CN103974547A - Printed circuit board manufacturing method adopting ink-jet technology - Google Patents
Printed circuit board manufacturing method adopting ink-jet technology Download PDFInfo
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- CN103974547A CN103974547A CN201210567693.3A CN201210567693A CN103974547A CN 103974547 A CN103974547 A CN 103974547A CN 201210567693 A CN201210567693 A CN 201210567693A CN 103974547 A CN103974547 A CN 103974547A
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Abstract
The invention discloses a printed circuit board manufacturing method adopting an ink-jet technology and relates to manufacturing of multi-layer circuit boards. The method is completed based on a multi-nozzle and multi-channel ink-jet printing device. The method specifically includes the following steps that firstly, corresponding nanometer material ink is placed in ink boxes corresponding to all channels according to materials used for manufacturing a printed circuit board; secondly, layering processing is conducted on graph and material data of the whole manufactured printed circuit board through software; finally, the different graph and material data are conveyed to corresponding nozzles through a computer, layer-by-layer accumulation functional ink-jet module printing is then conducted on X-Y-Z planes, and therefore the circuit board is manufactured. The printed circuit board manufacturing method is simple in manufacturing process, friendly to the environment, free of pollution, capable of avoiding waste of a large amount of resources, and capable of easily, conveniently and fast manufacturing the circuit board.
Description
Technical field
The present invention relates to a kind of manufacture method of the printed circuit board that utilizes ink-jet technology, espespecially the manufacture of multilayer printed circuit board.
Technical background
Printed circuit board, claims again printed circuit board (PCB), printed substrate, and often using english abbreviation PCB (Printed circuitboard) is important electronic unit, is the supporter of electronic component, is the supplier of electronic devices and components connection.Traditional circuit board, adopts the method for printing etching resist, makes circuit and the drawing of circuit, is therefore called as printed circuit board (PCB) or printed substrate.Because the continuous microminiaturization of electronic product is with becoming more meticulous, the increase of integrated antenna package density, has caused the high concentration of interconnection line, and this makes the application of multilayer circuit board more and more wider.
The manufacture craft of the multilayer circuit board of most is substantially: etch inner figure (comprise signals layer, bus plane, king's layer), then pass through Darkening process, it is (outer with Copper Foil or copper-clad plate that lamination is carried out in heating pressurization afterwards, middle with semi-solid preparation tablet inner plating), then boring, etchback or decyclization oxygen are stained etc. the operation of series of complex, not only efficiency is very low, and has caused a large amount of wastings of resources and environmental pollution.
Summary of the invention
In view of the foregoing, the invention provides a kind of method for manufacturing printed circuit board of simple, novel, environmental protection.The method is that multichannel ink jet printing device completes based on the many shower nozzles of one; By figure and the material data of the monoblock printed circuit board of required making, carry out layering processing by software, and by computer, different materials graph data is flowed to corresponding shower nozzle, the more functional ink spray module printing of successively piling up at X-Y-Z face, realize the making of multilayer circuit board.
The present invention realizes in the following way:
1) on print platform, generate corresponding graph data according to the shape of circuit board and size, by ink jet printing device, coordinate the water miscible substrate of ink jet-printing one deck of respective material;
2) after dry solidification at the bottom of aqueous base, then according to the figure of monoblock printed circuit board and material data, based on the principle of discrete/accumulation, successively pile up, until complete the making substantially of printed circuit board;
3) after circuit board dry solidification to be printed, cleared up water-soluble substrate by clear water, dried;
4) resetting, on print platform, according to the solder mask pattern data information of top layer and bottom, then continues top layer and the bottom of spray printing one deck insulation solder mask at circuit board;
5) after dry, then the graph text information spray printing of top layer and bottom character layer is got on, complete multilayer printed circuit board all process steps.
The present invention has following beneficial effect:
1) the relative manufacturing process of traditional circuit-board, preparation flow of the present invention is simple, and environmental protection, pollution-free, has avoided the waste of ample resources, realized easy, fast make circuit board.
2) the present invention can realize single sided board, double sided board, multiple-plate making; Also can realize in rigid plate, flex plate, makes circuit board in rigid-flex board material,
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention; technical scheme in the embodiment of the present invention is clearly and completely described; obviously; described embodiment is only the present invention's part embodiment; instead of whole embodiment; based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtaining under creative work prerequisite, belong to the scope of protection of the invention.
Embodiment 1:
The first step, as shown in Figure 1, by the shower nozzle of nanometer base material ink is housed, makes circuit board region at print platform and sprays in advance last layer water-soluble base material, thickness 1-2mm.The object of this layer is in order to prevent that print platform from directly contacting with made circuit board.
Bis-Walk, after water-soluble base material dry solidification, then according to the figure of monoblock printed circuit board and material data, by processing and the transmission of computer software, is transported to the graph text information data corresponding with material in the shower nozzle of respective material.As shown in Figure 2, when the inkjet-fabricated circuit board of circuit board, the nano ink and the nano ink corresponding region of spray printing respectively that conducting medium is housed of dielectric is housed.Require design according to the number of plies of circuit board, successively accumulation, stack, until the making of completing circuit plate.
Tri-Walk, has cleared up after water-soluble substrate, respectively by the shower nozzle and the shower nozzle that character layer ink is housed of solder mask ink are housed, and according to its graph text information, as shown in Figure 3, at circuit board bottom and the corresponding ink of region spray printing corresponding to top layer.
Above three steps, have completed the making of multilayer circuit board.
Claims (4)
1. a manufacture method of utilizing the printed circuit board of ink-jet technology, is characterized in that, the method comprises the following steps:
1) on print platform, generate corresponding graph data according to the shape of circuit board and size, by ink jet printing device, coordinate the water miscible substrate of ink jet-printing one deck of respective material;
2) after dry solidification at the bottom of aqueous base, then according to the figure of monoblock printed circuit board and material data, based on the principle of discrete/accumulation, successively pile up, until complete the making substantially of printed circuit board;
3) after circuit board dry solidification to be printed, cleared up water-soluble substrate by clear water, dried;
4) resetting, on print platform, according to the solder mask pattern data information of top layer and bottom, then continues top layer and the bottom of spray printing one deck insulation solder mask at circuit board;
5) after dry, then the graph text information spray printing of top layer and bottom character layer is got on, complete multilayer printed circuit board all process steps.
2. the manufacture method of the printed circuit board that utilizes ink-jet technology according to claim 1, is characterized in that, described step 2) in multilayer printed circuit board manufacture method be:
A), according to the figure of designed printed circuit board, by software processing, the dissociation of graphic and data corresponding to a kind of material out, by computer, transfer of data is arrived to the shower nozzle of respective material;
B) many shower nozzles, multichannel printing device;
C) printed circuit board of different size, corresponding composition material is not identical yet, thus the ink of variety classes nano material is housed in the different passage of this equipment, can be for the making of different materials circuit board;
D) by the principle of discrete/accumulation, successively spray printing, according to material graph data, the ink of zones of different spray printing different materials, successively accumulation, the general structure of formation printed circuit board.
3. multilayer printed circuit board manufacture method according to claim 2, is characterized in that described step 4) in the spray printing preparation method that forms circuit board insulation solder mask be:
A) in sprayer channel, put into welding resistance ink;
B) according to printed circuit board top layer and bottom solder mask graph text information, respectively at top layer and the corresponding welding resistance ink layer of bottom spray printing;
C) solidify.
4. the method that forms circuit board insulation solder mask by spray printing according to claim 3, it is characterized in that, described step b) middle spray printing solder mask comprises that spray printing is to top layer and the bottom of printed circuit board respectively, and full addition is printed, and wraps up high-precision pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210567693.3A CN103974547A (en) | 2012-12-25 | 2012-12-25 | Printed circuit board manufacturing method adopting ink-jet technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210567693.3A CN103974547A (en) | 2012-12-25 | 2012-12-25 | Printed circuit board manufacturing method adopting ink-jet technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103974547A true CN103974547A (en) | 2014-08-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201210567693.3A Pending CN103974547A (en) | 2012-12-25 | 2012-12-25 | Printed circuit board manufacturing method adopting ink-jet technology |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104228342A (en) * | 2014-08-15 | 2014-12-24 | 中国科学院重庆绿色智能技术研究院 | Wiring system and method based on ink-jet printing and selective laser melting |
| CN106507579A (en) * | 2016-11-30 | 2017-03-15 | 上海摩软通讯技术有限公司 | Integrated circuit board manufacturing method and device based on 3D printing technique |
| CN106994511A (en) * | 2016-01-26 | 2017-08-01 | 精工爱普生株式会社 | The three-dimensional manufacture method and function element tectosome of function element tectosome |
| CN108541146A (en) * | 2018-04-24 | 2018-09-14 | 珠海元盛电子科技股份有限公司 | A kind of fully-additive process technology of full printing single layer FPC |
| CN110139491A (en) * | 2019-06-11 | 2019-08-16 | 北京大华博科智能科技有限公司 | A kind of circuit board preparation method and circuit board |
| CN110557896A (en) * | 2019-08-08 | 2019-12-10 | 广合科技（广州）有限公司 | Full ink-jet manufacturing method of circuit board |
| CN110588175A (en) * | 2019-08-29 | 2019-12-20 | 深圳市汉森软件有限公司 | Printing control method, device and equipment for PCB characters and storage medium |
| CN110605917A (en) * | 2019-08-29 | 2019-12-24 | 深圳市汉森软件有限公司 | Printing control method, device and equipment for PCB characters and storage medium |
| CN112654180A (en) * | 2020-12-11 | 2021-04-13 | 杨同建 | Method and machine for manufacturing multilayer circuit board |
| CN113492584A (en) * | 2020-03-19 | 2021-10-12 | 深圳市汉森软件有限公司 | Ink-jet printing method, device and equipment for PCB characters and storage medium |
-
2012
- 2012-12-25 CN CN201210567693.3A patent/CN103974547A/en active Pending
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104228342B (en) * | 2014-08-15 | 2017-03-08 | 中国科学院重庆绿色智能技术研究院 | Wiring system and method based on inkjet printing and selective laser melting |
| CN104228342A (en) * | 2014-08-15 | 2014-12-24 | 中国科学院重庆绿色智能技术研究院 | Wiring system and method based on ink-jet printing and selective laser melting |
| CN106994511B (en) * | 2016-01-26 | 2021-02-05 | 精工爱普生株式会社 | Three-dimensional manufacturing method for functional element structure, and functional element structure |
| CN106994511A (en) * | 2016-01-26 | 2017-08-01 | 精工爱普生株式会社 | The three-dimensional manufacture method and function element tectosome of function element tectosome |
| CN106507579A (en) * | 2016-11-30 | 2017-03-15 | 上海摩软通讯技术有限公司 | Integrated circuit board manufacturing method and device based on 3D printing technique |
| CN108541146A (en) * | 2018-04-24 | 2018-09-14 | 珠海元盛电子科技股份有限公司 | A kind of fully-additive process technology of full printing single layer FPC |
| CN110139491A (en) * | 2019-06-11 | 2019-08-16 | 北京大华博科智能科技有限公司 | A kind of circuit board preparation method and circuit board |
| CN110557896A (en) * | 2019-08-08 | 2019-12-10 | 广合科技（广州）有限公司 | Full ink-jet manufacturing method of circuit board |
| CN110605917A (en) * | 2019-08-29 | 2019-12-24 | 深圳市汉森软件有限公司 | Printing control method, device and equipment for PCB characters and storage medium |
| CN110588175B (en) * | 2019-08-29 | 2020-12-25 | 深圳市汉森软件有限公司 | Printing control method, device and equipment for PCB characters and storage medium |
| CN110588175A (en) * | 2019-08-29 | 2019-12-20 | 深圳市汉森软件有限公司 | Printing control method, device and equipment for PCB characters and storage medium |
| CN110605917B (en) * | 2019-08-29 | 2021-03-16 | 深圳市汉森软件有限公司 | Printing control method, device and equipment for PCB characters and storage medium |
| CN113492584A (en) * | 2020-03-19 | 2021-10-12 | 深圳市汉森软件有限公司 | Ink-jet printing method, device and equipment for PCB characters and storage medium |
| CN113492584B (en) * | 2020-03-19 | 2022-10-21 | 深圳市汉森软件有限公司 | Ink-jet printing method, device and equipment for PCB characters and storage medium |
| CN112654180A (en) * | 2020-12-11 | 2021-04-13 | 杨同建 | Method and machine for manufacturing multilayer circuit board |
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Application publication date: 20140806 |
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