CN110610902B - Screen body manufacturing method and display device - Google Patents
Screen body manufacturing method and display device Download PDFInfo
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- CN110610902B CN110610902B CN201910911745.6A CN201910911745A CN110610902B CN 110610902 B CN110610902 B CN 110610902B CN 201910911745 A CN201910911745 A CN 201910911745A CN 110610902 B CN110610902 B CN 110610902B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
- H01L27/1244—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits for preventing breakage, peeling or short circuiting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
Abstract
The application relates to a screen body manufacturing method and a display device. Firstly, an insulating bulge is manufactured on the surface of a substrate. The insulating protrusion is located on the same side of the signal lines on the surface of the substrate. And then manufacturing a short-circuit line on the surface of the substrate, wherein the short-circuit line crosses the surface of the insulating bulge and connects the signal lines with each other. And then cutting the substrate to form a plurality of screen bodies, and finally removing the short circuit lines on the surface of the insulating bulge so as to mutually disconnect the signal lines. The connection between the signal wires is disconnected by polishing the short circuit lines on the surfaces of the insulating bulges, so that the process difficulty is reduced, and a particularly accurate positioning instrument is not needed, so that the production efficiency is improved, and the production cost is reduced.
Description
Technical Field
The present disclosure relates to the field of display, and in particular, to a method for manufacturing a display panel and a display device.
Background
In the manufacturing process of the driving display substrate of the display screen at present, a large amount of static electricity which is unfavorable for the performance of the product is generated in each manufacturing process. Shorting bars (Shorting bars) are commonly used to address the static electricity problem in each process, and are finally disconnected. However, the existing method for disconnecting the short-circuit rod has high precision requirement, thereby increasing the production cost.
Disclosure of Invention
In view of the above, it is necessary to provide a screen body manufacturing method and a display device, which address the problem that the conventional method for finally disconnecting the shorting bar has a high requirement for accuracy.
A method of making a screen, the method comprising:
s10, providing a display substrate, wherein a plurality of signal lines are arranged on the surface of the display substrate;
s20, manufacturing an insulating bulge on the surface of the display substrate, wherein the insulating bulge is positioned on the same side of the signal lines on the surface of the substrate;
s30, manufacturing a short circuit on the surface of the display substrate, wherein the short circuit covers the insulation protrusion and connects the signal wires with each other;
s40, cutting the display substrate to form a plurality of display screen bodies;
s50, cutting the short circuit line along the insulation protrusion of each display screen body to disconnect the signal lines from each other.
In one embodiment, the S20 includes:
s11, defining cutting positions on the same side of the signal wires;
and S12, forming a plurality of insulation bulges at the surface of the cutting position at intervals side by side, wherein the insulation bulges are in one-to-one correspondence with the signal wires.
In one embodiment, the S30 includes:
the short circuit line comprises a plurality of short circuit branches, wherein one end of each short circuit branch is connected with one corresponding signal line, one ends of the short circuit branches, which are far away from the signal line, are connected with each other on one side, which is far away from the signal line, of the insulating bulge, and each short circuit line comprises a plurality of short circuit branches.
In one embodiment, the S30 includes:
s31, providing a first prefabricated layer, wherein the first prefabricated layer comprises a graphene layer, a metal layer and an organic layer which are sequentially stacked;
s32, covering the first prefabricated layer on the surface of the display substrate and the surface of the insulating protrusion, and attaching the graphene layer to the surface of the display substrate and the surface of the insulating protrusion;
s33, removing the organic layer to form a second prefabricated layer;
s34, etching the second prefabricated layer to form the short circuit line, wherein the short circuit line crosses the surface of the insulation bulge and connects the signal lines with each other.
In one embodiment, the S31 includes:
s311, forming the graphene layer on the surface of the copper foil;
s312, forming a metal layer on the surface of the graphene layer far away from the copper foil;
s313, forming the organic layer on the surface of the metal layer far away from the graphene layer;
and S314, removing the copper foil to form the first prefabricated layer.
In one embodiment, in S50:
and removing the short circuit lines on the surfaces of the insulating bulges by ultrasonic waves to disconnect the signal lines from each other.
In one embodiment, in S50, the short circuit line on the surface of the insulating bump is removed through an electrochemical polishing process to disconnect the signal lines from each other.
A display device, comprising:
the display screen comprises a display screen body, wherein a plurality of signal wires are arranged on the surface of the display screen body;
and the insulating bulge is arranged on the display screen body and is positioned on one side of the plurality of signal wires.
In one embodiment, the number of the insulating protrusions is multiple, the insulating protrusions are arranged side by side at intervals, and the tops of the insulating protrusions are arc-shaped surfaces.
In one embodiment, the cross section of the insulating protrusion along the direction parallel to the display screen body is in one or more of a rectangular structure, a circular structure and an oval structure.
According to the screen body manufacturing method and the display device, the insulating protrusions are manufactured on the surface of the display substrate, the short circuit lines are manufactured on the surfaces of the insulating protrusions, when the connection between the signal lines needs to be disconnected, the short circuit lines are cut off along the insulating protrusions of each display screen body, and therefore the signal lines can be disconnected. When the connection between the signal wires is disconnected, the signal wires on the surfaces of the insulating bulges are used as the disconnection positions of the signal wires, so that the positioning difficulty and the process difficulty of disconnecting the short-circuit lines are reduced. Compared with the method that the short circuit line is directly arranged on the surface of the display substrate, the short circuit line is removed on the surface of the insulating protrusion, so that the circuit on the surface of the display substrate cannot be damaged due to deviation of the polishing position and the polishing thickness, the process difficulty is reduced by polishing the short circuit line on the surface of the insulating protrusion to break the connection between the signal lines, a particularly accurate positioning instrument is not needed, the production efficiency is improved, and the production cost is reduced.
Drawings
Fig. 1 is a flowchart of a method for manufacturing a display screen according to an embodiment of the present disclosure;
FIG. 2 is a flow chart of a method for forming an insulation bump according to an embodiment of the present disclosure;
fig. 3 is a schematic view illustrating a plurality of insulation bumps disposed on a surface of a display substrate according to an embodiment of the present disclosure;
FIG. 4 is a cross-sectional view of a display substrate and an insulating bump according to an embodiment of the present disclosure;
fig. 5 is a diagram of a first prefabricated layer structure provided in the embodiment of the present application;
fig. 6 is a diagram of a second prefabricated layer structure provided in the embodiment of the present application;
fig. 7 is a structural diagram of a second prefabricated layer formed on a surface of a copper foil according to an embodiment of the present disclosure;
fig. 8 is a schematic view of the insulation convex surface provided in the embodiment of the present application as an arc surface.
Description of reference numerals:
Short-circuit line 130
Short-circuit branch 132
First preform layer 150
Graphene layer 152
Second preform layer 160
Arcuate surface 152
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more clearly apparent, the screen body manufacturing method and the display device of the present application are further described in detail below by way of embodiments and with reference to the accompanying drawings.
The numbering of the components as such, e.g., "first", "second", etc., is used herein only to distinguish the objects as described, and does not have any sequential or technical meaning. The term "connected" and "coupled" when used in this application, unless otherwise indicated, includes both direct and indirect connections (couplings). In the description of the present application, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present application and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be considered as limiting the present application.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
The inventor researches and discovers that the display substrate (TFT backboard) is usually made of glass, so the display substrate is not conductive. During the process of manufacturing the display screen, static electricity is easily accumulated on the single independent structure of the display substrate, such as the signal line, causing static electricity damage. To avoid the electrostatic problem, a Shorting Bar (Shorting Bar) is generally used to connect a plurality of signal line connections to each other to prevent the static electricity from accumulating on a single signal line to cause local damage. In some embodiments, the shorting bar is disconnected by cutting the display substrate at a cutting line when the display substrate is finally cut to form a single display screen body. However, when cutting, if the position of the cutting line is not accurate enough, the cutting surface of the display substrate is easy to remain metal, and there is a risk that the metal is corroded. There is therefore a need for an accurate determination of the cutting position, which requires a more precise position-finding instrument. In some embodiments, the shorting bar may be disconnected by laser, but the use of laser requires a high degree of operational precision. And a laser machine is required to be provided, thereby increasing the production cost.
Referring to fig. 1, an embodiment of the present application provides a method for manufacturing a screen body. The manufacturing method comprises the following steps:
s10, providing a display substrate 100, wherein a plurality of signal lines 120 are disposed on a surface of the display substrate 100.
Referring to fig. 1a, in S10, the display substrate 100 is an insulating material and has no conductivity. The display substrate 100 may be a glass display substrate. The display substrate 100 may have a thin film transistor driving circuit therein. The surface of the display substrate 100 may be provided with a plurality of signal lines 120. The signal line 120 may be a data line or a scan line. The plurality of signal lines 120 may be arranged side by side.
S20, an insulating bump 110 is formed on the surface of the display substrate 100. The insulating protrusion 110 is located on the same side of the plurality of signal lines 120 on the surface of the display substrate 100.
The insulating protrusion 110 may be made of an insulating material such as silicon nitride, silicon oxide, or aluminum oxide. The height of the insulating protrusion 110 may be the same as that of the signal line 120. The insulating protrusion 110 may be fabricated by a photolithography, development and etching process. In one embodiment, the height of the insulation bump 110 may be 0-50 nm higher or lower than the signal line. Therefore, when the short circuit line 130 on the surface of the insulation bump 110 is removed, abrasion of the signal line 120 can be avoided or reduced.
S30, forming the short circuit 130 on the surface of the display substrate 100. The short circuit line 130 covers the insulating protrusion 110 and connects the plurality of signal lines 120 to each other.
Referring to fig. 1b, in S20, the short circuit 130 may cover the display substrate 100 and the surface of the insulating display substrate 100 away from the display substrate 100. The short circuit line 130 may be attached to the display substrate 100 and the insulating protrusion 110. The short circuit line 130 may connect the plurality of signal lines 120 to each other. Therefore, before the display substrate 100 is cut, the short circuit line 130 may be formed by the photolithography, development, etching, and the like. It is understood that the short circuit line 130 may be made of a metal material. The short circuit line 130 may be made of molybdenum, silver, titanium, aluminum, gold, copper, or the like. When static electricity is introduced from the signal line 120, the signal lines 120 may be short-circuited by the short circuit line 130, so that the signal lines 120 share the static electricity with each other, and thus the signal lines 120 may be protected from being damaged by the static electricity.
S40, cutting the display substrate 100 to form a plurality of display panels 200. A cutting line may be predetermined on the surface of the display substrate 100 according to the size of the display screen body, and the display substrate 100 may be cut into a plurality of display screen bodies 200 according to the cutting line. In this embodiment, the cutting line may not intersect or overlap with the short circuit line 130, so that the cutting line may be prevented from being too close to the middle of the display panel body 200, so that the circuit is exposed and corroded in the cutting surface of the display substrate 100 after cutting.
Referring to fig. 1c, S50, the short circuit 130 is cut along the insulation protrusion 110 of each display panel 200, so that the signal lines 120 are disconnected from each other.
In S50, the short circuit 130 on the surface of the insulating bump 110 may be removed or cut off by polishing, that is, after the short circuit 130 on the surface of the insulating bump 110 is removed or cut off, the short circuit 130 is disconnected, so that the signal lines 120 cannot be connected to each other, and thus the short circuit of the signal lines 120 in the following manufacturing process can be avoided. It can be understood that, since the insulating protrusion 110 protrudes to a certain height relative to the surface of the display substrate 100, the insulating protrusion 110 only needs to be aligned during polishing, and the circuit on the surface of the display substrate 100 is not damaged due to the deviation between the polishing position and the polishing thickness. Therefore, the difficulty of the process of disconnecting the signal lines 120 is reduced by removing the short circuit 130 on the surface of the insulating protrusion 110, and a particularly precise positioning instrument is not required, thereby improving the production efficiency and reducing the production cost.
In the method for manufacturing the screen body according to the embodiment of the present application, the insulating protrusion 110 is manufactured on the surface of the display substrate 100, and the short circuit line 130 is manufactured on the surface of the insulating protrusion 110, so that when the connection between the signal lines 120 is disconnected, the short circuit line 130 on the surface of the insulating protrusion 110 is removed along the insulating protrusion 110 of each display screen body 200. When the disconnection between the signal lines 120 is removed, the short-circuit line 130 on the surface of the insulating protrusion 110 is used as a position where the signal line 120 is disconnected, thereby reducing the difficulty of positioning and the difficulty of the process of disconnecting the short-circuit line 130. Compared with the method of directly arranging the short circuit 130 on the surface of the display substrate 100, the method of removing the short circuit 130 on the surface of the insulating protrusion 110 does not damage the surface of the display substrate 100 due to the deviation of the polishing position and the polishing thickness, so that the process difficulty is reduced by polishing the short circuit 130 on the surface of the insulating protrusion 110 to disconnect the signal lines 120, and a particularly accurate positioning instrument is not required to be added, so that the production efficiency is improved, and the production cost is reduced.
Referring to fig. 2, in one embodiment, the S20 includes:
s21, defining a cutting location 140 on the same side of the plurality of signal lines 120.
S22, forming a plurality of insulation protrusions 110 spaced side by side on the surface of the cutting site 140. The plurality of insulation protrusions 110 correspond to the plurality of signal lines 120 one to one.
In this embodiment, the signal lines 120 may be arranged in parallel and spaced apart from each other. The number of the insulation bumps 110 may be the same as the number of the signal lines 120. Each of the insulation protrusions 110 may be correspondingly disposed at a position of an extension line of the signal line 120 corresponding thereto.
Referring to fig. 3-4, in an embodiment, the S30 includes:
a short circuit branch 132 is formed on the surface of each of the insulating protrusions 110. One end of each of the short-circuit branches 132 is connected to a corresponding one of the signal lines 120. The ends of the short-circuit branches 132 away from the signal line 120 are connected to each other at the side of the insulating protrusion 110 away from the signal line 120. The short-circuit line 130 includes a plurality of short-circuit branches 132.
In this embodiment, the short circuit 130 may include a plurality of short circuit branches 132. Each shorting leg 132 may be a conductive line. That is, one conductive line may be formed on the surface of each of the insulating protrusions 110. One end of the conductive line is connected to the signal line 120 corresponding to the insulating protrusion 110. The other end of the conductive line crosses the insulation bump 110 and then extends to a side of the insulation bump 110 away from the signal line 120, and covers the surface of the display substrate 100. Ends of the plurality of conductive lines remote from the signal line 120 may be connected to each other. Therefore, a plurality of signal lines 120 can be correspondingly connected by a plurality of short-circuit branches 132. Thus, the purpose of preventing static electricity from being concentrated on a certain signal line 120 can be achieved.
It can be understood that each of the insulation protrusions 110 corresponds to one of the short circuit branches 132. Therefore, when one of the signal lines 120 needs to be disconnected from the other signal lines 120, only the short-circuit branch 132 connected to the signal line 120 needs to be disconnected. The signal line 120 can be disconnected from other signal lines 120 by removing the short-circuit branches 132 on the surface of the insulation protrusion 110. Since one insulating protrusion 110 corresponds to one short-circuit branch 132, the removal of one short-circuit branch 132 on the surface of one insulating protrusion 110 is more accurate and more thorough than the simultaneous removal of a plurality of short-circuit branches 132 on the surface of one insulating protrusion 110, which can ensure that the short-circuit branches 132 are disconnected. By separately removing the short-circuit branch 132 on the surface of each insulation protrusion 110, a short circuit caused by the failure of removing the short-circuit branch 132 in a later process can be avoided.
Referring to fig. 5-6, in one embodiment, the S30 includes:
s31 provides a first pre-fabricated layer 150, the first pre-fabricated layer 150 including a graphene layer 152, a metal layer 154, and an organic layer 156, which are sequentially stacked. The graphene layer 152 may be grown on the surface of a substrate and then the metal layer 154 may be deposited on the surface of the graphene layer 152. The thickness of the metal layer 154 may be 30nm to 70 nm. The metal layer 154 may serve as a support. It is understood that the graphene layer 152 has conductivity and thus may function to transfer static electricity. The adhesion between graphene layer 152 and the surface of insulation bump 110 is van der waals, and the adhesion is low. Therefore, the graphene layer 152 is easily separated from the surface of the insulation bump 110 under external vibration or the like, thereby achieving the purpose of disconnecting the short circuit 130.
The organic layer 156 may be an organic material such as polymethyl methacrylate. The organic layer 156 can support the first pre-manufactured layer 150 during transfer and can prevent the first pre-manufactured layer 150 from being torn due to uneven stress during transfer.
S32, the first pre-fabricated layer 150 is covered on the surface of the display substrate 100 and the surface of the insulation protrusion 110. The graphene layer 152 is attached to the surface of the display substrate 100 and the surface of the insulating protrusion 110. I.e. the graphene layer 152 is located at the outermost layer of the first pre-fabricated layer 150. The graphene layer 152 is directly attached to the surfaces of the insulating protrusion 110 and the display substrate 100.
S33 removes the organic layer 156 to form a second pre-fabricated layer 160. The organic layer 156 may be dissolved away by a chemical agent. The chemical agent may be an organic solvent. The second pre-fabricated layer 160 may thus include the graphene layer 152 and the metal layer 154.
S34 etching the second pre-fabricated layer 160 to form the short circuit 130, wherein the short circuit 130 crosses over the surface of the insulation protrusion 110 and connects the signal lines 120 to each other. The metal layer 154 may be etched by wet etching using a mask plate during the etching process. The graphene layer 152 is then etched by dry etching. The etching resistance can be reduced and the etching efficiency can be improved by two times of etching and layered etching.
Referring to fig. 7, in one embodiment, the S31 includes:
s311, the graphene layer 152 is formed on the surface of the copper foil 168. The graphene layer 152 may be deposited by chemical vapor deposition or physical vapor deposition.
S312, a metal layer 154 is formed on the surface of the graphene layer 152 away from the copper foil 168. The metal layer 154 may be formed by physical vapor deposition. The metal layer 154 may be aluminum, silver, gold, titanium, or the like.
S313, the organic layer 156 is formed on the surface of the metal layer 154 away from the graphene layer 152. A liquid organic material may be applied on the surface of the metal layer 154, and the liquid organic material may be formed into the organic layer 156 by drying or the like.
S314, removing the copper foil 168 to form the first pre-fabricated layer 150. The copper foil 168 may be dissolved away by a chemical agent.
In one embodiment, in S50:
the short circuit line 130 on the surface of the insulation bump 110 is removed by ultrasonic waves to disconnect the plurality of signal lines 120 from each other. The portion of the short circuit line 130 attached to the insulating bump 110 is the graphene layer 152. Since the adhesion between the graphene layer 152 and the surface of the insulating bump 110 is small, the graphene layer 152 can be detached from the surface of the insulating bump 110 by ultrasonic waves, and the influence on the surface circuit of the display substrate 100 can be reduced.
In one embodiment, in S50, the short circuit line 130 on the surface of the insulation bump 110 is removed through an electrochemical polishing process to disconnect the signal lines 120 from each other. The electrochemical polishing process has simple equipment and convenient use, and can reduce the production cost.
The embodiment of the application also provides a display device. The display device includes a display body 200 and an insulating protrusion 110. The surface of the display screen body 200 is provided with a plurality of signal lines 120. The insulation protrusion 110 is disposed on one side of the plurality of signal lines 120 of the display panel body 200. The insulating bump 110 may serve as a platform for breaking the short circuit line 130. The height of the insulation protrusion 110 may be substantially the same as the height of the signal line 120. The insulating protrusion 110 may be left in the display device. And the insulation bump 110 does not affect the post-process.
Referring to fig. 8, in one embodiment, the number of the insulation protrusions 110 is multiple. A plurality of the insulation protrusions 110 are arranged side by side at intervals. The top of the insulating protrusion 110 is an arcuate surface 158. Before the display substrate 100 is cut, a short circuit branch 132 may be disposed on a surface of each of the insulating protrusions 110. The short circuit branches 132 on the surface of the insulating protrusion 110 are removed after cutting the display substrate 100. The top of the insulating protrusion 110 is an arc surface 158, so that when the graphene layer 152 is vibrated, the surface of the graphene layer 152 is loosened, which is beneficial to the separation of the graphene layer 152 from the top of the insulating protrusion 110, and the purpose of disconnecting the short circuit line 130 is achieved. When the top of the insulating protrusion 110 is the arc-shaped surface 158, it is also advantageous to remove the short circuit 130 of the arc-shaped surface 158 by a polishing process. I.e., the top of the insulation bump 110 is an arc-shaped surface 158, the short-circuit line 130 may be polished along the top tangent plane of the arc-shaped surface 158 during polishing. It is therefore convenient to cut the short-circuit line 130 at the highest position of the insulating bump 110, and the short-circuit line 130 can be cut off by removing less material of the short-circuit line 130.
In one embodiment, the cross-section of the insulation protrusion 110 along the direction parallel to the display screen body 200 is one or more of a rectangular structure, a circular structure and an oval structure. Namely, the projection of the insulation protrusion 110 on the display substrate 100 is one or more of a rectangular structure, a circular structure and an elliptical structure. The insulating protrusion 110 has a simple structure, is convenient to manufacture, and can improve the production efficiency.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present patent. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A screen body manufacturing method is characterized by comprising the following steps:
s10, providing a display substrate (100), wherein a plurality of signal lines (120) are arranged on the surface of the display substrate (100);
s20, manufacturing an insulating bump (110) on the surface of the display substrate (100), wherein the insulating bump (110) is positioned on the same side of the signal lines (120) on the surface of the substrate (100);
s30, manufacturing a short circuit line (130) on the surface of the display substrate (100), wherein the short circuit line (130) covers the insulating protrusion (110) and connects the signal lines (120) with each other;
s40, cutting the display substrate (100) to form a plurality of display screen bodies (200);
s50, cutting off the short circuit line (130) along the insulation projection (110) of each display screen body (200) to disconnect the signal lines (120) from each other;
the S30 includes:
s31, providing a first prefabricated layer (150), wherein the first prefabricated layer (150) comprises a graphene layer (152), a metal layer (154) and an organic layer (156) which are sequentially stacked;
s32, covering the first prefabricated layer (150) on the surface of the display substrate (100) and the surface of the insulation protrusion (110), and enabling the graphene layer (152) to be attached to the surface of the display substrate (100) and the surface of the insulation protrusion (110);
s33 removing the organic layer (156) to form a second pre-fabricated layer (160);
s34, etching the second prefabricated layer (160) to form the short circuit line (130), wherein the short circuit line (130) crosses the surface of the insulation bump (110) and connects the signal lines (120) with each other.
2. The screen body manufacturing method according to claim 1, wherein the S20 includes:
s21, defining a cutting position (140) on the same side of the signal lines (120);
s22, forming a plurality of insulation bulges (110) at intervals side by side on the surface of the cutting position (140), wherein the insulation bulges (110) correspond to the signal wires (120) one by one.
3. The screen body manufacturing method according to claim 2, wherein the S30 includes:
and manufacturing a short-circuit branch (132) on the surface of each insulating protrusion (110), wherein one end of each short-circuit branch (132) is connected with a corresponding signal line (120), one ends of the short-circuit branches (132) far away from the signal line (120) are connected with each other on one side of the insulating protrusion (110) far away from the signal line (120), and the short-circuit line (130) comprises a plurality of short-circuit branches (132).
4. The screen body manufacturing method according to claim 1, wherein the S31 includes:
s311, forming the graphene layer (152) on the surface of a copper foil (168);
s312, forming a metal layer (154) on the surface of the graphene layer (152) far away from the copper foil (168);
s313, forming the organic layer (156) on the surface of the metal layer (154) far away from the graphene layer (152);
s314, removing the copper foil (168) to form the first prefabricated layer (150).
5. The screen body manufacturing method according to claim 1, wherein in S50:
removing the short circuit line (130) on the surface of the insulating bump (110) by ultrasonic waves to disconnect the plurality of signal lines (120) from each other.
6. The screen body fabricating method of claim 1, wherein in the S50, the short circuit line (130) on the surface of the insulating bump (110) is removed by an electrochemical polishing process to disconnect the signal lines (120) from each other.
7. The screen body manufacturing method of claim 1, wherein in S10, the display substrate (100) has a thin film transistor driving circuit therein.
8. The screen body manufacturing method of claim 1, wherein in the S20, the height of the insulating protrusion (110) is 0 to 50 nm higher or lower than the signal line (120).
9. A display device, comprising:
the display screen comprises a display screen body (200), wherein a plurality of signal lines (120) are arranged on the surface of the display screen body (200);
the insulating bulge (110) is arranged on the display screen body (200) and is positioned on one side of the signal lines (120);
insulating protruding (110) are a plurality of, and is a plurality of insulating protruding (110) are side by side the interval setting, the top of insulating protruding (110) is arc surface (158).
10. A display device as claimed in claim 9, wherein the cross-section of the insulating protrusion (110) in a direction parallel to the display screen body is in one or more of a rectangular, circular and oval configuration.
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