CN110609223A - Automatic test system and method for embedded system - Google Patents

Automatic test system and method for embedded system Download PDF

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Publication number
CN110609223A
CN110609223A CN201910551848.6A CN201910551848A CN110609223A CN 110609223 A CN110609223 A CN 110609223A CN 201910551848 A CN201910551848 A CN 201910551848A CN 110609223 A CN110609223 A CN 110609223A
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CN
China
Prior art keywords
test
measurement
way switch
control switch
target
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Pending
Application number
CN201910551848.6A
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Chinese (zh)
Inventor
王奎
孙德印
韦虎
马全伟
秦建鑫
周大鹏
张君宝
高金锁
梅佳希
陈胤凯
董虎
杨伟
何珊
游源祺
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Eye Core Technology (shanghai) Co Ltd
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Eye Core Technology (shanghai) Co Ltd
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Priority to CN201910551848.6A priority Critical patent/CN110609223A/en
Publication of CN110609223A publication Critical patent/CN110609223A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2832Specific tests of electronic circuits not provided for elsewhere
    • G01R31/2834Automated test systems [ATE]; using microprocessors or computers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2853Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2884Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test

Abstract

The invention discloses an automatic testing system and method of an embedded system, and relates to the technical field of embedded system testing. The system comprises: testing a target; a plurality of measuring instruments for measuring data to be measured of the test target; the measurement conversion circuit comprises a multi-way switch conversion matrix and a control switch, and is connected with any measurement instrument and any test target through the on-off of the control switch; the upper computer is used for acquiring the test item information and controlling the on-off of a control switch on the measurement conversion circuit according to the test item information so as to communicate the corresponding measuring instrument with the test target; and controlling the measuring instrument to enter a measuring state, controlling the test target to enter an item to be tested to run state, and acquiring the measurement data. The invention has the advantages of low realization cost, easy expansion, capability of carrying out large-scale automatic test and effective reduction of the labor test cost and the test time.

Description

Automatic test system and method for embedded system
Technical Field
The invention relates to the technical field of embedded system testing.
Background
In the design of the embedded system, chip verification is a necessary means for ensuring whether a chip reaches design expectation, and a complete and efficient chip verification method can accelerate the iteration rate and further confirm the correctness of chip design. Meanwhile, as the scale of the embedded system becomes larger and larger, both chip design and chip verification are more challenging, and the testing of the embedded system usually requires a large amount of external instruments to measure a large amount of data to be tested, such as signal data of voltage, current, resistance, capacitance, clock, and the like.
At present, the testing device of the embedded system generally includes the following three implementation forms:
1) one is a full human test. The method uses a single measuring instrument to transform different targets to be measured to obtain measurement data, and then manually transforms other measuring instruments to measure the different targets to be measured.
2) One is semi-automated testing. A plurality of measuring instruments are connected to different targets to be measured in advance, and then the measuring instruments are programmed to complete measuring tasks of the different targets to be measured.
3) One is to set a multiple-selection multiple-program-controlled switch. The user needs to design an external circuit board and design a multi-selection topological structure by using the multi-selection program control switch.
The above method has the following defects: for a non-automatic test scheme, a measuring instrument is required to be directly connected with a target to be measured, the measuring instrument cannot be separated from the target to be measured, the operation of replacing the measuring instrument and the target to be measured is required to be frequently carried out, and the operation efficiency is low. For the existing automatic test scheme 3), a user is required to design an external connection circuit during use, and an expandable topology cannot be realized without the support of the external circuit. On the other hand, the existing automatic test scheme generally uses a relay to realize switch control, the relay is a mechanical switch, the mechanical switch has mechanical abrasion and large volume, and an external instrument is required to detect whether the relay works normally before the relay is used. Meanwhile, the on-off speed of the relay is slow (millimeter level), a measurement test item of high-speed on-off is difficult to complete, and a large driving circuit is needed to drive on-off, so that large power consumption is consumed.
Disclosure of Invention
The invention aims to: the defects of the prior art are overcome, and the automatic testing system and the method of the embedded system are provided. The invention has the advantages of low realization cost, easy expansion, capability of carrying out large-scale automatic test and effective reduction of the labor test cost and the test time.
In order to achieve the above object, the present invention provides the following technical solutions:
an automated test system for embedded systems, comprising:
testing a target;
a plurality of measuring instruments for measuring the data to be measured of the test target;
the measurement conversion circuit comprises a multi-way switch conversion matrix and a control switch, all the measurement instruments and the test targets are connected to the conversion matrix at the same time, and any measurement instrument and any test target are connected through the on-off of the control switch;
the upper computer is used for acquiring the test item information and controlling the on-off of a control switch on the measurement conversion circuit according to the test item information so as to communicate the corresponding measuring instrument with the test target; and controlling the measuring instrument to enter a measuring state, controlling the test target to enter an item to be tested to run state, and acquiring the measurement data.
Further, the measurement conversion circuit comprises a plurality of multi-way switch conversion matrixes, and topology expansion is carried out on the multi-way switch conversion matrixes to enable the multi-way switch conversion matrixes to be cascaded and expanded to form more measurement points.
Further, when the multi-way switch conversion matrix is expanded in the row direction, two adjacent multi-way switch conversion matrixes are communicated through a measuring point on the upper side or the lower side; and/or the presence of a gas in the gas,
when the multi-way switch conversion matrix expands in the column direction, two adjacent multi-way switch conversion matrixes are communicated through the measurement point on the left side or the right side.
Further, the control switch is a diode and/or a triode.
Furthermore, the control switch is controlled to be switched on and off by the singlechip and/or the FPGA to output high and low levels.
The invention also provides an automatic testing method of the embedded system, which comprises the following steps:
step 100, connecting all measuring instruments and test targets to a measurement conversion circuit; the measurement conversion circuit comprises a multi-way switch conversion matrix and a control switch, all the measurement instruments and the test targets are connected to the conversion matrix at the same time, and any measurement instrument and any test target are connected through the on-off of the control switch;
200, generating configuration information according to the connection condition of the measuring instrument and the test target and inputting the configuration information to an upper computer;
step 300, reading the information of the test item by the upper computer;
step 400, the upper computer controls the measurement conversion circuit to communicate the corresponding measuring instrument with the test target according to the configuration information and the test item information;
step 500, controlling a corresponding measuring instrument to enter a measuring state;
step 600, controlling the test target to enter the running state of the test item;
step 700, detecting whether the measurement is finished, and executing step 800 when the measurement is finished; otherwise, go back to step 500.
And 800, judging whether residual test items exist by the upper computer, returning to execute the step 400 when the residual test items exist, and otherwise, ending the test.
Further, the measurement conversion circuit comprises a plurality of multi-way switch conversion matrixes, and topology expansion is carried out on the multi-way switch conversion matrixes to enable the multi-way switch conversion matrixes to be cascaded and expanded to form more measurement points.
Further, the control switch is a diode and/or a triode.
Furthermore, the control switch is controlled to be switched on and off by the singlechip and/or the FPGA to output high and low levels.
Further, the data to be measured is voltage, current, resistance, capacitance and/or clock signal data.
Due to the adoption of the technical scheme, compared with the prior art, the invention has the following advantages and positive effects as examples: 1) a measurement conversion circuit is arranged between a measuring instrument and a test target, and the measurement conversion circuit is in a matrix form, and the connection between any measuring instrument and any target to be measured can be realized on the measurement conversion circuit. 2) The measurement conversion circuit in the matrix form can be used for topology expansion, and a plurality of measurement conversion circuits can expand more measurement points, so that the structure is simple, and the operation is convenient. 3) Furthermore, the control switch is realized by using a diode or a triode, the diode and the triode are electronic devices, mechanical abrasion is avoided, the size is small, and the service life is long. And the electrical characteristics of the diode or the triode are utilized, the on-off time is fast (up to microsecond level), the test item for fast on-off can be realized, and the drive control can be realized by a common single chip Microcomputer (MCU) or FPGA, so that the power consumption is reduced.
Drawings
Fig. 1 is a schematic structural diagram of an embedded system automatic test system according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a measurement conversion circuit according to an embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a measurement conversion circuit according to an embodiment of the present invention for performing measurement point expansion.
Fig. 4 is a flowchart of an automated testing method for an embedded system according to an embodiment of the present invention.
Detailed Description
The automated testing system and method for embedded systems disclosed in the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments. It should be noted that technical features or combinations of technical features described in the following embodiments should not be considered as being isolated, and they may be combined with each other to achieve better technical effects. In the drawings of the embodiments described below, the same reference numerals appearing in the respective drawings denote the same features or components, and may be applied to different embodiments. Thus, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.
It should be noted that the structures, proportions, sizes, and other dimensions shown in the drawings and described in the specification are only for the purpose of understanding and reading the present disclosure, and are not intended to limit the scope of the invention, which is defined by the claims, and any modifications of the structures, changes in the proportions and adjustments of the sizes and other dimensions, should be construed as falling within the scope of the invention unless the function and objectives of the invention are affected. The scope of the preferred embodiments of the present invention includes additional implementations in which functions may be executed out of order from that described or discussed, including substantially concurrently or in reverse order, depending on the functionality involved, as would be understood by those reasonably skilled in the art of the embodiments of the present invention.
Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
Examples
Referring to fig. 1, an automated testing system for embedded systems is disclosed. The system is an automatic test system consisting of an upper computer, a measuring instrument, a measurement conversion circuit and a test target.
The test target, in this embodiment, is a real-time embedded system to be tested. The real-time embedded system to be measured is in communication connection with the upper computer and the measurement conversion circuit, and the communication connection mode can be wireless communication connection or wired communication connection, and is not limited herein.
The measuring instruments are multiple and are used for measuring the data to be measured of the test target.
The data to be measured may be, for example and without limitation, signal data such as voltage, current, resistance, capacitance, and clock, and the measuring instrument performs adaptive setting according to the data to be measured.
And the measurement conversion circuit is arranged between the measuring instrument and the test target and is in communication connection with the upper computer.
The measurement switching circuit preferably includes a multiplexer switch matrix and a control switch.
Referring to fig. 2, the multi-way switch transition matrix includes a plurality of row measurement points and a plurality of column measurement points, any one of the row measurement points and any other one of the row measurement points or the column measurement points are interconnected by a switch node at which a control switch is disposed.
When the device is operated, all the measuring instruments and the test targets are connected to the conversion matrix at the same time, and any measuring instrument and any test target are connected by controlling the on-off of the switch.
By way of example and not limitation, as shown in fig. 2, for example, the multi-way switch conversion matrix includes 6 row measurement points and 4 column measurement points, the 4 different measurement instruments, namely instrument a1, instrument a2, instrument A3 and instrument a4, are respectively connected to the 4 column measurement points, and the 6 different test targets, namely target B1, target B2, target B3, target B4, target B5 and target B6, are respectively connected to the 6 row measurement points, so that any measurement instrument and any test target can be connected through an on-off control switch, for example, instrument a1 is connected with target B4 to test a clock signal of target B4, and instrument a2 is connected with target B1 to test resistance data of target B1.
And the upper computer is a test execution component and is used for scheduling tasks and controlling a test process. When the device is implemented specifically, the device can collect test item information and control the on-off of a control switch on the measurement conversion circuit according to the test item information, so that a corresponding measuring instrument is communicated with a test target; and controlling the measuring instrument to enter a measuring state, controlling the test target to enter an item to be tested to run state, and acquiring the measurement data.
The test item information can be the default test item content of the system, and can also be the customized personalized setting of the user.
Preferably, in this embodiment, a configuration information acquisition unit is further provided. The configuration information acquisition unit is used for acquiring the connection condition of the measuring instrument and the measuring target, generating configuration information according to the connection condition and transmitting the configuration information to the upper computer. The configuration information includes the position of the measurement point of the measurement instrument in the multi-way switch conversion matrix, the position of the measurement point of the test target in the multi-way switch conversion matrix, and control switch information between the two — for example and without limitation, the configuration information may include number information, on-off information, and the like of the control switch.
In this embodiment, a measurement conversion circuit is provided between the measurement instrument and the test target, and the measurement conversion circuit is in a matrix form, and the measurement conversion circuit can realize connection between any measurement instrument and any target to be measured.
And the measurement conversion circuit in the form of a matrix can be subjected to topology expansion, and a plurality of measurement conversion circuits can expand more measurement points. When the measurement conversion circuit is specifically arranged, the measurement conversion circuit can comprise a plurality of multi-way switch conversion matrixes according to needs, and topology expansion is carried out on the multi-way switch conversion matrixes to enable the multi-way switch conversion matrixes to be cascaded and expanded to form more measurement points. Therefore, a user can conveniently set the test scale according to the requirement, the structure is simple, and the operation is convenient.
Referring to fig. 3, when the multi-way switch conversion matrix is expanded in the row direction, two adjacent multi-way switch conversion matrices are communicated through a measurement point on the upper side or the lower side; when the multi-way switch conversion matrix expands in the column direction, two adjacent multi-way switch conversion matrixes are communicated through the measurement point on the left side or the right side.
Preferably, the control switch is a diode and/or a triode, and the on-off of the control switch is controlled by a single chip Microcomputer (MCU) and/or an FPGA (field programmable gate array) to output high and low levels. The control switch is realized by using a diode or a triode, the diode and the triode are electronic devices, mechanical abrasion is avoided, the size is small, and the service life is long. And the electrical characteristics of the diode or the triode are utilized, the on-off time is fast (up to microsecond level), the test items for fast on-off can be realized, the drive control can be realized by a common single chip Microcomputer (MCU) or FPGA, and the power consumption is reduced.
The invention further provides an automatic testing method of the embedded system.
As described in connection with fig. 4, the method comprises the steps of:
and step 100, connecting all the measuring instruments and the test targets to a measurement conversion circuit.
The test target, in this embodiment, is a real-time embedded system to be tested. The real-time embedded system to be measured is in communication connection with the upper computer and the measurement conversion circuit, and the communication connection mode can be wireless communication connection or wired communication connection, and is not limited herein.
The measuring instruments are multiple and are used for measuring the data to be measured of the test target.
The data to be measured may be, for example and without limitation, signal data such as voltage, current, resistance, capacitance, and clock, and the measuring instrument performs adaptive setting according to the data to be measured.
And the measurement conversion circuit is arranged between the measuring instrument and the test target and is in communication connection with the upper computer.
The measurement switching circuit preferably includes a multiplexer switch matrix and a control switch.
And 200, generating configuration information according to the connection condition of the measuring instrument and the test target and inputting the configuration information to an upper computer.
The configuration information may include the position of the measurement point of the measurement instrument in the multi-way switch conversion matrix, the position of the measurement point of the test target in the multi-way switch conversion matrix, and control switch information therebetween — by way of example and not limitation, for example, the configuration information may include number information, on-off information, and the like of the control switch.
The upper computer collects the configuration information.
And step 300, reading the test item information by the upper computer.
The test item information may be the default test item content of the system, or may be the customized personalized setting of the user.
And 400, controlling the measurement conversion circuit by the upper computer according to the configuration information and the test item information to enable the corresponding measuring instrument to be communicated with the test target.
Preferably, the upper computer controls the on-off of a control switch on the measurement conversion circuit through a programmable device such as a single chip microcomputer and/or an FPGA (field programmable gate array), so that the corresponding measurement instrument is communicated with the test target.
And 500, controlling the corresponding measuring instrument to enter a measuring state.
Preferably, the upper computer is used for programming the corresponding measuring instrument to enter a measuring state and starting to acquire data.
And step 600, controlling the test target to enter the running state of the test item.
Preferably, the test object, such as the embedded system to be tested, enters the test item running state through the upper computer program.
Step 700, detecting whether the measurement is finished, and executing step 800 when the measurement is finished; otherwise, go back to step 500.
Preferably, the upper computer is provided with a test monitoring unit, and whether the measurement is completed or not is detected through the test monitoring unit.
And 800, judging whether residual test items exist by the upper computer, returning to execute the step 400 when the residual test items exist, and otherwise, ending the test.
Preferably, the measurement conversion circuit comprises a plurality of multi-way switch conversion matrixes, and topology expansion is performed on the multi-way switch conversion matrixes to enable the multi-way switch conversion matrixes to be cascaded and expanded to obtain more measurement points. Therefore, a user can conveniently set the test scale according to the requirement, the structure is simple, and the operation is convenient. Specifically, when the multi-way switch conversion matrix is expanded in the row direction, two adjacent multi-way switch conversion matrixes are communicated through a measuring point on the upper side or the lower side; when the multi-way switch conversion matrix expands in the column direction, two adjacent multi-way switch conversion matrixes are communicated through the measurement point on the left side or the right side.
In this embodiment, the control switch is a diode and/or a triode, and the control switch is controlled to be switched on and off by outputting high and low levels through a single chip Microcomputer (MCU) and/or an FPGA. The control switch is realized by using a diode or a triode, the diode and the triode are electronic devices, mechanical abrasion is avoided, the size is small, and the service life is long. And the electrical characteristics of the diode or the triode are utilized, the on-off time is fast (up to microsecond level), the test items for fast on-off can be realized, the drive control can be realized by a common single chip Microcomputer (MCU) or FPGA, and the power consumption is reduced.
Other technical features are described in the previous embodiment and are not described in detail herein.
In the foregoing description, the disclosure of the present invention is not intended to limit itself to these aspects. Rather, the various components may be selectively and operatively combined in any number within the intended scope of the present disclosure. In addition, terms like "comprising," "including," and "having" should be interpreted as inclusive or open-ended, rather than exclusive or closed-ended, by default, unless explicitly defined to the contrary. All technical, scientific, or other terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs unless defined otherwise. Common terms found in dictionaries should not be interpreted too ideally or too realistically in the context of related art documents unless the present disclosure expressly limits them to that. Any changes and modifications of the present invention based on the above disclosure will be within the scope of the appended claims.

Claims (10)

1. An automated test system for embedded systems, comprising:
testing a target;
a plurality of measuring instruments for measuring the data to be measured of the test target;
the measurement conversion circuit comprises a multi-way switch conversion matrix and a control switch, all the measurement instruments and the test targets are connected to the conversion matrix at the same time, and any measurement instrument and any test target are connected through the on-off of the control switch;
the upper computer is used for acquiring the test item information and controlling the on-off of a control switch on the measurement conversion circuit according to the test item information so as to communicate the corresponding measuring instrument with the test target; and controlling the measuring instrument to enter a measuring state, controlling the test target to enter an item to be tested to run state, and acquiring the measurement data.
2. The system of claim 1, wherein: the measurement conversion circuit comprises a plurality of multi-way switch conversion matrixes, and topology expansion is carried out on the multi-way switch conversion matrixes to enable the multi-way switch conversion matrixes to be cascaded and expanded to form more measurement points.
3. The system of claim 2, wherein: when the multi-way switch conversion matrix is expanded in the row direction, two adjacent multi-way switch conversion matrixes are communicated through a measuring point on the upper side or the lower side; and/or the presence of a gas in the gas,
when the multi-way switch conversion matrix expands in the column direction, two adjacent multi-way switch conversion matrixes are communicated through the measurement point on the left side or the right side.
4. The system according to claim 1 or 2, characterized in that: the control switch is a diode and/or a triode.
5. The system of claim 4, wherein: the control switch is controlled to be switched on and off by outputting high and low levels through the singlechip and/or the FPGA.
6. An automatic test method of an embedded system is characterized by comprising the following steps:
step 100, connecting all measuring instruments and test targets to a measurement conversion circuit; the measurement conversion circuit comprises a multi-way switch conversion matrix and a control switch, all the measurement instruments and the test targets are connected to the conversion matrix at the same time, and any measurement instrument and any test target are connected through the on-off of the control switch;
200, generating configuration information according to the connection condition of the measuring instrument and the test target and inputting the configuration information to an upper computer;
step 300, reading the information of the test item by the upper computer;
step 400, the upper computer controls the measurement conversion circuit to communicate the corresponding measuring instrument with the test target according to the configuration information and the test item information;
step 500, controlling a corresponding measuring instrument to enter a measuring state;
step 600, controlling the test target to enter the running state of the test item;
step 700, detecting whether the measurement is finished, and executing step 800 when the measurement is finished; otherwise, executing step 500;
and 800, judging whether residual test items exist by the upper computer, returning to execute the step 400 when the residual test items exist, and otherwise, ending the test.
7. The method of claim 6, wherein: the measurement conversion circuit comprises a plurality of multi-way switch conversion matrixes, and topology expansion is carried out on the multi-way switch conversion matrixes to enable the multi-way switch conversion matrixes to be cascaded and expanded to form more measurement points.
8. The method of claim 6, wherein: the control switch is a diode and/or a triode.
9. The method of claim 6, wherein: the control switch is controlled to be switched on and off by outputting high and low levels through the singlechip and/or the FPGA.
10. The method of claim 6, wherein: the data to be measured is voltage, current, resistance, capacitance and/or clock signal data.
CN201910551848.6A 2019-06-25 2019-06-25 Automatic test system and method for embedded system Pending CN110609223A (en)

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CN114994402A (en) * 2021-09-02 2022-09-02 北京荣耀终端有限公司 Terminal module power consumption testing device, method and system

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CN113167812A (en) * 2021-03-26 2021-07-23 华为技术有限公司 Signal switching control method, signal switching device, test system and platform
CN114994402A (en) * 2021-09-02 2022-09-02 北京荣耀终端有限公司 Terminal module power consumption testing device, method and system

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