CN110572992B - Immersed self-turbulent flow cooling system with four-corner tangential circles - Google Patents

Immersed self-turbulent flow cooling system with four-corner tangential circles Download PDF

Info

Publication number
CN110572992B
CN110572992B CN201910882744.3A CN201910882744A CN110572992B CN 110572992 B CN110572992 B CN 110572992B CN 201910882744 A CN201910882744 A CN 201910882744A CN 110572992 B CN110572992 B CN 110572992B
Authority
CN
China
Prior art keywords
liquid
pipe
server
cooling
cabinet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201910882744.3A
Other languages
Chinese (zh)
Other versions
CN110572992A (en
Inventor
刘昱
李斌
李钟勇
崔峥
王鑫煜
任霄汉
邵卫
王兵
张宇川
王宏标
陈帆
余道广
夏爽
孙海逸
王文璞
肖龙
邓高翔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shandong University
Original Assignee
Shandong University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shandong University filed Critical Shandong University
Priority to CN201910882744.3A priority Critical patent/CN110572992B/en
Priority to CN202010327356.1A priority patent/CN111447797B/en
Priority to CN202010328108.9A priority patent/CN111356348B/en
Publication of CN110572992A publication Critical patent/CN110572992A/en
Application granted granted Critical
Publication of CN110572992B publication Critical patent/CN110572992B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208Liquid cooling with phase change
    • H05K7/20818Liquid cooling with phase change within cabinets for removing heat from server blades
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/203Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309Evaporators
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318Condensers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336Heat pipes, e.g. wicks or capillary pumps

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention provides an immersed self-turbulence cooling system with four tangential circles, which comprises a cabinet, a liquid separating device, a self-turbulence device and a liquid collecting device, wherein the self-turbulence device is a self-turbulence device with four tangential circles, and comprises four jet pipes, wherein the four jet pipes are placed in the vertical direction of four corners of the cabinet, the lower end openings of the jet pipes are communicated with a liquid separating main pipe, and the upper end openings of the jet pipes are sealed; the jet pipe is provided with a row of jet holes in the vertical direction, the opening direction of the jet holes is sequentially along the tangential direction of an inscribed circle where the server is located, and the directions of the jet holes on the two jet pipes at the diagonal positions are parallel in pairs. According to the invention, the principle of 'four-corner tangent circle' is utilized, the self-turbulence devices are arranged in the vertical directions of the four corners of the cabinet, the insulating cooling liquid ejected from the jet holes forms annular flow around the server in the horizontal direction, and the formed annular turbulence is mixed with the cooling liquid uniformly rising from the bottom of the cabinet, so that the cooling liquid spirally rises around the server, and the disturbance intensity of a cooling liquid flow field in the cabinet is enhanced. To a certain extent, the stronger the disturbance, the better the heat exchange performance, and the higher the heat exchange efficiency.

Description

Immersed self-turbulent flow cooling system with four-corner tangential circles
Technical Field
The invention relates to the field of shell-and-tube heat exchangers, in particular to an immersed self-turbulent flow cooling technology.
Background
With the rapid development of cloud storage technology, the data density of an internet data center machine room is higher and higher in recent years, but the problems of high heating power and high heat flux density are also brought, so that the temperature of a server element is increased, and a more effective cooling mode is needed for keeping the server to operate efficiently and stably. The traditional server air cooling technology can not meet the requirement of people on energy conservation, and more than one third of the power consumption of a data center is used for cooling the server.
In order to carry out more effective heat dissipation to the server, the submergence formula cooling technology that adopts direct liquid cooling comes along with transporting, adopts and wholly soaks the server in the rack that is full of insulating and stable performance's coolant liquid, and insulating coolant liquid and server direct contact take away the heat that the server dispels, and the rethread extrinsic cycle heat abstractor cools off insulating coolant liquid to the realization lasts efficient cooling effect.
Compared with the traditional air-cooled heat dissipation mode of a machine room, the immersed cooling mode has the advantages that the heat exchange efficiency of the cooling liquid is 1000 times that of air, the computing equipment does not need a fan, an additional air conditioner is not needed indoors, and 20% -30% of electric quantity can be saved. Compared with a water-cooling plate type cooling technology adopting indirect liquid cooling, the immersion type cooling technology has higher heat dissipation and cooling performance and does not need to consider the risk of sealing leakage of the cooling liquid. In addition, the design that the server system is completely soaked in a closed liquid environment enables the calculation deployment density to be greatly improved, the CPU and the GPU calculation component can stably work in a high-performance frequency state for a long time, the influence of humidity, dust and vibration is almost completely avoided, the operation environment of the server is greatly optimized, and the service life of equipment is prolonged.
However, in the existing server immersion type liquid cooling technology, the cooling liquid flows upwards from the bottom of the cabinet to immerse the server for cooling, the flow field in the vertical direction is relatively uniform, corresponding disturbance is absent in the horizontal direction, and the immersion cooling heat exchange performance of the server can be further improved. The invention provides a self-turbulent flow technology based on the principle of 'four-corner tangential circles', thereby enhancing the disturbance of a flow field of cooling liquid in a cabinet and improving the cooling and heat dissipation effects of a server. The basic idea of 'four corners tangent circle' is as follows: the rays led out from the points at the opposite corners are parallel to each other, and then the two groups of parallel lines are intersected in the rectangle to form a parallelogram or a rectangle, and the parallelogram or the rectangle has an inscribed circle or an inscribed ellipse. Similarly, if the fluid is ejected from four vertexes of four corners along two groups of ray directions, the four groups of fluids are mixed at the inscribed circle, and the flow direction is matched with the tangential direction of the inscribed circle to form a vortex-shaped flow field which circularly flows, so that the disturbance degree of the fluid is enhanced. Based on the above thought, we invented a server immersion type self-turbulent flow cooling technology.
Disclosure of Invention
One of the main purposes of the present invention is to provide a server immersion type self-disturbed flow cooling technology, which enhances the disturbance of the insulating cooling liquid in the horizontal direction by the principle of 'four corner tangent circles', thereby improving the heat dissipation performance of the liquid immersion type cooling system.
In order to achieve the purpose, the invention adopts the following technical scheme:
an immersed four-corner circle-cutting self-turbulence cooling system comprises a cabinet, a liquid separating device, a self-turbulence device and a liquid collecting device, wherein the cabinet is provided with a cooling liquid inlet and a cooling liquid outlet, the cooling liquid inlet is communicated with the liquid separating device, the liquid separating device is communicated with the self-turbulence device, the liquid collecting device is positioned below the cooling liquid level at the upper part of the cabinet, the liquid collecting device is communicated with the cooling liquid outlet, insulating cooling liquid enters the cabinet through the cooling liquid inlet, the liquid separating device and the self-turbulence device in sequence, flows out of the cooling liquid outlet through the liquid collecting device, and a server is immersed in the insulating cooling liquid in the cabinet for cooling and heat dissipation; the liquid separation device comprises a liquid separation mother pipe and a jet pipe, and the liquid separation mother pipe is communicated with a cooling liquid inlet;
the self-turbulent flow device is a 'four-corner tangential circle' self-turbulent flow device, and comprises four jet pipes which are arranged in the vertical direction of four corners of the cabinet, wherein the lower end openings of the jet pipes are communicated with the liquid separation mother pipe, and the upper end openings are sealed;
the jet pipe is provided with a row of jet holes in the vertical direction, the opening direction of the jet holes is sequentially along the tangential direction of an inscribed circle where the server is located, and the directions of the jet holes on the two jet pipes at the diagonal positions are parallel in pairs.
Preferably, the liquid separating device comprises liquid separating branch pipes, the liquid separating branch pipes are arranged in parallel, openings at two ends of the liquid separating branch pipes are communicated with the side walls of the liquid separating main pipe, and the liquid separating main pipe and the liquid separating branch pipes are both horizontally arranged at the bottom of the cabinet; and a row of evenly distributed shunting holes are formed in the upper pipe wall of the branch liquid distribution pipe along the length direction of the pipe.
Preferably, the jet pipe is rotatable.
Preferably, the liquid collecting device is composed of a collecting pipe, the interior of the collecting pipe is hollow and tubular, the exterior of the collecting pipe is square, and a collecting pipe liquid outlet and a cooling liquid outlet on the collecting pipe are communicated.
Preferably, the outer wall surface of the collecting pipe is tightly attached to the inner wall surface of the cabinet, and the four inner wall surfaces of the collecting pipe are provided with uniformly arranged collecting holes.
Compared with the prior art, the invention has the beneficial effects that:
1) according to the invention, the principle of 'four-corner tangent circle' is utilized, the self-turbulence devices are arranged in the vertical directions of the four corners of the cabinet, the insulating cooling liquid ejected from the jet holes forms annular flow around the server in the horizontal direction, and the formed annular turbulence is mixed with the cooling liquid uniformly rising from the bottom of the cabinet, so that the cooling liquid spirally rises around the server, and the disturbance intensity of a cooling liquid flow field in the cabinet is enhanced. To a certain extent, the stronger the disturbance, the better the heat exchange performance, and the higher the heat exchange efficiency.
2) The annular disturbance formed by the self-turbulent device with the four tangential corners does not need additional devices such as a fan or a pump, and the like, has no working noise and can be completed by the self-turbulent device.
3) The liquid separating device consists of a liquid separating mother pipe and liquid separating branch pipes, the tubular flow passage is more favorable for fluid flow, the resistance is relatively small, and the uniform distribution of cooling liquid is more favorable; the liquid-separating branch pipes are evenly paved at the bottom of the machine cabinet, and the cooling liquid is discharged upwards through the flow-dividing holes, so that the cooling liquid flows upwards evenly, and the occurrence of flowing dead zones is reduced.
4) The collector pipe is in a square frame shape, the outer wall surface of the collector pipe is tightly attached to the wall of a cabinet, and a circle of collector holes are formed in the inner wall surface of the collector pipe, so that cooling liquid on the same horizontal plane uniformly and quickly reaches the collector holes to enter the collector pipe, finally flows out of the collector pipe through a liquid outlet of the collector pipe to be circulated in the next step, and the occurrence of flow dead zones is reduced.
5) According to a large amount of researches, the density and size of the spraying holes in the height direction are determined to change, so that the heat dissipation is more uniform, and the service life of the server is prolonged.
6) The heat pipe is used for transporting heat generated by the server, liquid phase change heat transfer is utilized, and compared with conventional convection heat transfer, the heat pipe has higher heat dissipation response speed and higher heat dissipation efficiency, and can well solve the heat dissipation problem of the server with high heat flow density.
7) According to the invention, the server is packaged in the server packaging box filled with the phase-change material, so that the problem of unequal heat flux density generated by each part of the server can be solved, and the whole system has good temperature uniformity. Meanwhile, as the server packaging box is immersed in the insulating cooling liquid, the influence of dust and the like on the server is avoided, the operating environment of the server is greatly optimized, and the calculation performance and the service life of the server can be improved.
8) This scheme combines together the cooling and the submergence formula liquid cooling of heat pipe condensation end, can cool off the condensation end of heat pipe fast high-efficiently, improves the radiating efficiency of whole server, guarantees that the server operates steadily high-efficiently for a long time.
9) The invention determines the length change of the condensation end of the heat pipe along the height direction according to a great deal of research, and determines an optimized design formula, so that the heat dissipation is more uniform, and the service life of the server is prolonged.
Description of the drawings:
fig. 1 is a schematic view of the overall structure of a cabinet;
FIG. 2 is a view of the interior of the cabinet;
FIG. 3 is a top view of the internal structure of the cabinet;
FIG. 4 is a side view of the internal structure of the cabinet;
FIG. 5 is a schematic diagram of a server and a liquid-separating branch fork;
FIG. 6 is a top view of a server and a dispensing manifold fork;
FIG. 7 is a schematic view of the structure of the liquid separating device;
FIG. 8 is a schematic view of the liquid trap structure;
FIG. 9 is a schematic view of a jet pipe;
FIG. 10 is a schematic view of the jet angle of the jet hole of the jet pipe;
FIG. 11 is a schematic view of "quadrangle tangential circle" flow in the horizontal direction;
FIG. 12 is a schematic view showing the flow of the insulating coolant in the vertical direction
FIG. 13 is a schematic diagram of a configuration of a set-up server enclosure;
fig. 14 is a schematic structural view of a section a of the server enclosure a in fig. 13.
In the figure:
1 server 2 cabinet 201 side wall 202 cabinet upper cover plate 203 cabinet lower floor 204 observation window 205 pneumatic spring support rod 206 cooling liquid inlet 207 cooling liquid outlet
3 liquid separating device 301 liquid separating mother pipe liquid inlet 302 liquid separating mother pipe 303 liquid separating branch pipe 304 liquid separating hole 305 jet pipe liquid inlet
4 'four-corner tangential' self-turbulent device 401 jet pipe 402 jet hole 403 jet pipe liquid inlet 404 sealing cover
5 liquid collecting device 501 manifold 502 manifold orifice 503 manifold liquid outlet
6. Packaging the box; 7. a condensing end; 8. an evaporation end; 9. phase change material, 10, heat pipe.
Detailed Description
Fig. 1-4 illustrate an immersed "quadrangle tangential circle" self-turbulating cooling system of the present invention. As shown in fig. 1-4, the system includes a server 1 (or a server enclosure 6), a cabinet 2, a liquid separating device 3, a "four-corner tangential circle" self-turbulent flow device 4, and a liquid collecting device 5. The cabinet 2 is provided with a cooling liquid inlet 206 and a cooling liquid outlet 207, the cooling liquid inlet 206 is positioned at the lower part of the cabinet side wall 201, the cooling liquid inlet 206 is communicated with a liquid separating device 3, the liquid separating device 3 is communicated with a four-corner tangential turbulence device 4, the liquid collecting device 5 is positioned below the liquid level of the insulating cooling liquid, and the liquid collecting device 5 is communicated with the cooling liquid outlet 207. Insulating coolant liquid loops through liquid separating device 3 and "four corners circle of contact" vortex device 4 after passing through coolant liquid inlet 206 and enters into in rack 2, and server 1 (or server packaging box 6) submergence is in the insulating coolant liquid in rack 2, and insulating coolant liquid takes away the heat that server 1 (or server packaging box 6) produced and flows out from coolant liquid outlet 207 through liquid collecting device 5 on rack lateral wall 201 upper portion.
The liquid separating device 3 comprises a liquid separating mother pipe 302, and the liquid separating mother pipe 302 is communicated with the cooling liquid inlet 206;
the self-turbulent flow device is a 'four-corner tangential circle' self-turbulent flow device, and comprises four jet pipes 401 which are arranged at four corners of the cabinet 2 in the vertical direction, wherein the lower end openings of the jet pipes 401 are communicated with the liquid separation main pipe 302, and the upper end openings are sealed;
a row of jet holes 402 are formed in the jet pipe 401 in the vertical direction, the opening direction of each jet hole 402 is sequentially along the tangential direction of an inscribed circle where a server (or a server packaging box 6) is located, and the directions of the jet holes 402 on the two jet pipes at the diagonal positions are pairwise parallel.
Preferably, the coolant ejection angle is determined by:
as shown in fig. 10, when viewed from the top, the length of the cabinet is L, the width of the cabinet is W, the length of the server group is M, the width of the server group is N, and the diameter of the jet pipe is d, then the angle formed by the two jet pipe cooling liquid jet directions and the length direction of the cabinet is:
Figure DEST_PATH_IMAGE001
the angle formed by the spraying direction of the other two spraying pipes and the length direction of the cabinet is as follows:
Figure 869534DEST_PATH_IMAGE002
wherein X = (L-d)/2, Y = (W-d)/2, a = M/2, b = N/2.
The invention utilizes the principle of 'four-corner tangential circle', self-turbulence devices are arranged in the vertical directions of four corners of the cabinet, insulating cooling liquid ejected by jet holes forms annular flow around a server (or a server packaging box 6) in the horizontal direction, particularly, the angle of the jet holes is adjusted, so that the opening direction of the jet holes 402 sequentially follows the tangential direction of an inscribed circle where the server (or the server packaging box 6) is located, the formed annular turbulence is more fully mixed with the cooling liquid uniformly rising from the bottom of the cabinet, the cooling liquid spirally rises around the server (or the server packaging box 6), and the disturbance intensity of a cooling liquid flow field in the cabinet is enhanced. To a certain extent, through the mode of four corners tangential circle for the disturbance is stronger, and the heat transfer performance is better, and heat exchange efficiency is higher.
Preferably, the server (or server enclosure box 6) is of square configuration. Further preferably, the server is arranged inside the enclosure box 6, as shown in fig. 13. The servers of figures 1-12 are now disposed within the enclosure 6 to cool the enclosure.
The server 1 (or the server packaging box 6) is vertically arranged on a fixed support in the cabinet body, and the lower part of the server 1 is suspended and keeps a certain distance from the liquid separating device. The lower part of the server 1 is also immersed in the cooling liquid, and all-round heat dissipation is guaranteed.
As shown in fig. 5, the liquid separating device 3 comprises a liquid separating mother pipe 302 and a liquid separating branch pipe 303, and the liquid separating branch pipe 303 is provided with an upward diversion hole. The branch liquid separating pipes are arranged in parallel, and the openings at the two ends of the pipe bundle are communicated with the side wall of the mother liquid separating pipe 302 to form H-shaped arrangement. The coolant in the mother liquid separating pipe 302 is uniformly dispersed into the branch liquid separating pipe 303. The main liquid separating pipe 302 and the branch liquid separating pipe 303 are both horizontally arranged at the bottom of the cabinet. The servers or the lower parts of the server packaging boxes 6 can be cooled by upward injection of the branch liquid pipes 303, so that the heat exchange area is increased.
Preferably, the branch liquid pipes are only arranged at the lower part of the server or the server packaging box 6, and are not arranged at other positions. By providing the upward spray of the branch liquid distribution pipe 303, the server or the server packaging box 6 is effectively cooled.
The liquid inlet 301 of the liquid separation main pipe is communicated with the cooling liquid inlet 206 on the cabinet 2, two liquid inlet 301 of the liquid separation main pipe are arranged at the diagonal of the liquid separation device 3, and a jet pipe inlet 305 is arranged above four right angles of the liquid separation main pipe 302. The insulating cooling liquid enters the liquid separation mother pipe 302 through the cooling liquid inlet 206, and then enters the liquid separation branch pipe 303 and the jet pipe 401 through the liquid separation mother pipe 302.
The upper wall surface of the branch liquid distribution pipe 303 is provided with a row of flow distribution holes 304 with equal size and uniform distribution. The shape of the diversion hole 304 is not limited, and may be configured as a square hole, a round hole, or a regular polygon hole according to specific needs.
As an improvement, the diversion holes 304 formed in the upper wall surface of the branch liquid distribution pipe 303 are different in size and are not uniformly distributed. The method comprises the following specific steps:
the distribution density of the distribution holes 304 gradually decreases from the center position of the server or server enclosure box 6 (if it is a rectangle, the intersection of two diagonal lines of the rectangle) to the positions around the server or server enclosure box 6.
The uneven arrangement can further improve the heat exchange efficiency in a targeted manner. Because the central heat of a common server is concentrated most, the heat concentration from the center to the periphery is gradually reduced, the spraying amount of the cooling liquid can be further changed according to the heat distribution, the middle cooling liquid is distributed most, the heat dissipation capacity is strongest, and the heat dissipation capacity is integrally improved.
More preferably, the distribution density of the distribution holes 304 gradually decreases and gradually increases. The rule is a rule of concentrating the heat of the server obtained by a large number of numerical simulations and experiments, so that the distribution density is regularly set.
The area (diameter if circular) of the distribution holes 304 gradually decreases from the center position of the server or server enclosure box 6 (the intersection of two diagonal lines of the rectangle if it is rectangular) to the position around the server or server enclosure box 6. More preferably, the density of the flow distribution holes 304 gradually decreases in area (diameter when the flow distribution holes are circular). For specific reasons see analysis of changes in tap hole density.
Preferably, the cabinet sidewall 201 is a double-wall structure, and has an inner wall and an outer wall, and the space between the inner wall and the outer wall contains the cooling liquid. The liquid inlet 206 is communicated with the outer wall, and the liquid inlet 301 of the liquid separation mother pipe is communicated with the inner wall, so that cooling liquid is introduced into the side wall from the liquid inlet 206 and then enters the liquid separation mother pipe 302 through the side wall.
Through the cabinet side wall 201 with the double-wall structure, the liquid level of the cooling liquid can be enabled to have a certain height in the side wall 201 after a small amount of cooling liquid is filled in, so that the pressure of the cooling liquid in the bottom liquid-separating mother pipe is increased, and the injection force of the cooling liquid is improved. In addition, the cooling liquid on the side wall can also participate in the internal heat exchange, and the heat exchange capacity is improved.
Preferably, the outer part of the outer wall is provided with an insulating layer.
Preferably, the coolant outlet 207 is communicated with the outer wall, and the manifold outlet 503 is communicated with the inner wall, so that the coolant is discharged from the upper part of the side wall of the cabinet.
As shown in fig. 2, 3 and 4, the branch liquid separator 303 and the server 1 (or the server enclosure box 6) are arranged in a straight line as a possible embodiment. The liquid separating branch pipe 303 and the liquid separating branch pipe 303 are just right opposite to the gap between two adjacent servers 1 (or server packaging boxes 6), and the cooling liquid flows into the gap between the servers 1 (or server packaging boxes 6) after passing through the liquid separating branch pipe 303, so that the cooling effect is greatly improved, and the flow resistance is also reduced.
As another possible embodiment, as shown in fig. 5 and 6, the branch liquid dispensing pipes 303 and the server 1 (or the server enclosure box 6) are arranged in a crosswise direction. Server 1 (or server packaging box 6) is placed between two adjacent branch flow holes 304 on branch liquid pipe, and different branch liquid pipes on branch liquid pipe correspond with the same row of branch flow holes 304 just to the gap between two adjacent servers 1 (or server packaging box 6), and insulating coolant flows directly into the gap between servers 1 after passing through branch flow holes 304, not only greatly improves the cooling effect, has still reduced the flow resistance.
As shown in fig. 2, 9 and 11, the "tangential four-corner" flow disturbing device 4 includes four jet pipes 401 vertically fixed at four corners of the cabinet 2 in the vertical direction, and the lower end openings of the jet pipes 401 are communicated with the liquid separating mother pipe 302. The cooling liquid in the main liquid-separating pipe 302 not only flows to the branch liquid-separating pipes, but also enters the four jet pipes 401 through the liquid inlets 403 of the jet pipes. The upper end of the jet pipe 401 is sealed, and a certain number of jet holes 402 are uniformly arranged on the jet pipe 401. The opening direction of the jet hole 402 is along the tangential direction of the inscribed circle of the server 1 (or the server packaging box 6). The cooling liquid ejected from the jet holes 402 on the four jet pipes 401 is directly ejected on the server 1 (or the server packaging box 6) on one hand, so that the heat exchange cooling effect is enhanced, and on the other hand, annular disturbance is generated on the cooling liquid which flows uniformly from the bottom in the horizontal direction, so that the cooling liquid horizontally rotates in the machine cabinet, the disturbance is enhanced, and the heat exchange cooling effect is enhanced.
The jet pipe 401 can rotate, and when the number of the servers 1 (or the server packaging boxes 6) in the cabinet 2 is changed, the direction of the jet hole 402 is changed by rotating the jet pipe 401.
As shown in fig. 8, the liquid collecting device 5 is composed of a collecting pipe 501, the collecting pipe 501 is a hollow pipe, the collecting pipe 501 is connected end to form a square frame, the outer side of the square frame-shaped collecting pipe 501 is tightly attached to the inner wall surface of the cabinet, and four surfaces of the inner side of the square frame are provided with uniformly distributed collecting holes 502. The collecting pipe 501 is immersed below the liquid level of the cooling liquid, and the uniformly distributed collecting holes 502 ensure that the cooling liquid in the placing cavity of the server 1 (or the server packaging box 6) uniformly flows into the collecting pipe 501 through the collecting holes 502 and flows out through the collecting pipe liquid outlet 503, so that the occurrence of flow dead zones is reduced. The number of the manifold liquid outlets 503 is two, and the manifold liquid outlets are distributed diagonally, so that the cooling liquid can flow out more uniformly.
In this example, a filter device may be disposed on each of the manifold holes 502.
In this example, the cover plate is provided with an observation window for observing the cooling liquid level.
In this example, the cooling liquid is dielectric coolant, such as insulating and non-conductive mineral oil, silicone oil, and electron fluorinated liquid.
The coolant flow-through path is described in connection with fig. 11 and 12: after the stable insulating cooling liquid is cooled by the cooling heat exchanger to reach a preset temperature, the stable insulating cooling liquid enters the cabinet 2 through the cooling liquid inlet 206 under the pressure of the circulating pump, then enters the liquid separation main pipe 302, and then uniformly flows into the horizontal liquid separation branch pipe 303 and the jet pipe 401 which are communicated with the liquid separation main pipe 302 through the liquid separation main pipe 302. The cooling liquid in the branch liquid separating pipe 303 flows out through the branch flow holes 304 on the upper wall of the branch liquid separating pipe 303 and surges upwards, and enters the gaps of the server 1 array to cool the server 1; meanwhile, the cooling liquid entering the jet pipes 401 is ejected through the jet holes 402, and the cooling liquid ejected from the four jet pipes 401 forms a circular flow rotating around the server 1 in a manner of "four corner tangential circles". The uniform flow from the bottom in the vertical direction and the circulation flow in the horizontal direction are mixed and superposed, so that the flow field of the cooling liquid in the cabinet is changed, and the cooling liquid around the server 1 rises spirally. The cooling liquid reaches the horizontal plane of the collector pipe 501 bundle below the liquid level, because the collecting holes 502 are uniformly distributed on the periphery tightly attached to the cabinet body, the cooling liquid uniformly flows towards the collecting holes 502 on the periphery, so that all the cooling liquid is ensured to participate in the cooling circulation process, and the generation of flow dead zones is avoided. Cooling liquid in the collecting pipe 501 enters the cooling liquid outlet 207 through the collecting pipe liquid outlet 503 to be discharged, the cooling liquid is sent to an external heat exchange system for cooling the cooling liquid, and the insulating cooling liquid enters the cooling liquid inlet 206 again after being cooled, so that the next circulation is completed.
Preferably, the jet pipe can rotate, and the angle is adjusted through the rotation of the jet pipe, so that the server (or the server packaging box 6) with different sizes is met.
Preferably, the distribution density of the jet holes 402 is increased along the height direction. The above results are obtained by a number of numerical simulations and experiments. Can make the heat dissipation more even, extension server life. Through theoretical analysis, on the one hand, because the encapsulation case submerges in cooling liquid, consequently the cooling liquid in the encapsulation case can lead to the temperature of the liquid on upper portion to be higher than the lower part because the convection current, because the difference in temperature of upper portion and heat pipe condensation end just diminishes, leads to the heat transfer effect obviously to be less than the lower part, through the constantly increasing of the distribution density who sets up jet hole 402, increases the jet flow to increase the heat dissipation capacity on upper portion, make whole upper portion lower part heat dissipation capacity even, avoid local high temperature, cause local damage. On the other hand, since the coolant enters from the lower portion, the lower portion is originally under a higher pressure, and the injection amount is also large, and therefore, by setting the distribution density of the upper portion to be higher than that of the lower portion, it is possible to further ensure that more coolant enters the upper portion for injection. The above-described technical feature of setting the distribution density of the jet holes 402 to be increased is a result obtained by a large number of experiments and numerical simulations, and is an invention point of the present application, and is not common knowledge in the art.
Further preferably, the distribution density of the jet holes 402 is set to be increased more and more in the height direction. This technical feature is the result obtained through a large number of experiments and numerical simulations, and is in accordance with the distribution of the liquid temperature and the distribution law of the cooling liquid, and is an invention point of the present application, and is not common knowledge in the field.
Preferably, the size of the jet hole 402 increases along the height direction. The above results are obtained by a number of numerical simulations and experiments. Can make the heat dissipation more even, extension server life. Through theoretical analysis, on the one hand, because the encapsulation case submerges in cooling liquid, consequently the cooling liquid in the encapsulation case can lead to the temperature of the liquid on upper portion to be higher than the lower part because the convection current, because the difference in temperature of upper portion and heat pipe condensation end just diminishes, leads to the heat transfer effect obviously to be less than the lower part, through the size constantly increase that sets up jet hole 402, increases the jet flow to increase the heat dissipation capacity on upper portion, make whole upper portion lower part heat dissipation capacity even, avoid local high temperature, cause local damage. On the other hand, since the coolant enters from the lower portion, the lower portion is originally under a higher pressure, and the injection amount is also large, and therefore, by setting the distribution density of the upper portion to be higher than that of the lower portion, it is possible to further ensure that more coolant enters the upper portion for injection. The above-described technical feature of setting the size of the jet hole 402 to be increased is a result obtained by a large number of experiments and numerical simulations, and is an invention point of the present application, and is not common knowledge in the art.
Further preferably, the size of the jet hole 402 is set to be increased more and more in the height direction. This technical feature is the result obtained through a large number of experiments and numerical simulations, and is in accordance with the distribution of the liquid temperature and the distribution law of the cooling liquid, and is an invention point of the present application, and is not common knowledge in the field.
Preferably, the liquid collecting device is composed of a collecting pipe, the interior of the collecting pipe is hollow and tubular, the exterior of the collecting pipe is square, and a collecting pipe liquid outlet and a cooling liquid outlet on the collecting pipe are communicated.
Preferably, the outer wall surface of the collecting pipe is tightly attached to the inner wall surface of the cabinet, and the four inner wall surfaces of the collecting pipe are provided with uniformly arranged collecting holes.
As a case of a particular implementation, preferred dimensions are as follows:
the length of the server is 915mm, the width of the server is 445mm, and the height of the server is 75 mm;
the length of the cabinet is 1500mm, the width is 500mm, and the height is 1000 mm;
the diameter of the main pipe for liquid separation is 32mm, the length is 1500mm, the diameter of the branch pipe for liquid separation is 20mm, the length is 440mm,
the diameter of the jet pipe is 20mm, and the height of the jet pipe is 900 mm;
the diameter of the liquid collecting pipe is 20mm, and the lengths of the two side pipes are 1500mm and 500mm respectively.
The size is only a reference size in the experimental simulation process and cannot be used as a limitation of the invention, and when factors such as different server sizes and heating power are changed, the size can be changed to provide a more efficient and good cooling effect.
Figure 13 shows a server enclosure box in place of the server of the previous figures. The server 1 is enclosed inside the phase-change material 9, the evaporation end 8 of the heat pipe 10 is arranged in the phase-change material 9, and the condensation end 7 of the heat pipe 10 extends out of the packaging box 6.
The heat pipe, the phase change material and the immersion liquid cooling are combined to dissipate heat of the server, so that heat generated by the server is firstly transferred to the phase change material, the phase change material is subjected to phase change, then the heat is transferred to the condensation end through the evaporation end of the heat pipe, the evaporation end is transferred outwards from the condensation end, and then the evaporation end is transferred to the cooling liquid, so that the rapid heat dissipation of the server is realized.
According to the invention, the phase-change material is arranged to surround the server, more heat is absorbed through phase-change latent heat through phase-change heat exchange of the phase-change material, and the temperature of the heat storage material is ensured to be constant, so that the temperature of the server can be ensured to be constant.
According to the invention, through the phase-change material, the temperature difference between different positions of the outer wall surface of the server and the phase-change material is kept basically the same, the integral heat dissipation is ensured to be uniform, and the local damage caused by nonuniform heat dissipation due to overlarge and overlong local temperature difference is avoided.
On one hand, the heat pipe is used for transporting heat generated by the server, liquid phase change heat transfer is utilized, the heat dissipation response speed is higher compared with that of conventional convection heat transfer, the heat dissipation efficiency is higher, and the heat dissipation problem of the server with high heat flow density can be well solved.
According to the invention, the server is packaged in the server packaging box filled with the phase-change material, so that the problem of unequal heat flux density generated by each part of the server can be solved, and the whole system has good temperature uniformity.
The invention has wide application range and can be used in extremely cold extreme environment. If the heat-preserving server is arranged in an extreme environment of rapid cooling, the phase-change material can play a heat-preserving role at the same time, and can play a certain heat-preserving effect by stopping the circulation of cooling liquid, so that the server is prevented from stopping running in the extreme environment.
Preferably, the outer wall surface of the packaging box is a heat conductor, and through the arrangement of the heat conductor on the outer wall surface and the insulating cooling liquid, the cooling liquid can directly contact with the outer wall surface of the packaging box to directly dissipate heat, so that the heat dissipation problem is better solved, and the heat dissipation effect is improved.
Preferably, the packaging box 6 is immersed in the insulating cooling liquid and is suspended and fixed by a bracket. Because the server packaging box 6 is immersed in the insulating cooling liquid, the influence of dust and the like on the server is avoided, the operating environment of the server is greatly optimized, and the computing performance and the service life of the server can be improved. And the lower part of the packaging box is also immersed in the cooling liquid through the suspension fixation of the bracket, so that the omnibearing heat dissipation is ensured.
Furthermore, the server packaging box contains a server, a heat pipe, a phase-change material and the like. And a plurality of servers are arranged in the server packaging box at equal intervals. Phase change materials are filled in the gap between two adjacent servers and between the server and the server packaging box wall, and a plurality of heat pipes are inserted into the phase change materials. The evaporation end of the heat pipe is arranged in the server packaging box, the condensation end of the heat pipe is arranged outside the server packaging box, and the contact part of the heat pipe and the server packaging box is strictly sealed so as to realize the isolation of the inside and the outside of the server packaging box. The phase change material arranged in the server packaging box can be used for enabling the inside of the server packaging box to have good temperature uniformity.
Further, the heat pipe comprises an evaporation end, a condensation end and the like. The heat pipe is made of high-quality heat conduction material such as copper. And the evaporation end of the heat pipe is inserted into the phase change material filled in the server packaging box. And the condensation end of the heat pipe is positioned outside the server packaging box. The inner surface of the heat pipe is designed into a porous structure or is provided with a plurality of channels, so that the power of the heat pipe working medium flowing back from the condensation end to the evaporation end is provided. In order to further enhance the heat dissipation effect of the condensation end, other auxiliary heat dissipation measures can be implemented on the outer surface of the condensation end, such as: additionally adding a heat sink and the like. The working medium of the heat pipe can be selected from liquid ammonia, water, propane, organic refrigerants and the like.
Furthermore, the heat pipes can be arranged in a row or in a fork manner.
Furthermore, the insulating cooling liquid can be cooled by an external heat dissipation system such as an air conditioner, a heat exchanger and the like after flowing out of the cabinet, and the cooled insulating cooling liquid is driven by the power pump to return to the refrigerant source again.
Preferably, the condensation end of the heat pipe is arranged perpendicular to the wall surface of the package box 6.
Preferably, each wall surface of the packaging box is provided with a heat pipe condensation end.
Preferably, the servers are arranged along the height direction, and the phase change materials are also arranged along the height direction. The heat pipe is arranged in plurality in the height direction.
Preferably, the heat pipe is arranged in a plurality of heat pipes along the height direction, and the length of the heat pipe condensation end extending out of the packaging box is increased along the height direction. The above results are obtained by a number of numerical simulations and experiments. Can make the heat dissipation more even, extension server life. Through theoretical analysis, because the encapsulation case submergence is in cooling liquid, consequently the cooling liquid in the encapsulation case can lead to the temperature of the liquid on upper portion to be higher than the lower part because the convection current, because the difference in temperature of upper portion and heat pipe condensation end just diminishes, lead to the heat transfer effect obviously to be less than the lower part, through the length that sets up the heat pipe condensation end constantly increase, make whole increase heat transfer area, thereby increase the heat dissipation capacity on upper portion, make whole upper portion lower part heat dissipation capacity even, avoid local high temperature, cause local damage. The technical feature that the length of the condensation end of the heat pipe is increased continuously is the result obtained by a large number of experiments and numerical simulation, and is an invention point of the application, and is not common knowledge in the field.
Further preferably, the length of the condensation end of the heat pipe increases along the height direction by a larger and larger range. This technical feature is the result obtained by a large number of experiments and numerical simulations, and is in accordance with the distribution of the liquid temperature, which is also an invention point of the present application, and is not common knowledge in the art.
Preferably, the height of the packaging box is H, and along the height direction, the length of the condensation end of the heat pipe at the lowest end of the packaging box is L, and then the length L rule of the condensation end of the heat pipe at the position H away from the lowest end of the packaging box is as follows: l ═ L + b ═ L ═ H/H)aWherein a and b are coefficients, and the following requirements are met:
1.23<a<1.45,0.35<b<0.38。
preferably, a and b are gradually increased as H/H is increased.
Preferably, 1.30< a <1.38,0.36< b < 0.37.
Preferably, the heat pipes are arranged in a plurality along the height direction, and the distribution quantity of the condensation ends of the heat pipes extending out of the packaging box is increased along the height direction. The above results are obtained by a number of numerical simulations and experiments. Can make the heat dissipation more even, extension server life. Through theoretical analysis, because the encapsulation case submergence is in cooling liquid, consequently the cooling liquid in the encapsulation case can lead to the temperature of the liquid on upper portion to be higher than the lower part because the convection current, because the difference in temperature of upper portion and heat pipe condensation end just diminishes, lead to the heat transfer effect obviously to be less than the lower part, distribution density through setting up the heat pipe condensation end constantly increases, make whole increase heat transfer area, thereby increase the heat dissipation capacity on upper portion, make whole upper portion lower part heat dissipation capacity even, avoid local high temperature, cause local damage. The technical feature that the length of the condensation end of the heat pipe is increased continuously is the result obtained by a large number of experiments and numerical simulation, and is an invention point of the application, and is not common knowledge in the field.
Further preferably, the distribution density of the condensation end of the heat pipe is increased along the height direction by a larger and larger range. This technical feature is the result obtained by a large number of experiments and numerical simulations, and is in accordance with the distribution of the liquid temperature, which is also an invention point of the present application, and is not common knowledge in the art.
Preferably, the height of the packaging box is H, and along the height direction, the distribution density of the condensation end of the heat pipe at the lowest end of the packaging box is D, and the distribution density D rule of the condensation end of the heat pipe at the position H away from the lowest end of the packaging box is as follows:
d=D+b*D*(h/H)awherein a and b are coefficients, and the following requirements are met:
1.3<a<1.5,0.34<b<0.37。
preferably, a and b are gradually increased as H/H is increased.
Preferably, 1.38< a <1.42,0.35< b < 0.36.
Although the present invention has been described with reference to the preferred embodiments, it is not limited thereto. Various changes and modifications may be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.

Claims (5)

1. An immersed four-corner tangential circle self-turbulence cooling system comprises a cabinet, a liquid separating device, a self-turbulence device and a liquid collecting device, wherein the cabinet is provided with a cooling liquid inlet and a cooling liquid outlet, the cooling liquid is insulating cooling liquid, the cooling liquid inlet is communicated with the liquid separating device, the liquid separating device is communicated with the self-turbulence device, the liquid collecting device is positioned below the cooling liquid level on the upper portion of the cabinet, the liquid collecting device is communicated with the cooling liquid outlet, the cooling liquid enters the cabinet through the cooling liquid inlet, the liquid separating device and the self-turbulence device in sequence, flows out of the cooling liquid outlet through the liquid collecting device, and a server is immersed in the cooling liquid in the cabinet for cooling and heat dissipation; the liquid separating device comprises a liquid separating mother pipe, and the liquid separating mother pipe is communicated with a liquid inlet of the cooling liquid;
the self-turbulent flow device is a 'four-corner tangential circle' self-turbulent flow device and comprises four jet pipes, the four jet pipes are placed in the vertical directions of four corners of the cabinet, the lower end openings of the jet pipes are communicated with the liquid separation main pipe, and the upper end openings are sealed;
the jet pipe is provided with a row of jet holes in the vertical direction, and the opening directions of the jet holes are parallel to each other on the two jet pipes at the diagonal position along the tangential direction of the inscribed circle where the server is located in sequence.
2. The self-disturbed flow cooling system of claim 1, wherein the liquid separating device comprises branch liquid separating pipes, the branch liquid separating pipes are arranged in parallel, openings at two ends of the branch liquid separating pipes are communicated with the side walls of the main liquid separating pipe, and the main liquid separating pipe and the branch liquid separating pipes are both horizontally arranged at the bottom of the cabinet; and a row of evenly distributed shunting holes are formed in the upper pipe wall of the branch liquid distribution pipe along the length direction of the pipe.
3. The self-turbulating cooling system of claim 1, wherein the jet tube is rotatable.
4. The self-turbulating cooling system of claim 1, wherein the liquid collecting device comprises a manifold, the manifold is hollow and tubular, and has a rectangular frame shape, and a manifold outlet of the manifold is connected to the coolant outlet.
5. The self-turbulating cooling system of claim 4, wherein the outer wall surface of the manifold is closely attached to the inner wall surface of the cabinet, and the four inner wall surfaces of the manifold are provided with uniformly arranged flow-gathering holes.
CN201910882744.3A 2019-09-18 2019-09-18 Immersed self-turbulent flow cooling system with four-corner tangential circles Active CN110572992B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201910882744.3A CN110572992B (en) 2019-09-18 2019-09-18 Immersed self-turbulent flow cooling system with four-corner tangential circles
CN202010327356.1A CN111447797B (en) 2019-09-18 2019-09-18 Heat pipe system with jet holes distributed in size and self-turbulent flow cooling system
CN202010328108.9A CN111356348B (en) 2019-09-18 2019-09-18 Immersed self-turbulent flow cooling system with four-corner tangential circles

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910882744.3A CN110572992B (en) 2019-09-18 2019-09-18 Immersed self-turbulent flow cooling system with four-corner tangential circles

Related Child Applications (2)

Application Number Title Priority Date Filing Date
CN202010328108.9A Division CN111356348B (en) 2019-09-18 2019-09-18 Immersed self-turbulent flow cooling system with four-corner tangential circles
CN202010327356.1A Division CN111447797B (en) 2019-09-18 2019-09-18 Heat pipe system with jet holes distributed in size and self-turbulent flow cooling system

Publications (2)

Publication Number Publication Date
CN110572992A CN110572992A (en) 2019-12-13
CN110572992B true CN110572992B (en) 2020-05-19

Family

ID=68780906

Family Applications (3)

Application Number Title Priority Date Filing Date
CN202010327356.1A Active CN111447797B (en) 2019-09-18 2019-09-18 Heat pipe system with jet holes distributed in size and self-turbulent flow cooling system
CN202010328108.9A Active CN111356348B (en) 2019-09-18 2019-09-18 Immersed self-turbulent flow cooling system with four-corner tangential circles
CN201910882744.3A Active CN110572992B (en) 2019-09-18 2019-09-18 Immersed self-turbulent flow cooling system with four-corner tangential circles

Family Applications Before (2)

Application Number Title Priority Date Filing Date
CN202010327356.1A Active CN111447797B (en) 2019-09-18 2019-09-18 Heat pipe system with jet holes distributed in size and self-turbulent flow cooling system
CN202010328108.9A Active CN111356348B (en) 2019-09-18 2019-09-18 Immersed self-turbulent flow cooling system with four-corner tangential circles

Country Status (1)

Country Link
CN (3) CN111447797B (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111240446B (en) * 2020-01-06 2021-06-29 苏州浪潮智能科技有限公司 Immersion type liquid cooling device for server
CN111447784B (en) * 2020-03-08 2022-06-21 苏州浪潮智能科技有限公司 Immersion type liquid cooling device for server
CN111864304B (en) * 2020-08-11 2024-04-16 大连理工大学 Two-phase immersed battery liquid cooling device utilizing phase change material for energy storage
CN112708398A (en) * 2020-12-30 2021-04-27 兰洋(宁波)科技有限公司 Cooling liquid for cooling integrated chip circuit board
CN113099694A (en) * 2021-04-06 2021-07-09 龚晶晶 Terminal equipment for industrial equipment information management based on big data
CN113465409A (en) * 2021-05-21 2021-10-01 常州大学 Pipe shell type spray cooling heat exchanger
CN113365478A (en) * 2021-06-22 2021-09-07 中国联合网络通信集团有限公司 Cooling device and cluster router
CN113543588B (en) * 2021-06-24 2022-06-07 西安交通大学 Jet flow-transverse flow combined immersed heat dissipation device and method
CN113543595B (en) * 2021-07-12 2023-10-27 广东合一新材料研究院有限公司 Mobile immersion server, workstation and work system
CN113473823B (en) * 2021-09-02 2021-11-19 深圳比特微电子科技有限公司 Single-phase immersion type liquid cooling cabinet
CN115297697B (en) * 2022-08-31 2024-05-17 南京工业大学 Immersed jet cooling device and method for heat dissipation of data center server
CN117241566B (en) * 2023-11-14 2024-01-30 东南大学 Immersed multiphase coupling liquid cooling system

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109539815A (en) * 2018-12-27 2019-03-29 南昌工程学院 A kind of high-temperature hot-air device that the waste gas circulation suitable for brickkiln heats

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8867209B2 (en) * 2011-07-21 2014-10-21 International Business Machines Corporation Two-phase, water-based immersion-cooling apparatus with passive deionization
CN202396124U (en) * 2011-11-11 2012-08-22 大连熵立得传热技术有限公司 Enclosed heat accumulating type electronic heat radiation apparatus
CN204810797U (en) * 2014-10-10 2015-11-25 汤金菊 High density server liquid immersion cooling rack
CN207003951U (en) * 2017-04-27 2018-02-13 应鸽龙 Big flow more shower nozzle putty slurry coating spray coating operations heads side by side
CN206807964U (en) * 2017-05-05 2017-12-26 华中师范大学 A kind of oil immersed type cooling system of server
CN108124408B (en) * 2017-12-19 2019-08-13 中南大学 Data center's immersion liquid cooling cabinet based on hot pipe technique
CN208224976U (en) * 2018-05-08 2018-12-11 无锡商业职业技术学院 A kind of heat pipe heat radiation supercomputing center
CN108522500B (en) * 2018-06-22 2019-03-15 南京中丰益农业科技有限公司 A kind of seed cold-induction device and method based on ultrasonic technology
CN208353209U (en) * 2018-07-20 2019-01-08 乌鲁木齐金风天翼风电有限公司 Unsteady flow device assembly and wind power generating set
CN108882652B (en) * 2018-08-21 2019-07-09 葛俊 Liquid-immersed cooling machine cabinet, system and the maintaining method of high density server
CN209281327U (en) * 2018-12-27 2019-08-20 江南大学 A kind of air cooling immersion supercomputing center cooling system

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109539815A (en) * 2018-12-27 2019-03-29 南昌工程学院 A kind of high-temperature hot-air device that the waste gas circulation suitable for brickkiln heats

Also Published As

Publication number Publication date
CN111447797B (en) 2021-02-26
CN110572992A (en) 2019-12-13
CN111447797A (en) 2020-07-24
CN111356348A (en) 2020-06-30
CN111356348B (en) 2021-01-05

Similar Documents

Publication Publication Date Title
CN110572992B (en) Immersed self-turbulent flow cooling system with four-corner tangential circles
CN110475465B (en) Heat pipe system with jet hole height changing
CN110631301B (en) Immersed self-turbulent-flow shell-and-tube heat exchanger
CN110470159B (en) Heat pipe with gradually-changed length of condensation end and immersed self-turbulent flow cooling system
CN110581114B (en) Heat pipe, phase change material and immersed liquid cooling combined heat dissipation system
CN107690267B (en) Data center cooling system and data center
US11871545B2 (en) Cooling cabinet and cooling system
CA2977688C (en) Hybrid fluid cooler method and apparatus
CN101814470B (en) Micro-channel heat sink for electronic encapsulation device
CN105263295B (en) A kind of microchannel heat sink
US20130048254A1 (en) Heat transfer bridge
CN104167399A (en) Staggered complex micro-channel miniature heat exchanger
CN107690268B (en) Data center cooling system and data center
CN110631302B (en) Shell-and-tube heat exchanger with heat pipe combined with phase-change material
CN103593026A (en) Bi-phase variation circulation type water cooling module and method for applying same
CN208862072U (en) A kind of battery case, battery heat removal system and electric vehicle
US20160007502A1 (en) Heat exchanger, cooling system, and electronic device
CN207703030U (en) A kind of electric power cabinet cooling tower
JP2023524485A (en) Electrical equipment, panels and heat exchangers
CN112683080B (en) Thermodynamic type superconducting cooling process
CN213273837U (en) Novel heat exchange system of closed cooling tower
CN214426478U (en) Thermal power type superconducting cooling device
CN220669901U (en) Low-temperature cooling liquid circulating pump
CN204424038U (en) The heat abstractor of reactor or transformer and reactor module, transformer module
CN215264677U (en) Liquid cooling server

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant