CN110551422A - Conductive ink, SMT (surface mount technology) conductive elastomer and preparation method thereof - Google Patents
Conductive ink, SMT (surface mount technology) conductive elastomer and preparation method thereof Download PDFInfo
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- CN110551422A CN110551422A CN201910983552.1A CN201910983552A CN110551422A CN 110551422 A CN110551422 A CN 110551422A CN 201910983552 A CN201910983552 A CN 201910983552A CN 110551422 A CN110551422 A CN 110551422A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
- H01R12/718—Contact members provided on the PCB without an insulating housing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
Abstract
The invention relates to a conductive ink which comprises the following components in percentage by mass: 5-10% of conductive metal powder, 10-30% of conductive carbon powder, 10-20% of bisphenol A epoxy resin, 0.5-5% of curing agent, 0.5-5% of auxiliary agent and 30-50% of organic solvent; wherein the conductive metal powder is copper powder, aluminum powder or nickel powder; the conductive carbon powder is one or more of carbon nano tube, conductive graphite, conductive carbon black and acetylene black. The invention also relates to an SMT conductive elastomer and a preparation method thereof, wherein the preparation method comprises the following steps: providing an extruded silica gel, wherein the extruded silica gel comprises a silica gel body and a hollow part in the silica gel body, the cross section of the silica gel body is approximately trapezoidal, two opposite side walls on the silica gel body are provided with concave parts, and the concave parts are concave towards the inside of the silica gel body; spraying the conductive ink on the surface of the silica gel body, baking for 5-15min at 80-120 ℃ to form a high-temperature-resistant conductive coating on the surface of the silica gel body, and attaching a high-temperature-resistant copper foil tape to part of the surface of the high-temperature-resistant conductive coating.
Description
Technical Field
The invention relates to the field of conductive materials, in particular to conductive ink, an SMT (surface mount technology) conductive elastomer and a preparation method thereof.
Background
SMT is known as surface mount or surface mount technology and is currently the most popular technology and process in the electronic assembly industry. The surface-mounted component is mounted on the surface of Printed Circuit Board (PCB) or other base plate, and is soldered and assembled by means of reflow soldering or dip soldering. In order to prevent mutual interference between surface-assembled components, the outer parts of the components are usually coated with conductive elastomers to provide a buffer effect between different components, and the conductive elastomers can reflect according to the properties of objects when encountering radio waves to play a role in conductive shielding.
At present, when the coated conductive elastomer is prepared, a copper-plated or tin-plated Polyimide (PI) film layer is generally coated on the surface of silica gel. Such as the SMT foam disclosed in the Chinese patent with the application number of 201820302693.3, which has the advantages of high temperature resistance, high elasticity and electric conduction. The prior preparation process of the coated conductive elastomer has the following defects: the PI material needs to be plated with copper or tin firstly, or some materials are coated on the surface of the PI material in a hot coating processing mode, so that the cost is increased, the working hour is increased, and the coating processing mode has the risk of product layering and explosion cracking. In addition, after being mounted on the surface of a substrate such as a PCB, the conventional coated conductive elastomer is deformed and inclined under pressure once being pressed, thereby interfering with and affecting other components.
Disclosure of Invention
in order to solve the technical problems, the invention aims to provide conductive ink, an SMT conductive elastomer and a preparation method thereof, the conductive ink can resist the high temperature of 250-300 ℃ and has good conductivity, the SMT conductive elastomer disclosed by the invention adopts the conductive ink for spraying to form a conductive coating when being prepared, the process optimizes the manufacturing procedure, reduces the cost, and the prepared SMT conductive elastomer has high shielding efficiency and conductivity and good buffering effect.
The invention discloses a conductive ink which comprises the following components in parts by mass based on the total weight of the conductive ink:
5-10% of conductive metal powder, 10-30% of conductive carbon powder, 10-20% of bisphenol A epoxy resin, 0.5-5% of curing agent, 0.5-5% of auxiliary agent and 30-50% of organic solvent;
Wherein the conductive metal powder is copper powder, aluminum powder or nickel powder; the conductive carbon powder is one or more of carbon nano tube, conductive graphite, conductive carbon black and acetylene black.
further, the curing agent is one or more of amine curing agent, imidazole curing agent and anhydride curing agent. Preferably, the amine curing agent is selected from melamine, the imidazole curing agent is selected from benzimidazole, and the anhydride curing agent is selected from maleic anhydride.
