CN110549018A

CN110549018A - Laser drilling device and method

Info

Publication number: CN110549018A
Application number: CN201910472066.3A
Authority: CN
Inventors: 彭仁波; 李长团
Original assignee: Shenzhen JPT Optoelectronics Co Ltd
Current assignee: Shenzhen JPT Optoelectronics Co Ltd
Priority date: 2019-05-31
Filing date: 2019-05-31
Publication date: 2019-12-10
Anticipated expiration: 2039-05-31
Also published as: CN110549018B

Abstract

The invention provides a laser drilling device and a laser drilling method. And controlling the laser light path component, the positioning component, the movement mechanism and the code scanner to drill the workpiece, calibrate the two-dimensional bar code and scan the two-dimensional bar code through the controller. Testing the light transmittance of the workpiece through a spectrometer, detecting whether the drilled workpiece is qualified, if the detected workpiece is a unqualified product, alarming to prompt a user that the workpiece is unqualified, and if the detected workpiece is a qualified product, acquiring workpiece information; and finally unloading the workpiece from the fixture platform. The laser drilling device provided by the invention is simple in process, simple in structure, convenient to operate, high in efficiency, high in precision and good in equipment stability.

Description

laser drilling device and method

Technical Field

the invention relates to the field of processing and manufacturing, in particular to a laser drilling device and method.

background

Laser drilling is the earliest practical laser processing technique and is one of the main application fields of laser processing. The drilling process flow of the existing laser drilling device sequentially comprises the following steps: loading product, positioning, drilling, two-dimensional barcode marking, unloading product, loading product, testing transmittance, unloading product, loading product, two-dimensional barcode scanning, and unloading product. The prior art has the disadvantages of multiple manufacturing procedures, complex structure, frequent manual loading and unloading and low efficiency.

Disclosure of Invention

In view of the above, there is a need to provide a laser drilling apparatus and method with simple process, simple structure, high efficiency and easy operation.

A laser drilling apparatus, comprising:

A substrate;

the clamp platform is arranged on the base plate and used for loading and unloading workpieces;

the supporting frame is fixedly arranged on the base plate and is arranged at intervals with the clamp platform;

the supporting plate is fixedly arranged on the substrate and is vertical to the substrate;

The laser light path component is arranged on the supporting plate and used for drilling the workpiece and calibrating the two-dimensional bar code;

the positioning assembly is arranged on the support frame and used for positioning the workpiece;

the movement mechanism is arranged on the support frame and used for moving the workpiece, the laser light path component and the positioning component;

The code scanner is arranged on the support frame and used for scanning the two-dimensional bar code;

and the controller is electrically connected with the laser light path component, the positioning component, the movement mechanism and the code scanner.

in one embodiment, the method further comprises the following steps:

The frame body is fixedly arranged on the base plate;

The upper-layer clapboard is arranged on the frame body and is close to the top end of the frame body;

the laser light path component comprises:

the laser generator is arranged on the upper layer clapboard and is used for generating laser beams;

the laser output device is arranged on the supporting plate, is connected with the laser generator through a light guide structure, and is used for outputting the laser beam generated by the laser generator;

the vibrating mirror is connected with the laser output device in a light guide mode and deflects the laser beam output by the laser output device;

and the focusing mirror is in light guide connection with the vibrating mirror, is coaxially arranged with the vibrating mirror, and is used for focusing the laser beam after the vibrating mirror is deflected to the workpiece.

in one embodiment, the laser optical path assembly further includes:

the laser power sensor is arranged on the substrate, is coaxial with the focusing mirror and is used for detecting the power value of the laser beam transmitted by the focusing mirror;

and the laser power controller is arranged on the upper layer of partition board, is electrically connected with the laser power sensor and is used for controlling the power of the laser beam.

In one embodiment, the positioning assembly comprises:

the image acquisition device is arranged on the support frame and is used for acquiring image information;

the light source is arranged on the clamp platform and used for illuminating the image acquisition device;

and the display is electrically connected with the controller and used for displaying image information.

in one embodiment, the support frame comprises:

A first surface;

A second surface opposite the first surface;

A first end; and

A second end opposite the first end;

The image acquisition device includes:

a first CCD camera disposed on the first surface and proximate to the first end for capturing a first edge image of the workpiece;

a second CCD camera disposed on the first surface proximate to the second end for capturing a second edge image of the workpiece;

The third CCD camera is arranged on the second surface, is positioned between the first end and the second end and is used for capturing an image of a third edge of the workpiece;

and the fourth CCD camera is arranged on the second surface, is positioned between the first end and the second end and is close to the second end, and is used for acquiring the image information of the workpiece and detecting the drilling quality.

In one embodiment, the movement mechanism comprises:

the X-axis motion mechanism is arranged on the substrate and used for controlling the workpiece to horizontally move in the X-axis direction in a three-dimensional space;

the Y-axis motion mechanism is arranged on the substrate, is vertical to the X-axis motion mechanism and is used for controlling the workpiece to horizontally move in the Y-axis direction in a three-dimensional space;

The Z-axis motion mechanism is arranged on the supporting plate, is vertical to the base plate and is used for vertically moving the laser output device along the Z-axis direction in a three-dimensional space;

image acquisition motion mechanism, including: the first CCD motion mechanism is arranged on the first surface and close to the first end and is used for controlling the motion of the first CCD camera; the second CCD motion mechanism is arranged on the first surface, is close to the second end and is used for controlling the motion of the second CCD camera;

and the code scanning motion mechanism is arranged on the second surface and is close to the second end and used for controlling the code scanner to move.

in one embodiment, the X-axis motion mechanism and the Y-axis motion mechanism are driven by linear motors;

the Z-axis motion mechanism, the image acquisition motion mechanism and the code scanning motion mechanism are driven by servo motors.

In one embodiment, the controller further comprises a marking card, and the marking card is connected with the controller and used for controlling the galvanometer to mark the two-dimensional bar code to the designated position of the workpiece.

in one embodiment, the device further comprises a spectrometer, wherein the spectrometer is arranged on the upper layer partition plate and used for testing the light transmittance of the workpiece after laser drilling is completed.

in one embodiment, the laser drilling device further comprises a cleaning assembly for cleaning waste generated in the laser drilling process, wherein the cleaning assembly comprises:

The air blowing element is arranged on the substrate and is coaxial with the focusing mirror;

and the dust suction element is arranged on the substrate and is connected with the air blowing element.

a laser drilling method, comprising the steps of:

s110, loading the workpiece to the clamp platform;

S120, acquiring the image information of the workpiece through the image acquisition device, and positioning the workpiece to form positioning information;

s130, controlling the laser beam to move to a drilling position through the galvanometer according to the positioning information, and drilling according to drilling parameters preset by the controller;

s140, testing the light transmittance of the workpiece through the spectrometer, and detecting whether the workpiece after drilling is qualified;

s150, if the workpiece after the drilling is detected to be a qualified workpiece, calibrating the two-dimensional bar code to the qualified workpiece, and scanning the two-dimensional bar code through the code scanner to acquire the workpiece information;

S160, if the workpiece after the drilling is detected to be an unqualified workpiece, prompting a user that the workpiece is unqualified through alarm information;

s170, unloading the workpiece from the clamp platform after the step S150 or the step S160 is finished.

According to the laser drilling device and method provided by the invention, the controller is used for controlling the laser light path component, the positioning component, the movement mechanism and the code scanner to drill a hole on the workpiece, calibrate the two-dimensional bar code and scan the two-dimensional bar code. The device and the method can save the manufacturing process, and lead the manufacturing flow to be simple and have high efficiency. The movement of the laser is controlled through the vibrating mirror, so that the production speed is accelerated. Through 4 CCD cameras gather image information simultaneously, save image acquisition time, raise the efficiency. In addition, the linear motor drives the X-axis movement mechanism and the Y-axis movement mechanism, so that the laser drilling process is high in speed, high in precision and good in stability. Therefore, the laser drilling device and method provided by the invention have the advantages of few working procedures, simple flow, high efficiency, stability and convenience in operation.

Drawings

fig. 1 is a schematic overall structure diagram of a laser drilling device according to an embodiment of the present invention;

Fig. 2 is a front view of an internal structure of a laser drilling apparatus according to an embodiment of the present invention;

FIG. 3 is a top view of the internal structure of a laser drilling apparatus according to an embodiment of the present invention;

Fig. 4 is a front view of the overall structure of a laser drilling device according to an embodiment of the present invention;

FIG. 5 is a partial schematic view of a laser optical path assembly of a laser drilling apparatus according to an embodiment of the present invention;

FIG. 6 is a partial schematic view of a cleaning system for a laser drilling apparatus according to an embodiment of the present invention;

FIG. 7 is a schematic diagram of a controller of a laser drilling apparatus according to an embodiment of the present invention;

fig. 8 is a schematic flow chart of a laser drilling method according to an embodiment of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

Referring to fig. 1 to 4, an embodiment of the present application provides a laser drilling apparatus 100, including: the substrate 110, the clamp platform 120, the support frame 130, the support plate 132, the laser optical path assembly 140, the positioning assembly 150, the motion mechanism 160, the code scanner 170, and the controller 180.

the chuck table 120 is disposed on the base plate 110 for loading and unloading a workpiece. The substrate 110 is a flat plate structure, and the material can be metal, marble or wood, and can be selected according to actual needs.

The supporting frame 130 is fixedly installed on the substrate 110, and is spaced apart from the clamp platform 120. The support bracket 130 includes: a first surface 134, a second surface 135 opposite the first surface 134, a first end 136, and a second section 137 opposite the first end 136. The support frame 130 further includes a pillar and a beam. The two ends of the beam are connected with the upright posts to form a support body with a supporting function. The cross member of the support bracket 130 is used to hang or secure instrumentation and mechanisms.

the supporting plate 132 is fixedly mounted on the substrate 110 and is perpendicular to the substrate 110. The supporting plate 132 is a plate-shaped structure perpendicular to the base plate 110, and plays a role in supporting and fixing.

The laser optical path assembly 140 is disposed on the supporting plate 132. The laser path assembly 140 generates a laser beam and transmits the laser beam to a designated location of the workpiece for drilling the workpiece and calibrating the two-dimensional bar code. The positioning assembly 150 is disposed on the supporting frame 130. The positioning component 150 obtains the position information of the workpiece by acquiring the image information of the workpiece, thereby positioning the workpiece. The moving mechanism 160 is disposed on the supporting frame 130. The motion mechanism 160 assists in moving the workpiece and the elements, may move the workpiece to a position to be machined, may move the elements, and may adjust the orientation of the elements. The bar scanner 170 is disposed on the supporting frame 130, and configured to scan the two-dimensional bar code of the workpiece after drilling and calibrating the two-dimensional bar code, so as to obtain information of the workpiece.

Referring to fig. 7, in a controller of a laser drilling apparatus according to an embodiment of the present disclosure, the controller 180 is electrically connected to the laser beam path assembly 140, the positioning assembly 150, the moving mechanism 160, and the code scanner 170. The controller 180 includes: the industrial computer 181, install respectively in first electric mounting panel 182 and the second electric mounting panel 183 of industrial computer 181 both sides. The industrial computer 181 is electrically connected to the first electrical mounting board 182 and the second electrical mounting board 183.

In one embodiment of the present application, the first electrical mounting board 181 includes 2 upper silver drivers, 4 servo drivers, a laser power supply, a galvanometer power supply, a laser control card, a laser adapter card, and a terminal strip. The second electrical mounting plate 182 includes a total leakage switch and a 4-way miniature circuit breaker, and is used for performing breaking protection on the laser optical path assembly 140, the driver, the motion control card, the switch power supply, the terminal strip and the power supply of the IO control card.

The controller 180 sends a control command, and the components and mechanisms electrically connected with the controller 180 complete the operations of the laser drilling, the two-dimensional bar code calibration and the two-dimensional bar code scanning of the workpiece according to the control command. The laser drilling device can save manufacturing processes, and enables the manufacturing process to be simple, efficient, stable and convenient to operate.

In one embodiment of the present application, the laser drilling apparatus 100 further includes: a frame body 111 and an upper-layer partition 131. The frame body 111 is fixedly installed on the substrate 110, and the frame body 111 is of a cubic or rectangular structure and is used for covering internal components of the laser drilling device. The upper partition 131 is disposed on the frame 111 and is close to the top end of the frame 111. The upper spacer 131 may house instrumentation.

referring to fig. 4 and 5, in an embodiment of the present application, the laser path assembly 140 includes a laser generator 141, a laser output device 142, a vibrating mirror 143, and a focusing mirror 144.

The laser generator 141 is disposed at the upper partition 131 of the laser drilling apparatus 100 to generate a laser beam. The laser output device 142 is disposed on the supporting plate 132. The laser generator 141 and the laser output device 142 are connected through a light guide structure. The laser generator 141 generates laser light. The light guide structure transmits the laser beam generated by the laser generator 141 to the laser output device 142.

the galvanometer 143 is connected to the laser output device 142, and the galvanometer 143 deflects the laser beam output by the laser output device 142. The galvanometer 143 is used for changing the direction of the laser beam and controlling the laser beam to move to the workpiece position.

the focusing mirror 144 is connected to the galvanometer 143 in a light-guiding manner, and is disposed coaxially with the galvanometer 143, and is configured to focus the laser light deflected by the galvanometer 143 on the workpiece. The focusing mirror 144 focuses the laser beam deflected by the vibrating mirror 143 into a laser spot, and projects the laser spot to the workpiece, so as to complete the work of laser drilling and two-dimensional bar code calibration.

Specifically, the laser beam generated by the laser generator 141 is output through the laser output device 142, and then the path of the laser beam is changed through the vibrating mirror 143, so that the laser beam is deflected to the focusing mirror 144, and the focusing mirror 144 plays a role in focusing the laser beam on the workpiece.

in one embodiment of the present application, a laser power sensor 145 and a laser power controller 146 are also included.

The laser power sensor 145 is disposed on the substrate 110 and coaxial with the focusing mirror 144, and is configured to detect a power value of the laser beam transmitted by the focusing mirror 144. The laser power controller 146 is disposed on the upper barrier 131 and electrically connected to the laser power sensor 145 for controlling the power of the laser beam. The laser power sensor 145 is used to detect the power value of the laser beam and feed back the detected signal to the laser power controller 146. The laser power controller 146 adjusts the power of the laser beam according to the received detection signal and controls the laser generator 141 to generate the laser beam of a designated power.

Referring to fig. 2 and 3, in one embodiment of the present application, the positioning assembly 150 includes: an image capture device, a light source 152, and a display.

The image acquisition device is an image acquisition device, is arranged on the support 130, and is used for acquiring image information of the workpiece. The image acquisition device can adopt a CCD camera or a video acquisition device.

In this embodiment, the image capturing device includes four CCD cameras, namely a first CCD camera 151, a second CCD camera 153, a third CCD camera 155 and a fourth CCD camera 157. The CCD camera is disposed on the supporting frame 130, and is configured to collect edge information of the workpiece, and then position the workpiece.

the first CCD camera 151 is disposed on the first surface 134 and proximate to the first end 136 for capturing a first edge image of the workpiece. The first edge image is an edge image of the workpiece in an X-axis direction in a three-dimensional space.

The second CCD camera 153 is disposed on the first surface 134 near the second end 137 for capturing a second edge image of the workpiece. The second edge image is an edge image of the workpiece in a Y-axis direction in a three-dimensional space.

the third CCD camera 155 is disposed on the second surface 135, located between the first end 136 and the second end 137, and is configured to capture an image of a third edge of the workpiece. The third edge image is another edge image of the workpiece in the Y-axis direction in the three-dimensional space.

in this embodiment, the position information of the workpiece can be obtained by capturing three edge images of the workpiece by the first CCD camera 151, the second CCD camera 153, and the third CCD camera 155, and the obtained position information of the workpiece is fed back to the industrial personal computer 181. The industrial personal computer 181 determines the laser drilling position and the two-dimensional barcode calibration position according to the position information of the workpiece. The fourth CCD camera 157 is disposed on the second surface 135, between the first end 136 and the second end 137, and near the second end 137. The fourth CCD camera 157 is used to acquire the overall image information of the workpiece after the laser drilling work is completed, and to detect the drilling quality according to the overall image information. Through 4 CCD cameras simultaneous workings, can reduce positioning time, efficiency is showing and is improving to can also detect drilling quality.

the light sources 152 are disposed on the fixture platform 120 and distributed at four edge regions of the fixture platform 120. When the image acquisition device acquires image information, the light source 152 may illuminate the target work area, so as to improve the brightness of the target work area. Moreover, the light source 152 can avoid the interference of ambient light, ensure the stability of the collected image, and form an imaging effect most beneficial to image processing.

the display is electrically connected to the controller 180. The image information collected by the image collecting device is processed by the controller 180 and then transmitted to the display. The display is used for displaying image information.

in order to cooperate with the fixture platform 120, the supporting frame 130, the laser optical path assembly 140 and the positioning assembly 150 to perform a better machining operation, the moving mechanism 160 needs to be provided. The workpiece and other instrumentation are moved by the motion mechanism 160 to cooperate to complete the machining operation.

referring to fig. 1, 3 and 5, in one embodiment of the present application, the movement mechanism 160 includes: an X-axis motion mechanism 161, a Y-axis motion mechanism 162, a Z-axis motion mechanism 163, an image acquisition motion mechanism and a code scanning motion mechanism 165.

The X-axis motion mechanism 161 is disposed on the substrate 110, and configured to horizontally move the workpiece in the X-axis direction in a three-dimensional space.

The Y-axis motion mechanism 162 is disposed on the substrate 110, perpendicular to the X-axis motion mechanism 161, and configured to horizontally move the workpiece in a Y-axis direction in a three-dimensional space.

the X-axis motion mechanism 161 and the Y-axis motion mechanism 162 are used to move the workpiece to a working area for a machining operation before the workpiece is machined. And after the workpiece is machined, moving the workpiece out of a working area, so that the workpiece is conveniently unloaded.

Referring to fig. 5, in an embodiment of the present application, the Z-axis moving mechanism 163 is disposed on the supporting plate 132 and perpendicular to the substrate 110, and is used for vertically moving the laser output device 142 along a Z-axis direction in a three-dimensional space. In the laser drilling and two-dimensional bar code calibration process, the height of the laser output device 142 in the Z-axis direction in the three-dimensional space can be adjusted through the Z-axis movement mechanism 163, and further the distance between the laser beam and the workpiece is adjusted, so as to complete the laser drilling and two-dimensional bar code calibration by matching with the laser output device 142.

In one embodiment of the present application, the image capturing motion mechanism comprises: a first CCD motion mechanism 164 and a second CCD motion mechanism 166. The first CCD motion mechanism 164 is disposed on the first surface 134 and near the first end 136 for controlling the motion of the first CCD camera 151. The second CCD motion mechanism 166 is disposed on the first surface 134 near the second end 137, and is configured to control the motion of the second CCD camera 153. The image capturing motion mechanism can move the CCD camera to capture edge information of the workpiece through manipulation of the first CCD motion mechanism 164 and the second CCD motion mechanism 166, thereby positioning the workpiece.

In this embodiment, the code scanning mechanism 165 is disposed on the second surface 135 and near the second end 137 for controlling the movement of the code scanner 170.

In the present embodiment, the X-axis movement mechanism 161 and the Y-axis movement mechanism 162 are driven by linear motors. The linear motor drive can prevent the X-axis movement mechanism 161 and the Y-axis movement mechanism 162 from being severely shaken during the operation, and the accuracy and efficiency can be improved when the linear motor drive is used for repeated positioning. The Z-axis movement mechanism 163, the image capturing movement mechanism, and the code scanning movement mechanism 165 are driven by servo motors.

Referring to fig. 4, in an embodiment of the present application, the laser drilling apparatus further includes a spectrometer 191, where the spectrometer 191 is disposed on the upper partition 131 and is used to perform a transmittance test on the workpiece after the laser drilling is completed. Specifically, after the workpiece is subjected to the drilling process, the drilling quality of the workpiece needs to be detected, and therefore, whether the workpiece is transparent or not is detected by using the spectrometer 191, so that the quality of the drilled hole is judged.

Referring to fig. 7, in an embodiment of the present application, the controller 180 further includes a marking card 184, and the marking card 184 is electrically connected to the controller 180 and is configured to control the galvanometer 143 to mark the two-dimensional barcode on a designated position of the workpiece.

Specifically, the marking card 184 is connected to a data interface of the industrial computer 181, the industrial computer 181 sends a control instruction to the marking card 184, and the marking card 184 receives the instruction, adjusts the direction of the laser beam by controlling the galvanometer 143, and marks the two-dimensional barcode on the workpiece.

in this embodiment, the data interface between the marking card 184 and the industrial computer 181 may adopt a transmission interface such as a USB interface or an RS232 interface.

referring to fig. 5 and 6, in one embodiment of the present application, the laser drilling apparatus further includes a cleaning assembly 192 for cleaning waste generated during the laser drilling process; the cleaning assembly 192 includes a blowing element 1921 and a suction element 1922. The blowing element 1921 is disposed on the substrate 110 and is coaxial with the focusing mirror 144. The dust suction member 1922 is disposed on the substrate 110 and connected to the air blowing member 1921.

in the drilling process, waste materials are easy to generate and need to be cleaned in time. Therefore, in the embodiment of the present application, a blowing element 1921 and a suction element 1922 are provided between the focusing mirror 144 and the workpiece. The air blowing element 1921 blows out waste materials generated in the drilling process, and the dust suction element 1922 sucks the blown waste materials away in time.

according to another aspect of the present application, there is provided a laser drilling method, please refer to fig. 8, including the following steps:

S110, loading the workpiece to the jig stage 120;

s130, controlling the laser beam to move to a drilling position through the vibrating mirror 143 according to the positioning information, and drilling according to drilling parameters preset by the controller 180;

S140, testing the light transmittance of the workpiece through the spectrometer 191, and detecting whether the workpiece after drilling is qualified;

S150, if the workpiece after the drilling is detected to be a qualified workpiece, calibrating the two-dimensional bar code to the qualified workpiece, and then scanning the two-dimensional bar code through the scanner 170 to obtain the workpiece information;

s170 after step S150 or step S160 is completed, the workpiece is unloaded from the jig stage 120.

in order to fully explain the laser drilling method of the present application, a detailed description will be given. In an embodiment of the present application, a user loads a workpiece to be processed to the jig stage 120, and image information of the workpiece is acquired by the image acquisition device. And acquiring the edge image of the workpiece by using the CCD camera during information acquisition so as to acquire the positioning information of the workpiece. The workpiece is positioned to a drilling position by the X-axis moving mechanism 161 and the Y-axis moving mechanism 162. The controller 180 sends a control command to the galvanometer 143, and the galvanometer 143 adjusts the direction of the laser beam and moves the laser beam to a desired drilling position for drilling. After the drilling process is finished, the spectrometer 191 is used for detecting the drilling quality, if the workpiece is penetrated to cause light transmission, the workpiece is an unqualified product, and at the moment, an alarm device is started to prompt a user that the workpiece is unqualified. The user unloads the workpiece from the clamp platform 120. And if the workpiece is not transparent, the workpiece is qualified, and the next procedure is needed, namely the workpiece information is obtained. The workpiece information includes processing information, workpiece parameter information, drilling information, and the like of the workpiece. The marking card 184 is used to control the galvanometer 143 to mark the two-dimensional barcode containing the workpiece information on the workpiece, and then the scanner 170 is used to scan the two-dimensional barcode of the workpiece to obtain the workpiece information. And finally displaying the workpiece information on the display. The user unloads the workpiece from the gripper platform 120.

the technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A laser drilling apparatus, comprising:

A substrate (110);

A jig stage (120) provided to the base plate (110) for loading and unloading a workpiece;

the supporting frame (130) is fixedly arranged on the base plate (110) and is arranged at an interval with the clamp platform (120);

A support plate (132) fixedly mounted on the substrate (110) and arranged perpendicular to the substrate (110);

the laser light path component (140) is arranged on the support plate (132) and is used for drilling the workpiece and calibrating the two-dimensional bar code;

The positioning assembly (150) is arranged on the support frame (130) and is used for positioning the workpiece;

a motion mechanism (160) disposed on the support frame (130) for moving the workpiece, the laser path assembly (140), and the positioning assembly (150);

The code scanner (170) is arranged on the support frame (130) and is used for scanning the two-dimensional bar code;

A controller (180) electrically connected to the laser path assembly (140), the positioning assembly (150), the motion mechanism (160), and the code scanner (170).

2. the laser drilling apparatus of claim 1, further comprising:

a frame body (111) fixedly mounted on the substrate (110);

the upper-layer partition plate (131) is arranged on the frame body (111) and is close to the top end of the frame body (111);

The laser light path assembly (140) comprises:

a laser generator (141) disposed on the upper barrier (131) for generating a laser beam;

the laser output device (142) is arranged on the supporting plate (132), is in light guide connection with the laser generator (141) through a light guide structure, and is used for outputting the laser beam generated by the laser generator (141);

A galvanometer (143) optically connected to the laser output (142), the galvanometer (143) deflecting the laser beam output by the laser output (142);

And the focusing mirror (144) is connected with the galvanometer (143) in a light guide manner, is coaxially arranged with the galvanometer (143), and is used for focusing the laser beam after the galvanometer (143) is shifted to the workpiece.

3. A laser drilling device according to claim 2, wherein the laser light path assembly (140) further comprises:

a laser power sensor (145) disposed on the substrate (110) and coaxial with the focusing mirror (144) for detecting a power value of the laser beam transmitted by the focusing mirror (144);

and the laser power controller (146) is arranged on the upper-layer partition board (131) and is electrically connected with the laser power sensor (145) and used for controlling the power of the laser beam.

4. a laser drilling device according to claim 1, wherein the positioning assembly (150) comprises:

the image acquisition device is arranged on the support frame (130) and is used for acquiring image information;

a light source (152) disposed on the clamp platform (120) for illuminating the image capture device;

A display electrically connected to the controller (180) for displaying image information.

5. A laser drilling device according to claim 4,

the support frame (130) comprises:

a first surface (134);

a second surface (135) opposite the first surface (134);

a first end (136); and

A second end (137) opposite the first end (136);

the image acquisition device includes:

A first CCD camera (151) disposed on the first surface (134) proximate the first end (136) for capturing a first edge image of the workpiece;

a second CCD camera (153) disposed on the first surface (134) proximate the second end (137) for capturing a second edge image of the workpiece;

a third CCD camera (155) disposed on the second surface (135) intermediate the first end (136) and the second end (137) for capturing an image of a third edge of the workpiece;

And the fourth CCD camera (157) is arranged on the second surface (135) and is positioned between the first end (136) and the second end (137) and close to the second end (137) and used for acquiring image information of the workpiece and detecting the drilling quality.

6. a laser drilling device according to claim 1, wherein the movement mechanism (160) comprises:

an X-axis motion mechanism (161) arranged on the substrate (110) and used for controlling the workpiece to horizontally move in the X-axis direction in a three-dimensional space;

the Y-axis motion mechanism (162) is arranged on the substrate (110), is vertical to the X-axis motion mechanism (161), and is used for controlling the workpiece to horizontally move in the Y-axis direction in a three-dimensional space;

a Z-axis motion mechanism (163) disposed on the support plate (132) and perpendicular to the substrate (110) for vertically moving the laser output device (142) along a Z-axis direction in a three-dimensional space;

Image acquisition motion mechanism, including: a first CCD motion mechanism (164) disposed on the first surface (134) and proximate to the first end (136) for controlling motion of the first CCD camera (151); a second CCD motion mechanism (166) disposed on the first surface (134) proximate to the second end (137) for controlling motion of the second CCD camera (153);

a code scanning motion mechanism (165) disposed on the second surface (135) and proximate to the second end (137) for controlling movement of the code scanner (170).

7. Laser drilling device according to claim 7,

the X-axis movement mechanism (161) and the Y-axis movement mechanism (162) are driven by linear motors;

The Z-axis movement mechanism (163), the image acquisition movement mechanism and the code scanning movement mechanism (165) are driven by servo motors.

8. the laser drilling device according to claim 1, wherein the controller (180) further comprises a marking card (184), and the marking card (184) is connected with the controller (180) and used for controlling the galvanometer (143) to mark the two-dimensional bar code to a specified position of the workpiece.

9. the laser drilling device according to claim 2, further comprising a spectrometer (191), wherein the spectrometer (191) is arranged on the upper partition plate (131) and is used for testing the light transmittance of the workpiece after laser drilling is completed.

10. the laser drilling apparatus of claim 2, further comprising a cleaning assembly (192) for cleaning waste material generated during the laser drilling process, the cleaning assembly (192) comprising:

An air-blowing element (1921) provided to the substrate (110) and coaxial with the focusing mirror (144);

and a dust suction member (1922) provided on the substrate (110) and connected to the air blowing member (1921).

11. a method of laser drilling, comprising the steps of:

s110, loading the workpiece to the clamp platform (120);

s130, controlling the laser beam to move to a drilling position through the galvanometer (143) according to the positioning information, and drilling according to drilling parameters preset by the controller (180);

s140, testing the light transmittance of the workpiece through the spectrometer (191), and detecting whether the workpiece after drilling is qualified;

S150, if the workpiece after the drilling is detected to be a qualified workpiece, calibrating the two-dimensional bar code to the qualified workpiece, and scanning the two-dimensional bar code through the code scanner (170) to acquire the workpiece information;

S170, unloading the workpiece from the clamp platform (120) after the step S150 or the step S160 is completed.