CN208224976U - A kind of heat pipe heat radiation supercomputing center - Google Patents
A kind of heat pipe heat radiation supercomputing center Download PDFInfo
- Publication number
- CN208224976U CN208224976U CN201820717246.4U CN201820717246U CN208224976U CN 208224976 U CN208224976 U CN 208224976U CN 201820717246 U CN201820717246 U CN 201820717246U CN 208224976 U CN208224976 U CN 208224976U
- Authority
- CN
- China
- Prior art keywords
- heat pipe
- thermally conductive
- conductive case
- chip
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to supercomputing centers; especially a kind of heat pipe heat radiation supercomputing center; including thermally conductive case, chip, radiated rib, command post, heat pipe, protective shell; the chip is fixed on thermally conductive case inner bottom plating using fast insert-pull pedestal, and the chip is lined up multiple row and is immersed in halogenated hydrocarbons mixing liquid；The top of the thermally conductive case is fixedly mounted more vertical heat pipes, and the radiated rib of the outer surface installation multilayer of the heat pipe and thermally conductive case, the inside of the heat pipe is connected to thermally conductive case；The utility model has the advantages that natural cooling, chips close is immersed in insulating liquid using heat pipe heat exchanging, and it is small in size, it can be mounted on automobile；More maintenance changes chip conveniently, energy saving.
Description
Technical field
The utility model relates to supercomputing center, especially a kind of heat pipe heat radiation supercomputing center.
Background technique
Existing supercomputing center, required to have huge water cooling system since chip cooling is huge, this necessarily brings
The following aspects is inconvenient: first is that it is bulky, water cooling coil pipe heat-conducting block is used between chip, needs water pump, valve, cooling
The integration of equipments such as tower, fan take up space big, cannot be mounted on automobile and move at any time；Second is that replacement maintenance chip trouble, chip
Between installation is tightly fastened using water cooling coil pipe heat-conducting block, to change chip and must tear heat-conducting block open can just change chip, three
It is the energy consumption for increasing water pump fan for heat dissipation；This just makes troubles to operation and maintenance.
Summary of the invention
The purpose of the utility model is to overcome defects in the prior art, using in a kind of heat pipe heat radiation supercomputing
The heart, using heat pipe heat exchanging, natural cooling, chips close is immersed in insulating liquid, small in size, can be mounted on automobile；More tie up
Shield changes chip conveniently, energy saving.
To achieve the above object, the technical solution of the utility model is using a kind of heat pipe heat radiation supercomputing center, packet
Thermally conductive case, chip, radiated rib, command post, heat pipe, protective shell are included, the chip is fixed on using fast insert-pull pedestal and is led
On hot tank inner bottom plating, the chip is lined up multiple row and is immersed in halogenated hydrocarbons mixing liquid；The top of the thermally conductive case is solid
Dingan County fills more vertical heat pipes, the radiated rib of the outer surface installation multilayer of the heat pipe and thermally conductive case, the heat pipe
Inside be connected to thermally conductive case.
The command post is fixedly mounted on the inside of thermally conductive case.
The protective shell surface is provided with the slot of cross-ventilation, and the protective shell is mounted on the appearance of whole device
Face.
The utility model has the beneficial effects that:
(1) heat pipe heat exchanging is used, natural cooling, chips close is immersed in insulating liquid, and it is small in size, automobile can be mounted on
On.
(2) more maintenance changes chip conveniently, energy saving.
Detailed description of the invention
Fig. 1 is the schematic diagram of the utility model.
In figure: thermally conductive case 1, chip 2, radiated rib 3, command post 4, heat pipe 5, protective shell 6.
Specific embodiment
Specific embodiment of the present invention is further described in conjunction with Fig. 1:
According to technical solution provided by the utility model, a kind of heat pipe heat radiation supercomputing center, including thermally conductive case 1, core
Piece 2, radiated rib 3, command post 4, heat pipe 5, protective shell 6, the chip 2 are fixed on thermally conductive case 1 using fast insert-pull pedestal
On inner bottom plating, the chip 2 is lined up multiple row and is immersed in halogenated hydrocarbons mixing liquid；The top of the thermally conductive case 1 is fixed
More vertical heat pipes 5 are installed, the radiated rib 3 of the outer surface installation multilayer of the heat pipe 5 and thermally conductive case 1, the heat
The inside of pipe 5 is connected to thermally conductive case 1.
The command post 4 is fixedly mounted on the inside of thermally conductive case 1.
6 surface of protective shell is provided with the slot of cross-ventilation, and the protective shell 6 is mounted on the appearance of whole device
Face.
The course of work of the utility model is: thermally conductive case 1 is full of the halogenated hydrocarbons mixing liquid of half, halogenated hydrocarbons mixing liquid
Boiling point at 50~65 DEG C, chip 2 is lined up multiple row and is immersed in halogenated hydrocarbons mixing liquid；The fever of chip 2 mixes halogenated hydrocarbons
Ebuillition of heated liquid becomes steam, and heat is taken away by steam, and chip 2 is cooled down；Steam rises to inside heat pipe 5, in heat pipe 5
Inner wall be condensed into liquid, liquid, which along inner wall instills thermally conductive 1 lower part of case, to be continued evaporation and absorbs heat, and heat pipe 5 passes through cooling fin
Piece 3 passes to heat in air.
The utility model has the beneficial effects that: being exchanged heat using heat pipe 5, natural cooling, chip 2 is intensively immersed in dielectric
In vivo, small in size, it can be mounted on automobile；More 2 convenience of chip is changed in maintenance, energy saving.
Particular embodiments described above has carried out into one the purpose of this utility model, technical scheme and beneficial effects
Step is described in detail, it should be understood that being not limited to this foregoing is merely specific embodiment of the utility model
Utility model, within the spirit and principle of the utility model, any modification, equivalent substitution, improvement and etc. done should all wrap
Containing being within the protection scope of the utility model.
Claims (3)
1. a kind of heat pipe heat radiation supercomputing center, it is characterised in that: including thermally conductive case, chip, radiated rib, command post, heat
Pipe, protective shell, the chip are fixed on thermally conductive case inner bottom plating using fast insert-pull pedestal, and the chip lines up multiple row simultaneously
It is immersed in halogenated hydrocarbons mixing liquid；The top of the thermally conductive case is fixedly mounted more vertical heat pipes, the heat pipe and
The radiated rib of the outer surface installation multilayer of thermally conductive case, the inside of the heat pipe is connected to thermally conductive case.
2. a kind of heat pipe heat radiation supercomputing center according to claim 1, it is characterised in that: the command post is fixed
It is mounted on the inside of thermally conductive case.
3. a kind of heat pipe heat radiation supercomputing center according to claim 1, it is characterised in that: the protective shell surface
It is provided with the slot of cross-ventilation, the protective shell is mounted on the outer surface of whole device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820717246.4U CN208224976U (en) | 2018-05-08 | 2018-05-08 | A kind of heat pipe heat radiation supercomputing center |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820717246.4U CN208224976U (en) | 2018-05-08 | 2018-05-08 | A kind of heat pipe heat radiation supercomputing center |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208224976U true CN208224976U (en) | 2018-12-11 |
Family
ID=64508426
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820717246.4U Expired - Fee Related CN208224976U (en) | 2018-05-08 | 2018-05-08 | A kind of heat pipe heat radiation supercomputing center |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208224976U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111356348A (en) * | 2019-09-18 | 2020-06-30 | 山东大学 | Heat pipe distribution design method for packaging box and self-turbulent flow cooling system |
-
2018
- 2018-05-08 CN CN201820717246.4U patent/CN208224976U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111356348A (en) * | 2019-09-18 | 2020-06-30 | 山东大学 | Heat pipe distribution design method for packaging box and self-turbulent flow cooling system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181211 Termination date: 20190508 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |