CN110534632A - 一种uv led封装工艺 - Google Patents
一种uv led封装工艺 Download PDFInfo
- Publication number
- CN110534632A CN110534632A CN201910816201.1A CN201910816201A CN110534632A CN 110534632 A CN110534632 A CN 110534632A CN 201910816201 A CN201910816201 A CN 201910816201A CN 110534632 A CN110534632 A CN 110534632A
- Authority
- CN
- China
- Prior art keywords
- substrate
- led
- packaging technology
- sealant
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012536 packaging technology Methods 0.000 title claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 45
- 229910052751 metal Inorganic materials 0.000 claims abstract description 28
- 239000002184 metal Substances 0.000 claims abstract description 28
- 239000000565 sealant Substances 0.000 claims abstract description 26
- 239000000843 powder Substances 0.000 claims abstract description 19
- 230000003287 optical effect Effects 0.000 claims abstract description 16
- 239000011261 inert gas Substances 0.000 claims abstract description 11
- 239000007767 bonding agent Substances 0.000 claims abstract description 10
- 238000007639 printing Methods 0.000 claims abstract description 6
- 238000007789 sealing Methods 0.000 claims abstract description 6
- 239000000919 ceramic Substances 0.000 claims description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 6
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 239000003085 diluting agent Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 4
- 230000001680 brushing effect Effects 0.000 claims description 4
- 238000005323 electroforming Methods 0.000 claims description 4
- 239000011265 semifinished product Substances 0.000 claims description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229920002120 photoresistant polymer Polymers 0.000 claims description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052786 argon Inorganic materials 0.000 claims description 2
- 239000007789 gas Substances 0.000 claims description 2
- 238000000227 grinding Methods 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims description 2
- 229910052754 neon Inorganic materials 0.000 claims description 2
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 claims description 2
- 229910052757 nitrogen Inorganic materials 0.000 claims 1
- 239000007800 oxidant agent Substances 0.000 claims 1
- 230000001590 oxidative effect Effects 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 claims 1
- 239000012812 sealant material Substances 0.000 claims 1
- 239000003292 glue Substances 0.000 abstract description 6
- 239000007787 solid Substances 0.000 abstract description 5
- 238000005516 engineering process Methods 0.000 abstract description 3
- 238000005538 encapsulation Methods 0.000 abstract description 2
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000000047 product Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002105 nanoparticle Substances 0.000 description 2
- 238000000016 photochemical curing Methods 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J163/10—Epoxy resins modified by unsaturated compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0812—Aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Led Device Packages (AREA)
Abstract
本发明涉及UV LED封装技术领域,尤其是一种UV LED封装工艺,包括如下步骤:在基板上点涂或刷涂结合剂;在芯片电路上贴置芯片;将结合剂加热,使芯片电路与基板贴合,并将芯片电路的电极与基板的电路连接;在基板上依次放置光学透镜,并点注密封剂使基板、金属杯和光学镜头依次连接;加热密封剂,使基板、金属杯和光学镜头固定成一体形成UV LED封装体;将基板和金属杯和光学透镜组合的腔体抽真空或者注入惰性气体;完成UV LED封装成品。本发明提供的一种UV LED封装工艺,通过使用含有纳米金属粉末的密封剂以及抽真空或者注入惰性气体,避免了传统固胶受UV光线高温影响会出现变黄脆化现象,保持芯片的密封空间,延长了芯片使用寿命。
Description
技术领域
本发明涉及UV LED封装技术领域,特别涉及一种散热性能好的一种UV LED封装工艺。
背景技术
三十多年以前紫外线(UV光)被成功的推广到商业应用。各胶黏剂生产商针对UV(紫外线)光固化特性,研制出用于粘接、密封、印刷等系列UV产品,并广泛应用于通讯、电子、光学、印刷等众多领域。这些产品在UV光(一定波长及一定光强度)照射下,会固化或硬化(聚合),并且与传统产品--UV光固化更加快高效、节能环保。
UV固化设备也经历了不断研发及完善的过程。以汞灯照射方式为主流的生产工艺被采用了很长时间。但由于设备价格昂贵、维护成本高、UV光照强度衰减快,被照射元件的表面温升高、体积大、耗材贵、贡污染等缺陷,业界一直致力于改进,但因原始硬件的局限性一直难以突破。
UV LED的问世,为UV固化行业带来了革命性的变化。其具有恒定的光照强度、优秀的温度控制、便携环保的特性,更有相对较低的采购成本和几乎为零的维护成本,对UV固化工艺的品质提升与节能降耗起到了推动作用。
现有UV LED内部结构一般包括有透镜、内引线、绝缘成型材料、外引线、固晶胶、UVLED芯片、透镜填充胶、导热柱、散热基板、荧光粉层等多个部份。在现有技术的UV LED封装中,避免传统固胶受UV光线高温影响会出现变黄脆化现象、减少芯片外界化学反应及延长芯片使用寿命成为一个技术难题。
发明内容
(一)解决的技术问题
本发明要解决的技术问题是:本发明提供的一种UV LED封装工艺,通过使用含有纳米金属粉末的密封剂以及抽真空或者注入惰性气体,避免了传统固胶受UV光线高温影响会出现变黄脆化现象,很好的保持芯片的密封空间,减少芯片外界化学反应,延长了芯片使用寿命。
(二)技术方案
为实现以上目的,本发明通过以下技术方案予以实现:
一种UV LED封装工艺,包括如下步骤:
S10,将金属杯通过电镀铜的方式一层叠一层电镀成型到陶瓷板;
S11,在基板上点涂或刷涂结合剂;
S12,在芯片电路上贴置芯片;
S13,将结合剂加热,使芯片电路与基板贴合,并将芯片电路的电极与基板的电路连接;
S14,点注密封剂使基板和光学镜头连接;
S15,将基板和金属杯和光学透镜组合的腔体抽真空或者注入惰性气体;
S16,在S15步骤同时,80-100℃加热密封剂10-15分钟,使基板、金属杯和光学镜头固定一体形成UV LED封装体;
S17,将UV LED半成品移至150-170度的烘箱中烘烤1-2小时,进行最终完全密封成型。
优选的,所述基板为陶瓷基板或金属基板。
优选的,所述密封剂包括如下组分:聚氨酯丙烯酸酯,环氧树脂丙烯酸酯,活性稀释剂,光引发剂,纳米金属粉末。
优选的,各组分以及各组分重量百分比含量为:
聚氨酯丙烯酸酯10-15%
环氧树脂丙烯酸酯65-80%
活性稀释剂2-8%
光引发剂1-2%
纳米金属粉末1-4%。
优选的,所述密封剂包括如下组分:所述纳米金属粉末为纳米铜粉、纳米银粉、纳米铝粉、纳米镍粉中的一种或几种。
所述在所述基板上形成密封剂层步骤还包括:对所述密封剂层进行打磨处理,露出所述电极凸点。
所述在所述基板上形成密封剂层步骤所述密封剂中掺有高导热材料和/或光阻材料。
(三)有益效果
本发明提供了一种散热性能好的一种UV LED封装工艺,具备以下有益效果:
本发明提供的一种UV LED封装工艺,通过使用含有纳米金属粉末的密封剂以及抽真空或者注入惰性气体,避免了传统固胶受UV光线高温影响会出现变黄脆化现象,很好的保持芯片的密封空间,减少芯片外界化学反应,延长了芯片使用寿命。
具体实施方式
所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
实施例1:
一种UV LED封装工艺,包括如下步骤:
S10,将金属杯通过电镀铜的方式一层叠一层电镀成型到陶瓷板;
S11,在基板上点涂或刷涂结合剂;
S12,在芯片电路上贴置芯片;
S13,将结合剂加热,使芯片电路与基板贴合,并将芯片电路的电极与基板的电路连接;
S14,点注密封剂使基板和光学镜头连接;
S15,将基板和金属杯和光学透镜组合的腔体抽真空或者注入惰性气体;
S16,在S15步骤同时,80-100℃加热密封剂10-15分钟,使基板、金属杯和光学镜头固定一体形成UV LED封装体;
S17,将UV LED半成品移至150-170度的烘箱中烘烤1-2小时,进行最终完全密封成型。
密封剂中各组分以及各组分重量百分比含量为:
聚氨酯丙烯酸酯10%
环氧树脂丙烯酸酯65%
活性稀释剂2%
光引发剂1%
纳米铜粉1%
实施例2:
一种UV LED封装工艺,包括如下步骤:
S10,将金属杯通过电镀铜的方式一层叠一层电镀成型到陶瓷板;
S11,在基板上点涂或刷涂结合剂;
S12,在芯片电路上贴置芯片;
S13,将结合剂加热,使芯片电路与基板贴合,并将芯片电路的电极与基板的电路连接;
S14,点注密封剂使基板和光学镜头连接;
S15,将基板和金属杯和光学透镜组合的腔体抽真空或者注入惰性气体;
S16,在S15步骤同时,80-100℃加热密封剂10-15分钟,使基板、金属杯和光学镜头固定一体形成UV LED封装体;
S17,将UV LED半成品移至150-170度的烘箱中烘烤1-2小时,进行最终完全密封成型。
密封剂中各组分以及各组分重量百分比含量为:
聚氨酯丙烯酸酯15%
环氧树脂丙烯酸酯80%
活性稀释剂8%
光引发剂2%
纳米铝粉4%
在上述两个实施例中,所述基板为陶瓷基板或金属基板;所述惰性气体可以为氮气、氩气或者氖气;所述在所述基板上形成密封剂层步骤还包括:对所述密封剂层进行打磨处理,露出所述电极凸点;所述密封剂中掺有高导热材料和/或光阻材料。
综上所述,本发明提供的一种UV LED封装工艺,通过使用含有纳米金属粉末的密封剂以及抽真空或者注入惰性气体,避免了传统固胶受UV光线高温影响会出现变黄脆化现象,很好的保持芯片的密封空间,减少芯片外界化学反应,延长了芯片使用寿命。
尽管已经示出和描述了本发明的实施例,对于本领域的普通技术人员而言,可以理解在不脱离本发明的原理和精神的情况下可以对这些实施例进行多种变化、修改、替换和变型,本发明的范围由所附权利要求及其等同物限定。
Claims (9)
1.一种UV LED封装工艺,包括如下步骤:
S10,将金属杯通过电镀铜的方式一层叠一层电镀成型到陶瓷板;
S11,在基板上点涂或刷涂结合剂;
S12,在芯片电路上贴置芯片;
S13,将结合剂加热,使芯片电路与基板贴合,并将芯片电路的电极与基板的电路连接;
S14,点注密封剂使基板和光学镜头连接;
S15,将基板和金属杯和光学透镜组合的腔体抽真空或者注入惰性气体;
S16,在S15步骤同时,80-100℃加热密封剂10-15分钟,使基板、金属杯和光学镜头固定一体形成UV LED封装体;
S17,将UV LED半成品移至150-170度的烘箱中烘烤1-2小时,进行最终完全密封成型。
2.如权利要求1所述的一种UV LED封装工艺,其特征在于:所述基板为陶瓷基板或金属基板。
3.如权利要求1所述的一种UV LED封装工艺,其特征在于:所述LED密封剂包括如下组分:聚氨酯丙烯酸酯,环氧树脂丙烯酸酯,活性稀释剂,光引发剂,纳米金属粉末。
4.如权利要求3所述的一种UV LED封装工艺,其特征在于,各组分以及各组分重量百分比含量为:
聚氨酯丙烯酸酯10-15%
环氧树脂丙烯酸酯65-80%
活性稀释剂2-8%
光引发剂1-2%
纳米金属粉末1-4%。
5.如权利要求4所述的一种UV LED封装工艺,其特征在于:所述纳米金属粉末为纳米铜粉、纳米银粉、纳米铝粉、纳米镍粉中的一种或几种。
6.如权利要求1所述的一种UV LED封装工艺,其特征在于:所述惰性气体为氮气、氩气或者氖气。
7.如权利要求1所述的一种UV LED封装工艺,其特征在于:所述在所述基板上形成密封剂层步骤还包括:对所述密封剂层进行打磨处理,露出所述电极凸点。
8.如权利要求7所述的一种UV LED封装工艺,其特征在于:所述密封剂中掺有高导热材料和/或光阻材料。
9.一种如权利要求1-8任一项所述的UV LED芯片的封装方法所制备的UVLED封装结构。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910816201.1A CN110534632A (zh) | 2019-08-30 | 2019-08-30 | 一种uv led封装工艺 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910816201.1A CN110534632A (zh) | 2019-08-30 | 2019-08-30 | 一种uv led封装工艺 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN110534632A true CN110534632A (zh) | 2019-12-03 |
Family
ID=68665640
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910816201.1A Pending CN110534632A (zh) | 2019-08-30 | 2019-08-30 | 一种uv led封装工艺 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN110534632A (zh) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104031598A (zh) * | 2014-06-30 | 2014-09-10 | 江苏华程光电科技有限公司 | 高导热性led密封胶 |
CN107527978A (zh) * | 2017-08-15 | 2017-12-29 | 江苏稳润光电科技有限公司 | 一种大功率紫外led真空封装器件及其制造方法 |
CN109346593A (zh) * | 2018-09-19 | 2019-02-15 | 中山市瑞宝电子科技有限公司 | 基于切割技术的陶瓷支架围坝成型方法 |
CN109473512A (zh) * | 2018-09-30 | 2019-03-15 | 广州市鸿利秉光电科技有限公司 | 一种全无机led灯及其封装方法 |
-
2019
- 2019-08-30 CN CN201910816201.1A patent/CN110534632A/zh active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104031598A (zh) * | 2014-06-30 | 2014-09-10 | 江苏华程光电科技有限公司 | 高导热性led密封胶 |
CN107527978A (zh) * | 2017-08-15 | 2017-12-29 | 江苏稳润光电科技有限公司 | 一种大功率紫外led真空封装器件及其制造方法 |
CN109346593A (zh) * | 2018-09-19 | 2019-02-15 | 中山市瑞宝电子科技有限公司 | 基于切割技术的陶瓷支架围坝成型方法 |
CN109473512A (zh) * | 2018-09-30 | 2019-03-15 | 广州市鸿利秉光电科技有限公司 | 一种全无机led灯及其封装方法 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN204130585U (zh) | 一种紫外led器件 | |
CN106684227B (zh) | 一种紫外led封装方法 | |
CN103682047B (zh) | 一种led无机封装用盖板 | |
CN207753046U (zh) | 一种led封装器件 | |
CN208538852U (zh) | 一种led芯片的封装产品 | |
CN104064660A (zh) | Led灌胶封装工艺 | |
CN106531858A (zh) | 紫外led封装方法 | |
CN103606616B (zh) | 一种led封装工艺 | |
CN110148671A (zh) | 有机电子器件封装多层光固化树脂全面覆盖封装方法 | |
CN110429170B (zh) | 一种用紫外光固化的芯片器件封装工艺 | |
CN103943763B (zh) | 一种倒装led芯片的封装结构及方法 | |
CN105870298A (zh) | 一种led光源的封装方法 | |
CN106159060A (zh) | 一种led封装工艺 | |
CN110534632A (zh) | 一种uv led封装工艺 | |
CN106206920A (zh) | Led封装结构、封装方法及具有该led封装结构的led灯 | |
CN104263304B (zh) | 一种光固化灌注胶及应用方法 | |
CN203339218U (zh) | 一种薄膜型led器件 | |
CN106299042A (zh) | 一种紫外led光源无机封装方法 | |
CN101964389B (zh) | 一种芯片集成式大功率led封装工艺及其产品 | |
CN107331737A (zh) | 一种 led 封装方法 | |
CN109735235A (zh) | 一种导热高折射率led透明环氧树脂灌封胶及其制备方法 | |
CN107681038B (zh) | 一种led器件的制备方法 | |
CN112635635A (zh) | 玻璃透镜uvcled灯珠及其封装方法 | |
CN107086262A (zh) | 紫外光发光二极管封装方法 | |
CN203179942U (zh) | 一种具有隔离层保护的发光二极管器件 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191203 |