and the driving circuit 80 and the piezoelectric elements 44. and a wiring board 46 on which wiring for connection is formed. The piezoelectric element 44 is an example of a driving element.

The flow channel structure 30 is a structure that forms a flow channel for supplying ink to a plurality of nozzles N. As shown in FIG. The channel structure 30 of the first embodiment is composed of a channel substrate 32 , a pressure chamber substrate 34 , a vibration plate 42 , a nozzle plate 62 and a vibration absorber 64 . Each member constituting the flow path structure 30 is a plate-like member elongated in the Y direction. The container 90 and the pressure chamber substrate 34 are installed on the surface of the channel substrate 32 on the negative side in the Z direction. On the other hand, a nozzle plate 62 and a vibration absorber 64 are installed on the surface of the channel substrate 32 on the positive side in the Z direction. For example, each member is fixed with an adhesive.

The nozzle plate 62 is a plate-like member in which a plurality of nozzles N are formed. Each of the plurality of nozzles N is a circular through hole through which ink passes. A plurality of nozzles N forming a first row L1 and a plurality of nozzles N forming a second row L2 are formed on the nozzle plate 62 of the first embodiment. For example, the nozzle plate 62 is manufactured by processing a single crystal substrate of silicon (Si) using semiconductor manufacturing technology (for example, processing technology such as dry etching and wet etching). However, known materials and manufacturing methods can be arbitrarily adopted for manufacturing the nozzle plate 62 .

As illustrated in FIGS. 2 and 3, the channel substrate 32 includes spaces Ra, a plurality of supply channels 322, a plurality of communication channels 324, and a supply liquid for each of the first row L1 and the second row L2. A chamber 326 is formed. The space Ra is an elongated opening along the Y direction in a plan view (that is, when viewed from the Z direction), and the supply channel 322 and the communication channel 324 are through holes formed for each nozzle N. . The supply liquid chamber 326 is an elongated space extending in the Y direction over the plurality of nozzles N, and allows the space Ra and the plurality of supply channels 322 to communicate with each other. Each of the communication channels 324 overlaps one nozzle N corresponding to the communication channel 324 in plan view.

As illustrated in FIGS. 2 and 3, the pressure chamber substrate 34 is a plate-like member in which a plurality of pressure chambers C are formed for each of the first row L1 and the second row L2. A plurality of pressure chambers C are arranged in the Y direction. Each pressure chamber C (cavity) is an elongated space formed for each nozzle N and extending in the X direction in plan view. The flow path substrate 32 and the pressure chamber substrate 34 are manufactured by processing a silicon single crystal substrate, for example, using semiconductor manufacturing technology, like the nozzle plate 62 described above. However, known materials and manufacturing methods can be arbitrarily adopted for manufacturing the flow path substrate 32 and the pressure chamber substrate 34 .

As illustrated in FIG. 3, a vibration plate 42 is formed on the surface of the pressure chamber substrate 34 opposite to the flow path substrate 32 . The diaphragm 42 of the first embodiment is a plate-like member that can vibrate elastically. Part or all of the diaphragm 42 can be integrated with the pressure chamber substrate 34 by selectively removing a portion of the plate-like member having a predetermined thickness corresponding to the pressure chambers C in the plate thickness direction. can be formed to

As understood from FIG. 3, the pressure chamber C is a space located between the flow path substrate 32 and the vibration plate 42. As shown in FIG. A plurality of pressure chambers C are arranged in the Y direction for each of the first row L1 and the second row L2. As illustrated in FIGS. 2 and 3, pressure chamber C communicates with communication channel 324 and supply channel 322 . Therefore, the pressure chamber C communicates with the nozzle N via the communication channel 324 and communicates with the space Ra via the supply channel 322 and the supply liquid chamber 326 .

As illustrated in FIGS. 2 and 3, the piezoelectric element 44 is located on the surface of the flow path structure 30 opposite to the nozzle N. As shown in FIG. Specifically, on the surface of the vibration plate 42 of the flow path structure 30 opposite to the pressure chambers C, a plurality of nozzles corresponding to different nozzles N are provided for each of the first row L1 and the second row L2. A piezoelectric element 44 is formed. Each piezoelectric element 44 is a passive element that changes the pressure in the pressure chamber C by being deformed by a drive signal supplied from the drive circuit 80 . A drive signal output from the drive circuit 80 is supplied to each piezoelectric element 44 via the connection terminal T of the wiring board 46 . The drive signal is a signal for driving the piezoelectric element 44 .

