CN110527979B - Tail gas pipeline assembly for vapor deposition equipment and vapor deposition equipment - Google Patents

Tail gas pipeline assembly for vapor deposition equipment and vapor deposition equipment Download PDF

Info

Publication number
CN110527979B
CN110527979B CN201810515736.0A CN201810515736A CN110527979B CN 110527979 B CN110527979 B CN 110527979B CN 201810515736 A CN201810515736 A CN 201810515736A CN 110527979 B CN110527979 B CN 110527979B
Authority
CN
China
Prior art keywords
pipe
outer sleeve
sub
cavity
lining pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201810515736.0A
Other languages
Chinese (zh)
Other versions
CN110527979A (en
Inventor
兰云峰
史小平
李春雷
王勇飞
王帅伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Naura Microelectronics Equipment Co Ltd
Original Assignee
Beijing Naura Microelectronics Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing Naura Microelectronics Equipment Co Ltd filed Critical Beijing Naura Microelectronics Equipment Co Ltd
Priority to CN201810515736.0A priority Critical patent/CN110527979B/en
Publication of CN110527979A publication Critical patent/CN110527979A/en
Application granted granted Critical
Publication of CN110527979B publication Critical patent/CN110527979B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4408Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber by purging residual gases from the reaction chamber or gas lines

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

The invention provides a tail gas pipeline assembly for vapor deposition equipment, which comprises an outer sleeve and an inner lining pipe, wherein the inner lining pipe is arranged in a pipe cavity of the outer sleeve, and a cavity is formed between the inner lining pipe and the outer sleeve; a main injection hole penetrating through the lining pipe along the thickness direction of the pipe wall of the lining pipe is formed in the lining pipe, and the main injection hole is communicated with the cavity; the outer sleeve is provided with a fluid inlet which penetrates through the outer sleeve along the thickness direction of the wall of the outer sleeve, and fluid can be sprayed out in a mist form through the main spray hole through the cavity. The invention also provides vapor deposition equipment comprising the tail gas pipeline assembly. The tail gas treatment pipeline component of the vapor deposition equipment has less or no residual particles, so that the damage to a vacuum pump can be reduced or even eliminated.

Description

Tail gas pipeline assembly for vapor deposition equipment and vapor deposition equipment
Technical Field
The invention relates to the field of vapor deposition equipment, in particular to a tail gas pipeline assembly for vapor deposition equipment and vapor deposition equipment comprising the tail gas pipeline assembly.
Background
Vapor deposition is to form a film structure on a substrate disposed in a process chamber of a vapor deposition apparatus by introducing process gas into the process chamber. The vapor deposition equipment comprises a tail gas pipe for exhausting reaction tail gas from the process cavity, and after the deposition step is finished, the excessive process gas needs to be pumped out of the process cavity through the tail gas pipe by using a vacuum pump. In the process, the unreacted process gas may be further deposited on the tube wall of the exhaust pipe and the valve disposed in the exhaust pipe, which may not only affect the normal operation of the valve, but also may be pumped into the vacuum pump, causing damage to the vacuum pump.
For example, Al formation is performed by using the vapor deposition apparatus shown in FIG. 12O3Deposition of a single atomic layer of a thin filmIn the deposition process, first, Trimethyl Aluminum (TMA) gas is introduced into the process chamber of the process chamber 200 to adhere Trimethyl Aluminum to the substrate, purge gas is introduced to purge the substrate, and the purge gas and the excess TMA gas are pumped out through the off-gas treatment pipe 100 by the vacuum pump 500. After purging is finished, introducing water vapor mist to enable water molecules to be deposited on the substrate and react with TMA molecules to form Al2O3A film. Then, the process chamber and the pipeline are purged by introducing purge gas. During this process, unreacted process gases may continue to react to produce Al2O3Attached to the pipe wall and to the valve. Due to Al2O3If the vacuum pump is hard, the vacuum pump is very likely to be stuck if the vacuum pump is pumped into the vacuum pump.
It is common practice to change the process parameters so that TMA reacts as completely as possible with the water mist, but all chemical reactions are not 100% complete and therefore unreacted process gas is still present.
Therefore, how to prevent the unreacted process gas from continuing to react to form particle products in the purging process becomes a technical problem to be solved in the field.
Disclosure of Invention
The invention aims to provide an exhaust gas pipeline assembly for a vapor deposition device and the vapor deposition device comprising the exhaust gas pipeline assembly, wherein residual particles in the exhaust gas pipeline assembly are less or even no, so that the damage to a vacuum pump can be reduced or even eliminated.
In order to achieve the above object, as one aspect of the present invention, there is provided an off-gas piping assembly for a vapor deposition apparatus, wherein the off-gas piping assembly includes an outer jacket pipe and an inner liner pipe, wherein,
the inner lining pipe is arranged in the pipe cavity of the outer sleeve, and a cavity is formed between the inner lining pipe and the outer sleeve;
a main injection hole penetrating through the lining pipe along the thickness direction of the pipe wall of the lining pipe is formed in the lining pipe, and the main injection hole is communicated with the cavity;
the outer sleeve is provided with a fluid inlet which penetrates through the outer sleeve along the thickness direction of the wall of the outer sleeve, and fluid can be sprayed out in a mist form through the main spray hole through the cavity.
Preferably, the exhaust pipeline assembly further comprises an upper connecting plate and a lower connecting plate, wherein,
the upper connecting plate is connected to one end of the outer sleeve and one end of the inner lining pipe, and the lower connecting plate is connected to the other end of the outer sleeve and the other end of the inner lining pipe, so that the cavity is defined by the upper connecting plate, the lower connecting plate, the outer surface of the inner lining pipe and the inner surface of the outer sleeve.
Preferably, the lower connecting plate is formed with an auxiliary injection hole penetrating through the lower connecting plate in the thickness direction of the lower connecting plate;
the axis of the auxiliary injection hole is gradually inclined toward the axis of the lining pipe from the upper surface of the lower connecting plate.
Preferably, the lining pipe comprises at least one section of sub pipe body, and the sub pipe body comprises an air outlet part and a flow guide part which are sequentially arranged along the axial direction of the sub pipe body;
the main injection hole is arranged on the air outlet part, and the inner surface of the flow guide part is inclined towards the axis of the sub-pipe body from the air outlet part gradually.
Preferably, the outer peripheral wall of the sub-tube body is recessed into the tube cavity along the radial direction of the sub-tube body to form a flow guiding concave part, and the flow guiding concave part is located at one end of the sub-tube body, which is far away from the main injection hole;
the flow guide concave part comprises a fixed surface and a flow guide surface arranged along the circumferential direction of the sub-pipe body.
Preferably, the lining pipe includes a plurality of sections of sub-pipe bodies, in two adjacent sections of the sub-pipe bodies, an end surface of the latter section of the sub-pipe body, which is close to the main injection hole, is connected to the fixing surface of the former section of the sub-pipe body, and the air outlet portion of the latter section of the sub-pipe body is arranged at an interval from the flow guide surface of the former section of the sub-pipe body.
Preferably, the axial length of the outer sleeve is greater than the axial length of the inner liner tube, and the lower end of the outer sleeve exceeds the lower end of the inner liner tube;
the exhaust pipeline assembly further comprises an exhaust pipe, a first switch valve and a second switch valve, the exhaust pipe is communicated with the outer sleeve on the part, exceeding the inner lining pipe, of the outer sleeve, the first switch valve is arranged on the outer sleeve, and the second switch valve is arranged on the exhaust pipe.
Preferably, the exhaust pipeline assembly further comprises a waste liquid collecting box;
the lower port of the outer sleeve forms a waste liquid outlet, and the waste liquid collecting box is selectively communicated with the waste liquid outlet.
Preferably, the tail gas pipeline assembly further comprises a first guide pipe, a second guide pipe, a third on-off valve and a fourth on-off valve;
one end of the first guide pipe is communicated with the fluid inlet, the second guide pipe is communicated with the first guide pipe, the third switch valve is arranged on the first guide pipe, and the fourth switch valve is arranged on the second guide pipe.
As a second aspect of the present invention, a vapor deposition apparatus is provided, which includes a process chamber and an exhaust gas pipe assembly, wherein the exhaust gas pipe assembly is the exhaust gas pipe assembly provided in the present invention, and the lining pipe is communicated with the process chamber.
And when the purging process is finished, introducing a high-pressure solution which can react with the product to generate a soluble substance into the cavity between the outer sleeve and the inner lining pipe through the fluid inlet, wherein the high-pressure solution is atomized through the main injection hole on the inner lining pipe, is injected into the pipe cavity of the inner lining pipe and adheres to the inner surface of the inner lining pipe, so that the high-pressure solution can react with the product deposited on the inner wall of the inner lining pipe to generate the soluble substance, and the soluble substance is dissolved in the solvent in the aerosol and flows out along the inner wall of the inner lining pipe.
In the invention, the high-pressure solution can be stopped from being introduced after the high-pressure solution is introduced for the preset time, and the process cavity of the vapor deposition equipment is vacuumized by the vacuum pump through the tail gas pipeline assembly after all soluble substances are discharged from the tail gas pipeline assembly. Because the product that the unreacted process gas generated has been discharged from the tail gas pipeline, consequently, can not be pumped into the vacuum pump to can not cause the damage to the vacuum pump, and then prolonged the life of vacuum pump.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic view of a vapor deposition apparatus in the prior art;
FIG. 2 is a schematic structural view of a vapor deposition apparatus provided in the present invention;
FIG. 3 is a perspective sectional view of the inner liner tube;
fig. 4 is a sectional view of the sub-pipe body.
Description of the reference numerals
100: an exhaust gas line 110: outer sleeve
120: the liner tube 121: main jet hole
120 a: the sub-tube body 120a1: air outlet part
120a2: the flow guide part 130: upper connecting plate
140: lower connecting plate 141: auxiliary injection hole
150: the air exhaust pipe 160: first switch valve
161: chamber gate valve 162: butterfly valve
170: second switching valve 180: waste liquid collecting box
181: fifth switching valve 182: acid discharge valve
191: first draft tube 192: second flow guide pipe
193: third on-off valve 194: fourth switch valve
200: the process chamber 310: first process gas pipe
320: second process gas pipe 330: purified gas pipe
410: first process gas source 420: second process gas source
500: vacuum pump
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.
It should be noted that, in the present invention, the terms "upper and lower" are used in the orientations of "upper and lower" in fig. 2 to 4.
As an aspect of the present invention, there is provided an off-gas piping assembly for a vapor deposition apparatus, wherein, as shown in fig. 2, the off-gas piping assembly includes an outer sleeve 110 and an inner liner 120, and the inner liner 120 is disposed inside the outer sleeve 110.
As shown in fig. 3, a cavity is formed between the liner tube 120 and the outer tube 110, the liner tube is provided with a main injection hole 121 penetrating the liner tube 120 in the thickness direction of the tube wall of the liner tube 120, and the outer tube 110 is provided with a fluid inlet penetrating the outer tube 110 in the thickness direction of the tube wall of the outer tube 110, and it can be easily understood that the cavity between the outer tube 110 and the liner tube 120 is communicated, and fluid can flow through the cavity and be sprayed from the main injection hole in the form of mist.
Shown in FIG. 2 is a vapor deposition apparatus comprising the off-gas line assembly shown in FIG. 3, with the lumen of the liner tube in communication with the process chamber. When the vapor deposition equipment works, process gas is introduced into a process cavity of the vapor deposition equipment through a process gas inlet pipe. When the process chamber is purged, a purge gas for purging is introduced into the process chamber, and an unreacted process gas and the purge gas are extracted through the lumen of the inner liner 120. The unreacted process gas may react within the lumen of the liner 120 and the products adhere to the inner surface of the liner 120.
When the vapor deposition equipment works, process gas is introduced into a process cavity of the vapor deposition equipment through a process gas inlet pipe. When the process chamber is purged, a purge gas for purging is introduced into the process chamber, and an unreacted process gas and the purge gas are extracted through the lumen of the inner liner 120. The unreacted process gas may react within the lumen of the liner 120 and the products adhere to the inner surface of the liner 120.
When the purging process is finished, a high-pressure solution capable of reacting with the product and generating a soluble substance is introduced into the cavity between the outer sleeve 110 and the inner lining tube 120 through the fluid inlet, and the high-pressure solution is atomized through the main injection hole on the inner lining tube 120, injected into the lumen of the inner lining tube 120, and attached to the inner surface of the inner lining tube 120, so as to react with the product deposited on the inner wall of the inner lining tube 120 and generate the soluble substance, and the soluble substance is dissolved in the solvent in the aerosol and flows out along the inner wall of the inner lining tube 120.
In the invention, the high-pressure solution can be stopped from being introduced after the high-pressure solution is introduced for the preset time, and the process cavity of the vapor deposition equipment is vacuumized by the vacuum pump through the tail gas pipeline assembly after all soluble substances are discharged from the tail gas pipeline assembly. Because the product that the unreacted process gas generated has been discharged from the tail gas pipeline, consequently, can not be pumped into the vacuum pump to can not cause the damage to the vacuum pump, and then prolonged the life of vacuum pump.
In order to prevent the unreacted process gas from entering the cavity between the outer sleeve 110 and the inner liner 120, it is preferable that, as shown in fig. 3, the off-gas pipe assembly further includes an upper connecting plate 130 and a lower connecting plate 140, the upper connecting plate 130 is connected to one end of the outer sleeve 110 and the inner liner 120, and the lower connecting plate 140 is connected to the other end of the outer sleeve 110 and the inner liner 120, so that the upper connecting plate 130, the lower connecting plate 140, the outer surface of the inner liner 120, and the inner surface of the outer sleeve 110 together enclose the cavity. Also, the fluid inlet communicates with the cavity, and the main injection hole 121 also communicates with the cavity.
Since the cavity between the outer sleeve 110 and the inner liner 120 is closed, the unreacted process gas in the process chamber does not enter between the outer sleeve 110 and the inner liner 120, thereby ensuring that the fluid inlet is not closed and further ensuring that the reaction product cleaning step can be performed normally. In addition, when the tail gas pipeline assembly is cleaned, high-pressure liquid can be provided for the closed cavity, and the high-pressure liquid can be atomized by the main injection hole 121 to form aerial fog.
In order to facilitate atomization of the high-pressure liquid, it is preferable that the main injection hole 121 has a hole diameter of between 1mm and 10 mm. Preferably, the main injection hole 121 may have a hole diameter of 2 mm.
In the present invention, the liner tube 120 is provided with a plurality of main injection holes 121, and the plurality of main injection holes 121 are distributed on a plurality of circumferences for convenience of processing. 5 to 20 main injection holes 121 may be provided on each circumference. As a preferred embodiment, 10 main injection holes 121 are provided per circumference.
The present invention provides an exhaust line assembly that is an improvement over the prior art exhaust line assembly shown in fig. 1. Accordingly, the present invention provides an exhaust pipe assembly that retains some of the accessories of the exhaust pipe assembly of FIG. 1, including, for example, a butterfly valve disposed at the lower end of the outer sleeve 120. When the purge process is performed, the butterfly valve is opened. In order to facilitate the cleaning of the valve plate of the butterfly valve, it is preferable that, as shown in fig. 3, the lower connection plate 140 is formed with auxiliary injection holes 141 penetrating the lower connection plate 140 in a thickness direction thereof, and axes of the auxiliary injection holes 141 are gradually inclined toward the axis O of the liner tube 120 from an upper surface of the lower connection plate 140.
The auxiliary injection holes 141 are provided to facilitate the injection of the cleaning aerosol onto the valve plate surface of the chamber gate valve 161, so as to clean the chamber gate valve 161 more thoroughly.
In the present invention, the specific structure of the inner liner tube is not particularly limited. The liner tube may be a length of steel tubing.
In the present invention, the lining pipe may be made of a corrosion-resistant stainless steel material.
To facilitate installation and removal and to improve versatility, the liner tube preferably includes at least one segment of tubular body 120a, e.g.As shown in fig. 4, the sub-tube 120a includes gas outlets 120a sequentially arranged in the direction of the axis O of the sub-tube 120a1And a flow guide part 120a2The main injection hole 121 is formed in the gas outlet portion 120a1Upper, flow guide part 120a2From the gas outlet portion 120a1Begins to gradually incline toward the axis O of the sub-tube body 120 a.
After the daughter pipe body 120a is installed in the lumen of the outer tube 110 to form the inner liner 120 in the manner shown in FIG. 3, the outlet 120a1Closer to a process chamber of the vapor deposition apparatus. Due to the diversion part 120a2Is a sloped surface, so that when the mist flows from the outlet 120a1After being sprayed out from the main injection hole, the main injection hole can be connected with the flow guide part 120a2Sufficient contact is made to ensure maximum removal of reaction products from the liner. And, the flow guide part 120a2The provision of the inclined surface also facilitates the discharge of soluble substances produced by the reaction with the reaction products out of the inner liner tube 120.
The outer peripheral wall of the sub-tube 120a is recessed into the tube cavity along the radial direction of the sub-tube 120a to form a flow guiding recess a, and the flow guiding recess a is located at one end of the sub-tube 120a far away from the main injection hole 121.
The flow guide concave part A comprises a fixing surface and a flow guide surface arranged along the circumferential direction of the sub-pipe body.
The gas injection holes are positioned in the flow guide concave part A, and the injected gas is guided by the flow guide part 120a of the tube body 120a2Is blocked and reflected to follow the flow guide 120a2The flow guide surface of the flow guide plate flows down.
In the present invention, the specific number of the sub-tubes 120a is not particularly limited. The number of the segments of the bobbin body may be determined according to the length of the outer sleeve 110.
In the embodiment shown in fig. 2 and 3, the lining pipe 120 includes a plurality of sub-pipe bodies 120a, and in two adjacent sub-pipe bodies 120a, an end surface of the next sub-pipe body 120a close to the main injection hole is connected to a fixing surface of the previous sub-pipe body 120a, and the gas outlet portion of the next sub-pipe body 120a is spaced apart from the flow guide surface of the previous sub-pipe body 120 a.
Moreover, it should be noted that the upper connecting plate is connected to the upper end of the uppermost sub-pipe body, and the lower connecting plate is connected to the lower end of the lowermost sub-pipe body.
Besides ensuring the normal ejection of the aerosol, the arrangement of the flow guiding recess a can ensure the stability of the connection between two adjacent sections of the sub-tube bodies, and preferably, as shown in fig. 4, the sub-tube body 120a is away from the air outlet 120a1The end surface of the sub-tube body 120a is attached to the fixing surface of the diversion concave part on the previous section of the sub-tube body 120a, and the area of the end surface of the sub-tube body 120a close to the main injection hole 121 does not exceed the air outlet part 121a of the sub-tube body 120a deviating from the main injection hole 121a1The area of the fixed end surface positioned outside the flow guide concave part A on the end surface of the guide plate. As shown in fig. 3, when two adjacent sections of sub-pipes are connected, the upper end surface of the next section of sub-pipe 120a is connected to the fixing surface of the flow guiding recess a on the lower end surface of the previous section of sub-pipe 120a, so that a stable connection can be formed without blocking the outflow of gas from the main injection hole.
In order to guide the aerosol flowing into the guiding concave part a to flow out, the top surface of the guiding concave part a is preferably a concave curved surface.
In order to better guide the gas ejected from the main injection hole, it is preferable that the sub-pipe 120a is away from the gas outlet 120a1The part of the end surface of the sub-tube body 120a, which is located inside the flow guiding concave portion a, exceeds the part of the end surface of the sub-tube body 120a, which is located outside the flow guiding concave portion a, and is away from the air outlet portion. Specifically, after the multi-segment sub-tube body 120a is assembled, the gas injection holes are located in the flow guiding recessed portion a, and the injected gas is guided by the flow guiding portion 120a of the sub-tube body 120a2Is blocked and reflected to follow the flow guide 120a2Flows down the inner surface of the container.
To facilitate communication with a vacuum pump, it is preferred that the axial length of the outer sleeve 110 is greater than the axial length of the liner tube 110, and that the lower end of the outer sleeve 110 exceeds the lower end of the liner tube 120, as shown in FIG. 2.
Accordingly, the exhaust line assembly further includes an exhaust pipe 150 and a first switch valve 160, the exhaust pipe 150 is connected to and communicates with the outer casing 110 at a portion of the outer casing 110 beyond the inner liner 120, and the first switch valve 160 is disposed on the outer casing 110. The lower port of the outer sleeve 110 forms a waste outlet.
In the present invention, only the air exhaust holes communicated with the air exhaust pipe 150 need to be opened on the pipe wall of the outer sleeve 110, and the air exhaust holes do not need to be opened on the inner liner pipe 110, thereby simplifying the process steps of manufacturing the tail gas pipeline and reducing the processing cost.
The first on-off valve 160 is provided to allow the first on-off valve 160 to be closed when a deposition process is performed to prevent process gases from escaping through the off-gas line assembly. When the off-gas cleaning and purging process is required, the first switching valve 160 is opened.
In an embodiment of the present invention, the first switching valve 160 may include a gate valve 161 and a butterfly valve 162.
In order to prevent gas from entering the pumping line 150 during the deposition process and the purge process, the off-gas line assembly preferably further includes a second on-off valve 170, and the second on-off valve 170 is disposed on the pumping line 150.
The waste liquid outlet and the air pumping port are different ports, so that the influence of the discharge of the waste liquid on the air pumping pipe can be avoided.
In the present invention, the lower port of the outer sleeve 110 is set as a waste liquid outlet, so that the waste liquid can be automatically discharged from the exhaust pipeline assembly under the action of gravity.
In order to prevent environmental pollution and recycle of the recycled materials, it is preferable that the exhaust line assembly further includes a waste liquid collecting box 180. The waste collection box 180 is in selective communication with the waste outlet.
It should be noted that the term "selectively communicate" is used herein to mean that the operator can select to connect or disconnect the waste liquid collecting box 180 with or from the waste liquid outlet according to the actual situation.
The selective communication of the waste liquid outlet with the waste liquid collecting box 180 may be achieved by providing a fifth switching valve 181 at the waste liquid outlet of the outer sleeve 110.
In order to discharge the waste liquid collected in the waste liquid collecting box 180, it is preferable that a drain pipe communicating with the inside of the waste liquid collecting box 180 is provided, and a drain valve 182 is provided on the drain pipe, and when the liquid in the waste liquid collecting box 180 reaches a predetermined amount, the drain valve 182 is opened to discharge the liquid in the waste liquid collecting box 180. Alternatively, after the cleaning is completed, the drain valve 182 is opened to drain the liquid in the waste liquid collecting box 180.
In order to facilitate the purging and cleaning of the exhaust pipe assembly, it is preferable that the exhaust pipe assembly further includes a first delivery pipe 191, a second delivery pipe 192, a third on/off valve 193, and a fourth on/off valve 194. As shown in fig. 2, one end of the first fluid guide tube 191 communicates with the fluid inlet, the second fluid guide tube 192 communicates with the first fluid guide tube 191, the first fluid guide tube 191 is provided with a third on/off valve 193, and the second fluid guide tube 192 is provided with a fourth on/off valve 194.
One of the first and second conduits 191, 192 is used to pass a purge gas (e.g., nitrogen, argon, etc.) and the other of the first and second conduits 191, 192 is used to pass a solution capable of reacting with the product.
As another aspect of the present invention, a vapor deposition apparatus is provided, as shown in fig. 2, which includes a process chamber 200 and a tail gas pipeline assembly, wherein the tail gas pipeline assembly is the above-mentioned tail gas pipeline assembly provided by the present invention, and the lining pipe 120 is communicated with the process chamber 200.
When the vapor deposition equipment works, process gas is introduced into a process cavity of the vapor deposition equipment through a process gas inlet pipe. When the process chamber is purged, a purge gas for purging is introduced into the process chamber, and an unreacted process gas and the purge gas are extracted through the lumen of the inner liner 120. The unreacted process gas may react within the lumen of the liner 120 and the products adhere to the inner surface of the liner 120.
When the purging process is finished, a high-pressure solution capable of reacting with the product and generating a soluble substance is introduced into the cavity between the outer sleeve 110 and the inner lining tube 120 through the fluid inlet, and the high-pressure solution is atomized through the main injection hole on the inner lining tube 120, injected into the lumen of the inner lining tube 120, and attached to the inner surface of the inner lining tube 120, so as to react with the product deposited on the inner wall of the inner lining tube 120 and generate the soluble substance, and the soluble substance is dissolved in the solvent in the aerosol and flows out along the inner wall of the inner lining tube 120.
In the invention, the high-pressure solution can be stopped from being introduced after the high-pressure solution is introduced for the preset time, and the process cavity of the vapor deposition equipment is vacuumized by the vacuum pump through the tail gas pipeline assembly after all soluble substances are discharged from the tail gas pipeline assembly. Because the product that the unreacted process gas generated has been discharged from the tail gas pipeline, consequently, can not be pumped into the vacuum pump to can not cause the damage to the vacuum pump, and then prolonged the life of vacuum pump.
As a specific embodiment, the vapor deposition equipment can be used for depositing and forming the aluminum oxide film. Specifically, the vapor deposition apparatus includes a first process gas introduction pipe 310, a second process gas introduction pipe 320, and a purge gas pipe 330. One end of the first process gas introduction pipe 310 is communicated with a first process gas source (i.e., TMA source) 410, and the other end of the first process gas introduction pipe 310 is communicated with the process chamber 210; one end of the second process gas introduction pipe 320 is communicated with the second process gas source (i.e., water vapor source) 420, and the other end of the second process gas introduction pipe 320 is communicated with the process chamber 210. The product generated by the unreacted process gas is aluminum oxide, and the aluminum oxide attached to the inner surface of the liner tube 120 can be treated by spraying alkali liquor aerosol through the main injection hole, and the specific reaction formula is as follows:
Al2O3+2NaOH=2NaAlO2+H2O。
wherein NaAlO2Is soluble.
When the deposition process is performed, the gate valve 161 and the butterfly valve 162 are closed. After the deposition process is finished, the gate valve 161 and the butterfly valve 162 are opened, and the second switching valve 170 is closed. And opening the third switch valve 193, injecting a high-pressure hot NaOH solution into the closed cavity between the outer sleeve 110 and the inner lining pipe 120 through the first flow guide pipe 192, and atomizing and spraying the high-pressure hot NaOH solution from the main injection hole after the closed cavity is filled with the high-pressure hot NaOH solution. The NaOH gas mist is attached to the inner surface of the inner liner tube 120While the NaOH gas mist ejected from the auxiliary ejection holes is ejected onto the valve plate of the gate valve 161, the Al on the inner surface of the inner liner tube 120 and the valve plate of the gate valve 161 can be sprayed downstream2O3And (6) cleaning.
After a predetermined time, the third switch valve 193 is closed, the fourth switch valve 194 is opened, and inert purge gas (e.g., N) is introduced through the second flow conduit 1922) And enters the inner cavity of the liner tube 120 through the main injection holes and the auxiliary injection holes. Meanwhile, purge gas is introduced into the process chamber through the purge gas pipe 330 to blow dry the inner surface of the liner pipe 120 and the valve plate surface of the butterfly valve 162, and blow the liquid into the waste liquid collecting box.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.

Claims (10)

1. An exhaust pipeline component for vapor deposition equipment, which is characterized by comprising an outer sleeve and an inner lining pipe, wherein,
the inner lining pipe is arranged in the pipe cavity of the outer sleeve, a cavity is formed between the inner lining pipe and the outer sleeve, and the inner lining pipe is communicated with the process chamber of the vapor deposition equipment;
a main injection hole penetrating through the lining pipe along the thickness direction of the pipe wall of the lining pipe is formed in the lining pipe, and the main injection hole is communicated with the cavity;
the outer sleeve is provided with a fluid inlet which penetrates through the outer sleeve along the thickness direction of the wall of the outer sleeve, and fluid can be sprayed out in a mist form through the main spray hole through the cavity.
2. The exhaust line assembly of claim 1, further comprising an upper connection plate and a lower connection plate, wherein,
the upper connecting plate is connected to one end of the outer sleeve and one end of the inner lining pipe, and the lower connecting plate is connected to the other end of the outer sleeve and the other end of the inner lining pipe, so that the cavity is defined by the upper connecting plate, the lower connecting plate, the outer surface of the inner lining pipe and the inner surface of the outer sleeve.
3. The exhaust pipeline assembly according to claim 2, wherein the lower connecting plate is formed with auxiliary injection holes penetrating through the lower connecting plate in a thickness direction of the lower connecting plate;
the axis of the auxiliary injection hole is gradually inclined toward the axis of the lining pipe from the upper surface of the lower connecting plate.
4. The exhaust pipeline assembly according to claim 2, wherein the lining pipe comprises at least one segment of a sub-pipe body, and the sub-pipe body comprises a gas outlet portion and a flow guide portion which are sequentially arranged along an axial direction of the sub-pipe body;
the main injection hole is arranged on the air outlet part, and the inner surface of the flow guide part is inclined towards the axis of the sub-pipe body from the air outlet part gradually.
5. The exhaust pipe assembly according to claim 4, wherein the outer peripheral wall of the sub-pipe body is recessed into the pipe cavity along a radial direction of the sub-pipe body to form a flow guiding recess, and the flow guiding recess is located at one end of the sub-pipe body away from the main injection hole;
the flow guide concave part comprises a fixed surface and a flow guide surface arranged along the circumferential direction of the sub-pipe body.
6. The exhaust pipeline assembly according to claim 5, wherein the lining pipe comprises a plurality of sections of sub-pipe bodies, and in two adjacent sections of sub-pipe bodies, an end surface of the next section of sub-pipe body close to the main injection hole is connected to the fixing surface of the previous section of sub-pipe body, and the air outlet portion of the next section of sub-pipe body is spaced from the flow guide surface of the previous section of sub-pipe body.
7. The exhaust line assembly of any of claims 1 to 5, wherein the outer sleeve has an axial length greater than an axial length of the liner tube, and the lower end of the outer sleeve exceeds the lower end of the liner tube;
the exhaust pipeline assembly further comprises an exhaust pipe, a first switch valve and a second switch valve, the exhaust pipe is communicated with the outer sleeve on the part, exceeding the inner lining pipe, of the outer sleeve, the first switch valve is arranged on the outer sleeve, and the second switch valve is arranged on the exhaust pipe.
8. The exhaust line assembly of claim 7, further comprising a waste collection box;
the lower port of the outer sleeve forms a waste liquid outlet, and the waste liquid collecting box is selectively communicated with the waste liquid outlet.
9. The exhaust pipeline assembly according to any one of claims 1 to 4, further comprising a first flow guide pipe, a second flow guide pipe, a third on-off valve and a fourth on-off valve;
one end of the first guide pipe is communicated with the fluid inlet, the second guide pipe is communicated with the first guide pipe, the third switch valve is arranged on the first guide pipe, and the fourth switch valve is arranged on the second guide pipe.
10. A vapour deposition apparatus comprising a process chamber and an off-gas line assembly, wherein the off-gas line assembly is as claimed in any one of claims 1 to 9, and the liner is in communication with the process chamber.
CN201810515736.0A 2018-05-25 2018-05-25 Tail gas pipeline assembly for vapor deposition equipment and vapor deposition equipment Active CN110527979B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810515736.0A CN110527979B (en) 2018-05-25 2018-05-25 Tail gas pipeline assembly for vapor deposition equipment and vapor deposition equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810515736.0A CN110527979B (en) 2018-05-25 2018-05-25 Tail gas pipeline assembly for vapor deposition equipment and vapor deposition equipment

Publications (2)

Publication Number Publication Date
CN110527979A CN110527979A (en) 2019-12-03
CN110527979B true CN110527979B (en) 2021-08-13

Family

ID=68657015

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810515736.0A Active CN110527979B (en) 2018-05-25 2018-05-25 Tail gas pipeline assembly for vapor deposition equipment and vapor deposition equipment

Country Status (1)

Country Link
CN (1) CN110527979B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11971057B2 (en) * 2020-11-13 2024-04-30 Taiwan Semiconductor Manufacturing Co., Ltd. Gas transport system
CN115522182A (en) * 2022-03-21 2022-12-27 黄特伟 Modularized chemical vapor deposition reactor for semiconductor chip production

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0346893A1 (en) * 1988-06-15 1989-12-20 Centrotherm Elektrische Anlagen Gmbh + Co. Apparatus for purifying exhaust gases emitted in CVD processes
CN1459324A (en) * 2002-05-25 2003-12-03 优尼森有限公司 Device and method for pretreating waste gas under moisture environment
CN2716284Y (en) * 2004-07-07 2005-08-10 中国航空工业第一集团公司北京航空制造工程研究所 Device for treating tail gas from chemical vapor codeposition and infiltration

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0346893A1 (en) * 1988-06-15 1989-12-20 Centrotherm Elektrische Anlagen Gmbh + Co. Apparatus for purifying exhaust gases emitted in CVD processes
CN1459324A (en) * 2002-05-25 2003-12-03 优尼森有限公司 Device and method for pretreating waste gas under moisture environment
CN2716284Y (en) * 2004-07-07 2005-08-10 中国航空工业第一集团公司北京航空制造工程研究所 Device for treating tail gas from chemical vapor codeposition and infiltration

Also Published As

Publication number Publication date
CN110527979A (en) 2019-12-03

Similar Documents

Publication Publication Date Title
JP3122311B2 (en) Apparatus for supplying liquid material to film forming chamber and method of using the same
US4509456A (en) Apparatus for guiding gas for LP CVD processes in a tube reactor
CN110527979B (en) Tail gas pipeline assembly for vapor deposition equipment and vapor deposition equipment
KR101795980B1 (en) Method of controlling powder and deposition in throttle valves and valve apparatus or throttle valve
EP1448319B1 (en) Source liquid supply apparatus having a cleaning function
CN100342962C (en) Device for changing nozzles
JP2008522814A5 (en)
KR20110005699A (en) Tools and methods for processing microelectronic workpices using process chamber designs that easily transition between open and closed modes of operation
TWI739309B (en) Exhaust Hazardous Substance Removal Unit
KR20120092275A (en) Nitrogen gas power ejection apparatus
US20130037971A1 (en) Wetted wall venturi scrubber with a 2-stage venturi throat
CN110484894B (en) Tail gas cleaning unit, tail gas cleaning device and vapor deposition equipment
JPH09103639A (en) Waste gas treatment apparatus of semiconductor production facility
CN201381280Y (en) Etching equipment
KR20120079355A (en) Energy conservation type silencer assembly and vacuum pump with the same for manufacturing of semiconductor and heat method of nitrogen gas
CN114823431A (en) Spraying device for cleaning wafer
CN102146813A (en) Waste steam heating, pressurizing and recycling system
KR101323125B1 (en) Gas distribution system of vertical diffusion furnace for manufacturing semiconductor
CN216367149U (en) Candle type filter
CN117190633A (en) Drying system and drying method using supercritical fluid as drying medium
CN216174979U (en) Cleaning device for powder material conveying pipeline
US20230068823A1 (en) Apparatus and method of trapping an exhaust material from a substrate-processing process and apparatus for processing a substrate including the trapping apparatus
CN215856721U (en) Clothing treatment equipment capable of uniformly spraying materials
CN218404394U (en) Precursor source bottle
RU2180711C1 (en) Multi-stage jet apparatus

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant