CN110602923A - Packaging module, packaging method thereof and electronic equipment - Google Patents

Abstract

The application provides a packaging module, a preparation method thereof, and electronic equipment. The packaging module includes a substrate, a magnetic core, a winding, a heat sink, and a plastic package structure. The magnetic core includes a main body and mounting feet connected to the main body. The mounting feet are connected to the substrate. Cooperate with the magnetic core for electromagnetic conversion, the heat sink and the main body are spaced apart on the same side of the substrate, and in the direction perpendicular to the substrate, the heat sink and the winding are at least partially overlapped, and the plastic packaging structure wraps the core and the heat sink on the substrate. The plastic package structure includes a top surface away from the substrate, the main body and the heat dissipation block extend to the top surface along a direction perpendicular to the substrate, and the surface of the magnetic core and the heat dissipation block facing away from the substrate is coplanar with the top surface, or the magnetic core and the heat dissipation block are away from the substrate The surface protrudes from the top surface to transfer the heat of the magnetic core and the winding to the external environment, improve the overall heat dissipation performance of the packaged module, and help to improve the working efficiency of the packaged module.

Description

Encapsulation module, encapsulation method thereof, and electronic device

technical field

The present application relates to the technical field of packaging, in particular to a packaging module, a packaging method thereof, and electronic equipment.

Background technique

With the development of science and technology, more and more devices are developing in the direction of miniaturization and integration. At present, each device of the equipment is developing towards the miniaturization direction of the module, and the power supply and other modules include many electronic components such as power devices, control integrated circuits and passive devices, which greatly improve the power density and power consumption of the power supply and other modules. The overall heat dissipation performance of the module is poor, which seriously affects the working efficiency.

Contents of the invention

The present application provides a packaging module, a packaging method thereof, and an electronic device, which are used to improve the heat dissipation performance of the packaging module and improve work efficiency.

The packaging module described in this application includes a substrate, a magnetic core, a winding, a heat dissipation block, and a plastic packaging structure. The magnetic core includes a main body and mounting feet connected to the main body, the mounting feet are connected to the substrate, and the winding is provided The inside of the substrate or the surface of the substrate is arranged around the mounting feet to cooperate with the magnetic core for electromagnetic conversion, and the heat sink is spaced apart from the main body on the same side of the substrate. In a direction perpendicular to the substrate, the heat dissipation block overlaps the winding at least partially, the plastic encapsulation structure wraps the magnetic core and the heat dissipation block on the substrate, and the plastic encapsulation structure includes The top surface of the substrate, the main body and the heat dissipation block extend to the top surface along a direction perpendicular to the substrate, and the surface of the main body and the heat dissipation block away from the substrate and the top The surfaces are coplanar, or, the surfaces of the main body and the heat dissipation block facing away from the substrate protrude from the top surface.

In the packaging module described in the present application, a heat dissipation block at least partially overlapping the winding in a direction perpendicular to the substrate is added, and the heat dissipation block can reduce the thermal resistance between the winding and the external environment, as the The heat conduction channel of the winding provides a heat transfer path for the winding, and the surface of the main body and the heat dissipation block facing away from the substrate is coplanar with the top surface, or the magnetic core and the heat dissipation block are away from the The surface of the substrate protrudes from the top surface, that is, the surface of the magnetic core and the heat dissipation block facing away from the substrate is exposed on the top surface, and the heat generated by the magnetic core and the winding can pass through Through the plastic encapsulation structure, it is transmitted to the external environment through the surface of the magnetic core and the heat dissipation block away from the substrate, so as to realize rapid heat dissipation of the magnetic core and the winding, and improve the overall performance of the packaging module. The heat dissipation performance helps to improve the working efficiency of the packaged module.

In one embodiment, in a direction perpendicular to the substrate, the heat dissipation block at least partially overlaps the winding, that is, the orthographic projection of the heat dissipation block on the substrate at least partially covers the winding on the Orthographic projection on the substrate, so that the heat generated by the winding can be directly transferred to the heat dissipation block.

In one embodiment, the winding is embedded inside the substrate, the winding includes a heat dissipation surface facing the main body, and the heat dissipation block is arranged on the heat dissipation surface to increase the contact between the heat dissipation block and the heat dissipation surface. The contact area of the winding is equivalent to increasing the diameter of the heat dissipation channel of the winding, which improves the overall heat dissipation performance of the packaging module.

In one embodiment, the thermal conductivity of the heat dissipation block is greater than that of the plastic encapsulation structure, that is, the heat conduction speed of the heat dissipation block is faster than that of the plastic encapsulation structure, so that the heat dissipation block can be used as The heat transfer bridge of the winding transmits the heat generated by the winding to the external environment through the plastic encapsulation structure.

In one embodiment, the thermal conductivity of the heat dissipation block is greater than 3W/(m·K).

It should be understood that the thermal conductivity of the plastic package structure is generally 1W/(m·K) or 3W/(m·K), and the thermal conductivity of the heat dissipation block in this embodiment is greater than 3W/(m·K) A heat dissipation channel for the winding can be formed in the plastic encapsulation structure to quickly transfer the heat generated by the winding to the external environment.

In one embodiment, the material of the heat dissipation block includes metal materials such as copper, and the heat dissipation block is fixed on the heat dissipation surface of the winding by welding or by insulating and heat-conducting glue, so as to realize effective contact with the winding, so as to The heat generated by the winding can be directly transferred to the external environment through the heat dissipation block.

In one embodiment, the material of the heat dissipation block includes high thermal conductivity ceramic materials such as alumina ceramics or aluminum nitride ceramics, and the welding surface of the heat dissipation block is metallized and fixed to the heat dissipation surface of the winding by welding, Alternatively, the heat dissipation block is fixed on the heat dissipation surface of the winding through insulating and heat-conducting glue, so as to realize effective contact with the winding, so that the heat generated by the winding can be directly transferred to the external environment through the heat dissipation block. Moreover, since ceramic materials have good insulation properties, adding the heat sink made of ceramic materials to the packaging module can effectively avoid the problem of insulation withstand voltage.

In one embodiment, the packaging module further includes a heat conduction interface structure, the heat conduction interface structure covers the surface of the magnetic core and the heat dissipation block away from the substrate and the top surface, and is used for uniform diffusion and transfer to the The heat of the thermal interface structure described above. In the packaging module shown in this embodiment, after the heat generated by the magnetic core and the winding is transferred to the heat-conducting interface structure, the heat is evenly diffused in the heat-conducting interface layer and then transferred to the external environment, which can not only Reducing the temperature difference between various positions of the packaging module can also increase the heat dissipation area of the packaging module and improve the overall heat dissipation efficiency of the packaging module.

In one embodiment, the thermally conductive interface structure includes a thermally conductive adhesive layer, and the thermally conductive adhesive layer has a thermal conductivity greater than that of air, so as to reduce the thermal resistance of the magnetic core and the winding to the external environment and improve the thermal conductivity of the magnetic core and the winding. The heat dissipation efficiency of the packaged module is described.

In another embodiment, the thermal interface structure includes a transition layer, a diffusion layer and a protective layer stacked in sequence, and the transition layer is used to increase the contact between the thermal interface structure and the magnetic core, the heat dissipation block and the heat dissipation layer. The bonding force of the plastic encapsulation structure, the diffusion layer is used to evenly diffuse the heat transferred to the thermal interface structure, and reduce the temperature difference between various positions of the packaging module, and the protective layer is used to protect the diffusion layer.

In one embodiment, the packaging module further includes a heat sink, and the heat sink is arranged on the surface of the thermal interface structure away from the substrate, so as to transmit the heat evenly diffused through the thermal interface structure to the external environment. , realizing effective and rapid heat dissipation of the magnetic core and the winding, improving the overall heat dissipation performance of the packaging module, and helping to improve the working efficiency of the packaging module.

In one embodiment, the heat sink covers the surface of the heat conduction interface structure away from the substrate, so as to increase the contact area between the heat sink and the heat conduction interface structure, and the heat transferred to the heat conduction interface structure The heat is transmitted to the external environment more quickly, so as to realize rapid heat dissipation of the magnetic core and the winding.

In one embodiment, the heat sink includes a heat dissipation body and a plurality of heat dissipation fins, the heat dissipation body covers the surface of the heat conduction interface structure facing away from the substrate, and the plurality of heat dissipation fins are arranged at intervals on the heat dissipation surface. The main body is away from the surface of the thermal interface structure, so as to further increase the heat dissipation area of the heat sink and improve the heat dissipation efficiency of the heat sink.

In one embodiment, the packaging module further includes a heating element and a heat conducting block, the heating element is spaced apart from the main body on the same side of the substrate, and the heat conducting block is arranged on the side of the heating element facing away from the substrate and extending to the top surface in a direction perpendicular to the substrate, the surface of the heat conducting block facing away from the heating element is coplanar with the top surface, or the heat conducting block is facing away from the heating element The surface protrudes from the top surface.

In the packaging module described in this embodiment, the heat conduction block is assembled on the surface of the heating element away from the substrate, and the addition of the heat conduction block reduces the thermal resistance between the heat generation element and the external environment, and can be used as a heat conduction element. The thermal bridge provides a heat transfer path for the heating element, and the surface of the heat conducting block facing away from the heating element is coplanar with the top surface, or the surface of the heat conducting block facing away from the heating element protrudes beyond the The top surface, that is, the surface of the heat conducting block facing away from the heating element is exposed on the top surface, and the plastic sealing structure at least partially exposes the surface of the heat conducting block facing away from the heating element. The heat can pass through the plastic sealing structure, and be transferred to the external environment through the surface of the heat conducting block away from the heating element, so as to realize rapid heat dissipation of the heating element, improve the overall heat dissipation performance of the packaging module, and improve the Describe the working efficiency of the packaged module.

In one embodiment, the thermal conductivity of the heat conduction block is greater than the thermal conductivity of the plastic encapsulation structure, that is, the heat conduction velocity of the heat conduction block is higher than the heat conduction velocity of the plastic encapsulation structure, so that the heat conduction block can be used as The heat transfer bridge of the heating element quickly transfers the heat generated by the heating element to the external environment.

In one embodiment, the thermal conductivity of the heat conduction block is greater than 3W/(m·K).

It should be understood that the thermal conductivity of the plastic package structure is generally 1W/(m·K) or 3W/(m·K), and the thermal conductivity of the heat conduction block in this embodiment is greater than 3W/(m·K) ), at this time, the heat conducting block can form a heat dissipation channel for the heating element in the plastic encapsulation structure, and quickly transfer the heat generated by the heating element to the external environment through the plastic encapsulation structure.

In one embodiment, the material of the heat-conducting block includes metal materials such as copper, and after the surface of the heating element away from the substrate is metallized, the heat-conducting block is fixed on the heating element away from the substrate by welding. or, the heat conduction block is fixed on the surface of the heating element away from the substrate through insulating and heat conducting glue, so as to realize effective contact with the heating element, so that the heat generated by the heating element can directly pass through the The heat conducting block is transferred to the external environment.

In one embodiment, the material of the heat conduction block includes high thermal conductivity ceramic materials such as alumina ceramics or aluminum nitride ceramics, and after the surface of the heating element away from the substrate and the welding surface of the heat conduction block are metallized, the The heat-conducting block is fixed on the surface of the heating element away from the substrate by welding, or the heat-conducting block is fixed on the surface of the heating element away from the substrate through insulating and heat-conducting glue, so as to realize the connection with the heating element Effective contact, so that the heat generated by the heating element can be directly transferred to the external environment through the heat dissipation block and the heat conduction block. Moreover, since ceramic materials have good insulation properties, adding the heat conducting block made of ceramic materials in the packaging module can also effectively avoid the problem of insulation withstand voltage.

The electronic device described in the present application includes a control module and any one of the packaging modules described above, and the controller is electrically connected to the packaging module to control the operation of the packaging module.

The preparation method of packaging module described in the application comprises:

A module to be packaged is provided, wherein the module to be packaged includes a substrate, a magnetic core and a winding, the magnetic core includes a main body and mounting feet connected to the main body, the mounting feet are connected to the substrate, and the main body Extending in a direction perpendicular to the substrate, the winding is arranged inside the substrate or on the surface of the substrate, and is arranged around the mounting feet, so as to cooperate with the magnetic core to perform electromagnetic transformation;

Install the heat dissipation block on one side of the substrate, wherein the heat dissipation block and the main body are arranged at intervals on the same side of the substrate, and in a direction perpendicular to the substrate, the heat dissipation block and the winding At least partially overlapping, the heat slug extends in a direction perpendicular to the substrate;

A plastic encapsulation structure covering the magnetic core and the heat dissipation block on the substrate is formed, wherein the plastic encapsulation structure exposes the surface of the magnetic core and the heat dissipation block away from the substrate.

In the preparation method of the packaging module described in the present application, in the direction perpendicular to the substrate, the heat dissipation block at least partially overlapping the winding is formed, and then the plastic package covering the magnetic core and the heat dissipation block is formed. structure, and the plastic encapsulation structure exposes the surface of the magnetic core and the heat sink away from the substrate, so that the heat generated by the magnetic core and the winding can pass through the plastic encapsulation structure, respectively through the The surface of the magnetic core and the heat dissipation block away from the substrate is transmitted to the external environment, so as to realize rapid heat dissipation of the magnetic core and the winding, and improve the overall heat dissipation performance of the packaging module.

In one embodiment, the module to be packaged further includes a heating element, and the heating element is spaced apart from the main body on the same side of the substrate;

After providing a module to be packaged and before forming a plastic package structure covering the magnetic core and the heat dissipation block on the substrate, the packaging method of the package module further includes: installing the heat conduction block on the The heating element is away from the surface of the substrate, and the heat conducting block extends along the surface perpendicular to the substrate;

In the process of forming the plastic encapsulation structure covering the magnetic core and the heat dissipation block on the substrate, the plastic encapsulation structure also covers the heating element and the heat conduction block, and exposes the heat conduction block away from the surface of the heating element.

In the preparation method of the packaging module described in this embodiment, a heat dissipation block is added on the surface of the heating element away from the substrate, and then a plastic sealing structure is formed to expose the surface of the heat conduction block away from the heating element, so that the heating element The heat generated during operation can be directly transferred to the external environment through the heat conducting block passing through the plastic encapsulation structure, so as to improve the overall heat dissipation performance of the packaging module.

In one embodiment, the process of forming the plastic encapsulation structure covering the magnetic core and the heat dissipation block on the substrate includes:

forming a plastic package covering the substrate, the magnetic core and the heat sink;

removing the part of the plastic package away from the substrate to expose the surface of the magnetic core and the heat dissipation block away from the substrate to form a plastic package structure.

In the preparation method of the packaging module described in this embodiment, a plastic package covering the substrate, the magnetic core and the heat dissipation block is formed first, and then the part of the plastic package that is away from the substrate is removed to expose the The surface of the magnetic core and the heat dissipation block facing away from the substrate, so that the heat generated by the magnetic core and the winding can be directly transferred to the external environment through the surface of the magnetic core and the heat dissipation block facing away from the substrate In this way, the rapid heat dissipation of the magnetic core and the winding is realized.

In one embodiment, after the forming of the plastic packaging structure covering the magnetic core and the heat dissipation block on the substrate, the packaging method of the packaging module further includes:

forming a thermally conductive interface structure covering the surface of the magnetic core, the heat slug, and the plastic encapsulation structure facing away from the substrate;

A heat sink is assembled on the surface of the thermal interface structure facing away from the substrate.

In the preparation method of the packaging module described in this embodiment, a thermally conductive interface structure is formed on the surface of the magnetic core, the heat dissipation block, and the plastic packaging structure away from the substrate, and the heat generated when the magnetic core and the winding are in operation After the heat is transferred to the heat-conducting interface structure, the heat-conducting interface structure evenly disperses the heat and then transfers it to the external environment through the radiator, which can uniformize the temperature of each position in the packaging module and reduce the temperature of the packaging module. The temperature difference at each position is beneficial to improve the overall heat dissipation performance of the packaging module.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiment of the present application or the background art, the following will describe the drawings that need to be used in the embodiment of the present application or the background art.

FIG. 1 is a schematic structural diagram of an electronic device provided in an embodiment of the present application;

FIG. 2 is a schematic structural diagram of a packaging module provided by an embodiment of the present application;

FIG. 3 is a partial structural schematic diagram of the packaged module shown in FIG. 2;

Fig. 4 is a schematic cross-sectional structure diagram of the package module shown in Fig. 2 along the direction A-A;

Fig. 5 is a schematic cross-sectional structure diagram of the package module shown in Fig. 3 along the B-B direction;

FIG. 6 is a schematic diagram of an exploded structure of the packaging module shown in FIG. 5;

FIG. 7 is a schematic diagram of an enlarged structure of region C in the package module shown in FIG. 4 in an implementation manner;

FIG. 8 is a schematic diagram of an enlarged structure of region C in another implementation manner in the packaging module shown in FIG. 4;

FIG. 9 is a process flow chart of a packaging method for a packaging module provided in an embodiment of the present application;

FIG. 10 is a schematic structural diagram of the module to be packaged in the packaging method of the packaged module shown in FIG. 9;

Fig. 11 is a schematic cross-sectional structure diagram of the module to be packaged along the D-D direction shown in Fig. 10;

Fig. 12 is a schematic cross-sectional structure diagram of the module to be packaged along the E-E direction shown in Fig. 10;

FIG. 13 is a schematic cross-sectional structural view of the heat sink block installed on the mounting surface in the packaging method of the packaged module shown in FIG. 9;

FIG. 14 is a schematic cross-sectional structural view of the heat conduction block installed on the mounting surface in the packaging method of the packaged module shown in FIG. 9;

FIG. 15 is a schematic cross-sectional structural view of the plastic packaging structure formed in the packaging method of the packaging module shown in FIG. 9;

FIG. 16 is a schematic cross-sectional structural view of a plastic package formed in the packaging method of the packaging module shown in FIG. 9;

FIG. 17 is a schematic cross-sectional structure diagram of forming a thermal interface structure in the packaging method of the packaging module shown in FIG. 9 .

Detailed ways

Embodiments of the present application are described below with reference to the drawings in the embodiments of the present application.

Embodiments of the present application provide a packaging module and its preparation and electronic equipment. A heat dissipation block is used to assemble the mounting surface of the substrate and at least partially cover the surface of the winding. The plastic packaging structure covering the mounting surface exposes at least part of the heat dissipation block. away from the surface of the substrate, so that the heat dissipation block provides a heat transfer path for the winding, acts as a heat transfer bridge, reduces the thermal resistance of the winding to the external environment, and can reduce the heat generated by the winding during operation. The heat is transmitted to the external environment through the plastic packaging structure, realizing rapid heat dissipation of the winding, improving the overall heat dissipation performance of the packaging module, and helping to improve the working efficiency of the packaging module.

Please refer to FIG. 1 . FIG. 1 is a schematic structural diagram of an electronic device 100 provided in an embodiment of the present application.

The electronic device 100 provided in the embodiment of the present application includes but is not limited to a mobile phone, a tablet computer, a multimedia player, an e-book reader, a notebook computer, a vehicle-mounted device or a wearable device, etc., which have undergone a system-in-package (SIP, System Inpackage). The electronic device 100 includes a control module 10 and a packaging module 20 . The control module 10 is electrically connected with the encapsulation module 20 for controlling the encapsulation module 20 to convert voltage or current or frequency. The encapsulation module 20 converts the voltage, current or frequency and then transmits it to the next-level power conversion module or directly supplies power to an ASIC (Application Specific Integrated Circuit). Wherein, the control module 10 includes and is not limited to a driver chip.

Please refer to FIGS. 2-4 . FIG. 2 is a schematic structural diagram of a packaging module 20 provided by an embodiment of the present application, wherein the packaging module 20 corresponds to the packaging module 20 shown in FIG. 1 . FIG. 3 is a partial structural schematic diagram of the packaging module 20 shown in FIG. 2 , wherein the thermal interface structure 8 and the heat sink 9 are not shown. FIG. 4 is a schematic cross-sectional structure diagram of the packaging module 20 shown in FIG. 2 along the direction A-A, wherein the direction A-A shown in FIG. 2 corresponds to the direction A-A shown in FIG. 3 .

The packaging module 20 includes a substrate 1 , a magnetic core 2 , a winding 3 , a heat dissipation block 4 and a plastic packaging structure 5 . The magnetic core 2 includes a main body 21 and a mounting foot 22 connected to the main body 21 , and the mounting foot 22 is connected to the substrate 1 . The winding 3 is disposed inside the substrate 1 and is disposed around the mounting feet 22 for cooperating with the magnetic core 2 to perform electromagnetic transformation. The heat dissipation block 4 and the main body 21 are spaced apart on the same side of the substrate 1 , and in a direction perpendicular to the substrate 1 , the heat dissipation block 4 and the winding 3 at least partially overlap. The plastic encapsulation structure 5 wraps the magnetic core 2 and the heat dissipation block 4 on the substrate 1, the plastic encapsulation structure 5 includes a top surface 501 away from the substrate 1, the main body 21 and the heat dissipation block 4 extend to the top surface 501 along a direction perpendicular to the substrate 1, And the surface of the main body 21 and the heat dissipation block 4 facing away from the substrate 1 is coplanar with the top surface 501 . In this embodiment, the packaging module 20 is a power module. It should be noted that, in other embodiments, the encapsulation module may also be other high power consumption plastic encapsulation modules.

In the packaging module 20 shown in the embodiment of the present application, a heat dissipation block 4 at least partially overlapping with the winding 3 in the direction perpendicular to the substrate 1 is added. The heat dissipation block 4 can reduce the thermal resistance between the winding 3 and the external environment and serve as a winding The heat conduction channel of 3 provides a heat transfer path for the winding 3, and the surface of the main body 21 of the magnetic core 2 and the heat dissipation block 4 away from the substrate 1 is coplanar with the top surface 501 of the plastic packaging structure 5, and the heat generated when the magnetic core 2 and the winding 3 work It can pass through the plastic sealing structure 5 and transmit to the external environment through the main body 21 and the surface of the heat dissipation block 4 facing away from the substrate 1, so as to realize rapid heat dissipation of the magnetic core 2 and winding 3, improve the overall heat dissipation performance of the packaging module 20, and contribute to The working efficiency of the packaging module 20 is improved, and the electrical performance of the packaging module 20 is improved.

Please refer to Figure 5 and Figure 6 together. FIG. 5 is a schematic cross-sectional structure diagram of the packaging module 20 shown in FIG. 3 along the B-B direction. FIG. 6 is a schematic diagram of an exploded structure of the packaging module 20 shown in FIG. 5 , wherein the plastic packaging structure 5 is not shown.

The substrate 1 includes two mounting surfaces 101 opposite to each other. Two installation grooves 102 and one receiving groove 103 are recessed on the installation surface 101 , and both the installation grooves 102 and the accommodation groove 103 penetrate the two installation surfaces 101 . The two installation slots 102 are spaced and oppositely arranged, and the receiving slot 103 is located between the two installation slots 102 and is spaced apart from the two installation slots 103 . In this embodiment, the substrate 1 is a printed circuit board (PCB, Printed Circuit Board), and the substrate 1 is provided with inner-layer circuits for signal transmission.

The mounting feet 22 of the magnetic core 2 are embedded in the mounting groove 102 . The magnetic core 2 includes an upper magnetic core 201 and a lower magnetic core 202 which are arranged oppositely. The upper magnetic core 201 and the lower magnetic core 202 are respectively mounted on the two installation surfaces 101 and electrically connected through the installation groove 102 and the receiving groove 103 . In this embodiment, the magnetic core 2 is a magnetic core of a transformer. The size and dimensions of the upper magnetic core 201 and the lower magnetic core 202 are the same. Both the upper magnetic core 201 and the lower magnetic core 202 include a main body 21 , a central column 23 and two mounting feet 22 . The main body 21 of the upper magnetic core 201 is disposed on a mounting surface 101 , and the main body 21 includes a bearing surface 211 attached to the mounting surface 101 . The center column 23 is disposed in the middle area of the carrying surface 211 and accommodated in the receiving groove 103 . The two mounting feet 22 are disposed on the edge area of the bearing surface 211 , located on both sides of the central column 23 , and are mirror-symmetrical to the central column 23 . The two mounting feet 22 are respectively accommodated in the two mounting grooves 102 . The lower magnetic core 202 is interlocked with the upper magnetic core 201 through the installation groove 102 and the receiving groove 103 . The main body 21 of the lower magnetic core 202 is arranged on another mounting surface 101, and the bearing surface 211 where the main body 21 and the mounting surface 101 are bonded is provided with two adhesive glues 24 arranged at intervals, and the main body 21 of the lower magnetic core 202 passes through The adhesive glue 24 is bonded on the mounting surface 101 . The central column 23 of the lower magnetic core 202 is disposed in the middle area of the carrying surface 211 and between the two adhesives 24 . The center column 23 of the lower magnetic core 202 is accommodated in the receiving groove 103 , and is electrically connected to the center column 23 of the upper magnetic core 201 through the conductive glue 25 . The two mounting feet 22 of the lower magnetic core 202 are disposed on the edge region of the carrying surface 211 , located on two sides of the center post 23 , and are mirror-symmetrical to the center post 23 . The two mounting legs 22 of the lower magnetic core 202 are accommodated in the two mounting slots 102 respectively, and are electrically connected to the two mounting legs 22 of the upper magnetic core 201 through conductive glue 25 , forming two side columns of the magnetic core 2 .

In this embodiment, the winding 3 is a transformer winding. There are two windings 3, and the two windings 3 are buried in the substrate 1 at intervals, and are respectively arranged around the installation groove 102, that is, the two windings 3 are respectively arranged around the two side columns of the magnetic core 2, and are carried out in cooperation with the magnetic core 2. Electromagnetic conversion. Specifically, the winding 3 is a part of the inner layer circuit in the substrate 1, which is formed simultaneously with the inner layer circuit. The winding 3 includes two heat dissipation surfaces 301 facing the same direction as the two mounting surfaces 101. surface 101 and is flush with the installation surface 101 . It should be noted that, in other embodiments, the winding can also be an inductance winding, and the winding can also be arranged on the surface of the substrate, that is, the mounting surface of the substrate, and surround the mounting feet of the magnetic core. The present application does not specifically limit the positional relationship of the windings on the substrate.

In the direction perpendicular to the substrate 1, the projection of the cooling block 4 on the substrate 1 at least partially covers the projection of the winding 3 on the substrate 1, that is, the orthographic projection of the cooling block 4 on the mounting surface 101 at least partially covers the winding 3 on the mounting surface 101 Orthographic projection on . In this embodiment, the heat dissipation block 4 is arranged on the heat dissipation surface 301 of the winding 3, that is, the heat dissipation block 4 is fully in contact with the winding 3, so as to increase the contact area between the heat dissipation block 4 and the winding 3, which is equivalent to increasing the heat dissipation channel of the winding 3 The diameter improves the heat transfer efficiency of the heat dissipation block 4, thereby improving the heat dissipation efficiency of the winding 3. Specifically, there are 16 heat dissipation blocks 4 , and every 8 heat dissipation blocks 4 are arranged on two heat dissipation surfaces 301 of a winding 3 . Among them, four heat dissipation blocks 4 are spaced and evenly arranged on one heat dissipation surface 301 of the winding 3 , and the other four heat dissipation blocks 4 are spaced and evenly arranged on the other heat dissipation surface 301 of the winding 3 to realize uniform heat dissipation of the winding 3 . It can be understood that the larger the contact area between the heat dissipation block and the winding, the more conducive to speeding up the heat transfer efficiency of the heat dissipation block and improving the heat dissipation efficiency of the winding. In other embodiments, the heat dissipation block It can also be adapted to the heat dissipation surface to completely cover the heat dissipation surface so that the contact area between the heat dissipation block and the winding is the largest, and the application does not specifically limit the contact area between the heat dissipation block and the winding . It should be noted that, in other embodiments, when insulation needs to be maintained between the heat dissipation block and the winding, a layer of insulating ink layer can be added on the heat dissipation surface of the winding, and the heat dissipation block is arranged on the on the insulating ink layer, so that the heat dissipation block is in insulating contact with the winding, so as to meet the insulation requirements of the packaging module.

The thermal conductivity of the cooling block 4 is greater than that of the plastic-encapsulated structure 5, that is, the heat conduction rate of the cooling block 4 is higher than that of the plastic-encapsulated structure 5, so that the cooling block 4 can be used as a heat transfer bridge for the winding 3, and the winding 3 can work The heat generated during the process passes through the plastic encapsulation structure 5 and is transferred to the external environment. In this embodiment, the thermal conductivity of the heat dissipation block 4 is greater than 3W/(m·K), that is, the heat transferred through a unit horizontal cross-sectional area per unit time is greater than 3W under a unit temperature gradient. It should be understood that the thermal conductivity of the plastic package structure 5 is generally 1W/(m·K) or 3W/(m·K), and the thermal conductivity of the heat dissipation block 4 in this embodiment is greater than 3W/(m·K). The heat dissipation block 4 can form a cooling channel for the winding 3 in the plastic packaging structure 5 , reduce the thermal resistance of the winding 3 to the external environment, and realize rapid heat dissipation for the winding 3 .

In one embodiment, the material of the heat dissipation block 4 includes copper, that is, the heat dissipation block 4 is a copper block. The heat dissipation block 4 is reflow mounted on the heat dissipation surface 301 of the winding 3 by surface mount technology (SMT, Surface Mounting Technology), so as to fix the heat dissipation block 4 on the heat dissipation surface 301 of the winding 3 and realize effective contact between the heat dissipation block 4 and the winding 3 . It can be understood that, in other implementation manners, the heat dissipation block may also be installed on the surface of the winding through insulating and heat-conducting glue, and this application does not specifically limit the assembly method of the heat dissipation block on the surface of the winding. It should be noted that, in other implementation manners, the material of the heat dissipation block may also include gold, aluminum, silver, nickel or tin and other metal materials with high thermal conductivity.

The top surface 501 of the plastic encapsulation structure 5 is coplanar with the surface of the main body 21 of the magnetic core 2 and the surface of the heat dissipation block 4 facing away from the substrate 1, that is, the top surface 501 is located on the same surface as the surface of the main body 21 and the heat dissipation block 4 facing away from the substrate 1. At this time, the magnetic core The surface of the main body 21 of 2 and the heat dissipation block 4 facing away from the substrate 1 is exposed on the top surface 501 of the plastic packaging structure 5, so that the heat generated when the magnetic core 2 and the winding 3 work can directly pass through the main body 21 of the magnetic core 2 and the heat dissipation block 4. The surface of the substrate 1 is transmitted to the external environment, realizing rapid heat dissipation of the magnetic core 2 and the winding 3 , and further improving the overall heat dissipation performance of the packaging module 20 . Specifically, the plastic encapsulation structure 5 covers the installation surface 101 and the surrounding surfaces of the magnetic core 3 and the heat dissipation block 4 to improve the anti-corrosion capability of the packaging module 20 . In this embodiment, the material of the plastic sealing structure 5 is epoxy resin, and its thermal conductivity is 1W/(m·K). It should be noted that, in other embodiments, the surface of the main body and the heat dissipation block facing away from the substrate may also protrude from the top surface of the plastic packaging structure, so as to realize the protection of the magnetic core and the winding. Rapid heat dissipation, which is not specifically limited in this application.

In one embodiment, the top surface 501 of the plastic packaging structure 5 and the main body 21 of the magnetic core 2 and the surface of the heat sink 4 facing away from the substrate 1 are parallel to the mounting surface 101 of the substrate 1, so as to improve the regularity of the appearance of the package module 20 and make the package The module 20 is a structural part with a square appearance, which reduces the requirements of the packaging module 20 on the assembly environment and improves the application flexibility of the packaging module 20

In this embodiment, the packaging module 20 further includes a heating element 6 and a heat conducting block 7 . The heating element 6 and the main body 21 are arranged at intervals on the same side of the substrate 1, and the heat conducting block 7 is arranged on the surface of the heating element 6 facing away from the substrate 1, and extends to the top surface 501 along a direction perpendicular to the substrate 1, and the heat conducting block 7 faces away from the heating element. The surface of 6 is coplanar with the top surface 501. Specifically, there are two heating elements 6 , and the two heating elements 6 are welded on the two mounting surfaces 101 through a welding process. The distance from the surface of the heating element 6 facing away from the substrate 1 to the mounting surface 101 is less than the distance from the surface of the magnetic core 2 facing away from the substrate 1 to the mounting surface 101, that is, the height of the heating element 6 is less than the height of the magnetic core 2 protruding from the mounting surface 101. The heat generated when the element 6 is in operation needs to pass through the plastic encapsulation structure 5 to be transferred to the external environment. In one embodiment, the heating element 6 is a MOS (Metal Oxide Semiconductor, Metal Oxide Semiconductor) tube. It should be noted that, in other implementation manners, the heating element may also be an electronic component with relatively small height and serious heat generation, such as an inductor, a capacitor, or a resistor.

The heat conduction block 7 partially covers the surface of the heating element 6 away from the substrate 1 . It can be understood that the larger the contact area between the heat conducting block 7 and the heating element 6 is, the more favorable it is to speed up the heat transfer efficiency of the heat conducting block 7 and improve the heat dissipation efficiency of the heating element 6 . In other embodiments, the heat conduction block can also be adapted to the surface of the heating element away from the substrate, so as to completely cover the surface of the heat generation element away from the substrate, so that the heat conduction block and the The contact area of the heating element is the largest. Since the other structures of the packaging module remain unchanged at this time, no more description is given here.

The surface of the heat conduction block 7 facing away from the heating element 6 is coplanar with the top surface 501 of the plastic sealing structure 5, that is, the surface of the heat conduction block 7 facing away from the heating element 6 is located on the same surface as the surface of the magnetic core 2 facing away from the substrate 1. At this time, the heat conduction block 7 is away from the heat generating The surface of the element 6 is completely exposed on the top surface 501 of the plastic sealing structure 5, so that the heat generated by the heating element 6 can be directly transferred to the external environment through the surface of the heat conducting block 7 away from the heating element 7, so that the heating element 6 can be quickly heated. Heat dissipation. Specifically, the plastic sealing structure 5 covers the heating element 6 and the heat conducting element 7 to protect the heating element 6 and the heat conducting element 7 and further improve the anti-corrosion capability of the packaging module 20 . It should be noted that, in other embodiments, the surface of the heat conducting block facing away from the heating element may also protrude from the top surface of the plastic encapsulation structure, so as to realize rapid heat dissipation of the heating element. No specific restrictions are made.

In this embodiment, the thermal conductivity of the heat conduction block 7 is greater than the thermal conductivity of the plastic encapsulation structure 5 . Specifically, the thermal conductivity of the heat conduction block 7 is greater than 3W/(m·K), that is, the heat transferred through a unit horizontal cross-sectional area per unit time is greater than 3W at a unit temperature gradient. It should be understood that the thermal conductivity of the plastic package structure 5 is generally 1W/(m·K) or 3W/(m·K), and the thermal conductivity of the heat conduction block 7 in this embodiment is greater than 3W/(m·K). The heat dissipation channel of the heating element 6 is formed in the plastic sealing structure 5, which reduces the thermal resistance of the heating element 6 to the external environment, and quickly transfers the heat generated by the heating element 6 to the external environment through the plastic sealing structure 5.

In one embodiment, the material of the heat conduction block 7 includes copper, that is, the heat conduction block 7 is a copper block. After the metallization treatment of the surface of the heating element 6 away from the substrate 1, the heat conducting block 7 is reflow mounted on the surface of the heating element 6 through the surface mount technology, so as to fix the heat conducting block 7 on the surface of the heating element 6, and realize the heat conducting block 7 and the heating element. 6 effective contacts. It can be understood that, in other embodiments, the heat conduction block can also be installed on the surface of the heating element away from the substrate through insulating heat conduction glue. The method is not specifically limited. It should be noted that, in other implementation manners, the material of the heat conduction block may also include gold, aluminum, silver, nickel or tin and other metal materials with high thermal conductivity.

In this embodiment, the packaging module 20 further includes a thermal interface structure 8 and a heat sink 9 . The thermal interface structure 8 covers the surfaces of the magnetic core 2 , the heat dissipation block 4 and the thermal conduction block 7 away from the substrate 1 and the top surface 501 of the plastic encapsulation structure 5 . When the heat generated by the magnetic core 2, the winding 3 and the heating element 6 is transferred to the heat-conducting interface structure 8, the heat is evenly diffused in the heat-conducting interface structure 8 and then transferred to the external environment, which can uniformize the temperature of each position of the packaging module 20. temperature, reduce the temperature difference of each position of the packaging module 20, and at this time, the heat dissipation area of the packaging module 20 is the surface of the thermal interface structure 8 away from the substrate 1, that is, the addition of the thermal interface structure 8 also increases the heat dissipation area of the packaging module 20, improving The heat dissipation efficiency of the packaging module 20 is improved.

Please refer to FIG. 7 . FIG. 7 is an enlarged schematic structural view of the area C in the packaging module 20 shown in FIG. 4 in an implementation manner.

In this embodiment, the thermally conductive interface structure 8 includes a thermally conductive adhesive layer. Specifically, the heat-conducting adhesive layer covers the surface of the magnetic core 2 , the heat-dissipating block 4 , the plastic package structure 5 and the heat-conducting block 7 away from the substrate 1 . The thermal conductivity coefficient of the thermally conductive adhesive layer is greater than that of air, so as to further reduce the thermal resistance of the winding magnetic core 2 and the winding 3 to the external environment, improve the heat dissipation efficiency of the magnetic core 2, the winding 3 and the heating element 6, and then improve Heat dissipation efficiency of the packaging module 20 .

Please refer to FIG. 8 . FIG. 8 is an enlarged structural diagram of the area C in the package module 20 shown in FIG. 4 in another implementation manner.

The difference between the thermal interface structure 8 shown in this embodiment and the thermal interface structure 8 shown in the above embodiments is that the thermal interface structure 8 includes a transition layer 81 , a diffusion layer 82 and a protective layer 83 stacked in sequence. Specifically, the transition layer 81 covers the surface of the magnetic core 2 , the heat dissipation block 4 , the plastic encapsulation structure 5 and the heat conduction block 7 away from the substrate 1 , so as to increase the bonding force between the heat conduction interface structure 8 and the magnetic core 2 , the heat dissipation block 4 and the plastic encapsulation structure 5 . In one embodiment, the transition layer 81 is formed on the surface of the magnetic core 2 , the heat dissipation block 4 , the plastic package structure 5 and the heat conduction block 7 away from the substrate 1 by sputtering a titanium film or a copper film. In other implementation manners, the transition layer may also be formed through other coating processes, which is not specifically limited in the present application.

The diffusion layer 82 covers the surface of the transition layer 81 facing away from the substrate 1 to increase the thickness of the thermal interface structure 8 and evenly diffuse the heat transferred into the thermal interface structure 8 . In one embodiment, the diffusion layer 82 is formed on the surface of the transition layer 81 away from the substrate 1 by chemical plating or copper electroplating. In other implementation manners, the diffusion layer may also be formed by other processes, which is not specifically limited in the present application.

The protection layer 83 covers the surface of the diffusion layer 82 facing away from the transition layer 81 to protect the diffusion layer 82 made of copper and prevent the diffusion layer 82 from being oxidized. In one embodiment, the protection layer 83 is formed on the surface of the diffusion layer 82 away from the transition layer 81 by electroplating nickel or gold. In other implementation manners, the diffusion layer may also be formed by other processes, which is not specifically limited in the present application.

The heat sink 9 is disposed on the surface of the thermal interface structure 8 away from the substrate 1 . In this embodiment, the heat sink 9 covers the surface of the thermally conductive interface structure 8 away from the substrate 1, so as to transfer the heat transferred to the thermally conductive interface structure 8 to the external environment, so as to realize rapid heat dissipation of the magnetic core 2, winding 3 and heating element 6 . Specifically, the radiator 9 includes a heat dissipation body 91 and a plurality of heat dissipation fins 92 . The heat dissipation body 91 covers the surface of the protection layer 83 facing away from the diffusion layer 82 , and a plurality of heat dissipation fins 92 are spaced apart on the surface of the heat dissipation body 7 facing away from the protection layer 83 . The heat uniformly diffused by the heat conduction interface structure 8 is transferred to the heat dissipation body 91, and then transferred to the external environment through the heat dissipation fins 92. The existence of the heat dissipation fins 92 increases the heat dissipation area of the radiator 9, and increases the contact between the radiator 9 and the air. The contact area improves the heat exchange efficiency between the radiator 9 and the air, improves the heat dissipation efficiency of the radiator 9, further improves the heat dissipation performance of the packaging module 20, and helps to improve the electrical performance of the packaging module.

The embodiment of the present application also provides a second package module 20, which is different from the above-mentioned first package module 20 in that the materials of the heat dissipation block 4 and the heat conduction block 7 include alumina ceramics, that is, the heat dissipation block 4 and the heat conduction block 7 are both Alumina ceramic block. The heat dissipation block 4 and the heat conduction block 7 are bonded on the surface of the winding 3 and the heating element 6 by insulating and heat conducting glue, so that the heat dissipation block 4 and the heat conduction block 7 are respectively fixed on the surfaces of the winding 3 and the heat generating element 6 to realize heat dissipation block 4 and heat conduction The block 7 is in effective contact with the winding 3 and the heating element 6 respectively, and quickly transfers the heat generated by the winding 3 and the heating element 6 to the external environment. It can be understood that, in other implementation manners, the welding surface of the heat dissipation block and the heat conduction block may also be metallized, and then mounted on the surface of the winding and the heating element through SMT reflow, The present application does not specifically limit the assembly manner of the heat dissipation block and the heat conduction block.

In the embodiment of the present application, both the heat dissipation block 4 and the heat conduction block 7 use ceramic blocks to dissipate heat from the winding 3 and the heating element 6, which can significantly reduce the thermal resistance between the winding 3 and the heating element 6 to the radiator 9, and is square, flat and without pins. The packaged (QFN, QuadFlat No-leadPackage) MOS tube 6 can at least meet the heat dissipation requirement of 50W heat consumption. In addition, the ceramic material has good insulation performance, and the addition of the heat dissipation block 4 and the heat conduction block 7 can effectively avoid the problem of insulation withstand voltage.

The embodiment of the present application also provides a third package module 20, which is different from the above-mentioned second package module 20 in that the materials of the heat dissipation block 4 and the heat conduction block 7 include aluminum nitride ceramics, that is, the heat dissipation block 4 and the heat conduction block 7 Aluminum nitride ceramic block. It should be noted that, in other embodiments, the materials of the heat dissipation block and the heat conduction block may also be other high thermal conductivity ceramic materials, which are not specifically limited in this application.

Please refer to FIG. 9 . FIG. 9 is a process flow diagram of a method for manufacturing a packaging module provided in an embodiment of the present application.

The preparation method of the packaging module shown in the embodiment of the present application includes:

Step S1, please refer to FIG. 10 , providing a module 20a to be packaged. Wherein, the module 20a to be packaged includes a substrate 1, a magnetic core 2 and a winding 3, the magnetic core 2 includes a main body 21 and mounting feet 22 connected to the main body 21, the mounting feet 22 are connected to the substrate 1, and the main body 21 is along a direction perpendicular to the substrate. extend. The winding 3 is disposed inside the substrate 1 and is disposed around the mounting feet 22 for cooperating with the magnetic core to perform electromagnetic transformation.

Please refer to FIG. 11 to FIG. 12 together. FIG. 11 is a schematic cross-sectional structure diagram of the module to be packaged 20a shown in FIG. 10 along the D-D direction, and FIG. 12 is a schematic cross-sectional structure diagram of the module to be packaged 20a shown in FIG.

The substrate 1 includes two mounting surfaces 101 opposite to each other. Two installation grooves 102 and one receiving groove 103 are recessed on the installation surface 101 , and both the installation grooves 102 and the accommodation groove 103 penetrate the two installation surfaces 101 . The two installation slots 102 are spaced and oppositely arranged, and the receiving slot 103 is located between the two installation slots 102 and is spaced apart from the two installation slots 103 . In this embodiment, the substrate 1 is a printed circuit board, and an inner layer circuit for signal transmission is disposed inside the substrate 1 .

The mounting feet 22 of the magnetic core 2 are embedded in the mounting groove 102 . The magnetic core 2 includes an upper magnetic core 201 and a lower magnetic core 202 which are arranged oppositely. The upper magnetic core 201 and the lower magnetic core 202 are respectively mounted on the two installation surfaces 101 and electrically connected through the installation groove 102 and the receiving groove 103 . In this embodiment, the size and dimension of the upper magnetic core 201 and the lower magnetic core 202 are the same. Both the upper magnetic core 201 and the lower magnetic core 202 include a main body 21 , a central column 23 and two mounting feet 22 . The main body 21 of the upper magnetic core 201 is disposed on a mounting surface 101 , and the main body 21 includes a bearing surface 211 attached to the mounting surface 101 . The center column 23 is disposed in the middle area of the carrying surface 211 and accommodated in the receiving groove 103 . The two mounting feet 22 are disposed on the edge area of the carrying surface 211 , located on both sides of the central column 23 , and mirrored symmetrically with respect to the central column 23 . The two mounting feet 22 are respectively accommodated in the two mounting grooves 102 . The lower magnetic core 202 is interlocked with the upper magnetic core 201 through the installation groove 102 and the receiving groove 103 . The main body 21 of the lower magnetic core 202 is arranged on another mounting surface 101, and the bearing surface 211 where the main body 21 and the mounting surface 101 are bonded is provided with two adhesive glues 24 arranged at intervals, and the main body 21 of the lower magnetic core 202 passes through The adhesive glue 24 is bonded on the mounting surface 101 . The central column 23 of the lower magnetic core 202 is disposed in the middle area of the carrying surface 211 and between the two adhesives 24 . The center column 23 of the lower magnetic core 202 is accommodated in the receiving groove 103 , and is electrically connected to the center column 23 of the upper magnetic core 201 through the conductive glue 25 . The two mounting feet 22 of the lower magnetic core 202 are disposed on the edge region of the carrying surface 211 , located on two sides of the center post 23 , and are mirror-symmetrical to the center post 23 . The two mounting legs 22 of the lower magnetic core 202 are accommodated in the two mounting grooves 102 respectively, and are respectively electrically connected with the two mounting legs 22 of the upper magnetic core 201 through conductive glue 25 , forming two side columns of the magnetic core 2 .

In this embodiment, there are two windings 3, and the two windings 3 are buried in the substrate 1 at intervals, and are respectively arranged around the installation groove 102, that is, the two windings 3 are respectively arranged around the two side columns of the magnetic core 2, and The magnetic core 2 cooperates to perform electromagnetic conversion. Specifically, the winding 3 includes two heat dissipation surfaces 301 facing the same direction as the two installation surfaces 101 , and each heat dissipation surface 301 is exposed from one installation surface 101 and is flush with the installation surface 101 . In one embodiment, the winding 3 is a part of the inner circuit in the substrate 1 and is formed simultaneously with the inner circuit. It should be noted that, in other embodiments, the winding can also be arranged on the surface of the substrate, that is, the mounting surface of the substrate, and be arranged around the mounting feet of the magnetic core. The positional relationship on the substrate is not specifically limited.

In this embodiment, the module 20 a to be packaged further includes a heating element 6 , and the heating element 6 is spaced apart from the main body 21 on the same side of the substrate 1 . Specifically, there are two heating elements 6 , and the two heating elements 6 are welded on the two mounting surfaces 101 through a welding process. The distance from the surface of the heating element 6 facing away from the substrate 1 to the mounting surface 101 is less than the distance from the surface of the magnetic core 2 facing away from the substrate 1 to the mounting surface 101, that is, the height of the heating element 6 is less than the height of the magnetic core 2 protruding from the mounting surface 101. The heat generated when the element 6 is in operation needs to pass through the plastic encapsulation structure 5 to be transferred to the external environment. In one embodiment, the heating element 6 is a MOS tube. It should be noted that, in other implementation manners, the heating element may also be an electronic component with relatively small height and serious heat generation, such as an inductor, a capacitor, or a resistor.

Step S2, please refer to FIG. 13, install the heat dissipation block 4 on one side of the substrate 1, wherein the heat dissipation block 4 and the main body 21 are arranged on the same side of the substrate 1 at intervals, and in the direction perpendicular to the substrate 1, the heat dissipation block 4 and the The windings 3 are at least partially overlapped, and the heat dissipation block 4 extends along a direction perpendicular to the substrate 1 . Specifically, the heat dissipation block 4 is disposed on the heat dissipation surface 301 of the winding 3 .

In one embodiment, the heat dissipation block 4 is an alumina ceramic block or an aluminum nitride ceramic block. In step S2 , first metallize the welding surface of the heat dissipation block 4 , and then use solder to weld the heat dissipation block 4 to the heat dissipation surface 301 of the winding 3 . It should be noted that, in other embodiments, the heat dissipation block can also be installed on the heat dissipation surface of the winding by means of insulating and thermally conductive glue. Not specifically limited.

In the packaging method of the packaging module shown in this embodiment, after step S2, the packaging method of the packaging module further includes:

Step S21 , please refer to FIG. 14 , install the heat conducting block 7 on the surface of the heating element 6 away from the substrate 1 .

In one embodiment, the heat conduction block 7 is an alumina ceramic block or an aluminum nitride ceramic block. In step S21 , the heat conduction block 7 is pasted on the surface of the heating element 6 away from the substrate 1 through insulating heat conduction glue. It should be noted that, in other embodiments, it is also possible to first metallize the surface of the heating element away from the substrate and the welding surface of the heat conduction block, and then use solder to weld the heat conduction block to the heating element. The component is away from the surface of the substrate, and the application does not specifically limit the installation method of the heat conducting block on the surface of the heating element away from the substrate.

Step S3 , please refer to FIG. 15 , forming a plastic package structure 5 covering the magnetic core 2 and the heat dissipation block 4 on the substrate 1 , wherein the plastic package structure 5 exposes the surface of the magnetic core 2 and the heat dissipation block 4 away from the substrate 1 . In this embodiment, the plastic encapsulation structure 5 also covers the heating element 6 and the heat conducting block 7 , and exposes the surface of the heat conducting block 7 facing away from the heating element 6 .

In one embodiment, step S3 can be completed through the following steps S31 and S32.

Step S31 , please refer to FIG. 16 , forming a plastic package 5 a covering the installation surface 101 , the magnetic core 2 and the heat dissipation block 4 . In this embodiment, the plastic package 5 a also covers the heating element 6 and the heat conducting block 7 .

Step S32 , removing the part of the plastic package 5 a facing away from the substrate 1 , exposing the surfaces of the magnetic core 2 , heat dissipation block 4 and heat conduction block 7 facing away from the substrate 1 to form a plastic package structure 5 , as shown in FIG. 15 . In this embodiment, the part of the plastic package 5 a away from the substrate 1 is removed by grinding.

In the packaging method of the packaging module shown in this embodiment, compared with the scheme of using copper blocks for the heat dissipation block 4 and the heat conduction block 7, the heat dissipation block 4 and the heat conduction block 7 in the embodiment of the present application are both made of alumina ceramic blocks or nitrogen In the process of grinding the plastic package 5a, the aluminum ceramic block can not only avoid the problem that the copper powder produced in the process of grinding the copper block pollutes the grinding disc, resulting in cracks and damage to the magnetic core 2 when grinding the magnetic core 2, but also effectively guarantees The heat dissipation and insulation problem of the packaged module reduces the difficulty of the module package process and improves the flexibility of the packaged module application.

Step S4 , please refer to FIG. 17 , forming a thermally conductive interface structure 8 covering the surface of the magnetic core 2 , the heat dissipation block 4 and the plastic encapsulation structure 5 facing away from the substrate 1 . In this embodiment, the thermally conductive interface structure 8 also covers the surface of the thermally conductive block 7 away from the heating element 6 . Specifically, after the transition layer 81 is formed by sputtering a titanium-coated film or a copper film on the surface of the magnetic core 2, the heat dissipation block 4, the plastic package structure 5, and the heat conduction block 7 away from the substrate 1, the surface of the transition layer 81 away from the substrate 1 is chemically The diffusion layer 82 is formed by copper plating or electroplating, and finally the protection layer 83 is formed by electroplating nickel or gold on the surface of the diffusion layer 82 away from the transition layer 81. The transition layer 81, diffusion layer 82 and protection layer 83 are sequentially stacked The thermal interface structure 8. It should be noted that, in other embodiments, the thermally conductive interface structure 8 may also be a thermally conductive adhesive layer, and this application does not specifically limit the specific structure and material of the thermally conductive interface structure.

Step S5 , assembling the heat sink 9 on the surface of the thermal interface structure 8 away from the substrate 1 , as shown in FIG. 4 . In this embodiment, the heat sink 9 covers the surface of the thermally conductive interface structure 8 away from the substrate 1, so as to transfer the heat transferred to the thermally conductive interface structure 8 to the external environment, so as to realize the maintenance of the magnetic core 2, the winding 3 and the heating element. 6. Rapid heat dissipation.

Claims (13)

1. A packaging module, characterized in that it includes a substrate, a magnetic core, a winding, a heat sink, and a plastic package structure, the magnetic core includes a main body and mounting feet connected to the main body, and the mounting feet are connected to the substrate , the winding is arranged inside the substrate or on the surface of the substrate, and is arranged around the mounting feet, so as to cooperate with the magnetic core to perform electromagnetic transformation, and the heat dissipation block is arranged at a distance from the main body on the On the same side of the substrate, in a direction perpendicular to the substrate, the heat dissipation block and the winding are at least partially overlapped, and the plastic encapsulation structure wraps the magnetic core and the heat dissipation block on the substrate, so The plastic package structure includes a top surface away from the substrate, the main body and the heat dissipation block extend to the top surface along a direction perpendicular to the substrate, and the magnetic core and the heat dissipation block are away from the substrate The surface of the magnetic core and the heat slug are coplanar with the top surface, or the surface of the magnetic core and the heat slug facing away from the substrate protrudes from the top surface. 2. The packaging module according to claim 1, wherein the thermal conductivity of the heat dissipation block is greater than the thermal conductivity of the plastic packaging structure. 3. The packaging module according to claim 1 or 2, wherein the material of the heat dissipation block comprises alumina ceramics, aluminum nitride ceramics or copper. 4. The packaging module according to claim 1, wherein the heat dissipation module further comprises a heat conduction interface structure, and the heat conduction interface structure covers the surface of the magnetic core and the heat dissipation block away from the installation surface and the the top surface. 5 . The packaging module according to claim 4 , further comprising a heat sink disposed on a surface of the thermal interface structure away from the substrate. 6 . 6. The packaging module according to claim 1, characterized in that, the packaging module further comprises a heating element and a heat conduction block, the heating element is spaced apart from the main body on the same side of the substrate, and the heat conduction block It is provided on the surface of the heating element away from the substrate and extends to the top surface in a direction perpendicular to the substrate, and the surface of the heat conducting block away from the heating element is coplanar with the top surface, or , the surface of the heat conducting block facing away from the heating element protrudes from the top surface. 7 . The packaging module according to claim 6 , wherein the thermal conductivity of the heat conduction block is greater than the thermal conductivity of the plastic encapsulation structure. 8. The packaging module according to claim 6 or 7, wherein the material of the heat conducting block comprises alumina ceramics, aluminum nitride ceramics or copper. 9. An electronic device, comprising a control module and the packaging module according to any one of claims 1-8, the control module being electrically connected to the packaging module. 10. A method for encapsulating a packaged module, comprising: A module to be packaged is provided, wherein the module to be packaged includes a substrate, a magnetic core and a winding, the magnetic core includes a main body and mounting feet connected to the main body, the mounting feet are connected to the substrate, and the main body Extending in a direction perpendicular to the substrate, the winding is arranged inside the substrate or on the surface of the substrate, and is arranged around the mounting feet, so as to cooperate with the magnetic core to perform electromagnetic transformation; Install the heat dissipation block on one side of the substrate, wherein the heat dissipation block and the main body are arranged at intervals on the same side of the substrate, and in a direction perpendicular to the substrate, the heat dissipation block and the winding At least partially overlapping, the heat slug extends in a direction perpendicular to the substrate; A plastic encapsulation structure covering the magnetic core and the heat dissipation block on the substrate is formed, wherein the plastic encapsulation structure exposes the surface of the magnetic core and the heat dissipation block away from the substrate. 11. The packaging method of a packaged module according to claim 10, wherein the module to be packaged further comprises a heating element, and the heating element is spaced apart from the main body on the same side of the substrate; After providing a module to be packaged and before forming a plastic package structure covering the magnetic core and the heat dissipation block on the substrate, the packaging method of the package module further includes: installing the heat conduction block on the The heating element is away from the surface of the substrate, and the heat conducting block extends along the surface perpendicular to the substrate; In the process of forming the plastic encapsulation structure covering the magnetic core and the heat dissipation block on the substrate, the plastic encapsulation structure also covers the heating element and the heat conduction block, and exposes the heat conduction block away from the surface of the heating element. 12. The packaging method of a packaging module according to claim 10, wherein the process of forming the plastic packaging structure covering the magnetic core and the heat dissipation block on the substrate includes: forming a plastic package covering the substrate, the magnetic core and the heat sink; removing the part of the plastic package away from the substrate to expose the surface of the magnetic core and the heat dissipation block away from the substrate to form a plastic package structure. 13. The packaging method of a packaging module according to any one of claims 10-12, characterized in that, after forming the plastic packaging structure covering the magnetic core and the heat slug on the substrate, the The encapsulation method of the encapsulation module also includes: forming a thermally conductive interface structure covering the surface of the magnetic core, the heat slug, and the plastic encapsulation structure facing away from the substrate; A heat sink is assembled on the surface of the thermal interface structure facing away from the substrate.