CN110582190A - Heat dissipation plate device of electronic equipment - Google Patents
Heat dissipation plate device of electronic equipment Download PDFInfo
- Publication number
- CN110582190A CN110582190A CN201910990799.6A CN201910990799A CN110582190A CN 110582190 A CN110582190 A CN 110582190A CN 201910990799 A CN201910990799 A CN 201910990799A CN 110582190 A CN110582190 A CN 110582190A
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- electronic equipment
- plate
- fin
- dissipation plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a heat dissipation plate device of electronic equipment, which comprises a heat dissipation plate, wherein a plurality of first ventilation holes are formed in the heat dissipation plate, threaded columns are arranged at two ends of the inner side surface of the heat dissipation plate, clamping plates and clamping nuts are arranged on the threaded columns, a plurality of fin plates perpendicular to the heat dissipation plate are arranged on the outer side surface of the heat dissipation plate, heat dissipation through holes are correspondingly formed in the fin plates, two fin plates on the outermost side are welded with a heat dissipation fan mounting plate, a heat dissipation fan is mounted on the heat dissipation fan mounting plate, second ventilation holes are formed in the heat dissipation fan mounting plates on two sides of the heat dissipation fan, the heat dissipation plate is fixed to the back surface of the electronic equipment through the threaded columns and the clamping plates, the heat dissipation fan is started, heat can be dissipated through the ventilation holes, heat can.
Description
Technical Field
The invention relates to the technical field of electronic equipment heat dissipation devices, in particular to an electronic equipment heat dissipation plate device.
Background
At present, a plurality of electronic devices, such as a control computer, usually generate heat, and if the heat dissipation is not good, faults are easy to occur, and no good solution is available.
Therefore, a heat dissipation plate device for electronic devices is in need of research.
Disclosure of Invention
in order to solve the above problems, and in particular to overcome the disadvantages of the prior art, the present invention provides a heat sink device for an electronic device, which can solve the above problems.
In order to achieve the purpose, the invention adopts the following technical means:
The utility model provides an electronic equipment heating panel device, includes the heating panel, be provided with a plurality of ventilation holes one on the heating panel, the both ends of heating panel medial surface are provided with the screw thread post, be provided with clamp plate, clamping nut on the screw thread post, the heating panel lateral surface is provided with a plurality of fin boards that set up perpendicularly with the heating panel, the correspondence is provided with the heat dissipation through-hole on the fin board, and two fin board welding in the outside have the radiator fan mounting panel, install radiator fan on the radiator fan mounting panel, be provided with ventilation hole two on the radiator fan mounting panel of radiator fan both sides.
Further, the fin plate and the vent hole are arranged in a staggered mode.
The radiating plate has the beneficial effects that the connecting firmness of the fin plate and the radiating plate is favorably improved.
Further, the threaded columns are arranged in pairs of two groups.
The beneficial effects are that the clamping can be more stable.
Furthermore, a rubber pad is arranged on the inner side of the clamping plate.
The beneficial effects are that, be favorable to better centre gripping, do not harm electronic equipment.
The invention has the beneficial effects that: according to the invention, the heat dissipation plate is fixed on the back of the electronic equipment through the threaded column and the clamping plate, the heat dissipation fan is started, heat dissipation can be carried out through the vent holes, heat can be transmitted to the fin plate through the heat dissipation plate and can be dissipated quickly, and the electronic equipment can be cooled quickly.
Drawings
FIG. 1 is a schematic structural view of the present invention;
Fig. 2 is a schematic top view of the present invention.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1-2, the invention provides a heat dissipation plate device for electronic equipment, which comprises a heat dissipation plate 1, wherein a plurality of first ventilation holes 2 are formed in the heat dissipation plate 1, threaded columns 3 are arranged at two ends of the inner side surface of the heat dissipation plate 1, clamping plates 4 and clamping nuts 5 are arranged on the threaded columns 3, a plurality of fin plates 6 which are perpendicular to the heat dissipation plate 1 are arranged on the outer side surface of the heat dissipation plate 1, heat dissipation through holes 7 are correspondingly formed in the fin plates 6, heat dissipation fan mounting plates 8 are welded on the two fin plates 6 on the outermost side, heat dissipation fans 9 are mounted on the heat dissipation fan mounting plates 8, and second ventilation holes 10 are formed in the heat dissipation fan mounting plates 8.
the fin plate 6 and the ventilation holes 2 are arranged in a staggered mode, and the connection firmness of the fin plate and the heat dissipation plate is improved.
The threaded columns 3 are arranged in pairs of two groups, so that clamping can be more stable.
The rubber pad 401 is arranged on the inner side of the clamping plate 4, so that better clamping is facilitated, and electronic equipment is not damaged.
According to the invention, the heat dissipation plate is fixed on the back of the electronic equipment through the threaded column and the clamping plate, the heat dissipation fan is started, heat dissipation can be carried out through the vent holes, heat can be transmitted to the fin plate through the heat dissipation plate and can be dissipated quickly, and the electronic equipment can be cooled quickly.
The foregoing detailed description is given for clarity of illustration only, and is not intended to limit the scope of the invention. It will be apparent to those skilled in the art that other variations and modifications may be made in the foregoing disclosure without departing from the spirit or essential characteristics of all embodiments, and that all changes and modifications apparent from the above teachings are within the scope of the invention.
Claims (4)
1. The utility model provides an electronic equipment heating panel device, its characterized in that, includes heating panel (1), be provided with a plurality of ventilation holes (2) on heating panel (1), the both ends of heating panel (1) medial surface are provided with screw thread post (3), be provided with clamp plate (4), clamping nut (5) on screw thread post (3), heating panel (1) lateral surface is provided with a plurality of fin boards (6) that set up perpendicularly with heating panel (1), the correspondence is provided with heat dissipation through-hole (7) on fin board (6), and two fin boards (6) welding in the outside have radiator fan mounting panel (8), install radiator fan (9) on radiator fan mounting panel (8), be provided with ventilation hole two (10) on radiator fan mounting panel (8) of radiator fan (9) both sides.
2. An electronic equipment heat sink device as claimed in claim 1, wherein said fin (6) is offset from said first ventilation hole (2).
3. An electronic equipment heat sink device as claimed in claim 1, wherein said threaded studs (3) are arranged in pairs of two.
4. An electronic equipment heat sink device as claimed in claim 1, wherein said clamping plate (4) is provided with a rubber pad (401) on the inside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910990799.6A CN110582190A (en) | 2019-10-18 | 2019-10-18 | Heat dissipation plate device of electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910990799.6A CN110582190A (en) | 2019-10-18 | 2019-10-18 | Heat dissipation plate device of electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110582190A true CN110582190A (en) | 2019-12-17 |
Family
ID=68814897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910990799.6A Pending CN110582190A (en) | 2019-10-18 | 2019-10-18 | Heat dissipation plate device of electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110582190A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5873406A (en) * | 1997-11-04 | 1999-02-23 | Sunonwealth Electric Machine Industry Co., Ltd. | Heat dissipation device |
| CN207604129U (en) * | 2017-12-21 | 2018-07-10 | 广州泽浩电子有限公司 | A kind of PCB circuit board cabinet cooling device |
| CN208016226U (en) * | 2018-04-16 | 2018-10-26 | 广东电网有限责任公司 | A kind of electronic equipment is met an urgent need heat sink |
| CN208110512U (en) * | 2018-04-27 | 2018-11-16 | 深圳市七彩虹禹贡科技发展有限公司 | A kind of radiator for PCH chip |
| CN208630495U (en) * | 2018-06-25 | 2019-03-22 | 刘森良 | A kind of vehicle-mounted electronic equipment clamping device with heat sinking function |
| CN208722521U (en) * | 2018-09-15 | 2019-04-09 | 深圳市金宝信光电有限公司 | LED energy conservation interacts display screen |
| CN109933172A (en) * | 2019-03-18 | 2019-06-25 | 安徽信息工程学院 | Computer motherboard radiator |
-
2019
- 2019-10-18 CN CN201910990799.6A patent/CN110582190A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5873406A (en) * | 1997-11-04 | 1999-02-23 | Sunonwealth Electric Machine Industry Co., Ltd. | Heat dissipation device |
| CN207604129U (en) * | 2017-12-21 | 2018-07-10 | 广州泽浩电子有限公司 | A kind of PCB circuit board cabinet cooling device |
| CN208016226U (en) * | 2018-04-16 | 2018-10-26 | 广东电网有限责任公司 | A kind of electronic equipment is met an urgent need heat sink |
| CN208110512U (en) * | 2018-04-27 | 2018-11-16 | 深圳市七彩虹禹贡科技发展有限公司 | A kind of radiator for PCH chip |
| CN208630495U (en) * | 2018-06-25 | 2019-03-22 | 刘森良 | A kind of vehicle-mounted electronic equipment clamping device with heat sinking function |
| CN208722521U (en) * | 2018-09-15 | 2019-04-09 | 深圳市金宝信光电有限公司 | LED energy conservation interacts display screen |
| CN109933172A (en) * | 2019-03-18 | 2019-06-25 | 安徽信息工程学院 | Computer motherboard radiator |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110582190A (en) | Heat dissipation plate device of electronic equipment | |
| CN203523231U (en) | Integrated radiator | |
| CN210470147U (en) | Power device heat abstractor and motor driver | |
| CN111133401B (en) | Data processing apparatus | |
| CN216600202U (en) | HDI circuit board of high performance high density | |
| CN210986573U (en) | High heat dissipation printed wiring board | |
| CN210781885U (en) | Novel switching power supply's heat dissipation package assembly | |
| CN214046159U (en) | PCB circuit board with penetrating type via hole bonding pad | |
| CN110809362A (en) | High-heat-dissipation printed circuit board and manufacturing method thereof | |
| CN213485237U (en) | Heat dissipation substrate | |
| CN212696411U (en) | Fill electric pile circuit board that heat dispersion is good | |
| CN212573098U (en) | Durable type circuit board suitable for fill electric pile | |
| CN214627464U (en) | Flexible circuit board | |
| CN218976912U (en) | Capacitor circuit board with ladder structure | |
| CN210807790U (en) | Multilayer heat dissipation circuit board | |
| CN214046131U (en) | Heat dissipation type HDI circuit board | |
| CN218630608U (en) | Industry flat equipment of convenient equipment | |
| CN221178226U (en) | Integrated circuit radiator | |
| CN205040095U (en) | Circuit board radiator | |
| CN211792219U (en) | Printed circuit board with heat dissipation function | |
| CN214046141U (en) | Quick radiating multilayer HDI circuit board | |
| CN211959664U (en) | Heat radiation assembly of PCB (printed circuit board) | |
| CN221055145U (en) | Compressor drive plate mounting structure | |
| CN215773986U (en) | Electronic equipment and heat dissipation module thereof | |
| CN203120370U (en) | Heat dissipation structure of model airplane motor controller |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20191217 |