CN110581062A - Manufacturing method of packaging substrate for improving residual copper in edge curling - Google Patents
Manufacturing method of packaging substrate for improving residual copper in edge curling Download PDFInfo
- Publication number
- CN110581062A CN110581062A CN201910909360.6A CN201910909360A CN110581062A CN 110581062 A CN110581062 A CN 110581062A CN 201910909360 A CN201910909360 A CN 201910909360A CN 110581062 A CN110581062 A CN 110581062A
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- CN
- China
- Prior art keywords
- layer
- photoresist
- metal layer
- manufacturing
- insulating film
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0272—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers for lift-off processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
Abstract
the invention relates to a manufacturing method of a packaging substrate for improving crimping residual copper, and belongs to the technical field of circuit boards. The method comprises the following steps: preparing a base material consisting of a metal layer and an insulating film layer; adhering a PI layer on the insulating film layer; coating photoresist on the metal layer to form a photoresist thin layer on the metal layer and the PI layer; forming conveying chain wheel holes at the two side edges of the composition part; stripping the PI layer, and leaving a tape formed by the photoresist layer, the metal layer and the insulating film layer; the obtained tape is exposed and developed to form a circuit, and then a protective layer is provided to mount an electronic component, thereby finally obtaining a package substrate. The invention has the beneficial effects that: when coating processing, carry out the photoresist coating to the metal aspect, photoresist evenly distributed on the metal level need not set up SPOT UV device on developing apparatus, directly develops after the exposure, also can not appear the remaining problem of photoresist, can effectually avoid the appearance of the incomplete copper of turn-up.
Description
Technical Field
The invention relates to a manufacturing method of a packaging substrate for improving crimping residual copper, and belongs to the technical field of circuit boards.
Background
In the prior art, in order to improve the problem of residual copper in the edge curl, a second exposure is usually performed on a region with a thicker edge photoresist after the exposure is completed and before the development is performed. Specifically, in the developing device, a SPOT UV device is added at a position before entering the developing tank, and the SPOT UV device has two ultraviolet light lenses arranged on two sides of the conveying device. When the product is conveyed and produced by the conveying device, ultraviolet light is generated by the SPOT UV device body, is emitted through the lens and irradiates areas with thicker curled edge photoresist on two sides of the conveying device, and secondary exposure is realized. After the secondary exposure, the photoresist at the edge curling part can be developed although being thicker, so that the condition of residual copper of the edge curling can be avoided, the production yield is improved, and the cost is reduced.
however, in the conventional art, the cost for modification is increased by adding the SPOT UV device to the formed developing device, and the SPOT UV device itself is expensive, so that the cost is greatly increased although the conventional art can effectively improve the situation of the residual copper by curling.
Disclosure of Invention
in order to overcome the defects of the prior art, the invention provides the manufacturing method of the packaging substrate for improving the residual copper of the turned edge, and the problem of the residual copper of the turned edge can be effectively solved by producing the packaging substrate according to the method provided by the invention.
the invention is realized by the following technical scheme: a manufacturing method of a packaging substrate for improving residual copper in edge curling is characterized by comprising the following steps:
Step A: preparing a base material consisting of a metal layer and an insulating film layer;
And B: adhering a PI layer on the insulation film layer, wherein the width of the PI layer is larger than that of the substrate;
And C: coating photoresist on the metal layer to form a photoresist thin layer on the metal layer and the PI layer;
Step D: forming conveying chain wheel holes at the two side edges of the composition part;
Step E: stripping the PI layer on the insulation film layer, and enabling the photoresist on the PI layer to fall off, so as to leave a tape formed by the photoresist layer, the metal layer and the insulation film layer;
step F: the obtained tape is exposed and developed to form a circuit, and then a protective layer is provided to mount an electronic component, thereby finally obtaining a package substrate.
the metal layer is conductive metal.
The conductive metal is copper.
the PI layer is a polyimide film.
The insulating film layer is made of polyimide resin, epoxy resin or liquid crystal polymer and supports the surface metal layer.
And C, when the photoresist coating is carried out on the metal layer in the step C, the whole metal layer is uniformly coated.
and D, forming a conveying chain wheel hole by punching the edges of the two sides of the composition part by using a special die.
The invention has the beneficial effects that: when coating and processing, the photoresist coating is carried out on the whole metal layer, so the photoresist is uniformly distributed on the whole metal layer, an SPOT UV device is not required to be arranged on developing equipment, the developing is directly carried out after the exposure is finished, the problem of photoresist residue can not occur, and the occurrence of edge curling residual copper can be effectively avoided. Compared with the traditional method for solving the problem of residual copper in the edge curling, the method does not need to improve developing equipment and additionally increase and purchase a SPOT UV device, so that equipment refitting cost and equipment purchasing cost can be saved, and the manufacturing cost is effectively saved.
drawings
The invention is further illustrated below with reference to the figures and examples.
FIG. 1 is a flow chart of a method for manufacturing a package substrate with improved edge curl residual copper according to the present invention.
In the figure: 1. metal layer, 2, insulating film layer, 3, PI layer, 4, photoresist layer, 5, and conveying sprocket hole.
Detailed Description
The manufacturing method of the package substrate for improving the residual copper in the edge rolling as shown in fig. 1 is characterized by comprising the following steps:
step A: preparing a base material consisting of a metal layer 1 and an insulating film layer 2;
and B: a PI layer 3 is adhered on the insulation film layer 2, and the width of the PI layer 3 is larger than that of the substrate;
And C: coating photoresist on the metal layer 1 to form a photoresist thin layer 4 on the metal layer 1 and the PI layer 3;
Step D: forming conveying chain wheel holes 5 at the two side edges of the composition part;
step E: stripping the PI layer 3 on the insulating film layer 2, and enabling the photoresist on the PI layer 3 to fall off, so as to leave a tape formed by the photoresist layer 4, the metal layer 1 and the insulating film layer 2;
step F: the obtained tape is exposed and developed to form a circuit, and then a protective layer is provided to mount an electronic component, thereby finally obtaining a package substrate.
The metal layer 1 is a conductive metal.
the conductive metal is copper.
The PI layer 3 is a polyimide film.
The insulating film layer 2 is made of polyimide resin, epoxy resin or liquid crystal polymer and supports the surface metal layer 1.
and C, when the photoresist is coated on the metal layer 1 in the step C, the whole metal layer 1 is uniformly coated.
And D, forming the conveying chain wheel hole 5 by punching by using special dies at the two side edges of the composition part.
When coating and processing, the photoresist coating is carried out on the whole metal layer, so the photoresist is uniformly distributed on the whole metal layer, an SPOT UV device is not required to be arranged on developing equipment, the developing is directly carried out after the exposure is finished, the problem of photoresist residue can not occur, and the occurrence of edge curling residual copper can be effectively avoided. Compared with the traditional method for solving the problem of residual copper in the edge curling, the method does not need to improve developing equipment and additionally increase and purchase a SPOT UV device, so that equipment refitting cost and equipment purchasing cost can be saved, and the manufacturing cost is effectively saved.
Claims (7)
1. A manufacturing method of a packaging substrate for improving residual copper in edge curling is characterized by comprising the following steps:
step A: preparing a base material consisting of a metal layer (1) and an insulating film layer (2);
And B: a PI layer (3) is adhered to the insulating film layer (2), and the width of the PI layer (3) is larger than that of the base material;
And C: coating photoresist on the metal layer (1) to form a photoresist thin layer (4) on the metal layer (1) and the PI layer (3);
step D: forming conveying chain wheel holes (5) at the two side edges of the composition part;
Step E: stripping the PI layer (3) on the insulating film layer (2), and enabling the photoresist on the PI layer (3) to fall off, so that a winding tape consisting of the photoresist layer (4), the metal layer (1) and the insulating film layer (2) is left;
step F: the obtained tape is exposed and developed to form a circuit, and then a protective layer is provided to mount an electronic component, thereby finally obtaining a package substrate.
2. The method for manufacturing a package substrate capable of improving residual copper in edge curling according to claim 1, wherein: the metal layer (1) is conductive metal.
3. The method for manufacturing a package substrate capable of improving residual copper in edge rolling according to claim 2, wherein: the conductive metal is copper.
4. The method for manufacturing a package substrate capable of improving residual copper in edge curling according to claim 1, wherein: the PI layer (3) is a polyimide film.
5. The method for manufacturing a package substrate capable of improving residual copper in edge curling according to claim 1, wherein: the insulating film layer (2) is made of polyimide resin, epoxy resin or liquid crystal polymer and supports the surface metal layer (1).
6. The method for manufacturing a package substrate capable of improving residual copper in edge curling according to claim 1, wherein: and C, when the photoresist is coated on the metal layer (1) in the step C, the whole metal layer (1) is uniformly coated.
7. The method for manufacturing a package substrate capable of improving residual copper in edge curling according to claim 1, wherein: and D, forming a conveying chain wheel hole (5) by punching at the two side edges of the composition part by using a special die.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910909360.6A CN110581062A (en) | 2019-09-25 | 2019-09-25 | Manufacturing method of packaging substrate for improving residual copper in edge curling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910909360.6A CN110581062A (en) | 2019-09-25 | 2019-09-25 | Manufacturing method of packaging substrate for improving residual copper in edge curling |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110581062A true CN110581062A (en) | 2019-12-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910909360.6A Pending CN110581062A (en) | 2019-09-25 | 2019-09-25 | Manufacturing method of packaging substrate for improving residual copper in edge curling |
Country Status (1)
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101102638A (en) * | 2002-03-13 | 2008-01-09 | 三井金属矿业株式会社 | COF flexible printed wiring board and manufacturing method for the same |
| CN102446773A (en) * | 2010-10-01 | 2012-05-09 | Lg伊诺特有限公司 | Carrier tape for tab-package and manufacturing method thereof |
| CN102496562A (en) * | 2011-11-30 | 2012-06-13 | 中国科学院半导体研究所 | Method of adhering flexible thin-film material to glass substrate |
| CN104375382A (en) * | 2014-03-31 | 2015-02-25 | 中能柔性光电（滁州）有限公司 | Graphical manufacturing method for flexible conducting film |
| CN108962761A (en) * | 2018-06-05 | 2018-12-07 | 信利半导体有限公司 | A kind of COF preparation method |
-
2019
- 2019-09-25 CN CN201910909360.6A patent/CN110581062A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101102638A (en) * | 2002-03-13 | 2008-01-09 | 三井金属矿业株式会社 | COF flexible printed wiring board and manufacturing method for the same |
| CN102446773A (en) * | 2010-10-01 | 2012-05-09 | Lg伊诺特有限公司 | Carrier tape for tab-package and manufacturing method thereof |
| CN102496562A (en) * | 2011-11-30 | 2012-06-13 | 中国科学院半导体研究所 | Method of adhering flexible thin-film material to glass substrate |
| CN104375382A (en) * | 2014-03-31 | 2015-02-25 | 中能柔性光电（滁州）有限公司 | Graphical manufacturing method for flexible conducting film |
| CN108962761A (en) * | 2018-06-05 | 2018-12-07 | 信利半导体有限公司 | A kind of COF preparation method |
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Application publication date: 20191217 |