CN110504292B - Array substrate, display panel and display device - Google Patents
Array substrate, display panel and display device Download PDFInfo
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- CN110504292B CN110504292B CN201910800124.0A CN201910800124A CN110504292B CN 110504292 B CN110504292 B CN 110504292B CN 201910800124 A CN201910800124 A CN 201910800124A CN 110504292 B CN110504292 B CN 110504292B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
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Abstract
The invention provides an array substrate, a display panel and a display device, relates to the technical field of display, and aims to solve the problem that in the prior art, the electrochemical corrosion of metal wiring causes the electrical connection in the display panel to be invalid, so that the display function of the display panel is ensured to be reliable. An array substrate, comprising: the circuit comprises a substrate, metal wires, an insulating layer and a sacrificial circuit; an insulating layer is arranged on one side, facing the substrate base plate, of the metal routing, and the insulating layer is provided with at least one through hole; a sacrificial circuit is arranged on one side, facing the substrate, of the insulating layer and is connected with the metal routing through the at least one through hole; the substrate base plate is provided with an avoiding area, the sacrificial circuit is arranged in the avoiding area, and the sacrificial circuit is used for attracting charges accumulated by the metal routing so that electrochemical corrosion is generated in the avoiding area.
Description
Technical Field
The invention relates to the technical field of display, in particular to an array substrate, a display panel and a display device.
Background
With the rapid development of display technologies, various types of display panels are gradually entering the market and are widely used. For example, the display panel can be configured in various intelligent terminals such as mobile phones, tablet computers, televisions, intelligent wearable devices, information inquiry machines in halls of public places, and the like, so as to better realize human-computer interaction.
At present, in the production process of a display panel, for example, in the production process of an array substrate of the display panel, charges are easily accumulated in a metal film layer in a vacuum film forming process such as physical vapor deposition, dry etching, and the like, so that after a metal trace with a specific pattern is formed on the metal film layer, electrochemical corrosion may occur in a subsequent wet process, which causes the metal trace to be broken, thereby causing electrical connection failure.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides the array substrate, the display panel and the display device, which are beneficial to reducing and even avoiding the problem of electric connection failure in the display panel caused by electrochemical corrosion generated by metal wiring, so that the display function reliability of the display panel is ensured.
One aspect of the present invention provides an array substrate, including: the circuit comprises a substrate, metal wires, an insulating layer and a sacrificial circuit; an insulating layer is arranged on one side, facing the substrate base plate, of the metal routing, and the insulating layer is provided with at least one through hole; a sacrificial circuit is arranged on one side, facing the substrate, of the insulating layer and is connected with the metal routing through the at least one through hole; the substrate base plate is provided with an avoiding area, the sacrificial circuit is arranged in the avoiding area, and the sacrificial circuit is used for attracting charges accumulated by the metal routing so that electrochemical corrosion is generated in the avoiding area.
In one possible implementation manner, the substrate base plate is provided with a display area and a non-display area, and the non-display area is located at the periphery of the display area; the avoidance area is arranged in the non-display area.
In one possible implementation manner, the avoidance area is located around the golden finger end.
In one possible implementation manner, the metal trace has an extending portion, and the extending portion is located in the non-display area and is opposite to the avoidance area; the extension is connected with the sacrificial circuit through the via hole.
In one possible implementation manner, at least one end of the metal trace forms the extension portion.
In one possible implementation, the extension is connected to the sacrificial circuit through a plurality of spaced-apart vias.
In one possible implementation, the plurality of vias are uniformly distributed.
In one possible implementation, the sacrificial circuit includes a sacrificial trace made of a metal material.
Another aspect of the invention provides a display panel including the array substrate as set forth in any one of the preceding claims.
It is a further aspect of the present invention to provide a display device comprising a display panel as claimed in any one of the preceding claims.
According to the array substrate, the display panel and the display device provided by the invention, the avoidance area is arranged on the substrate, the sacrificial circuit is arranged in the avoidance area and is connected with the metal routing through the via hole, so that charges accumulated by the metal routing are guided to the sacrificial circuit, the area subjected to electrochemical corrosion is favorably limited in the reserved avoidance area, the adverse effect of the electrochemical corrosion on the metal routing is favorably reduced or even avoided, the problem of electric connection failure in the display panel caused by the electrochemical corrosion is favorably reduced or even avoided, and the display function reliability of the display panel is favorably ensured.
In addition to the technical problems addressed by the present invention, the technical features constituting the technical solutions, and the advantageous effects brought by the technical features of the technical solutions described above, other technical problems that the present invention can solve, other technical features included in the technical solutions, and advantageous effects brought by the technical features will be described in further detail in the detailed description.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a schematic structural diagram of an exemplary display panel;
fig. 2 is a schematic structural diagram of an array substrate in an exemplary display panel;
fig. 3 is a schematic structural diagram of an array substrate in an exemplary display panel.
Description of reference numerals:
1-a display panel;
11-an array substrate;
11 a-display area;
11 b-non-display area;
11 c-an avoidance zone;
12-a display element;
13-a pixel defining layer;
111-substrate base plate;
112-metal routing;
113-an insulating layer;
114-a victim circuit;
115-via.
With the above figures, certain embodiments of the invention have been illustrated and described in more detail below. The drawings and the description are not intended to limit the scope of the inventive concept in any way, but rather to illustrate it by those skilled in the art with reference to specific embodiments.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention.
All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. The embodiments described below and the features of the embodiments can be combined with each other without conflict.
The terms "upper" and "lower" are used for describing relative positions of the structures in the drawings, and are only for the sake of clarity, but not for limiting the scope of the present invention, and the relative relationship changes or adjustments are also considered to be within the scope of the present invention without substantial technical changes.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
The display panel, such as a liquid crystal display panel, an organic electroluminescence display panel, a quantum dot electroluminescence display panel, and the like, can be configured in various intelligent terminals, such as a mobile phone, a tablet computer, a television, an intelligent wearable device, an information inquiry machine in a hall of a public place, and the like, so as to better realize human-computer interaction.
However, in the vacuum film formation process such as physical vapor deposition and dry etching, charges are easily accumulated on the metal film layer, which causes electrochemical corrosion to occur in the subsequent wet process after the metal film layer forms the metal trace with a specific pattern, which causes the metal trace to be broken, thereby causing electrical connection failure.
In order to overcome the above problems, the present embodiment provides an array substrate, a display panel and a display device, in which a sacrificial circuit is disposed in an avoidance region of a substrate, and the sacrificial circuit is connected to a metal trace through a via hole; therefore, the electric charges accumulated by the metal routing can be guided to the sacrificial circuit, and in the subsequent wet process, the electrochemical corrosion is guided to the avoiding area through the sacrificial circuit, so that the adverse effect of the electrochemical corrosion on the metal routing is favorably reduced or even avoided, and the adverse effect on other circuit structures in the display panel is favorably reduced or even avoided.
The structure and implementation process of the present embodiment are described below with reference to the accompanying drawings.
Fig. 1 is a schematic structural diagram of an exemplary display panel; fig. 2 is a schematic structural diagram of an array substrate in an exemplary display panel; fig. 3 is a schematic structural diagram of an array substrate in an exemplary display panel.
As shown in fig. 1, the present embodiment provides a display panel 1 including: an array substrate 11, a display element 12, and a pixel defining layer 13.
The display element 12 and the pixel defining layer 13 are disposed on the surface of the array substrate 11. In some examples, the display elements 12 are capable of self-illumination; the display element 12 may include an anode, an organic light emitting layer and a cathode stacked and arrayed on the substrate surface; when the display panel 1 is powered on, holes and electrons are combined in the organic light emitting layer under the driving of an electric field formed by the anode and the cathode, so that the organic light emitting layer emits light. The pixel defining layer 13 serves to space the display elements 12 apart.
The array substrate 11 may be used to carry other devices of the display panel 1 and to control the current flowing into the display element 12. As shown in fig. 2, the array substrate 11 may include a substrate 111 and a metal trace 112 disposed on the substrate 111.
In some examples, the substrate base 111 may be made of at least one of the following materials: polyimide, polystyrene, polyethylene terephthalate, parylene, polyethersulfone, or polyethylene naphthalate. The method of manufacturing the base substrate 111 includes a coat-cure method, an ink jet printing method, a casting method. It should be added that the substrate 111 is thin, generally 10-1000um, so that the substrate 111 is easy to deform, and in order to make the position of the device manufactured on the substrate 111 accurate, the substrate 111 is generally prepared or adsorbed on the surface of the hard substrate, and then the substrate 111 is peeled off from the hard substrate after the device is prepared.
Of course, the material and the manufacturing process of the substrate 111 are not limited thereto, and the embodiment is only illustrated here; the material and the manufacturing process of the substrate base 111 in this embodiment are not particularly limited. For example: the substrate base plate 111 may also comprise or be made of glass.
The metal trace 112 may be made of a metal material having good conductive performance. The metal traces 112 may be used to connect the tfts to the driving circuits. In the process of manufacturing the metal trace 112, a metal layer is usually formed first, and then patterning processes such as glue coating (photoresist), masking, exposure, development, etching, and stripping (residual photoresist) are performed on the metal layer to form the trace 112 with a predetermined shape.
Of course, the function and the manufacturing process of the metal trace 112 are not limited thereto, and the embodiment is only illustrated here; the function and the manufacturing process of the metal trace 112 are not limited in this embodiment.
For convenience of description, the present embodiment and the following embodiments do not take the direction of the substrate base plate 111 toward the display element 12 as upward, as shown by an arrow S in the drawing; the direction of the substrate base 111 away from the display element 12 is downward.
The array substrate 11 further includes an insulating layer 113 and a sacrificial circuit 114.
One side of the metal wire 112 facing the substrate base plate 111 is provided with an insulating layer 113, and the insulating layer 113 is provided with at least one via hole 115; a sacrificial circuit 114 is disposed on a side of the insulating layer 113 facing the substrate base 111, and the sacrificial circuit 114 is connected to the metal trace 112 through at least one via 115. That is, the insulating layer 113 and the sacrificial circuit 114 are sequentially disposed on the lower surface of the metal trace 112. That is, the sacrifice circuit 114 and the insulating layer 113 are sequentially provided on the upper surface of the base substrate 111.
Wherein, the insulating layer 113 is provided with at least one via 115, so that the sacrificial circuit 114 is connected with the metal trace 112 through the at least one via 115.
In some examples, the sacrificial circuit 114 can include a sacrificial trace made of a metal material, which can be stacked on top of and below a portion of the metal trace 112 to facilitate the provision of a via connecting the sacrificial trace with the metal trace 112.
In other examples, the sacrificial circuit 114 may include a patterned conductive layer made of a metal material, which may be rectangular, circular, oval, etc. The conductive layer may cover a portion of the metal trace 112; that is, the metal trace 112 has an orthographic projection of a part on the upper surface of the substrate base 111, and is located in the orthographic projection of the conductive layer on the upper surface of the substrate base 111; so as to facilitate the arrangement of the via hole for connecting the conductive layer and the metal trace 112.
The substrate base 111 is provided with a relief region 11c, and the sacrificial circuit 114 is provided at the relief region 11c of the substrate base 111. The avoidance region 11c is not provided with an effective circuit structure, that is, the avoidance region 11c is not provided with a component having an effective signal transmission function, such as a gold finger tip, a signal line, a data line, an electrical connector, and the like. The avoidance area 11c may be rectangular, trapezoidal, triangular, circular, elliptical, star-shaped, or the like. Of course, the avoiding region 11c may have other shapes, and may be specifically set according to actual needs.
The substrate base 111 may be provided with one relief region 11c or a plurality of relief regions 11 c; each escape area 11c may be provided with one or more sacrificial circuits 114.
In this way, the charges accumulated by the metal traces 112 can be guided to the sacrificial circuit 114, i.e. the charges accumulated by the metal traces 112 can be released to the sacrificial circuit 114 through the vias. In the subsequent wet process, the electrolyte solution formed by the electrolyte in water may contact the sacrificial circuit 114 with the accumulated charges and cause electrochemical corrosion at the sacrificial circuit 114, that is, the electrochemical corrosion may be guided to the avoiding area 11c through the sacrificial circuit 114, thereby reducing or even avoiding adverse effects of the electrochemical corrosion on the metal traces 112, and reducing or even avoiding adverse effects on other circuit structures in the display panel 1.
The display panel 1 provided by the embodiment, the avoiding region 11c is arranged on the substrate 11, the sacrificial circuit 114 is arranged in the avoiding region, and the sacrificial circuit 114 is connected with the metal routing 112 through the via hole 115, so that charges accumulated by the metal routing 112 are guided to the sacrificial circuit, the region where electrochemical corrosion occurs is limited in the reserved avoiding region 11c, adverse effects of the electrochemical corrosion on the metal routing 112 are reduced or even avoided, the problem of electrical connection failure in the display panel 1 caused by the electrochemical corrosion is reduced or even avoided, and the display function reliability of the display panel 1 is ensured.
In one possible implementation, the substrate base plate 111 has a display area 11a and a non-display area 11b, and the non-display area 11b is located at the periphery of the display area 11 a; for example, the non-display area 11b is surrounded on the outer periphery of the display area 11 a. The escape area 11c is provided in the non-display area 11 b.
In some examples, a relief area 11c is reserved in the non-display area 11c of the substrate base plate 111, and gold finger tips, electrical connectors, and the like are provided in other areas than the relief area 11 c. In other examples, a region where no gold finger tip, electrical connector, or the like is provided may be selected as the escape region 11c in the non-display region 11b of the substrate base plate 111.
By disposing the avoiding region 11c in the non-display region 11b, that is, by guiding the electrochemical corrosion to the region of the non-display region 11b where no effective circuit is disposed, adverse effects of the occurrence of the electrochemical corrosion on the electrical connection within the display panel 1 are prevented, thereby facilitating to ensure reliable display function of the display panel 1.
Optionally, the avoidance region 11c is located around the tip of the golden finger. It is understood that the escape area 11c may be provided in a partial area on a side having a smaller influence on the electrical connection of the gold finger end with other lines or components to reduce the influence on the arrangement position of the other lines or components.
In one possible implementation manner, the metal trace 112 has an extending portion, and the extending portion is located in the non-display area 11b and is opposite to the avoiding area 11 c; the extensions are connected to the sacrificial circuit 114 by vias 115.
Optionally, at least one end of the metal trace 112 forms an extension portion to facilitate quick discharge of charges accumulated in the metal trace 112 to the sacrificial circuit. For example, both ends of the metal trace 112 form an extension; both ends of the metal trace 112 may be disposed corresponding to the same avoiding region 11c, or both ends of the metal trace 112 may be disposed corresponding to avoiding regions 11c, respectively.
In this embodiment, the extension portion does not have a signal transmission function, and the extension portion can be used as a sacrificial segment of the metal trace 112; the metal trace 112 may also have an active segment. The sacrificial segment is only used to guide the charges of the active segment to the bypass region 11c, and at least a portion of the charges can be released to the sacrificial circuit 114 through the via.
Optionally, the extension portion may be connected to the sacrificial circuit 114 through a plurality of vias 115 distributed at intervals, so that the accumulated charges in the tip region of the metal trace 112, such as the extension portion, can be quickly released to the sacrificial circuit 114. The plurality of vias 115 are uniformly distributed to facilitate the reduction of the concentrated accumulation of charges.
Of course, the extension may also be electrically connected to the sacrificial circuit 114 through a via 115, which is advantageous for simplifying the structure of the array base 11.
In the wet process, the electrolyte solution formed by the electrolyte when encountering water can perform electrochemical corrosion with the avoiding region 11c and the sacrificial circuit 114, so that the electrochemical corrosion can be guided to the avoiding region 11c, that is, the region where the electrochemical corrosion occurs is limited to a preset specific region, that is, the electrochemical corrosion only occurs in the avoiding region 11c, thereby reducing or even avoiding adverse effects of the electrochemical corrosion on the electrical connection in the display panel 1, and ensuring reliable display function of the display panel 1.
The array substrate 11 of the display panel 1 may be manufactured by the following method:
providing a substrate base plate; the base substrate can be produced by a coating-curing method, an ink-jet printing method, a casting method, or the like.
A metal film layer is formed in a region of a substrate, and the metal layer is subjected to patterning processes such as gluing, masking, exposure, development, etching, stripping and the like to form a sacrificial circuit.
Forming an insulating layer on the surface of the substrate with the sacrificial circuit by vapor deposition and other processes, wherein the insulating layer and the sacrificial circuit can be stacked; the insulating layer may be formed using a common insulating material. And forming a via hole in the insulating layer.
Forming another metal film layer on the surface of the substrate, wherein part of the metal film layer is stacked with the insulating layer; and carrying out composition processes such as gluing, masking, exposure, development, etching, stripping and the like on the metal layer to form a metal wire, and enabling the metal wire to be connected with the sacrificial circuit through the via hole of the insulating layer.
In addition, a Thin Film Transistor (TFT) film layer, a planarization layer and the like are arranged on the surface of the substrate. The materials and processes of the TFT film, the planarization layer, and other films may be conventional in the art, and are not described herein.
The present embodiment further provides an array substrate 11, and the structure of the array substrate 11 is the array substrate 11 in any of the foregoing embodiments.
The structure, function and implementation process of the array substrate 11 may be the same as or similar to those of the previous embodiments, and are not described herein again.
The embodiment also provides a display device, and the display device can be any equipment with a display function, such as a television, a digital camera, a mobile phone, a tablet computer, an intelligent watch, an electronic book, a navigator and the like. The display device comprises a display panel 1 as in any of the previous embodiments.
The structure, function and implementation process of the display panel 1 may be the same as or similar to those of the foregoing embodiments, and are not described herein again.
In addition, in the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," "fixed," and the like are to be construed broadly, e.g., as being fixedly connected, detachably connected, or integrated; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (9)
1. An array substrate, comprising: the circuit comprises a substrate, metal wires, an insulating layer and a sacrificial circuit; an insulating layer is arranged on one side, facing the substrate base plate, of the metal routing, and the insulating layer is provided with at least one through hole; a sacrificial circuit is arranged on one side, facing the substrate, of the insulating layer and is connected with the metal routing through the at least one through hole;
the substrate base plate is provided with an avoidance area, the avoidance area is an area without an effective circuit structure, the sacrificial circuit is arranged in the avoidance area, the metal routing wire is provided with an extension portion, the extension portion is located in a non-display area and is opposite to the avoidance area, the extension portion is connected with the sacrificial circuit through the through hole, and the sacrificial circuit is used for attracting charges accumulated by the metal routing wire so that electrochemical corrosion occurs in the avoidance area.
2. The array substrate of claim 1, wherein the substrate has a display area and a non-display area, the non-display area is located at the periphery of the display area; the avoidance area is arranged in the non-display area.
3. The array substrate of claim 2, wherein the avoiding region is located around the tip of the golden finger.
4. The array substrate of claim 1, wherein at least one end of the metal trace forms the extension.
5. The array substrate of claim 1, wherein the extension is connected to the sacrificial circuit by a plurality of spaced apart vias.
6. The array substrate of claim 1, wherein the plurality of vias are evenly distributed.
7. The array substrate of claim 1, wherein the sacrificial circuit comprises a sacrificial trace made of a metal material.
8. A display panel comprising the array substrate according to any one of claims 1 to 7.
9. A display device characterized by comprising the display panel according to claim 8.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910800124.0A CN110504292B (en) | 2019-08-28 | 2019-08-28 | Array substrate, display panel and display device |
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| CN201910800124.0A CN110504292B (en) | 2019-08-28 | 2019-08-28 | Array substrate, display panel and display device |
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| CN110504292B true CN110504292B (en) | 2022-08-05 |
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| CN105489596A (en) * | 2016-01-04 | 2016-04-13 | 京东方科技集团股份有限公司 | Array substrate and fabrication method |
| KR20170123979A (en) * | 2016-04-29 | 2017-11-09 | 엘지디스플레이 주식회사 | Organic light emitting display device |
| CN206833100U (en) * | 2017-06-27 | 2018-01-02 | 京东方科技集团股份有限公司 | Display panel and display device |
| CN107818988A (en) * | 2017-09-27 | 2018-03-20 | 武汉华星光电半导体显示技术有限公司 | Flexible display panels and preparation method thereof |
| CN109786373A (en) * | 2018-12-26 | 2019-05-21 | 友达光电（昆山）有限公司 | Display panel |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105489596A (en) * | 2016-01-04 | 2016-04-13 | 京东方科技集团股份有限公司 | Array substrate and fabrication method |
| KR20170123979A (en) * | 2016-04-29 | 2017-11-09 | 엘지디스플레이 주식회사 | Organic light emitting display device |
| CN206833100U (en) * | 2017-06-27 | 2018-01-02 | 京东方科技集团股份有限公司 | Display panel and display device |
| CN107818988A (en) * | 2017-09-27 | 2018-03-20 | 武汉华星光电半导体显示技术有限公司 | Flexible display panels and preparation method thereof |
| CN109786373A (en) * | 2018-12-26 | 2019-05-21 | 友达光电（昆山）有限公司 | Display panel |
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