CN210670782U

CN210670782U - Circuit board surface treatment equipment

Info

Publication number: CN210670782U
Application number: CN201920788482.XU
Authority: CN
Inventors: 刘明清; 李谦; 杨斌生; 谭远洋; 伍苏苏
Original assignee: Shenzhen Hymson Laser Intelligent Equipment Co Ltd
Current assignee: Hymson Laser Technology Group Co Ltd
Priority date: 2019-05-28
Filing date: 2019-05-28
Publication date: 2020-06-02
Anticipated expiration: 2029-05-28

Abstract

The utility model relates to a circuit board surface treatment equipment, including removing the subassembly, being used for the transmitter of transmitting laser and being used for the fixed mounting fixture who treats the processing test piece, mounting fixture with remove the subassembly and connect, and remove under the drive of subassembly and remove, so that the laser that the transmitter outgoing shines in the test piece surface. The utility model provides a circuit board surface treatment equipment adopts laser irradiation's mode to excise the glued membrane on test piece surface, and through the relative position between the laser beam that removal subassembly adjustment test piece and laser instrument sent, the glued membrane is from test piece surface gasification and elimination under laser irradiation, accomplishes the surface treatment to the test piece, and the course of working is simple, swift, and production efficiency is high to can not cause the damage to the test piece, improved the production yield.

Description

Circuit board surface treatment equipment

Technical Field

The utility model relates to a surface treatment and circuit board processing technology field especially relate to a circuit board surface treatment equipment.

Background

With the development of science and technology and the continuous update of electronic equipment, the requirements of the electronic industry on circuit boards are gradually increased, so that the circuit boards are developed towards high precision, high density, high reliability, low cost and small volume. The circuit board needs to be pre-pasted with a layer of adhesive film in the processing process so as to avoid damage to the circuit board when other process operations are carried out, but in order to carry out circuit connection, a plating layer on the circuit board needs to be exposed, and at the moment, the adhesive film on the circuit board needs to be removed.

The existing adhesive film on the circuit board is usually cut by a milling cutter, but the cutting cost of the milling cutter is higher, the cutting precision and efficiency are low due to the influence of the thickness of the adhesive film on the circuit board, and the production yield of the circuit board is low and the production efficiency is influenced due to the fact that fuzz is left on the edge of the processed circuit board.

SUMMERY OF THE UTILITY MODEL

The present invention provides a surface treatment device for circuit board to overcome the defects of low production efficiency and low production yield of circuit board.

The utility model provides a technical scheme that above-mentioned technical problem adopted is:

a circuit board surface treatment device comprises a moving assembly, a transmitter and a mounting fixture, wherein the moving assembly is mounted on a base, the transmitter is used for transmitting laser, the mounting fixture is used for fixing a test piece to be processed, and the mounting fixture is connected with the moving assembly and moves under the driving of the moving assembly so that the laser emitted by the transmitter irradiates the surface of the test piece.

In a preferred embodiment, the moving assembly includes a first moving module and a second moving module connected to each other, the first moving module is mounted on the base, and the mounting fixture is connected to the second moving module.

In a preferred embodiment, the first moving module comprises a first guide rail and a first sliding block slidably connected to the first guide rail, the second moving module comprises a second guide rail and a second sliding block slidably connected to the second guide rail, the second guide rail is connected to the first sliding block, and the mounting fixture is connected to the second sliding block.

In a preferred embodiment, the laser further comprises a galvanometer assembly, the galvanometer assembly is communicated with the emitter, and the galvanometer assembly receives and emits laser light emitted from the emitter.

In a preferred embodiment, the galvanometer assembly includes a first deflecting element, a second deflecting element, a focusing element, and a fourth moving module, the first deflecting element is connected to the emitter, the second deflecting element is connected to the focusing element, and the second deflecting element is driven by the fourth moving module to move relative to the first deflecting element.

In a preferred embodiment, the moving assembly further comprises a third moving module, the third moving module comprises a third guide rail and a third slider slidably connected to the third guide rail, and the focusing element is connected to the third slider and moves along with the third slider.

In a preferred embodiment, the device further comprises a mounting rack fixedly arranged on the base, and the emitter is connected with the mounting rack.

In a preferred embodiment, the test piece further comprises a positioning assembly, the positioning assembly comprises a CCD camera and a light source element, the CCD camera and the light source element are both connected with the mounting frame, and the CCD camera is used for photographing and positioning the test piece.

In a preferred embodiment, the positioning assembly further includes a fifth moving module, the fifth moving module is connected to the mounting frame and the CCD camera, and the CCD camera is driven by the fifth moving module to move relative to the mounting frame.

In a preferred embodiment, the mounting fixture comprises an upper clamping plate and a lower clamping plate, the upper clamping plate covers the upper surface of the lower clamping plate, a mounting position for accommodating a test piece is arranged between the upper clamping plate and the lower clamping plate, and the lower clamping plate is connected with the second sliding block.

The utility model discloses following beneficial effect has at least:

the utility model provides a circuit board surface treatment equipment adopts laser irradiation's mode to excise the glued membrane on test piece surface, and through the relative position between the laser beam that removal subassembly adjustment test piece and laser instrument sent, the glued membrane is from test piece surface gasification and elimination under laser irradiation, accomplishes the surface treatment to the test piece, and the course of working is simple, swift, and production efficiency is high to can not cause the damage to the test piece, improved the production yield.

Drawings

The present invention will be further explained with reference to the drawings and examples.

FIG. 1 is a schematic structural diagram of one embodiment of a circuit board surface treatment device.

Detailed Description

The conception, specific structure and technical effects of the present invention will be described clearly and completely with reference to the accompanying drawings and embodiments, so as to fully understand the objects, aspects and effects of the present invention. It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.

It should be noted that, unless otherwise specified, when a feature is referred to as being "fixed" or "connected" to another feature, it may be directly fixed or connected to the other feature or indirectly fixed or connected to the other feature. Furthermore, the description of the upper, lower, left, right, etc. used in the present invention is only relative to the mutual positional relationship of the components of the present invention in the drawings.

Furthermore, unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used in the description herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any combination of one or more of the associated listed items.

Referring to fig. 1, the surface treatment equipment for a circuit board in the embodiment includes a base 10 and a moving assembly installed on the base 10, wherein an installation fixture 20 for fixing a test piece to be processed is installed above the moving assembly, and the installation fixture 20 can be driven by the moving assembly to move. The laser positioning device further comprises a transmitter 30, the transmitter 30 can emit laser, the position of the test piece is adjusted through movement of the movable assembly, the laser is aligned with the test piece to be processed and irradiated, and the surface adhesive film of the circuit board is removed.

The emitter 30 in this embodiment can adopt traditional laser emitter 30, drives the removal of test piece through moving the subassembly, adjusts the position of shining of laser beam on the test piece to shine the different areas that need get rid of the glued membrane to the test piece surface, accomplish getting rid of circuit board surface glued membrane, and the glued membrane gasifies when the excision, can not cause the damage to the circuit board.

The circuit board surface treatment equipment in this embodiment adopts laser irradiation's mode to excise the glued membrane on test piece surface, adjusts the relative position between the laser beam that test piece and laser instrument sent through removing the subassembly, and the glued membrane is from the gasification of test piece surface and eliminate under the irradiation of laser, accomplishes the surface treatment to the test piece, and the course of working is simple, swift, and production efficiency is high to cause the damage to the test piece, improved the production yield.

Preferably, the emitter 30 adopts an infrared picosecond laser, the infrared picosecond laser can emit laser pulses with picoseconds pulse width, the pulse energy is high, the precision is high, and the processing of micro-scale materials can be realized, and the infrared laser has the characteristics of high stability, low noise and high output power, so that the laser beam can remove a surface adhesive film of the test piece under weak energy by using the infrared picosecond laser, and the damage to the test piece due to the overhigh intensity of the laser beam is avoided. Preferably, the laser wavelength is not less than 1 μm, the laser focal length is not less than 300mm, and the long-focus and long-wavelength infrared laser has extremely high output energy percentage and high repetition frequency, so that the removal efficiency of the adhesive film can be improved, and the test piece is not damaged.

The moving assembly comprises a first moving module 40 and a second moving module 50, the second moving module 50 is overlapped above the first moving module 40, the first moving module 40 comprises a first guide rail 41 and a first sliding block 42 which is connected with the first guide rail 41 and can slide along the first guide rail 41; the second moving module 50 includes a second guide rail 51 and a second slider 52 connected to the second guide rail 51 and capable of sliding along the second guide rail 51; the first slider 42 is connected to the second guide rail 51, so that the second guide rail 51 can move synchronously with the first slider 42, so that the second slider 52 can move along the second guide rail 51 and can move along the first guide rail 41 along with the first slider 42; the mounting fixture 20 is connected above the second slide block 52 and can move along with the second slide block 52, so that the test piece can move along the first guide rail 41 and the second guide rail 51, and the purpose of adjusting the position of the test piece is achieved.

The first slider 42 and the second slider 52 can be driven by an air cylinder, and two air cylinders respectively connected with the first slider 42 and the second slider 52 are arranged to provide power for the movement of the first slider 42 and the second slider 52, so that the movement of the first slider 42 along the first guide rail 41 and the movement of the second slider 52 along the second guide rail 51 are realized. The first guide rail 41 and the second guide rail 51 are distributed in a crossed manner and form a certain angle, so that the first slide block 42 and the second slide block 52 can move along different directions, the moving range of the mounting clamp 20 is enlarged, and the flexibility of adjusting the position of the test piece is improved. The test piece moves along the direction pointed by the first guide rail 41 and the second guide rail 51 along with the mounting fixture 20, so that the position adjustment between the test piece and the laser beam is realized, the laser can irradiate different positions of the test piece, adhesive films at different positions of the test piece are removed, and the processing requirement of the test piece is met.

The laser device further comprises a galvanometer assembly 60, the galvanometer assembly 60 is communicated with the emitter 30, a laser beam emitted from the emitter 30 enters the galvanometer assembly 60 and is deflected in the galvanometer assembly 60, then the laser beam emitted from the galvanometer assembly 60 irradiates the surface of a test piece downwards, and an adhesive film on the surface of the test piece is removed.

The moving assembly further comprises a third moving module 70, the third moving module 70 comprises a third guide rail 71 and a third slider 72 connected with the third guide rail 71 and slidable along the third guide rail 71, the third guide rail 71 is vertically distributed, so that the third slider 72 can move in the vertical direction along the third guide rail 71. The galvanometer assembly 60 comprises a first deflection element 61, a second deflection element 62 and a focusing element 63, wherein the focusing element 63 is connected with a third slide block 72 and moves in the vertical direction along with the third slide block 72, so that the focusing position of the laser beam is adjusted, the focal position of the laser beam is just positioned on the surface of the test piece, and the processing precision is improved.

The first deflecting element 61 is connected to the emitter 30, the second deflecting element 62 is connected to the focusing element 63, and the laser beam emitted from the emitter 30 is deflected by the first deflecting element 61 and the second deflecting element 62 in sequence, so that the laser beam is emitted from the focusing element 63 in a vertical direction. The galvanometer assembly 60 further comprises a fourth moving module 64 which is vertically distributed, the fourth moving module 64 adopts a guide rail slider structure, the first deflecting element 61 and the second deflecting element 62 are both connected with the fourth moving module 64, specifically, the first deflecting element 61 is connected with a slider portion, and the second deflecting element 62 is connected with a guide rail portion, so that the first deflecting element 61 and the focusing element 63 can synchronously move in the vertical direction in the process that the focusing element 63 moves along with the third slider 72.

The first moving module 40, the second moving module 50, the third moving module 70 and the fourth moving module 64 are all provided with dust covers 12 with dust prevention functions, so that the working environment of the surface of the test piece is optimized, and the cleanliness of the processed test piece is improved.

Preferably, the first deflecting element 61 and the second deflecting element 62 may be a deflecting lens, and the focusing element 63 may be a field lens.

The device further comprises a mounting frame 11, the mounting frame 11 is fixedly connected above the base 10, and the emitter 30 is mounted on the mounting frame 11 and is relatively fixed with the mounting frame 11. The third guide rail 71 is connected to the mounting bracket 11 in a vertical state, and provides a space for the third slider 72 to move vertically.

Still include locating component 80, locating component 80 is connected with mounting bracket 11, and locating component 80 includes CCD camera 81 and light source component 82, and light source component 82 provides the illumination for CCD camera 81's shooting, through the location of shooing of CCD camera 81 to the test piece, improves the machining precision and the yields of test piece. The positioning assembly 80 further comprises a fifth moving module 83 in a vertical state, the fifth moving module 83 is of a guide rail sliding block structure, a guide rail part of the fifth moving module is fixedly connected with the mounting frame 11, a sliding block part of the fifth moving module is connected with the CCD camera 81, the CCD camera 81 can move in the vertical direction, and accurate photographing positioning of the test piece by the CCD camera 81 is guaranteed.

The light source element 82 adopts a bowl-shaped light source which can perform high-uniform diffusion illumination and eliminate the interference caused by uneven surface of a product; the light emitted by the bowl-shaped light source irradiates the surface of the test piece, is reflected on the surface of the test piece and then is emitted out through the light transmission hole in the top of the bowl-shaped light source, the CCD camera 81 is positioned above the light source element 82 and shoots the test piece below the light source element to obtain the position information of the test piece to be processed, so that the laser beam processes the corresponding position of the test piece, and the accuracy of the surface treatment of the test piece is improved.

The mounting fixture 20 comprises an upper clamping plate 21 and a lower clamping plate 22, the upper clamping plate 21 covers the lower clamping plate 22, the lower clamping plate 22 is fixedly connected with the second sliding block 52, and a mounting position for accommodating a test piece is arranged between the upper clamping plate 21 and the lower clamping plate 22; positioning holes or positioning columns for positioning are arranged on the upper clamping plate 21 and the lower clamping plate 22, so that the upper clamping plate and the lower clamping plate can be accurately positioned; be equipped with a plurality of through-holes on the punch holder 21, the test piece exposes from this through-hole department, under the prerequisite of guaranteeing that mounting fixture 20 advances line location to the test piece, locating component 80 can see through this through-hole and shoot the location to the test piece, and laser beam can shine the test piece through this through-hole, removes and glues the membrane processing.

Preferably, the device also comprises a marking card module, wherein the marking card module is connected with the galvanometer component 60 through a software system, and the emitting state (such as emitting direction, laser spot position and the like) of the laser beam emitted by the galvanometer component 60 is adjusted, so that the laser beam can be suitable for the surface treatment of test pieces of different types, and the practicability of the circuit board surface treatment equipment is improved.

The working flow of the circuit board surface treatment equipment is as follows: placing a test piece to be processed between the lower pressing plate and the upper pressing plate, and accurately covering the upper pressing plate on the lower pressing plate to realize the fixation of the test piece; the mounting fixture 20 is driven to move by the first moving module 40 and the second moving module 50, and the test piece is moved to a laser processing area; the position of the galvanometer component 60 is adjusted through the third moving module 70, so that the focus of the laser beam is positioned on the surface of the test piece; starting the positioning component 80 to photograph and position the test piece, and determining the position of the test piece to be processed; the emitter 30 and the galvanometer component 60 work, and laser beams emitted from the galvanometer component 60 irradiate the test piece to carry out surface treatment; the processed test piece is driven by the first moving module 40 and the second moving module 50 to move to the blanking area, the upper clamping plate 21 is separated from the lower clamping plate 22, and the processed test piece is taken out.

While the preferred embodiments of the present invention have been described, the present invention is not limited to the embodiments, and those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention, and such equivalent modifications or substitutions are intended to be included within the scope of the present invention as defined by the appended claims.

Claims

1. The circuit board surface treatment equipment is characterized by comprising a moving assembly, a transmitter and a mounting fixture, wherein the moving assembly is mounted on a base, the transmitter is used for transmitting laser, the mounting fixture is used for fixing a test piece to be processed, and the mounting fixture is connected with the moving assembly and is driven by the moving assembly to move so that the laser emitted by the transmitter irradiates the surface of the test piece.

2. The apparatus of claim 1, wherein the moving assembly comprises a first moving module and a second moving module connected to each other, the first moving module is mounted on the base, and the mounting fixture is connected to the second moving module.

3. The apparatus of claim 2, wherein the first moving module comprises a first rail and a first slider slidably connected to the first rail, the second moving module comprises a second rail and a second slider slidably connected to the second rail, the second rail is connected to the first slider, and the mounting fixture is connected to the second slider.

4. The apparatus of claim 1, further comprising a galvanometer assembly in communication with the emitter, the galvanometer assembly receiving and emitting laser light emitted from the emitter.

5. The apparatus for processing surface of circuit board according to claim 4, wherein the galvanometer assembly comprises a first deflecting element, a second deflecting element, a focusing element and a fourth moving module, the first deflecting element is connected to the transmitter, the second deflecting element is connected to the focusing element, and the second deflecting element is moved relative to the first deflecting element by the fourth moving module.

6. The apparatus of claim 5, wherein the moving assembly further comprises a third moving module, the third moving module comprises a third guide rail and a third slider slidably coupled to the third guide rail, and the focusing element is coupled to the third slider and moves with the third slider.

7. The apparatus of claim 5, further comprising a mounting bracket secured to the base, the transmitter being coupled to the mounting bracket.

8. The circuit board surface treatment equipment of claim 7, further comprising a positioning assembly, wherein the positioning assembly comprises a CCD camera and a light source element, the CCD camera and the light source element are both connected with the mounting frame, and the CCD camera is used for photographing and positioning the test piece.

9. The apparatus for processing the surface of a circuit board according to claim 8, wherein the positioning assembly further comprises a fifth moving module, the fifth moving module is connected to the mounting frame and the CCD camera, and the CCD camera is moved relative to the mounting frame by the fifth moving module.

10. The surface treatment equipment for the circuit board as claimed in claim 3, wherein the mounting fixture comprises an upper clamping plate and a lower clamping plate, the upper clamping plate covers the upper surface of the lower clamping plate, a mounting position for accommodating a test piece is arranged between the upper clamping plate and the lower clamping plate, and the lower clamping plate is connected with the second sliding block.