CN110602920B - Cold plate and method for producing a cold plate - Google Patents
Cold plate and method for producing a cold plate Download PDFInfo
- Publication number
- CN110602920B CN110602920B CN201811572280.8A CN201811572280A CN110602920B CN 110602920 B CN110602920 B CN 110602920B CN 201811572280 A CN201811572280 A CN 201811572280A CN 110602920 B CN110602920 B CN 110602920B
- Authority
- CN
- China
- Prior art keywords
- plate
- flow channel
- cover plate
- cooling flow
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a cold plate and a cold plate manufacturing method. In with apron and bottom plate welding, in with apron and bottom plate seam, arrange into and fall into the cooling channel after the melting of the solder layer between cooling channel and the apron and form the ruggedized layer in making the cooling channel, after the cooling channel was gone into to the coolant liquid, the coolant liquid through the ruggedized layer made the bubble in the coolant liquid produce more easily, made the coolant liquid can take away the heat fast, promoted the heat transfer performance of cold drawing, solved the poor problem of cold drawing heat dissipation effect among the prior art.
Description
Technical Field
The invention relates to a cold plate and a cold plate manufacturing method.
Background
With the development of high-power and high-energy consumption devices such as electronic devices in various fields, liquid cooling heat dissipation has also been applied deeply and widely in this respect. The structure of traditional liquid cooling cold drawing is comparatively simple, and through heating element and the laminating of liquid cooling cold drawing, inside coolant circulation heat conduction utilizes the heat cycle of liquid cooling cold drawing heat conduction effect with components and parts to bring back to the liquid cooling source to reach radiating purpose. When equipment or components and parts heating power and heat flux density are higher in the aviation field, conventional cold plate structural design can not satisfy the heat dissipation demand, needs carry out certain heat dissipation design in order to satisfy the heat dissipation requirement to the cold plate structure.
Disclosure of Invention
The invention aims to provide a cold plate, which aims to solve the problem of poor heat dissipation effect of the cold plate in the prior art; in addition, the invention also aims to provide a cold plate manufacturing method.
In order to achieve the purpose, the technical scheme of the cold plate is as follows:
the cold plate comprises a cover plate and a base plate which are welded together, at least one cooling flow channel for cooling liquid to flow is arranged on the base plate, and a roughening layer formed in the cooling flow channel after the welding flux of the cover plate and the base plate is melted is arranged in the cooling flow channel.
The invention has the beneficial effects that: when with apron and bottom plate welding, arrange into and fall into the cooling channel after the melting on the solder layer between cooling channel and the apron and form the roughness layer in making the cooling channel, after the cooling channel is gone into to the coolant liquid, make the bubble in the coolant liquid more easy production under the comparatively crude surface structure's of roughness layer effect, make the coolant liquid can take away the heat fast, promote the heat transfer performance of cold drawing, solved the poor problem of cold drawing heat dissipation effect among the prior art.
Furthermore, in order to improve the welding quality of the cover plate and the base plate, the welding mode of the cover plate and the base plate is brazing, and the characteristic that the process temperature of brazing is lower is utilized, so that the energy consumption of heating a welding flux layer is reduced, the low-temperature welding of the cover plate and the base plate is realized, the welding quality is improved, and the welding deformation of the cold plate is reduced.
Furthermore, in order to improve the welding quality of the cover plate and the base plate, a heat dissipation rib matched with the cover plate in a supporting mode is arranged in the cooling flow channel, the welding area between the cover plate and the base plate is increased, the welding strength of the cover plate and the base plate is improved, the heat exchange area is increased, and the heat dissipation effect is improved.
Furthermore, in order to reduce the flow resistance of the cooling liquid, the cooling flow channel comprises at least two common sections and distribution sections communicated with the common sections, and the distribution sections are arranged in parallel, so that the flow resistance of the cooling liquid is reduced, and the heat dissipation effect of the cold plate is improved.
The technical scheme of the cold plate manufacturing method of the invention is as follows:
the manufacturing method of the cold plate comprises the steps of processing a cooling flow channel on the base plate, then clamping a welding flux layer between the cover plate and one side of the base plate with the cooling flow channel, melting the welding flux layer to weld the cover plate and the base plate together, and melting the welding flux layer between the cooling flow channel and the cover plate and then falling into the cooling flow channel to form a roughened layer.
The invention has the beneficial effects that: set up the solder layer between apron and bottom plate, in with apron and bottom plate seam, it forms the roughness layer to fall into in the cooling channel after the melting in the solder layer of arranging between cooling channel and the apron in, after the cooling channel is gone into to the coolant liquid, make the bubble in the coolant liquid produce more easily under the effect of the comparatively coarse surface structure in roughness layer, make the coolant liquid can take away the heat fast, promote the heat transfer performance of cold drawing, the problem that cold drawing heat dissipation effect is poor among the prior art has been solved.
Furthermore, in order to improve the welding quality of the cover plate and the base plate, the cover plate and the base plate are brazed together, and the characteristic that the brazing process temperature is low is utilized, so that the energy consumption of heating a welding flux layer is reduced, the low-temperature welding of the cover plate and the base plate is realized, the welding quality is improved, and the welding deformation of a cold plate is reduced.
Furthermore, in order to improve the quality of the roughened layer, the cover plate and the base plate are brazed together in a vacuum mode, and the roughened layer generated in the cooling flow channel is moderate in surface roughness due to good wettability and fluidity of solder for vacuum brazing, so that the heat dissipation effect of the cold plate is improved, the brazing flux is not contained, the corrosion resistance of the cold plate is improved, and the pollution of the cold plate is avoided.
Drawings
FIG. 1 is a schematic structural view of a cold plate according to an embodiment 1 of the present invention;
FIG. 2 is a partial schematic view of the bottom plate of an embodiment 1 of the cold plate of the present invention;
in the figure: 1. a cover plate; 2. a brazing material layer; 3. heat dissipation ribs; 4. a base plate; 5. a roughening layer; 6. and cooling the flow channel.
Detailed Description
The following further describes embodiments of the present invention with reference to the drawings.
In embodiment 1 of the cold plate of the present invention, as shown in fig. 1 and 2, the cold plate includes a cover plate 1, a bottom plate 4, and a brazing material layer 2 disposed between the cover plate 1 and the bottom plate 4 to weld the cover plate 1 and the bottom plate 4 together, the bottom plate 4 is provided with a cooling flow channel 6 through which a cooling liquid flows, the bottom plate 4 is provided with a liquid inlet and a liquid outlet communicated with the cooling flow channel 6, the cooling liquid flows into the cooling flow channel 6 from the liquid inlet, so that the cooling liquid exchanges heat with a heat source attached to the cover plate 1 and then flows out from the liquid outlet, and heat generated by the heat source is taken away to cool the heat source. After the brazing material layer 2 is melted, part of the brazing material layer 2 arranged between the cooling flow channel 6 and the cover plate 1 falls into the cooling flow channel 6, the roughening layer 5 is generated in the cooling flow channel 6, and when cooling liquid flows through the roughening layer 5, bubbles are generated in the cooling liquid more easily under the action of the rough surface structure of the roughening layer 5, so that the heat transfer efficiency of the cooling liquid is improved.
In order to reduce the flow resistance of coolant liquid in cooling channel 6, improve the radiating effect of cold plate, therefore, in this embodiment, cooling channel 6 includes public section and separates into the distribution section of a plurality of parallelly connected settings through the runner division board that sets up in cooling channel 6, be equipped with on the diapire of cooling channel 6 a plurality ofly and apron 1 support complex heat dissipation muscle 3, improve the seam area of apron 1 and bottom plate 4 through heat dissipation muscle 3, improve the welding strength of apron 1 and bottom plate 4, and when coolant liquid flows through heat dissipation muscle 3, heat dissipation muscle 3 can produce certain vortex effect to the coolant liquid, improve the heat-sinking capability of cold plate, the indirect heat transfer area who has improved the cold plate of setting up of heat dissipation muscle 3 simultaneously, further improve radiating effect. Of course, in other embodiments, the cooling flow channel 6 may be a cooling flow channel with an equal cross section throughout; the number of the cooling flow channels can be any number, such as two, three and the like, which is larger than one, and the two ends of each cooling flow channel are respectively provided with a liquid inlet and a liquid outlet.
In this embodiment, the coolant liquid adopts freon R134a, before letting in the coolant liquid in cooling runner 6, in entering the evaporimeter after preheating the coolant liquid of low temperature liquid phase to saturation temperature, adjust the quality, with the boiling state control of coolant liquid in bubble attitude boiling stage, guarantee that the coolant liquid has higher heat transfer coefficient to guarantee comparatively stable flowing heat transfer state. Of course, in other embodiments, water or other cooling liquid may be used as the cooling liquid.
The method of manufacturing the cold plate in this embodiment is as follows: clamping brazing material layer 2 between cover plate 1 and bottom plate 4, and aligning the three mutually, then put cover plate 1, brazing material layer 2 and bottom plate 4 into vacuum furnace and heat, make brazing material layer 2 reach self melting point and begin to melt, the part that brazing material layer 2 in the molten state is placed between cover plate 1 and bottom plate 4 welds cover plate 1 and bottom plate 4 together, and the part that brazing material layer 2 is placed between cooling runner 6 and cover plate 1 drops in cooling runner 6, after cover plate 1, brazing material layer 2 and bottom plate 4 cool off naturally, brazing material layer 2 that drops in cooling runner 6 forms rough layer 5 in cooling runner 6, this cold drawing is accomplished. In the embodiment, the brazing material layer 2 is made of vacuum brazing filler metal, the quality of the roughened layer 5 is improved by utilizing good temperature wettability and flowability of the vacuum brazing filler metal, the surface roughness of the roughened layer 5 is kept in a moderate state, and the phenomenon that the flow resistance of cooling liquid is increased due to overlarge surface roughness is avoided. The solder layer 2 constitutes a solder layer, but in other embodiments, other stack soldering processes may be used to provide a solder layer between the cover plate 1 and the base plate 4 to form a roughened layer in the cooling channel 6.
Claims (7)
1. A cold plate, characterized in that: the cooling flow channel is internally provided with a roughening layer which is formed after the welding flux of the cover plate and the bottom plate is melted and falls into the cooling flow channel, the surface structure of the roughening layer is rough, the roughening layer covers the wall surface of the cooling flow channel, and the space between the roughening layer and the cover plate in the cooling flow channel is used for cooling liquid to flow.
2. The cold plate of claim 1, wherein: the welding mode of the cover plate and the bottom plate is brazing.
3. The cold plate of claim 1 or 2, wherein: and a heat dissipation rib used for supporting and matching with the cover plate is arranged in the cooling flow channel.
4. The cold plate of claim 1 or 2, wherein: the cooling flow channel comprises a common section and at least two distribution sections communicated with the common section, and the distribution sections are arranged in parallel.
5. The cold plate manufacturing method is characterized in that: the method comprises the steps of firstly processing a cooling flow channel on a bottom plate, then clamping a solder layer between a cover plate and one side of the bottom plate with the cooling flow channel, melting the solder layer to weld the cover plate and the bottom plate together, melting the solder layer between the cooling flow channel and the cover plate, and then dropping the melted solder layer into the cooling flow channel to form a roughened layer, wherein the surface structure of the roughened layer is rough, the roughened layer covers the wall surface of the cooling flow channel, and a space between the roughened layer and the cover plate in the cooling flow channel is used for cooling liquid to flow.
6. The cold plate manufacturing method according to claim 5, wherein: the cover plate and the base plate are brazed together.
7. The cold plate manufacturing method of claim 6, wherein: the cover plate and the bottom plate are vacuum brazed together.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810702536 | 2018-06-30 | ||
| CN2018107025366 | 2018-06-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110602920A CN110602920A (en) | 2019-12-20 |
| CN110602920B true CN110602920B (en) | 2020-10-30 |
Family
ID=68849282
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811572280.8A Active CN110602920B (en) | 2018-06-30 | 2018-12-21 | Cold plate and method for producing a cold plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110602920B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1484328A (en) * | 2002-06-24 | 2004-03-24 | ������������ʽ���� | Semiconductor element and mfg method |
| CN101364552A (en) * | 2007-08-06 | 2009-02-11 | 国际商业机器公司 | Method for forming a solder mold with venting channels and method for using the same |
| CN204497218U (en) * | 2015-03-20 | 2015-07-22 | 中兴通讯股份有限公司 | A kind of liquid cold plate |
| CN106409792A (en) * | 2016-10-18 | 2017-02-15 | 武汉征原电气有限公司 | Water cooling plate radiator and the preparation technology for the same |
| CN206717222U (en) * | 2017-05-22 | 2017-12-08 | 深圳市晟达真空钎焊技术有限公司 | The vacuum brazing welding structure of fluid channel annular seal space heat exchanger |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8962085B2 (en) * | 2009-06-17 | 2015-02-24 | Novellus Systems, Inc. | Wetting pretreatment for enhanced damascene metal filling |
| CN105333759A (en) * | 2014-08-06 | 2016-02-17 | 双鸿科技股份有限公司 | Etching temperature uniformization board |
| CN207021255U (en) * | 2017-07-06 | 2018-02-16 | 华南理工大学 | A kind of modular IGBT liquid cooling plates |
-
2018
- 2018-12-21 CN CN201811572280.8A patent/CN110602920B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1484328A (en) * | 2002-06-24 | 2004-03-24 | ������������ʽ���� | Semiconductor element and mfg method |
| CN101364552A (en) * | 2007-08-06 | 2009-02-11 | 国际商业机器公司 | Method for forming a solder mold with venting channels and method for using the same |
| CN204497218U (en) * | 2015-03-20 | 2015-07-22 | 中兴通讯股份有限公司 | A kind of liquid cold plate |
| CN106409792A (en) * | 2016-10-18 | 2017-02-15 | 武汉征原电气有限公司 | Water cooling plate radiator and the preparation technology for the same |
| CN206717222U (en) * | 2017-05-22 | 2017-12-08 | 深圳市晟达真空钎焊技术有限公司 | The vacuum brazing welding structure of fluid channel annular seal space heat exchanger |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110602920A (en) | 2019-12-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11306973B2 (en) | Liquid cooling heat exchanger and method for making the same | |
| CN207967246U (en) | Liquid cooling plate component and automotive battery system | |
| CN102439715B (en) | Heat exchanger and method of manufacturing the same | |
| CN204651303U (en) | A kind of electronic element radiating cold drawing | |
| CN205510653U (en) | Liquid cooling cold plate | |
| CN106455456B (en) | Copper-aluminum composite water cooling plate, processing and manufacturing method thereof and water cooling method | |
| CN108448205A (en) | A kind of battery modules radiator | |
| CN105140194A (en) | Heat-superconducting radiator and manufacturing method thereof | |
| CN110763059B (en) | Ultrathin uniform temperature plate and manufacturing method thereof | |
| CN101200014B (en) | Fabricating process for heat dissipating device | |
| JP2011166127A (en) | Method of manufacturing liquid-cooled integrated substrate, and liquid-cooled integrated substrate | |
| CN106409792A (en) | Water cooling plate radiator and the preparation technology for the same | |
| CN108133916B (en) | A kind of microchannel heat sink welding procedure | |
| CN206471326U (en) | A kind of liquid-cooling heat radiator | |
| CN110602920B (en) | Cold plate and method for producing a cold plate | |
| WO2024187842A1 (en) | Circuit board, circuit board assembly, and electronic device | |
| CN107241889A (en) | Circuit module water cooler and IGBT power models | |
| CN112736046B (en) | Integrated chip heat dissipation device and heat dissipation method thereof | |
| CN112008179B (en) | Production process of anti-deformation thick film heater with heat storage function | |
| CN209626208U (en) | A kind of multi-deck screw type microchannel liquid-cooling heat radiator | |
| CN110756979B (en) | Clamping tool and method for liquid cooling heat dissipation cold plate | |
| CN209710593U (en) | A kind of integrated morphology of hybrid locomotrives power module and liquid cooling plate | |
| CN109640581B (en) | Air-cooled cold plate with built-in heat pipe and processing method thereof | |
| CN216903110U (en) | Cooling system and battery | |
| CN107598359A (en) | A kind of preparation method of heat sink |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |