CN110557896A - Full ink-jet manufacturing method of circuit board - Google Patents
Full ink-jet manufacturing method of circuit board Download PDFInfo
- Publication number
- CN110557896A CN110557896A CN201910731799.4A CN201910731799A CN110557896A CN 110557896 A CN110557896 A CN 110557896A CN 201910731799 A CN201910731799 A CN 201910731799A CN 110557896 A CN110557896 A CN 110557896A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- ink
- layer
- jet
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 47
- 238000000034 method Methods 0.000 claims abstract description 31
- 230000008569 process Effects 0.000 claims abstract description 28
- 238000003825 pressing Methods 0.000 claims abstract description 11
- 238000007781 pre-processing Methods 0.000 claims abstract description 4
- 239000010410 layer Substances 0.000 claims abstract 28
- 238000007641 inkjet printing Methods 0.000 claims description 25
- 238000013461 design Methods 0.000 claims description 17
- 238000007731 hot pressing Methods 0.000 claims description 17
- 238000007639 printing Methods 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 17
- 229920005989 resin Polymers 0.000 claims description 17
- 238000001723 curing Methods 0.000 claims description 16
- 238000000016 photochemical curing Methods 0.000 claims description 12
- 238000001029 thermal curing Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 10
- 238000012545 processing Methods 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 239000007787 solid Substances 0.000 claims description 9
- 238000005507 spraying Methods 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 7
- 230000001681 protective effect Effects 0.000 claims description 7
- 239000003814 drug Substances 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 238000003848 UV Light-Curing Methods 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 5
- 238000005553 drilling Methods 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 5
- 239000000123 paper Substances 0.000 claims description 5
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 239000002344 surface layer Substances 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 16
- 230000008901 benefit Effects 0.000 abstract description 7
- 230000001737 promoting effect Effects 0.000 abstract description 3
- 239000011229 interlayer Substances 0.000 abstract 1
- 238000010030 laminating Methods 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000012163 sequencing technique Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000007774 longterm Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to a full ink-jet manufacturing method of a circuit board, which comprises the following steps: manufacturing a support plate, splitting a plurality of groups of complete multilayer circuit board interlayer patterns, respectively transmitting the groups to a plurality of ink-jet printers, manufacturing veneer layers one by one according to the grouped patterns by each ink-jet printer, accumulating the veneer layers layer by layer to form a superposed layer, finishing an ink-jet process of all the patterns in the groups to form circuit board modules, simultaneously preprocessing a prepreg, arranging the circuit board modules according to the sequence of the circuit board layer structure groups, adding the prepreg between every two adjacent circuit board modules as a supporting medium, performing a pressing process after finishing typesetting, and finally obtaining a finished circuit board. The advantage that has combined traditional technology and inkjet technology is when promoting the board manufacturing efficiency and reduce man-hour loss, has compromise the mechanical strength of plate body. The use problem caused by insufficient mechanical strength of the plate body is avoided.
Description
Technical Field
The invention relates to the field of printed circuit board manufacturing, in particular to a full inkjet manufacturing method of a circuit board.
Background
ink-jet printing, also known as ink-jet printing, is a printing process that can be used for pattern transfer as well as offset printing, screen printing. The ink jet printing is a non-contact physical printing process, does not need to use chemical liquid medicine, does not use a printing plate or a film for printing like type printing and exposure photography, only needs to directly output a printing pattern by a computer, and controls a spray head of an ink jet system through a controller to spray ink particles out of a spray nozzle to form the pattern.
The conventional PCB circuit has a complicated manufacturing process, and a desired circuit is formed on the substrate only after an image transfer process, a process of attaching a metal to the substrate, and an etching manufacturing process of forming a circuit by processing the metal, and the current image transfer technology has reached the limit of a line width, and thus the packaging density cannot be increased. The ink jet technology is used to spray metal particles to overcome this problem, and the lines can be formed without using an image transfer process and an etching process, thereby simplifying the manufacturing process. With conventional manufacturing techniques, the mask used in the image transfer manufacturing process must be changed when the shape of the circuit is changed, which not only increases the time and cost for mask fabrication, but also requires changes in the type of printed circuit board or the manufacturing line. In contrast, with the inkjet technology, the line can be changed by directly inputting the CAD data into the inkjet printing apparatus without changing the production line and preparing the components.
The existing ink jet printing technology adopts a processing mode of layer-by-layer superposition, each layer needs to be processed by the working procedures of picture selection, ink jet and solidification, the time consumption is long, and the efficiency is low.
In addition, the plate main body which is formed by ink jet curing in a full structure is pursued in the existing ink jet printing technology, and a supporting structure is lost, so that the main body mechanism of the printed circuit board produced by the technology is soft, and the plate body is deformed to influence the conduction performance due to high heat generated in the process of high-power long-term use. Meanwhile, the excessively soft plate body can also cause instability of each electrical element plugged on the plate body.
Disclosure of Invention
In order to solve the problems, the invention adopts the following technical scheme: a full ink-jet manufacturing method of a circuit board comprises the following steps:
S1, manufacturing a carrier plate, selecting a plurality of carrier plates with the same size and meeting the design requirement of circuit board makeup, and respectively putting the carrier plates into a plurality of ink-jet printers;
S2, splitting data, grouping the structures of the layers of the circuit board and inputting the grouped structures into computers matched with different ink-jet printers respectively, so that the ink-jet printers can simultaneously manufacture different layer structures;
S3, manufacturing a veneer layer, in any ink-jet printer, analyzing each veneer layer graph in the group through a computer, extracting the first layer graph as an execution reference, controlling the ink-jet printer to print the circuit graph on the surface of the carrier plate by using conductive ink, printing the non-conductive graph area by using insulating resin ink, and forming the veneer layer after hot-pressing leveling, thermocuring or photocuring treatment;
S4, stacking the board layers, selecting a second layer of pattern in the groups as an execution reference through a computer, controlling an ink-jet printer to print the circuit pattern on the basis of the single board layers by using conductive ink, printing a non-conductive pattern area by using insulating resin ink, and after hot-pressing leveling, thermocuring or photocuring treatment, generating a single board layer on the cured single board layer again to combine the single board layer and the stacked board layer;
S5, forming a module, repeating the operation of the step S4 to finish printing all the patterns in the group one by one, generating a circuit board module with a multilayer structure, and simultaneously generating a plurality of circuit board modules by a plurality of ink jet printers;
S6, preprocessing a prepreg, selecting the prepreg which meets the design requirement size of circuit board makeup, and positioning and drilling according to the structures of two adjacent circuit board modules;
S7, spraying a prepreg, and filling conductive ink in the through hole by ink jet according to the pattern design of the layer where the prepreg is located;
And S8, pressing, namely arranging the circuit board modules according to the grouping sequence of the circuit board layer structures, adding a prepreg between every two adjacent circuit board modules as a supporting medium, and performing a pressing process after typesetting to finally obtain a finished circuit board.
further, in the step S5, after printing all the patterns in the group is completed and the generated laminated board layer is finally cured, the carrier board is removed, and only the circuit board module generated by spraying is left for standby.
Further, in the steps S3 and S4, solder resist ink and protective ink are used for ink-jet printing of the patterns on the entire surface of the circuit board structure.
Further, characters, marks and patterns are subjected to ink-jet printing on the surface of the finished circuit board by using character ink.
and further, carrying out appearance processing on the finished circuit board.
Furthermore, the carrier plate can be made of paper, metal, glass, ceramic or resin materials.
Furthermore, the carrier plate is a solid layer structure plate formed by curing ink, after the circuit board module is constructed, the ink layer serving as the carrier plate can be washed away by liquid medicine, and the carrier plate can be removed under the condition that the structure of the circuit board module is not damaged.
Furthermore, the circuit board modules are grouped according to the circuit board structure patterns referred by the circuit board modules, and a conductive layer, an insulating layer, a via hole or other circuit board structures are generated.
Further, the conducting layer thickness is 2-20um, the via height is 5-50um, the insulating layer thickness is 5-75 um.
Further, the heat curing temperature is 80-200 ℃, and the time is 2-60 minutes; the light curing type is UV light curing, and the curing time is 1-30 minutes; the hot pressing and flattening temperature is 50-100 ℃ and the pressure is 1-50 KG.
The working principle of the invention is as follows: the improved structure has the advantages that the improved structure is improved on the basis of the existing layer-by-layer ink-jet technology, each module forming the circuit board main body is manufactured in a mode that a plurality of ink-jet printers work simultaneously and work is divided into different modes, and then final finished boards are obtained through press forming of the modules, so that board manufacturing efficiency is improved exponentially, and working hours are greatly shortened. The integration of the traditional process and the emerging process can be realized on the basis of the process, the board layer generated by ink-jet printing is combined with the prepreg layer, and the glass fiber mesh in the prepreg can be hardened to form a supporting structure for the whole circuit board while the modules are combined through high temperature and high pressure generated in the pressing process. The mechanical strength of the finished board is effectively improved, and the problems that the circuit board is deformed by heating and the electronic device is unstable due to a soft board body are solved.
The invention combines the practical example of simultaneous processing of three ink-jet printers, and the total number of circuit patterns of each layer of the circuit board is nine.
Firstly, selecting three carrier plates with the same size and meeting the design requirement of circuit board makeup, and respectively putting the carrier plates into three ink-jet printers; and the data is divided in advance, and nine circuit patterns of nine layers in total are grouped by grouping adjacent three patterns. The No. 1, the No. 2 and the No. 3 are taken as a first group and are conveyed to a computer of a first ink-jet printer; no. 4, No. 5 and No. 6 are second groups and are conveyed to a computer of a second ink-jet printer; the third set of nos. 7, 8, and 9 was fed to the computer of the third inkjet printer.
The three ink-jet printers work simultaneously, and respectively manufacture the board layer patterns corresponding to the patterns with the first numbers in the respective groups, namely the first ink-jet printer selects the pattern No. 3 as a first execution reference, the corresponding circuit pattern in the pattern No. 3 is printed out by using conductive ink on the surface of the carrier plate, the non-conductive pattern area is printed out by using insulating resin ink, and the single board layer represented by the pattern No. 3 is formed after hot-pressing leveling, thermocuring or photocuring treatment.
And the second ink-jet printer selects the No. 6 graph as a first execution reference, prints the corresponding circuit graph in the No. 6 graph on the surface of the carrier plate by using conductive ink, prints the non-conductive graph area by using insulating resin ink, and forms the veneer layer represented by the No. 6 graph after hot-pressing leveling, thermocuring or photocuring treatment.
And the third ink-jet printer selects the No. 9 graph as a first execution reference, prints the corresponding circuit graph in the No. 9 graph on the surface of the carrier plate by using conductive ink, prints the non-conductive graph area by using insulating resin ink, and forms the veneer layer represented by the No. 9 graph after hot-pressing leveling, thermocuring or photocuring treatment.
and after the single board layers of the first layer, which are respectively responsible for the three ink-jet printers, are manufactured, generating a second layer on the basis of the single board layers, and obtaining a laminated board layer. The first ink-jet printer selects the No. 2 graph as a second execution reference, ink-jet printing is carried out on the surface of the veneer layer shown by the No. 3 graph to generate the veneer layer shown by the No. 2 graph, and the veneer layer are combined to form a superposed veneer layer.
and the second ink-jet printer selects the No. 5 graph as a second execution reference, performs ink-jet printing on the surface of the veneer layer shown by the No. 6 graph to generate the veneer layer shown by the No. 5 graph, and the veneer layer and the laminated veneer layer are combined to form a laminated veneer layer.
and the third ink-jet printer selects the No. 8 graph as a second execution reference, performs ink-jet printing on the surface of the veneer layer represented by the No. 9 graph to generate the veneer layer represented by the No. 8 graph, and combines the veneer layer represented by the No. 8 graph and the laminated veneer layer to form a laminated veneer layer.
And repeating the operation again, wherein the first ink-jet printer selects the No. 1 graph as a third execution reference, performs ink-jet printing on the surface of the veneer layer presented by the No. 2 graph to generate the veneer layer presented by the No. 1 graph, and combines the No. 1, the No. 2 and the No. 3 to form the first circuit board module.
And the second ink-jet printer selects the No. 4 graph as a third execution reference, performs ink-jet printing on the surface of the veneer layer shown by the No. 5 graph to generate the veneer layer shown by the No. 4 graph, and combines the No. 4 graph, the No. 5 graph and the No. 6 graph to form a second circuit board module.
and the third ink-jet printer selects the No. 7 graph as a third execution reference, performs ink-jet printing on the surface of the veneer layer shown by the No. 8 graph to generate the veneer layer shown by the No. 7 graph, and combines the No. 7 graph, the No. 8 graph and the No. 9 graph to form a third circuit board module.
And (4) carrying out a separate pretreatment process on the prepreg while the module is manufactured. Firstly, cutting according to the size meeting the design requirement of circuit board makeup, and then drilling according to the circuit requirement and the circuit pattern shapes of two modules to be spliced at two sides of a prepreg. And the CCD positioning technology is adopted to avoid the occurrence of deviation. After the through hole is drilled in the prepreg, the through hole is filled in an ink-jet mode. The filler is conductive ink, and the preparation work of the prepreg is completed after the conductive ink is solidified.
And sequencing the prepreg and the three circuit board modules according to a circuit structure, wherein the No. 3 pattern board layer of the first module is adjacent to the No. 4 pattern board layer of the second module, and the No. 6 pattern board layer of the second module is adjacent to the No. 7 pattern board layer of the third module. One of the prepregs is inserted into the two gaps according to reasonable design, or one layer of prepreg is inserted into each of the two gaps.
and (3) sequentially stacking the three circuit board modules and the prepregs in a laminating machine, and starting a laminating process after typesetting and aligning. Finally obtaining the finished circuit board.
The carrier plate is used as a carrier medium for generating the module and can be directly removed after the module is manufactured. The carrier plate with special function can be reserved. The material of the carrier plate can be one of paper, metal, glass, ceramic or resin materials. However, the material selected in the present invention is a solid structural plate formed by curing ink. The design has the advantage that module construction is carried out on the surface of the solid ink layer by using the principle of a silk-screen process. After the module is built, the carrier plate can be cleaned by liquid medicine to remove the solid ink layer without any trace. The integrity and high precision of the module can be guaranteed to the maximum extent. Playing an excellent bedding effect in the subsequent pressing and splicing process.
No. 1 and No. 9 are used as two outermost layer patterns of the circuit board, and filling materials in the patterns are solder resist ink and protective ink which are used for circuit board protection and solder resist protection. And after the solder resist ink and the protective ink are cured, spraying a layer of character ink for marking characters, marks and figures.
in each model, pattern slabs having different functions are formed according to the pattern groups. For example, the veneer layer represented by pattern No. 3 is a conductive layer, and the veneer layer represented by pattern No. 4 is an insulating layer. The position of the margin of the No. 3 pattern corresponds to the position of the margin of the No. 4 pattern, and the margin of the No. 3 pattern and the margin of the No. 4 pattern are combined to form a buried hole or a through hole penetrating through the No. 3 veneer layer and the No. 4 veneer layer.
other processing parameters in this example are: the thickness of the conductive layer is 2-20um, the height of the via hole is 5-50um, and the thickness of the insulating layer is 5-75 um. The thermosetting temperature is 80-200 ℃ and the time is 2-60 minutes; the light curing type is UV light curing, and the curing time is 1-30 minutes; the hot pressing and flattening temperature is 50-100 ℃ and the pressure is 1-50 KG.
Finally, the appearance of the finished circuit board is processed to complete the manufacture of the whole board body.
The invention has the beneficial effects that: the advantage that has combined traditional technology and inkjet technology is when promoting the board manufacturing efficiency and reduce man-hour loss, has compromise the mechanical strength of plate body. The use problem caused by insufficient mechanical strength of the plate body is avoided.
Drawings
the figures further illustrate the invention, but the examples in the figures do not constitute any limitation of the invention.
Fig. 1 is a schematic layout structure diagram of a full inkjet manufacturing method for a circuit board according to an embodiment of the invention.
Fig. 2 is a schematic structural diagram of a first circuit board module and a carrier board of a full inkjet manufacturing method of a circuit board according to an embodiment of the invention.
the figure is as follows:
001 a first circuit board module; 002 a second circuit board module; 003 a third circuit board module; 004 prepreg; 005 a carrier plate.
Detailed Description
As shown in fig. 1-2, a method for manufacturing a circuit board by full inkjet according to an embodiment of the present invention includes the following steps:
S1, manufacturing a carrier plate 005, selecting a plurality of carrier plates 005 which have the same size and meet the layout design requirement of the circuit board, and respectively putting the carrier plates 005 into a plurality of ink-jet printers;
S2, splitting data, grouping the structures of the layers of the circuit board and inputting the grouped structures into computers matched with different ink-jet printers respectively, so that the ink-jet printers can simultaneously manufacture different layer structures;
S3, manufacturing a veneer layer, wherein in any ink-jet printer, each veneer layer pattern in the group is analyzed by a computer, the first layer pattern is extracted as an execution reference, the ink-jet printer is controlled to print a circuit pattern on the surface of a carrier plate 005 by using conductive ink, a non-conductive pattern area is printed by using insulating resin ink, and the veneer layer is formed after hot-pressing leveling, thermocuring or photocuring treatment;
S4, stacking the board layers, selecting a second layer of pattern in the groups as an execution reference through a computer, controlling an ink-jet printer to print the circuit pattern on the basis of the single board layers by using conductive ink, printing a non-conductive pattern area by using insulating resin ink, and after hot-pressing leveling, thermocuring or photocuring treatment, generating a single board layer on the cured single board layer again to combine the single board layer and the stacked board layer;
S5, forming a module, repeating the operation of the step S4 to finish printing all the patterns in the group one by one, generating a circuit board module with a multilayer structure, and simultaneously generating a plurality of circuit board modules by a plurality of ink jet printers;
S3, preprocessing a prepreg 004, selecting the prepreg 004 meeting the design requirement size of the circuit board makeup, and positioning and drilling by referring to the structures of two adjacent circuit board modules;
S4, spraying the prepreg 004, and filling the conductive ink in the through hole by ink jet according to the pattern design of the layer where the prepreg 004 is located;
And S5, pressing, namely arranging the circuit board modules according to the grouping sequence of the circuit board layer structures, adding a prepreg 004 between every two adjacent circuit board modules as a supporting medium, and performing a pressing process after typesetting to finally obtain a finished circuit board.
further, in the step S5, after printing all the patterns in the group is completed and the generated laminated board layer is finally cured, the carrier board 005 is removed, and only the circuit board module generated by spraying is left for standby.
further, in the steps S3 and S4, solder resist ink and protective ink are used for ink-jet printing of the patterns on the entire surface of the circuit board structure.
further, characters, marks and patterns are subjected to ink-jet printing on the surface of the finished circuit board by using character ink.
And further, carrying out appearance processing on the finished circuit board.
further, the carrier plate 005 may be made of paper, metal, glass, ceramic, or resin.
Further, the carrier plate 005 is a solid layer structure plate formed by curing ink, and after the circuit board module is constructed, the ink layer serving as the carrier plate 005 can be washed away by using liquid medicine, so that the carrier plate 005 can be removed without damaging the structure of the circuit board module.
Furthermore, the circuit board modules are grouped according to the circuit board structure patterns referred by the circuit board modules, and a conductive layer, an insulating layer, a via hole or other circuit board structures are generated.
Further, the conducting layer thickness is 2-20um, the via height is 5-50um, the insulating layer thickness is 5-75 um.
Further, the heat curing temperature is 80-200 ℃, and the time is 2-60 minutes; the light curing type is UV light curing, and the curing time is 1-30 minutes; the hot pressing and flattening temperature is 50-100 ℃ and the pressure is 1-50 KG.
The working principle of the invention is as follows: the improved structure has the advantages that the improved structure is improved on the basis of the existing layer-by-layer ink-jet technology, each module forming the circuit board main body is manufactured in a mode that a plurality of ink-jet printers work simultaneously and work is divided into different modes, and then final finished boards are obtained through press forming of the modules, so that board manufacturing efficiency is improved exponentially, and working hours are greatly shortened. The integration of the traditional process and the emerging process can be realized on the basis of the process, the board layer generated by ink-jet printing is combined with the prepreg 004 layer, and the glass fiber net in the prepreg 004 can be hardened to form a supporting structure for the whole circuit board while the modules are combined through high temperature and high pressure generated in the pressing process. The mechanical strength of the finished board is effectively improved, and the problems that the circuit board is deformed by heating and the electronic device is unstable due to a soft board body are solved.
The invention combines the practical example of simultaneous processing of three ink-jet printers, and the total number of circuit patterns of each layer of the circuit board is nine.
Firstly, selecting three carrier plates 005 which have the same size and meet the design requirement of circuit board makeup, and respectively putting the carrier plates into three ink-jet printers; and the data is divided in advance, and nine circuit patterns of nine layers in total are grouped by grouping adjacent three patterns. The No. 1, the No. 2 and the No. 3 are taken as a first group and are conveyed to a computer of a first ink-jet printer; no. 4, No. 5 and No. 6 are second groups and are conveyed to a computer of a second ink-jet printer; the third set of nos. 7, 8, and 9 was fed to the computer of the third inkjet printer.
The three ink-jet printers work simultaneously, and respectively manufacture the board layer patterns corresponding to the first numbered patterns in the respective groups, namely the first ink-jet printer selects the No. 3 pattern as a first execution reference, the corresponding circuit patterns in the No. 3 pattern are printed out by using conductive ink on the surface of the carrier plate 005, the non-conductive pattern areas are printed out by using insulating resin ink, and after hot-pressing leveling, thermocuring or photocuring treatment, the single board layer represented by the No. 3 pattern is formed.
The second inkjet printer selects the No. 6 pattern as a first execution reference, prints the corresponding circuit pattern in the No. 6 pattern on the surface of the carrier plate 005 by using conductive ink, prints the non-conductive pattern area by using insulating resin ink, and forms a veneer layer represented by the No. 6 pattern after hot-pressing leveling, thermocuring or photocuring treatment.
And the third ink-jet printer selects the No. 9 pattern as a first execution reference, prints the corresponding circuit pattern in the No. 9 pattern on the surface of the carrier plate 005 by using conductive ink, prints the non-conductive pattern area by using insulating resin ink, and forms the veneer layer represented by the No. 9 pattern after hot-pressing leveling, thermocuring or photocuring treatment.
And after the single board layers of the first layer, which are respectively responsible for the three ink-jet printers, are manufactured, generating a second layer on the basis of the single board layers, and obtaining a laminated board layer. The first ink-jet printer selects the No. 2 graph as a second execution reference, ink-jet printing is carried out on the surface of the veneer layer shown by the No. 3 graph to generate the veneer layer shown by the No. 2 graph, and the veneer layer are combined to form a superposed veneer layer.
and the second ink-jet printer selects the No. 5 graph as a second execution reference, performs ink-jet printing on the surface of the veneer layer shown by the No. 6 graph to generate the veneer layer shown by the No. 5 graph, and the veneer layer and the laminated veneer layer are combined to form a laminated veneer layer.
And the third ink-jet printer selects the No. 8 graph as a second execution reference, performs ink-jet printing on the surface of the veneer layer represented by the No. 9 graph to generate the veneer layer represented by the No. 8 graph, and combines the veneer layer represented by the No. 8 graph and the laminated veneer layer to form a laminated veneer layer.
And repeating the operation again, wherein the first ink-jet printer selects the No. 1 graph as a third execution reference, performs ink-jet printing on the surface of the veneer layer represented by the No. 2 graph to generate the veneer layer represented by the No. 1 graph, and combines the No. 1 graph, the No. 2 graph and the No. 3 graph to form the first circuit board module 001.
The second inkjet printer selects the No. 4 pattern as a third execution reference, performs inkjet printing on the surface of the veneer layer presented by the No. 5 pattern to generate the veneer layer presented by the No. 4 pattern, and combines the No. 4, the No. 5 and the No. 6 to form a second circuit board module 002.
the third ink jet printer selects the No. 7 graph as a third execution reference, carries out ink jet printing on the surface of the veneer layer presented by the No. 8 graph to generate the veneer layer presented by the No. 7 graph, and combines the No. 7, the No. 8 and the No. 9 to form a third circuit board module 003.
The prepreg 004 is subjected to a separate pretreatment process while the module is manufactured. Firstly, cutting is carried out according to the size meeting the design requirement of circuit board makeup, and then drilling processing is carried out according to the circuit requirement and the circuit pattern shapes of the two modules to be spliced on the two sides of the prepreg 004. And the CCD positioning technology is adopted to avoid the occurrence of deviation. After the through holes are drilled in the prepreg 004, the through holes are filled in an ink-jet mode. The filler is conductive ink, and the preparation work of the prepreg 004 is completed after the conductive ink is cured.
and sequencing the prepreg 004 and the three circuit board modules according to a circuit structure, wherein the No. 3 graphic board layer of the first module is adjacent to the No. 4 graphic board layer of the second module, and the No. 6 graphic board layer of the second module is adjacent to the No. 7 graphic board layer of the third module. The prepreg 004 is inserted into one of the two gaps according to a reasonable design, or one layer of the prepreg 004 is inserted into each of the two gaps.
And (3) sequentially stacking the three circuit board modules and the prepreg 004 in a laminating machine, and starting a laminating process after typesetting and aligning. Finally obtaining the finished circuit board.
the carrier plate 005 is used as a carrier medium for forming the module, and can be removed directly after the module is manufactured. The carrier plate 005 having a special function can be retained. The material of the carrier plate 005 can be one of paper, metal, glass, ceramic or resin material. However, the material selected in the present invention is a solid structural plate formed by curing ink. The design has the advantage that module construction is carried out on the surface of the solid ink layer by using the principle of a silk-screen process. The carrier plate 005 can be cleaned with a liquid medicine to remove the solid ink layer without any trace after the module is built. The integrity and high precision of the module can be guaranteed to the maximum extent. Playing an excellent bedding effect in the subsequent pressing and splicing process.
No. 1 and No. 9 are used as two outermost layer patterns of the circuit board, and filling materials in the patterns are solder resist ink and protective ink which are used for circuit board protection and solder resist protection. And after the solder resist ink and the protective ink are cured, spraying a layer of character ink for marking characters, marks and figures.
In each model, pattern slabs having different functions are formed according to the pattern groups. For example, the veneer layer represented by pattern No. 3 is a conductive layer, and the veneer layer represented by pattern No. 4 is an insulating layer. The position of the margin of the No. 3 pattern corresponds to the position of the margin of the No. 4 pattern, and the margin of the No. 3 pattern and the margin of the No. 4 pattern are combined to form a buried hole or a through hole penetrating through the No. 3 veneer layer and the No. 4 veneer layer.
other processing parameters in this example are: the thickness of the conductive layer is 2-20um, the height of the via hole is 5-50um, and the thickness of the insulating layer is 5-75 um. The thermosetting temperature is 80-200 ℃ and the time is 2-60 minutes; the light curing type is UV light curing, and the curing time is 1-30 minutes; the hot pressing and flattening temperature is 50-100 ℃ and the pressure is 1-50 KG.
finally, the appearance of the finished circuit board is processed to complete the manufacture of the whole board body.
The invention has the beneficial effects that: the advantage that has combined traditional technology and inkjet technology is when promoting the board manufacturing efficiency and reduce man-hour loss, has compromise the mechanical strength of plate body. The use problem caused by insufficient mechanical strength of the plate body is avoided.
The above-mentioned embodiments only represent several embodiments of the core technical attack of the large data server system suite based on the purley platform, and the description thereof is specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A full ink-jet manufacturing method of a circuit board is characterized by comprising the following steps:
S1, manufacturing a carrier plate, selecting a plurality of carrier plates with the same size and meeting the design requirement of circuit board makeup, and respectively putting the carrier plates into a plurality of ink-jet printers;
S2, splitting data, grouping the structures of the layers of the circuit board and inputting the grouped structures into computers matched with different ink-jet printers respectively, so that the ink-jet printers can simultaneously manufacture different layer structures;
S3, manufacturing a veneer layer, in any ink-jet printer, analyzing each veneer layer graph in the group through a computer, extracting the first layer graph as an execution reference, controlling the ink-jet printer to print the circuit graph on the surface of the carrier plate by using conductive ink, printing the non-conductive graph area by using insulating resin ink, and forming the veneer layer after hot-pressing leveling, thermocuring or photocuring treatment;
s4, stacking the board layers, selecting a second layer of pattern in the groups as an execution reference through a computer, controlling an ink-jet printer to print the circuit pattern on the basis of the single board layers by using conductive ink, printing a non-conductive pattern area by using insulating resin ink, and after hot-pressing leveling, thermocuring or photocuring treatment, generating a single board layer on the cured single board layer again to combine the single board layer and the stacked board layer;
S5, forming a module, repeating the operation of the step S4 to finish printing all the patterns in the group one by one, generating a circuit board module with a multilayer structure, and simultaneously generating a plurality of circuit board modules by a plurality of ink jet printers;
S6, preprocessing a prepreg, selecting the prepreg which meets the design requirement size of circuit board makeup, and positioning and drilling according to the structures of two adjacent circuit board modules;
S7, spraying a prepreg, and filling conductive ink in the through hole by ink jet according to the pattern design of the layer where the prepreg is located;
And S8, pressing, namely arranging the circuit board modules according to the grouping sequence of the circuit board layer structures, adding a prepreg between every two adjacent circuit board modules as a supporting medium, and performing a pressing process after typesetting to finally obtain a finished circuit board.
2. The full inkjet manufacturing method of circuit board according to claim 1, wherein: in the step S5, after printing all the patterns in the group is completed and the generated laminated board layer is finally cured, the carrier board is removed, and only the circuit board module generated by spraying is left for standby.
3. The full inkjet manufacturing method of circuit board according to claim 1, wherein: in the steps S3 and S4, solder resist ink and protective ink are adopted when the patterns on the surface layer of the whole circuit board structure are printed by ink jet.
4. The full inkjet manufacturing method of circuit board according to claim 1, wherein: and carrying out ink-jet printing on characters, marks and patterns on the surface of the finished circuit board by using character ink.
5. The full inkjet manufacturing method of circuit board according to claim 1, wherein: and (5) processing the appearance of the finished circuit board.
6. The full inkjet manufacturing method of circuit board according to claim 1, wherein: the carrier plate can be made of paper, metal, glass, ceramic or resin materials.
7. The full inkjet manufacturing method of circuit board according to claim 1, wherein: the support plate is a solid layer structure plate formed by curing ink, after the circuit board module is constructed, the ink layer serving as the support plate can be washed away by liquid medicine, and the support plate can be removed under the condition that the structure of the circuit board module is not damaged.
8. The full inkjet manufacturing method of circuit board according to claim 1, wherein: the circuit board modules are grouped according to the circuit board structure patterns referred by the circuit board modules, and a conductive layer, an insulating layer, a via hole or other circuit board structures are generated.
9. The full inkjet manufacturing method of circuit board according to claim 8, wherein: the conducting layer thickness is 2-20um, the via height is 5-50um, the insulating layer thickness is 5-75 um.
10. The full inkjet manufacturing method of circuit board according to claim 1, wherein: the thermosetting temperature is 80-200 ℃ and the time is 2-60 minutes; the light curing type is UV light curing, and the curing time is 1-30 minutes; the hot pressing and flattening temperature is 50-100 ℃ and the pressure is 1-50 KG.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910731799.4A CN110557896A (en) | 2019-08-08 | 2019-08-08 | Full ink-jet manufacturing method of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910731799.4A CN110557896A (en) | 2019-08-08 | 2019-08-08 | Full ink-jet manufacturing method of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110557896A true CN110557896A (en) | 2019-12-10 |
Family
ID=68737191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910731799.4A Pending CN110557896A (en) | 2019-08-08 | 2019-08-08 | Full ink-jet manufacturing method of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110557896A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114434963A (en) * | 2020-10-30 | 2022-05-06 | 深圳市汉森软件有限公司 | Printing method, device and equipment for PCB oil plugging hole and storage medium |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101146407A (en) * | 2006-09-15 | 2008-03-19 | 李东明 | Graph transfer shaping technology for carrier board circuit of printed circuit board |
| US20100060680A1 (en) * | 2008-09-10 | 2010-03-11 | Samsung Electro-Mechanics Co., Ltd. | Method of printing line by using inkjet apparatus |
| CN103200782A (en) * | 2013-04-18 | 2013-07-10 | 汕头超声印制板（二厂）有限公司 | Manufacturing method of full-inkjet printed-circuit board |
| CN103974547A (en) * | 2012-12-25 | 2014-08-06 | 北京中科纳通科技有限公司 | Printed circuit board manufacturing method adopting ink-jet technology |
| CN107105577A (en) * | 2017-04-17 | 2017-08-29 | 复旦大学 | It is a kind of to prepare two-sided and multilayer printed circuit template shifting process |
-
2019
- 2019-08-08 CN CN201910731799.4A patent/CN110557896A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101146407A (en) * | 2006-09-15 | 2008-03-19 | 李东明 | Graph transfer shaping technology for carrier board circuit of printed circuit board |
| WO2008034312A1 (en) * | 2006-09-15 | 2008-03-27 | Dongming Li | Fabrication method of a printed circuit board |
| US20100060680A1 (en) * | 2008-09-10 | 2010-03-11 | Samsung Electro-Mechanics Co., Ltd. | Method of printing line by using inkjet apparatus |
| CN103974547A (en) * | 2012-12-25 | 2014-08-06 | 北京中科纳通科技有限公司 | Printed circuit board manufacturing method adopting ink-jet technology |
| CN103200782A (en) * | 2013-04-18 | 2013-07-10 | 汕头超声印制板（二厂）有限公司 | Manufacturing method of full-inkjet printed-circuit board |
| CN107105577A (en) * | 2017-04-17 | 2017-08-29 | 复旦大学 | It is a kind of to prepare two-sided and multilayer printed circuit template shifting process |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114434963A (en) * | 2020-10-30 | 2022-05-06 | 深圳市汉森软件有限公司 | Printing method, device and equipment for PCB oil plugging hole and storage medium |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100276193B1 (en) | Printed circuit board, ic card and fabricating method thereof | |
| US7705247B2 (en) | Built-up printed circuit board with stack type via-holes | |
| CN101668389B (en) | Method for making high alignment printed circuit board | |
| CN105291588A (en) | High-speed printed circuit board character jet printing machine with double work platforms and operation method of high-speed printed circuit board character jet printing machine | |
| CN109451665B (en) | Manufacturing process of photoelectric plate | |
| WO2019196221A1 (en) | 3d printing method for circuit board | |
| CN103200782A (en) | Manufacturing method of full-inkjet printed-circuit board | |
| US8265445B2 (en) | Printed circuit board for optical waveguide and method of manufacturing the same | |
| KR20080003396A (en) | Generic patterned conductor for customizable electronic devices | |
| CN103974547A (en) | Printed circuit board manufacturing method adopting ink-jet technology | |
| CN110557896A (en) | Full ink-jet manufacturing method of circuit board | |
| JPWO2014041670A1 (en) | Electronic device manufacturing apparatus and manufacturing method thereof | |
| KR101539355B1 (en) | 3-dimension Rapid prototyping equipment for making printed circuit board and forming methods thereby | |
| CN1886034B (en) | Printed circuit board using convex point and manufacturing method thereof | |
| JP2009130156A (en) | Ceramic multilayer substrate and method of producing ceramic multilayer substrate | |
| CN101528002A (en) | Method for manufacturing a printed-wiring board having resistive element inside | |
| TWI400016B (en) | Laminated substrate and the producing method thereof | |
| CN112654180A (en) | Method and machine for manufacturing multilayer circuit board | |
| CN110392480B (en) | Printed circuit board and method for manufacturing the same | |
| KR100770168B1 (en) | Fabricating method for circuit board | |
| JP2011138890A (en) | Substrate with built-in components and manufacturing method thereof | |
| CN108495485A (en) | A kind of multilayer board insertion resistance production method | |
| US20240064897A1 (en) | Pcb production by laser systems | |
| JP4637389B2 (en) | Manufacturing method of multilayer wiring board | |
| JPH10126058A (en) | Manufacture of multilayered printed interconnection board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| CB02 | Change of applicant information |
Address after: 510730 No. 22, Ying Ying Road, Guangzhou Free Trade Zone, Guangzhou, Guangdong Applicant after: Guangzhou Guanghe Technology Co., Ltd Address before: 510730 No. 22, Ying Ying Road, Guangzhou Free Trade Zone, Guangzhou, Guangdong Applicant before: DELTON TECHNOLOGY (GUANGZHOU) Inc. |
|
| CB02 | Change of applicant information | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |