CN110589416A - Automatic loading and unloading device for IGBT chip mounting and working method thereof - Google Patents
Automatic loading and unloading device for IGBT chip mounting and working method thereof Download PDFInfo
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- CN110589416A CN110589416A CN201910859175.0A CN201910859175A CN110589416A CN 110589416 A CN110589416 A CN 110589416A CN 201910859175 A CN201910859175 A CN 201910859175A CN 110589416 A CN110589416 A CN 110589416A
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- 238000000034 method Methods 0.000 title claims description 35
- 238000000926 separation method Methods 0.000 claims abstract description 41
- 230000000149 penetrating effect Effects 0.000 claims abstract 4
- 238000003825 pressing Methods 0.000 claims description 16
- 238000009434 installation Methods 0.000 claims description 13
- 210000003437 trachea Anatomy 0.000 claims description 11
- 238000013016 damping Methods 0.000 claims description 10
- 239000007921 spray Substances 0.000 claims description 8
- 238000005096 rolling process Methods 0.000 claims description 6
- 239000000428 dust Substances 0.000 claims description 5
- 239000012535 impurity Substances 0.000 claims description 5
- 238000003780 insertion Methods 0.000 claims 2
- 230000037431 insertion Effects 0.000 claims 2
- 238000007599 discharging Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/02—Devices for feeding articles or materials to conveyors
- B65G47/04—Devices for feeding articles or materials to conveyors for feeding articles
- B65G47/06—Devices for feeding articles or materials to conveyors for feeding articles from a single group of articles arranged in orderly pattern, e.g. workpieces in magazines
- B65G47/08—Devices for feeding articles or materials to conveyors for feeding articles from a single group of articles arranged in orderly pattern, e.g. workpieces in magazines spacing or grouping the articles during feeding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/34—Devices for discharging articles or materials from conveyor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0214—Articles of special size, shape or weigh
- B65G2201/022—Flat
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Feeding Of Articles To Conveyors (AREA)
Abstract
The invention discloses an automatic loading and unloading device for IGBT chip mounting, which comprises a mounting plate, a frame, a bottom frame and an end frame, wherein the middle end of the top of the frame is vertically connected with a rotating rod, the mounting plate is mounted above the rotating rod, a through hole is arranged in the middle of the mounting plate in a penetrating manner, a plurality of separation grooves are uniformly arranged in the edge of the top of the mounting plate in a penetrating manner, and the middle ends of the insides of the separation grooves are movably connected with an annular edge plate. After the chip is pasted, the first telescopic column contracts and moves upwards to drive the chip pasting device to break away from the inside of the separation groove, the mounting plate continues to rotate to drive the chip after the chip is pasted to move, the chip moves to the upper portion of the air pipe nozzle at the end of the air inlet pipe, the air inlet pipe conveys air to the inside of the air pipe nozzle, the air is sprayed out from the inside of the air pipe nozzle, then the air flow contacts with the bottom of the chip, and the chip is blown away from the inside of the separation groove by the air flow. The chip can be automatically fed and discharged in the chip mounting through the loading frame and the end frame, and the working efficiency is improved.
Description
Technical Field
The invention relates to a feeding and discharging device, in particular to an automatic feeding and discharging device for IGBT chip mounting and a working method thereof, and belongs to the field of chip mounting processing application.
Background
Chip mounting is a surface mounting technology, which is the most popular technology in the electronic assembly industry. Electronic circuit surface assembly techniques, known as surface mount or surface mount techniques. The surface-mounted component without pins or short leads is mounted on the surface of a printed circuit board or other substrates and is welded and assembled by methods such as reflow soldering or dip soldering.
The existing chip mounter still has certain disadvantages in use. The existing chip mounting device is simple in structure and cannot automatically feed and discharge the chip. The chip is not convenient enough to move in the processing, the precision is not accurate enough during the paster, can not carry out diversified operation according to the needs of reality, and the efficiency of work is lower. After the chip is pasted, the chip cannot be quickly removed from the inside of the pasting device, the pasting is disconnected easily, the precision in the pasting is not enough, and errors easily occur. The chips to be pasted can not be orderly placed in the working process, and the chips are more disordered in the process of pasting.
Disclosure of Invention
The invention aims to provide an automatic loading and unloading device for IGBT chip mounting and a working method thereof, which can solve the problems that the existing chip mounting device is simple in structure and cannot realize automatic loading and unloading of chips. The chip is not convenient enough to move in the processing, the precision is not accurate enough during the paster, can not carry out diversified operation according to the needs of reality, and the efficiency of work is lower. After the chip is pasted, the chip cannot be quickly removed from the inside of the pasting device, the pasting is disconnected easily, the precision in the pasting is not enough, and errors easily occur. The chip to be pasted can not be orderly placed in the working process, and the chip is pasted more disorderly.
The purpose of the invention can be realized by the following technical scheme:
the utility model provides a unloader in automation for IGBT chip paster, includes mounting panel, frame, underframe and tip frame, the vertical dwang that is connected with in top middle-end of frame, the mounting panel is installed to the top of dwang, and the middle part of mounting panel runs through and is provided with the perforation, and the top edge of mounting panel evenly runs through and is provided with a plurality of and separates the groove, separates the inside middle-end swing joint in groove and has annular edge board.
The frame welding is in one side of underframe, and the loading frame is installed at the top of frame, and the bottom middle-end vertical connection of loading frame has the pole setting, and the bottom of pole setting is run through the perforation and is rotated through the top of bearing with the dwang and be connected, the top one side of loading frame and the top one side fixed connection of underframe.
The conveyer belt is installed to the top one end of loading frame, and top other end middle part is provided with the through-hole, and the through-hole is kept away from one side top of conveyer belt and is connected with the baffle, and the horizontal distance between through-hole and the perforation is the same with the horizontal distance between separation groove and the perforation.
The frame is kept away from the one end top of underframe and is connected with the fixed plate, and the top of fixed plate is the level setting, and the below vertical flexible post of third that is connected with on top, the bottom horizontally connect of the flexible post of third has the clamp plate, the vertical flexible post of second that is connected with of one end of underframe.
A plurality of air pipe spray heads are evenly installed on the outer side wall of the frame, one side, close to the bottom frame, of the frame is connected with an air inlet pipe and an air suction pipe respectively, one air pipe spray head is connected to the top of the air inlet pipe, the rest air pipe spray heads are connected in series and connected with the air suction pipe, and the air pipe spray head at the top of the air inlet pipe is arranged between the loading frame and the second telescopic column.
One side that the fixed plate was kept away from at the frame top is connected with the transportation area, the one end that the frame was kept away from to the underframe is connected with the tip frame, and the inside of tip frame is rotated and is installed a plurality of and place the board, and the one end setting in intake pipe top trachea nozzle is transported the one end in area, and the other end setting is in the inside of tip frame.
Preferably, the conveying chain is installed all to the inside both sides of tip frame, and the equal level in inside of tip frame rotates and installs a plurality of pivot, and the both ends of pivot all are connected with the conveying chain through the gear.
Preferably, the conveying chains on the two sides are uniformly connected with a plurality of horizontally arranged cross rods in a rotating mode, and the placing plates are installed between the cross rods.
Preferably, the limiting plate is all installed to the top both sides of mounting panel, and the vertical first flexible post that is connected with in bottom of limiting plate, the bottom of first flexible post and bottom one side fixed connection of underframe.
Preferably, the limiting plate is convex setting, and one side that the limiting plate bottom is close to the mounting panel installs a plurality of universal wheel, and the bottom of universal wheel and the top butt of mounting panel, one side that the mounting panel was kept away from to the bottom are installed a plurality of leading wheel, leading wheel and the side butt of mounting panel.
Preferably, the bottom of the air pipe nozzle is connected with a base, and the base is connected with the frame.
Preferably, the bottom end of the inner part of the separation groove is vertically connected with a plurality of damping springs, and the tops of the damping springs are connected with the bottoms of the edge plates.
Preferably, the motor is installed to the bottom of dwang, and the top horizontally connect of dwang has the bearing plate, and the top of bearing plate is vertical to be connected with a plurality of inserted bar, and the dwang runs through the perforation, and the bottom and the bearing plate butt of mounting panel, and the inserted bar is pegged graft in the inside of mounting panel.
A working method of an automatic loading and unloading device for IGBT chip surface mounting comprises the following specific steps:
the method comprises the following steps: placing the chip to be processed on the upper part of the conveying belt at the upper end of the loading frame, and connecting the air inlet pipe and the air suction pipe with the air pump; the conveying belt runs to drive the chip to run towards one end, and the chip is limited by the baffle after running to one end and falls into the separation groove from the through hole;
step two: the mounting plate rotates, the third telescopic column drives the pressing plate to move downwards, the pressing plate enters the separating groove to extrude the chip in the separating groove, the bottom of the chip is in contact with the inner edge plate, and the chip is horizontally placed in the separating groove; after the bottom of the pressure plate is contacted with the top of the chip, the chip is pushed to move downwards, and the chip which is placed unstably is pushed to be in a horizontal state;
step three: in the process of rotating the mounting plate, a plurality of air pipe nozzles around the bottom of the frame absorb air inwards, so that suction is generated on the chips in the separation grooves, impurity and dust at the bottoms of the chips are absorbed and removed, and the positions of the chips are fixed; the chip rotates along with the mounting plate in the separation groove until the chip rotates to the position below the first telescopic column, the first telescopic column moves downwards to drive the chip mounting device to move downwards, and the chip mounting device carries out chip mounting on the upper portion of the chip; after the chip is pasted, the first telescopic column contracts and moves upwards to drive the chip pasting device to be separated from the inside of the separation groove, and the mounting plate continues to rotate to drive the chip after the chip is pasted to move;
step four: after the chip moves to the upper part of the air pipe nozzle at the end part of the air inlet pipe, the air inlet pipe conveys air to the interior of the air pipe nozzle, the air is sprayed out from the interior of the air pipe nozzle, the air flow is contacted with the bottom of the chip, the chip is blown and separated from the interior of the separation groove by the air flow, and after the chip falls into the upper part of the conveyer belt, the conveyer belt conveys the chip after being pasted to the upper part of the placing plate; the rotating shaft drives the conveying chain to rotate, so that the plurality of placing plates are driven to rotate in the end frame, and the chip after being pasted is conveyed away from the pasting device;
step five: the mounting panel rotates the in-process, and the contact of a plurality of universal wheel of limiting plate bottom and the top of mounting panel, the side contact of a plurality of leading wheel and mounting panel all produce rolling friction with the mounting panel, carry on spacingly to the mounting panel.
The invention has the beneficial effects that:
1. the upper portion of the frame is rotatably connected with the mounting plate, so that a chip to be processed can move towards one end along with the conveyor belt in work, the chip is limited by the baffle after moving to one end and cannot fall off from the end portion of the loading frame, and the chip enters the through hole and then falls off from the through hole to the inside of the separation groove. The chip feeding is simple and quick, and automatic feeding can be realized.
2. Through connecting the clamp plate in one side of frame for in the mounting panel rotation, the flexible post of third can drive the clamp plate and move down, and the clamp plate enters into the inside of separating the groove, extrudees the chip of separating the inslot portion, makes the bottom of chip can be stable and inside edge board contact, and the chip level is placed in the inside of separating the groove, makes things convenient for going on of follow-up paster, and the paster is convenient and fast more, and the rate of accuracy of paster is higher, and is more even. After the bottom of the pressing plate is contacted with the top of the chip, the chip is pushed to move downwards, and the chip placed unstably is pushed to be in a horizontal state. And in the process of pressing the chip, the edge plate is pushed to move downwards in the separation groove. Damping spring cushions the edge board in the bottom for the edge board removes slowly, and then makes the chip can not damage after being suppressed, can adjust the position of chip, can guarantee again that the chip is not fragile in the processing.
3. Through a plurality of trachea shower nozzle of outside installation at the frame for mounting panel pivoted in-process, a plurality of trachea shower nozzle around the frame bottom inwards absorbs the air, and then produces certain suction to the chip of partition tank inside, can absorb the impurity dust of chip bottom and get rid of, can fix the position of chip again, makes mounting panel pivoted in-process, and the chip is difficult for droing from the inside of partition tank. The chip can be restricted in processing, is not easy to shake and fall off, and can be cleaned, so that the chip is processed more comprehensively, and the quality is better.
4. Install the paster apparatus through the first post that contracts on the top one side of underframe. The chip rotates the below of first flexible post in making work, and first flexible post moves down, drives paster apparatus and moves down, and the paster apparatus carries out the paster to the upper portion of chip, and the paster is more comprehensive, can once the paster succeed. After the paster, first flexible post shrink rebound, it breaks away from the inside of separating the groove to drive the paster apparatus, the mounting panel continues to rotate, the chip after driving the paster removes, the chip removes behind the upper portion of intake pipe tip trachea shower nozzle, the intake pipe is to the inside conveying gas of trachea shower nozzle, gaseous outside blowout from the inside of trachea shower nozzle, and then the air current contacts with the bottom of chip, the air current blows the chip and breaks away from the inside of separating the groove, the chip falls into behind the upper portion of transportation area, the chip transportation area after with the paster is transported the upper portion of placing the board, the chip falls into the upper portion of placing the board from the upper portion of transportation area. The pivot drives the conveying chain and rotates, and then drives a plurality of and places the board and rotate in the inside of tip frame, and the chip behind the paster is transported and is kept away from the apparatus of paster. The chip can be automatically fed and discharged in the chip mounting through the loading frame and the end frame, and the working efficiency is improved.
5. The operation of the whole device is controlled through the PLC control system, so that the PLC control system controls the mounting plate, the conveyor belt, the first telescopic column and the third telescopic column to be started, stopped and closed simultaneously in the chip transportation process. After the mounting plate stops rotating, the empty separation groove can be parked under the through hole, the pressing plate and the paster device, and the chip to be processed on the upper portion of the conveying belt can accurately fall into the separation groove from the through hole. Simultaneously first flexible post and the flexible post of third can drive paster apparatus and the accurate chip to separating inslot portion of clamp plate respectively and process, are difficult for makeing mistakes in the processing, and the processing accuracy of chip obtains improving. When automatic feeding and discharging are realized, the accuracy and efficiency of chip processing can be improved.
6. During the rotation process of the mounting plate, the universal wheels at the bottom of the limiting plate are in contact with the top of the mounting plate, the guide wheels are in contact with the side face of the mounting plate, rolling friction is generated between the guide wheels and the mounting plate, friction force is small, abrasion is not prone to occurring, the mounting plate can be well limited, and the mounting plate is more stable in rotation. Inside a plurality of inserted bar inserted the bottom of mounting panel simultaneously, can carry out good injecing to the mounting panel, can make things convenient for the mounting panel again to follow the upper portion installation of dwang and dismantle, follow-up maintenance is simple. When the mounting plate is mounted and dismounted, the loading frame needs to be dismounted.
Drawings
In order to facilitate understanding for those skilled in the art, the present invention will be further described with reference to the accompanying drawings.
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a schematic view of the internal structure of fig. 1 according to the present invention.
Fig. 3 is a schematic view of a bottom frame structure according to the present invention.
Fig. 4 is an exploded perspective view of fig. 3 according to the present invention.
FIG. 5 is an enlarged view of detail A in FIG. 4 according to the present invention.
Fig. 6 is a schematic diagram of a limiting plate structure according to the present invention.
Fig. 7 is a schematic structural view of a fixing plate according to the present invention.
Fig. 8 is a schematic view of the structure of the loading frame of the present invention.
Fig. 9 is a schematic view of the rotating rod structure of the present invention.
FIG. 10 is a schematic view of the internal structure of the separation tank of the present invention.
In the figure: 1. mounting a plate; 2. a frame; 3. a bottom frame; 4. a loading frame; 5. a fixing plate; 6. a conveyor belt; 7. an end frame; 8. a rotating shaft; 9. placing the plate; 10. a conveyor chain; 11. perforating; 12. a first telescopic column; 13. an air inlet pipe; 14. an air intake duct; 15. a separation tank; 16. a base; 17. an air pipe nozzle; 18. an edge plate; 19. a limiting plate; 20. a second telescopic column; 21. a universal wheel; 22. a guide wheel; 23. pressing a plate; 24. a third telescopic column; 25. a through hole; 26. a baffle plate; 27. a conveyor belt; 28. erecting a rod; 29. a bearing plate; 30. inserting a rod; 31. rotating the rod; 32. a shock absorbing spring.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-10, an automatic loading and unloading device for IGBT chip mounting includes an installation plate 1, a frame 2, a bottom frame 3 and an end frame 7, wherein a rotation rod 31 is vertically connected to the middle end of the top of the frame 2, the installation plate 1 is installed above the rotation rod 31, a through hole 11 is penetratingly arranged in the middle of the installation plate 1, a plurality of separation grooves 15 are uniformly penetratingly arranged on the edge of the top of the installation plate 1, and an annular edge plate 18 is movably connected to the middle end inside the separation grooves 15;
the frame 2 is welded on one side of the bottom frame 3, the loading frame 4 is installed at the top of the frame 2, the middle end of the bottom of the loading frame 4 is vertically connected with an upright rod 28, the bottom of the upright rod 28 penetrates through the through hole 11 and is rotatably connected with the top of the rotating rod 31 through a bearing, and one side of the top of the loading frame 4 is fixedly connected with one side of the top of the bottom frame 3;
a conveyor belt 27 is arranged at one end of the top of the loading frame 4, a through hole 25 is formed in the middle of the other end of the top of the loading frame, a baffle 26 is connected to the top of one side, away from the conveyor belt 27, of the through hole 25, and the horizontal distance between the through hole 25 and the through hole 11 is the same as the horizontal distance between the separation groove 15 and the through hole 11;
the top of one end, far away from the bottom frame 3, of the frame 2 is connected with a fixed plate 5, the top of the fixed plate 5 is horizontally arranged, a third telescopic column 24 is vertically connected below the top end of the fixed plate 5, the bottom of the third telescopic column 24 is horizontally connected with a pressing plate 23, and one end of the bottom frame 3 is vertically connected with a second telescopic column 20;
a plurality of air pipe nozzles 17 are uniformly arranged on the outer side wall of the frame 2, one side, close to the bottom frame 3, of the frame 2 is connected with an air inlet pipe 13 and an air suction pipe 14 respectively, the top of the air inlet pipe 13 is connected with one air pipe nozzle 17, the rest air pipe nozzles 17 are connected in series and connected with the air suction pipe 14, and the air pipe nozzle 17 at the top of the air inlet pipe 13 is arranged between the loading frame 4 and the second telescopic column 20;
one side that fixed plate 5 was kept away from at 2 tops of frame is connected with transportation area 6, and the one end that frame 2 was kept away from to underframe 3 is connected with tip frame 7, and the inside rotation of tip frame 7 is installed a plurality of and is placed board 9, and the one end setting of transportation area 6 is in the below of intake pipe 13 top trachea nozzle 17, and the other end setting is in the inside of tip frame 7.
The inside both sides of tip frame 7 all rotate and install conveying chain 10, and the equal level rotation in inside of tip frame 7 installs a plurality of pivot 8, and the both ends of pivot 8 all are connected with conveying chain 10 through the gear, and 8 rotations in the pivot can drive conveying chain 10 and rotate, and then drive a plurality of and place board 9 and rotate.
Evenly rotate between the both sides conveying chain 10 and be connected with the horizontal pole that a plurality of level set up, place board 9 and install between the horizontal pole, place the chip that board 9 can place after the paster.
Limiting plates 19 are installed on two sides of the top of the mounting plate 1, a first telescopic column 12 is vertically connected to the middle end of the bottom of the limiting plates 19, the bottom of the first telescopic column 12 is fixedly connected with one side of the bottom frame 3, the limiting plates 19 can be driven by the first telescopic column 12 to move up and down, and the mounting plate 1 can be limited.
Limiting plate 19 is arc setting, a plurality of universal wheel 21 is installed to one side that limiting plate 19 bottom is close to mounting panel 1, the bottom of universal wheel 21 and the top butt of mounting panel 1, one side that mounting panel 1 was kept away from to the bottom is installed a plurality of leading wheel 22, the side butt of leading wheel 22 and mounting panel 1, universal wheel 21 and leading wheel 22 all produce rolling friction with mounting panel 1, frictional force is little, difficult wearing and tearing, and can carry out good spacing to mounting panel 1, it is more stable in the mounting panel 1 rotates.
The bottom of the air pipe nozzle 17 is connected with a base 16, the base 16 is connected with the frame 2, and the base 16 facilitates installation of the air pipe nozzle 17.
The bottom end of the inner part of the separation groove 15 is vertically connected with a plurality of damping springs 32, the top parts of the damping springs 32 are connected with the bottom parts of the edge plates 18, and the damping springs 32 play a role in damping and buffering.
The motor is installed to the bottom of dwang 31, the top horizontally connect of dwang 31 has bearing plate 29, the vertical a plurality of inserted bar 30 that is connected with in top of bearing plate 29, dwang 31 runs through perforation 11, and the bottom and the 29 butt of bearing plate of mounting panel 1, and inserted bar 30 pegs graft in the inside of mounting panel 1, and the motor can drive dwang 31 and rotate, and inserted bar 30 pegs graft and can carry on spacingly to mounting panel 1 in the inside of mounting panel 1, can make things convenient for its installation to dismantle again.
A working method of an automatic loading and unloading device for IGBT chip surface mounting comprises the following specific steps:
the method comprises the following steps: placing the chip to be processed on the upper part of the conveying belt 27 at the upper end of the loading frame 4, and connecting the air inlet pipe 13 and the air suction pipe 14 with an air pump; the conveyor belt 27 operates to drive the chip to operate towards one end, and the chip is limited by the baffle 26 after operating to one end and falls into the separation groove 15 from the through hole 25;
step two: the mounting plate 1 rotates, the third telescopic column 24 drives the pressing plate 23 to move downwards, the pressing plate 23 enters the separating groove 15 to extrude the chip in the separating groove 15, the bottom of the chip is in contact with the inner edge plate 18, and the chip is horizontally placed in the separating groove 15; after the bottom of the pressure plate 23 contacts with the top of the chip, the chip is pushed to move downwards, and the chip which is placed unstably is pushed to be in a horizontal state;
step three: in the rotating process of the mounting plate 1, a plurality of air pipe nozzles 17 around the bottom of the frame 2 absorb air inwards, so that suction is generated on the chips in the separation grooves 15, impurity and dust at the bottoms of the chips are absorbed and removed, and the positions of the chips are fixed; the chip rotates along with the mounting plate 1 in the separation groove 15 until the chip rotates to the position below the first telescopic column 12, the first telescopic column 12 moves downwards to drive the chip mounting device to move downwards, and the chip mounting device carries out chip mounting on the upper portion of the chip; after the chip is pasted, the first telescopic column 12 contracts and moves upwards to drive the chip pasting device to be separated from the inside of the separation groove 15, and the mounting plate 1 continues to rotate to drive the chip after the chip is pasted to move;
step four: after the chips move to the upper part of the air pipe nozzle 17 at the end part of the air inlet pipe 13, the air inlet pipe 13 conveys air to the interior of the air pipe nozzle 17, the air is sprayed out from the interior of the air pipe nozzle 17, the air flow is contacted with the bottom of the chips, the chips are blown and separated from the interior of the separation groove 15 by the air flow, and after the chips fall into the upper part of the conveyer belt 6, the conveyer belt 6 conveys the chips after being pasted to the upper part of the placing plate 9; the rotating shaft 8 drives the conveying chain 10 to rotate, and further drives the placing plates 9 to rotate inside the end frame 7, and the chip after being pasted is transported away from the pasting device;
step five: during the rotation of the mounting plate 1, the universal wheels 21 at the bottom of the limiting plate 19 contact with the top of the mounting plate 1, and the guide wheels 22 contact with the side of the mounting plate 1 and generate rolling friction with the mounting plate 1 to limit the mounting plate 1.
When the chip processing device is used, a chip to be processed is placed on the upper part of the conveying belt 27 at the upper end of the loading frame 4, and the air inlet pipe 13 and the air suction pipe 14 are both connected with an air pump. The conveyor belt 27 runs to drive the chips to run towards one end, the chips are limited by the baffle 26 after running to one end, the chips cannot fall off from the end part of the loading frame 4, enter the through hole 25 and then fall off from the through hole 25 to the inside of the separation groove 15.
During the rotation of mounting panel 1, the flexible post 24 of third drives clamp plate 23 and moves down, and clamp plate 23 enters into the inside of separating groove 15, extrudees the inside chip of separating groove 15 for the bottom of chip can be stable with inside edge board 18 contact, and the chip level is placed in the inside of separating groove 15, makes things convenient for going on of follow-up paster, and the paster is convenient and fast more, and the rate of accuracy of paster is higher, and is more even. After the bottom of the pressing plate 23 contacts the top of the chip, the chip is pushed to move downwards, and the chip placed unstably is pushed to be in a horizontal state. And during the pressing process of the chip, the edge plate 18 is pushed to move downwards in the separation groove 15. The damping springs 32 cushion the edge plate 18 at the bottom, so that the edge plate 18 moves slowly, the chip cannot be damaged after being pressed, the position of the chip can be adjusted, and the chip cannot be damaged easily in processing.
In the rotating process of the mounting plate 1, a plurality of air pipe nozzles 17 around the bottom of the frame 2 absorb air inwards, so that certain suction is generated on the chip inside the separation groove 15, the impurity and dust at the bottom of the chip can be absorbed and removed, and the position of the chip can be fixed, so that in the rotating process of the mounting plate 1, the chip is not easy to fall off from the inside of the separation groove 15. The chip can be restricted in processing, is not easy to shake and fall off, and can be cleaned, so that the chip is processed more comprehensively, and the quality is better.
The chip rotates along with mounting panel 1 in the inside of separating groove 15, and until the chip rotates the below of first flexible post 12, first flexible post 12 moves down, drives paster apparatus and moves down, and the paster apparatus carries out the paster to the upper portion of chip, and the paster is more comprehensive, can once the paster succeed. After the paster, first flexible post 12 contracts rebound, it breaks away from the inside of separating groove 15 to drive the paster apparatus, mounting panel 1 continues to rotate, the chip after driving the paster removes, the chip removes behind the upper portion of intake pipe 13 tip trachea shower nozzle 17, intake pipe 13 is to the inside conveying gas of trachea shower nozzle 17, gaseous outside blowout from the inside of trachea shower nozzle 17, and then the bottom contact of air current and chip, the air current blows the chip from the inside of separating groove 15 and breaks away from, the chip falls into behind the upper portion of conveyer belt 6, the upper portion of placing board 9 is transported to the chip after the paster to conveyer belt 6, the chip falls into the upper portion of placing board 9 from the upper portion of conveyer belt 6. The pivot 8 drives the conveying chain 10 and rotates, and then drives a plurality of and places board 9 and rotate in the inside of tip frame 7, and the chip behind the paster is transported and is kept away from the apparatus of paster. The loading frame 4 and the end frame 7 can automatically load and unload the chips in the chip mounting process, and the working efficiency is improved.
In the chip transportation process, the PLC control system controls the mounting plate 1, the conveyor belt 27, the first telescopic column 12 and the third telescopic column 24 to be started, stopped and closed simultaneously. After the mounting plate 1 stops rotating, the empty separation groove 15 can be parked under the through hole 25, the pressing plate 23 and the chip mounting device, and the chips to be processed on the upper portion of the conveyor belt 27 can accurately fall into the separation groove 15 from the through hole 25. Meanwhile, the first telescopic column 12 and the third telescopic column 24 can respectively drive the chip mounting instrument and the pressing plate 23 to accurately process the chip inside the separation groove 15, errors are not prone to occurring in the process, and the processing accuracy of the chip is improved. When automatic feeding and discharging are realized, the accuracy and efficiency of chip processing can be improved.
The mounting panel 1 rotates the in-process, and a plurality of universal wheel 21 and the top contact of mounting panel 1 of limiting plate 19 bottom, a plurality of leading wheel 22 and the side contact of mounting panel 1 all produce rolling friction with mounting panel 1, and frictional force is little, and difficult wearing and tearing just can carry out good spacing to mounting panel 1, and mounting panel 1 is more stable in rotating. Simultaneously inside a plurality of inserted bar 30 inserted the bottom of mounting panel 1, can carry out good injecing to mounting panel 1, can make things convenient for mounting panel 1 again to follow the upper portion installation of dwang 31 and dismantle, follow-up maintenance is simple. When the mounting plate 1 is mounted and dismounted, the loading frame 4 needs to be dismounted.
The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.
Claims (9)
1. The automatic loading and unloading device for the IGBT chip paster is characterized by comprising an installation plate (1), a frame (2), a bottom frame (3) and an end frame (7), wherein the middle end of the top of the frame (2) is vertically connected with a rotating rod (31), the installation plate (1) is installed above the rotating rod (31), a through hole (11) is formed in the middle of the installation plate (1) in a penetrating mode, a plurality of separation grooves (15) are uniformly formed in the edge of the top of the installation plate (1) in a penetrating mode, and an annular edge plate (18) is movably connected to the middle end of the inside of each separation groove (15);
the frame (2) is welded on one side of the bottom frame (3), the loading frame (4) is installed at the top of the frame (2), the middle end of the bottom of the loading frame (4) is vertically connected with an upright rod (28), the bottom of the upright rod (28) penetrates through the through hole (11) and is rotatably connected with the top of the rotating rod (31) through a bearing, and one side of the top of the loading frame (4) is fixedly connected with one side of the top of the bottom frame (3);
a conveyor belt (27) is installed at one end of the top of the loading frame (4), a through hole (25) is formed in the middle of the other end of the top of the loading frame, a baffle (26) is connected to the top of one side, away from the conveyor belt (27), of the through hole (25), and the horizontal distance between the through hole (25) and the through hole (11) is the same as the horizontal distance between the separation groove (15) and the through hole (11);
the top of one end, far away from the bottom frame (3), of the frame (2) is connected with a fixed plate (5), the top of the fixed plate (5) is horizontally arranged, a third telescopic column (24) is vertically connected below the top end of the fixed plate, the bottom of the third telescopic column (24) is horizontally connected with a pressing plate (23), and one end of the bottom frame (3) is vertically connected with a second telescopic column (20);
a plurality of air pipe spray heads (17) are uniformly arranged on the outer side wall of the frame (2), one side, close to the bottom frame (3), of the frame (2) is connected with an air inlet pipe (13) and an air suction pipe (14) respectively, the top of the air inlet pipe (13) is connected with one air pipe spray head (17), the rest air pipe spray heads (17) are connected in series and connected with the air suction pipe (14), and the air pipe spray head (17) at the top of the air inlet pipe (13) is arranged between the loading frame (4) and the second telescopic column (20);
one side that fixed plate (5) were kept away from at frame (2) top is connected with transportation area (6), the one end that frame (2) were kept away from in underframe (3) is connected with tip frame (7), and the inside rotation of tip frame (7) is installed a plurality of and is placed board (9), and the one end setting of transportation area (6) is in the below of intake pipe (13) top trachea shower nozzle (17), and the other end setting is in the inside of tip frame (7).
2. The automatic loading and unloading device for the IGBT chip patch as claimed in claim 1, wherein the conveying chains (10) are rotatably mounted on two sides of the inside of the end frame (7), the plurality of rotating shafts (8) are horizontally rotatably mounted inside the end frame (7), and two ends of each rotating shaft (8) are connected with the conveying chains (10) through gears.
3. The automatic loading and unloading device for the IGBT chip patch as claimed in claim 2, wherein a plurality of horizontal bars are evenly and rotatably connected between the conveying chains (10) at two sides, and the placing plate (9) is installed between the horizontal bars.
4. The automatic loading and unloading device for the IGBT chip paster as claimed in claim 1, wherein the mounting plate (1) is provided with limiting plates (19) on both sides of the top, the middle end of the bottom of the limiting plates (19) is vertically connected with a first telescopic column (12), and the bottom of the first telescopic column (12) is fixedly connected with one side of the bottom frame (3).
5. The automatic loading and unloading device for the IGBT chip paster as claimed in claim 4, wherein the limiting plate (19) is arc-shaped, a plurality of universal wheels (21) are installed on one side of the bottom of the limiting plate (19) close to the mounting plate (1), the bottom of the universal wheels (21) is abutted to the top of the mounting plate (1), a plurality of guide wheels (22) are installed on one side of the bottom far away from the mounting plate (1), and the guide wheels (22) are abutted to the side of the mounting plate (1).
6. The automatic loading and unloading device for the IGBT chip patch as claimed in claim 1, wherein the bottom of the air pipe nozzle (17) is connected with a base (16), and the base (16) is connected with the frame (2).
7. The automatic loading and unloading device for the IGBT chip patch as claimed in claim 1, wherein the bottom end inside the separation groove (15) is vertically connected with a plurality of damping springs (32), and the top of each damping spring (32) is connected with the bottom of the edge plate (18).
8. The automatic loading and unloading device for the IGBT chip patch as claimed in claim 1, wherein a motor is installed at the bottom of the rotating rod (31), a bearing plate (29) is horizontally connected above the rotating rod (31), a plurality of insertion rods (30) are vertically connected to the top of the bearing plate (29), the rotating rod (31) penetrates through the through hole (11), the bottom of the mounting plate (1) is abutted to the bearing plate (29), and the insertion rods (30) are inserted into the mounting plate (1).
9. A working method of an automatic loading and unloading device for IGBT chip surface mounting is characterized by comprising the following specific steps:
the method comprises the following steps: placing the chip to be processed on the upper part of a conveyor belt (27) at the upper end of a loading frame (4), and connecting an air inlet pipe (13) and an air suction pipe (14) with an air pump; the conveyor belt (27) operates to drive the chip to operate towards one end, and the chip is limited by the baffle (26) after operating to one end and falls into the separating groove (15) from the through hole (25);
step two: the mounting plate (1) rotates, the third telescopic column (24) drives the pressing plate (23) to move downwards, the pressing plate (23) enters the separating groove (15) to extrude the chip in the separating groove (15), the bottom of the chip is in contact with the inner edge plate (18), and the chip is horizontally placed in the separating groove (15); after the bottom of the pressure plate (23) is contacted with the top of the chip, the chip is pushed to move downwards, and the chip which is placed unstably is pushed to be in a horizontal state;
step three: in the rotating process of the mounting plate (1), a plurality of air pipe nozzles (17) around the bottom of the frame (2) absorb air inwards, so that suction is generated on chips in the separation grooves (15), impurity and dust at the bottoms of the chips are absorbed and removed, and the positions of the chips are fixed; the chip rotates along with the mounting plate (1) in the separation groove (15) until the chip rotates to the position below the first telescopic column (12), the first telescopic column (12) moves downwards to drive the chip pasting device to move downwards, and the chip pasting device pastes the upper part of the chip; after the chip is pasted, the first telescopic column (12) contracts and moves upwards to drive the pasting device to be separated from the inside of the separation groove (15), and the mounting plate (1) continues to rotate to drive the chip after the chip is pasted to move;
step four: after the chip moves to the upper part of an air pipe nozzle (17) at the end part of an air inlet pipe (13), the air inlet pipe (13) conveys air to the interior of the air pipe nozzle (17), the air is sprayed out from the interior of the air pipe nozzle (17), the air flow is contacted with the bottom of the chip, the chip is blown and separated from the interior of a separation groove (15) by the air flow, and after the chip falls into the upper part of a conveyer belt (6), the conveyer belt (6) conveys the chip after being pasted to the upper part of a placing plate (9); the rotating shaft (8) drives the conveying chain (10) to rotate, and further drives the placing plates (9) to rotate in the end frame (7), and the chip after being pasted is transported away from the pasting device;
step five: during the rotation process of the mounting plate (1), the universal wheels (21) at the bottom of the limiting plate (19) are in contact with the top of the mounting plate (1), and the guide wheels (22) are in contact with the side face of the mounting plate (1) and generate rolling friction with the mounting plate (1) to limit the mounting plate (1).
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| CN201910859175.0A CN110589416B (en) | 2019-09-11 | 2019-09-11 | Automatic feeding and discharging device for IGBT chip paster and working method thereof |
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| CN201910859175.0A CN110589416B (en) | 2019-09-11 | 2019-09-11 | Automatic feeding and discharging device for IGBT chip paster and working method thereof |
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