The wiring board 46 in FIG. 2 is a plate-like member facing the surface of the vibration plate 42 on which the plurality of piezoelectric elements 44 are formed with a gap therebetween. That is, the wiring board 46 is located on the opposite side of the flow channel structure 30 as viewed from the piezoelectric element 44 . A wiring that electrically connects the drive circuit 80 and the piezoelectric element 44 is formed on the wiring substrate 46 . A drive circuit 80 is installed on the surface of the wiring board 46 opposite to the nozzle N. As shown in FIG. The wiring board 46 of the first embodiment also functions as a reinforcing plate that reinforces the mechanical strength of the head unit 261 and a sealing plate that protects and seals the piezoelectric element 44 . The wiring board 46 is electrically connected to the control unit 20 via the external wiring 52 . The external wiring 52 is a flexible wiring board for supplying drive signals from the control unit 20 to the wiring board 46 . For example, connection parts such as FPCs (Flexible Printed Circuits) or FFCs (Flexible Flat Cables) are preferably employed as the external wiring 52 .

The container 90 is a case for storing the ink supplied to the plurality of pressure chambers C. As shown in FIG. A surface of the container 90 on the positive side in the Z direction is bonded to the channel substrate 32 with an adhesive, for example. As illustrated in FIG. 3, a space Rb for storing ink is formed in the container 90. As shown in FIG. The space Rb is a space elongated in the Y direction. In the first embodiment, spaces Rb are formed for each of the first row L1 and the second row L2. Space Rb of container 90 and space Ra of channel substrate 32 communicate with each other. A space composed of the space Ra and the space Rb functions as a liquid storage chamber (reservoir) R that stores ink supplied to the plurality of pressure chambers C. As shown in FIG. Ink is supplied to the liquid storage chamber R through an inlet 482 formed in the container 90 . Ink in the liquid storage chamber R is supplied to the pressure chamber C via the supply liquid chamber 326 and each supply flow path 322 . The container 90 is formed, for example, by injection molding of a resin material.

Further, as illustrated in FIG. 2 , an opening Q is formed in the container 90 at a position corresponding to the drive circuit 80 . Specifically, the drive circuit 80 is positioned inside the opening Q in plan view from the Z direction. That is, the driving circuit 80 is exposed through the opening Q. As shown in FIG.

The vibration absorber 64 in FIG. 3 is an element for absorbing pressure fluctuations of the ink in the liquid storage chamber R. As shown in FIG. The vibration absorber 64 of the first embodiment has an elastic film 641 and a support plate 643 . The elastic membrane 641 is a flexible member formed in a film shape. The elastic film 641 of the first embodiment forms the bottom surface of the common liquid chamber R by being installed on the surface of the channel substrate 32 so as to block the space Ra, the connecting channel 326 and the supply channel 322 . The support plate 643 is a flat plate made of a highly rigid material such as stainless steel. to support. The elastic film 641 deforms according to the pressure of the ink in the reservoir R, thereby suppressing pressure fluctuations in the liquid reservoir R.

The wiring board 46 includes a base portion 70 and a plurality of wirings 72 . The base portion 70 is an insulating plate-like member elongated in the Y direction and positioned between the flow path structure 30 and the drive circuit 80 . The base portion 70 is manufactured, for example, by processing a silicon single crystal substrate using semiconductor manufacturing technology. However, known materials and manufacturing methods can be arbitrarily adopted for manufacturing the base portion 70 . The wiring 72 transmits, for example, drive signals. A plurality of wirings 72 are positioned at the negative end in the Y direction of the first surface F1 of the base portion 70 .

As illustrated in FIG. 2, the base portion 70 includes a first surface F1 and a second surface F2 which are positioned opposite to each other, and which is located on the opposite side of the pressure chamber substrate 34 or the diaphragm 42 from the flow path substrate 32. is fixed to the surface of the device, for example by means of an adhesive. Specifically, the base portion 70 is installed so that the second surface F2 faces the surface of the diaphragm 42 with a gap therebetween.

As illustrated in FIG. 2, the drive circuit 80 and the external wiring 52 are mounted on the first surface F1 of the base portion 70. As shown in FIG. That is, the driving circuit 80 and the external wiring 52 are mounted on the surface of the wiring board 46 opposite to the flow channel structure 30 . The drive circuit 80 is an IC chip elongated along the longitudinal direction (Y direction) of the base portion 70 . The external wiring 52 is mounted on the negative end in the Y direction of the first surface F1 of the base portion 70 . A plurality of wirings for transmitting drive signals to the wiring board 46 are formed in the external wiring 52, for example. The plurality of wirings 72 of the wiring board 46 and the plurality of wirings of the external wirings 52 are electrically connected. The operation of driving the piezoelectric element 44 causes the drive circuit 80 to generate heat.

FIG. 4 is a cross-sectional view (a cross-sectional view of the liquid jet head 26) taken along line IV-IV in FIG. As illustrated in FIG. 4 , the liquid jet head 26 includes a plurality of head units 261 , a fixing plate 263 to which the head units 261 are fixed, and a support 265 that supports the head units 261 and the fixing plate 263 . equip.

The fixing plate 263 is a member made of, for example, highly rigid metal, and each head unit 261 is fixed thereto. The fixing plate 263 is made of stainless steel, for example. As illustrated in FIG. 4 , the fixing plate 263 of the first embodiment has a fixing portion 631 and a peripheral edge portion 633 . The fixed portion 631 is a flat portion extending in the X direction in a cross-sectional view. On the other hand, the peripheral portion 633 is a portion extending from the surface of the fixed portion 631 toward the negative side in the Z direction, and is formed in a portion of the outer periphery of the fixed portion 631 along the Y direction.

As illustrated in FIG. 4 , a plurality of head units 261 are fixed to the surface of the fixing portion 631 on the side of the support 265 . The plurality of head units 261 are fixed to the fixing portion 631 with a space therebetween. A portion of the head unit 261 on the nozzle side (that is, the positive side in the Z direction) contacts the fixed portion 631 . That is, the flow channel structure 30 of the head unit 261 contacts the fixed portion 631 . Specifically, the surface of the support plate 643 of the vibration absorber 64 on the side opposite to the elastic film 641 contacts the fixing portion 631 . As illustrated in FIG. 4 , an opening O is formed in the fixed portion 631 so as to correspond to the outer shape of the nozzle plate 62 . Therefore, the nozzle N is exposed from the opening O. As shown in FIG.

The support 265 is a box-shaped structure composed of a flat portion 653 and a frame-shaped side wall projecting from the peripheral edge of the flat portion 653 to the positive side in the Z direction. As illustrated in FIG. 4, the sidewall includes a first sidewall 651 and a second sidewall 652 facing each other. The first side wall portion 651 and the second side wall portion 652 are plate-like portions extending in the Z direction. A first side wall portion 651 and a second side wall portion 652 are formed so as to correspond to portions along the Y direction on the positive side and the negative side in the X direction of the outer periphery of the fixing portion 631 . A plurality of head units 261 are positioned between the first sidewall portion 651 and the second sidewall portion 652 . The positive side portion in the Z direction of each side wall portion is joined to the peripheral edge portion 633 and the fixed portion 631 of the fixed plate 263 . As exemplified in FIG. 4 , the end of the side wall on the positive side in the Z direction contacts the surface of the fixing portion 631 , and the surface of the side wall on the side opposite to the head unit 261 contacts the peripheral edge portion 633 . do. That is, the fixed plate 263 and the side wall are joined so that the peripheral edge 633 is engaged with the side wall. As can be understood from the above description, the support 265 contacts the fixed plate 263 at the outer periphery of the fixed plate 263 .

As illustrated in FIG. 4 , the flat portion 653 faces the fixed plate 263 with the head unit 261 interposed therebetween. The head unit 261 is joined to the surface of the flat portion 653 on the side of the fixing plate 263 . For example, the portion of the container 90 of the head unit 261 that faces the flat portion 653 is bonded to the flat portion 653 with an adhesive B. As shown in FIG. A through hole H is formed in the flat portion 653 and the adhesive B to supply the ink from the liquid container to the inlet 482 . That is, the support 265 is formed with a channel through which ink flows.

The support 265 is made of a material having higher thermal conductivity than the housing 90 and the fixing plate 263 of the head unit 261 . A support 265 is formed of a metal such as aluminum or copper, for example. In the first embodiment, the entire support 265 is made of metal. By forming the support 265 from a material having a higher thermal conductivity than the container 90 and the fixing plate 263 , the heat generated inside the head unit 261 is transferred to the support through the fixing plate 263 in contact with the head unit 261 . 265 heat is dissipated. Specifically, the heat generated in the drive circuit 80 of the head unit 261 contacts the support 265 of the vibration absorber 64 via the container 90 and the flow path structure 30 positioned around the drive circuit 80. It propagates to the fixed plate 263 . The heat propagated to the fixed plate 263 is dissipated into the outside air via the support 265 in contact with the fixed plate 263 . Therefore, an increase in temperature inside the head unit 261 can be suppressed.

For example, in a configuration in which the support 265 is made of a material having a lower thermal conductivity than the housing 90 and the fixing plate 263 (hereinafter referred to as “contrast”), the heat generated by the drive circuit 80 is transferred to the outside of the head unit 261. There is a problem that the temperature inside the head unit 261 rises because it is difficult to propagate. In contrast, according to the configuration of the first embodiment in which the support 265 is made of a material having a higher thermal conductivity than the housing 90 and the fixing plate 263 of the head unit 261, the drive circuit Heat generated at 80 is efficiently radiated from the fixed plate 263 through the support 265 . Specifically, since the area that can be used for heat dissipation is increased compared to the comparison, it is possible to suppress the temperature rise inside the head unit 261 . Therefore, it is possible to reduce the error in the ink ejection characteristics caused by the temperature rise inside the head unit 261 .

According to the configuration of the first embodiment in which the support 265 is made of metal, there is an advantage that the heat generated in the drive circuit 80 can be efficiently dissipated. In particular, according to the configuration in which the support 265 is made of aluminum, it is possible to easily form the support 265 by die casting such as die casting. In addition, in the first embodiment, the support 265 contacts the fixed plate 263 at the outer periphery of the fixed plate 263 , so that the heat of the drive circuit 80 can be radiated from the outer periphery of the fixed plate 263 . According to the configuration of the first embodiment in which the opening Q is formed in the housing 90 at a position corresponding to the drive circuit 80, compared to the configuration in which the drive circuit 80 is covered with the housing 90, the head unit 261 can reduce heat retention. Further, since the support 265 is formed with the through-holes H through which the ink flows, the heat propagated from the head unit 261 to the support 265 is efficiently radiated through the ink.

<Second embodiment>
A second embodiment of the present invention will be described. It should be noted that, in each of the following illustrations, the reference numerals used in the description of the first embodiment are used for the elements whose functions are the same as those of the first embodiment, and detailed description of each will be omitted as appropriate.

FIG. 5 is a cross-sectional view of the liquid jet head 26 according to the second embodiment. The configuration of the support 265 of the liquid jet head 26 of the second embodiment is different from that of the first embodiment. Note that the head unit 261 and the fixing plate 263 have the same configuration as in the first embodiment.

As illustrated in FIG. 5 , the support 265 of the second embodiment includes a contact portion 654 in addition to the first sidewall portion 651 , the second sidewall portion 652 and the planar portion 653 . The contact portion 654 is a portion that contacts the fixed plate 263 between the first side wall portion 651 and the second side wall portion 652 . A flat portion extending from the flat portion 653 toward the fixed plate 263 is the contact portion 654 .

A configuration in which the first head unit 261a, the second head unit 261b, and the third head unit 261c are fixed to the fixing plate 263 is assumed. The contact portion 654a contacts the fixed plate 263 between the first head unit 261a and the second head unit 261b. Similarly, the contact portion 654b contacts the fixed plate 263 between the second head unit 261b and the third head unit 261c. The ends of the contact portions 654 (654a, 654b) in the Z direction are bonded to the surface of the fixed plate 263 with an adhesive, for example. One of the first head unit 261a and the second head unit 261b is an example of the first head unit, and the other is an example of the second head unit. One of the second head unit 261b and the third head unit 261c is an example of the first head unit, and the other is an example of the second head unit.

In the second embodiment, a first side wall portion 651 and a second side wall portion 652 that contact the outer periphery of the fixed plate 263 and a contact portion that contacts the fixed plate 263 between the first side wall portion 651 and the second side wall portion 652 654 are included in the support 265 , the heat of the driving circuit 80 can be radiated not only from the outer circumference of the fixing plate 263 but also from between the first side wall portion 651 and the second side wall portion 652 . Heat tends to stay particularly between the head units 261 (261a, 261b, 261c). In the second embodiment, since the support 265 has the contact portion 654 that contacts the fixed plate 263 between the head units 261, there is an advantage that the heat remaining between the head units 261 can be efficiently dissipated.

Since black ink is frequently used for printing, it is particularly necessary to suppress the temperature rise of the head unit 261 that ejects black ink and reduce errors in the ejection characteristics. Therefore, when at least one of the two head units 261 adjacent to each other ejects black ink, a configuration in which the contact portion 654 is formed between the two head units is particularly suitable.

<Third Embodiment>
FIG. 6 is a cross-sectional view of the liquid jet head 26 according to the third embodiment. The support 265 of the third embodiment includes a connecting portion 655 in addition to the planar portion 653 and the side wall portions. As illustrated in FIG. 6 , a connecting portion 655 is formed at a position corresponding to the opening Q of the container 90 . The connecting portion 655 of the third embodiment is located inside the opening Q and is thermally connected to the drive circuit 80 . In addition, the element A and the element B are "thermally connected",
(1) a state in which element A and element B are in direct contact, or
(2) An element C having a thermal conductivity of 10 W·m−1·K−1 or more is interposed between the elements A and B, and the gap between the elements A and B is 50 μm. means a condition that:

Specifically, the connecting portion 655 is located between the upper surface of the driving circuit 80 and the flat portion 653 . In the third embodiment, a filler G such as grease is interposed between the drive circuit 80 and the connecting portion 655 . In the above configuration, the drive circuit 80 and the connecting portion 655 are thermally connected via the filler G. As shown in FIG.

The third embodiment also achieves the same effect as the first embodiment. In the third embodiment, since the support 265 includes the connection portion 655 that is thermally connected to the drive circuit 80, the heat generated inside the head unit 261 can be efficiently dissipated from the support 265 as well. There are advantages. Note that the third embodiment may be applied to the second embodiment.

<Fourth Embodiment>
FIG. 7 is a cross-sectional view of a head unit 261 according to the fourth embodiment. As illustrated in FIG. 7, in the fourth embodiment, the head unit 261 is conveniently divided into a first portion P1 and a second portion P2 with a reference plane O parallel to the YZ plane as a boundary. The first portion P1 and the second portion P2 have a relationship of substantially plane symmetry with the reference plane O interposed therebetween. The structure of the first portion P1 located on the positive side in the X direction with respect to the reference plane O is the same as in the first embodiment. The second portion P2 has a structure in which the nozzle N and the piezoelectric element 44 are omitted from the structure of the first embodiment.

A circulation channel 328 is formed for each nozzle N of the first portion P1 in the channel substrate 32 of the fourth embodiment. The circulation flow path 328 is a space surrounded by grooves formed in the surface of the flow path substrate 32 facing the nozzle plate 62 and the surface. The communication channel 324 of the first portion P 1 and the communication channel 324 of the second portion P 2 communicate with each other via a circulation channel 328 .

The ink supplied to the through hole H of the first portion P1 is, as illustrated by the dashed arrow in FIG. It is supplied to the communication flow path 324 via the path 322→pressure chamber C. Of the ink supplied to the communication channel 324, the ink that is not ejected from the nozzles N is supplied to the communication channel 324 of the second portion P2 via the circulation channel 328, and is supplied to the communication channel 324 in the second portion P2. →pressure chamber C→supply channel 322→supply liquid chamber 326→liquid storage chamber R→introduction port 482.

As illustrated in FIG. 7, the liquid ejecting apparatus 100 of the fourth embodiment includes a circulation mechanism 92. As shown in FIG. The circulation mechanism 92 is a mechanism that circulates the ink discharged from the head unit 261 to the head unit 261 . The circulation mechanism 92 is a mechanism for circulating the ink supplied to the head unit 261, and includes a supply channel 921, a discharge channel 922, and a circulation pump 923, for example.

The supply channel 921 is connected to the through hole H of the first portion P1. The discharge channel 922 is connected to the through hole H of the second portion P2. The supply channel 921 is a channel for supplying ink to the through hole H of the first portion P1, and the discharge channel 922 is a channel for discharging ink from the through hole H of the second portion P2. be. The circulation pump 923 is a pumping mechanism that sends the ink supplied from the discharge channel 922 to the supply channel 921 . That is, the ink discharged from the through hole H of the second portion P2 is circulated to the through hole H of the first portion P1 via the discharge channel 922, the circulation pump 923, and the supply channel 921.

As can be understood from the above description, in the fourth embodiment, of the ink supplied from the supply channel 921 to the first portion P1, the ink that is not ejected from the nozzle N is discharged from the second portion P2 to the discharge channel 922. It is discharged and circulated to the supply channel 921 by the circulation pump 923 . That is, the ink inside the head unit 261 circulates.

As described above, according to the fourth embodiment, there is an advantage that the heat generated inside the head unit 261 is easily dissipated by circulation of the ink. Especially in the fourth embodiment, since the ink circulates through the path including the liquid storage chamber R and the pressure chamber C located around the drive circuit 80, the heat generated in the drive circuit 80 can be efficiently dissipated. be. In addition, since the ink in the head unit 261 is circulated through the through holes H, the heat generated in the head unit 261 can be efficiently dissipated through the support.

<Modification>
Each form illustrated above can be variously modified. Specific modifications that can be applied to each of the above-described modes are exemplified below. Two or more aspects arbitrarily selected from the following examples can be combined as appropriate within a mutually consistent range.

(1) The configuration of the support 265 is not limited to the examples of the above-described forms. The shape of the support 265 is arbitrary as long as the support 265 includes a portion where the support 265 contacts the fixing plate 263 . For example, a configuration in which the support 265 includes elements other than the side wall portion and the contact portion 654, or a configuration in which the support 265 does not include the planar portion 653 may be employed. A portion of the fixing plate 263 that contacts the support 265 can be changed as appropriate according to the configuration of the support 265 . That is, the portion of the fixing plate 263 that the support 265 contacts is not limited to the outer circumference of the fixing plate 263 or the space between the first side wall portion 651 and the second side wall portion 652 .

(2) In each of the above-described embodiments, the fixing plate 263 is composed of the fixing portion 631 and the peripheral portion 633, but the shape of the fixing plate 263 is not limited to the above examples. For example, the peripheral portion 633 may be omitted. However, according to the configuration in which the fixing plate 263 includes the peripheral edge portion 633 and the fixing portion 631, the contact area between the fixing plate 263 and the support body 265 is larger than that in the configuration in which the fixing plate 263 does not include the peripheral edge portion 633, for example. To increase. Therefore, the heat generated by the drive circuit 80 can be efficiently radiated from the support 265 via the fixing plate 263 . Also, the fixing plate 263 may include elements other than the fixing portion 631 and the peripheral edge portion 633 .

(3) In each of the above-described embodiments, the support 265 is made of a material having higher thermal conductivity than the container 90 and the fixing plate 263, but the support 265 is made of a material having a higher thermal conductivity than the fixing plate 263. is not required. If the support 265 is made of a material having a higher thermal conductivity than the container 90, the heat generated by the drive circuit 80 can be dissipated from the fixed plate 263 via the support 265. Realized. However, according to the configuration in which the support 265 is made of a material having a higher thermal conductivity than that of the fixed plate 263 , the heat transmitted from the drive circuit 80 to the fixed plate 263 is easily transferred to the support 265 . Therefore, there is an advantage that the heat of the drive circuit 80 can be efficiently dissipated compared to the structure in which the support 265 has a lower thermal conductivity than the fixed plate 263 .

(4) In each of the above-described embodiments, the entire support 265 is made of a metal material having higher thermal conductivity than the container 90, but part of the support 265 is made of a material having a higher thermal conductivity than the container 90. may be formed with For example, the side wall portion in contact with the fixing plate 263 may be made of a material with a higher thermal conductivity than the container 90 and the other portion may be made of a material with a higher thermal conductivity than the container 90 . In addition, in the second embodiment, the contact portion 654 may be made of a material having a higher thermal conductivity than the container 90 .

(5) In each of the above embodiments, the support plate 643 of the vibration absorber 64 contacts the fixed plate 263 , but the portion of the flow path structure 30 that contacts the fixed plate 263 is not limited to the support 265 . For example, when the support plate 643 is omitted from the vibration absorber 64 , the elastic film 641 contacts the fixed plate 263 . Moreover, when the vibration absorber 64 is omitted in the flow path structure 30 , the flow path substrate 32 contacts the fixed plate 263 . As described above, the portion of the flow path structure 30 that contacts the fixed plate 263 is appropriately changed according to the configuration of the flow path structure 30 . Moreover, the configuration of the flow path structure 30 is not limited to the above examples.

(6) In each of the above embodiments, the support 265 is made of metal, but the support 265 may be made of any material as long as it has a higher thermal conductivity than the container 90 . For example, the support 265 may be made of high thermal conductive resin.

(7) In each of the above-described embodiments, the configuration in which the drive circuit 80 is mounted on the surface of the wiring board 46 opposite to the flow path structure 30 is adopted. Not limited. For example, as illustrated in FIG. 8, a configuration in which the drive circuit 80 is mounted on the flexible wiring board 46 whose end is joined to the flow path structure 30 is also employed. In the configuration described above, the piezoelectric element 44 is covered with the sealing portion 49 . However, in the configurations exemplified in the above embodiments, the heat generated by the drive circuit 80 tends to stay inside the head unit 261 as compared with the configuration exemplified in FIG. Therefore, it is more effective to form the support 265 in contact with the fixing plate 263 with a material having a higher thermal conductivity than the housing 90 of the head unit 261 .

(8) In each of the above embodiments, the surface of the support 265 may be uneven. That is, a heat sink is formed on the surface of support 265 . According to the above configuration, the surface area of the support 265 is increased compared to the configuration where the surface of the support 265 is flat, so heat generated inside the head unit 261 can be efficiently radiated.

(9) In each of the above-described embodiments, it is preferable that the fixed plate 263 has a higher thermal conductivity than the container 90 . According to the above configuration, heat generated inside the head unit 261 can be efficiently radiated also from the fixing plate 263 .

(10) The driving element for ejecting the ink in the pressure chamber C from the nozzle N is not limited to the piezoelectric element 44 exemplified in each of the above embodiments. For example, it is possible to use, as the drive element, a heating element that generates bubbles in the pressure chamber C by heating to change the pressure. As can be understood from the above examples, the drive element is comprehensively expressed as an element for ejecting the liquid in the pressure chamber C from the nozzle N, and the operation method (piezoelectric method/thermal method) and specific configuration are different. No question.

(11) In each of the above-described embodiments, the serial-type liquid ejecting apparatus 100 that reciprocates the carrier 242 on which the head unit 261 is mounted has been exemplified. The present invention can also be applied to devices. According to the line-type liquid ejecting apparatus, the liquid ejecting head is a line head, and employs a configuration including a housing that contacts the support and fixes the liquid ejecting head. According to the above configuration, since the support 265 contacts the housing to which the liquid jet head is fixed, there is an advantage that the heat of the head unit can be dissipated through the housing.

(12) The liquid ejecting apparatus 100 exemplified in each of the above embodiments can be employed in various types of equipment such as facsimile machines and copiers, in addition to equipment dedicated to printing. However, the application of the liquid ejecting apparatus of the present invention is not limited to printing. For example, a liquid ejecting apparatus that ejects a colorant solution is used as a manufacturing apparatus for forming a color filter for a display device such as a liquid crystal display panel. Also, a liquid ejecting apparatus that ejects a solution of a conductive material is used as a manufacturing apparatus for forming wiring and electrodes of a wiring board. Further, a liquid ejecting apparatus that ejects a solution of an organic matter related to living organisms is used as a manufacturing apparatus for manufacturing biochips, for example.

DESCRIPTION OF SYMBOLS 100... Liquid ejecting apparatus 12... Medium 14... Liquid container 20... Control unit 22... Conveying mechanism 24... Moving mechanism 242... Conveying body 244... Conveying belt 26... Liquid ejecting head 261... Head unit , 263... Fixed plate 265... Support body 651... First side wall part 652... Second side wall part 653... Flat part 654... Contact part 655... Connection part 30... Flow path structure 32... Flow Circuit board 34 Pressure chamber board 42 Diaphragm 44 Piezoelectric element 46 Wiring board 50 Liquid ejecting part 52 External wiring 62 Nozzle plate 631 Fixed part 633 Peripheral part 64 Vibration absorber 70 Base portion 72 Wiring 80 Drive circuit 90 Housing body Introduction port 482 .

Claims (13)

a head unit including a liquid ejector for ejecting liquid from a nozzle in an ejection direction, a drive circuit for driving the liquid ejector, and a container having a space for storing the liquid;
a fixing plate that contacts the head unit on the nozzle side of the head unit;
a support that contacts the fixed plate and supports the head unit;
the support includes a first side wall portion and a second side wall portion contacting the outer circumference of the fixed plate;
the head unit is positioned between the first side wall portion and the second side wall portion;
the support includes a contact portion that contacts the fixed plate between the first side wall portion and the second side wall portion;
The liquid ejecting head, wherein the support is made of a material having higher thermal conductivity than the container.
a head unit including a liquid ejector for ejecting liquid from a nozzle in an ejection direction, a drive circuit for driving the liquid ejector, and a container having a space for storing the liquid;
a fixing plate that contacts the head unit on the nozzle side of the head unit;
a support that contacts the fixed plate and supports the head unit;
comprising a plurality of the head units including a first head unit and a second head unit;
the support includes a contact portion that contacts the fixed plate between the first head unit and the second head unit;
The liquid ejecting head, wherein the support is made of a material having higher thermal conductivity than the container.
the support includes a first side wall portion and a second side wall portion contacting the outer circumference of the fixed plate;
the first and second head units are positioned between the first sidewall and the second sidewall;
3. The liquid jet head according to claim 2.
4. The liquid jet head according to claim 2, wherein at least one of the first head unit and the second head unit jets black ink.
The support includes a planar portion,
the first and second side wall portions protrude from the periphery of the flat portion in the injection direction;
The contact portion protrudes from the flat portion in the ejection direction,
4. The liquid jet head according to claim 1 or 3.
The fixed plate includes a fixed portion to which the head unit is fixed, and a peripheral portion extending from an outer circumference of the fixed portion in a direction opposite to the ejection direction,
a surface of the first side wall portion opposite to the head unit is in contact with the peripheral edge portion;
6. The liquid jet head according to any one of claims 1, 3 and 5.
The drive circuit is elongated in a first direction perpendicular to the injection direction,
the head unit is arranged between the first side wall portion and the second side wall portion in a second direction perpendicular to the ejection direction and the first direction;
each of the first sidewall portion and the second sidewall portion extends along the first direction;
7. The liquid jet head according to any one of claims 1, 3, 5 and 6.
8. The liquid jet head according to claim 1, wherein the support is made of metal.
The liquid injection part is
a flow path structure in which a pressure chamber is formed that contacts the fixed plate and communicates with the nozzle;
a driving element located on the opposite side of the nozzle in the flow channel structure and changing the pressure of the pressure chamber;
a wiring substrate located on the opposite side of the flow path structure as viewed from the drive element and having a wiring formed thereon for electrically connecting the drive circuit and the drive element,
9. The liquid jet head according to any one of claims 1 to 8, wherein the drive circuit is mounted on a surface of the wiring substrate opposite to the flow channel structure.
The liquid jet head according to any one of claims 1 to 9, wherein the support has higher thermal conductivity than the fixing plate.
The liquid jet head according to any one of Claims 1 to 10, wherein the support is made of aluminum.
The liquid jet head according to any one of claims 1 to 11, wherein unevenness is formed on the surface of the support.
The liquid jet head according to any one of Claims 1 to 12, wherein the fixing plate has higher thermal conductivity than the container.

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