CN110552053B - Automatic internal circulation and flow control water plating device - Google Patents
Automatic internal circulation and flow control water plating device Download PDFInfo
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- CN110552053B CN110552053B CN201910994420.9A CN201910994420A CN110552053B CN 110552053 B CN110552053 B CN 110552053B CN 201910994420 A CN201910994420 A CN 201910994420A CN 110552053 B CN110552053 B CN 110552053B
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- copper film
- pool
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- 238000007747 plating Methods 0.000 title claims abstract description 36
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 11
- 239000007788 liquid Substances 0.000 claims abstract description 201
- 239000010936 titanium Substances 0.000 claims abstract description 74
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 74
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 72
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 64
- 239000010949 copper Substances 0.000 claims abstract description 64
- 229910052802 copper Inorganic materials 0.000 claims abstract description 64
- 238000009713 electroplating Methods 0.000 claims abstract description 37
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims abstract description 27
- 229910001431 copper ion Inorganic materials 0.000 claims abstract description 27
- 238000005507 spraying Methods 0.000 claims description 35
- 239000003792 electrolyte Substances 0.000 abstract description 28
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 12
- 238000007599 discharging Methods 0.000 description 11
- 230000008569 process Effects 0.000 description 6
- 239000007921 spray Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 238000005086 pumping Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000011176 pooling Methods 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/16—Regeneration of process solutions
- C25D21/18—Regeneration of process solutions of electrolytes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0685—Spraying of electrolyte
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses an automatic internal circulation and flow control water plating device, wherein in a pool entering area, the inner side and the outer side of a copper film are respectively provided with a first inner liquid inlet pipe and a first outer liquid inlet pipe, the liquid of the first inner liquid inlet pipe passes through a second pool entering titanium blue to reach the inner side surface of the copper film, and the liquid flowing out of the first outer liquid inlet pipe passes through the first pool entering titanium blue to reach the outer side surface of the copper film; in the cell outlet area, the inner side and the outer side of the copper film are provided with a second inner liquid inlet pipe and a second outer liquid inlet pipe, the liquid of the second inner liquid inlet pipe passes through the second cell outlet titanium blue to reach the inner surface of the copper film, and the liquid flowing out of the second outer liquid inlet pipe passes through the first cell outlet titanium blue to reach the outer surface of the copper film; the inner side of the copper film is provided with a second outlet tank titanium blue and a second inner liquid inlet pipe, and the upper side edge of the electroplating tank is provided with a liquid return tank with a copper ion concentration detector. The invention effectively solves the problem that the electrolyte circulates unevenly in the plating solution tank, the flow direction of the electrolyte can be flexibly regulated by the guide plate, and the system can also regulate the current according to the thickness of the copper film by real-time feedback.
Description
Technical Field
The invention relates to the technical field of automatic production equipment, in particular to a water plating device with automatic internal circulation and flow control.
Background
In an automated production line of lithium batteries, it is necessary to perform an electroplating operation on a copper film using a plating bath. In the prior art, along with the tape running of a copper film, corresponding electroplating areas are formed through different copper ion concentrations of titanium blue, and in order to realize the movement of copper ions, a traditional method adopts a pumping external circulation system for control. Specifically, an external pump is adopted to pump out electrolyte in the tank, then the electrolyte is refluxed into the titanium blue, and the electrolyte with high copper ion content in the titanium blue is circulated to other areas in the tank.
However, the structure needs to additionally add a pumping device, the volume and the corresponding cost of the product are increased, meanwhile, the flow direction is easily inconsistent in the mode, the concentration of electrolyte in the cell is regionally uneven, and then turbulence in the cell is caused; but also affects the stability of the copper film in the pond.
The defects are worth solving.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides an automatic internal circulation and flow control water plating device.
The technical scheme of the invention is as follows:
An automatic internal circulation and flow control water plating device comprises an electroplating pool, wherein a steering conductive roller is arranged in the electroplating pool, a copper film bypasses the steering conductive roller and goes out of the pool after entering the electroplating pool, the automatic internal circulation and flow control water plating device is characterized in that the left side and the right side of the electroplating pool are respectively provided with a pool entering area and a pool exiting area which are symmetrical,
In the pond entering area, a first pond entering titanium blue and a first outer liquid inlet pipe are arranged on the outer side of the copper film, liquid flowing out of the first outer liquid inlet pipe passes through the first pond entering titanium blue to reach the outer side surface of the copper film, a second pond entering titanium blue and a first inner liquid inlet pipe are arranged on the inner side of the copper film, and liquid flowing out of the first inner liquid inlet pipe passes through the second pond entering titanium blue to reach the inner side surface of the copper film;
in the pool outlet area, a first pool outlet titanium blue and a second outer liquid inlet pipe are arranged on the outer side of the copper film, liquid flowing out of the second outer liquid inlet pipe passes through the first pool outlet titanium blue to reach the outer side surface of the copper film, a second pool outlet titanium blue and a second inner liquid inlet pipe are arranged on the inner side of the copper film, and liquid flowing out of the second inner liquid inlet pipe passes through the second pool outlet titanium blue to reach the inner side surface of the copper film;
The upper side edge of the electroplating tank is provided with a liquid return tank, a plurality of copper ion concentration detectors are arranged in the liquid return tank, and the copper ion concentration detectors are connected with proportional valves at the inlets of all liquid inlet pipes through a closed-loop control system.
The invention according to the scheme is characterized in that the steering conductive roller is positioned at the junction of the pond-in area and the pond-out area.
According to the scheme, the electroplating device is characterized in that the inlet of the electroplating tank is provided with the in-tank conductive roller, the in-tank conductive roller comprises a first in-tank conductive roller and a second in-tank conductive roller, the rotation directions of the first in-tank conductive roller and the second in-tank conductive roller are opposite, and the electroplating tank is filled after the first in-tank conductive roller and the second in-tank conductive roller pass through.
According to the scheme, the electroplating device is characterized in that the outlet of the electroplating tank is provided with the out-of-tank conductive roller, the out-of-tank conductive roller comprises a first out-of-tank conductive roller and a second out-of-tank conductive roller, the rotation directions of the first out-of-tank conductive roller and the second out-of-tank conductive roller are opposite, and the electroplating tank is penetrated after the first out-of-tank conductive roller and the second out-of-tank conductive roller pass through.
The invention according to the above scheme is characterized in that the first outer liquid inlet pipe, the first inner liquid inlet pipe, the second outer liquid inlet pipe and the second inner liquid inlet pipe are all pure titanium pipes.
The invention according to the above scheme is characterized in that the first outer liquid inlet pipe, the first inner liquid inlet pipe, the second outer liquid inlet pipe and the second inner liquid inlet pipe are respectively provided with a plurality of liquid spraying holes, and the aperture of each liquid spraying hole is reduced along with the increase of the distance between each liquid spraying hole and the corresponding proportional valve, and the distance between two adjacent liquid spraying holes is also reduced along with the increase of the distance between each liquid spraying hole and the corresponding proportional valve.
According to the scheme, the invention is characterized in that a first guide plate is further arranged in the pond entering area, the first guide plate corresponds to the position of the first outer liquid inlet pipe, and the first guide plate guides the liquid flowing out of the first outer liquid inlet pipe to the first pond entering titanium blue position.
Further, the first deflector is fixed on the electroplating pool through a first deflector shaft, and the first deflector rotates around the first deflector shaft.
Further, a first outer pipe liquid spraying hole is formed in the first outer liquid inlet pipe, and faces to the rotating direction of the first guide plate.
Further, the cross section of the first guide plate is S-shaped.
Still further, the first guide plate comprises a straight section and an arc section provided with two ends of the straight section, and the first outer liquid inlet pipe is positioned on the circumferential track of the arc section.
According to the scheme, the copper film-titanium blue pond-entering device is characterized in that the first inner liquid inlet pipe is positioned between the copper film and the second pond-entering titanium blue pond, a first inner pipe liquid spraying hole is formed in the first inner liquid inlet pipe, and the first inner pipe liquid spraying hole faces to the lower side of the second pond-entering titanium blue pond.
According to the scheme, the invention is characterized in that a second guide plate is further arranged in the pool outlet region, the second guide plate corresponds to the position of the second outer liquid inlet pipe, and the second guide plate guides the liquid flowing out of the second outer liquid inlet pipe to the first pool outlet titanium blue.
Further, the second guide plate is fixed on the electroplating pool through a second guide plate shaft, and the second guide plate rotates around the second guide plate shaft.
Further, a second outer pipe liquid spraying hole is formed in the second outer liquid inlet pipe, and faces to the rotating direction of the second guide plate.
Further, the section of the second guide plate is S-shaped.
Still further, the second guide plate comprises a straight section and an arc section provided with two ends of the straight section, and the second outer liquid inlet pipe is positioned on the circumferential track of the arc section.
According to the scheme, the copper film-titanium blue-discharging device is characterized in that the second inner liquid inlet pipe is positioned between the copper film and the second titanium blue-discharging tank, a second inner pipe liquid spraying hole is formed in the second inner liquid inlet pipe, and the second inner pipe liquid spraying hole faces to the lower side of the second titanium blue-discharging tank.
According to the scheme, the method has the beneficial effects that the method adopts a mode of regional strong pressure multi-point liquid feeding and equal-height overflow liquid returning, the phenomenon that electrolyte circulates unevenly in a plating bath tank is effectively solved, the S-shaped guide plate can flexibly adjust the flow direction of the electrolyte according to the consumption of the electrolyte, the copper ion concentration detector in the overflow tank can feed back in real time according to the thickness of a copper film, and the system can adjust the current according to the feedback.
Drawings
Fig. 1 is a schematic structural view of the present invention.
Fig. 2 is a side view of the present invention.
In the figure, 111, a first in-cell conductive roller; 112. a second pond-entering conductive roller; 121. a first out-of-pool conductive roller; 122. a second out-of-pool conductive roller; 130. turning to a conductive roller;
200. An electroplating pool; 211. titanium blue is first put into the pool; 212. second pond titanium blue; 221. titanium blue is discharged from the first pond; 222. a second titanium blue outlet; 230. a first inner liquid inlet pipe; 231. a first inner tube spray orifice; 240. a first outer liquid inlet tube; 241. a first outer tube spray orifice; 250. a second outer liquid inlet tube; 251. a second outer tube spray orifice; 260. a second inner liquid inlet pipe; 261. a second inner tube spray orifice; 270. a first deflector; 271. a first deflector shaft; 280. a second deflector; 281. a second deflector shaft; 291. a left liquid return tank and a right liquid return tank; 292. left and right copper ion concentration detectors; 293. a front and a rear liquid return tanks; 294. front and rear copper ion concentration detectors;
300. A proportional valve;
400. And (5) a copper film.
Detailed Description
The invention is further described below with reference to the drawings and embodiments:
As shown in fig. 1 and 2, an automatic internal circulation and flow control water plating device comprises an electroplating tank 200, wherein the left side and the right side of the electroplating tank 200 are respectively provided with a tank inlet area and a tank outlet area which are symmetrical. The electroplating pool 200 is internally provided with a steering conductive roller 130, the copper film 400 bypasses the steering conductive roller 130 and goes out of the pool after entering the electroplating pool 200, the electroplating pool 200 is divided into an inner area and an outer area by a tape path of the copper film 400, the upper side of the copper film 400 is provided with an inner area, and the lower side of the copper film 400 is provided with an outer area. Preferably, the steering conductive roller 130 is located at the junction of the in-cell and out-cell regions, so that the entire copper film 400 moves more smoothly and smoothly.
The inlet of the electroplating pool 200 is provided with a pool-entering conductive roller, the pool-entering conductive roller comprises a first pool-entering conductive roller 111 and a second pool-entering conductive roller 112, the rotation directions of the first pool-entering conductive roller 111 and the second pool-entering conductive roller 112 are opposite, and the electroplating pool 200 is entered after passing through the first pool-entering conductive roller 111 and the second pool-entering conductive roller 112 in sequence. The outlet of the electroplating pool 200 is provided with a pool discharging conductive roller, the pool discharging conductive roller comprises a first pool discharging conductive roller 121 and a second pool discharging conductive roller 122, the rotation directions of the first pool discharging conductive roller 121 and the second pool discharging conductive roller 122 are opposite, and the electroplating pool 200 passes through the first pool discharging conductive roller 121 and the second pool discharging conductive roller 122 in sequence.
According to the invention, through the mutual matching of the first pond-entering conductive roller 111 and the second pond-entering conductive roller 112, the tensioning of the copper film 400 in the pond is realized, and meanwhile, the copper film 400 can enter a pond-entering area from a specific angle; by the mutual matching of the first out-of-pool conductive roller 121 and the second out-of-pool conductive roller 122, the tensioning of the out-of-pool of the copper film 400 is realized, and meanwhile, the copper film 400 is ensured to be out of the pool from a specific angle.
1. In the pooling zone:
The outside of the copper film 400 is provided with a first pond-entering titanium blue 211 and a first outer liquid inlet pipe 240, liquid flowing out of the first outer liquid inlet pipe 240 passes through the first pond-entering titanium blue 211 to reach the outer side surface of the copper film 400, the inside of the copper film 400 is provided with a second pond-entering titanium blue 212 and a first inner liquid inlet pipe 230, and liquid flowing out of the first inner liquid inlet pipe 230 passes through the second pond-entering titanium blue 212 to reach the inner side surface of the copper film 400.
Preferably, a first baffle 270 is further disposed in the cell-entering region, the first baffle 270 is fixed to the plating cell 200 by a first baffle shaft 271, and the first baffle 270 rotates about the first baffle shaft 271. The first deflector 270 corresponds to the position of the first outer liquid inlet pipe 240, and deflects the liquid flowing out of the first outer liquid inlet pipe 240 to the first pond-entering titanium blue 211. The first outer liquid inlet pipe 240 is located at the lower sides of the first and second pond titanium blues 211 and 212, and the first outer liquid inlet pipe 240 is located within the range of the rotation circumference of the first guide plate 270.
Preferably, the cross section of the first baffle 270 is S-shaped, and the S-shaped opening faces the direction in which the first baffle 270 rotates. In this embodiment, the first baffle 270 includes a straight section and an arc section with two ends of the straight section, and the first outer liquid inlet pipe 240 is located on the circumferential track of the arc section. The shape of the first baffle 270 is matched so that the liquid coming in from the first outer liquid inlet pipe 240 is sufficiently guided by the first baffle 270.
The first outer liquid inlet pipe 240 is provided with a first outer pipe liquid spraying hole 241, and the first outer pipe liquid spraying hole 241 faces the rotating direction of the first guide plate 270, so that liquid flowing in from the first outer liquid inlet pipe 240 can be fully matched with the rotating direction of the first guide plate 270, and further the liquid can be ensured to smoothly reach the side surface of the first pond-entering titanium blue 211.
The first inner liquid inlet pipe 230 is located between the copper film 400 and the second pond titanium blue 212, a first inner pipe liquid spraying hole 231 is arranged on the first inner liquid inlet pipe 230, and the first inner pipe liquid spraying hole 231 faces to the lower side of the second pond titanium blue 212. The orientation of the first inner tube spray hole 231 can enable the flowing liquid to match the boundary of the whole electroplating cell 200, so that the flowing liquid can smoothly reach the side surface of the second in-cell titanium blue 212, and further the sufficient reaction between the flowing liquid and the second in-cell titanium blue 212 is ensured.
2. In the out-of-pool zone:
The outer side of the copper film 400 is provided with a first out-tank titanium blue 221 and a second outer liquid inlet pipe 250, liquid flowing out of the second outer liquid inlet pipe 250 passes through the first out-tank titanium blue 221 to reach the outer side surface of the copper film 400, the inner side of the copper film 400 is provided with a second out-tank titanium blue 222 and a second inner liquid inlet pipe 260, and liquid flowing out of the second inner liquid inlet pipe 260 passes through the second out-tank titanium blue 222 to reach the inner side surface of the copper film 400.
Preferably, a second deflector 280 is further arranged in the effluent pool area, and the second deflector 280 corresponds to the position of the second outer liquid inlet pipe 250, and deflects the liquid flowing out of the second outer liquid inlet pipe 250 to the position of the first effluent pool titanium blue 221.
The second deflector 280 is fixed to the plating cell 200 by a second deflector shaft 281, and the second deflector 280 rotates around the second deflector shaft 281. The second deflector 280 corresponds to the position of the second outer liquid inlet pipe 250, and deflects the liquid flowing out of the second outer liquid inlet pipe 250 to the first outlet tank titanium blue 221. The second outer liquid inlet pipe 250 is positioned at the lower side of the first outlet cell titanium blue 221 and the second outlet cell titanium blue 222, and the second outer liquid inlet pipe 250 is positioned within the range of the rotation circumference of the second deflector 280.
Preferably, the cross section of the second deflector 280 is S-shaped, and the S-shaped opening faces the direction in which the second deflector 280 rotates. In this embodiment, the second baffle 280 includes a straight section and an arc section with two ends of the straight section, and the second outer liquid inlet pipe 250 is located on the circumferential track of the arc section. The shape of the second baffle 280 is matched so that the liquid coming in from the second outer liquid inlet pipe 250 is sufficiently guided by the second baffle 280.
The second outer liquid inlet pipe 250 is provided with a second outer pipe liquid spraying hole 251, and the second outer pipe liquid spraying hole 251 faces the rotating direction of the second guide plate 280, so that the liquid flowing in from the second outer liquid inlet pipe 250 can be fully matched with the rotating direction of the second guide plate 280, and further the liquid can be ensured to smoothly reach the side surface of the first pool titanium blue 221.
The second inner liquid inlet pipe 260 is located between the copper film 400 and the second out-tank titanium blue 222, a second inner pipe liquid spraying hole 261 is arranged on the second inner liquid inlet pipe 260, and the second inner pipe liquid spraying hole 261 faces to the lower side of the second out-tank titanium blue 222. The second inner tube spray holes 261 are oriented such that the incoming liquid matches the boundary of the entire plating cell 200 so that it smoothly reaches the side of the second out-cell titanium blue 222, thereby ensuring a sufficient reaction with the second out-cell titanium blue 222.
In this embodiment, the first guide plate 270 and the second guide plate 280 play a role in guiding the flow direction of the electrolyte, and the flow direction of the electrolyte flowing through the titanium blue can be adjusted according to the difference between the copper ion concentration of the electrolyte and the process requirement.
In this embodiment, the first outer liquid inlet pipe 240, the first inner liquid inlet pipe 230, the second outer liquid inlet pipe 250 and the second inner liquid inlet pipe 260 are all pure titanium pipes, which can satisfy the mutual reflection of the copper film 400 and the titanium blue and simultaneously play a sufficient supporting role.
The first outer liquid inlet pipe 240, the first inner liquid inlet pipe 230, the second outer liquid inlet pipe 250 and the second inner liquid inlet pipe 260 are all distributed on the corresponding proportional valves 300 to be connected, and each liquid inlet pipe is provided with a plurality of liquid spraying holes, along with the increase of the distance between the liquid spraying holes and the corresponding proportional valves 300, the aperture of each liquid spraying hole is reduced, the distance between two adjacent liquid spraying holes is reduced, the aperture and the distance between the liquid spraying holes can be set according to the specific working environment requirements, and the repeated description is omitted here.
According to the invention, the liquid spraying holes are manufactured according to a pressure attenuation method, namely, the distance and the aperture of the liquid spraying holes are manufactured according to a pressure attenuation principle, and the circulation mode of pumping the electrolyte in the external circulation plating bath is replaced by strong pressure internal circulation, so that the cost is saved, and the fluid with uniform flow speed and uniform flow direction can be obtained, and the circulation effect is better. The strong pressure multipoint liquid inlet forms a more regular laminar flow direction in the tank, and the flow direction of the electrolyte is more conveniently changed by matching with each guide plate.
The upper side edge of the electroplating tank 200 is provided with a liquid return tank, a plurality of copper ion concentration detectors are arranged in the liquid return tank, and the copper ion concentration detectors are connected with proportional valves at the inlets of all liquid inlet pipes through a closed-loop control system. The copper ion concentration detector in each overflow groove can feed back in real time according to the thickness of the copper film, and the system can adjust the current according to the feedback to form a complete closed-loop control system.
Specifically, left and right liquid return tanks 291 are provided on the left and right sides of the plating bath 200, and a plurality of left and right copper ion concentration detectors 292 are provided in the left and right liquid return tanks 291; front and rear liquid return tanks 293 are provided on the front and rear sides of the plating tank 200, and a plurality of front and rear copper ion concentration detectors 294 are provided in the front and rear liquid return tanks 293.
The overflow liquid inlets are located at both longitudinal ends of the plating cell 200, so that in the plating cell 200 of fig. 1, electrolyte on the inner side flows to the back side and electrolyte on the outer side flows to the front side with the center as a boundary, forming a regular flow direction. The invention adopts the overflow tank overflow liquid returning method, so that the electrolyte in the whole plating solution tank 200 forms a complete circulation system. Meanwhile, the concentration change of the liquid in the electroplating tank 200 is monitored by the copper ion concentration detector, whether the consumption of copper ions in the electrolyte is within the process requirement or not can be monitored in real time, and the automatic control of the concentration of the electric ions is realized by automatically adjusting the flow of the inlet liquid according to the change of the concentration of the electrolyte in the tank. Compared with the traditional water plating equipment, the control is more convenient and stable, the efficiency is higher, and the cost is lower.
The implementation principle of the invention is as follows:
The titanium blue is not only a conductive anode, but also a copper ball containing container for supplementing copper ion concentration, so that the copper ion concentration of the electrolyte at the periphery and inside of the titanium blue is much higher than that of other areas.
During the electroplating process, the surface current density of the copper film 400 as a cathode is different for each region, which results in different consumption of copper ions in the electrolyte for each region. To ensure uniformity of the plating effect on the surface of the copper film 400, the plating solution concentration of each region is detected and adjusted. The ideal plating solution effect is achieved by adjusting the opening of the proportional valve 300 through the feedback value of the copper ion concentration detector installed in each liquid return tank. The specific control mode is as follows: when the copper ion concentration of the liquid return in the area is detected to be higher, the opening of the proportional valve 300 on the corresponding liquid inlet pipe is increased; and conversely, the opening of the proportional valve 300 decreases. The process is fully automatic and closed-loop controlled, and the plating solution concentration in the electroplating tank 200 is always maintained within the range of process requirements.
The invention adopts a liquid inlet mode with adjustable multi-point liquid spraying angle, can realize uniform flow velocity and flow quantity in the width direction, can generate laminar flow with uniform flow velocity and adjustable flow direction in the plating solution tank under the combined action of the guide plate and the liquid inlet angle, and can bring out the electrolyte with high copper ion content in the titanium blue when the electrolyte flows to the inside of the titanium blue, so that the electrolyte uniformly and consistently tends to the surface of the copper film 400. Due to the adoption of the overflow liquid return method, the electrolyte with low concentration can float up to the liquid level position and finally overflows. The electrolyte flows from bottom to top in both the liquid inlet (in-cell) direction of the copper film 40 and the liquid outlet (out-cell) direction of the copper film 400 (the specific gravity of the electrolyte consuming copper ions is lower than that of the electrolyte having a high copper ion content during the electroplating process). Forming a nearly closed laminar flow path.
It will be understood that modifications and variations will be apparent to those skilled in the art from the foregoing description, and it is intended that all such modifications and variations be included within the scope of the following claims.
While the invention has been described above with reference to the accompanying drawings, it will be apparent that the implementation of the invention is not limited by the above manner, and it is within the scope of the invention to apply the inventive concept and technical solution to other situations as long as various improvements made by the inventive concept and technical solution are adopted, or without any improvement.
Claims (7)
1. An automatic internal circulation and flow control water plating device comprises an electroplating pool, wherein a steering conductive roller is arranged in the electroplating pool, a copper film bypasses the steering conductive roller and goes out of the pool after entering the electroplating pool, the automatic internal circulation and flow control water plating device is characterized in that the left side and the right side of the electroplating pool are respectively provided with a pool entering area and a pool exiting area which are symmetrical,
In the pond entering area, a first pond entering titanium blue and a first outer liquid inlet pipe are arranged on the outer side of the copper film, liquid flowing out of the first outer liquid inlet pipe passes through the first pond entering titanium blue to reach the outer side surface of the copper film, a second pond entering titanium blue and a first inner liquid inlet pipe are arranged on the inner side of the copper film, liquid flowing out of the first inner liquid inlet pipe passes through the second pond entering titanium blue to reach the inner side surface of the copper film, a first guide plate is further arranged in the pond entering area, and the first guide plate corresponds to the position of the first outer liquid inlet pipe and guides the liquid flowing out of the first outer liquid inlet pipe to the position of the first pond entering titanium blue;
In the pool outlet area, a first pool outlet titanium blue and a second outer liquid inlet pipe are arranged on the outer side of the copper film, liquid flowing out of the second outer liquid inlet pipe passes through the first pool outlet titanium blue to reach the outer side surface of the copper film, a second pool outlet titanium blue and a second inner liquid inlet pipe are arranged on the inner side of the copper film, liquid flowing out of the second inner liquid inlet pipe passes through the second pool outlet titanium blue to reach the inner side surface of the copper film, a second guide plate is further arranged in the pool outlet area, the second guide plate corresponds to the position of the second outer liquid inlet pipe, and the second guide plate guides the liquid flowing out of the second outer liquid inlet pipe to the first pool outlet titanium blue;
The first outer liquid inlet pipe, the first inner liquid inlet pipe, the second outer liquid inlet pipe and the second inner liquid inlet pipe are respectively provided with a plurality of liquid spraying holes, and the aperture of each liquid spraying hole is reduced along with the increase of the distance between each liquid spraying hole and the corresponding proportional valve, and the distance between two adjacent liquid spraying holes is also reduced along with the increase of the distance between each liquid spraying hole and the corresponding proportional valve;
The upper side edge of the electroplating tank is provided with a liquid return tank, a plurality of copper ion concentration detectors are arranged in the liquid return tank, and the copper ion concentration detectors are connected with proportional valves at the inlets of all liquid inlet pipes through a closed-loop control system.
2. The automated internal circulation and flow control plating apparatus of claim 1, wherein the first baffle is secured to the plating cell by a first baffle shaft and the first baffle rotates about the first baffle shaft.
3. The automatic internal circulation and flow control plating apparatus according to claim 1, wherein the first baffle has an S-shaped cross section.
4. The automatic internal circulation and flow control plating apparatus according to claim 1, wherein the first internal liquid inlet pipe is located between the copper film and the second pond-entering titanium blue, and a first internal pipe liquid spraying hole is formed in the first internal liquid inlet pipe and faces the lower side of the second pond-entering titanium blue.
5. The automatic internal circulation and flow control plating apparatus according to claim 1, wherein the second baffle is fixed to the plating cell by a second baffle shaft, and the second baffle rotates about the second baffle shaft.
6. The automatic internal circulation and flow control plating apparatus according to claim 1, wherein the second baffle has an S-shaped cross section.
7. The automatic internal circulation and flow control plating apparatus according to claim 1, wherein the second internal liquid inlet pipe is located between the copper film and the second out-of-pool titanium blue, and a second internal pipe liquid spraying hole is provided on the second internal liquid inlet pipe, and the second internal pipe liquid spraying hole faces to the lower side of the second out-of-pool titanium blue.
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| CN110923761B (en) * | 2019-12-26 | 2022-01-11 | 重庆切普电子技术有限公司 | Spraying electroplating system |
| CN112064102B (en) * | 2020-09-15 | 2023-06-23 | 扬州宏远电子股份有限公司 | Device and method for improving specific volume uniformity of medium-high voltage corrosion foil |
| CN113936861B (en) * | 2021-12-15 | 2022-03-11 | 深圳乐能电子有限公司 | Electrolytic treatment device for surface coating of vehicle-mounted USB charging cable |
| CN116356396B (en) * | 2023-03-13 | 2024-05-03 | 广东捷盟智能装备股份有限公司 | Liquid inlet mechanism capable of realizing directional flow in gaps |
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