Further, the auxiliary agent is one or more of a dispersing agent, a stabilizing agent, a film forming agent, a coupling agent, a plasticizer, an antifoaming agent, a thickening agent, a leveling agent and a thixotropic agent. Preferably, the auxiliary agent is selected from one or more of a dispersing agent, a defoaming agent, a leveling agent and a thixotropic agent.
Further, the organic solvent is one or more of methanol, ethanol, n-butanol, ethyl acetate, butanone, toluene and xylene.
The second purpose of the invention is to disclose a preparation method of SMT conductive elastomer, which comprises the following steps:
(1) providing an extruded silica gel, wherein the extruded silica gel comprises a silica gel body and a hollow part in the silica gel body, the cross section of the silica gel body is approximately trapezoidal, two opposite side walls on the silica gel body are provided with concave parts, and the concave parts are concave towards the inside of the silica gel body;
(2) Spraying the conductive ink on the surface of a silica gel body, and then baking for 5-15min at 80-120 ℃ to form a high-temperature-resistant conductive coating on the surface of the silica gel body, wherein the thickness of the high-temperature-resistant conductive coating is 5-50 microns;
(3) And attaching a high-temperature-resistant copper foil adhesive tape to part of the surface of the high-temperature-resistant conductive coating to obtain the SMT conductive elastomer.
Further, before the step (2), the method also comprises the steps of cleaning the surface of the extruded silica gel and then coating the silica gel treating agent.
Further, the silica gel treating agent is a 3M 94 primer.
Further, in the step (2), the spraying is performed by using an air rotary spraying method, and the viscosity of the conductive ink is 100-500 cps.
Further, in the step (2), the high temperature-resistant conductive coating can withstand a temperature of 250-300 ℃.
Further, in step (1), a groove is formed in the silica gel body, and the groove extends along the axis direction of the silica gel body. The cross section of the groove is arc-shaped. The arrangement of the groove enables the product coated by the SMT conductive elastomer to be compressed, reduces stress tension and enables the product to be compressed more easily.
Further, the groove is located in the middle of the bottom side of the roughly trapezoidal silica gel body.
further, in the step (3), the high-temperature resistant copper foil tape can resist the temperature of 20-280 ℃ and the thickness of 50-200 μm, and is positioned on the bottom edge of the silica gel body.
further, the high-temperature resistant copper foil tapes are positioned on two sides of the groove.
The SMT conductive elastomer comprises a silica gel core, wherein the surface of the silica gel core is coated with a high-temperature-resistant conductive coating, and part of the surface of the high-temperature-resistant conductive coating is coated with a high-temperature-resistant copper foil adhesive tape; the silica gel core includes the hollow portion in silica gel body and the silica gel body, and the cross section of silica gel body roughly is trapezoidal, and two relative lateral walls are equipped with the depressed part on the silica gel body, and the depressed part is sunken towards silica gel body inside.
Furthermore, a groove is formed in the silica gel body and extends along the axis direction of the silica gel body. The cross section of the groove is arc-shaped. The arrangement of the groove enables the product coated by the SMT conductive elastomer to be compressed, reduces stress tension and enables the product to be compressed more easily.
further, the thickness of the high-temperature resistant conductive coating is 5-50 microns.
Further, the groove is located in the middle of the bottom side of the roughly trapezoidal silica gel body.
Further, the high-temperature resistant copper foil tapes are positioned on two sides of the groove.
furthermore, the high-temperature resistant copper foil tape can resist the temperature of 20-280 ℃ and the thickness of 50-200 mu m.
By the scheme, the invention at least has the following advantages:
The conductive ink disclosed by the invention can resist high temperature and has good conductivity.
According to the preparation method, a conductive layer is not required to be formed after copper plating and nickel plating are carried out on the surface of the extruded silica gel, the high-temperature-resistant conductive coating is formed by directly spraying the conductive ink on the surface of the silica gel, the coating is uniform and has stronger adhesive force, the separation phenomenon from the silica gel is avoided, the manufacturing process is more optimized, the process replaces a copper plating or tin plating PI or material hot wrapping processing mode, and the cost and the working hour are saved. The traditional PI plated with copper or tin has reduced conductive and shielding performance after the plating layer on the surface is damaged, and the invention adopts tin foil to replace the PI, so that the conductivity and shielding effect of the SMT conductive elastomer are higher and more stable.
according to the invention, the recessed parts are arranged on the two opposite side walls of the silica gel body of the SMT conductive elastomer, so that when a product coated by the SMT conductive elastomer is extruded by external force, the product cannot incline towards the two opposite side surfaces, and the interference and influence on other electronic components are avoided; through set up well kenozooecium in SMT electrically conductive elastomer for SMT electrically conductive elastomer's compressive property effect is better, makes it receive dispersion stress when extrudeing, and the sealed effect of buffering is better.
The product of the invention can be applied to the surface of various substrates such as PCB boards and the like in the SMT reflow soldering process, can resist high temperature and over reflow soldering, and plays a role in conductive shielding and buffering in the process.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical solutions of the present invention more clearly understood and to implement them in accordance with the contents of the description, the following detailed description is given with reference to the preferred embodiments of the present invention and the accompanying drawings.
Drawings
FIG. 1 is a schematic perspective view of an SMT conductive elastomer according to the present invention;
FIG. 2 is a schematic cross-sectional view of an SMT conductive elastomer of the present invention;
description of reference numerals:
1-a silica gel body; 2-high temperature resistant conductive coating; 3-high temperature resistant copper foil tape; 10-a hollow part; 11-a groove; 12-depressions.
Detailed Description
The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
Example 1
the conductive ink comprises the following components in parts by mass based on the total weight of the conductive ink:
10% of conductive metal powder, 10% of conductive carbon powder, 20% of bisphenol A epoxy resin, 5% of curing agent, 5% of auxiliary agent and 50% of organic solvent;
Wherein the conductive metal powder is aluminum powder; the conductive carbon powder is carbon nanotube, conductive graphite, conductive carbon black and acetylene black.
The curing agent is melamine. The auxiliary agent consists of a dispersant (BYK110), a defoaming agent (BYK051 and BYK052), a leveling agent (BYK361N) and a thixotropic agent (fumed silica) which are equal in quantity. The organic solvent is methanol and toluene.
Example 2
The conductive ink comprises the following components in parts by mass based on the total weight of the conductive ink:
10% of conductive metal powder, 30% of conductive carbon powder, 20% of bisphenol A epoxy resin, 5% of curing agent, 5% of auxiliary agent and 30% of organic solvent;
Wherein the conductive metal powder is copper powder; the conductive carbon powder is carbon nanotube, conductive graphite, conductive carbon black and acetylene black.
The curing agent is benzimidazole. The auxiliary agent consists of a dispersant (BYK110), a defoaming agent (BYK051 and BYK052), a leveling agent (BYK361N) and a thixotropic agent (fumed silica) which are equal in quantity. The organic solvent is n-butanol and ethyl acetate.
example 3
The conductive ink comprises the following components in parts by mass based on the total weight of the conductive ink:
5% of conductive metal powder, 30% of conductive carbon powder, 10% of bisphenol A epoxy resin, 3% of curing agent, 3% of auxiliary agent and 49% of organic solvent;
Wherein the conductive metal powder is nickel powder; the conductive carbon powder is carbon nanotube, conductive graphite, conductive carbon black and acetylene black.
The curing agent is maleic anhydride. The auxiliary agent consists of a dispersant (BYK110), a defoaming agent (BYK051 and BYK052), a leveling agent (BYK361N) and a thixotropic agent (fumed silica) which are equal in quantity. The organic solvent is butanone and toluene.
Example 4
The invention discloses a preparation method of an SMT conductive elastomer (shown in figures 1-2), which comprises the following steps:
(1) Preparing extruded silica gel by adopting an extruder, cleaning the surface of the extruded silica gel, and brushing a layer of silica gel treating agent (3M 94 primer) on the surface of the extruded silica gel to increase the adhesive force of the conductive ink and the silica gel during later spraying. Wherein, extrude silica gel and include silica gel body 1 and run through well kenozooecium 10 in the silica gel body 1, the cross section of silica gel body 1 and well kenozooecium 10 roughly is trapezoidal, and trapezoidal four angles are the fillet. Two relative lateral walls are equipped with depressed part 12 on the silica gel body 1, and depressed part 12 is sunken towards silica gel body 1 is inside. The middle part on silica gel body 1 base is seted up flutedly 11, and the transversal arc of personally submitting of flutedly 11, and flutedly 11 extends along silica gel body 1's axis direction.
(2) The viscosity of the conductive ink in example 1 was adjusted to 100cps, and then it was sprayed on the surface of a silica gel body: placing the extruded silica gel in a box body for room temperature operation, spraying by adopting an air rotary spraying method, wherein the thickness of the coating formed by spraying once is about 3-5 micrometers, spraying for multiple times after the coating is precured, and then baking for 15min at 80 ℃ to form a high-temperature resistant conductive coating 2 with the thickness of 5 micrometers on the surface of the extruded silica gel.
(3) And attaching a high-temperature-resistant copper foil adhesive tape 3 to the surface of the high-temperature-resistant conductive coating 2 positioned at the bottom edge of the extruded silica gel to obtain the SMT conductive elastomer.
Example 5
The invention relates to a preparation method of an SMT conductive elastomer, which comprises the following steps:
(1) Preparing extruded silica gel by adopting an extruder, cleaning the surface of the extruded silica gel, and brushing a layer of silica gel treating agent (3M 94 primer) on the surface of the extruded silica gel to increase the adhesive force of the conductive ink and the silica gel during later spraying. Wherein, extrude silica gel and include the silica gel body and run through this internal well kenozooecium of silica gel, the cross section of silica gel body and well kenozooecium roughly is trapezoidal, and trapezoidal four angles are the fillet. Two relative lateral walls are equipped with the depressed part on the silica gel body, and the depressed part is sunken towards silica gel body inside. The middle part on silica gel body base is seted up flutedly, and the transversal arc of personally submitting of recess, and the recess extends along the axis direction of silica gel body.
(2) the viscosity of the conductive ink in example 2 was adjusted to 300cps, and then it was sprayed on the surface of a silica gel body: placing the extruded silica gel in a box body for room temperature operation, spraying by adopting an air rotary spraying method, wherein the thickness of the coating formed by spraying once is about 3-5 micrometers, spraying for multiple times after the coating is precured, and then baking for 10min at 100 ℃ to form a high-temperature resistant conductive coating with the thickness of 30 micrometers on the surface of the extruded silica gel.
(3) and attaching a high-temperature-resistant copper foil adhesive tape to the surface of the high-temperature-resistant conductive coating at the bottom edge of the extruded silica gel to obtain the SMT conductive elastomer.
Example 6
the invention relates to a preparation method of an SMT conductive elastomer, which comprises the following steps:
(1) preparing extruded silica gel by adopting an extruder, cleaning the surface of the extruded silica gel, and brushing a layer of silica gel treating agent (3M 94 primer) on the surface of the extruded silica gel to increase the adhesive force of the conductive ink and the silica gel during later spraying. Wherein, extrude silica gel and include the silica gel body and run through this internal well kenozooecium of silica gel, the cross section of silica gel body and well kenozooecium roughly is trapezoidal, and trapezoidal four angles are the fillet. Two relative lateral walls are equipped with the depressed part on the silica gel body, and the depressed part is sunken towards silica gel body inside. The middle part on silica gel body base is seted up flutedly, and the transversal arc of personally submitting of recess, and the recess extends along the axis direction of silica gel body.
(2) The viscosity of the conductive ink in example 3 was adjusted to 500cps, and then it was sprayed on the surface of a silica gel body: placing the extruded silica gel in a box body for room temperature operation, spraying by adopting an air rotary spraying method, wherein the thickness of the coating formed by spraying once is about 3-5 micrometers, spraying for multiple times after the coating is precured, and then baking for 5min at 120 ℃ to form a high-temperature resistant conductive coating with the thickness of 50 micrometers on the surface of the extruded silica gel.
(3) And attaching a high-temperature-resistant copper foil adhesive tape to the surface of the high-temperature-resistant conductive coating at the bottom edge of the extruded silica gel to obtain the SMT conductive elastomer.
The SMT conductive elastomer prepared in the embodiments 4-6 of the invention can be subjected to the SMT reflow soldering process, and in the process, the SMT conductive elastomer can resist the temperature of 280 ℃ for more than 5 min. The shielding effectiveness can amount to >60 db. The product has high conductivity, and when the product is compressed by 25%, the resistance of the product is less than 0.08 omega. And the adhesion of the conductive coating and the silica gel is better. The conductivity is more stable.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, it should be noted that, for those skilled in the art, many modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (10)
1. The conductive ink is characterized by comprising the following components in parts by mass based on the total weight of the conductive ink:
5-10% of conductive metal powder, 10-30% of conductive carbon powder, 10-20% of bisphenol A epoxy resin, 0.5-5% of curing agent, 0.5-5% of auxiliary agent and 30-50% of organic solvent;
Wherein the conductive metal powder is copper powder, aluminum powder or nickel powder; the conductive carbon powder is one or more of carbon nano tube, conductive graphite, conductive carbon black and acetylene black.
2. The conductive ink of claim 1, wherein: the curing agent is one or more of amine curing agent, imidazole curing agent and anhydride curing agent.
3. the conductive ink of claim 1, wherein: the auxiliary agent is one or more of a dispersing agent, a stabilizing agent, a film forming agent, a coupling agent, a plasticizer, a defoaming agent, a thickening agent, a flatting agent and a thixotropic agent.
4. a preparation method of an SMT conductive elastomer is characterized by comprising the following steps:
(1) Providing an extruded silica gel, wherein the extruded silica gel comprises a silica gel body and a hollow part in the silica gel body, the cross section of the silica gel body is approximately trapezoidal, two opposite side walls on the silica gel body are provided with concave parts, and the concave parts are concave towards the inside of the silica gel body;
(2) Spraying the conductive ink of any one of claims 1-3 on the surface of the silica gel body, and then baking at 80-120 ℃ for 5-15min to form a high temperature resistant conductive coating on the surface of the silica gel body, wherein the thickness of the high temperature resistant conductive coating is 5-50 microns;
(3) And attaching a high-temperature-resistant copper foil adhesive tape to part of the surface of the high-temperature-resistant conductive coating to obtain the SMT conductive elastomer.
5. The method according to claim 4, wherein before the step (2), the method further comprises the steps of cleaning the surface of the extruded silica gel and then coating the silica gel treatment agent.
6. The method according to claim 5, wherein the silica gel treating agent is a 3M 94 primer.
7. The method as claimed in claim 4, wherein in the step (2), the conductive ink is sprayed by an air rotary spraying method, and the viscosity of the conductive ink is 100-500 cps.
8. The preparation method according to claim 4, wherein in the step (1), the silica gel body is provided with a groove, and the groove extends along the axis direction of the silica gel body.
9. The preparation method according to claim 4, wherein in the step (3), the high temperature resistant copper foil tape can withstand a temperature of 20-280 ℃, and the high temperature resistant copper foil tape is positioned on the bottom edge of the silica gel body.
10. an SMT conductive elastomer prepared according to the preparation method of claim 4, wherein the SMT conductive elastomer comprises a silica gel core, the surface of the silica gel core is coated with a high temperature resistant conductive coating, and part of the surface of the high temperature resistant conductive coating is coated with a high temperature resistant copper foil adhesive tape; the silica gel core includes silica gel body and this internal well kenozooecium of silica gel, the cross section of silica gel body roughly is trapezoidal, two relative lateral walls are equipped with the depressed part on the silica gel body, the depressed part is sunken towards the silica gel body is inside.
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| CN113004735A (en) * | 2021-03-04 | 2021-06-22 | 辛格顿(常州)新材料科技有限公司 | Matte black copper foil and preparation method thereof |
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| CN109111586A (en) * | 2018-07-03 | 2019-01-01 | 北京中科纳通电子技术有限公司 | The preparation method of conductive rubber strip and its application in 5G communication |
| CN110172277A (en) * | 2019-06-14 | 2019-08-27 | 广东华祐新材料有限公司 | A kind of conductive material of low-resistance value |
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| CN112822833A (en) * | 2021-02-22 | 2021-05-18 | 苏州康丽达精密电子有限公司 | SMT conductive elastic gasket and manufacturing process thereof |
| CN113004735A (en) * | 2021-03-04 | 2021-06-22 | 辛格顿(常州)新材料科技有限公司 | Matte black copper foil and preparation method thereof |
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