CN110602923A

CN110602923A - Packaging module, packaging method thereof and electronic equipment

Info

Publication number: CN110602923A
Application number: CN201910817591.4A
Authority: CN
Inventors: 潘伟健; 胡志祥; 叶刚
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2019-08-30
Filing date: 2019-08-30
Publication date: 2019-12-20
Anticipated expiration: 2039-08-30
Also published as: CN110602923B

Abstract

The application provides a packaging module, a preparation method thereof and electronic equipment. The packaging module comprises a substrate, a magnetic core, a winding, a radiating block and a plastic package structure, wherein the magnetic core comprises a main body and a mounting pin connected to the main body, the mounting pin is connected to the substrate, the winding is arranged inside or on the surface of the substrate and surrounds the mounting pin to be matched with the magnetic core for electromagnetic transformation, the radiating block and the main body are arranged on the same side of the substrate at intervals, in the direction perpendicular to the substrate, at least part of the radiating block is overlapped with the winding, the magnetic core and the radiating block are wrapped on the substrate by the plastic package structure, the plastic package structure comprises a top surface deviating from the substrate, the main body and the radiating block extend to the top surface in the direction perpendicular to the substrate, the surface of the magnetic core and the surface of the radiating block deviating from the substrate are coplanar with the top surface, or the surfaces of the magnetic core and the radiating block deviating from the substrate protrude out of, the work efficiency of the encapsulation module is improved.

Description

Packaging module, packaging method thereof and electronic equipment

Technical Field

The present disclosure relates to the field of packaging technologies, and in particular, to a packaging module, a packaging method thereof, and an electronic device.

Background

With the development of science and technology, more and more devices are developed towards miniaturization and integration. At present, all devices of equipment develop towards the miniaturization direction of modules, and modules such as a power supply comprise a power device, a control integrated circuit, a passive device and other numerous electronic components, so that the power density and the power consumption of the modules such as the power supply are greatly improved, the overall heat dissipation performance of the modules is poor, and the working efficiency is seriously influenced.

Disclosure of Invention

The application provides a packaging module, a packaging method thereof and electronic equipment, which are used for improving the heat dissipation performance of the packaging module and improving the working efficiency.

The utility model provides a packaging module includes base plate, magnetic core, winding, radiating block and plastic packaging structure, the magnetic core include the main part and connect in the installation foot of main part, the installation foot is connected to the base plate, the winding is located the inside of base plate or the surface of base plate, and encircle the installation foot sets up, in order to with the magnetic core cooperation carries out electromagnetic transformation, the radiating block with the main part interval sets up the homonymy of base plate, in the perpendicular to in the direction of base plate, the radiating block with the at least partial overlapping of winding, the plastic packaging structure will the magnetic core with the radiating block cladding is on the base plate, the plastic packaging structure is including deviating from the top surface of base plate, the main part with the radiating block extends to the top surface in the direction of base plate along the perpendicular to, just the main part with the radiating block deviates from the surface of base plate with top surface coplane, or the surface of the main body and the heat dissipation block, which faces away from the substrate, protrudes from the top surface.

In the packaging module, the radiating block which is at least partially overlapped with the winding in the direction perpendicular to the substrate is additionally arranged, the radiating block can reduce the thermal resistance between the winding and the external environment, a heat transfer way is provided for the winding as a heat conduction channel of the winding, the surface of the main body and the radiating block which deviate from the substrate is coplanar with the top surface, or the surface of the magnetic core and the surface of the radiating block which deviate from the substrate protrude out of the top surface, namely the surface of the magnetic core and the surface of the radiating block which deviate from the substrate expose out of the top surface, the heat generated during the working of the magnetic core and the winding can pass through the plastic package structure and is transferred to the external environment through the surface of the magnetic core and the surface of the radiating block which deviate from the substrate respectively, so that the rapid heat dissipation of the magnetic core and the winding is realized, and the overall heat dissipation performance of the packaging module, the work efficiency of the packaging module is improved.

In one embodiment, the heat dissipation block at least partially overlaps the winding in a direction perpendicular to the substrate, that is, an orthographic projection of the heat dissipation block on the substrate at least partially covers an orthographic projection of the winding on the substrate, so that heat generated by the winding during operation can be directly transferred to the heat dissipation block.

In one embodiment, the winding is embedded in the substrate, the winding includes a heat dissipation surface facing the main body, and the heat dissipation block is disposed on the heat dissipation surface to increase a contact area between the heat dissipation block and the winding, which is equivalent to increase a diameter of a heat dissipation channel of the winding, thereby improving overall heat dissipation performance of the package module.

In one embodiment, the heat conductivity of the radiating block is greater than the heat conductivity of the plastic package structure, namely, the heat conduction speed of the radiating block is faster than the heat conduction speed of the plastic package structure, so that the radiating block can serve as the heat transfer bridge of the winding, and the heat generated by the winding passes through the plastic package structure and is transferred to the external environment.

In one embodiment, the thermal conductivity of the heat slug is greater than 3W/(m · K).

It should be understood that the thermal conductivity of the plastic package structure is generally 1W/(m · K) or 3W/(m · K), the thermal conductivity of the heat dissipation block of the present embodiment is greater than 3W/(m · K), a heat dissipation channel of the winding can be formed in the plastic package structure, and the heat generated when the winding operates can be rapidly transferred to the external environment.

In one embodiment, the heat dissipation block is made of a metal material such as copper, and the heat dissipation block is fixed on the heat dissipation surface of the winding by welding or by using an insulating heat-conducting adhesive to achieve effective contact with the winding, so that heat generated by the winding can be directly transferred to the external environment through the heat dissipation block.

In one embodiment, the heat dissipation block is made of a high-thermal-conductivity ceramic material such as alumina ceramic or aluminum nitride ceramic, and the welding surface of the heat dissipation block is fixed to the heat dissipation surface of the winding in a welding manner after being metalized, or the heat dissipation block is fixed to the heat dissipation surface of the winding through insulating heat-conducting glue to achieve effective contact with the winding, so that heat generated by the winding can be directly transferred to the external environment through the heat dissipation block. Moreover, as the ceramic material has good insulating property, the heat dissipation block made of the ceramic material is additionally arranged in the packaging module, so that the problem of insulation and voltage resistance can be effectively avoided.

In one embodiment, the package module further includes a thermal interface structure covering the surfaces of the magnetic core and the heat slug facing away from the substrate and the top surface for uniformly diffusing heat transferred to the thermal interface structure. In the encapsulation module shown in this embodiment, the magnetic core and the heat transfer that the winding during operation produced extremely behind the heat conduction interface structure, the heat is in after the heat conduction interfacial layer evenly spreads in the transmission to external environment again, not only can reduce the temperature difference of each position of encapsulation module, can also increase the heat radiating area of encapsulation module improves the whole radiating efficiency of encapsulation module.

In one embodiment, the thermal interface structure includes a thermal conductive adhesive layer, and a thermal conductivity of the thermal conductive adhesive layer is greater than a thermal conductivity of air, so as to reduce a thermal resistance from the magnetic core and the winding to an external environment, and improve a heat dissipation efficiency of the package module.

In another embodiment, the heat conduction interface structure includes transition layer, diffuse layer and the protective layer that stacks gradually, the transition layer is used for increasing heat conduction interface structure with the magnetic core the radiating block with the cohesion of plastic envelope structure, the diffuse layer is used for even diffusion to transmit extremely the heat of heat conduction interface structure reduces the temperature difference of each position of encapsulation module, the protective layer is used for protecting the diffuse layer.

In one embodiment, the package module further includes a heat sink, where the heat conducting interface structure deviates from the surface of the substrate, so as to transfer the heat generated by the uniform diffusion of the heat conducting interface structure to the external environment, thereby achieving effective and rapid heat dissipation of the magnetic core and the winding, improving the overall heat dissipation performance of the package module, and contributing to improving the working efficiency of the package module.

In one embodiment, the heat sink covers the surface of the heat-conducting interface structure away from the substrate to increase the contact area between the heat sink and the heat-conducting interface structure, so that heat transferred to the heat-conducting interface structure can be transferred to the external environment more quickly, and the magnetic core and the winding can be quickly cooled.

In one embodiment, the heat sink includes a heat dissipating body and a plurality of heat dissipating fins, the heat dissipating body covers the surface of the heat conducting interface structure deviating from the substrate, and the heat dissipating fins are arranged at intervals on the surface of the heat dissipating body deviating from the heat conducting interface structure, so as to further increase the heat dissipating area of the heat sink and improve the heat dissipating efficiency of the heat sink.

In one embodiment, the package module further includes a heat generating element and a heat conducting block, the heat generating element and the main body are disposed at the same side of the substrate at an interval, the heat conducting block is disposed on a surface of the heat generating element facing away from the substrate and extends to the top surface along a direction perpendicular to the substrate, and a surface of the heat conducting block facing away from the heat generating element is coplanar with the top surface, or a surface of the heat conducting block facing away from the heat generating element protrudes from the top surface.

In the package module of this embodiment, the heat conduction block is assembled on the surface of the heating element away from the substrate, the heat conduction block is additionally provided to reduce the thermal resistance between the heating element and the external environment, and can serve as a heat transfer bridge to provide a heat transfer path for the heating element, and the surface of the heat conduction block away from the heating element is coplanar with the top surface, or the surface of the heat conduction block away from the heating element protrudes out of the top surface, that is, the surface of the heat conduction block away from the heating element is exposed out of the top surface, and the plastic package structure at least partially exposes out of the surface of the heat conduction block away from the heating element, so that heat generated during the operation of the heating element can pass through the plastic package structure and is transferred to the external environment through the surface of the heat conduction block away from the heating element, thereby achieving the rapid heat dissipation of the heating element, the integral heat dissipation performance of the packaging module is improved, and the working efficiency of the packaging module is improved.

In one embodiment, the thermal conductivity of the heat conducting block is greater than the thermal conductivity of the plastic package structure, that is, the thermal conduction speed of the heat conducting block is higher than the thermal conduction speed of the plastic package structure, so that the heat conducting block can be used as a heat transfer bridge of the heating element to rapidly transfer the heat generated by the heating element to the external environment.

In one embodiment, the thermal conductivity of the thermally conductive mass is greater than 3W/(m · K).

It should be understood that the thermal conductivity of the plastic package structure is generally 1W/(m · K) or 3W/(m · K), and in this embodiment, the thermal conductivity of the heat conduction block is greater than 3W/(m · K), and at this time, the heat conduction block can form a heat dissipation channel of the heating element in the plastic package structure, so that heat generated when the heating element operates is quickly transferred to the external environment through the plastic package structure.

In one embodiment, the heat conducting block is made of a metal material such as copper, and after the surface of the heating element facing away from the substrate is metalized, the heat conducting block is fixed to the surface of the heating element facing away from the substrate by welding, or the heat conducting block is fixed to the surface of the heating element facing away from the substrate by an insulating heat conducting adhesive, so as to achieve effective contact with the heating element, and thus heat generated by the heating element can be directly transferred to the external environment through the heat conducting block.

In one embodiment, the material of the heat conducting block includes a high-thermal-conductivity ceramic material such as an aluminum oxide ceramic or an aluminum nitride ceramic, after the surface of the heating element away from the substrate and the welding surface of the heat conducting block are metalized, the heat conducting block is fixed on the surface of the heating element away from the substrate in a welding manner, or the heat conducting block is fixed on the surface of the heating element away from the substrate through an insulating heat conducting adhesive, so as to achieve effective contact with the heating element, so that heat generated by the heating element can be directly transferred to the external environment through the heat dissipating block and the heat conducting block. Moreover, as the ceramic material has good insulating property, the heat conducting block made of the ceramic material is additionally arranged in the packaging module, so that the problem of insulation and voltage resistance can be effectively avoided.

The electronic equipment comprises a control module and any one of the encapsulation modules, wherein the controller is electrically connected with the encapsulation modules and used for controlling the operation of the encapsulation modules.

The preparation method of the packaging module comprises the following steps:

providing a module to be packaged, wherein the module to be packaged comprises a substrate, a magnetic core and a winding, the magnetic core comprises a main body and a mounting pin connected to the main body, the mounting pin is connected to the substrate, the main body extends in a direction perpendicular to the substrate, and the winding is arranged in the substrate or on the surface of the substrate and surrounds the mounting pin so as to be matched with the magnetic core for electromagnetic transformation;

installing a radiating block on one side of the substrate, wherein the radiating block and the main body are arranged on the same side of the substrate at intervals, the radiating block and the winding are at least partially overlapped in a direction perpendicular to the substrate, and the radiating block extends in the direction perpendicular to the substrate;

and forming a plastic package structure for wrapping the magnetic core and the radiating block on the substrate, wherein the plastic package structure exposes the magnetic core and the radiating block deviates from the surface of the substrate.

In the preparation method of the packaging module, in the direction perpendicular to the substrate, the radiating block is formed to be at least partially overlapped with the winding, the cladding is formed again, the magnetic core is in the plastic package structure of the radiating block, the plastic package structure is exposed, the magnetic core is deviated from the surface of the substrate, the magnetic core and the heat generated during the operation of the winding can penetrate through the plastic package structure, the magnetic core and the radiating block are respectively passed through the surface of the substrate and are transmitted to the external environment, the rapid heat dissipation of the magnetic core and the winding is realized, and the overall heat dissipation performance of the packaging module is improved.

In one embodiment, the module to be packaged further includes a heat generating element, and the heat generating element and the main body are spaced on the same side of the substrate;

after the module to be packaged is provided and before the plastic package structure for coating the magnetic core and the heat dissipation block on the substrate is formed, the packaging method of the module to be packaged further comprises the following steps: mounting a heat conduction block on a surface of the heating element facing away from the substrate, the heat conduction block extending perpendicular to the surface of the substrate;

in the process of forming the plastic package structure for coating the magnetic core and the radiating block on the substrate, the plastic package structure further coats the heating element and the heat conducting block, and exposes the surface of the heat conducting block deviating from the heating element.

In the method for manufacturing the package module according to this embodiment, a heat dissipation block is additionally disposed on a surface of the heating element away from the substrate, and then a plastic package structure exposing a surface of the heat conduction block away from the heating element is formed, so that heat generated by the heating element during operation can be directly transferred to an external environment through the heat conduction block passing through the plastic package structure, thereby improving overall heat dissipation performance of the package module.

In one embodiment, in the process of forming the plastic package structure in which the magnetic core and the heat dissipation block are coated on the substrate, the method includes:

forming a plastic package body covering the substrate, the magnetic core and the heat dissipation block;

and removing the part deviating from the substrate in the plastic package body to expose the magnetic core and the surface of the heat dissipation block deviating from the substrate, so as to form a plastic package structure.

In the method for manufacturing the package module according to this embodiment, a plastic package body covering the substrate, the magnetic core, and the heat dissipation block is formed first, and then a portion of the plastic package body deviating from the substrate is removed to expose a surface of the magnetic core and a surface of the heat dissipation block deviating from the substrate, so that heat generated during operation of the magnetic core and the winding can be directly transferred to an external environment through the surface of the magnetic core and the surface of the heat dissipation block deviating from the substrate, thereby achieving rapid heat dissipation of the magnetic core and the winding.

In one embodiment, after the plastic package structure that wraps the magnetic core and the heat dissipation block on the substrate is formed, the method for packaging the package module further includes:

forming a heat conduction interface structure covering the magnetic core, the heat dissipation block and the surface of the plastic package structure, which is away from the substrate;

and assembling a radiator on the surface of the heat conduction interface structure, which faces away from the substrate.

In the method for manufacturing the package module according to the embodiment, the magnetic core, the heat dissipation block, and the plastic package structure are separated from the surface of the substrate to form the heat conduction interface structure, and after the magnetic core and the winding generate heat during operation and are transferred to the heat conduction interface structure, the heat conduction interface structure uniformly disperses the heat and then transfers the heat to the external environment through the radiator, so that the temperature of each position in the package module can be uniformized, the temperature difference of each position of the package module is reduced, and the improvement of the overall heat dissipation performance of the package module is facilitated.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments or the background art of the present application, the drawings required to be used in the embodiments or the background art of the present application will be described below.

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure;

fig. 2 is a schematic structural diagram of a package module according to an embodiment of the present disclosure;

FIG. 3 is a schematic diagram of a portion of the package module shown in FIG. 2;

FIG. 4 is a cross-sectional view of the package module shown in FIG. 2 along the A-A direction;

FIG. 5 is a cross-sectional view of the package module shown in FIG. 3 along the direction B-B;

FIG. 6 is an exploded view of the package module shown in FIG. 5;

FIG. 7 is an enlarged view of a region C of the package module shown in FIG. 4 in accordance with one embodiment;

FIG. 8 is an enlarged view of a region C of the package module shown in FIG. 4 according to another embodiment;

fig. 9 is a process flow diagram of a packaging method for packaging a module according to an embodiment of the present disclosure;

FIG. 10 is a schematic structural diagram of a module to be packaged in the packaging method of the packaged module shown in FIG. 9;

FIG. 11 is a schematic cross-sectional view of the module to be packaged shown in FIG. 10 along the direction D-D;

FIG. 12 is a schematic cross-sectional view of the module to be packaged shown in FIG. 10 along the direction E-E;

fig. 13 is a cross-sectional view of a heat slug mounted on a mounting surface in the method of packaging the package module shown in fig. 9;

fig. 14 is a schematic cross-sectional view illustrating a heat conduction block mounted on a mounting surface in a packaging method of the package module shown in fig. 9;

fig. 15 is a schematic cross-sectional structure view of a plastic package structure formed in the packaging method of the package module shown in fig. 9;

FIG. 16 is a schematic cross-sectional view illustrating a plastic package formed by the packaging method of the package module shown in FIG. 9;

fig. 17 is a schematic cross-sectional view illustrating a thermal interface structure formed in the packaging method of the package module shown in fig. 9.

Detailed Description

The embodiments of the present application will be described below with reference to the drawings.

The embodiment of the application provides a packaging module and preparation and electronic equipment thereof adopts the radiating block to assemble on the installation face of base plate, and at least part covers the surface of winding, covers the plastic envelope structure of installation face exposes the part at least the radiating block deviates from the surface of base plate makes the radiating block does the winding provides the heat transfer way, plays the effect of heat transfer bridge, has reduced winding to external environment's thermal resistance, can with the heat that the winding during operation produced passes in the plastic envelope structure transmits to external environment, has realized right the quick heat dissipation of winding has improved packaging module's whole heat dispersion helps improving packaging module's work efficiency.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an electronic device 100 according to an embodiment of the present disclosure.

The electronic device 100 provided in the embodiment of the present application includes, but is not limited to, a System In Package (SIP) device such as a mobile phone, a tablet computer, a multimedia player, an e-book reader, a notebook computer, a vehicle-mounted device, or a wearable device. The electronic device 100 includes a control module 10 and a packaging module 20. The control module 10 is electrically connected to the package module 20 for controlling the package module 20 to convert voltage or current or frequency. The package module 20 converts the voltage, current or frequency and transmits the converted voltage, current or frequency to a next power conversion module or directly supplies power to an Integrated Circuit (ASIC). The control module 10 includes, but is not limited to, a driver chip.

Referring to fig. 2-4, fig. 2 is a schematic structural diagram of a package module 20 according to an embodiment of the present disclosure, wherein the package module 20 corresponds to the package module 20 shown in fig. 1. Fig. 3 is a schematic diagram of a portion of the package module 20 shown in fig. 2, wherein the thermal interface structure 8 and the heat sink 9 are not shown. Fig. 4 is a schematic cross-sectional view of the package module 20 shown in fig. 2 along a direction a-a, wherein the direction a-a shown in fig. 2 corresponds to the direction a-a shown in fig. 3.

The packaging module 20 comprises a substrate 1, a magnetic core 2, a winding 3, a heat dissipation block 4 and a plastic package structure 5. The magnetic core 2 includes a main body 21 and a mounting leg 22 connected to the main body 21, the mounting leg 22 being connected to the substrate 1. The winding 3 is disposed inside the substrate 1 and surrounds the mounting leg 22 to cooperate with the magnetic core 2 for electromagnetic transformation. The radiating block 4 and the main body 21 are arranged on the same side of the substrate 1 at intervals, and the radiating block 4 and the winding 3 are at least partially overlapped in the direction vertical to the substrate 1. The plastic package structure 5 wraps the magnetic core 2 and the heat dissipation block 4 on the substrate 1, the plastic package structure 5 comprises a top surface 501 deviating from the substrate 1, the main body 21 and the heat dissipation block 4 extend to the top surface 501 in a direction perpendicular to the substrate 1, and the surface of the main body 21 and the surface of the heat dissipation block 4 deviating from the substrate 1 are coplanar with the top surface 501. In this embodiment, the package module 20 is a power module. It should be noted that, in other embodiments, the package module may also be another plastic package module with high power consumption.

In the encapsulation module 20 shown in the embodiment of the application, the heat dissipation block 4 at least partially overlapped with the winding 3 in the direction perpendicular to the substrate 1 is additionally arranged, the heat dissipation block 4 can reduce the thermal resistance between the winding 3 and the external environment, a heat transfer path is provided for the winding 3 as a heat conduction channel of the winding 3, the surfaces of the main body 21 of the magnetic core 2 and the heat dissipation block 4 departing from the substrate 1 and the top surface 501 of the plastic package structure 5 are coplanar, the heat generated during the work of the magnetic core 2 and the winding 3 can pass through the plastic package structure 5, and is transferred to the external environment through the surfaces of the main body 21 and the heat dissipation block 4 departing from the substrate 1 respectively, so that the rapid heat dissipation of the magnetic core 2 and the winding 3 is realized, the overall heat dissipation performance of the encapsulation module 20 is improved, the work efficiency of the encapsulation.

Please refer to fig. 5 and fig. 6. Fig. 5 is a cross-sectional view of the package module 20 shown in fig. 3 along the direction B-B. Fig. 6 is an exploded schematic view of the package module 20 shown in fig. 5, wherein the plastic package structure 5 is not shown.

The substrate 1 includes two mounting surfaces 101 disposed oppositely. Two mounting grooves 102 and an accommodating groove 103 are concavely arranged on the mounting surface 101, and the mounting grooves 102 and the accommodating groove 103 penetrate through the two mounting surfaces 101. The two mounting grooves 102 are spaced and oppositely arranged, and the accommodating groove 103 is positioned between the two mounting grooves 102 and spaced from the two mounting grooves 103. In this embodiment, the substrate 1 is a Printed Circuit Board (PCB), and an inner Circuit for signal transmission is disposed in the substrate 1.

The mounting leg 22 of the magnetic core 2 is embedded in the mounting groove 102. The magnetic core 2 includes an upper magnetic core 201 and a lower magnetic core 202 which are oppositely arranged, the upper magnetic core 201 and the lower magnetic core 202 are respectively installed on the two installation surfaces 101, and the electrical connection is realized through the installation groove 102 and the accommodation groove 103. In the present embodiment, the magnetic core 2 is a magnetic core of a transformer. The upper core 201 and the lower core 202 are the same size and dimension. The upper core 201 and the lower core 202 each include a main body 21, a center pillar 23, and two mounting legs 22. The main body 21 of the upper core 201 is provided on one mounting surface 101, and the main body 21 includes a mounting surface 211 attached to the mounting surface 101. The center pillar 23 is disposed in the middle region of the receiving surface 211 and is received in the receiving groove 103. The two mounting legs 22 are disposed in the edge region of the carrying surface 211, are located at two sides of the center pillar 23, and are mirror-symmetrical with respect to the center pillar 23, and the two mounting legs 22 are respectively accommodated in the two mounting grooves 102. The lower core 202 is buckled with the upper core 201 through the mounting groove 102 and the receiving groove 103. The main body 21 of the lower core 202 is provided on the other mounting surface 101, two adhesive glues 24 are provided at intervals on the mounting surface 211 where the main body 21 is attached to the mounting surface 101, and the main body 21 of the lower core 202 is bonded to the mounting surface 101 by the adhesive glues 24. The center pillar 23 of the lower core 202 is disposed in the middle region of the carrying surface 211 and between the two bonding glues 24. The center leg 23 of the lower core 202 is accommodated in the accommodating groove 103 and electrically connected to the center leg 23 of the upper core 201 via the conductive paste 25. The two mounting legs 22 of the lower core 202 are disposed at the edge region of the carrying surface 211, are located at two sides of the center pillar 23, and are mirror-symmetrical with respect to the center pillar 23. The two mounting legs 22 of the lower magnetic core 202 are respectively accommodated in the two mounting grooves 102, and are electrically connected with the two mounting legs 22 of the upper magnetic core 201 through the conductive adhesive 25, so as to form two side columns of the magnetic core 2.

In this embodiment, the winding 3 is a transformer winding. The number of the windings 3 is two, the two windings 3 are embedded in the substrate 1 at intervals and are respectively arranged around the mounting groove 102, namely the two windings 3 are respectively arranged around the two side columns of the magnetic core 2 and are matched with the magnetic core 2 for electromagnetic conversion. Specifically, the winding 3 is a part of an inner-layer circuit in the substrate 1, and the formation of the winding 3 simultaneously with the inner-layer circuit includes two heat dissipation surfaces 301 facing the two mounting surfaces 101, and each heat dissipation surface 301 is exposed to one mounting surface 101 and is flush with the mounting surface 101. In other embodiments, the winding may be an inductance winding, the winding may be disposed on a surface of the substrate, that is, a mounting surface of the substrate, and may be disposed to surround the mounting leg of the magnetic core, and the positional relationship of the winding on the substrate is not particularly limited in the present application.

In the direction perpendicular to the substrate 1, the projection of the heat dissipation block 4 on the substrate 1 at least partially covers the projection of the winding 3 on the substrate 1, i.e. the orthographic projection of the heat dissipation block 4 on the mounting surface 101 at least partially covers the orthographic projection of the winding 3 on the mounting surface 101. In this embodiment, the heat dissipation block 4 is disposed on the heat dissipation surface 301 of the winding 3, that is, the heat dissipation block 4 is in full contact with the winding 3, so as to increase the contact area between the heat dissipation block 4 and the winding 3, which is equivalent to increase the diameter of the heat dissipation channel of the winding 3, thereby improving the heat transmission efficiency of the heat dissipation block 4, and further improving the heat dissipation efficiency of the winding 3. Specifically, there are 16 heat dissipation blocks 4, and 8 heat dissipation blocks 4 are disposed on two heat dissipation surfaces 301 of one winding 3. Wherein, 4 radiating blocks 4 are arranged on one radiating surface 301 of the winding 3 at intervals and uniformly, and the other 4 radiating blocks 4 are arranged on the other radiating surface 301 of the winding 3 at intervals and uniformly, so as to realize uniform heat dissipation of the winding 3. It can be understood that the larger the contact area of the heat dissipation block with the winding is, the more the heat dissipation block is favorable for accelerating the efficiency of heat transfer of the heat dissipation block, the improvement of the heat dissipation efficiency of the winding, in other embodiments, the heat dissipation block also can be matched with the heat dissipation surface to completely cover the heat dissipation surface, so that the heat dissipation block is the largest in contact area with the winding, and the contact area of the heat dissipation block with the winding is not specifically limited in the application. It should be noted that, in other embodiments, when insulation needs to be maintained between the heat dissipation block and the winding, an insulating ink layer may be additionally disposed on the heat dissipation surface of the winding, and the heat dissipation block is disposed on the insulating ink layer, so that the heat dissipation block and the winding are in insulating contact, and the insulation requirement of the package module is met.

The heat conductivity of the radiating block 4 is greater than that of the plastic package structure 5, that is, the heat conduction rate of the radiating block 4 is higher than that of the plastic package structure 5, so that the radiating block 4 can be used as a heat transfer bridge of the winding 3, and heat generated when the winding 3 works is transferred to the external environment through the plastic package structure 5. In this embodiment, the heat conductivity of the heat dissipating block 4 is greater than 3W/(m · K), that is, the amount of heat transferred per unit time through the unit horizontal sectional area is greater than 3W per unit temperature gradient. It should be understood that the thermal conductivity of the plastic package structure 5 is generally 1W/(m · K) or 3W/(m · K), and the thermal conductivity of the heat dissipation block 4 in this embodiment is greater than 3W/(m · K), so that the heat dissipation block 4 can form a heat dissipation channel of the winding 3 in the plastic package structure 5, reduce the thermal resistance from the winding 3 to the external environment, and achieve rapid heat dissipation of the winding 3.

In one embodiment, the material of the heat slug 4 comprises copper, i.e. the heat slug 4 is a copper slug. The heat slug 4 is reflow-mounted on the heat dissipation Surface 301 of the winding 3 by a Surface Mounting Technology (SMT) to fix the heat slug 4 on the heat dissipation Surface 301 of the winding 3, so that the heat slug 4 is effectively contacted with the winding 3. It is understood that, in other embodiments, the heat dissipation block may also be mounted on the surface of the winding through an insulating and heat-conducting adhesive, and the application does not specifically limit the manner in which the heat dissipation block is mounted on the surface of the winding. In another embodiment, the material of the heat dissipation block may include other metal materials having high thermal conductivity, such as gold, aluminum, silver, nickel, or tin.

The top surface 501 of the plastic package structure 5 is coplanar with the surfaces of the main body 21 and the heat dissipation block 4 of the magnetic core 2, which are away from the substrate 1, i.e. the top surface 501 is located on the same surface as the surfaces of the main body 21 and the heat dissipation block 4, which are away from the substrate 1, and the surfaces of the main body 21 and the heat dissipation block 4 of the magnetic core 2, which are away from the substrate 1, are exposed out of the top surface 501 of the plastic package structure 5, so that heat generated during the operation of the magnetic core 2 and the winding 3 can be directly transferred to the external environment through the surfaces of the main body 21 and the heat dissipation block 4 of the magnetic core 2, which are away from the substrate 1, thereby realizing. Specifically, the plastic package structure 5 covers the mounting surface 101 and the peripheral surfaces of the magnetic core 3 and the heat dissipation block 4 to improve the corrosion resistance of the package module 20. In this embodiment, the material of the plastic package structure 5 is epoxy resin, and the thermal conductivity thereof is 1W/(m · K). It should be noted that, in other embodiments, the surfaces of the main body and the heat dissipation block, which are away from the substrate, may also protrude from the top surface of the plastic package structure, so as to realize rapid heat dissipation of the magnetic core and the winding, which is not specifically limited in this application.

In one embodiment, the top surface 501 of the plastic package structure 5, the main body 21 of the magnetic core 2, and the surface of the heat dissipation block 4 away from the substrate 1 are parallel to the mounting surface 101 of the substrate 1, so as to improve the regularity of the appearance of the package module 20, make the package module 20a square structural member, reduce the requirement of the package module 20 on the assembly environment, and improve the flexibility of the application of the package module 20

In this embodiment, the package module 20 further includes a heat generating element 6 and a heat conductive block 7. The heating element 6 and the main body 21 are arranged on the same side of the substrate 1 at intervals, the heat conduction block 7 is arranged on the surface of the heating element 6 departing from the substrate 1 and extends to the top surface 501 along the direction perpendicular to the substrate 1, and the surface of the heat conduction block 7 departing from the heating element 6 is coplanar with the top surface 501. Specifically, there are two heating elements 6, and both the two heating elements 6 are welded to the two mounting surfaces 101 through a welding process. The distance from the surface of the heating element 6 departing from the substrate 1 to the mounting surface 101 is smaller than the distance from the surface of the magnetic core 2 departing from the substrate 1 to the mounting surface 101, that is, the height of the heating element 6 is smaller than the height of the magnetic core 2 protruding out of the mounting surface 101, and heat generated by the heating element 6 during operation can be transmitted to the external environment only by passing through the plastic package structure 5. In one embodiment, the heating element 6 is a MOS (Metal Oxide Semiconductor) tube. In another embodiment, the heating element may be an electronic component having a small height and generating heat severely, such as an inductor, a capacitor, or a resistor.

The heat-conducting block 7 partly covers the surface of the heating element 6 facing away from the substrate 1. It can be understood that the larger the contact area between the heat conduction block 7 and the heating element 6 is, the more beneficial the efficiency of the heat conduction block 7 in transferring heat is, and the heat dissipation efficiency of the heating element 6 is improved. In other embodiments, the heat conduction block may also be adapted to the surface of the heat generating element facing away from the substrate to completely cover the surface of the heat generating element facing away from the substrate, so as to maximize the contact area between the heat conduction block and the heat generating element, which will not be described herein too much in view of the fact that other structures of the package module are not changed at this time.

The surface of the heat conduction block 7 departing from the heating element 6 is coplanar with the top surface 501 of the plastic package structure 5, that is, the surface of the heat conduction block 7 departing from the heating element 6 and the surface of the magnetic core 2 departing from the substrate 1 are located on the same surface, and at the moment, the surface of the heat conduction block 7 departing from the heating element 6 is completely exposed out of the top surface 501 of the plastic package structure 5, so that heat generated by the heating element 6 during working can be directly transferred to the external environment through the surface of the heat conduction block 7 departing from the heating element 7, and rapid heat dissipation of the heating element 6 is realized. Specifically, the plastic package structure 5 covers the heating element 6 and the heat conducting member 7 to protect the heating element 6 and the heat conducting member 7, and further improve the corrosion resistance of the package module 20. It should be noted that, in other embodiments, a surface of the heat conduction block away from the heating element may also protrude from the top surface of the plastic package structure, so as to implement rapid heat dissipation of the heating element, which is not specifically limited in this application.

In this embodiment, the thermal conductivity of the heat conducting block 7 is greater than that of the plastic package structure 5. Specifically, the thermal conductivity of the heat-conducting block 7 is greater than 3W/(m · K), that is, the amount of heat transferred per unit time through the unit horizontal sectional area is greater than 3W per unit temperature gradient. It should be understood that the thermal conductivity of the plastic package structure 5 is generally 1W/(m · K) or 3W/(m · K), and the thermal conductivity of the heat conduction block 7 in this embodiment is greater than 3W/(m · K), so as to form a heat dissipation channel of the heating element 6 in the plastic package structure 5, reduce the thermal resistance from the heating element 6 to the external environment, and quickly transfer the heat generated by the heating element 6 during operation to the external environment through the plastic package structure 5.

In one embodiment, the material of the heat conducting block 7 comprises copper, i.e. the heat conducting block 7 is a copper block. After the surface of the heating element 6, which is away from the substrate 1, is metallized, the heat conduction block 7 is attached to the surface of the heating element 6 through a surface assembly technology in a backflow mode, so that the heat conduction block 7 is fixed on the surface of the heating element 6, and the heat conduction block 7 is effectively contacted with the heating element 6. It is understood that, in other embodiments, the heat conducting block may also be mounted on the surface of the heating element facing away from the substrate through an insulating heat conducting adhesive, and the application does not specifically limit the manner in which the heat conducting block is mounted on the surface of the heating element. In other embodiments, the material of the heat conducting block may include other metal materials with high thermal conductivity, such as gold, aluminum, silver, nickel, or tin.

In this embodiment, the package module 20 further includes a thermal interface structure 8 and a heat sink 9. The heat conducting interface structure 8 covers the surfaces of the magnetic core 2, the heat dissipation block 4 and the heat conduction block 7 facing away from the substrate 1 and the top surface 501 of the plastic encapsulated structure 5. After the heat generated by the magnetic core 2, the winding 3 and the heating element 6 during operation is transferred to the heat-conducting interface structure 8, the heat is uniformly diffused in the heat-conducting interface structure 8 and then transferred to the external environment, the temperature of each position of the packaging module 20 can be uniformized, the temperature difference of each position of the packaging module 20 is reduced, and the heat dissipation area of the packaging module 20 is the surface of the heat-conducting interface structure 8 deviating from the substrate 1, namely, the heat-conducting interface structure 8 is additionally arranged, the heat dissipation area of the packaging module 20 is further increased, and the heat dissipation efficiency of the packaging module 20 is improved.

Referring to fig. 7, fig. 7 is an enlarged schematic view of a region C in the package module 20 shown in fig. 4 according to an embodiment.

In this embodiment, the thermal interface structure 8 includes a thermal adhesive layer. Specifically, the heat conducting adhesive layer covers the surface of the magnetic core 2, the heat dissipation block 4, the plastic package structure 5 and the heat conduction block 7 departing from the substrate 1. The heat conduction coefficient of the heat conduction adhesive layer is larger than that of air, so that the thermal resistance from the winding magnetic core 2 and the winding 3 to the external environment is further reduced, the heat dissipation efficiency of the magnetic core 2, the winding 3 and the heating element 6 is improved, and the heat dissipation efficiency of the packaging module 20 is further improved.

Referring to fig. 8, fig. 8 is an enlarged schematic view of a region C of the package module 20 shown in fig. 4 according to another embodiment.

The heat conduction interface structure 8 according to the present embodiment is different from the heat conduction interface structure 8 according to the above-described embodiment in that the heat conduction interface structure 8 includes a transition layer 81, a diffusion layer 82, and a protective layer 83, which are sequentially stacked. Specifically, the transition layer 81 covers the surface of the magnetic core 2, the heat dissipation block 4, the plastic package structure 5, and the heat conduction block 7 away from the substrate 1, so as to increase the bonding force between the heat conduction interface structure 8 and the magnetic core 2, the heat dissipation block 4, and the plastic package structure 5. In one embodiment, the transition layer 81 is formed on the surfaces of the magnetic core 2, the heat dissipation block 4, the plastic encapsulated structure 5 and the heat conduction block 7 away from the substrate 1 by sputtering a titanium coating or a copper coating. In other embodiments, the transition layer may also be formed by other plating processes, which is not specifically limited in this application.

The diffusion layer 82 covers the surface of the transition layer 81 facing away from the substrate 1 to increase the thickness of the heat-conducting interface structure 8, so that the heat transferred to the heat-conducting interface structure 8 is uniformly diffused. In one embodiment, the diffusion layer 82 is formed by electroless or electrolytic copper plating on the surface of the transition layer 81 facing away from the substrate 1. In other embodiments, the diffusion layer may be formed by other processes, which is not specifically limited in this application.

The protective layer 83 covers the surface of the diffusion layer 82 facing away from the transition layer 81 to protect the diffusion layer 82 made of copper from oxidation of the diffusion layer 82. In one embodiment, the protective layer 83 is formed by electroplating nickel or gold on the surface of the diffusion layer 82 facing away from the transition layer 81. In other embodiments, the diffusion layer may be formed by other processes, which is not specifically limited in this application.

The heat sink 9 is arranged at a surface of the thermal interface structure 8 facing away from the substrate 1. In this embodiment, the heat sink 9 covers the surface of the heat conducting interface structure 8 away from the substrate 1 to transfer the heat transferred to the heat conducting interface structure 8 to the external environment, so as to realize rapid heat dissipation of the magnetic core 2, the winding 3 and the heating element 6. Specifically, the heat sink 9 includes a heat dissipating body 91 and a plurality of heat dissipating fins 92. The heat dissipation body 91 covers the surface of the protection layer 83 facing away from the diffusion layer 82, and a plurality of heat dissipation fins 92 are provided at intervals on the surface of the heat dissipation body 7 facing away from the protection layer 83. The heat uniformly diffused by the heat conduction interface structure 8 is transferred to the heat dissipation main body 91 and then transferred to the external environment through the heat dissipation fins 92, the heat dissipation area of the heat sink 9 is increased due to the heat dissipation fins 92, the contact area between the heat sink 9 and the air is increased, the heat exchange efficiency between the heat sink 9 and the air is improved, the heat dissipation efficiency of the heat sink 9 is improved, the heat dissipation performance of the package module 20 is further improved, and the electrical performance of the package module is improved.

The second package module 20 is different from the first package module 20 in that the materials of the heat dissipation block 4 and the heat conduction block 7 include alumina ceramics, that is, the heat dissipation block 4 and the heat conduction block 7 are alumina ceramics blocks. The radiating block 4 and the heat conducting block 7 are bonded on the surfaces of the winding 3 and the heating element 6 through insulating heat conducting glue, so that the radiating block 4 and the heat conducting block 7 are respectively fixed on the surfaces of the winding 3 and the heating element 6, the radiating block 4 and the heat conducting block 7 are respectively in effective contact with the winding 3 and the heating element 6, and heat generated by the winding 3 and the heating element 6 is rapidly transferred to the external environment. It is understood that, in other embodiments, the soldering surfaces of the heat dissipation block and the heat conduction block may be metalized and then reflowed and attached to the surfaces of the winding and the heat generating element by SMT, and the assembly manner of the heat dissipation block and the heat conduction block is not particularly limited in this application.

In the embodiment of the application, the heat dissipation block 4 and the heat conduction block 7 both adopt ceramic blocks to dissipate heat of the winding 3 and the heating element 6, so that the thermal resistance between the winding 3 and the heating element 6 and the radiator 9 can be obviously reduced, and the MOS tube 6 subjected to square flat No-lead package (QFN) can at least meet the heat dissipation requirement of 50W heat consumption. In addition, the ceramic material has good insulating property, and the problem of insulation and voltage resistance can be effectively avoided by adding the heat dissipation block 4 and the heat conduction block 7.

The third package module 20 is different from the second package module 20 in that the material of the heat spreader 4 and the heat conductive block 7 includes aluminum nitride ceramic, i.e., the heat spreader 4 and the heat conductive block 7 are aluminum nitride ceramic blocks. It should be noted that, in other embodiments, the material of the heat dissipation block and the heat conduction block may also be other high heat conduction ceramic materials, which is not specifically limited in this application.

Referring to fig. 9, fig. 9 is a process flow chart of a method for manufacturing a package module according to an embodiment of the present disclosure.

The preparation method of the packaging module disclosed by the embodiment of the application comprises the following steps:

in step S1, please refer to fig. 10, a module to be packaged 20a is provided. Wherein, waiting to encapsulate module 20a includes base plate 1, magnetic core 2 and winding 3, and magnetic core 2 includes main part 21 and the mounting foot 22 of connecting in main part 21, and mounting foot 22 is connected to base plate 1, and main part 21 extends along the direction that is perpendicular to the base plate. The winding 3 is arranged inside the substrate 1 and surrounds the mounting foot 22 to cooperate with the magnetic core for electromagnetic transformation.

Referring to fig. 11 to 12, fig. 11 is a schematic cross-sectional view of the module to be packaged 20a shown in fig. 10 along a direction D-D, and fig. 12 is a schematic cross-sectional view of the module to be packaged 20a shown in fig. 10 along a direction E-E.

The substrate 1 includes two mounting surfaces 101 disposed oppositely. Two mounting grooves 102 and an accommodating groove 103 are concavely arranged on the mounting surface 101, and the mounting grooves 102 and the accommodating groove 103 penetrate through the two mounting surfaces 101. The two mounting grooves 102 are spaced and oppositely arranged, and the accommodating groove 103 is positioned between the two mounting grooves 102 and spaced from the two mounting grooves 103. In this embodiment, the substrate 1 is a printed circuit board, and an inner layer circuit for signal transmission is disposed in the substrate 1.

The mounting leg 22 of the magnetic core 2 is embedded in the mounting groove 102. The magnetic core 2 includes an upper magnetic core 201 and a lower magnetic core 202 which are oppositely arranged, the upper magnetic core 201 and the lower magnetic core 202 are respectively installed on the two installation surfaces 101, and the electrical connection is realized through the installation groove 102 and the accommodation groove 103. In this embodiment, the upper core 201 and the lower core 202 have the same size and dimensions. The upper core 201 and the lower core 202 each include a main body 21, a center pillar 23, and two mounting legs 22. The main body 21 of the upper core 201 is provided on one mounting surface 101, and the main body 21 includes a mounting surface 211 attached to the mounting surface 101. The center pillar 23 is disposed in the middle region of the receiving surface 211 and is received in the receiving groove 103. The two mounting legs 22 are disposed in the edge region of the carrying surface 211, are located at two sides of the center pillar 23, and are mirror-symmetrical with respect to the center pillar 23, and the two mounting legs 22 are respectively accommodated in the two mounting grooves 102. The lower core 202 is buckled with the upper core 201 through the mounting groove 102 and the receiving groove 103. The main body 21 of the lower core 202 is provided on the other mounting surface 101, two adhesive glues 24 are provided at intervals on the mounting surface 211 where the main body 21 is attached to the mounting surface 101, and the main body 21 of the lower core 202 is bonded to the mounting surface 101 by the adhesive glues 24. The center pillar 23 of the lower core 202 is disposed in the middle region of the carrying surface 211 and between the two bonding glues 24. The center leg 23 of the lower core 202 is accommodated in the accommodating groove 103 and electrically connected to the center leg 23 of the upper core 201 via the conductive paste 25. The two mounting legs 22 of the lower core 202 are disposed at the edge region of the carrying surface 211, are located at two sides of the center pillar 23, and are mirror-symmetrical with respect to the center pillar 23. The two mounting legs 22 of the lower magnetic core 202 are respectively accommodated in the two mounting grooves 102, and are electrically connected with the two mounting legs 22 of the upper magnetic core 201 through the conductive adhesive 25, so as to form two side columns of the magnetic core 2.

In this embodiment, there are two windings 3, and the two windings 3 are embedded in the substrate 1 at intervals and respectively surround the mounting groove 102, that is, the two windings 3 are respectively disposed around the two side columns of the magnetic core 2 and cooperate with the magnetic core 2 to perform electromagnetic conversion. Specifically, the winding 3 includes two heat dissipation surfaces 301 facing the same direction as the two mounting surfaces 101, and each heat dissipation surface 301 is exposed to one mounting surface 101 and is flush with the mounting surface 101. In one embodiment, the winding 3 is part of an inner layer circuit in the substrate 1, formed simultaneously with said inner layer circuit. In other embodiments, the winding may be disposed on a surface of the substrate, that is, a mounting surface of the substrate, and may be disposed around the mounting leg of the magnetic core.

In this embodiment, the module to be packaged 20a further includes a heat generating element 6, and the heat generating element 6 and the main body 21 are disposed on the same side of the substrate 1 at an interval. Specifically, there are two heating elements 6, and both the two heating elements 6 are welded to the two mounting surfaces 101 through a welding process. The distance from the surface of the heating element 6 departing from the substrate 1 to the mounting surface 101 is smaller than the distance from the surface of the magnetic core 2 departing from the substrate 1 to the mounting surface 101, that is, the height of the heating element 6 is smaller than the height of the magnetic core 2 protruding out of the mounting surface 101, and heat generated by the heating element 6 during operation can be transmitted to the external environment only by passing through the plastic package structure 5. In one embodiment, the heating element 6 is a MOS transistor. In another embodiment, the heating element may be an electronic component having a small height and generating heat severely, such as an inductor, a capacitor, or a resistor.

Step S2, referring to fig. 13, the heat slug 4 is mounted on one side of the substrate 1, wherein the heat slug 4 and the main body 21 are spaced apart from each other and disposed on the same side of the substrate 1, the heat slug 4 and the winding 3 at least partially overlap each other in a direction perpendicular to the substrate 1, and the heat slug 4 extends in the direction perpendicular to the substrate 1. Specifically, the heat dissipation block 4 is provided on the heat dissipation surface 301 of the winding 3.

In one embodiment, the heat slug 4 is an alumina ceramic slug or an aluminum nitride ceramic slug. In step S2, the soldering surface of the heat dissipation block 4 is metalized, and then the heat dissipation block 4 is soldered to the heat dissipation surface 301 of the winding 3 with solder. In other embodiments, the heat dissipation block may be mounted on the heat dissipation surface of the winding by using an insulating heat-conducting adhesive, and the manner of mounting the heat dissipation block on the heat dissipation surface of the winding is not particularly limited in the present application.

In the method for packaging a package module shown in this embodiment, after step S2, the method further includes:

in step S21, please refer to fig. 14, the heat conduction block 7 is mounted on the surface of the heating element 6 away from the substrate 1.

In one embodiment, the heat conducting block 7 is an alumina ceramic block or an aluminum nitride ceramic block. In step S21, the heat conduction block 7 is attached to the surface of the heat generating element 6 facing away from the substrate 1 by an insulating heat conduction adhesive. In other embodiments, after the surface of the heating element facing away from the substrate and the bonding surface of the heat conduction block are metalized, the heat conduction block is bonded to the surface of the heating element facing away from the substrate by using solder, and the manner of mounting the heat conduction block on the surface of the heating element facing away from the substrate is not particularly limited in the present application.

Step S3, please refer to fig. 15, forming a plastic package structure 5 for wrapping the magnetic core 2 and the heat slug 4 on the substrate 1, wherein the plastic package structure 5 exposes the surface of the magnetic core 2 and the heat slug 4 away from the substrate 1. In this embodiment, the plastic package structure 5 further covers the heating element 6 and the heat conduction block 7, and exposes the surface of the heat conduction block 7 away from the heating element 6.

In one embodiment, step S3 may be completed by the following steps S31 and S32.

In step S31, referring to fig. 16, a plastic package 5a is formed to cover the mounting surface 101, the magnetic core 2, and the heat dissipation block 4. In the present embodiment, the molded body 5a also covers the heating element 6 and the heat conductive block 7.

Step S32, removing a portion of the plastic package body 5a away from the substrate 1, and exposing the surface of the magnetic core 2, the heat dissipation block 4, and the heat conduction block 7 away from the substrate 1 to form the plastic package structure 5, as shown in fig. 15. In this embodiment, a portion of the plastic package 5a away from the substrate 1 is removed by polishing.

In the encapsulation method of the encapsulation module shown in the embodiment, compared with the scheme that the heat dissipation block 4 and the heat conduction block 7 both adopt copper blocks, the heat dissipation block 4 and the heat conduction block 7 both adopt alumina ceramic blocks or aluminum nitride ceramic blocks in the embodiment of the application, in the process of grinding the plastic package body 5a, copper powder generated in the process of grinding the copper blocks can be avoided from polluting a grinding disc, the problem that cracks are generated when the magnetic core 2 is ground to damage the magnetic core 2 is caused, the heat dissipation insulation problem of the encapsulation module can be effectively guaranteed, the process difficulty of module encapsulation is reduced, and the application flexibility of the encapsulation module is improved.

In step S4, please refer to fig. 17, a heat conducting interface structure 8 is formed to cover the surface of the magnetic core 2, the heat dissipation block 4, and the plastic package structure 5 away from the substrate 1. In this embodiment, the heat-conducting interface structure 8 also covers the surface of the heat-conducting block 7 facing away from the heat-generating element 6. Specifically, after a transition layer 81 is formed by sputtering a titanium film or a copper film on the surfaces of the magnetic core 2, the heat dissipation block 4, the plastic package structure 5 and the heat conduction block 7 away from the substrate 1, a diffusion layer 82 is formed on the surface of the transition layer 81 away from the substrate 1 by means of chemical plating or copper electroplating, and finally a protection layer 83 is formed on the surface of the diffusion layer 82 away from the transition layer 81 by means of nickel electroplating or gold electroplating, so that the heat conduction interface structure 8 formed by sequentially stacking the transition layer 81, the diffusion layer 82 and the protection layer 83 is formed. It should be noted that, in other embodiments, the heat conducting interface structure 8 may also be a heat conducting adhesive layer, and the specific structure and material of the heat conducting interface structure are not specifically limited in this application.

In step S5, the heat sink 9 is mounted on the surface of the thermal interface structure 8 facing away from the substrate 1, as shown in fig. 4. In this embodiment, the heat sink 9 covers the surface of the heat conducting interface structure 8 away from the substrate 1, so as to transfer the heat transferred to the heat conducting interface structure 8 to the external environment, thereby achieving rapid heat dissipation of the magnetic core 2, the winding 3 and the heating element 6.

Claims

1. The utility model provides a packaging module, its characterized in that, includes base plate, magnetic core, winding, radiating block and plastic packaging structure, the magnetic core include the main part and connect in the installation foot of main part, the installation foot is connected to the base plate, the winding is located the inside of base plate or the surface of base plate, and encircle the installation foot sets up, in order with the magnetic core cooperation carries out the electromagnetic transformation, the radiating block with the main part interval sets up the homonymy of base plate, in the perpendicular to in the direction of base plate, the radiating block with the at least part of winding overlaps, the plastic packaging structure will the magnetic core with the radiating block cladding is on the base plate, the plastic packaging structure is including deviating from the top surface of base plate, the main part with the radiating block extends to in the direction of base plate perpendicular to the top surface, just the magnetic core with the radiating block deviate from the surface of base plate with top surface coplane, or the surfaces of the magnetic core and the heat dissipation block, which are far away from the substrate, protrude out of the top surface.

2. The package module of claim 1, wherein a thermal conductivity of the heat slug is greater than a thermal conductivity of the plastic encapsulated structure.

3. The package module of claim 1 or 2, wherein the material of the heat slug comprises an aluminum oxide ceramic, an aluminum nitride ceramic, or copper.

4. The packaged module of claim 1, wherein the heat spreader module further comprises a thermally conductive interface structure covering the top surface and surfaces of the magnetic core and the heat slug facing away from the mounting surface.

5. The packaged module of claim 4, further comprising a heat spreader disposed on a surface of the thermal interface structure facing away from the substrate.

6. The package module of claim 1, further comprising a heat generating component and a heat conducting block, wherein the heat generating component and the main body are spaced apart from each other on the same side of the substrate, the heat conducting block is disposed on a surface of the heat generating component facing away from the substrate and extends to the top surface in a direction perpendicular to the substrate, and a surface of the heat conducting block facing away from the heat generating component is coplanar with the top surface, or a surface of the heat conducting block facing away from the heat generating component protrudes above the top surface.

7. The package module of claim 6, wherein the thermal conductivity of the thermal block is greater than the thermal conductivity of the plastic encapsulated structure.

8. The package module of claim 6 or 7, wherein the material of the thermal conductive block comprises an aluminum oxide ceramic, an aluminum nitride ceramic, or copper.

9. An electronic device comprising a control module and a packaged module according to any of claims 1-8, the control module being electrically connected to the packaged module.

10. A method of encapsulating a module, comprising:

11. The method of claim 10, wherein the module to be packaged further comprises a heat generating element spaced apart from the main body on the same side of the substrate;

12. The method for packaging a package module according to claim 10, wherein the step of forming the plastic package structure in which the magnetic core and the heat spreader are coated on the substrate comprises:

13. The method for packaging a package module according to any one of claims 10 to 12, wherein after the forming the plastic package structure for coating the magnetic core and the heat dissipation block on the substrate, the method further comprises: