CN110525028A - A kind of wafer type electronic ceramic component plate electrode automatic press - Google Patents
A kind of wafer type electronic ceramic component plate electrode automatic press Download PDFInfo
- Publication number
- CN110525028A CN110525028A CN201910943273.2A CN201910943273A CN110525028A CN 110525028 A CN110525028 A CN 110525028A CN 201910943273 A CN201910943273 A CN 201910943273A CN 110525028 A CN110525028 A CN 110525028A
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- ceramic component
- electronic ceramic
- printing assembly
- turn
- component piece
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- 239000000919 ceramic Substances 0.000 title claims abstract description 117
- 238000007639 printing Methods 0.000 claims abstract description 109
- 230000007306 turnover Effects 0.000 claims abstract description 39
- 238000001035 drying Methods 0.000 claims abstract description 38
- 238000010438 heat treatment Methods 0.000 claims abstract description 10
- 238000001179 sorption measurement Methods 0.000 claims description 32
- 239000000463 material Substances 0.000 claims description 25
- 238000002347 injection Methods 0.000 claims description 11
- 239000007924 injection Substances 0.000 claims description 11
- 238000007664 blowing Methods 0.000 claims description 7
- 230000005611 electricity Effects 0.000 claims description 2
- 230000033001 locomotion Effects 0.000 abstract description 11
- 238000010586 diagram Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000011017 operating method Methods 0.000 description 2
- 229910052573 porcelain Inorganic materials 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000446313 Lamella Species 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000008450 motivation Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F17/00—Printing apparatus or machines of special types or for particular purposes, not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F23/00—Devices for treating the surfaces of sheets, webs, or other articles in connection with printing
- B41F23/04—Devices for treating the surfaces of sheets, webs, or other articles in connection with printing by heat drying, by cooling, by applying powders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G35/00—Mechanical conveyors not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/22—Devices influencing the relative position or the attitude of articles during transit by conveyors
- B65G47/24—Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles
- B65G47/248—Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles by turning over or inverting them
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/82—Rotary or reciprocating members for direct action on articles or materials, e.g. pushers, rakes, shovels
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Screen Printers (AREA)
Abstract
The present invention provides a kind of wafer type electronic ceramic component plate electrode automatic press, including rack, front electrode printing assembly, opposite electrode printing assembly and turn-over drying mechanism;Front electrode printing assembly, opposite electrode printing assembly and turn-over drying mechanism are set in rack;Conveying mechanism is equipped with below front electrode printing assembly and opposite electrode printing assembly;Turn-over drying mechanism includes motor and motor-driven rotating disk, and rotating disk is radially equipped with several article putting grooves, and heating structure is equipped with inside rotating disk;Turn-over drying mechanism is set between front electrode printing assembly and opposite electrode printing assembly;The present invention is by providing a kind of wafer type electronic ceramic component plate electrode automatic press, realize the automatic printing, turn-over and the movement of drying of electronic ceramic component piece, so that full-automation is realized in the printing of electronic ceramic component piece front and back sides, without manually overturning electronic ceramic component piece, the labor intensity of worker is significantly reduced, and improves the efficiency of printing.
Description
Technical field
The present invention relates to printer field, in particular to a kind of wafer type electronic ceramic component plate electrode automatic press.
Background technique
Electronic ceramic component piece is called piezoelectric ceramic piece, is that a kind of structure is simple and sensitive high electro-acoustic element, uses extensively
In electronic equipments such as manufacture ultrasonic transducer, infrared detectors;Electronic ceramic component piece tow sides are printed with electrode;It is existing
Mode of printing be human assistance printing, i.e. after the one side of electronic ceramic component piece is completed for printing by printing equipment, manually from
Printing equipment is sent after taking out to baking oven heating, drying, is manually overturn after drying, then the other one side of printing;This mode of printing because
It is dried to need to interrupt printing-flow, and needs artificial turn-over, it is cumbersome, cause the printing of electronic ceramic component piece to be imitated
Rate is low.
Summary of the invention
Cumbersome to solve existing electronic ceramic component plate electrode printing operation, the low problem of printing efficiency, the present invention mentions
It is printed for a kind of wafer type electronic ceramic component plate electrode automatic press, including rack, front electrode printing assembly, opposite electrode
Brush assemblies and turn-over drying mechanism;The front electrode printing assembly, the opposite electrode printing assembly and turn-over drying
Mechanism is set in the rack;It is equipped with and is used for below the front electrode printing assembly and the opposite electrode printing assembly
Convey the conveying mechanism of electronic ceramic component piece;The turn-over drying mechanism includes motor and motor-driven rotating disk, described
Rotating disk is radially even to be equipped with several article putting grooves, and heating structure is equipped with inside the rotating disk;The turn-over drying mechanism
Between the front electrode printing assembly and the opposite electrode printing assembly.
Further, the opposite electrode printing assembly is additionally provided with described far from the side of the front electrode printing assembly
Turn-over drying mechanism.
It further, further include feeding mechanism, the feeding mechanism is set to the front electrode printing assembly far from described
The side of opposite electrode printing assembly;The feeding mechanism includes mandril and for storing electronic ceramic component piece to be printed
Barrel;The mandril is set to the lower section of the barrel.
It further, further include haul mechanism for transporting electronic ceramic component piece to be printed, the haul mechanism
Between the feeding mechanism and the conveying mechanism.
Further, the haul mechanism includes several for adsorbing haul adsorption structure and the drive of electronic ceramic component piece
Move the mobile haul driving mechanism of the haul adsorption structure.
It further, further include the anti-stacked mechanism of sheet of elements, the anti-stacked mechanism of sheet of elements includes putting material platform and for blowing away
Put the injection structure for the electronic ceramic component piece being overlapped on material platform;Described put expects that platform and the injection structure are set to the rack
On.
Further, the conveying mechanism below the front electrode printing assembly is nearby equipped with side printing assembly, described
Side printing assembly includes the dip mobile for the dip mechanism and driving dip mechanism of printed electronic ceramic component piece side
Driving mechanism.
It further, further include finished product collecting mechanism, the finished product collecting mechanism is disposed far from the front printing equipment
Side, the finished product collecting mechanism includes the finished product adsorption structure and finished product placement plate for adsorbing electronic ceramic component piece;
The finished product adsorption structure is flexibly connected by Mobile base with the rack;The finished product placement plate is set in the rack.
A kind of wafer type electronic ceramic component plate electrode automatic press provided by the invention, firstly, passing through front electrode
Printing assembly prints the front of electronic ceramic component piece, real then by being equipped with conveying mechanism and turn-over drying mechanism
The now movement of the conveying of electronic ceramic component piece, turn-over and drying;Finally, being realized by opposite electrode printing assembly to electronics
The reverse side of ceramic component piece is printed;The wafer type electronic ceramic component plate electrode automatic press provided through the invention,
Automatic printing, automatic turnover and automatic the drying movement for realizing electronic ceramic component piece, so that electronic ceramic component piece
Full-automation is realized in the printing of front and back sides, without artificial overturning electronic ceramic component piece, significantly reduces the labor intensity of worker,
Operating procedure when printing is simplified, printing efficiency is greatly improved.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is this hair
Bright some embodiments for those of ordinary skill in the art without any creative labor, can be with
It obtains other drawings based on these drawings.
Fig. 1 is the structural schematic diagram of wafer type electronic ceramic component plate electrode automatic press provided by the invention;
Fig. 2 is the enlarged diagram in the portion A in Fig. 1;
Fig. 3 is the structural schematic diagram of conveying mechanism;
Fig. 4 is the structural schematic diagram of side printing assembly;
Fig. 5 is the enlarged diagram in the portion B in Fig. 4;
Fig. 6 is the structural schematic diagram of finished product collecting mechanism;
Fig. 7 is the structural schematic diagram of haul mechanism;
Fig. 8 is the structural schematic diagram of electronic ceramic component piece automatic press preferred embodiment;
Fig. 9 is the enlarged diagram in the portion C in Fig. 8.
Appended drawing reference:
100 rack, 210 front electrode printing assembly, 220 opposite electrode printing assembly
300 conveying mechanism, 310 delivery track, 320 pusher
321 push away 410 rotating disk of column, 411 article putting groove
500 feeding mechanism, 510 barrel, 520 mandril
600 haul mechanism, 610 haul adsorption structure, 620 movable stand
Material platform is put by the anti-stacked mechanism 710 of 630 haul moving track, 700 sheet of elements
720 injection structure, 800 side printing assembly, 810 dip block
811 dip slot, 820 scraper plate, 900 finished product collecting mechanism
910 finished product adsorption structure, 920 Mobile base, 930 finished product placement plate
940 finished product placing boxes
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art
Every other embodiment obtained without creative efforts, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that term " center ", " longitudinal direction ", " transverse direction ", "upper", "lower",
The orientation or positional relationship of the instructions such as "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside" is
It is based on the orientation or positional relationship shown in the drawings, is merely for convenience of description of the present invention and simplification of the description, rather than instruction or dark
Show that signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as pair
Limitation of the invention.In addition, term " first ", " second " are used for description purposes only, it is not understood to indicate or imply opposite
Importance.
The present invention provides a kind of wafer type electronic ceramic component plate electrode automatic press, including rack 100, front electrode
Printing assembly 210, opposite electrode printing assembly 220 and turn-over drying mechanism;It is the front electrode printing assembly 210, described anti-
Face electrode print component 220 and the turn-over drying mechanism are set in the rack 100;The front electrode printing assembly
210 lower sections are equipped with the conveying mechanism 300 for conveying electronic ceramic component piece, set below the opposite electrode printing assembly 220
There is the conveying mechanism 300 for conveying electronic ceramic component piece;The turn-over drying mechanism includes the first rotating disk 410 and driving
The motor of first rotating disk 410 rotation;First rotating disk 410 is radially even to be equipped with several article putting grooves 411, and the rotation
Heating structure is equipped with inside turntable 410;The turn-over drying mechanism is set between the conveying mechanism 300 and conveying mechanism 300.
When it is implemented, as shown in Figure 1-Figure 3, wafer type electronic ceramic component plate electrode automatic printing provided by the invention
Machine, including front electrode printing assembly 210, opposite electrode printing assembly 220 and turn-over drying mechanism;Front electrode printing assembly
210 be ink-jet printing apparatus or screen printing apparatus;The front electrode printing assembly 210 of the present embodiment is set using silk-screen printing
It is standby;Front electrode printing assembly 210 includes web plate and scraper, and scraper can be used push rod transmission, cylinder-driven or motor and drive
The drive controls mode such as cam follower;By the extruding of scraper when printing, print material is made to be transferred to electronic ceramic component through web plate
On piece, to realize the printing of electronic ceramic component piece;Above-mentioned print material is the electrode slurrys such as silver paste, copper slurry;It should be noted that
Opposite electrode printing assembly 220 is identical as 210 structure of front electrode printing assembly, and details are not described herein again;
The lower section of front electrode printing assembly 210 and opposite electrode printing assembly 220 is equipped with conveying mechanism 300;Conveying
Mechanism 300 includes delivery track 310 and pusher 320;Delivery track 310 is that width is less than electronic ceramic component piece diameter
Track structure is uniformly provided with the aperture being connected with vacuum pump on delivery track 310, electronic ceramic component piece is inhaled
It invests on delivery track 310, prevents electronic ceramic component piece from deviateing or being detached from delivery track 310;Delivery track 310 is for carrying
Electronic ceramic component piece;Pusher 320 is set to the two sides of delivery track 310, pushes away on pusher 320 including what is be uniformly arranged
Column 321, pushing away column 321 is column structure;Column 321 is pushed away for pushing electronic ceramic component piece to travel forward;Pushing electronic ceramics
When sheet of elements travels forward, pusher 320, which is first lowered down into, pushes away the position that column 321 is lower than track, then moves backward, then
Pusher 320 rises, and the column 321 that pushes away of 310 the right and left of delivery track resists on rear side of electronic ceramic component piece, last pusher
Structure 320 moves forward, and electronic ceramic component piece can be pushed to move forward;About 320 pusher of driving, back-and-forth motion are
Cam mechanism, the cam mechanism are made of cam, follower lever;
Turn-over drying mechanism includes motor and motor-driven rotating disk 410;Rotating disk 410 is disc structure, rotating disk
410 are connected with the rotation axis of motor, and several article putting grooves 411, article putting groove 411 are along the circumferential direction uniformly provided in rotating disk 410
For narrow groove-like structure, each article putting groove 411 is arranged along radial direction, and article putting groove 411 is for accommodating electronic ceramic component piece;
Electronic ceramic component piece enters in the article putting groove 411 of 410 side of rotating disk under the transport of conveying mechanism 300, and rotating disk 410 is in electricity
Electronic ceramic component piece is overturn under the driving of machine, to realize the turn-over movement of electronic ceramic component piece.Also, turn-over dryer
Heating structure is equipped with inside the rotating disk 410 of structure, the parts such as heater strip or heating sheet can be used in heating structure, and heating structure is used for
Heated rotary discs 410, to be dried to the electronic ceramic component piece printed.
In actual use, firstly, electronic ceramic component piece is placed on the delivery track 310 of conveying mechanism 300, conveying
The aperture being connected on track 310 with vacuum pump generates suction-operated to electronic ceramic component piece, so that delivery track 310 is opposite
Electronic ceramic component piece has certain adsorption capacity, to prevent from deviateing delivery track 310 when conveying electronic ceramic component piece;
The pusher 320 of conveying mechanism 300 is under the driving of cam mechanism by electronic ceramic component piece toward front electrode printing assembly
210 direction push, when electronic ceramic component piece is transferred into the lower section of front electrode printing assembly 210, front electrode printing
The front that the scraper of component 210 acts to printed electronic ceramic component piece;The electronic ceramic component piece for completing front printing exists
Enter in the article putting groove 411 of turn-over drying mechanism under the promotion of pusher 320;After turn-over drying mechanism turn-over, electronics pottery
Porcelain sheet of elements enters conveying mechanism 300 under the promotion of pusher 320 and moves towards the position of opposite electrode printing assembly 220
It is dynamic, when electronic ceramic component piece is moved to 220 underface of opposite electrode printing assembly, the scraper of opposite electrode printing assembly 220
Movement is to complete the back face printing of electronic ceramic component piece.
A kind of wafer type electronic ceramic component plate electrode automatic press provided by the invention, firstly, passing through front electrode
Printing assembly prints the front of electronic ceramic component piece, real then by being equipped with conveying mechanism and turn-over drying mechanism
The now movement of the conveying of electronic ceramic component piece, turn-over and drying;Finally, being realized by opposite electrode printing assembly to electronics
The reverse side of ceramic component piece is printed;The wafer type electronic ceramic component plate electrode automatic press provided through the invention,
Automatic printing, automatic turnover and automatic the drying movement for realizing electronic ceramic component piece, so that electronic ceramic component piece
Full-automation is realized in the printing of front and back sides, without artificial overturning electronic ceramic component piece, significantly reduces the labor intensity of worker,
Operating procedure when printing is simplified, printing efficiency is greatly improved.
Preferably, the opposite electrode printing assembly 220 is additionally provided with far from the side of the front electrode printing assembly 210
The turn-over drying mechanism.
When it is implemented, as shown in figure 8, side of the opposite electrode printing assembly 220 far from front electrode printing assembly 210
It is additionally provided with the turn-over drying mechanism, turn-over drying mechanism includes motor and motor-driven rotating disk 410, turn-over drying mechanism
Rotating disk 410 be equipped with heating structure, print the electronic ceramic component piece of reverse side by turn-over drying mechanism can directly into
Row drying, dries it is not necessary that electronic ceramic component piece to be placed in baking box, reduces the manufacturing procedure of electronic ceramic component piece,
Improve production efficiency.
It preferably, further include feeding mechanism 500, it is remote that the feeding mechanism 500 is set to the front electrode printing assembly 210
Side from the opposite electrode printing assembly 220;The feeding mechanism 500 includes mandril 520 and to be printed for storing
The barrel 510 of electronic ceramic component piece;The mandril 520 is set to the lower section of the barrel 510.
When it is implemented, as shown in figure 9, wafer type electronic ceramic component plate electrode automatic press provided in this embodiment
It further include barrel 510 and mandril 520, barrel 510 is cylindrical body hollow structure, and electronic ceramic component lamella, which stacks, is placed in barrel
In 510, barrel 510 is set to side of the front electrode printing assembly 210 far from opposite electrode printing assembly 220, and under barrel 510
Portion is equipped with mandril 520, and mandril 520 is rod-like structure, and mandril 520 is connected with cylinder;Electronic ceramic component in barrel 510
After piece consumption, mandril 520 jacks up electronic ceramic component piece remaining in barrel 510, facilitates subsequent delivery electronic ceramic component
Piece.
It preferably, further include haul mechanism 600 for transporting electronic ceramic component piece to be printed, the haul mechanism
600 are set between the feeding mechanism 500 and the conveying mechanism 300.
Preferably, the haul mechanism 600 includes several for adsorbing the haul adsorption structure 610 of electronic ceramic component piece
With the haul driving mechanism for driving the haul adsorption structure 610 mobile.
When it is implemented, as shown in Figure 7 and Figure 8, wafer type electronic ceramic component plate electrode provided in this embodiment is automatic
Printing machine further includes haul mechanism 600;Haul mechanism 600 includes that haul adsorption structure 610 and driving haul adsorption structure 610 move
Dynamic haul driving mechanism;Haul adsorption structure 610 is the suction tube structure being connected with vacuum pump, for adsorbing ceramic electronic element
Part piece, haul adsorption structure 610 are set on haul movable stand 620, and haul movable stand 620 and the sliding of haul moving track 630 connect
It connects;Haul moving track 630 is fixed in rack 100;Haul driving mechanism is connected with haul movable stand 620;Haul is driven
Motivation structure is the cam mechanism that cam and driven member form;Preferably, haul driving mechanism also can be used cylinder, push rod etc. zero
Part;In use, haul adsorbing mechanism under the driving of haul driving mechanism, is moved to 510 top of barrel and adsorbs to be printed
Electronic ceramic component piece, then, haul adsorption structure 610 is under the driving of haul driving mechanism, along haul moving track
630 are moved to 310 top of delivery track, and then haul adsorption structure 610 is disconnected by solenoid valve and vacuum pump, electronics pottery
Porcelain sheet of elements is to fall and on delivery track 310, that is, realize the movement of the carrying to electronic ceramic component piece.Preferably, fortune
Material mechanism 600 can also be the mechanical arm with haul adsorption structure 610.
It preferably, further include the anti-stacked mechanism 700 of sheet of elements, the anti-stacked mechanism 700 of sheet of elements includes putting material platform 710 and using
The injection structure 720 for expecting the electronic ceramic component piece being overlapped on platform 710 is put in blowing away;It is described to put material platform 710 and blowing knot
Structure 720 is set in the rack 100.
When it is implemented, as shown in fig. 7, further including the anti-stacked mechanism 700 of sheet of elements, the anti-stacked mechanism 700 of sheet of elements includes putting
Expect platform 710 and injection structure 720;Putting material platform 710 is supporting structure, puts material platform 710 and is set in rack 100, puts material platform 710
For placing electronic ceramic component piece;Also, it puts material platform 710 and is equipped with the negative-pressure adsorption hole being connected with vacuum pump;Put material platform
710 are equipped with injection structure 720, and injection structure 720 is plate structure in the present embodiment, and injection structure 720 is equipped with and air pump
The blowing mouth being connected;When in use, the haul adsorption structure 610 of haul mechanism 600 is by electronic ceramic component piece to be printed
It is carried to putting for the anti-stacked mechanism 700 of sheet of elements from barrel 510 to expect on platform 710, due to putting the suction in the negative-pressure adsorption hole on material platform 710
Attached effect, electronic ceramic component piece will be put material platform 710 by abutting;The blowing mouth of injection structure 720 to put material platform 710 on blow,
If putting there are when multilayer electrode sheet of elements on material platform 710, the electronic ceramic component piece in lower layer is due to putting on material platform 710
Negative-pressure adsorption hole suction-operated and be attached at and put on flitch, and the electronic ceramic component piece on upper layer is then in injection structure 720
Airflow function under and be blown away, thus prevent electronic ceramic component piece be overlapped.
Preferably, the conveying mechanism 300 of 210 lower section of front electrode printing assembly is nearby equipped with side printing assembly
800, the side printing assembly 800 includes the dip mechanism and driving dip mechanism for printed electronic ceramic component piece side
Mobile dip driving mechanism.
When it is implemented, as shown in Fig. 4, Fig. 5 and Fig. 8, electronic ceramic component piece automatic press provided in this embodiment
It further include side printing assembly 800, side printing assembly 800 is used for the side of printed electronic ceramic component piece;Side print couple
Part 800 includes dip mechanism and dip driving mechanism;Dip mechanism includes the dip for printed electronic ceramic component piece side
Block 810 and scraper plate 820 for striking off extra print material on dip block 810;The side of dip block 810 is equipped with dip slot 811, dips in
Hopper 811 is groove-like structure;The pipeline for print material circulation is equipped in dip block 810, pipeline one end in dip block 810 with dip in
Hopper 811 is connected, and the other end is connected with high-pressure pump;810 bottom of dip block is slidably connected by sliding rail with rack 100;
The movable end of dip driving mechanism is connected with dip block 810, and dip driving mechanism drives dip block 810 along sliding rail to conveyer
Structure 300 is mobile, so that the print material of dip slot 811 is in contact with electronic ceramic component piece, to realize electronic ceramic component piece
Side printing;Dip driving mechanism is the common driving devices such as cylinder, electric pushrod, cam mechanism, and details are not described herein again.
It preferably, further include finished product collecting mechanism 900, the finished product collecting mechanism 900 is disposed far from the front printing
The side of device, the finished product collecting mechanism 900 include finished product adsorption structure 910 for adsorbing electronic ceramic component piece and at
Product placement plate 930;The finished product adsorption structure 910 is flexibly connected by Mobile base 920 with the rack 100;The finished product is put
Plate 930 is set in the rack 100.
When it is implemented, as shown in Figure 6 and Figure 8, the present embodiment further includes finished product collecting mechanism 900, finished product collecting mechanism
900 include for adsorbing the finished product adsorption structure 910 of electronic ceramic component piece, putting for placing the finished product of electronic ceramic component piece
Plate 930 is set, finished product adsorption structure 910 is tubular structure, and one end of finished product adsorption structure 910 is connected with vacuum pump, thus shape
At negative pressure structure, for adsorbing the electronic ceramic component piece that printing is completed on delivery track 310;Finished product adsorption structure 910 is set
In on Mobile base 920, Mobile base 920 is slidably connected by sliding rail with rack 100, and Mobile base 920 and finished product driving mechanism phase
Connection;910 movement of driving finished product adsorption structure in the present embodiment is cam mechanism, and the cam mechanism is by cam, follower lever
Composition;Preferably, the movement that the components such as cylinder, push rod realize finished product adsorption structure 910 also can be used;Finished product adsorption structure
910 move back and forth under the driving of finished product driving mechanism in the top of delivery track 310 and finished product placement plate 930, to realize
The collection of finished product acts;Preferably, further including finished product placing box 940, finished product placing box 940 is equipped with handle;Finished product placing box
940, for stacking finished product placement plate 930, when finished product placement plate 930 fills finished product placing box 940, can directly withdraw finished product and put
Case 940 is set, so that the transport of electronic ceramic component piece be facilitated to shift.
Although more herein used such as rack, front electrode printing assembly, opposite electrode printing assembly, turn-over
The terms such as drying mechanism and article putting groove, but it does not exclude the possibility of using other terms.The use of these items is only for
It is more convenient to describe and explain essence of the invention;It is construed as any additional limitation all and is and spirit of that invention
It disagrees.
Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations;To the greatest extent
Pipe present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: its according to
So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into
Row equivalent replacement;And these are modified or replaceed, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (8)
1. a kind of wafer type electronic ceramic component plate electrode automatic press, it is characterised in that: including rack (100), front electricity
Pole printing assembly (210), opposite electrode printing assembly (220) and turn-over drying mechanism;The front electrode printing assembly
(210), the opposite electrode printing assembly (220) and the turn-over drying mechanism are set on the rack (100);It is described just
It is equipped with below face electrode print component (210) and the opposite electrode printing assembly (220) for conveying electronic ceramic component
The conveying mechanism (300) of piece;The turn-over drying mechanism includes motor and motor-driven rotating disk (410), the rotating disk
(410) radially even to be equipped with several article putting grooves (411), and heating structure is equipped with inside the rotating disk (410);The turn-over
Drying mechanism is set between the front electrode printing assembly (210) and the opposite electrode printing assembly (220).
2. wafer type electronic ceramic component plate electrode automatic press according to claim 1, it is characterised in that: described anti-
Face electrode print component (220) is additionally provided with the turn-over drying mechanism far from the side of the front electrode printing assembly (210).
3. wafer type electronic ceramic component plate electrode automatic press according to claim 1, it is characterised in that: further include
Feeding mechanism (500), the feeding mechanism (500) are set to the front electrode printing assembly (210) far from the opposite electrode
The side of printing assembly (220);The feeding mechanism (500) includes mandril (520) and for storing electronic ceramics to be printed
The barrel (510) of sheet of elements;The mandril (520) is set to the lower section of the barrel (510).
4. wafer type electronic ceramic component plate electrode automatic press according to claim 3, it is characterised in that: further include
For transporting the haul mechanism (600) of electronic ceramic component piece to be printed, the haul mechanism (600) is set to the charger
Between structure (500) and the conveying mechanism (300).
5. wafer type electronic ceramic component plate electrode automatic press according to claim 4, it is characterised in that: the fortune
Material mechanism (600) includes that several haul adsorption structures (610) for adsorbing electronic ceramic component piece and the driving haul are inhaled
The mobile haul driving mechanism of attached structure (610).
6. wafer type electronic ceramic component plate electrode automatic press according to claim 1-5, feature exist
In: it further include the anti-stacked mechanism of sheet of elements (700), the anti-stacked mechanism of sheet of elements (700) includes putting material platform (710) and for blowing away
Put the injection structure (720) for the electronic ceramic component piece being overlapped on material platform (710);It is described to put material platform (710) and blowing knot
Structure (720) is set on the rack (100).
7. wafer type electronic ceramic component plate electrode automatic press according to claim 6, it is characterised in that: it is described just
Conveying mechanism (300) below face electrode print component (210) is nearby equipped with side printing assembly (800), the side printing
Component (800) includes the dip driving mobile for the dip mechanism and driving dip mechanism of printed electronic ceramic component piece side
Mechanism.
8. wafer type electronic ceramic component plate electrode automatic press according to claim 7, it is characterised in that: further include
Finished product collecting mechanism (900), the finished product collecting mechanism (900) are disposed far from the side of the front printing equipment, it is described at
Product collecting mechanism (900) includes the finished product adsorption structure (910) and finished product placement plate for adsorbing electronic ceramic component piece
(930);The finished product adsorption structure (910) is flexibly connected by Mobile base (920) with the rack (100);The finished product is put
Plate (930) are set on the rack (100).
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