CN208556370U - A kind of laser hole drilling system of LCP flexible circuit board - Google Patents
A kind of laser hole drilling system of LCP flexible circuit board Download PDFInfo
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- CN208556370U CN208556370U CN201820799803.1U CN201820799803U CN208556370U CN 208556370 U CN208556370 U CN 208556370U CN 201820799803 U CN201820799803 U CN 201820799803U CN 208556370 U CN208556370 U CN 208556370U
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Abstract
The utility model relates to puncher structure technical fields, in particular to a kind of laser hole drilling system of LCP flexible circuit board.Including horizontal base plate, workbench, crossbeam and laser module；Y-direction motion module is disposed between workbench and horizontal base plate；X is provided between laser module and crossbeam to motion module and Z-direction motion module, it further includes mirror assembly that laser module, which includes galvanometer and the scanning lens for being fixed on galvanometer lower end,；Mirror assembly includes can be along X to the first reflecting mirror for moving and the second reflecting mirror that can be moved along Z-direction；Second reflecting mirror accepts the reflection laser of the first reflecting mirror on Z-direction direction positioned at the underface of the first reflecting mirror；Galvanometer is in same plane on direction for accepting the reflection laser of the second reflecting mirror in X with the second reflecting mirror.The perforating device structure of the utility model is simple, easy to operate, the precision of laser boring and high-efficient, adapts to the circuit board work pieces process of various different size models.
Description
Technical field
The utility model relates to puncher structure technical fields, in particular to a kind of laser drill of LCP flexible circuit board
Device.
Background technique
Since the data-interface of high-speed transfer requires circuit board to allow for bearing 5G upper and lower transmission speed per second, high speed
In transmission, extra thin copper foil can generate high temperature.The film coefficient of heat conduction and copper foil of polyimides (PI) material are variant.Eventually
Lead to PCB circuit board substrate warp, influences transmission speed.Since LCP is liquid crystal material, molecular orientation direction can control to adjust
Thermal expansion coefficient is saved, the performance close with copper foil is finally reached, to avoid because substrate warp occurs for high temperature, to bear more
The transmission speed of high speed.In addition to this, LCP also has more preferably frequency decay and moisture resistance, can greatly improve the property of product
Energy.With the rapid development of electronic product industry, people for product service performance and the requirement that is convenient for carrying also increasingly
Height, these products rely on fast and efficiently data channel for counsel very much.LCP flexible circuit board is punched in process of production,
Circuit board perforating device is punched using laser at present, and laser-beam drilling machine perforating efficiency is high, and production cost is low.
It, should such as the Chinese utility model patent of entitled " a kind of UV laser-beam drilling machine " of Patent No. " CN204771157U "
Patent describes a kind of perforating device, the device include for placing the workbench of workpiece, the transverse beam assembly on workbench,
The lifting assembly that can be moved in the horizontal direction is installed on transverse beam assembly, laser module, laser group are installed on lifting assembly
Part realizes the movement of vertical direction by lifting assembly.That is horizontal direction and vertical direction may be implemented in the laser module of the device
Movement, the laser conversion direction for being emitted laser module by the reflecting mirror of cross rail top realizes punching to workpiece.The dress
It is relatively simple to set structure, quick punching processing can be carried out to workpiece.But the mirror support of the device is fixation kit, and
Position adjustment is not can be carried out, adaptability is poor, and adjustment mode is comparatively laborious, switches difficult, hardly possible between the workpiece of different size
To increase substantially the efficiency of punching.
Summary of the invention
The purpose of this utility model seeks to the mirror assembly for the existing puncher for solving to mention in above-mentioned background technique
It is fixed structure, there are problems that adjusting that switching mode is more difficult, cumbersome, inefficiency, a kind of LCP flexible electrical is provided
The laser hole drilling system of road plate.
The technical solution of the utility model are as follows: a kind of laser hole drilling system of LCP flexible circuit board, including horizontal base plate,
Be arranged on horizontal base plate for carry circuit board to be processed workbench, be fixed on horizontal base plate and be suspended in workbench
On crossbeam and be arranged on crossbeam to the laser module of circuit board launch laser；Cloth between the workbench and horizontal base plate
It is equipped with the Y-direction motion module that driving workbench is moved along Y-direction；It is provided between the laser module and crossbeam sharp for driving
Along X to the X moved with Z-direction to motion module and Z-direction motion module, laser module includes galvanometer and is fixed under galvanometer optical assembly
The scanning lens at end,
It is characterized by also including mirror assemblies；The mirror assembly includes that can be used for what is moved by X along X
To the first reflecting mirror that the laser reflection of transmission is Z-direction and can be moved along Z-direction for by the laser reflection that Z-direction transmits be X to
And it transmits to the second reflecting mirror of galvanometer；Second reflecting mirror, which is located at immediately below the first reflecting mirror on Z-direction direction, to be held
Connect the reflection laser of the first reflecting mirror；The galvanometer is in same plane on direction for accepting in X with the second reflecting mirror
The reflection laser of second reflecting mirror.
The X to motion module include the first sliding rail and cunning along X to arrangement being set on crossbeam
Dynamic the first sliding block being connected on the first sliding rail；The first sliding block of driving is provided on first sliding block to move along the first sliding rail
Motor；First reflecting mirror is fixed on the first sliding block.
The Z-direction motion module include be set on the first sliding block along the second sliding rail of Z-direction arrangement and
The second sliding block being slidably connected on the second sliding rail；The second sliding block of driving is provided on second sliding block to move along the second sliding rail
Dynamic motor；The galvanometer and the second reflecting mirror is fixed on the second sliding block, and along X to arranged for interval.
The further Y-direction motion module includes the third sliding rail along Y-direction arrangement being set on horizontal base plate；Institute
The third sliding rail stated intersects with projection of first sliding rail on horizontal base plate；It is provided on the workbench for driving
The motor that workbench is moved along third sliding rail.
The detection device for detecting laser energy is provided on the further crossbeam.
The nanosecond for laser to occur is equipped on the crossbeam ultraviolet laser and has two laser
The optical path box of optical path；The optical path sealing drum of connection function has been disposed between the described nanosecond ultraviolet laser and optical path box；Institute
The detection device stated includes being mounted on energy detector corresponding with a laser optical path of optical path box on optical path box；Described
One reflecting mirror is corresponding in the side of optical path box and another laser optical path of optical path box to arranged for interval along X.
It further include further vision module；The vision module is to be fixed on the second sliding block for carrying out to galvanometer
Position the CCD sensing device of guidance.
The further vision module includes being fixed on the camera on the second sliding block being used to take pictures, being fixed on camera
Camera lens and be fixed on the second sliding block provide light source point light source.
The second sliding block lower end be equipped with close on the position of workbench for table surface into
The suction unit that row cleans.
The advantages of the utility model, has: 1, passing through adjustable first reflecting mirror in setting position and the second reflecting mirror, Neng Gouyou
Effect adapts to the variation that laser transmits position, and no matter how galvanometer position changes, and can guarantee in laser transfer to galvanometer always, shakes
Freely changing for three orientation may be implemented in mirror and workbench, can be used in the circuit board punching of various specifications model；
2, by the way that the first reflecting mirror and the second reflecting mirror to be separately mounted on the first sliding block and the second sliding block, two are simplified
Regulative mode in person's use process changes the two according to the variation of optical path box and galvanometer completely, keeps laser can be steady
Surely it is transferred on galvanometer, regulative mode is extremely simple；
3, by three groups of motion modules of setting, the movement on three directions of galvanometer and workbench is realized, galvanometer is adjusted
It is more accurate, the range of galvanometer adjusting has also been enlarged, can adapt to the work pieces process of various different sizes；
4, the operating condition that real-time detection can be facilitated to process laser by installing energy testing apparatus, can be more easily right
Entire processing effect is controlled, and the yield rate of work pieces process is improved；
5, it is convenient for accurately controlling the position of galvanometer by installation vision module, the precision of galvanometer control is improved, to improve
The precision and efficiency of laser processing；
6, the dust on work top can be siphoned away by installing suction unit, improves the working environment on workbench,
Improve the yield rate of work pieces process.
The perforating device structure of the utility model is simple, easy to operate, the precision of laser boring and high-efficient, adapts to various
The circuit board work pieces process of different size model has great promotional value.
Detailed description of the invention
Fig. 1: the main view of the utility model；
Fig. 2: the axonometric drawing of the utility model；
Wherein: 1-horizontal base plate；2-workbench；3-crossbeams；4-galvanometers；5-scanning lenses；6-the first reflecting mirror；
7-the second reflecting mirror；8-the first sliding rail；9-the first sliding block；10-the second sliding rail；11-the second sliding block；12-third sliding rails；
13-nanosecond ultraviolet laser；14-optical path boxes；15-optical path sealing drums；16-energy detectors；17-cameras；18-mirrors
Head；19-point light sources；20-suction units.
Specific embodiment
The utility model is described in further detail in the following with reference to the drawings and specific embodiments.
Such as Fig. 1~2, a kind of laser hole drilling system of LCP flexible circuit board, including horizontal base plate 1, it is arranged in horizontal base plate
It is used to carry the workbench 2 of circuit board to be processed, the crossbeam 3 for being fixed on horizontal base plate 1 and being suspended on workbench 2 on 1
Be arranged on crossbeam 3 to the laser module of circuit board launch laser, wherein horizontal base plate 1 be entire perforating device carrying
Basis, workbench 2 are the carriers for carrying workpiece, and driving workbench 2 is disposed between workbench 2 and horizontal base plate 1 and is moved along Y-direction
Y-direction motion module.Workpiece transmitting laser of the laser module for on workbench 2 punches it, laser module and cross
It is provided between beam 3 for driving laser module along X to the X moved with Z-direction to motion module and Z-direction motion module.Pass through Y-direction
Motion module, X realize the adjustment in three directions between laser module and workbench to motion module and Z-direction motion module.
As shown in Fig. 1~2, nanosecond 13 He of ultraviolet laser for laser to occur is installed on the crossbeam 3 of the present embodiment
Optical path box 14 with two laser optical paths, nanosecond ultraviolet laser 13 and optical path box 14 between be disposed with the light of connection function
Road sealing drum 15.The optical path box 14 of the present embodiment has two laser optical paths, and a laser optical path is main optical path, for that will swash
Light is transmitted on laser module and punches to workpiece.Another optical path is light path, is used for laser transfer to detector
Upper carry out energy measuring is monitored laser with this.As shown in Fig. 1~2, the present embodiment be equipped on optical path box 14 with
The corresponding energy detector 16 of light path,
In use, the laser passed over is divided into two parts by optical path box 14, laser is entered by main optical path all the way
Workpiece is punched to laser module, another way laser is entered in energy detector 16 and is detected by energy detector 16,
This fraction of laser light energy is more faint.
Laser needs to carry out transfer laser the adjustment in direction and position during entering laser module, such as Fig. 1~2
Shown, the present embodiment between laser module and optical path box 14 by arranging that mirror assembly realizes the tune of laser direction and position
It is whole.Mirror assembly include can along X to move for by X to the first reflecting mirror 6 that the laser reflection of transmission is Z-direction and can edge
The mobile laser reflection for transmitting Z-direction of Z-direction for X to and transmission to the second reflecting mirror 7 of galvanometer 4, the second reflecting mirror 7 exists
On Z-direction direction positioned at the first reflecting mirror 6 underface accept the first reflecting mirror 6 reflection laser, galvanometer 4 X on direction with
Second reflecting mirror 7 is in same plane for accepting the reflection laser of the second reflecting mirror 7.
After laser comes out from optical path box 14, be transmitted on the first reflecting mirror 6 first, the first reflecting mirror 6 by along X to transmitting
Laser reflection is to emit along Z-direction, and the second reflecting mirror 7 is located at the underface of the first reflecting mirror 6, accepts the laser emitted along Z-direction, and
It is reflected into along X to transmitting, is entered in laser module.Since the first reflecting mirror 6 can be along X to moving, the first reflecting mirror 6
It can be adjusted accordingly according to the movement of laser module, it is ensured that the two is opposing stationary on direction in X.Second reflecting mirror
7 can move along Z-direction, it is ensured that laser can enter on laser module from the first reflecting mirror 6, and the two is kept on Y-direction direction
It is opposing stationary.
As shown in Fig. 1~2, laser module includes galvanometer 4 and is fixed on sweeping for 4 lower end of galvanometer the laser module of the present embodiment
Retouch lens 5, the first transmitting mirror 6 keeps opposing stationary with galvanometer 4 on direction in X, the second transmitting mirror 7 on Z-direction direction with vibration
Mirror 4 keeps opposing stationary.During practical adjustments, the X of the present embodiment is to motion module as shown in Fig. 1~2, and X is to motion module
Including be set on crossbeam 3 along X to the first sliding rail 8 of arrangement and the first sliding block 9 being slidably connected on the first sliding rail 8,
The motor that the first sliding block 9 of driving is moved along the first sliding rail 8 is provided on first sliding block 9, the first reflecting mirror 6 is fixed on the first sliding block
On 9.Wherein, the first reflecting mirror 6 is fixed on the first sliding block 9, and the first sliding block 9 can be followed to move together along the first sliding rail 8.
The Z-direction motion module Z-direction motion module of the present embodiment includes being set on the first sliding block 9 along the second of Z-direction arrangement
Sliding rail 10 and the second sliding block 11 being slidably connected on the second sliding rail 10 are provided with the second sliding block 11 of driving on second sliding block 11
The motor moved along the second sliding rail 10, galvanometer 4 and the second reflecting mirror 7 are fixed on the second sliding block 11, and along X to arranged for interval.
Wherein, the second reflecting mirror 7 is fixed on the second sliding block 11, and the second sliding block 11 itself can follow the first sliding block 9 along X to moving,
Second reflecting mirror 7 can follow the second sliding block 11 to move along Z-direction again, i.e. the second reflecting mirror 7 can actually realize X to and Z-direction
The position in direction is adjusted, and the second reflecting mirror 7 is fixed on the second sliding block 11, keeps opposing stationary with galvanometer 4.
Realize the adjusting of Y-direction position, the present embodiment is disposed with Y-direction motion module on horizontal base plate 1, as shown in Fig. 2,
Y-direction motion module includes the third sliding rail 12 along Y-direction arrangement being set on horizontal base plate 1, third sliding rail 12 and the first sliding rail 8
Projection on horizontal base plate intersects, and the electricity for driving workbench 2 to move along third sliding rail 12 is provided on workbench 2
Machine.Wherein, third sliding rail 12 and the first sliding rail 8 are to intersect on Z-direction direction, i.e., galvanometer 4 can be moved to work by adjusting
Make to carry out laser boring right above the workpiece on platform 2.
When practical operation, in order to be accurately positioned galvanometer 4, the present embodiment is equipped on the second sliding block 11 for galvanometer
4 carry out the vision module of positioning guidance.Vision module includes being fixed on the camera 17 on the second sliding block 11 being used to take pictures, being fixed on
It camera lens 18 on camera 17 and is fixed on the second sliding block 11 point light source 19 of light source is provided.
In addition, the present embodiment is under the second sliding block 11 in order to avoid the clast generated in drill process does not influence to produce
End is equipped with the suction unit 20 for being cleaned to 2 table top of workbench close on the position of workbench 2.
When actual processing, workpiece to be processed is placed on workbench 2, vision module to the module on workbench 2 into
Row is taken pictures, and the position of galvanometer 4 is instructed to adjust, workbench 2 is moved along third sliding rail 12, the first sliding block 9 is moved along the first sliding rail 8,
Second sliding block 11 is moved along the second sliding rail 10, until galvanometer 4 just with the work pieces process aligned in position on workbench 2.
Nanosecond, ultraviolet laser 13 generated laser, and laser enters optical path box 14 by optical path sealing drum 15, is divided into two beams,
All the way in Laser emission to the first reflecting mirror 6, the first reflecting mirror 6 by X to laser reflection be along Z-direction to be emitted to the second reflecting mirror
On 7, the laser reflection that Z-direction emits is along X to being reflected on galvanometer 4 by the second reflecting mirror 7, and laser is got to by scanning lens 5
On workpiece, workpiece is punched.
Another way laser enters directly into energy detector 16, is measured in real time by energy detector 16, monitoring
Laser energy variation.
For the X of the present embodiment to the left and right directions for referring to Fig. 1, Y-direction refers to the drawing direction of vertical view 1, and Z-direction refers to upper and lower in Fig. 1
Direction.
Basic principles, main features, and advantages of the present invention has been shown and described above.Current row
The technical staff of industry is described in above embodiments and description it should be appreciated that the present utility model is not limited to the above embodiments
Only illustrate the principles of the present invention, the utility model can also on the premise of not departing from the spirit and scope of the utility model
There are various changes and modifications, these various changes and improvements fall within the scope of the claimed invention.The utility model is wanted
Protection scope is asked to be defined by appended claims and its equivalent.
Claims (9)
1. a kind of laser hole drilling system of LCP flexible circuit board, including horizontal base plate (1), the use being arranged on horizontal base plate (1)
In the workbench (2) for carrying circuit board to be processed, the crossbeam (3) for being fixed on horizontal base plate (1) and being suspended on workbench (2)
With the laser module being arranged on crossbeam (3) to circuit board launch laser；Between the workbench (2) and horizontal base plate (1)
It is disposed with the Y-direction motion module that driving workbench (2) is moved along Y-direction；It is arranged between the laser module and crossbeam (3) useful
In driving laser module along X to the X moved with Z-direction to motion module and Z-direction motion module, laser module include galvanometer (4) and
It is fixed on the scanning lens (5) of galvanometer (4) lower end,
It is characterized by also including mirror assemblies；The mirror assembly include can along X to move for by X to biography
The laser reflection penetrated is the first reflecting mirror (6) of Z-direction and the laser reflection for transmitting Z-direction that can be moved along Z-direction is X to simultaneously
It transmits to the second reflecting mirror (7) of galvanometer (4)；Second reflecting mirror (7) is located at the first reflecting mirror (6) on Z-direction direction
Underface accept the first reflecting mirror (6) reflection laser；The galvanometer (4) X on direction with the second reflecting mirror (7) at
It is used to accept the reflection laser of the second reflecting mirror (7) in same plane.
2. a kind of laser hole drilling system of LCP flexible circuit board as described in claim 1, it is characterised in that: the X is to fortune
Dynamic model block includes being set to the first sliding rail (8) of arrangement and being slidably connected on the first sliding rail (8) on crossbeam (3) along X
The first sliding block (9)；The electricity that driving the first sliding block (9) is moved along the first sliding rail (8) is provided on first sliding block (9)
Machine；First reflecting mirror (6) is fixed on the first sliding block (9).
3. a kind of laser hole drilling system of LCP flexible circuit board as claimed in claim 2, it is characterised in that: the Z-direction fortune
Dynamic model block includes being set on the first sliding block (9) along the second sliding rail (10) of Z-direction arrangement and being slidably connected to the second sliding rail
(10) the second sliding block (11) on；Driving the second sliding block (11) is provided on second sliding block (11) along the second sliding rail (10)
Mobile motor；The galvanometer (4) and the second reflecting mirror (7) is fixed on the second sliding block (11), and along X to arranged for interval.
4. a kind of laser hole drilling system of LCP flexible circuit board as described in claim 1, it is characterised in that: the Y-direction fortune
Dynamic model block includes the third sliding rail (12) along Y-direction arrangement being set on horizontal base plate (1)；The third sliding rail (12) and the
Projection of one sliding rail (8) on horizontal base plate intersects；It is provided on the workbench (2) for driving workbench (2)
The motor mobile along third sliding rail (12).
5. a kind of laser hole drilling system of LCP flexible circuit board as described in claim 1, it is characterised in that: the crossbeam
(3) detection device for detecting laser energy is provided on.
6. a kind of laser hole drilling system of LCP flexible circuit board as claimed in claim 5, it is characterised in that: the crossbeam
(3) the nanosecond ultraviolet laser (13) for laser to occur and the optical path box (14) with two laser optical paths are installed on；Institute
The optical path sealing drum (15) of connection function has been disposed between the nanosecond ultraviolet laser (13) stated and optical path box (14)；Described
Detection device includes being mounted on energy detector (16) corresponding with a laser optical path of optical path box (14) on optical path box (14)；
First reflecting mirror (6) is along X to arranged for interval in the side of optical path box (14) and another laser light of optical path box (14)
Road is corresponding.
7. a kind of laser hole drilling system of LCP flexible circuit board as claimed in claim 3, it is characterised in that: further include vision
Module；The vision module is to be fixed on the second sliding block (11) for carrying out the CCD sensing dress of positioning guidance to galvanometer (4)
It sets.
8. a kind of laser hole drilling system of LCP flexible circuit board as claimed in claim 7, it is characterised in that: the vision
Module include be fixed on camera (17) on the second sliding block (11) for taking pictures, the camera lens (18) that is fixed on camera (17) and
It is fixed on the second sliding block (11) and the point light source (19) of light source is provided.
9. a kind of laser hole drilling system of LCP flexible circuit board as claimed in claim 3, it is characterised in that: described second
Sliding block (11) lower end is equipped with the suction unit for being cleaned to workbench (2) table top close on the position of workbench (2)
(20)。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820799803.1U CN208556370U (en) | 2018-05-28 | 2018-05-28 | A kind of laser hole drilling system of LCP flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820799803.1U CN208556370U (en) | 2018-05-28 | 2018-05-28 | A kind of laser hole drilling system of LCP flexible circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN208556370U true CN208556370U (en) | 2019-03-01 |
Family
ID=65482330
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820799803.1U Active CN208556370U (en) | 2018-05-28 | 2018-05-28 | A kind of laser hole drilling system of LCP flexible circuit board |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110337188A (en) * | 2019-08-01 | 2019-10-15 | 南理工泰兴智能制造研究院有限公司 | A kind of laser hole drilling system of LCP flexible circuit board |
| CN110549018A (en) * | 2019-05-31 | 2019-12-10 | 深圳市杰普特光电股份有限公司 | Laser drilling device and method |
| CN110560893A (en) * | 2019-08-22 | 2019-12-13 | 北京华卓精科科技股份有限公司 | Laser annealing optical system |
| CN110653501A (en) * | 2019-11-07 | 2020-01-07 | 苏州铂煜诺自动化设备科技有限公司 | UV laser processing equipment |
| CN112207891A (en) * | 2020-10-15 | 2021-01-12 | 罗静峰 | Perforating device for aligning PCB (printed circuit board) hard board through full-automatic transposition and overturning |
| CN112620983A (en) * | 2019-04-19 | 2021-04-09 | 吴国喜 | LCP drilling system and method |
| CN113547236A (en) * | 2021-07-01 | 2021-10-26 | 上海美维电子有限公司 | Laser drilling machine performance detection method |
-
2018
- 2018-05-28 CN CN201820799803.1U patent/CN208556370U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112620983A (en) * | 2019-04-19 | 2021-04-09 | 吴国喜 | LCP drilling system and method |
| CN110549018A (en) * | 2019-05-31 | 2019-12-10 | 深圳市杰普特光电股份有限公司 | Laser drilling device and method |
| CN110337188A (en) * | 2019-08-01 | 2019-10-15 | 南理工泰兴智能制造研究院有限公司 | A kind of laser hole drilling system of LCP flexible circuit board |
| CN110560893A (en) * | 2019-08-22 | 2019-12-13 | 北京华卓精科科技股份有限公司 | Laser annealing optical system |
| CN110653501A (en) * | 2019-11-07 | 2020-01-07 | 苏州铂煜诺自动化设备科技有限公司 | UV laser processing equipment |
| CN112207891A (en) * | 2020-10-15 | 2021-01-12 | 罗静峰 | Perforating device for aligning PCB (printed circuit board) hard board through full-automatic transposition and overturning |
| CN113547236A (en) * | 2021-07-01 | 2021-10-26 | 上海美维电子有限公司 | Laser drilling machine performance detection method |
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